Liquid-cooled heat dissipation module and electronic device having the same

Abstract

The present invention provides a liquid-cooled heat dissipation module and an electronic device having the liquid-cooled heat dissipation module, which are used to solve the problems that the existing liquid-cooled heat dissipation system has many components and occupies a large space. The module comprises: a housing having a first chamber and a second chamber connected by a connecting port and a return port; and a pump located in the housing and aligned with the connecting port, the pump having a stator driving an impeller to rotate, so that a working fluid flows from the first chamber through the connecting port, the stator and the impeller, and flows to the return port in the second chamber, so as to flow back to the first chamber after passing through the return port.

Description

Technical Field

[0001] The present invention relates to a heat dissipation module and an electronic device, in particular to a liquid cooling heat dissipation module which can help the electronic device maintain a proper working temperature and an electronic device having the liquid cooling heat dissipation module. Background Art

[0002] Please refer to Figure 1 , which is an existing liquid cooling heat dissipation system 9, the existing liquid cooling heat dissipation system 9 has a heat absorption unit 91, a heat dissipation unit 92, a pump 93 and a pipe set 94. The heat absorption unit 91 can be attached to the heat source Z of the electronic device, and the pipe set 94 is connected by a pipe 941 to the pump 93 and the heat absorption unit 91, by a pipe 942 to the pump 93 and the heat dissipation unit 92, and then by a pipe 943 to the heat absorption unit 91 and the heat dissipation unit 92.

[0003] According to the aforementioned structure, the pump 93 can drive the working fluid to flow in the pipe assembly 94, and the working fluid that absorbs heat and heats up through the heat absorption unit 91 can be cooled down when passing through the heat dissipation unit 92, and the working fluid is directed to the heat absorption unit 91 again; this continuous cycle allows the heat source Z to maintain an appropriate working temperature, thereby avoiding overheating of the electronic device.

[0004] However, the existing liquid cooling heat dissipation system 9 has many components, and the components have to occupy a certain amount of space due to the need for assembly and combination, making it difficult to reduce the space required for the entire liquid cooling heat dissipation system 9. For thin and light electronic devices, it is often difficult to configure the space. Furthermore, if the pipe assembly 94 of the existing liquid cooling heat dissipation system 9 is not tightly assembled with the corresponding components, it may cause leakage of the internal working fluid, so it needs to be assembled carefully, which is relatively labor-intensive and time-consuming. The more components the pipe assembly 94 has, the higher the possibility of leakage. In addition, after a period of use, the pipe assembly 94 will also have problems such as evaporation of the working fluid and aging and cracking of the pipes, resulting in a shorter service life or more frequent need for repair and maintenance.

[0005] In view of this, the existing liquid cooling system still needs to be improved. Summary of the invention

[0006] To solve the above problems, the present invention aims to provide a liquid-cooled heat dissipation module, which can reduce the number of components required and the space required for assembling the components, and can be applied to thin and light electronic devices.

[0007] Another object of the present invention is to provide a liquid-cooled heat dissipation module, which can ensure that the working fluid thereof will hardly leak or evaporate and gradually reduce in volume.

[0008] Another object of the present invention is to provide a liquid-cooled heat dissipation module that can be pre-assembled so that it can be quickly assembled to a predetermined position of an electronic device later.

[0009] Another object of the present invention is to provide a liquid-cooled heat dissipation module, which has a large heat absorption and heat dissipation area, and the working fluid can maintain a good circulation efficiency, which can effectively reduce the working temperature of the heat source.

[0010] Another object of the present invention is to provide an electronic device having the above-mentioned liquid-cooled heat dissipation module.

[0011] The directions or similar terms used throughout the present invention, such as "front", "rear", "left", "right", "upper (top)", "lower (bottom)", "inner", "outer", "side", etc., are mainly used to refer to the directions of the drawings. The directions or similar terms used are only used to assist in the description and understanding of the embodiments of the present invention, and are not used to limit the present invention. Among them, the "axial direction" used throughout the present invention refers to the extension direction of the rotation axis of the impeller of the pump.

[0012] The components and members described throughout the present invention use the quantifiers "a" or "an" only for convenience of use and to provide a general meaning of the scope of the present invention; in the present invention, they should be interpreted as including one or at least one, and a single concept also includes multiple situations, unless it is obvious that it means otherwise.

