High-efficiency packaging device for semiconductor chips

Abstract

The present invention discloses a highly efficient packaging device for semiconductor chips, wherein a fixed block for cooperating with a push plate is arranged on the top of each slider, an electromagnetic plate is installed on the end surface of the push plate close to the fixed block, a first frame comprises a vertical portion connected to the right support plate and a horizontal portion extending to the top of the support box, a suction pump connected to the glue box through a connecting pipe is installed on the outer wall of the vertical portion, a second stepper motor is installed above the horizontal portion, a rotatable second electric telescopic rod is installed on the output shaft of the second stepper motor and below the horizontal portion, one end of a follow-up frame is sleeved on the piston cylinder of the second electric telescopic rod, a glue suction cylinder connected to the suction pump is installed on the other end of the follow-up frame, a telescopic cylinder is fixed on the telescopic end of the second electric telescopic rod, and a pressing plate is fixed on the telescopic end of the telescopic cylinder. The present invention can also improve the bonding strength of the chip while protecting the chip from damage, thereby greatly improving the work efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and in particular to a high-efficiency packaging device for semiconductor chips. Background Art

[0002] Semiconductor packaging refers to the process of processing the tested wafers into independent chips according to the product model and functional requirements. The packaging process is as follows: the wafers from the wafer front-end process are cut into small chips through the dicing process, and then the cut chips are glued to the corresponding islands of the substrate (lead frame) frame, and then the bonding pads of the chips are connected to the corresponding pins of the substrate using ultra-fine metal wires or conductive resins to form the required circuit; then the independent chips are packaged and protected with plastic shells, and a series of operations are required after the plastic packaging. After the packaging is completed, the finished product is tested, usually after inspection, testing and packaging, and finally shipped.

[0003] Existing semiconductor chips need to go through multiple continuous operations during the processing stage, and the processing operations are completed in different process stages, resulting in unsatisfactory overall processing efficiency. Summary of the invention

[0004] The purpose of the present invention is to provide an efficient packaging device for semiconductor chips, which can realize all operations of loading, dispensing, core bonding and unloading in one process, and can also improve the bonding strength of the chip while protecting the chip from damage, thereby greatly improving the work efficiency and improving the accuracy and reliability of chip processing.

[0005] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: an efficient packaging device for semiconductor chips, comprising: a left support plate, a right support plate and a top support plate which are arranged in parallel and at intervals, and which span the top of the left support plate and the right support plate, wherein four support boxes are arranged between the left support plate and the right support plate and are located directly below the top support plate, wherein each of the support boxes is provided with a plurality of material seats which can be intermittently moved around the support box, and the material seats are provided with material grooves for placing chips on the surface opposite to the support box, and a second frame and a first frame are arranged on the right support plate at intervals along the forward direction of the material seats, wherein the lower ends of the second frame and the first frame are respectively connected to the right support plate, and the upper ends of the second frame and the first frame are respectively extended to the top of the support box close to the right support plate and are correspondingly provided with a glue discharging cylinder and a glue sucking cylinder, wherein each of the glue discharging cylinder and the glue sucking cylinder has a material seat directly below, a material seat is arranged between the two material seats directly below the glue discharging cylinder and the glue sucking cylinder, and a material seat is respectively arranged at the front end of the material seat directly below the glue discharging cylinder and the rear end of the material seat directly below the glue sucking cylinder;

[0006] The top support plate is provided with a first slide groove, a second slide groove and a third slide groove with one end being collinear, wherein one end of the collinear groove corresponds to being located directly above the front ends of the three support boxes away from the right support plate from left to right, and the other ends of each of the three slide grooves extend to above the support boxes close to the right support plate, and the first slide groove extends to above the material seat at the rear end of the material seat directly below the glue suction cylinder, the second slide groove extends to above the material seat between the two material seats directly below the glue discharge cylinder and the glue suction cylinder, and the third slide groove extends to above the material seat at the front end of the material seat directly below the glue discharge cylinder, and a slider is slidably installed in each of the first slide groove, the second slide groove and the third slide groove, and a suction cup that can move up and down is installed at the bottom of each of the sliders through a first electric telescopic rod;

