Electronic device housing and manufacturing method thereof

Abstract

The present invention provides an electronic device casing. The electronic device casing includes a plate and a covering, and the plate includes a main body and a connecting member. The connecting member is fixedly connected to one side of the main body. The connecting member includes a first connecting area, a second connecting area and a bending area. The connecting member is fixedly connected to the main body through the first connecting area. The second connecting area is used to fix the covering. The bending area is located between the first connecting area and the second connecting area, and fixedly connects the first connecting area and the second connecting area. The covering covers at least a part of the bending area. The present invention also provides a method for manufacturing an electronic device casing. The present invention provides an electronic device casing and a manufacturing method thereof, by setting a groove on a flat plate, and bending the flat plate along the area where the groove is located to form a bent plate, and the covering covers the bending area and the groove, thereby increasing the bonding strength between the bent plate and the covering.

Description

Technical Field

[0001] The invention relates to a device housing structure, and in particular to an electronic device housing and a manufacturing method thereof. Background Art

[0002] With the rapid development of computer technology and mobile communication technology, various intelligent mobile electronic devices such as laptops, tablet computers, mobile phones, etc. have been widely used. At the same time, consumers' requirements for the portability of mobile electronic devices have gradually increased. As a result, various mobile electronic devices have been developed in terms of lightweight technology. At present, electronic device housings usually use a combination of sheet materials and plastic materials to reduce weight. Traditional electronic device housings use sheet materials and plastic materials directly joined. However, due to the different characteristics of the two materials, the direct joining method has weak bonding strength and low structural stability. Summary of the invention

[0003] In view of this, an object of the present invention is to provide an electronic device housing with high structural stability and a manufacturing method thereof.

[0004] The present invention provides an electronic device housing. The electronic device housing includes a bent plate and a covering. The bent plate includes a main body and a connecting member. The connecting member is fixedly connected to one side of the main body. The connecting member includes a first connecting area, a second connecting area and a bending area. The connecting member is fixedly connected to the main body through the first connecting area. The second connecting area is used to fix the covering. The bending area is located between the first connecting area and the second connecting area, and fixedly connects the first connecting area and the second connecting area. The covering covers at least a part of the bending area. The bending area includes a groove, and the covering fills the groove.

[0005] Optionally, the groove extends in the longitudinal direction of the bending zone. The covering member is filled into the groove to cover the area where the groove is located. The bending zone also includes at least one first fixing hole. The at least one first fixing hole is penetrated in the groove. The covering member is filled into the at least one first fixing hole to cover the area where the at least one first fixing hole is located.

[0006] Optionally, the at least one first fixing hole comprises a plurality of first fixing holes. The plurality of first fixing holes are arranged in the groove at equal intervals along the longitudinal direction of the bending zone. The covering member is filled into the plurality of first fixing holes to cover the area where the plurality of first fixing holes are located.

[0007] Optionally, the first connection area includes at least one first step and at least one second fixing hole. The at least one first step is located outside the first connection area. The at least one second fixing hole is arranged on one side of the groove. The covering member fills the at least one first step and the at least one second fixing hole to cover the area where the at least one first step and the at least one second fixing hole are located.

[0008] Optionally, the at least one first step includes two first steps. The two first steps are respectively arranged on the left and right outer sides of the first connection area. The at least one second fixing hole includes a plurality of second fixing holes. The plurality of second fixing holes are arranged at equal intervals on one side of the groove along the longitudinal direction of the bending area, and each second fixing hole corresponds to a position between two adjacent first fixing holes.

[0009] Optionally, the second connection area includes an external component and a second step. One side of the external component is adjacent to the groove. The second step is arranged around the other three sides of the external component. The covering component is filled to the second step and exposes the external component.

[0010] Optionally, the bending zone further comprises a bending piece. The groove extends to the bending piece along the longitudinal direction of the bending zone. The R angle of the bending piece is the same as the R angle of the covering member at the groove position.

[0011] Optionally, the covering piece is made of plastic. The covering piece is covered by injection molding. The material of the bent plate is a thermosetting plate, a thermoplastic plate, a thermosetting thermoplastic hybrid plate, a metal plate, or a plastic plate.

[0012] The present invention also provides a method for manufacturing an electronic device casing, which comprises: making a groove on a flat plate; providing a preset mold with an in-mold bending space; bending the flat plate along the area where the groove is located to form a bent plate including a bending area corresponding to the area where the groove is located; injection molding the bent plate inside the in-mold bending space of the preset mold to generate a covering member covering the bending area to form an electronic device casing.