[0013] The similar terms such as "combination", "assembly" or "assembly" described throughout the present invention mainly include the connection that can be separated without damaging the components, or the connection that makes the components inseparable, which can be selected by technicians in this field according to the materials of the components to be connected or the assembly requirements.

[0014] The liquid-cooled heat dissipation module of the present invention comprises: a shell having a first chamber and a second chamber in the shell, the first chamber and the second chamber being filled with a working fluid, and the first chamber and the second chamber being connected by a connecting port and a reflux port; and a pump located in the shell and aligned with the connecting port, the pump having a stator driving an impeller to rotate, so that the working fluid flows from the first chamber through the connecting port, the stator and the impeller, and flows to the reflux port in the second chamber, so as to flow back to the first chamber after passing through the reflux port.

[0015] The electronic device of the present invention comprises: a casing; an electrical module located in the casing and having a heating area; and the aforementioned liquid-cooled heat dissipation module, which is arranged in the casing and thermally connected to the heating area by a heat absorption area of ​​the outer casing corresponding to the first chamber or the second chamber.

[0016] Therefore, the liquid-cooled heat dissipation module of the present invention can directly form a first chamber and a second chamber that are axially layered and connected in the shell to allow the working fluid to circulate over a large area, thereby expanding the heat absorption and heat dissipation area, and maintaining a good circulation efficiency of the working fluid, thereby improving the heat dissipation efficiency and effectively reducing the working temperature of the heat source. At the same time, the liquid-cooled heat dissipation module has a small number of components, which can reduce the space required for assembly and combination between the components, and ensure that the working fluid will not leak due to the loose assembly between the components, and because it does not rely on pipes for infusion, there is almost no problem of gradual reduction in the amount of working fluid due to evaporation. In addition, the liquid-cooled heat dissipation module can also be assembled in advance so that it can be quickly assembled to a predetermined position of the electronic device later. Therefore, the liquid-cooled heat dissipation module of the present invention has the effects of improving space utilization and assembly efficiency, and is conducive to the development of lightweight and thin electronic devices with the liquid-cooled heat dissipation module.

[0017] The housing may include a first plate, a second plate and a partition, the partition may be located between the first plate and the second plate, the first chamber may be located between the first plate and the partition, the second chamber may be located between the second plate and the partition, and the connecting port and the reflux port may be provided on the partition. In this way, the housing may be easy to manufacture and can effectively prevent leakage of the working fluid, thereby improving manufacturing convenience and leak-proof effect.

[0018] The partition has a first surface and a second surface opposite to each other. The first plate can be laser welded to the first surface of the partition, and the second plate can be laser welded to the second surface of the partition. In this way, the plates can be closely connected without gaps, which has the effect of improving the sealing and structural strength of the shell.

[0019] The second plate may have an outer protrusion, and at least a part of the pump may be located in the outer protrusion. In this way, other parts of the housing may be thinner, which is applicable to thin electronic devices.

[0020] The outer protrusion can be integrally formed and connected with other parts of the second plate, thereby preventing liquid leakage.

[0021] The second plate may have a through hole, and a convex cover may be aligned with the through hole and combined with the second plate, so that the convex cover forms the outer convex portion of the second plate. In this way, the housing can be easily manufactured and assembled, and when the pump specification changes, the mold for molding the convex cover can be changed, and the mold for molding the second plate can be universal, which has the effects of improving manufacturing convenience and reducing costs.

[0022] The pump can be formed by combining the stator with the partition, the stator surrounding the communication port can form a liquid inlet of the pump, and a shaft connection portion can be provided in the outer protrusion for the impeller to be rotatably connected. In this way, the pump has a simpler structure, which can help reduce the thickness and weight of the overall liquid-cooled heat dissipation module, so as to be suitable for thinner electronic devices.

[0023] The pump may have a frame seat, and the frame seat may be composed of a ring wall and the partition plate to form a liquid inlet of the pump adjacent to the connecting port, and a liquid outlet of the pump may be arranged on the ring wall. In this way, the working fluid passing through the connecting port can all flow into the frame seat through the liquid inlet, which has the effect of improving the efficiency of the pump in driving the working fluid to flow.

[0024] The ring wall can be laser welded to the partition plate, thereby improving the adhesion between the ring wall and the partition plate.