[0007] Two opposing support members are arranged on the left and right ends of the upper surface of the top support plate, a threaded rod is rotatably installed between the two support members, one end of the threaded rod is connected to the output shaft of a servo motor, a push plate is threadedly connected to the threaded rod and located on the left side of the first slide groove, a fixed block for cooperating with the push plate is arranged on the top of each of the sliders, an electromagnetic plate is installed on the end surface of the push plate close to the fixed block, and an iron wheel for rolling contact with the electromagnetic plate is rotatably installed on each of the fixed blocks;

[0008] The first frame includes a vertical portion connected to the right support plate and a horizontal portion extending to the top of the support box, a suction pump connected to the glue box through a connecting pipe is installed on the outer wall of the vertical portion, a second stepping motor is installed above the horizontal portion, a rotatable second electric telescopic rod is installed on the output shaft of the second stepping motor and below the horizontal portion, one end of a follower frame is sleeved on the piston cylinder of the second electric telescopic rod, and the other end of the follower frame is installed with the glue suction cylinder connected to the suction pump;

[0009] A telescopic tube is fixed on the telescopic end of the second electric telescopic rod, and a clamping plate is fixed on the telescopic end of the telescopic tube. A clamping spring sleeved on the telescopic tube is arranged between the clamping plate and the telescopic end of the second electric telescopic rod, and a limiting ring protruding radially outward and located in the clamping spring is provided at the bottom of the telescopic end of the telescopic tube.

[0010] The further improved scheme in the above technical scheme is as follows:

[0011] 1. In the above scheme, the fixing rods connected to the left support plate and the right support plate at both ends respectively penetrate the four support boxes, and the support boxes are installed between the left support plate and the right support plate.

[0012] 2. In the above solution, the two fixing rods are arranged in parallel and at intervals in the middle area of ​​the support box.

[0013] 3. In the above solution, three electromagnet blocks are fixed on the lower surface of the top support plate and are distributed at equal distances. The three electromagnet blocks are respectively located on one side of the corresponding first electric telescopic rod.

[0014] 4. In the above solution, a track frame is fixed to the top inner wall of the first frame, and the top of the glue suction tube is slidably mounted on the inner wall of the track frame.

[0015] 5. In the above solution, a metering pump is installed on the second frame, the output end of the metering pump is connected to the glue outlet cylinder through a discharge pipe, and the input end of the metering pump is connected to a glue box through a pipeline.

[0016] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art:

[0017] The high-efficiency packaging device for semiconductor chips of the present invention has a first slide groove extending to above the material seat at the rear end of the material seat directly below the glue suction cylinder, a second slide groove extending to above the material seat between the two material seats directly below the glue outlet cylinder and the glue suction cylinder, and a third slide groove extending to above the material seat at the front end of the material seat directly below the glue outlet cylinder. A slider is slidably installed in each of the first slide groove, the second slide groove and the third slide groove, and a suction cup that can move up and down is installed at the bottom of each slider through a first electric telescopic rod. A glue suction cylinder connected to a suction pump is installed on the other end of the follower frame, and a telescopic cylinder is fixed on the telescopic end of the second electric telescopic rod. A clamping plate is fixed on the telescopic end of the telescopic cylinder. All operations of loading, dispensing, core bonding and unloading can be realized through one process. The bonding strength of the chip can be improved while protecting the chip from damage, and the excess glue can be sucked out for recycling, which greatly improves the work efficiency and improves the accuracy and reliability of chip processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Attached Figure 1 It is a schematic diagram of the overall structure of the efficient packaging device for semiconductor chips of the present invention;

[0019] Attached Figure 2 A bottom view of the high-efficiency packaging device for semiconductor chips of the present invention;

[0020] Attached Figure 3 The local structure of the efficient packaging device for semiconductor chips of the present invention is schematically shown. Figure 1 ;

[0021] Attached Figure 4 The local structure of the efficient packaging device for semiconductor chips of the present invention is schematically shown. Figure 2 .

