Circuit board connection structure and manufacturing method thereof

Abstract

The present invention proposes a method for manufacturing a circuit board connection structure, comprising the following steps: providing a copper-clad substrate, the copper-clad substrate comprising a base layer and a copper foil layer formed on the surface of the base layer; forming a soldering pad on the copper foil layer, wherein a receiving space is provided in the soldering pad; etching the copper foil layer not covered by the soldering pad to form a conductive circuit layer; filling the receiving space with a conductive paste, wherein the conductive paste protrudes the soldering pad away from the surface of the conductive circuit layer; and connecting a part to be connected to the conductive paste, wherein the part to be connected is electrically connected to the conductive circuit layer through the conductive paste, thereby obtaining the circuit board connection structure. The manufacturing method of the present invention can avoid short circuit of the conductive circuit layer. The present invention also provides a circuit board connection structure prepared by the method.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit boards, and in particular to a circuit board connection structure and a manufacturing method thereof. Background Art

[0002] In recent years, various electronic products have developed towards multifunctionality and integration. To this end, it is usually necessary to connect the parts to be connected (such as other circuit boards or electronic components) on the circuit board in the electronic product. Usually, it is necessary to print solder paste on the solder pad of the circuit board first, and then install the parts to be connected on the solder paste. At present, in order to improve the alignment between the circuit board and the parts to be connected, a protruding copper column is usually set on the solder pad, and then solder paste is printed on the solder pad with the copper column.

[0003] However, when the components to be connected are installed on the solder paste, the printed solder paste will flow around, which may easily cause a short circuit in the conductive circuit of the circuit board. Summary of the invention

[0004] In view of this, the present invention provides a method for manufacturing a circuit board connection structure capable of avoiding short circuit of a conductive circuit.

[0005] In addition, the present invention also provides a circuit board manufactured by the above manufacturing method.

[0006] A first embodiment of the present invention provides a method for manufacturing a circuit board connection structure, comprising the following steps:

[0007] Providing a copper-clad substrate, the copper-clad substrate comprising a base layer and a copper foil layer formed on a surface of the base layer;

[0008] forming a soldering pad on the copper foil layer, wherein the soldering pad is provided with an accommodating space;

[0009] Etching the copper foil layer not covered by the pad to form a conductive circuit layer;

[0010] Filling the accommodating space with a conductive paste, wherein the conductive paste protrudes out of the pad and away from the surface of the conductive circuit layer; and

[0011] The components to be connected are connected to the conductive paste, and the components to be connected are electrically connected to the conductive circuit layer through the conductive paste, thereby obtaining the circuit board connection structure.

[0012] A second embodiment of the present invention provides a method for manufacturing a multi-layer circuit board connection structure, comprising the following steps:

[0013] Providing a circuit substrate, the circuit substrate comprising a substrate and at least one first conductive circuit layer disposed on the substrate;

[0014] sequentially covering the first conductive circuit layer with an insulating layer and a copper foil layer;

[0015] forming a soldering pad on the copper foil layer, wherein the soldering pad is provided with an accommodating space;

[0016] Etching the copper foil layer not covered by the pad to form a conductive circuit layer;

[0017] Filling the accommodating space with a conductive paste, wherein the conductive paste protrudes out of the pad and away from the surface of the conductive circuit layer; and

[0018] The components to be connected are connected to the conductive paste, and the components to be connected are electrically connected to the conductive circuit layer through the conductive paste, thereby obtaining the multi-layer circuit board connection structure.

[0019] A first embodiment of the present invention provides a circuit board connection structure, comprising:

[0020] Grassroots;

[0021] A conductive circuit layer, wherein the conductive circuit layer is formed on the surface of the base layer;

[0022] A welding pad, wherein the welding pad is formed on the conductive circuit layer and an accommodating space is provided in the welding pad;

[0023] Conductive paste, the conductive paste is filled in the accommodating space, and the conductive paste is also formed on the surface of the pad away from the conductive circuit layer; and

[0024] The component to be connected is connected to the conductive paste, and the component to be connected is electrically connected to the conductive circuit layer through the conductive paste.