[0025] The stator may have a winding portion disposed on the inner periphery of an outer ring seat, the outer ring seat may be combined with the frame seat, the impeller may have a plurality of blades disposed around a hub, a magnetic member may be connected to the hub, the frame seat may have a bottom plate connected to the ring wall, the liquid inlet of the pump may be opposite to the bottom plate, an axial connection portion may be disposed on the bottom plate and located in the frame seat, the hub may be rotatably connected to the axial connection portion, and the magnetic member may be opposite to the winding portion. In this way, the pump may make full use of the space around the stator for drainage, so that the pump may be reduced in size and still achieve the expected flow rate and head, which is conducive to the development of the thinness of the liquid-cooled heat dissipation module.

[0026] The liquid outlet of the pump may face away from the reflux port, and the housing may have an island located in the second chamber, the island being adjacent to the communication port and extending toward the reflux port. In this way, the working fluid may be more evenly and smoothly introduced into all the flow channels, thereby expanding the heat dissipation or heat absorption area.

[0027] The diameter of the liquid inlet can be greater than or equal to the minimum inner diameter of the stator, and can be less than or equal to the outer diameter of the ring wall. In this way, the pump can have a larger liquid inlet, which has the effect of increasing the water intake.

[0028] The housing may have a plurality of spacers located in the first chamber and the second chamber, and a flow channel may be formed between any two adjacent spacers, thereby guiding the working fluid to flow more evenly and smoothly in the first chamber or the second chamber.

[0029] The plurality of spacers may not extend to the first chamber and the second chamber around the connecting port. Thus, the working fluid can be collected near the connecting port and pass through the connecting port more smoothly, thereby improving the efficiency of the pump driving the working fluid to flow.

[0030] The stator and the impeller can be arranged on the same side of the partition plate, so that the other side of the partition plate can be formed into a thinner shape, which is beneficial to the development of the thinning of the shell.

[0031] The first chamber and the second chamber of the housing can be formed by etching, thereby improving the molding qualification rate and facilitating the development of thinness.

[0032] The working fluid may be a non-conductive fluid. Thus, the stator of the pump does not need to be provided with an additional waterproof structure, which has the effect of simplifying the structure of the liquid-cooled heat dissipation module to improve manufacturing convenience. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 : A diagram of an existing liquid cooling system;

[0034] Figure 2 : An exploded perspective view of a first embodiment of the present invention;

[0035] Figure 3 : An exploded perspective view of a partial partition and a pump of the first embodiment of the present invention;

[0036] Figure 4 : A partial front view of the pump of the first embodiment of the present invention;

[0037] Figure 5 : A front view of the combination of the first embodiment of the present invention;

[0038] Figure 6 :along Figure 5 AA line cross-sectional view of the embodiment, wherein the center island of the housing is omitted;

[0039] Figure 7 : An exploded perspective view of a liquid-cooled heat dissipation module and an electronic device according to a first embodiment of the present invention;

[0040] Figure 8 : A cross-sectional view of a second embodiment of the present invention;

[0041] Fig. 9 : An exploded perspective view of a third embodiment of the present invention;

[0042] Fig.10 : A cross-sectional view of a third embodiment of the present invention;

[0043] Fig.11: An exploded perspective view of the housing of the third embodiment of the present invention and the pump of the first embodiment.

[0044] Description of Reference Numerals

[0045] [the present invention]

[0046] 1: Shell

[0047] 1a: First board

[0048] 1b: Second board

[0049] 1c: Partition

[0050] 11: Connecting port

[0051] 12: Reflux port

[0052] 13: Side 1

[0053] 14: Side 2

[0054] 15: Spacer

[0055] 16: Boss

[0056] 17: Outer convex part

[0057] 18: Nakajima

[0058] 19:Through port

[0059] 2: Pump

[0060] 21: Stator

[0061] 211: Winding part

[0062] 212: Outer ring seat

[0063] 22: Impeller

[0064] 221: Blade

[0065] 222: Wheel Hub

[0066] 223: Magnetic parts

[0067] 23: Frame

[0068] 231: Bottom plate

[0069] 232: Ring Wall

[0070] 24: Liquid inlet

[0071] 25:Liquid outlet

[0072] 26: Shaft connection

[0073] 3: Casing

[0074] 4:Electrical module

[0075] 41: Fever area

[0076] C: Cooling Zone

[0077] D1: Caliber

[0078] D2: minimum inner diameter

[0079] D3:Outer diameter

[0080] E: Electronic devices

[0081] F: Runner

[0082] H: Heat absorption area

[0083] L: Working fluid

[0084] P: convex cover

[0085] R: Virtual circle

[0086] S1: First chamber

[0087] S2: Second chamber

[0088]