[0013] Optionally, the step of bending the flat plate material along the area where the groove is located to form a bent plate material including a bending area corresponding to the area where the groove is located further includes: placing the flat plate material in the in-mold bending space of the preset mold, and bending the flat plate material along the area where the groove is located through a mold closing operation to form a bent plate material including a bending area corresponding to the area where the groove is located.

[0014] The present invention provides an electronic device housing and a manufacturing method thereof, wherein a groove is provided on a flat plate, and the flat plate is bent along the area where the groove is located to form a bent plate, and a covering member covers at least a part of the bent area and the groove, thereby increasing the bonding strength between the bent plate and the covering member. In addition, by providing a first fixing hole in the bent area, a second fixing hole in the first connection area, and a second step in the second connection area, the covering member is filled in the first fixing hole, the second fixing hole, and the second step, the bonding strength between the bent plate and the covering member is further enhanced, and the structural stability of the electronic device housing is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings of the embodiments will be briefly introduced below. Obviously, the drawings in the following description only relate to some embodiments of the present invention, but are not intended to limit the present invention.

[0016] Figure 1 The present invention is a schematic structural diagram of an electronic device housing provided by an embodiment of the present invention.

[0017] Figure 2 for Figure 1 A schematic structural diagram of a bent plate material of an electronic device housing according to an embodiment.

[0018] Figure 3 for Figure 2 A schematic diagram of a portion of the structure of the bent plate.

[0019] Figure 4 for Figure 2 A schematic diagram of a partial planar structure of the bent plate.

[0020] Figure 5 The present invention is a flowchart of a method for manufacturing an electronic device housing provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solution and effect of the technical solution of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention.

[0022] See also Figure 1An electronic device housing 900 provided by an embodiment of the present invention includes a bent plate 100 and a covering 200. The covering 200 covers the bent plate 100 by injection molding. The material of the bent plate 100 can be a thermosetting plate, a thermoplastic plate, a thermosetting thermoplastic hybrid plate, a metal plate, or a plastic plate. The covering 200 is a plastic material, which is light and plastic, easy to shape, and the electronic device housing 900 formed by combining with the plate 100 is light as a whole and has a buffering and shock absorbing effect. Specifically, the plastic material can be one of PC+ABS, PC+10%-60% glass fiber, PA+10%-60% glass fiber, PPS+10%-60% glass fiber, but is not limited to the above materials. In this embodiment, the bent plate 100 is placed in the bending space of a preset mold by a flat plate, and the bent plate 100 is formed by a mold closing operation.

[0023] See also Figure 1 and Figure 2 , the bending plate 100 includes a main body 110 and a connecting member 120. The connecting member 120 is fixedly connected to one side of the main body 110. The connecting member 120 includes a bending area 121, a first connecting area 122 and a second connecting area 123. The connecting member 120 is fixedly connected to the main body 110 through the first connecting area 122. The second connecting area 123 is used to fix the covering member 200. The bending area 121 is located between the first connecting area 122 and the second connecting area 123, and is fixedly connected to the first connecting area 122 and the second connecting area 123. In this embodiment, the covering member 200 covers the entire area of ​​the bending area 121; in other embodiments, the covering member 200 may also cover a partial area of ​​the bending area 121. The bending area 121 can be bent at any angle according to actual needs. By providing the bending area 121 on the bent plate 100 , the bent plate 100 extends to the area where the covering member 200 is located, thereby enhancing the mechanical strength of the area where the covering member 200 is located and enhancing the bonding strength between the bent plate 100 and the covering member 200 .

[0024] See also Figure 1-3, the bending zone 121 includes a groove 1211, a plurality of first fixing holes 1212 and a bending piece 1213. The groove 1211 extends in the longitudinal direction of the bending zone 121. The covering piece 200 is filled into the groove 1211 to cover the area where the groove 1211 is located, so as to increase the bonding strength between the covering piece 200 and the bending plate 100 and improve the structural stability. The plurality of first fixing holes 1212 are equidistantly arranged in the groove 1211 in the longitudinal direction of the bending zone 121. The covering piece 200 is filled into the plurality of first fixing holes 1212 to cover the area where the plurality of first fixing holes 1212 are located, so as to further enhance the bonding strength between the covering piece 200 and the bending plate 100 and improve the structural stability. The groove 1211 extends in the longitudinal direction of the bending zone 121 to the bending piece 1213. The R angle of the bending member 1213 is the same as the R angle of the covering member 200 at the position of the groove 1211, so as to avoid the R angle of the bending plate 100 and the R angle of the covering member 200 being inconsistent or misaligned due to factors such as the manufacturing of the bending plate and the positioning tolerance of the mold, thereby causing the R angle of the electronic device housing 900 to be poorly connected at the edge line, affecting the appearance of the electronic device housing 900. In this embodiment, the number of the first fixing holes 1212 is multiple. In other embodiments, the number of the first fixing holes 1212 can also be one, two or other numbers, the purpose of which is to enhance the bonding strength between the bending plate 100 and the covering member 200.

