Laser cutting device

Abstract

The present invention belongs to the field of laser cutting technology, and discloses a laser cutting device. The laser cutting device includes a laser cutting mechanism, a moving mechanism and a detection mechanism. The laser cutting mechanism includes a support platform and a laser cutting head. The laser cutting head is arranged on the support platform. The laser cutting head can emit a light beam to cut the workpiece to be cut. The moving mechanism is arranged on the support platform to enable the detection mechanism to move relative to the laser cutting mechanism to detect the cutting seam after cutting. The laser cutting device saves the space occupied by the equipment by integrating the detection mechanism on the working end of the laser cutting mechanism. At the same time, it can ensure that the detection mechanism can follow the cutting direction of the laser cutting mechanism and move to the rear of the cutting mechanism to detect the cutting seam. There is no need to transplant the product to be detected, thereby improving the efficiency and accuracy of detection, and making the laser cutting device more widely applicable.

Description

Technical Field

[0001] The invention relates to the technical field of laser cutting, and in particular to a laser cutting device. Background Art

[0002] Laser cutting is the process of using a high-power density laser beam to irradiate the material being cut, so that the material is quickly heated to a vaporization or melting temperature, and then evaporates to form holes. As the beam moves across the material, the holes continuously form narrow slits, and the material is finally cut.

[0003] With the continuous development of science and technology, laser cutting technology has been widely used in various industries, such as the automotive field and the chemical field. In general, laser cutting technology has the characteristics of wide cutting range, fast cutting speed, and good flexibility, but there are still many problems, such as: laser cutting cannot cut through, sharp corners are ablated, etc. In order to ensure the quality of the product after laser cutting, a detection station is generally set after laser cutting. The detection station is set separately from the laser cutting station, which will increase the volume of the equipment. For the convenience of detection, the detection mechanism will be fixed on one side of the laser cutting device, but the position of the detection mechanism and the laser cutting mechanism in this laser cutting device is relatively fixed, and the detection mechanism cannot move flexibly following the direction of laser cutting. When the laser cutting mechanism cuts in different directions, the detection mechanism can move to the back of the cutting mechanism to detect the slit. The scope of application is narrow and the detection efficiency is low.

[0004] Therefore, there is an urgent need for a cutting device to solve the problems in the prior art. Summary of the invention

[0005] The object of the present invention is to provide a laser cutting device which can solve the problem in the prior art that the detection mechanism cannot move to the rear of the movement direction of the laser cutting head as the cutting direction of the laser cutting mechanism changes.

[0006] To achieve this object, the present invention adopts the following technical solutions:

[0007] A laser cutting device, comprising:

[0008] A laser cutting mechanism, the laser cutting mechanism comprising a support platform and a laser cutting head, the laser cutting head being arranged on the support platform, the laser cutting head being able to emit a laser beam to cut a workpiece to be cut;

[0009] A moving mechanism and a detection mechanism, wherein the moving mechanism is arranged on the supporting platform, the detection mechanism is connected to the output end of the moving mechanism, and the moving mechanism can drive the detection mechanism to move to the rear of the laser cutting head along the moving direction to detect the cutting seam on the workpiece to be cut.

[0010] Optionally, the moving mechanism includes a rotation drive component, the rotation drive component is connected to the support platform, the detection mechanism is connected to the output end of the rotation drive component, and the rotation drive component can drive the detection mechanism to rotate around the laser beam emitted by the laser cutting head.

[0011] Optionally, the rotation drive assembly includes:

[0012] A rotary drive motor is arranged on the support platform;

[0013] A driving gear connected to the output end of the rotary drive motor;

[0014] The driven gear is coaxially arranged with the laser beam, the driven gear and the driving gear are meshed with each other, and the detection mechanism is connected with the driven gear.

[0015] Optionally, the detection mechanism comprises a backlight source, and the backlight source is configured to provide backlight for the detection mechanism.

[0016] Optionally, the detection mechanism further includes a light source bracket, a first end of the light source bracket is connected to the detection mechanism, a second end of the light source bracket extends to a side of the workpiece to be cut away from the detection mechanism, and the backlight source is connected to the second end.