[0025] The present invention sets the accommodating space in the soldering pad and fills the conductive paste in the accommodating space. When the part to be connected is connected to the conductive paste, the conductive paste can flow on the surface of the soldering pad, that is, the soldering pad can provide a flowing space for the conductive paste to prevent the conductive paste from contacting the conductive circuit layer after flowing and causing a short circuit in the conductive circuit layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1A and Figure 1B They are respectively a top view and a cross-sectional view after a first dry film is formed on the copper-clad substrate provided in the first embodiment of the present invention.

[0027] Figure 2A and Figure 2B Respectively Figure 1A and Figure 1B The top view and cross-sectional view of the first dry film after exposure and development are shown.

[0028] Figure 3A and Figure 3B Respectively in Figure 2A and Figure 2B The top view and cross-sectional view of the first groove after electroplating are shown.

[0029] Figure 4A and Figure 4B They are Figure 3A and Figure 3B The top view and cross-sectional view are shown after the first patterned dry film is removed.

[0030] Figure 5A and Figure 5B Respectively in Figure 4A and Figure 4B The top view and cross-sectional view are shown after the second dry film is formed on the bonding pad.

[0031] Fig. 6A and Figure 6B Respectively Figure 5A and Figure 5B The top view and cross-sectional view of the second dry film after exposure and development are shown.

[0032] Fig. 7A and Figure 7B Etching Fig. 6A and Figure 6B Top view and cross-sectional view after the copper foil layer is shown.

[0033] Fig. 8A and Figure 8B They are Fig. 7A and Figure 7B The top view and cross-sectional view are shown after the second patterned dry film is removed.

[0034] Fig.9A and Fig. 9B Respectively in Fig. 8A and Figure 8B The top view and cross-sectional view of the circuit board connection structure obtained after the accommodating space is filled with conductive paste and the parts to be connected are connected to the conductive paste.

[0035] Fig.10 4 is a cross-sectional view of a multi-layer circuit board connection structure provided by a second embodiment of the present invention.

[0036] Main component symbols

[0037] Circuit board connection structure 100

[0038] Copper clad substrate 10

[0039] Grassroots 101

[0040] Copper foil layer 102

[0041] Conductive circuit layer 103

[0042] First dry film 20

[0043] The first groove 201

[0044] The first patterned dry film 21

[0045] Solder pad 30

[0046] Solder pad 301

[0047] First end 3011

[0048] Second end 3012

[0049] Accommodation space 31

[0050] First opening 32

[0051] Second opening 33

[0052] Second dry film 40

[0053] The second patterned dry film 41

[0054] The second groove 411

[0055] Conductive paste 50

[0056] Circuit board 60

[0057] Substrate 601

[0058] The first conductive circuit layer 602

[0059] Insulation layer 70

[0060] Multilayer circuit board connection structure 200

[0061] The following specific implementation manner will further illustrate the present invention in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0062] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0063] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0064] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined purpose, the present invention is described in detail below in conjunction with the accompanying drawings and preferred embodiments.

[0065] A first embodiment of the present invention provides a method for manufacturing a circuit board connection structure, comprising the following steps:

[0066] Step S101, see Figure 1A and Figure 1B , providing at least one copper clad substrate 10.

[0067] In this embodiment, the copper clad substrate 10 includes a base layer 101 and a copper foil layer 102 disposed on a surface of the base layer 101 .

[0068] The material of the base layer 101 can be selected from one of epoxy resin, polypropylene (PP), BT resin, polyphenylene oxide (PPO), polypropylene (PP), polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), etc. In this embodiment, the material of the base layer 101 is polyimide.

[0069] Step S102 , forming a first dry film 20 on the copper foil layer 102 .

[0070] Step S103, see Figure 2A and Figure 2B , the first dry film 20 is exposed and developed to form a first patterned dry film 21 .

[0071] The first patterned dry film 21 includes a first groove 201. Specifically, in this embodiment, the first groove 201 includes two semi-circular first grooves, and the two semi-circular first grooves are arranged at a distance.

