A method for preparing instant transparent shielding film

Abstract

The invention relates to the technical field of electromagnetic shielding films, and in particular to a method for preparing an instant transparent shielding film, the method comprising the following steps: pre-treating a transparent substrate, attaching a Cu-based alloy to the transparent substrate by vacuum evaporation, covering a mask plate above a metal part of the Cu-based alloy, calculating the metal grid structure parameters corresponding to the target shielding effectiveness, and etching the Cu-based alloy metal part by an acidic ferric chloride solution; the invention can be immediately attached by coating optical glue or specific glue when the electromagnetic shielding film body has a relatively high light transmittance and shielding effectiveness, thereby solving the limitation that the shielding material needs to be fixed with an external frame in the past, and at the same time, the invention realizes the conductive treatment of the basic shielding material by directly attaching a metal frame antenna on the periphery, thereby solving the limitation of the frame and realizing the transmission of internal signals to the outside.

Description

Technical Field

[0001] The invention relates to the technical field of electromagnetic shielding films, in particular to a method for preparing an instant transparent shielding film. Background Art

[0002] The existing electromagnetic shielding films on the market currently have problems such as high light transmittance and high shielding effectiveness cannot coexist; the overall shielding effectiveness is low; and they cannot be immediately attached to the target surface. Compared with other products, the instant transparent shielding film prepared by the present invention can be used and attached immediately while having high light transmittance and high electromagnetic shielding effectiveness, and is suitable for a variety of object surface scenes.

[0003] At present, the functions of electromagnetic shielding film products are realized through the conductive and magnetic properties of metal materials attached to the multi-layer film system. The design and manufacturing process of the functional layer metal grid is affected by the original process route and design parameters, and it is difficult to take into account both high light transmittance and high shielding efficiency. A few similar technical products with higher indicators are non-transparent light red or other colors due to the influence of the color rendering properties of the metal itself, which makes it difficult to use in actual scenarios.

[0004] The product currently on the market that is closest to the present invention is our company's flexible high-transmittance and high-electromagnetic shielding film, which can also achieve high shielding efficiency under high transmittance. However, its function requires a frame for fixing it in the usage scenario and the main body needs to be conductively treated to exert its shielding function, which is greatly affected by the site and usage conditions. Summary of the invention

[0005] The object of the present invention is to provide a method for preparing a transparent shielding film of an instant sticker to solve the problems raised in the above background technology.

[0006] To achieve the above object, the present invention provides the following technical solution: a method for preparing a transparent shielding film of an instant sticker, the method comprising the following steps:

[0007] Step 1: pre-treating the transparent substrate and attaching the Cu-based alloy to the transparent substrate by vacuum evaporation;

[0008] Step 2: Covering the Cu-based alloy metal part with a mask;

[0009] Step 3: Etching the Cu-based alloy metal part with an acidic ferric chloride solution to form a highly conductive and highly magnetic metal grid film, and filling a high molecular conductive polymer in the gaps of the metal grid to make the film surface conductive;

[0010] Step 4: coating a thermosetting hardening resin on the highly conductive and highly magnetic metal film to form a transparent protective layer;

[0011] Step 5: Apply OCA optical glue or other high-transmittance glue suitable for the user-specified surface on the outside of the transparent protective layer, and then attach a layer of release film as a protective layer;

[0012] Step 6: Complete the preparation of the instant transparent shielding film.

[0013] Preferably, in the step 1, the transparent substrate pretreatment includes cleaning the surface of the transparent substrate to ensure that the transparent substrate is clean before plating.

[0014] Preferably, in step one, during the vacuum evaporation process, the coating chamber is evacuated to a suitable vacuum degree, and then the transparent substrate is heated to remove moisture and enhance the film-base bonding strength until a certain vacuum degree is reached. A relatively low-power electricity is first applied to the evaporation source to preheat or pre-melt the film material, and then a relatively high-power electricity is input to quickly heat the coating material to the evaporation temperature.