[0017] Optionally, the laser cutting device further comprises:

[0018] Mounting plate;

[0019] The linear drive mechanism is arranged on the mounting plate, the laser cutting mechanism is connected to the output end of the linear drive mechanism, and the linear drive mechanism can drive the laser cutting mechanism to approach or move away from the workpiece to be cut.

[0020] Optionally, the laser cutting device further comprises a guide assembly, a fixed end of the guide assembly is arranged on the mounting plate, a movable end is connected to the laser cutting mechanism, and the guide assembly is used to guide the laser cutting mechanism.

[0021] Optionally, the laser cutting device further comprises a positioning detection component, wherein the positioning detection component is connected to the supporting platform, and the positioning detection component is used to identify the position of the workpiece to be cut.

[0022] Optionally, the laser cutting device further comprises a dust suction mechanism, and the dust suction mechanism is configured to collect dust generated by cutting by the laser cutting head.

[0023] Optionally, the dust collection mechanism includes a dust collection box and a dust collection pipe, the dust collection box is connected to the support platform and is arranged around the laser cutting head, and the dust collection pipe is connected to the dust collection box so that the dust in the dust collection box can be discharged.

[0024] Beneficial effects of the present invention:

[0025] The laser cutting device provided by the present invention reduces the volume of the laser cutting device by integrating the detection mechanism on the laser cutting mechanism. When the laser cutting mechanism cuts the edges of the workpiece in different directions, the detection mechanism can move behind the laser cutting mechanism under the drive of the moving mechanism to detect the cutting seam, so that cutting and detection are carried out synchronously, which significantly improves the detection accuracy and detection efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a schematic structural diagram of the laser cutting device provided by the present invention at a first viewing angle;

[0027] Figure 2 It is a schematic structural diagram of the laser cutting device provided by the present invention at a second viewing angle.

[0028] In the figure:

[0029] 1. Laser cutting mechanism; 11. Support platform; 12. Laser cutting head; 13. Mounting plate; 14. Assembly plate;

[0030] 2. Rotation drive assembly; 21. Rotation drive motor; 22. Rotation platform;

[0031] 3. Testing agency;

[0032] 4. Linear drive mechanism; 41. Linear drive motor; 42. Guide assembly; 421. Slide rail; 422. Slide table;

[0033] 5. Positioning detection component;

[0034] 6. Dust collection mechanism; 61. Dust collection box; 62. Dust collection pipe; 63. Dust collection fixing plate;

[0035] 7. Backlight source; 71. Light source bracket. DETAILED DESCRIPTION

[0036] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0037] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0039] In the description of this embodiment, the terms "upper", "lower", "left", "right" and other directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the mechanism or element referred to must have a specific direction, be constructed and operate in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0040] The laser cutting device in the prior art cannot satisfy the requirement that when the laser cutting mechanism cuts the edges of the workpiece in different directions, the detection mechanism can move to the rear of the laser cutting mechanism to detect the cutting seam. To solve the above problem, this embodiment provides a laser cutting device, which belongs to the field of laser cutting.

[0041] like Figure 1As shown, a laser cutting device provided in this embodiment includes a horizontal driving mechanism (not shown in the figure), a mounting plate 13, a laser cutting mechanism 1, a moving mechanism and a detection mechanism 3. The mounting plate 13 is connected to the output end of the horizontal driving mechanism. The laser cutting mechanism 1 includes a supporting platform 11 and a laser cutting head 12. The supporting platform 11 is connected to the mounting plate 13. The laser cutting head 12 is arranged on the supporting platform 11. The workpiece to be cut is arranged horizontally and is located below the laser cutting head 12. The horizontal driving mechanism can drive the mounting plate 13 to move in the horizontal direction, thereby driving the laser cutting head 12 to cut the workpiece to be cut and generate a cutting seam extending in the horizontal direction. The moving mechanism is arranged on the supporting platform 11. The output end of the moving mechanism is connected to the detection mechanism 3. The moving mechanism can drive the detection mechanism 3 to move to the rear of the cutting direction of the laser cutting head 12 to detect the cutting seam on the workpiece to be cut.