[0072] Step S104, see Figure 3A and Figure 3B , electroplating is performed in the first groove 201 to form a soldering pad 30 .

[0073] Specifically, copper may be electroplated in the first groove 201 to form the pad 30 .

[0074] Step S105, see Figure 4A and Figure 4B, remove the first patterned dry film 21.

[0075] In this embodiment, the pad 30 includes at least two pad portions 301. The two pad portions 301 are arranged to form a receiving space 31. Each pad portion 301 includes a first end portion 3011 and a second end portion 3012 that are arranged opposite to each other. The first end portions 3011 of the two pad portions 301 are arranged to define a first opening 32, and the first opening 32 is connected to the receiving space 31. The second end portions 3012 of the two pad portions 301 are arranged to define a second opening 33. The second opening 33 is connected to the receiving space 31, and the first opening 32 and the second opening 33 are located on opposite sides of the receiving space 31.

[0076] In this embodiment, the cross-section of the welding pad 30 is substantially in the shape of two semicircular rings spaced apart from each other.

[0077] In other embodiments, the solder pad 30 may be provided with a plurality of openings according to the overflow amount of solder paste.

[0078] Step S106, see Figure 5A and Figure 5B , forming a second dry film 40 on the pad 30 .

[0079] The second dry film 40 also covers the surface of the copper foil layer 102 where the solder pad 30 is not formed.

[0080] Step S107, see Fig. 6A and Figure 6B , the second dry film 40 is exposed and developed to form a second patterned dry film 41 .

[0081] The second patterned dry film 41 includes a second groove 411 .

[0082] Step S108, see Fig. 7A and Figure 7B , etching the portion of the copper foil layer 102 corresponding to the second groove 411 to form a conductive circuit layer 103 .

[0083] Step S109, see Fig. 8A and Figure 8B , remove the second patterned dry film 41.

[0084] Step S110, see Fig.9A and Fig. 9B , a conductive paste 50 is filled in the accommodating space 31 .

[0085] The conductive paste 50 protrudes from the pad 30 away from the surface of the conductive circuit layer 103. The conductive paste 50 can be tin paste, copper paste, etc. In this embodiment, the conductive paste 50 is tin paste. The conductive paste 50 is provided to protrude, so as to facilitate the subsequent connection of the to-be-connected parts on the conductive paste 50.

[0086] Step S111 , connecting a component to be connected (not shown) to the conductive paste 50 , and the component to be connected is electrically connected to the conductive circuit layer 103 through the conductive paste 50 , thereby obtaining the circuit board connection structure 100 .

[0087] Wherein, the to-be-connected parts include circuit boards or electronic components. The circuit board connection structure 100 manufactured by the above method is a single-sided board. It can be understood that the circuit board connection structure 100 manufactured by the above method can also be a double-sided board.

[0088] See also Fig.10 The second embodiment of the present invention provides a method for manufacturing a multi-layer circuit board connection structure 200, the difference being that the manufacturing method can be used to manufacture multiple panels. The manufacturing method comprises the following steps:

[0089] Step S201 , providing a circuit substrate 60 .

[0090] In this embodiment, the circuit substrate 60 includes a substrate 601 and a first conductive circuit layer 602 disposed on the surface of the substrate 601. The first conductive circuit layer 602 may be a single layer. In other embodiments, the circuit substrate 60 may further include a greater number of conductive circuit layers.

[0091] The material of the substrate 601 may be the same as that of the base layer 101 , which will not be described in detail herein.

[0092] Step S202 , forming an insulating layer 70 and a copper foil layer (not shown) on the first conductive circuit layer 602 .

[0093] The subsequent steps may refer to step S102 to step S111 and will not be described in detail here.

[0094] See also Fig.9A and Fig. 9B The first embodiment of the present invention further provides a circuit board connection structure 100, which includes a base layer 101, a conductive circuit layer 103, a solder pad 30, a conductive paste 50 and a component to be connected (not shown).

