Power secondary equipment chassis

Abstract

The present disclosure relates to a chassis of a secondary power device. The chassis of the secondary power device includes: a front module, including a front module housing and a PCB board assembly, the PCB board assembly is arranged in the front module housing, the PCB board assembly includes a plurality of first terminals, and the housing includes a terminal port corresponding to the first terminal; a middle frame module, including a notch corresponding to the terminal port, and the middle frame module is connected to the front module housing; a PCB plug-in module, including a plug-in module housing, a PCB plug-in and a heat sink, the PCB plug-in includes a second terminal corresponding to the first terminal, the PCB plug-in is arranged in the plug-in module housing, and the heat sink is arranged on the plug-in module housing for heat dissipation of the PCB plug-in; the PCB plug-in module is connected to the middle frame module, the plug-in module housing is inserted into the notch of the middle frame module, and the second terminal passes through the terminal port and is connected to the first terminal. The chassis of the secondary power device disclosed in the present disclosure has high heat dissipation efficiency and good IP protection and electromagnetic shielding performance.

Description

Technical Field

[0001] The present invention belongs to the field of electric power equipment, and in particular, relates to a chassis of electric power secondary equipment. Background Art

[0002] With the rapid development of power grid technology, more and more high-speed and high-performance processors are used in power secondary devices, which often have the characteristics of high power consumption and high heat generation. Not only may a PCB plug-in be equipped with multiple high-performance processors, but the number of PCB plug-ins with high-performance processors inside the chassis is also increasing. This puts higher requirements on the heat dissipation performance of the device. At the same time, with the development and upgrading of smart substations and local devices, the requirements for IP protection (dust and moisture protection) and electromagnetic shielding of power secondary devices are also getting higher and higher. Summary of the invention

[0003] The present disclosure aims to provide a power secondary equipment chassis which adopts a modular design, has efficient heat dissipation performance, and is convenient for replacement and maintenance.

[0004] An embodiment of the present disclosure provides a power secondary equipment chassis, comprising: a front module, comprising a front module housing and a PCB board assembly, the PCB board assembly being arranged in the front module housing, the PCB board assembly comprising a plurality of first terminals, and the housing comprising terminal openings corresponding to the first terminals; a middle frame module, comprising a notch corresponding to the terminal opening, the middle frame module being connected to the front module housing; a PCB plug-in module, comprising a plug-in module housing, a PCB plug-in and a heat sink, the PCB plug-in comprising a second terminal corresponding to the first terminal, the PCB plug-in being arranged in the plug-in module housing, the heat sink being arranged on the plug-in module housing for heat dissipation of the PCB plug-in; the PCB plug-in module is connected to the middle frame module, the plug-in module housing is inserted into the notch of the middle frame module, the second terminal passes through the terminal opening, and is connected to the first terminal.

[0005] According to some embodiments of the present disclosure, the front module shell includes: an upper shell having a notch at the bottom end; a lower base plate for closing the notch of the upper shell and forming a first through cavity with the upper shell; a front panel arranged at the front end of the upper shell and respectively connected to the upper shell and the lower base plate; a support plate arranged at the rear end of the upper shell and respectively connected to the upper shell and the lower base plate, and the terminal port is located on the support plate; and a mounting bracket arranged on the side of the upper shell.

[0006] According to some embodiments of the present disclosure, the PCB board assembly includes: a bus PCB board, which is arranged on the support board, and the first terminal is arranged on the bus PCB board; a liquid crystal PCB board, which is arranged on the front panel, and the liquid crystal PCB board is connected to the bus PCB board.

[0007] According to some embodiments of the present disclosure, a conductive foam corresponding to the plug-in module housing is disposed on a side of the support plate close to the middle frame module, and the plug-in module housing presses the conductive foam.

[0008] According to some embodiments of the present disclosure, the plug-in module housing includes: a first side panel; a second side panel connected to the first side panel to form a through second cavity; a plug-in panel for closing the rear port of the second cavity; the PCB plug-in is arranged on the first side panel, the radiator is arranged on the outer side of the second side panel, and the boss of the radiator passes through the second side panel to press the PCB plug-in.

[0009] According to some embodiments of the present disclosure, the PCB plug-in module further includes a screw plate, which is disposed on the plug-in module housing, and on which screws are provided, and on the middle frame module, threaded holes corresponding to the screws are provided.

[0010] According to some embodiments of the present disclosure, the PCB plug-in module further includes a guide block, which is disposed on the outer side of the second side plate, and a guide groove corresponding to the guide block is provided on one side wall of the notch of the middle frame module.