[0025] See also Figure 1 , Figure 3 and Figure 4, the first connection area 122 includes two first steps 1221 and a plurality of second fixing holes 1222. The two first steps 1221 are located outside the first connection area 122. Specifically, the two first steps 1221 are respectively arranged on the left and right outer sides of the first connection area 122. The plurality of second fixing holes 1222 are arranged on one side of the groove 1211. Specifically, the plurality of second fixing holes are arranged on one side of the groove 1211 at equal intervals along the longitudinal direction of the bending area 122, and each second fixing hole 1222 corresponds to the position between two adjacent first fixing holes 1212. The covering member 200 is filled into the two first steps 1221 and the plurality of second fixing holes 1222 to cover the area where the two first steps 1221 and the plurality of second fixing holes 1222 are located, thereby improving the bonding strength between the bent sheet 100 and the covering member 200. In this embodiment, the number of the first steps 1221 is two. The number of the second fixing holes 1222 is multiple. The size of the second fixing hole 1222 decreases from top to bottom in the vertical direction. The upper end 1222a of the second fixing hole 1222 is connected to the edge of the groove 1211 to form an opening, and the width of at least one place inside the second fixing hole 1222 is greater than the width of the opening, so that the covering 200 is not easy to fall off after being filled in the upper end 1222a of the second fixing hole 1222, thereby improving the structural stability. The lower end 1222b of the second fixing hole 1222 is annular and embedded in the bending member 1213 to further increase the bonding area between the covering 200 and the bending plate 100 and enhance the bonding force. In other embodiments, the number of the first step 1221 can also be one or three or other numbers. The number of the second fixing holes 1222 can also be one or two or other numbers. The shape of the second fixing hole 1222 can also be other shapes, as long as the width of at least one place inside is greater than the opening width.

[0026] See also Figure 1-3 , the second connection area 123 includes an external component 1231 and a second step 1232. One side of the external component 1231 is adjacent to the groove 1211. The second step 1232 is arranged around the other three sides of the external component 1231. The covering 200 is filled to the second step 1232 and exposes the external component 1231. The covering 200 fills the bending area 121, the first connection area 122 and the second connection area 123 at the same time, increasing the bonding strength between the bending plate 100 and the covering 200. At the same time, the covering 200 is filled in the groove 1211, so that the R angle at the external ridge line of the area where the groove 1211 is located is consistent, avoiding the problem of poor connection between the R angles of the bending plate 100 and the covering 200, which affects the appearance of the electronic device housing 900.

[0027] See also Figure 5 An electronic device manufacturing method provided by an embodiment of the present invention includes the following steps 902-904 to manufacture Figure 1-4The electronic device housing 900.

[0028] Step 902, making a groove on the flat plate. In this embodiment, the groove is a narrow rectangular groove. In other embodiments, a plurality of first fixing holes may be further made in the groove, so that the plurality of first fixing holes are arranged in the groove at equal intervals along the longitudinal direction of the groove; in other embodiments, a plurality of second fixing holes may be made, so that the plurality of second fixing holes are arranged at equal intervals along the longitudinal direction on one side of the groove, and each second fixing hole corresponds to a position between two adjacent first fixing holes.

[0029] Step 904, providing a preset mold with an in-mold bending space.

[0030] Step 906, bend the flat plate along the area where the groove is located to form a bent plate including a bending area corresponding to the area where the groove is located. In this embodiment, the flat plate is directly bent to complete step 906. In other embodiments, the flat plate can also be placed in the in-mold bending space of the preset mold, and step 906 can be completed by a mold closing operation, that is, the flat plate is bent along the area where the groove is located by a mold closing operation to form a bent plate including a bending area corresponding to the area where the groove is located. Through step 906, the groove is located in the bending area. In the aforementioned other embodiments, the first fixing hole is also located in the bending area, and the second fixing hole is located on one side of the bending area.

[0031] Step 908, injection molding the bent sheet in the in-mold bending space of the preset mold to generate a covering covering the bending area to form an electronic device housing. According to the different completion methods of the aforementioned step 906, the coordination method of step 908 and step 906 is also adjusted accordingly. In this embodiment, the bending operation of step 906 is to bend the flat sheet directly, and then step 908 puts the bent sheet into the in-mold bending space of the preset mold for injection molding; in other embodiments, step 906 can bend the flat sheet in the preset mold, and then injection molding of step 908 is performed immediately.