[0095] The material of the base layer 101 can be selected from one of epoxy resin, polypropylene (PP), BT resin, polyphenylene oxide (PPO), polypropylene (PP), polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), etc. In this embodiment, the material of the base layer 101 is polyimide.

[0096] The conductive circuit layer 103 is formed on the surface of the base layer 101 .

[0097] The solder pad 30 is formed on the conductive circuit layer 103. In this embodiment, the solder pad 30 includes at least two solder pad portions 301. The two solder pad portions 301 are arranged to form a receiving space 31. Each of the solder pad portions 301 includes a first end portion 3011 and a second end portion 3012 that are arranged opposite to each other. The first end portions 3011 of the two solder pad portions 301 are arranged to define a first opening 32, and the first opening 32 is connected to the receiving space 31. The second end portions 3012 of the two solder pad portions 301 are arranged to define a second opening 33. The second opening 33 is connected to the receiving space 31, and the first opening 32 and the second opening 33 are located on opposite sides of the receiving space 31.

[0098] In this embodiment, the cross-section of the welding pad 30 is substantially in the shape of two semicircular rings spaced apart from each other.

[0099] In other embodiments, the solder pad 30 may be provided with a plurality of openings according to the overflow amount of solder paste.

[0100] The conductive paste 50 is filled in the accommodating space 31. The conductive paste 50 is also formed on the surface of the pad 30 away from the conductive circuit layer 103. The conductive paste 50 can be tin paste and copper paste. In this embodiment, the conductive paste 50 is tin paste. The conductive paste 50 is formed on the surface of the pad 30 away from the conductive circuit layer 103, so as to facilitate the subsequent connection of the connected parts on the conductive paste 50.

[0101] The component to be connected is connected to the conductive paste 50. The component to be connected is electrically connected to the conductive circuit layer 103 through the conductive paste 50. The component to be connected includes a circuit board or an electronic component.

[0102] See also Fig.10The second embodiment of the present invention further provides a multi-layer circuit board connection structure 200. The difference between the multi-layer circuit board connection structure 200 provided in the second embodiment and the circuit board connection structure 100 provided in the first embodiment is that the multi-layer circuit board connection structure 200 also includes a circuit substrate 60, and the circuit substrate 60 is formed on the side of the insulating layer 70 (equivalent to the base layer 101 in the first embodiment) away from the insulating layer 70.

[0103] In this embodiment, the circuit substrate 60 includes a substrate 601 and a first conductive circuit layer 602 disposed between the substrate 601 and the insulating layer 70. The first conductive circuit layer 602 may be a single layer. In other embodiments, the circuit substrate 60 may further include a greater number of conductive circuit layers.

[0104] The present invention provides the accommodation space 31 in the pad 30 and fills the conductive paste 50 in the accommodation space 31. When the to-be-connected part is connected to the conductive paste 50, the conductive paste 50 can flow on the surface of the pad 30, that is, the pad 30 can provide a space for the conductive paste 50 to flow, preventing the conductive paste 50 from contacting the conductive circuit layer 103 after flowing and causing a short circuit in the conductive circuit layer 103. At the same time, the first opening 32 and the second opening 33 are connected to the accommodation space 31, which is conducive to exhausting the air in the accommodation space 31 when filling the conductive paste 50, thereby reducing the generation of bubbles. In addition, the first opening 32 and the second opening 33 can reduce the possibility of the conductive paste 50 overflowing between the two pads 30, thereby reducing the risk of circuit short circuit.

[0105] The above description is only an optimized specific implementation of the present invention, but it cannot be limited to this implementation in actual application. For ordinary technicians in this field, other variations and changes made according to the technical concept of the present invention should all fall within the protection scope of the present invention.