[0022] In the above drawings: 1, left support plate; 2, material seat; 3, support box; 4, first electric telescopic rod; 5, push plate; 6, support member; 7, servo motor; 8, threaded rod; 9, electromagnetic plate; 10, top support plate; 11, first frame; 111, vertical part; 112, horizontal part; 12, connecting pipe; 13, suction pump; 14, metering pump; 15, glue box; 16, second frame; 17, glue cylinder; 18, second stepping motor; 19, second electric telescopic rod; 2 0. Glue suction tube; 21. Telescopic tube; 22. Compression spring; 23. Limiting ring; 24. Compression plate; 25. Iron wheel; 26. Fixed block; 27. Right support plate; 281. First slide groove; 282. Second slide groove; 283. Third slide groove; 29. ​​Sliding block; 30. Follow-up frame; 31. Fixed rod; 32. Transmission rod; 33. Transmission wheel; 34. Transmission belt; 35. Moving plate; 36. Intermittent wheel; 37. First stepper motor; 38. Rotating rod; 39. Sliding column. DETAILED DESCRIPTION

[0023] In the description of this patent, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention; the terms "first", "second", and "third" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance; in addition, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this patent can be understood according to specific circumstances.

[0024] Embodiment 1: An efficient packaging device for semiconductor chips, comprising: a left support plate 1, a right support plate 27 arranged in parallel and spaced apart, and a top support plate 10 spanning over the left support plate 1 and the right support plate 27, four support boxes 3 are arranged between the left support plate 1 and the right support plate 27 and directly below the top support plate 10, each of the support boxes 3 is provided with a plurality of material holders 2 that can intermittently move around the support box 3, and a material slot for placing chips is provided on the surface of the material holder 2 opposite to the support box 3, and the right support plate 27 is provided with a plurality of material holders 2 that can intermittently move around the support box 3, and a plurality of material holders 2 that can intermittently move around the support box 3 are provided on the right support plate 27 ... The second frame 16 and the first frame 11, the lower ends of the second frame 16 and the first frame 11 are connected to the right support plate 27, and the upper ends of the second frame 16 and the first frame 11 extend to the upper part of the support box 3 near the right support plate 27 and are correspondingly installed with a glue discharge cylinder 17 and a glue suction cylinder 20, and the glue discharge cylinder 17 and the glue suction cylinder 20 are each provided with a material seat 2 directly below, and a material seat 2 is arranged between the two material seats 2 directly below the glue discharge cylinder 17 and the glue suction cylinder 20, and a material seat 2 is respectively arranged at the front end of the material seat 2 directly below the glue discharge cylinder 17 and the rear end of the material seat 2 directly below the glue suction cylinder 20;

[0025] The top support plate 10 is provided with a first slide groove 281, a second slide groove 282 and a third slide groove 283 having a colinear end, and one end of the colinear end thereof corresponds to being located directly above the front ends of the three support boxes 3 away from the right support plate 27 from left to right, and the other ends thereof respectively extend to the top of the support box 3 close to the right support plate 27, and the first slide groove 281 extends to the top of the material seat 2 at the rear end of the material seat 2 located directly below the glue suction cylinder 20, the second slide groove 282 extends to the top of the material seat 2 between the two material seats 2 located directly below the glue discharge cylinder 17 and the glue suction cylinder 20, and the third slide groove 283 extends to the top of the material seat 2 at the front end of the material seat 2 located directly below the glue discharge cylinder 17, and a slider 29 is slidably installed in each of the first slide groove 281, the second slide groove 282 and the third slide groove 283, and a suction cup that can move up and down is installed at the bottom of each of the sliders 29 through the first electric telescopic rod 4;