[0011] According to some embodiments of the present disclosure, the PCB plug-in module further includes a leveling shock absorber, and the leveling shock absorber is disposed on the plug-in module housing.

[0012] According to some embodiments of the present disclosure, the PCB plug-in includes a plurality of processors, and the boss of the heat sink presses the processors.

[0013] According to some embodiments of the present disclosure, the plug-in panel is connected to the heat sink.

[0014] The power secondary equipment chassis disclosed in the present invention adopts a modular design to improve the heat dissipation performance of the power secondary equipment chassis; it has good IP protection and excellent electromagnetic shielding, which can ensure that the power secondary equipment chassis can operate stably during operation and is convenient for replacement and maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a schematic diagram of a power secondary equipment chassis according to an embodiment of the present disclosure;

[0016] Figure 2 is an exploded view of the front module of the embodiment of the present disclosure;

[0017] Figure 3 is a schematic diagram of a front module housing according to an embodiment of the present disclosure;

[0018] Figure 4 is a schematic diagram of a support plate according to an embodiment of the present disclosure;

[0019] Figure 5 is a schematic diagram of a bus PCB board according to an embodiment of the present disclosure;

[0020] Figure 6 is a schematic diagram of a liquid crystal PCB board according to an embodiment of the present disclosure;

[0021] Figure 7 is a schematic diagram of a frame module in an embodiment of the present disclosure;

[0022] Figure 8 is a schematic diagram of a PCB plug-in module according to an embodiment of the present disclosure;

[0023] Fig. 9 is a schematic diagram of a PCB plug-in according to an embodiment of the present disclosure;

[0024] Fig.10 This is a schematic diagram of the PCB plug-in connected to the first side panel in an embodiment of the present disclosure;

[0025] Fig.11 is a schematic diagram of a heat sink connected to a second side plate according to an embodiment of the present disclosure;

[0026] Fig.12 is a schematic diagram of the connection between the first side panel and the second side panel in an embodiment of the present disclosure;

[0027] Fig.13 is another schematic diagram of the heat sink connected to the second side plate according to the embodiment of the present disclosure;

[0028] Fig.14 Schematic diagram of a heat sink according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0029] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present disclosure. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0030] In the description of the present disclosure, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present disclosure. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present disclosure, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0031] In the description of the present disclosure, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances.

[0032] In the present disclosure, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is lower in level than the second feature.

[0033] The disclosure below provides many different embodiments or examples to realize different structures of the present disclosure. In order to simplify the disclosure of the present disclosure, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present disclosure. In addition, the present disclosure can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplicity and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present disclosure provides various specific examples of processes and materials, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0034] The preferred embodiments of the present disclosure are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present disclosure and are not intended to limit the present disclosure.

[0035] like Figure 1 As shown, an embodiment of the present disclosure provides a power secondary equipment chassis. The power secondary equipment chassis includes a front module 100, a middle frame module 200 and a PCB plug-in module 300. The power secondary equipment chassis of this embodiment adopts a modular design, and each PCB plug-in module 300 is equipped with a radiator, which has high heat dissipation performance and good IP protection and electromagnetic shielding performance.

[0036] like Figure 2 As shown, the front module 100 includes a front module housing 110 and a PCB board assembly 120. The interior of the front module housing 110 is a cavity, and the PCB board assembly 120 is arranged in the cavity of the front module housing 110. In this embodiment, the front module housing 110 is made of metal, and the PCB board assembly 120 is arranged in the metal housing, so that the front module 100 has a good IP protection level and electromagnetic shielding performance. The PCB board assembly 120 includes a first terminal 123, and the number of the first terminals 123 is multiple, and the multiple first terminals 123 are arranged in sequence. In this embodiment, the first terminal 123 is a male terminal. The housing 110 includes a terminal port 117 corresponding to the first terminal 123. Each first terminal 123 corresponds to a terminal port 117. The terminal port 117 is used for the second terminal of the PCB plug-in module 300 to penetrate and plug with the first terminal 123.

[0037] like Figure 2 and Figure 3 As shown, according to an optional technical solution of the present disclosure, the front module housing 110 includes: an upper housing 111 , a lower base plate 112 , a front panel 113 , a support plate 114 and a mounting bracket 115 .

[0038] The upper shell 111 is a frame-like structure, and a notch is provided at the bottom end of the upper shell 111 to facilitate the processing and manufacturing of the upper shell 111. The lower bottom plate 112 is connected to the upper shell 111 and is used to close the notch of the upper shell 111. In this embodiment, the lower bottom plate 112 is connected to the upper shell 111 by screws 1163. The upper shell 111 and the lower bottom plate 112 form a through first cavity.