[0042] The laser cutting device provided by the present invention reduces the volume of the laser cutting device by integrating the detection mechanism 3 on the laser cutting mechanism 1. When the laser cutting mechanism 1 cuts the edges of the workpiece in different directions, the detection mechanism 3 can move behind the laser cutting mechanism 1 under the drive of the moving mechanism to detect the cutting seam, so that cutting and detection are carried out synchronously, which significantly improves the detection accuracy and detection efficiency.

[0043] Alternatively, if Figure 1 As shown, the laser cutting head 12 includes a laser spot box and a laser head. The laser head can gather the spot generated by the laser spot box to form a laser beam for cutting the workpiece to be cut. Laser cutting has the advantages of high precision, narrow cutting seam, smooth cutting surface, and fast speed. Laser cutting is not limited by the material of the workpiece to be cut and has a wide range of applications.

[0044] Optionally, the support platform 11 is a plate-like structure with a through hole. The laser spot box of the laser cutting head 12 is fixed on the support platform 11. The laser head is connected to the laser spot box through the through hole, making the structure of the laser cutting device more compact and further reducing the volume of the laser cutting device.

[0045] Optionally, the detection mechanism 3 is an AOI (Automated Optical Inspection) CCD (Charge-coupled Device) component, which can obtain image information of the cutting seam, and then detect defects such as incomplete cutting or match heads in the cutting seam caused by poor cutting. The AOI CCD component has a fast detection speed and high accuracy.

[0046] Preferably, if Figure 2As shown, the moving mechanism includes a rotating drive component 2, which is connected to a supporting platform 11. A detecting mechanism 3 is arranged on the output end of the rotating drive component 2, and the detecting mechanism 3 can rotate around the laser beam emitted by the laser cutting head 12 as an axis under the drive of the rotating drive component 2, so that when the laser cutting mechanism 1 cuts the edge in any direction on the workpiece to be inspected, the detecting mechanism 3 can be conveniently moved to the rear of the movement direction of the laser cutting head 12, even if the connecting line between the detecting mechanism 3 and the laser cutting mechanism 1 is colinear with the edge to be cut, thereby realizing inspection while cutting and improving the efficiency of detection.

[0047] Optionally, the rotary drive assembly 2 includes a rotary drive motor 21, a driving gear and a driven gear. The rotary drive motor 21 is arranged on the support platform 11. The output end of the rotary drive motor 21 is connected to the driving gear for driving the driving gear to rotate. The driven gear is meshed with the driving gear. The driven gear is rotatably arranged on the support platform 11. The driven gear is fixedly connected to the rotating platform 22. The detection mechanism 3 is fixed on the rotating platform 22, so that the detection mechanism 3 can rotate around the laser beam emitted by the laser cutting head 12 as the axis under the drive of the drive motor. The rotary drive assembly 2 has a simple structure, low noise and a smooth movement process. Specifically, in this embodiment, the rotary drive motor 21 is arranged on the upper side of the support platform 11 and is located on one side of the laser spot box. The output shaft of the rotary drive motor 21 is passed through the lower side of the support platform 11 and is arranged parallel to the laser beam.

[0048] Optionally, a bearing is provided on the support platform 11, and the bearing is connected to the mounting portion of the support platform 11. Specifically, the inner ring of the bearing is connected to the mounting portion of the support platform 11, and the outer ring of the bearing is connected to the driven gear, and the driving gear and the driven gear are meshed with each other, so that the rotary drive motor 21 drives the rotary platform 22 to rotate. The bearing is used for connection, and the friction resistance is small and the mechanical efficiency is high.

[0049] In other embodiments, the driving gear can be replaced by a driving pulley, and the driven gear can be replaced by a driven pulley, and the driving pulley and the driven pulley are connected by a belt drive, and the rotating platform 22 is fixedly connected to the driven pulley, so that the rotational motion output by the rotating drive motor 21 can be transmitted to the detection mechanism 3, driving the detection mechanism 3 to rotate and move to the rear of the movement direction of the laser cutting head 12 to detect the cutting seam.

[0050] Optionally, the detection mechanism 3 includes a backlight source 7, which is disposed below the workpiece to be detected and can provide backlight to the detection mechanism 3, so that the image obtained by the detection mechanism 3 is clearer, thereby ensuring that the detection result is more accurate. Specifically, providing backlight means that the backlight source 7 and the detection mechanism 3 are respectively located on both sides of the workpiece to be detected, and the light emitted by the backlight source 7 can irradiate the detection mechanism 3 after passing through the cutting seam.