existing

[0089] 9: Liquid cooling system

[0090] 91:Heat absorption unit

[0091] 92: Cooling unit

[0092] 93: Pump

[0093] 94: Pipe fittings

[0094] 941,942,943: Pipe fittings

[0095] Z: Heat source. DETAILED DESCRIPTION

[0096] In order to make the above and other purposes, features and advantages of the present invention more clearly understood, preferred embodiments of the present invention are listed below and described in detail with reference to the accompanying drawings as follows:

[0097] Please refer to Figure 2 , Figure 6 As shown, it is a first embodiment of the liquid-cooled heat dissipation module of the present invention, comprising a housing 1 and a pump 2. The pump 2 is located in the housing 1 and can be used to drive a working fluid L to circulate in the housing 1.

[0098] The housing 1 can be made of copper, aluminum, titanium, stainless steel or other heat-conducting materials. The housing 1 has a first chamber S1 and a second chamber S2, the first chamber S1 and the second chamber S2 are filled with the working fluid L, and the first chamber S1 and the second chamber S2 can be connected by a connecting port 11 and a reflux port 12. In this way, the operation of the pump 2 can drive the working fluid L to flow from the first chamber S1 through the connecting port 11 into the second chamber S2, and then flow back to the first chamber S1 through the reflux port 12, so as to circulate in the first chamber S1 and the second chamber S2; or reversely circulate.

[0099] In detail, the housing 1 may include a first plate 1a, a second plate 1b and a partition 1c, the partition 1c is located between the first plate 1a and the second plate 1b, the partition 1c has a first surface 13 and a second surface 14 opposite to each other, the first plate 1a may face the first surface 13 of the partition 1c, so that the first chamber S1 may be located between the first plate 1a and the partition 1c; the second plate 1b may face the second surface 14 of the partition 1c, so that the second chamber S2 may be located between the second plate 1b and the partition 1c. The communication port 11 and the reflux port 12 may be selectively provided on the partition 1c, and pass through the first surface 13 and the second surface 14.

[0100] The housing 1 may be provided with a recess on the surface facing the first plate 1a or / and the partition 1c, so that the first plate 1a and the partition 1c may form the first chamber S1 together; similarly, a recess may be provided on the surface facing the second plate 1b or / and the partition 1c, so that the second plate 1b and the partition 1c may form the second chamber S2 together. The first plate 1a and the second plate 1b may be combined with the partition 1c respectively, or the first plate 1a and the second plate 1b may be combined. The present invention is not limited to the combination mode here, and the principle is that the partition 1c can separate the first chamber S1 and the second chamber S2, and the first chamber S1 and the second chamber S2 are sealed in the housing 1 to prevent the leakage of the working fluid L. In addition, the present invention does not limit the method of combining the plates, for example, bonding, embedding, clamping, locking or welding can be used; in this embodiment, laser welding can be selected to combine adjacent plates so that the plates can be closely connected without gaps, which also has the effect of improving the sealing and structural strength of the shell 1.

[0101] Furthermore, to facilitate processing, manufacturing and assembly, the present embodiment may select a thin plate-shaped first plate 1a, a second plate 1b and a partition 1c, and select the partition 1c to be flat. In addition, an etching process is used to thin the local plate thickness of the first plate 1a and the second plate 1b on the surface of the first plate 1a facing the partition 1c and the surface of the second plate 1b facing the partition 1c to form a depression, so that the first plate 1a is combined with the first surface 13 of the partition 1c, and the second plate 1b is combined with the second surface 14 of the partition 1c, so that an extremely thin shell 1 having the first chamber S1 and the second chamber S2 (the thickness excluding the location where the pump 2 is set can be less than or equal to 3 mm) can be formed, so that it can be suitable for use in thin electronic devices.