[0015] Preferably, in step 1, the vacuum evaporation process parameters are: pressure: 10-100 Pa, speed: 0.5-50 m / min, resistance: ≤200Ω, working voltage: 500-1000 V, working current: 50-500 A.

[0016] Preferably, in step 2, the metal grid structure parameters are calculated by eliminating electromagnetic waves by treating the metal grid as a circuit structure in which an inductor and a capacitor are connected in parallel in an equivalent circuit and a resistor is connected in series.

[0017] Preferably, in step three, the high-conductivity and high-magnetic-permeability metal film is etched from the original Cu-based alloy metal part and is loaded on a transparent substrate.

[0018] Preferably, in step three, the anti-corrosion ink is printed onto the surface of the transparent substrate by inkjet printing technology during etching, and then the anti-corrosion layer is formed by curing.

[0019] Preferably, in the step 4, the thermosetting hardening resin is dried at a temperature of 110 to 130° C. for 10 to 60 minutes to form a transparent protective layer.

[0020] Preferably, in step four, the preparation method of the thermosetting hardening resin is: providing epoxy resin and toughening resin, dissolving and mixing the epoxy resin and toughening resin to obtain a mixture, heating the mixture for grafting reaction to obtain a flexible epoxy resin, and after cooling, adding a curing agent to prepare a thermosetting modified epoxy resin.

[0021] Preferably, in step five, the light transmittance of the OCA optical adhesive is greater than 95%, and the release film is made of PET or PE material.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] 1. In the present invention, when the electromagnetic shielding film body has a relatively high light transmittance and shielding effectiveness, it can be immediately attached by coating optical glue or specific glue, thereby solving the limitation that the shielding material in the past needs an external frame for fixing.

[0024] 2. The present invention realizes the conductive processing of the basic shielding material by directly attaching a metal frame antenna on the periphery, which can solve the limitation of the frame and realize the transmission of internal signals to the outside. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the structure of the transparent shielding film of the present invention;

[0026] Figure 2 This is the equivalent circuit diagram of the metal grid of the present invention. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] Embodiment 1:

[0029] A method for preparing an instant transparent shielding film, the method comprising the following steps:

[0030] Step 1: pre-treating the transparent substrate and attaching the Cu-based alloy to the transparent substrate by vacuum evaporation;

[0031] Furthermore, the transparent substrate pretreatment content is to clean the surface of the transparent substrate to ensure that the transparent substrate is clean before plating. During the vacuum evaporation process, the coating chamber is evacuated to a suitable vacuum degree, and then the transparent substrate is heated to remove moisture and enhance the film-base bonding strength. Heating the substrate under high vacuum can desorb the gas adsorbed on the surface of the substrate. Then the vacuum chamber is evacuated by a vacuum pump, which is beneficial to improve the vacuum degree of the coating chamber, the purity of the film layer and the film-base bonding strength. After reaching a certain vacuum degree, the evaporation source is first powered by low-power electricity to preheat or pre-melt the film material, and then a high-power electricity is input to quickly heat the coating material to the evaporation temperature. The vacuum evaporation process parameters are: pressure: 10-100Pa, speed: 0.5-50m / min, resistance: ≤200Ω, working voltage: 500-1000V, working current: 50-500A.

[0032] Step 2: Covering the Cu-based alloy metal part with a mask;

[0033] Furthermore, the metal grid structure parameters are calculated by treating the metal grid as an inductor and a capacitor in parallel in an equivalent circuit, and then connecting a resistor in series to dissipate the electromagnetic wave (see Figure 2 ).

[0034] Step 3: Etching the Cu-based alloy metal part with an acidic ferric chloride solution to form a highly conductive and highly magnetic metal grid film, and filling a high molecular conductive polymer in the gaps of the metal grid to make the film surface conductive;

[0035] Furthermore, the highly conductive and highly magnetic metal film is etched from the original Cu-based alloy metal part and loaded on a transparent substrate. During etching, the anti-corrosion ink is printed onto the surface of the transparent substrate using inkjet printing technology, and then cured to form an anti-corrosion layer.