[0026] Two opposing support members 6 are provided at the left and right ends of the upper surface of the top support plate 10, a threaded rod 8 is rotatably installed between the two support members 6, one end of the threaded rod 8 is connected to the output shaft of a servo motor 7, a push plate 5 is threadedly connected on the threaded rod 8 and located on the left side of the first slide groove 281, a fixed block 26 for cooperating with the push plate 5 is provided on the top of each of the sliders 29, an electromagnetic plate 9 is installed on the end surface of the push plate 5 close to the fixed block 26, and an iron wheel 25 for rolling contact with the electromagnetic plate 9 is rotatably installed on each of the fixed blocks 26;

[0027] The first frame 11 includes a vertical portion 111 connected to the right support plate 27 and a horizontal portion 112 extending to the top of the support box 3, a suction pump 13 connected to the glue box 15 through a connecting pipe 12 is installed on the outer wall of the vertical portion 111, a second stepping motor 18 is installed above the horizontal portion 112, a rotatable second electric telescopic rod 19 is installed on the output shaft of the second stepping motor 18 and below the horizontal portion 112, one end of a follower frame 30 is sleeved on the piston cylinder of the second electric telescopic rod 19, and the other end of the follower frame 30 is installed with the glue suction cylinder 20 connected to the suction pump 13;

[0028] A telescopic tube 21 is fixed to the telescopic end of the second electric telescopic rod 19, and a clamping plate 24 is fixed to the telescopic end of the telescopic tube 21. A clamping spring 22 mounted on the telescopic tube 21 is arranged between the clamping plate 24 and the telescopic end of the second electric telescopic rod 19. The bottom of the telescopic end of the telescopic tube 21 has a limiting ring 23 that protrudes radially outward and is located in the clamping spring 22.

[0029] A transmission rod 32 is provided at each end of the support box 3, and the transmission rod 32 passes through the four support boxes 3 and is rotatably connected to the left support plate 1 and the right support plate 27. A transmission wheel 33 is installed on the transmission rod 32 and on the left and right sides of the support box 3. The transmission wheels 33 on the same side of the same support box 3 are connected by a transmission belt 34. Each of the transmission belts 34 is installed with a plurality of movable plates 35 connected to the side end surface of the material seat 2 at one end, and the other end of the movable plate 35 is connected to the transmission belt 34;

[0030] One end of any one of the transmission rods 32 passes through the left support plate 1 or the right support plate 27 and is installed with an intermittent wheel 36. A first stepper motor 37 installed on the left support plate 1 or the right support plate 27 is provided below the intermittent wheel 36. A rotating rod 38 is fixed to the output shaft of the first stepper motor 37. A sliding column 39 cooperating with the intermittent wheel 36 is fixed to the end of the rotating rod 38 away from the first stepper motor 37, thereby realizing intermittent movement of a material seat for placing products to be processed, facilitating the processing and transportation of the products to be processed and improving processing efficiency.

[0031] The fixing rod 31 , whose two ends are respectively connected to the left supporting plate 1 and the right supporting plate 27 , penetrates through the four supporting boxes 3 , and the supporting boxes 3 are installed between the left supporting plate 1 and the right supporting plate 27 .

[0032] The two fixing rods 31 are arranged in parallel and at intervals in the middle area of ​​the supporting box 3 .

[0033] Three electromagnet blocks are fixed on the lower surface of the top support plate 10 and are distributed at equal distances. The three electromagnet blocks are respectively located on one side of the corresponding first electric telescopic rod 4 .