[0039] The front panel 113 is disposed at the front end of the upper housing 111, and the front panel 113 closes the front port of the first cavity. The front panel 113 is connected to the upper housing 111 and the lower base plate 112 respectively by a plurality of screws 1131. The flanges of the upper housing 111 and the lower base plate 112 are provided with threaded holes corresponding to the screws 1131, so as to facilitate the installation of the front panel 113.

[0040] like Figure 4 As shown, the support plate 114 is arranged at the rear end of the upper shell 111, and the support plate 114 closes the rear port of the first cavity. The support plate 114 is connected to the upper shell 111 through a plurality of screws 1161, and is connected to the lower base plate 112 through a plurality of screws 1162. The support plate 114 is provided with threaded holes corresponding to the screws 1161 and the screws 1162. The terminal port 117 is located on the support plate 114. The upper shell 111, the lower base plate 112, the front panel 113 and the support plate 114 form a cavity of the shell 110, and the PCB board assembly 120 is arranged in the cavity of the front module shell 110. The upper shell 111, the lower base plate 112 and the support plate 114 are fixed to each other in pairs, which can ensure that the overall structural strength of the front module shell 110 is good.

[0041] There are two mounting brackets 115, which are respectively arranged on two opposite sides of the upper housing 111. The mounting brackets 115 are used for mounting the chassis of the power secondary equipment.

[0042] like Figure 2 , Figure 5 and Figure 6 As shown, the PCB assembly 120 includes a bus PCB 121 and a liquid crystal PCB 122. The bus PCB is fixed to the stud 1141 of the support plate 114 by screws 1211. A plurality of first terminals 123 are sequentially arranged on the bus PCB 121. The liquid crystal PCB 122 is fixed to the stud 1132 of the front panel 113 by screws 1221. The liquid crystal PCB 122 and the bus PCB 121 are connected by a flexible flat cable to transmit signals.

[0043] like Figure 7As shown, the middle frame module 200 is in the shape of a cuboid. The middle frame module 200 is made of metal material. The middle frame module 200 is arranged at the rear end of the front module 100 and is connected to the front module housing 110. In this embodiment, the screw passes through the support plate 114 and is connected to the threaded hole on the middle frame module 200 to fix the middle frame module 200. A plurality of notches 210 are provided on the middle frame module 200. The notches 210 correspond to the terminal ports 117 of the front module, and each terminal port 117 corresponds to a notch 210. In this embodiment, the shape of the notch 210 corresponds to the shape of the plug-in module housing 310 of the PCB plug-in module 300, and the PCB plug-in module 300 is inserted into the notch 210.

[0044] like Figure 8 and Fig. 9 As shown, the PCB plug-in module 300 includes a plug-in module housing 310, a PCB plug-in 320 and a heat sink 330. The PCB plug-in 320 is disposed in the plug-in module housing 310. The PCB plug-in 320 includes a second terminal 321 corresponding to the first terminal 123. The second terminal 321 is a female terminal. The heat sink 330 is disposed on the plug-in module housing 310, and the heat sink 330 presses the PCB plug-in 320 to dissipate heat of the PCB plug-in 320.

[0045] During assembly, the PCB plug-in module 300 is connected to the middle frame module 200. The plug-in module housing 310 is inserted into the slot 210 of the middle frame module, and the second terminal 321 passes through the terminal opening 117 and plugs into the first terminal 123 for signal transmission. There can be multiple PCB plug-in modules 300, and multiple PCB plug-in modules 300 are arranged in an array.

[0046] According to an optional technical solution of the present disclosure, the plug-in module housing 310 includes: a first side plate 311 , a second side plate 312 and a plug-in panel 313 .

[0047] like Fig.10 As shown, flanges are provided at the top and bottom of the first side plate 311. The PCB plug-in 320 is provided on the inner side of the first side plate 311 by means of screws 323.

[0048] like Fig.11 and Fig.12 As shown, flanges are provided at the top and bottom of the second side plate 312. The radiator 330 is provided on the outer side of the second side plate 312 by screws. The flanges of the first side plate 311 and the flanges of the second side plate 312 are connected by screws 314 to achieve a fixed connection between the first side plate 311 and the second side plate 312. The first side plate 311 and the second side plate 312 form a through second cavity.