Claims

1. A method for manufacturing a circuit board connection structure, characterized in that: The following steps are involved: Providing a copper-clad substrate, the copper-clad substrate comprising a base layer and a copper foil layer formed on a surface of the base layer; A solder pad is formed on the copper foil layer, wherein a receiving space is provided in the solder pad, wherein the solder pad comprises at least two solder pad portions, wherein the two solder pad portions are arranged to surround the receiving space, wherein each solder pad portion comprises a first end portion and a second end portion which are arranged opposite to each other, wherein the first end portions of the two solder pad portions are arranged to define a first opening which is connected to the receiving space, and wherein the second end portions of the two solder pad portions are arranged to define a second opening which is connected to the receiving space, and wherein the first opening and the second opening are located on opposite sides of the receiving space; Etching the copper foil layer not covered by the pad to form a conductive circuit layer; Filling the accommodating space with a conductive paste, wherein the conductive paste protrudes out of the pad and away from the surface of the conductive circuit layer; as well as The components to be connected are connected to the conductive paste, and the components to be connected are electrically connected to the conductive circuit layer through the conductive paste, thereby obtaining the circuit board connection structure.

2. The method for manufacturing a circuit board connection structure according to claim 1, characterized in that: The method for making the welding pad comprises: forming a first dry film on the copper foil layer; exposing and developing the first dry film to form a first patterned dry film, wherein the first patterned dry film includes a first groove; Electroplating in the first groove to form the pad; and The first patterned dry film is removed.

3. The method for manufacturing a circuit board connection structure according to claim 1, characterized in that: Etching the copper foil layer comprises: Covering a second dry film on the copper foil layer having the solder pad; exposing and developing the second dry film to form a second patterned dry film, wherein the second patterned dry film includes a second groove, and the second patterned dry film covers the pad; Etching a portion of the copper foil layer corresponding to the second groove to obtain the conductive circuit layer; and The second patterned dry film is removed.

4. A method for manufacturing a multilayer circuit board connection structure, characterized in that: The following steps are involved: Providing a circuit substrate, the circuit substrate comprising a substrate and at least one first conductive circuit layer disposed on the substrate; sequentially covering the first conductive circuit layer with an insulating layer and a copper foil layer; A solder pad is formed on the copper foil layer, wherein a receiving space is provided in the solder pad, wherein the solder pad comprises at least two solder pad portions, wherein the two solder pad portions are arranged to surround the receiving space, wherein each solder pad portion comprises a first end portion and a second end portion which are arranged opposite to each other, wherein the first end portions of the two solder pad portions are arranged to define a first opening which is connected to the receiving space, and wherein the second end portions of the two solder pad portions are arranged to define a second opening which is connected to the receiving space, and wherein the first opening and the second opening are located on opposite sides of the receiving space; Etching the copper foil layer not covered by the pad to form a second conductive circuit layer; Filling the accommodating space with a conductive paste, wherein the conductive paste protrudes out of the pad and away from the surface of the second conductive circuit layer; as well as The components to be connected are connected to the conductive paste, and the components to be connected are electrically connected to the second conductive circuit layer through the conductive paste, thereby obtaining the multi-layer circuit board connection structure.

5. A circuit board connection structure, characterized in that: include: Grassroots; A conductive circuit layer, wherein the conductive circuit layer is formed on the surface of the base layer; A soldering pad, wherein the soldering pad is formed on the conductive circuit layer, wherein a receiving space is provided in the soldering pad, wherein the soldering pad comprises at least two soldering pad portions, wherein the two soldering pad portions are arranged to surround the receiving space, wherein each soldering pad portion comprises a first end portion and a second end portion which are arranged opposite to each other, wherein the first end portions of the two soldering pad portions are arranged to define a first opening, wherein the first opening is connected to the receiving space, wherein the second end portions of the two soldering pad portions are arranged to define a second opening, wherein the second opening is connected to the receiving space, and wherein the first opening and the second opening are located on opposite sides of the receiving space; Conductive paste, the conductive paste is filled in the accommodating space, and the conductive paste is also formed on the surface of the pad away from the conductive circuit layer; as well as The component to be connected is connected to the conductive paste, and the component to be connected is electrically connected to the conductive circuit layer through the conductive paste.

6. The circuit board connection structure according to claim 5, characterized in that: The parts to be connected include circuit boards or electronic components.

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