[0036] Step 4: coating a thermosetting hardening resin on the highly conductive and highly magnetic metal film to form a transparent protective layer;

[0037] Furthermore, the thermosetting hardening resin is dried at a temperature of 130° C. for 20 minutes to form a transparent protective layer. The preparation method of the thermosetting hardening resin is as follows: providing an epoxy resin and a toughening resin, dissolving and mixing the epoxy resin and the toughening resin to obtain a mixture, heating the mixture for a grafting reaction to obtain a flexible epoxy resin, and after cooling, adding a curing agent to prepare a thermosetting modified epoxy resin.

[0038] Step 5: Apply OCA optical glue or other high-transmittance glue suitable for the user-specified surface on the outside of the transparent protective layer, and then attach a layer of release film as a protective layer;

[0039] Furthermore, the light transmittance of the OCA optical adhesive is greater than 95%, and the release film is made of PET material.

[0040] Step 6: Complete the preparation of the instant transparent shielding film.

[0041] Embodiment 2:

[0042] A method for preparing an instant transparent shielding film, the method comprising the following steps:

[0043] Step 1: pre-treating the transparent substrate and attaching the Cu-based alloy to the transparent substrate by vacuum evaporation;

[0044] Furthermore, the transparent substrate pretreatment content is to clean the surface of the transparent substrate to ensure that the transparent substrate is clean before plating. During the vacuum evaporation process, the coating chamber is evacuated to a suitable vacuum degree, and then the transparent substrate is heated to remove moisture and enhance the film-base bonding strength. Heating the substrate under high vacuum can desorb the gas adsorbed on the surface of the substrate. Then the vacuum chamber is evacuated by a vacuum pump, which is beneficial to improve the vacuum degree of the coating chamber, the purity of the film layer and the film-base bonding strength. After reaching a certain vacuum degree, the evaporation source is first powered by low-power electricity to preheat or pre-melt the film material, and then a high-power electricity is input to quickly heat the coating material to the evaporation temperature. The vacuum evaporation process parameters are: pressure: 30-100Pa, speed: 0.5-50m / min, resistance: ≤200Ω, working voltage: 750-1000V, working current: 200-500A.

[0045] Step 2: Covering the Cu-based alloy metal part with a mask;

[0046] Furthermore, the metal grid structure parameters are calculated by treating the metal grid as an inductor and a capacitor in parallel in an equivalent circuit, and then connecting a resistor in series to dissipate the electromagnetic wave (see Figure 2 ).

[0047] Step 3: Etching the Cu-based alloy metal part with an acidic ferric chloride solution to form a highly conductive and highly magnetic metal grid film, and filling a high molecular conductive polymer in the gaps of the metal grid to make the film surface conductive;

[0048] Furthermore, the highly conductive and highly magnetic metal film is etched from the original Cu-based alloy metal part and loaded on a transparent substrate. During etching, the anti-corrosion ink is printed onto the surface of the transparent substrate using inkjet printing technology, and then cured to form an anti-corrosion layer.

[0049] Step 4: coating a thermosetting hardening resin on the highly conductive and highly magnetic metal film to form a transparent protective layer;

[0050] Furthermore, the thermosetting hardening resin is dried at a temperature of 110° C. for 40 minutes to form a transparent protective layer. The preparation method of the thermosetting hardening resin is as follows: providing an epoxy resin and a toughening resin, dissolving and mixing the epoxy resin and the toughening resin to obtain a mixture, heating the mixture for a grafting reaction to obtain a flexible epoxy resin, and after cooling, adding a curing agent to prepare a thermosetting modified epoxy resin.

[0051] Step 5: Apply OCA optical glue or other high-transmittance glue suitable for the user-specified surface on the outside of the transparent protective layer, and then attach a layer of release film as a protective layer;

[0052] Furthermore, the light transmittance of the OCA optical adhesive is greater than 95%, and the release film is made of PE material.

[0053] Step 6: Complete the preparation of the instant transparent shielding film.