[0049] The plug-in panel 313 is located at the rear end of the first side plate 311 and the second side plate 312, and is used to close the rear port of the second cavity. The PCB plug-in 320 is located in the cavity formed by the first side plate 311, the second side plate 312 and the plug-in panel 313, and the second terminal 321 extends out of the front port of the second cavity. The PCB plug-in 320 is arranged in the plug-in module housing 310, which can ensure that the PCB plug-in 320 is well protected by IP protection and electromagnetic shielding.

[0050] like Fig.13 and 14 As shown, the heat sink 330 includes a base plate 331, a boss 332 and fins 333. The boss 332 and the fins 333 are respectively located on opposite sides of the base plate 331. The fins 333 extend in the vertical direction to facilitate the up and down flow of air and improve the heat dissipation efficiency. The heat sink 330 is set on the outer side of the second side plate 312 by screws, and the boss 332 of the heat sink passes through the second side plate 312 to press the PCB plug-in 320. The heat sink 330, the first side plate 311, the second side plate 312 and the plug-in panel 313 constitute a heat dissipation whole. The heat generated by the operation of the PCB plug-in 320 is conducted to the heat dissipation whole composed of the heat sink 330, the first side plate 311, the second side plate 312 and the plug-in panel 313. The heat dissipation whole fully expands the heat dissipation area to bring about efficient heat dissipation capacity.

[0051] The power secondary equipment chassis of this embodiment forms a front, middle and rear fixed connection between the front module 100, the middle frame module 200 and the PCB plug-in module 300 to ensure the overall strength and structural stability of the power secondary equipment chassis. Multiple PCB plug-in modules 300 are arranged in an array to improve the overall power density of the power secondary equipment chassis. The PCB plug-in module 300 is in direct contact with the surrounding air, which can ensure that the PCB plug-in 320 has good heat dissipation capabilities whether in air cooling or natural cooling.

[0052] According to an optional technical solution of the present disclosure, a conductive foam 118 is provided on one side of the support plate 114 close to the middle frame module 200. The conductive foam 118 is provided in the horizontal and vertical directions, and the shape of the conductive foam 118 extends to correspond to the plug-in module housing 310. When the second terminal 321 is plugged into the first terminal 123, the plug-in module housing 310 presses the conductive foam 118, so that the front module 100 and the PCB plug-in module 300 form a closed whole, and the charged PCB board is completely enclosed, thereby ensuring that the power secondary equipment chassis has a good IP protection level and electromagnetic shielding effectiveness.

[0053] According to an optional technical solution of the present disclosure, the PCB plug-in module 300 further includes a screw plate 340. In this embodiment, two screw plates 340 are respectively arranged at the top and bottom of the plug-in module housing 310. The screw plates 340 are respectively connected to the first side plate 311 and the second side plate 312 by a plurality of screws 342. The screw plate is provided with horizontally arranged screws 341, and the middle frame module 200 is provided with threaded holes 230 corresponding to the screws 341. The screws 341 of this embodiment are hand screws. The middle frame module 200 and the PCB plug-in module 300 are fixedly connected by the screws 341.

[0054] According to an optional technical solution disclosed in the present invention, the PCB plug-in module 300 also includes a guide block 350. The guide block 350 can be a guide aluminum bar. The guide block 350 is set on the outer side of the second side plate 312 by screws, and the number of the guide blocks 350 can be multiple. Multiple guide blocks 350 are arranged in sequence from top to bottom. A guide groove 220 corresponding to the guide block 350 is provided on one side wall of the notch 210 of the middle frame module. When the PCB plug-in module 300 is connected to the middle frame module 200, the guide block 350 is inserted into the corresponding guide groove 220, which can not only play a guiding role when plugging and unplugging the PCB plug-in module 300, but also prevent the PCB plug-in module 300 from reversing when plugging and unplugging.

[0055] According to an optional technical solution of the present disclosure, the PCB plug-in module 300 further includes a leveling shock absorber 360. Two leveling shock absorbers 360 are respectively arranged at the top and bottom of the plug-in module housing 310. The leveling shock absorbers 360 are respectively connected to the first side plate 311 and the second side plate 312 by a plurality of screws 361. When the power secondary equipment chassis is placed normally as a whole, the leveling shock absorber 360 is used for leveling, and the leveling shock absorber 360 is also helpful in reducing the adverse effects of vibration on the power secondary equipment chassis during road transportation.

[0056] According to an optional technical solution of the present disclosure, the PCB plug-in 320 includes a plurality of processors 322. The processors 322 are high-performance processors that generate a large amount of heat when working. The boss 332 of the heat sink presses the processors 322 through a thermally conductive silicone sheet to facilitate heat dissipation of the PCB plug-in 320.