[0102] The housing 1 may have a plurality of spacers 15 located in the first chamber S1 and the second chamber S2. The plurality of spacers 15 located in the same chamber are substantially parallel to each other and extend along the direction in which the connecting port 11 is connected to the reflux port 12 (i.e., the flow direction of the working fluid L), so as to form a flow channel F between any two adjacent spacers 15, which helps to guide the working fluid L to flow more evenly and smoothly in the first chamber S1 or the second chamber S2. The plurality of spacers 15 may not extend to the periphery of the first chamber S1 and the second chamber S2 at the connecting port 11, so that the working fluid L is gathered near the connecting port 11 and passes through the connecting port 11 more smoothly, which helps to improve the efficiency of the pump 2 in driving the working fluid L to flow. The housing 1 may also have a plurality of bosses 16 located in the first chamber S1 and the second chamber S2, and mainly located at the place where the spacers 15 are not present. The heights of the plurality of bosses 16 and the plurality of spacer bars 15 may be substantially the same as the depth of the first chamber S1 or the second chamber S2 (excluding the location where the pump 2 is disposed), so that the plurality of bosses 16 and the plurality of spacer bars 15 may abut against the partition plate 1c to provide auxiliary support, thereby helping the first chamber S1 or the second chamber S2 to maintain a substantially fixed volume and preventing the housing 1 from undergoing local deformation.

[0103] On the other hand, for the portion of the housing 1 where the pump 2 is disposed, if the axial height of the pump 2 is greater than the thickness of other portions of the housing 1, a convex portion 17 may be formed on a portion of the first plate 1a or / and the second plate 1b to accommodate the pump 2, so that the pump 2 is located opposite to the communication port 11 and is accommodated in the first chamber S1 or the second chamber S2, or is located in both the first chamber S1 and the second chamber S2. For example, if the convex portion 17 is disposed on the second plate 1b, the convex portion 17 may be integrally formed and connected with other portions of the second plate 1b to prevent leakage, for example, the convex portion 17 may be formed by stamping.

[0104] The pump 2 is located in the housing 1 and has a stator 21 that can drive an impeller 22 to rotate, thereby driving the working fluid L to circulate in the first chamber S1 and the second chamber S2. In this embodiment, the pump 2 can be a shaft-inlet and side-outlet centrifugal pump, and is arranged in alignment with the connecting port 11, so that the working fluid L can flow from the first chamber S1 through the connecting port 11, the stator 21 and the impeller 22 (including sequentially or non-sequentially flowing through the connecting port 11, the stator 21 and the impeller 22), and flow to the reflux port 12 in the second chamber S2, so as to flow back to the first chamber S1 after passing through the reflux port 12. Among them, the stator 21 and the impeller 22 can be selectively arranged on the same side of the partition 1c, for example, they are also located in the second chamber S2, and do not protrude into the first chamber S1, so that the other side can form a thinner shape.

[0105] For details, please refer to Figure 3 , Figure 6 As shown, the stator 21 may have a winding portion 211 disposed on the inner periphery of an outer ring seat 212; the impeller 22 may have a plurality of blades 221 disposed around a hub 222, and a magnetic member 223 may be directly or indirectly connected to the hub 222. The pump 2 of this embodiment may also have a frame seat 23, and the frame seat 23 may have a bottom plate 231 connected to a ring wall 232. During assembly, the outer ring seat 212 of the stator 21 may be combined with the bottom plate 231 and / or the ring wall 232 of the frame seat 23, and the frame seat 23 may be closely combined with the partition 1c by the ring wall 232 to form a liquid inlet 24 of the pump 2 adjacent to the communication port 11, and the liquid inlet 24 and the bottom plate 231 may be roughly axially opposite, and a liquid outlet 25 of the pump 2 may be provided on the ring wall 232 of the frame seat 23. The pump 2 may further include a shaft connection portion 26 , which may be disposed on the bottom plate 231 and located within the frame seat 23 , so as to be rotatably connected to the hub 222 of the impeller 22 and to allow the magnetic member 223 to be radially opposite to the winding portion 211 .

[0106] Moreover, in the pump 2 of this embodiment, the winding portion 211 can be closer to the communication port 11 than the plurality of blades 221, so when the pump 2 is in operation, the working fluid L passing through the communication port 11 can all flow into the frame 23 from the liquid inlet 24, and then flow through the stator 21 and then through the impeller 22, and finally flow out of the frame 23 from the liquid outlet 25. It is preferred to use a non-conductive liquid as the working fluid L, so that the stator 21 of the pump 2 does not need to be provided with an additional waterproof structure; in addition, the annular wall 232 of the frame 23 can be combined with the partition 1c by laser welding, so that the two have good adhesion and no gaps, ensuring that the working fluid L of the communication port 11 can all flow through the pump 2, so as to improve the efficiency of the pump 2 in driving the working fluid L to flow.