[0034] Embodiment 2: An efficient packaging device for semiconductor chips, comprising: a left support plate 1, a right support plate 27 arranged in parallel and spaced apart, and a top support plate 10 spanning over the left support plate 1 and the right support plate 27, four support boxes 3 are arranged between the left support plate 1 and the right support plate 27 and directly below the top support plate 10, each of the support boxes 3 is provided with a plurality of material holders 2 that can intermittently move around the support box 3, and a material slot for placing chips is provided on the surface of the material holder 2 opposite to the support box 3, and the right support plate 27 is provided with a plurality of material holders 2 that can intermittently move around the support box 3, and a plurality of material holders 2 that can intermittently move around the support box 3 are provided on the right support plate 27 ... The second frame 16 and the first frame 11, the lower ends of the second frame 16 and the first frame 11 are connected to the right support plate 27, and the upper ends of the second frame 16 and the first frame 11 extend to the upper part of the support box 3 near the right support plate 27 and are correspondingly installed with a glue discharge cylinder 17 and a glue suction cylinder 20, and the glue discharge cylinder 17 and the glue suction cylinder 20 are each provided with a material seat 2 directly below, and a material seat 2 is arranged between the two material seats 2 directly below the glue discharge cylinder 17 and the glue suction cylinder 20, and a material seat 2 is respectively arranged at the front end of the material seat 2 directly below the glue discharge cylinder 17 and the rear end of the material seat 2 directly below the glue suction cylinder 20;

[0035] The top support plate 10 is provided with a first slide groove 281, a second slide groove 282 and a third slide groove 283 having a colinear end, and one end of the colinear end thereof corresponds to being located directly above the front ends of the three support boxes 3 away from the right support plate 27 from left to right, and the other ends thereof respectively extend to the top of the support box 3 close to the right support plate 27, and the first slide groove 281 extends to the top of the material seat 2 at the rear end of the material seat 2 located directly below the glue suction cylinder 20, the second slide groove 282 extends to the top of the material seat 2 between the two material seats 2 located directly below the glue discharge cylinder 17 and the glue suction cylinder 20, and the third slide groove 283 extends to the top of the material seat 2 at the front end of the material seat 2 located directly below the glue discharge cylinder 17, and a slider 29 is slidably installed in each of the first slide groove 281, the second slide groove 282 and the third slide groove 283, and a suction cup that can move up and down is installed at the bottom of each of the sliders 29 through the first electric telescopic rod 4;

[0036] Two opposing support members 6 are provided at the left and right ends of the upper surface of the top support plate 10, a threaded rod 8 is rotatably installed between the two support members 6, one end of the threaded rod 8 is connected to the output shaft of a servo motor 7, a push plate 5 is threadedly connected on the threaded rod 8 and located on the left side of the first slide groove 281, a fixed block 26 for cooperating with the push plate 5 is provided on the top of each of the sliders 29, an electromagnetic plate 9 is installed on the end surface of the push plate 5 close to the fixed block 26, and an iron wheel 25 for rolling contact with the electromagnetic plate 9 is rotatably installed on each of the fixed blocks 26;

[0037] The first frame 11 includes a vertical portion 111 connected to the right support plate 27 and a horizontal portion 112 extending to the top of the support box 3, a suction pump 13 connected to the glue box 15 through a connecting pipe 12 is installed on the outer wall of the vertical portion 111, a second stepping motor 18 is installed above the horizontal portion 112, a rotatable second electric telescopic rod 19 is installed on the output shaft of the second stepping motor 18 and below the horizontal portion 112, one end of a follower frame 30 is sleeved on the piston cylinder of the second electric telescopic rod 19, and the other end of the follower frame 30 is installed with the glue suction cylinder 20 connected to the suction pump 13;

[0038] A telescopic tube 21 is fixed to the telescopic end of the second electric telescopic rod 19, and a clamping plate 24 is fixed to the telescopic end of the telescopic tube 21. A clamping spring 22 mounted on the telescopic tube 21 is arranged between the clamping plate 24 and the telescopic end of the second electric telescopic rod 19. The bottom of the telescopic end of the telescopic tube 21 has a limiting ring 23 that protrudes radially outward and is located in the clamping spring 22.