[0057] According to an optional technical solution of the present disclosure, the plug-in panel 313 is connected to the radiator 330 by screws 3131. The plug-in panel 313 is connected to the radiator 330, so that the PCB plug-in module 300 is more compact in structure, and is also beneficial to the overall heat dissipation of the first side plate 311, the second side plate 312, the plug-in panel 313 and the radiator 330.

[0058] The power secondary equipment chassis of this embodiment adopts a modular design to facilitate the replacement and maintenance of the equipment. The first side panel 311, the second side panel 312, the plug-in panel 313 and the radiator 330 constitute an integral heat dissipation structure with high heat dissipation performance. The PCB board assembly 120 is arranged in the front module housing 110, and the PCB plug-in 320 is arranged in the plug-in module housing 310. When connected, the front module 100, the middle frame module 200 and the PCB plug-in module 300 form a closed whole. The power secondary equipment chassis has good IP protection and good electromagnetic shielding performance.

[0059] The above description is only a preferred embodiment of the present disclosure and is not intended to limit the present disclosure. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present disclosure should be included in the protection scope of the present disclosure.

[0060] Finally, it should be noted that the above is only a preferred embodiment of the present disclosure and is not intended to limit the present disclosure. Although the present disclosure is described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A power secondary equipment chassis, characterized in that: include: The front module comprises a front module housing and a PCB board assembly, wherein the PCB board assembly is arranged in the front module housing, and the PCB board assembly comprises: A bus PCB board is arranged in the front module housing; A plurality of first terminals are arranged on the bus PCB board; A liquid crystal PCB board is arranged in the front module housing, and the liquid crystal PCB board is connected to the bus PCB board; Wherein, the front module housing includes a terminal opening corresponding to the first terminal; the front module housing is made of metal; A middle frame module, comprising a notch corresponding to the terminal opening, the middle frame module being connected to the front module housing; A PCB plug-in module, comprising a plug-in module housing, a PCB plug-in and a heat sink, wherein the PCB plug-in comprises a second terminal corresponding to the first terminal, the PCB plug-in is arranged in the plug-in module housing, and the heat sink is arranged on the plug-in module housing for heat dissipation of the PCB plug-in; The PCB plug-in module is connected to the middle frame module, the plug-in module housing is inserted into the notch of the middle frame module, and the second terminal passes through the terminal opening to connect to the first terminal.

2. The power secondary equipment chassis according to claim 1, characterized in that: The front module housing comprises: The upper shell has a notch at the bottom; A lower bottom plate, used to close the notch of the upper shell and form a first cavity that is connected with the upper shell; A front panel, arranged at the front end of the upper shell, and connected to the upper shell and the lower base plate respectively; A support plate, arranged at the rear end of the upper housing, connected to the upper housing and the lower base plate respectively, and the terminal port is located on the support plate; The mounting bracket is arranged on the side surface of the upper shell.

3. The power secondary equipment chassis according to claim 2, characterized in that: The bus PCB board is arranged on the support plate; The liquid crystal PCB board is arranged on the front panel.

4. The power secondary equipment chassis according to claim 2, characterized in that: A conductive foam corresponding to the plug-in module housing is disposed on a side of the support plate close to the middle frame module, and the plug-in module housing presses the conductive foam.

5. The power secondary equipment chassis according to claim 1, characterized in that: The plug-in module housing comprises: first side panel; A second side plate connected to the first side plate to form a through second cavity; a plug-in panel for closing a rear port of the second cavity; The PCB plug-in is arranged on the first side plate, the heat sink is arranged on the outer side of the second side plate, and the boss of the heat sink passes through the second side plate to press the PCB plug-in.

6. The power secondary equipment chassis according to claim 5, characterized in that: The PCB plug-in module further comprises a screw plate, which is arranged on the plug-in module housing, on which screws are arranged, and on the middle frame module, threaded holes corresponding to the screws are arranged.

7. The power secondary equipment chassis according to claim 5, characterized in that: The PCB plug-in module further includes a guide block, which is arranged on the outer side of the second side plate, and a guide groove corresponding to the guide block is provided on one side wall of the notch of the middle frame module.

8. The power secondary equipment chassis according to claim 5, characterized in that: The PCB plug-in module further comprises a leveling shock absorber, and the leveling shock absorber is arranged on the plug-in module housing.

9. The power secondary equipment chassis according to claim 5, characterized in that: The PCB plug-in includes a plurality of processors, and the boss of the heat sink presses the processors.

10. The power secondary equipment chassis according to claim 5, characterized in that: The plug-in panel is connected to the heat sink.

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