[0107] Please refer to Figure 4 , Figure 6 As shown, the diameter D1 of the liquid inlet 24 can be greater than or equal to the minimum inner diameter D2 of the stator 21 (in this embodiment, the minimum inner diameter D2 of the stator 21 is the diameter of a virtual circle R passing through each magnetic pole surface), and can be less than or equal to the outer diameter D3 of the ring wall 232, so that the pump 2 can have a larger liquid inlet 24 to increase the water intake. In this embodiment, since the frame seat 23 selects the outer peripheral surface of the ring wall 232 to be combined with the periphery of the communication port 11, the liquid inlet 24 can be formed at the inner peripheral surface of the ring wall 232, so that the diameter D1 of the liquid inlet 24 is slightly smaller than the outer diameter D3 of the ring wall 232, but it is not limited to this type. In other embodiments, if the thickness of the annular wall 232 varies, the diameter D1 of the liquid inlet 24 will also be slightly smaller than the outer diameter D3 of the annular wall 232; and if the top edge of the annular wall 232 has an inclined plane or curved surface connecting its inner and outer circumferential surfaces, the diameter D1 of the liquid inlet 24 can be approximately equal to the outer diameter D3 of the annular wall 232.

[0108] In addition, please refer to Figure 2 , Figure 6 As shown, in the second chamber S2, if the part closer to the connecting port 11 is the head end and the part closer to the reflux port 12 is the tail end, then the present embodiment can choose to make the liquid outlet 25 of the pump 2 face the head end of the second chamber S2 (i.e., face the direction away from the reflux port 12); in addition, the housing 1 can be provided with an island 18 located in the second chamber S2, and the island 18 can be adjacent to the connecting port 11 and extend toward the reflux port 12, for example, extending to connect to the spacer bar 15 located in the center of the second chamber S2. In this way, compared with making the liquid outlet 25 of the pump 2 directly face the multiple flow channels F, which will cause the working fluid L to flow into only a few flow channels F directly facing the liquid outlet 25, the arrangement of the present embodiment (please refer to Figure 5 As shown in the figure, the working fluid L flowing out of the liquid outlet 25 can first rush to the inner wall of the convex cover 17, and then be divided to both sides, and with the guidance of the middle island 18, it can be more evenly and smoothly introduced into all the flow channels F, and flow along each flow channel F to the return port 12, which has the effect of expanding the heat dissipation or heat absorption area.

[0109] Please refer to Figure 6 , Figure 7As shown, the assembled liquid-cooled heat dissipation module can be placed in a housing 3 of an electronic device E, wherein the housing 3 has an electrical module 4, and the electrical module 4 has a heating zone 41. The housing 1 can have a heat absorption zone H and a cooling zone C. When the heat absorption zone H is aligned with the first chamber S1, the cooling zone C is aligned with the second chamber S2, or the reverse arrangement can be made; that is, one side of the housing 1 is the heat absorption zone H, and the other side is the cooling zone C, and the housing 1 can be thermally connected to the heating zone 41 of the electrical module 4 through the heat absorption zone H, for example, directly contacting, or indirectly contacting with a heat conductive material such as a thermal pad. In this way, during the operation of the electronic device E, when the temperature of the heating zone 41 rises, the housing 1 can absorb the heat energy of the heating zone 41, so that the working fluid L flowing through the heat absorption zone H absorbs heat and heats up, and then when flowing through the cooling zone C, it releases heat and cools down due to contact with a relatively low temperature part of the housing 1. Therefore, the liquid-cooled heat dissipation module can utilize the working fluid L to continuously circulate in the first chamber S1 and the second chamber S2 to effectively remove the heat energy from the heating area 41 and help the electrical module 4 dissipate heat to maintain a proper working temperature.

[0110] The housing 3 may be made entirely or partially of metal, and the cooling area C of the housing 1 may contact the metal part of the housing 3 to quickly exchange heat with the outside; or, a cooling fan group may be provided in the housing 3 to drive the airflow through the cooling area C of the housing 1, or a cooling fin group may be connected to the cooling area C of the housing 1, or the cooling fan group and the cooling fin group may be provided at the same time, which may help the working fluid L to quickly cool down when passing through the cooling area C. In addition, the electronic device E to which the liquid-cooled heat dissipation module is applicable may be, for example, but not limited to, a mobile phone, a tablet computer, a handheld game console, a laptop computer, a desktop computer, a camera, a smart wearable device, an AR / VR glasses, or an electronic medical device.