[0051] Optionally, the detection mechanism 3 also includes a light source bracket 71, a first end of the light source bracket 71 is connected to the detection mechanism 3, and a second end of the light source bracket 71 extends to a side of the workpiece to be cut away from the detection mechanism 3, and a backlight light source 7 is connected to the second end, so that the backlight light source 7 can move with the detection mechanism 3, thereby ensuring that the backlight light source 7 always remains relative to the detection mechanism 3 and provides backlight for the detection mechanism 3.

[0052] Specifically, the light source bracket 71 includes a first mounting plate, a second mounting plate and a third mounting plate, the first mounting plate is connected to the detection mechanism 3, the second mounting plate is connected to the first mounting plate and extends in a direction away from the detection mechanism 3, and the second mounting plate is arranged on the side away from the edge of the workpiece to be cut, the third mounting plate is connected to the second mounting plate, and the third mounting plate is arranged parallel to the workpiece to be detected and below the workpiece to be detected, and the backlight source 7 is fixed on the third mounting plate, which can provide backlight to the detection mechanism 3, so that the image obtained by the detection mechanism 3 is clearer, thereby ensuring that the detection result is more accurate. In other embodiments, the specific shape of the light source bracket 71 is not limited, as long as the backlight source 7 can be located below the workpiece to be detected.

[0053] Optionally, the laser cutting device further comprises a dust suction mechanism 6, which can collect dust generated when the laser cutting head 12 cuts the workpiece to be cut, clean up the dust in time, and reduce the influence of the dust on the processing accuracy.

[0054] Specifically, the dust collection mechanism 6 includes a dust collection box 61 and a dust collection pipe 62. The dust collection box 61 is connected to the support platform 11, and the dust collection box 61 is arranged on the laser cutting head 12. The ring-shaped dust collection box 61 can improve the dust collection efficiency. The dust collection pipe 62 is connected to the dust collection box 61, and the dust collection pipe 62 can guide the dust in the dust collection box 61 out of the dust collection box 61.

[0055] Specifically, the laser cutting mechanism 1 also includes an assembly plate 14, the support platform 11 is connected to the assembly plate 14, and is connected to the mounting plate 13 through the assembly plate 14, and the dust suction mechanism 6 also includes a dust suction fixing plate 63, and the dust suction fixing plate 63 is connected to the assembly plate 14, that is, the dust suction box 61 is connected to the support platform 11 through the dust suction fixing plate 63 and the assembly plate 14, thereby ensuring synchronous movement with the laser cutting head 12.

[0056] Optionally, the laser cutting device also includes a linear drive mechanism 4, which is arranged on a mounting plate 13, and an assembly plate 14 is connected to an output end of the linear drive mechanism 4. Depending on the thickness of the workpiece to be cut, the linear drive mechanism 4 can drive the laser cutting mechanism 1 to be close to or away from the workpiece to be cut, thereby improving the applicability and practicality of the laser cutting device.

[0057] Furthermore, the linear drive mechanism 4 includes a linear drive motor 41 and a lead screw nut assembly, the output end of the linear drive motor 41 is connected to the input end of the lead screw nut assembly, and the output end of the lead screw nut assembly is connected to the assembly plate 14, and further connected to the support platform 11 of the laser cutting mechanism 1. The linear drive mechanism 4 has a simple structure and operates smoothly and reliably.

[0058] Optionally, the laser cutting device also includes a guide component 42, the fixed end of the guide component 42 is installed on the mounting plate 13, and the movable end of the guide component 42 is connected to the laser cutting mechanism 1. The guide component 42 can guide the moving direction of the laser cutting mechanism 1, thereby improving the stability of the movement of the laser cutting mechanism 1, making the cutting seam smoother, and effectively improving the processing accuracy.