[0054] In summary: When the electromagnetic shielding film body of the present invention already has a fairly high light transmittance and shielding effectiveness, it can be immediately attached by coating optical glue or specific glue, thereby solving the limitation that the shielding materials in the past need to be fixed with an external frame. At the same time, the present invention realizes the conductive treatment of the basic shielding material by directly attaching a metal frame antenna on the periphery, which solves the limitation of the frame while realizing the transmission of internal signals to the outside.

[0055] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0056] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A method for preparing an instant transparent shielding film, characterized in that: The method comprises the following steps: Step 1: pre-treating the transparent substrate and attaching the Cu-based alloy to the transparent substrate by vacuum evaporation; Step 2: Covering the Cu-based alloy metal part with a mask plate, and calculating the metal grid structure parameters corresponding to the target shielding effectiveness; Step 3: Etching the Cu-based alloy metal part with an acidic ferric chloride solution to form a highly conductive and highly magnetic metal grid film, and filling a high molecular conductive polymer in the gaps of the metal grid to make the film surface conductive; Step 4: coating a thermosetting hardening resin on the highly conductive and highly magnetic metal film to form a transparent protective layer; Step 5: Apply OCA optical glue or other high-transmittance glue suitable for the user-specified surface on the outside of the transparent protective layer, and then attach a layer of release film as a protective layer; Step 6: Complete the preparation of the instant transparent shielding film.

2. The method for preparing a transparent shielding film of instant sticker according to claim 1, characterized in that: In the step 1, the transparent substrate pretreatment includes cleaning the surface of the transparent substrate to ensure that the transparent substrate is clean before plating.

3. The method for preparing a transparent shielding film of instant sticker according to claim 1, characterized in that: In the step 1, the coating chamber is evacuated to a suitable vacuum degree during vacuum evaporation, and then the transparent substrate is heated to remove moisture and enhance the film-base bonding strength until a certain vacuum degree is reached. Low-power electricity is first applied to the evaporation source to preheat or pre-melt the film material, and then high-power electricity is input to quickly heat the coating material to the evaporation temperature.

4. The method for preparing a transparent shielding film of instant sticker according to claim 1, characterized in that: In the step 1, the vacuum evaporation process parameters are: pressure: 10-100 Pa, speed: 0.5-50 m / min, resistance: ≤200Ω, working voltage: 500-1000 V, working current: 50-500 A.

5. The method for preparing a transparent shielding film of instant sticker according to claim 1, characterized in that: In the step 2, the metal grid structure parameters are calculated by using an equivalent circuit structure in which the metal grid is equivalent to an inductor and a capacitor in parallel, and then a resistor is connected in series to eliminate electromagnetic waves.

6. The method for preparing a transparent shielding film of instant sticker according to claim 1, characterized in that: In the step three, the high-conductivity and high-magnetic-permeability metal film is etched from the original Cu-based alloy metal part and loaded on the transparent substrate.

7. The method for preparing a transparent shielding film of instant sticker according to claim 1, characterized in that: In the step three, the anti-corrosion ink is printed onto the surface of the transparent substrate by inkjet printing technology during etching, and then the anti-corrosion layer is formed by curing.

8. The method for preparing an instant transparent shielding film according to claim 1, characterized in that: In the step 4, the heat-curing hardening resin is dried at a temperature of 110 to 130° C. for 10 to 60 minutes to form a transparent protective layer.

9. The method for preparing a transparent shielding film of instant sticker according to claim 1, characterized in that: In the step 4, the preparation method of the thermosetting hardening resin is: providing epoxy resin and toughening resin, dissolving and mixing the epoxy resin and toughening resin to obtain a mixture, heating the mixture for grafting reaction to obtain a flexible epoxy resin, and after cooling, adding a curing agent to prepare a thermosetting modified epoxy resin.

10. The method for preparing a transparent shielding film of instant sticker according to claim 1, characterized in that: In the step 5, the light transmittance of the OCA optical adhesive is greater than 95%, and the release film is made of PET or PE material.

Images