[0039] Three electromagnet blocks are fixed on the lower surface of the top support plate 10 and are distributed at equal distances. The three electromagnet blocks are respectively located on one side of the corresponding first electric telescopic rod 4 .

[0040] A track frame is fixed to the top inner wall of the first frame 11 , and the top of the glue suction tube 20 is slidably mounted on the inner wall of the track frame.

[0041] A metering pump 14 is installed on the second frame 16 . The output end of the metering pump 14 is connected to a glue discharging cylinder 17 through a discharging pipe, and the input end of the metering pump 14 is connected to a glue box 15 through a pipeline.

[0042] When the above-mentioned efficient packaging device for semiconductor chips is used, the working principle is as follows: it forms material conveying channels of different sequences through support boxes arranged at intervals, and chips and semiconductors are respectively in different material conveying channels. When in working state, the intermittent mechanism works to drive the transport mechanism to advance intermittently, so that the processed materials are continuously advanced, and the servo motor works to drive the threaded rod to rotate, so that the push plate moves along the threaded rod, and pushes the fixed blocks in the first slide groove, the second slide groove, and the third slide groove in turn, and pushes the first electric telescopic rod with materials adsorbed to the top of the material seat on the far right, and puts the materials on the suction cup on the material seat at the front end directly below the glue discharge cylinder, the material seat between the glue discharge cylinder and the glue suction cylinder, and the material seat at the rear end of the glue suction cylinder, so that the uncoated semiconductors are stored in the material seat at the front end of the glue discharge cylinder waiting to enter the next link, and the uncoated semiconductors in the material seat directly below the glue discharge cylinder are coated with glue by the glue discharge cylinder, the coated semiconductors are placed with chips, the semiconductors with chips placed are compacted and glue sucked, and the completed semiconductors are transported away, so that the chips and semiconductors can be transported and stored separately, and continuous processes are completed on one side.

[0043] One end of the first slide, the second slide and the third slide are colinear and are located from left to right just above the front ends of the three support boxes away from the right support plate, and the other ends of each of them extend to the top of the support box close to the right support plate, and the first slide extends to the top of the material seat at the rear end of the material seat just below the glue suction cylinder, the second slide extends to the top of the material seat between the two material seats just below the glue discharge cylinder and the glue suction cylinder, and the third slide extends to the top of the material seat at the front end of the material seat just below the glue discharge cylinder. A slider is slidably installed in each of the first slide, the second slide and the third slide, and a suction cup that can move up and down is installed at the bottom of each slider through the first electric telescopic rod. One end of a follower frame is mounted on the piston cylinder of the second electric telescopic rod. The other end of the rod is provided with a glue suction cylinder connected with a suction pump, a telescopic cylinder is fixed on the telescopic end of the second electric telescopic rod, and a clamping plate is fixed on the telescopic end of the telescopic cylinder, and a clamping spring mounted on the telescopic cylinder is arranged between the clamping plate and the telescopic end of the second electric telescopic rod. By coordinating the suction cups installed in the three sliding grooves, the intermittently moving material seat and the glue discharging and glue suction stations, all operations of loading, dispensing, core sticking and unloading can be realized in one process, and the bonding strength of the chip can be improved while protecting the chip from damage, and the excess glue can be sucked out for recycling, which greatly improves the work efficiency, avoids the errors caused by multiple movements of the chip to be processed, and improves the accuracy and reliability of chip processing.