[0059] Furthermore, the guide assembly 42 includes a slide rail 421 and a slide table 422, the slide rail 421 is arranged parallel to the direction of the linear motion output by the linear drive mechanism 4 and is located on one side of the linear drive mechanism 4, the slide table 422 is slidably connected to the slide rail 421, the slide table 422 is connected to the assembly plate 14, and the laser cutting head 12 is fixed on the assembly plate 14. The guide assembly 42 has a simple structure and low cost.

[0060] like Figure 2 As shown, the laser cutting device also includes a positioning detection component 5, which is connected to the support platform 11. The positioning detection component 5 can identify the position of the workpiece to be cut to ensure the accuracy of the cutting. Specifically, in this embodiment, the positioning detection component 5 is connected to the assembly plate 14, thereby achieving connection with the support platform 11.

[0061] Optionally, the positioning detection component 5 is a target-grabbing CCD (Charge-coupled Device) component, which has high recognition accuracy and accurate positioning.

[0062] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A laser cutting device, characterized in that: include: A laser cutting mechanism (1), the laser cutting mechanism (1) comprising a support platform (11) and a laser cutting head (12), the laser cutting head (12) being arranged on the support platform (11), and the laser cutting head (12) being capable of emitting a laser beam to cut a workpiece to be cut; A moving mechanism and a detection mechanism (3), wherein the moving mechanism is arranged on the supporting platform (11), the detection mechanism (3) is connected to an output end of the moving mechanism, and the moving mechanism can drive the detection mechanism (3) to move to the rear of the laser cutting head (12) along the moving direction so as to detect the cutting seam on the workpiece to be cut; A backlight source (7), wherein the backlight source (7) is configured to provide backlight for the detection mechanism (3); The backlight source (7) and the detection mechanism (3) are respectively located on two sides of the workpiece to be detected, and the light emitted by the backlight source (7) passes through the cutting seam and irradiates the detection mechanism (3); The detection mechanism (3) further comprises a light source bracket (71), a first end of the light source bracket (71) being connected to the detection mechanism (3), a second end extending to a side of the workpiece to be cut away from the detection mechanism (3), and the backlight source (7) being connected to the second end; The moving mechanism comprises a rotary drive component (2), the rotary drive component (2) is connected to a support platform (11), the detection mechanism (3) is connected to an output end of the rotary drive component (2), and the rotary drive component (2) can drive the detection mechanism (3) to rotate around the laser beam emitted by the laser cutting head (12) as an axis.

2. The laser cutting device according to claim 1, characterized in that: The rotary drive assembly (2) comprises: A rotary drive motor (21) is arranged on the supporting platform (11); A driving gear connected to an output end of the rotary drive motor (21); The driven gear is coaxially arranged with the laser beam, the driven gear and the driving gear are meshed with each other, and the detection mechanism (3) is connected with the driven gear.

3. The laser cutting device according to claim 1, characterized in that: The laser cutting device also includes: Mounting plate (13); A linear drive mechanism (4) is arranged on the mounting plate (13); the laser cutting mechanism (1) is connected to an output end of the linear drive mechanism (4); and the linear drive mechanism (4) can drive the laser cutting mechanism (1) to approach or move away from the workpiece to be cut.

4. The laser cutting device according to claim 3, characterized in that: The laser cutting device further comprises a guide component (42), wherein a fixed end of the guide component (42) is arranged on the mounting plate (13), and a movable end is connected to the laser cutting mechanism (1), and the guide component (42) is used to guide the laser cutting mechanism (1).

5. The laser cutting device according to any one of claims 1 to 4, characterized in that: The laser cutting device further comprises a positioning detection component (5), wherein the positioning detection component (5) is connected to the supporting platform (11), and the positioning detection component (5) is used to identify the position of the workpiece to be cut.

6. The laser cutting device according to any one of claims 1 to 4, characterized in that: The laser cutting device further comprises a dust suction mechanism (6), wherein the dust suction mechanism (6) is configured to collect dust generated by cutting by the laser cutting head (12).

7. The laser cutting device according to claim 6, characterized in that: The dust collection mechanism (6) comprises a dust collection box (61) and a dust collection pipe (62); the dust collection box (61) is connected to the support platform (11) and is arranged around the laser cutting head (12); the dust collection pipe (62) is connected to the dust collection box (61) so that the dust in the dust collection box (61) can be discharged.

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