[0032] The present invention provides an electronic device housing and a manufacturing method thereof, wherein a groove is provided on a flat plate, and the flat plate is bent along the area where the groove is located to form a bent plate, and a covering member covers at least a part of the bent area and the groove, thereby increasing the bonding strength between the bent plate and the covering member. In addition, by providing a first fixing hole in the bent area, a second fixing hole in the first connection area, and a second step in the second connection area, the covering member is filled in the first fixing hole, the second fixing hole, and the second step, the bonding strength between the bent plate and the covering member is further enhanced, and the structural stability of the electronic device housing is improved.

[0033] Although the description and illustration of the relevant embodiments of the present invention have been given, it should be understood by those skilled in the art that the description and illustration of these embodiments do not constitute a limitation on the scope of the present invention, and the present invention may be transformed in various forms and details without exceeding the concept and scope of the present invention. Therefore, the scope of the present disclosure is not limited to the above embodiments, but should be determined by the claims and the equivalents of the claims.

Claims

1. An electronic device housing, characterized in that: The electronic device housing comprises a bent plate and a covering member, the bent plate comprises a main body and a connecting member, the connecting member is fixedly connected to one side of the main body, the connecting member comprises a first connecting area, a second connecting area and a bent area, the connecting member is fixedly connected to the main body through the first connecting area, the second connecting area is used to fix the covering member, the bending area is located between the first connecting area and the second connecting area, and is fixedly connected to the first connecting area and the second connecting area, the covering member covers at least a part of the bending area, the bending area comprises a groove, the covering member is filled into the groove, and the bending area also comprises at least a first A fixing hole, wherein the at least one first fixing hole is penetrated in the groove, and the covering member is filled into the at least one first fixing hole to cover the area where the at least one first fixing hole is located, and the first connection area includes at least one first step and at least one second fixing hole, and the at least one first step is located outside the first connection area, and the at least one second fixing hole is arranged on one side of the groove, and the size of the at least one second fixing hole decreases from top to bottom in the vertical direction, and the covering member is filled into the at least one first step and the at least one second fixing hole to cover the area where the at least one first step and the at least one second fixing hole are located.

2. An electronic device housing as claimed in claim 1, characterized in that: The groove extends along the longitudinal direction of the bending zone.

3. An electronic device housing as claimed in claim 2, characterized in that: The at least one first fixing hole comprises a plurality of first fixing holes, and the plurality of first fixing holes are arranged in the groove at equal intervals along the longitudinal direction of the bending zone, and the covering member is filled into the plurality of first fixing holes to cover the area where the plurality of first fixing holes are located.

4. An electronic device housing as claimed in claim 3, characterized in that: The at least one first step includes two first steps, and the two first steps are respectively arranged on the left and right outer sides of the first connecting area. The at least one second fixing hole includes a plurality of second fixing holes, and the plurality of second fixing holes are evenly spaced along the longitudinal direction of the bending area on one side of the groove, and each of the second fixing holes corresponds to a position between two adjacent first fixing holes.

5. An electronic device housing as claimed in claim 4, characterized in that: The second connection area includes an external component and a second step. One side of the external component is adjacent to the groove. The second step is arranged around the other three sides of the external component. The covering component fills up to the second step and exposes the external component.

6. An electronic device housing as claimed in claim 5, characterized in that: The bending zone further includes a bending piece, the groove extends to the bending piece along the longitudinal direction of the bending zone, and the R angle of the bending piece is the same as the R angle of the covering piece at the groove position.

7. An electronic device housing according to any one of claims 1 to 6, characterized in that: The covering piece is made of plastic, and the covering piece is covered by injection molding. The material of the bent plate is one of a thermosetting plate, a thermoplastic plate, a thermosetting thermoplastic mixed plate, a metal plate, or a plastic plate.

8. A method for manufacturing an electronic device housing, characterized in that: The electronic device housing manufacturing method comprises: A groove, a plurality of first fixing holes, and a plurality of second fixing holes are made on a flat plate, wherein the plurality of first fixing holes are arranged in the groove at equal intervals along the longitudinal direction of the groove, and the plurality of second fixing holes are arranged at equal intervals along the longitudinal direction on one side of the groove; Providing a preset mold with in-mold bending space; Bending the flat plate along the area where the groove is located to form a bent plate including a bending area corresponding to the area where the groove is located; The bent plate is injection molded inside the in-mold bending space of the preset mold to generate a covering member covering the bending area to form an electronic device housing.

9. The method for manufacturing an electronic device housing according to claim 8, characterized in that: The step of bending the flat plate along the area where the groove is located to form a bent plate including a bending area corresponding to the area where the groove is located, further includes: The flat plate is placed in the in-mold bending space of the preset mold, and the flat plate is bent along the area where the groove is located through a mold closing operation to form a bent plate including a bending area corresponding to the area where the groove is located.

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