[0044] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with the technology to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. An efficient packaging device for semiconductor chips, comprising: A left support plate (1), a right support plate (27) and a top support plate (10) are arranged in parallel and at intervals, and the top support plate (10) is across the left support plate (1) and the right support plate (27), four support boxes (3) are arranged between the left support plate (1) and the right support plate (27) and directly below the top support plate (10), each of the support boxes (3) is installed with a plurality of material seats (2) that can be intermittently moved around the support box (3), and the material seats (2) are provided with a material groove for placing chips on the surface opposite to the support box (3), characterized in that: a second frame (16) and a first frame (16) are arranged on the right support plate (27) along the forward direction of the material seat (2) (11), the lower ends of the second frame (16) and the first frame (11) are connected to the right support plate (27), and the upper ...); The top support plate (10) is provided with a first slide groove (281), a second slide groove (282) and a third slide groove (283) with one end being collinear, wherein one end of the collinear end is located from left to right directly above the front ends of the three support boxes (3) away from the right support plate (27), and the other end of each of the three slide grooves extends to the top of the support box (3) close to the right support plate (27), and the first slide groove (281) extends to the top of the material seat (2) at the rear end of the material seat (2) directly below the glue suction cylinder (20), and the second slide groove (283) extends to the top of the material seat (2) at the rear end of the material seat (2) directly below the glue suction cylinder (20). 82) extends to the upper part of the material seat (2) between the two material seats (2) located directly below the glue discharge cylinder (17) and the glue suction cylinder (20), the third slide groove (283) extends to the upper part of the material seat (2) located at the front end of the material seat (2) directly below the glue discharge cylinder (17), a slider (29) is slidably mounted in each of the first slide groove (281), the second slide groove (282) and the third slide groove (283), and a suction cup that can move up and down is mounted at the bottom of each of the sliders (29) through a first electric telescopic rod (4); Two opposing support members (6) are provided at the left and right ends of the upper surface of the top support plate (10); a threaded rod (8) is rotatably mounted between the two support members (6); one end of the threaded rod (8) is connected to an output shaft of a servo motor (7); a push plate (5) is threadedly connected to the threaded rod (8) and is located on the left side of the first slide groove (281); a fixed block (26) for cooperating with the push plate (5) is provided at the top of each of the sliders (29); an electromagnetic plate (9) is installed on the end surface of the push plate (5) close to the fixed block (26); and an iron wheel (25) for rolling contact with the electromagnetic plate (9) is rotatably mounted on each of the fixed blocks (26); The first frame (11) comprises a vertical portion (111) connected to the right support plate (27) and a horizontal portion (112) extending to the top of the support box (3); a suction pump (13) connected to the glue box (15) through a connecting pipe (12) is installed on the outer wall of the vertical portion (111); a second stepping motor (18) is installed above the horizontal portion (112); a rotatable second electric telescopic rod (19) is installed on the output shaft of the second stepping motor (18) and below the horizontal portion (112); one end of a follower frame (30) is sleeved on the piston cylinder of the second electric telescopic rod (19); the other end of the follower frame (30) is installed with the glue suction cylinder (20) connected to the suction pump (13); A telescopic tube (21) is fixed to the telescopic end of the second electric telescopic rod (19), a clamping plate (24) is fixed to the telescopic end of the telescopic tube (21), a clamping spring (22) sleeved on the telescopic tube (21) is arranged between the clamping plate (24) and the telescopic end of the second electric telescopic rod (19), and a limiting ring (23) protruding radially outward and located inside the clamping spring (22) is provided at the bottom of the telescopic end of the telescopic tube (21).

2. The high-efficiency semiconductor chip packaging device according to claim 1, characterized in that: A fixing rod (31) whose two ends are respectively connected to the left supporting plate (1) and the right supporting plate (27) passes through the four supporting boxes (3), and the supporting boxes (3) are installed between the left supporting plate (1) and the right supporting plate (27).

3. The high-efficiency semiconductor chip packaging device according to claim 2, characterized in that: The two fixing rods (31) are arranged in parallel and at intervals in the middle area of ​​the support box (3).

4. The high-efficiency semiconductor chip packaging device according to claim 1, characterized in that: A metering pump (14) is installed on the second frame (16); the output end of the metering pump (14) is connected to a glue outlet cylinder (17) via a discharge pipe, and the input end of the metering pump (14) is connected to a glue box (15) via a pipeline.

Images