[0111] Please refer to Figure 8 As shown, it is a second embodiment of the liquid cooling heat dissipation module of the present invention. In this embodiment, the pump 2 may be selected to not have the aforementioned frame seat 23 (indicated at Figure 6 ) to further simplify the pump 2.

[0112] In detail, the pump 2 of this embodiment can be directly connected to the partition plate 1c by the stator 21, and the liquid inlet 24 of the pump 2 is formed at the place where the stator 21 surrounds the communication port 11. The pump 2 can also be provided with a shaft connection portion 26 in the outer protrusion 17 of the housing 1 for the impeller 22 to be rotatably connected, so that the working fluid L from the first chamber S1 through the communication port 11 can all pass through the liquid inlet 24, and flow through the stator 21 and the impeller 22 to be input into the multiple flow channels F in the second chamber S2 (please refer to Figure 2). The pump 2 of this embodiment has a simpler structure, which can help reduce the thickness of the entire liquid-cooled heat dissipation module.

[0113] Please refer to Fig. 9 , Fig.10 As shown, it is a third embodiment of the liquid-cooled heat dissipation module of the present invention. In this embodiment, the outer protrusion 17 of the second plate 1 b can be formed in an assembly manner, and another type of pump 2 is provided.

[0114] In detail, in this embodiment, a through hole 19 can be set on the thin plate-shaped second plate 1b, and a convex cover P can be aligned with the through hole 19 and combined with the outer surface of the second plate 1b, so that the convex cover P forms the outer convex portion 17 of the second plate 1b, so that at least part of the pump 2 can be accommodated in the outer convex portion 17. In this way, when the specifications of the pump 2 are changed, as long as the mold for forming the convex cover P is changed, the mold for forming the second plate 1b can still be universal, which helps to reduce the mold cost at the manufacturing end. Among them, the convex cover P can be selected to use laser welding to combine with the second plate 1b, so that the two have good adhesion and no gaps, reducing the risk of leakage from this point.

[0115] On the other hand, the pump 2 of this embodiment can change the shape of the stator 21 and the impeller 22, so that the multiple blades 221 of the impeller 22 are closer to the communication port 11 than the winding portion 211 of the stator 21. In this way, when the pump 2 of this embodiment is in operation, the working fluid L passing through the communication port 11 can flow into the frame 23 from the liquid inlet 24, and then flow through the impeller 22 and then flow through the stator 21, and finally flow out of the frame 23 from the liquid outlet 25, and the effect of driving the working fluid L to circulate in the first chamber S1 and the second chamber S2 can also be achieved.

[0116] It is worth mentioning that the housing 1 and the pump 2 of each of the above embodiments can be used in any combination and are not limited to the pairing methods of each embodiment; for example, please refer to Fig.11 As shown, the housing 1 of the third embodiment is matched with the pump 2 of the first embodiment.

[0117] In summary, the liquid-cooled heat dissipation module of the present invention can directly form an axially layered and interconnected first chamber and second chamber in the housing to allow the working fluid to circulate over a large area, thereby expanding the heat absorption and heat dissipation area, and maintaining a good circulation efficiency of the working fluid, thereby improving the heat dissipation efficiency and effectively reducing the working temperature of the heat source. At the same time, the liquid-cooled heat dissipation module has a small number of components, which can reduce the space required for assembly and combination between the components, and ensure that the working fluid will not leak due to the loose assembly between the components, and because it does not rely on pipes for infusion, there is almost no problem of gradual reduction in the amount of working fluid due to evaporation. In addition, the liquid-cooled heat dissipation module can also be assembled in advance so that it can be quickly assembled to a predetermined position of the electronic device later. Therefore, the liquid-cooled heat dissipation module of the present invention has the effects of improving space utilization and assembly efficiency, and is conducive to the development of lightweight and thin electronic devices with the liquid-cooled heat dissipation module.

[0118] Although the present invention has been disclosed using the above-mentioned preferred embodiments, they are not intended to limit the present invention. Any person skilled in the art may make various changes and modifications to the above-mentioned embodiments without departing from the spirit and scope of the present invention, and the technical scope protected by the present invention is still within the scope of the present invention. Therefore, the scope of protection of the present invention shall be subject to the claims.

Claims

1. A liquid-cooled heat dissipation module, characterized in that: include: A shell, wherein the shell has a first chamber and a second chamber, the first chamber and the second chamber are filled with a working fluid, and the first chamber and the second chamber are connected by a connecting port and a reflux port, the shell has a first plate, a second plate and a partition, the partition is located between the first plate and the second plate, the first chamber is located between the first plate and the partition, the second chamber is located between the second plate and the partition, and the connecting port and the reflux port are provided on the partition; and A pump is located in the housing and aligned with the connecting port. The pump has a stator that drives an impeller to rotate, so that the working fluid flows from the first chamber through the connecting port, the stator and the impeller, and flows to the reflux port in the second chamber, so as to flow back to the first chamber after passing through the reflux port.

2. The liquid-cooled heat dissipation module according to claim 1, characterized in that: The partition has a first surface and a second surface opposite to each other. The first plate is laser welded to the first surface of the partition, and the second plate is laser welded to the second surface of the partition.

3. The liquid-cooled heat dissipation module according to claim 1, characterized in that: The second plate has an outer protrusion, and the pump is at least partially located in the outer protrusion.

4. The liquid-cooled heat dissipation module according to claim 3, characterized in that: The outer protrusion is integrally formed and connected with other parts of the second plate.

5. The liquid-cooled heat dissipation module according to claim 3, characterized in that: The second plate has a through hole, and a convex cover is aligned with the through hole and combined with the second plate, so that the convex cover forms an outer convex part of the second plate.

6. The liquid-cooled heat dissipation module according to claim 3, characterized in that: The pump is composed of the stator and the partition plate. The stator surrounds the communication port to form a liquid inlet of the pump. A shaft connection portion is arranged in the outer convex portion for rotatably connecting the impeller.

7. The liquid-cooled heat dissipation module according to claim 1, characterized in that: The pump has a frame seat, and the frame seat is combined with the partition plate by a ring wall to form a liquid inlet of the pump adjacent to the communication port, and a liquid outlet of the pump is arranged on the ring wall.

8. The liquid-cooled heat dissipation module according to claim 7, characterized in that: The ring wall is laser welded to the partition.

9. The liquid-cooled heat dissipation module according to claim 7, characterized in that: The stator has a winding portion arranged on the inner circumference of an outer ring seat, the outer ring seat is combined with the frame seat, the impeller has a plurality of blades arranged around a hub, a magnetic member is connected to the hub, the frame seat has a bottom plate connected to the ring wall, the liquid inlet of the pump is opposite to the bottom plate, an axial connection portion is arranged on the bottom plate and located in the frame seat, the hub is rotatably connected to the axial connection portion, and the magnetic member is opposite to the winding portion.

10. The liquid-cooled heat dissipation module according to claim 7, characterized in that: The liquid outlet of the pump faces a direction away from the reflux port. The housing has an island located in the second chamber. The island is adjacent to the communication port and extends toward the reflux port.

11. The liquid-cooled heat dissipation module according to claim 7, characterized in that: The diameter of the liquid inlet is greater than or equal to the minimum inner diameter of the stator, and less than or equal to the outer diameter of the annular wall.

12. The liquid-cooled heat dissipation module according to claim 1, characterized in that: The shell has a plurality of spacing bars located in the first chamber and the second chamber, and a flow channel is formed between any two adjacent spacing bars.

13. The liquid-cooled heat dissipation module according to claim 12, characterized in that: The plurality of spacer bars do not extend to the periphery of the first chamber and the second chamber located at the communicating port.

14. The liquid-cooled heat dissipation module according to claim 1, characterized in that: The stator and the impeller are arranged on the same side of the partition plate.

15. The liquid-cooled heat dissipation module according to any one of claims 1 to 14, characterized in that: The shell is formed with the first chamber and the second chamber by etching process.

16. The liquid-cooled heat dissipation module according to any one of claims 1 to 14, characterized in that: The working fluid is a non-conductive fluid.

17. An electronic device, characterized in that: include: a housing; an electrical module located in the housing and having a heat generating area; and A liquid-cooled heat dissipation module as claimed in any one of claims 1 to 16 is arranged in the housing, and a heat absorption area of ​​the housing corresponding to the first chamber or the second chamber is thermally connected to the heat generation area.

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