Camera modules and electronic equipment

Abstract

The present application discloses a camera module and an electronic device, wherein the camera module includes an optical component, a photosensitive component, and a lens base that holds the optical component on the light path of the photosensitive component, the photosensitive component includes a circuit board and a photosensitive chip that is conductively connected to the circuit board, the lens base is arranged on the circuit board, thereby forming a cavity between the optical component, the lens base and the circuit board, the photosensitive chip is located in the cavity, and the camera module also includes a first heat dissipation structure, the first heat dissipation structure is attached to the surface of the lens base, and the first heat dissipation structure extends from the inner surface of the lens base to the outer surface of the lens base to diffuse the heat in the cavity to the outside of the cavity. The present application improves the heat dissipation performance of the miniaturized camera module, is conducive to extending the life of the camera module, and reduces the poor imaging problem caused by excessive internal temperature.

Description

Technical Field

[0001] The present application relates to the technical field of optical devices, and in particular to camera modules and electronic devices. Background Art

[0002] With the popularization of mobile terminal devices, the related technologies of camera modules used in mobile terminal devices have been rapidly developed and improved. In recent years, camera modules have also been widely used in many fields such as medical treatment, security, industrial production, etc.

[0003] As a widely used mobile terminal device, mobile phones have become a must-have electronic product for everyone. Consumers have increasingly stringent requirements for mobile phone functions such as photo taking and video recording. This requires the image quality of camera modules to be continuously improved. However, the improvement in image quality is accompanied by an increase in the power consumption of camera modules, which also leads to the gradual emergence of the heat dissipation problem of camera modules.

[0004] At the same time, the heat dissipation problem of mobile phones is becoming more and more serious. The development of mobile phone camera module chips and their strong image processing capabilities have led to increased chip power consumption and heat generation, resulting in local high temperatures in the module. Most mobile phones have frequency reduction or power-off protection when local high temperatures occur, which will cause a significant decrease in the performance of the phone or affect the service life of the phone.

[0005] Figure 1 A cross-sectional schematic diagram of an existing camera module is shown, in which a circuit board 1A, a lens holder 2A and a filter 3A form a closed cavity, and a photosensitive chip 4A is located in the cavity. The heat generated by the photosensitive chip 4A is mainly diffused to the outside of the cavity through the circuit board 1A in contact with it, but its heat dissipation efficiency is far from meeting the existing needs. As the temperature in the cavity increases, the performance of the electronic devices in the cavity will be seriously affected.

[0006] Figure 2 The schematic cross-sectional view of an existing improved camera module is shown. In the figure, a through hole 11B for setting a photosensitive chip 4B is formed in the middle of the circuit board 1B. A metal sheet 5B for heat dissipation is set below the circuit board 1B. The photosensitive chip 4B is set in the through hole 11B. The photosensitive chip 4B is attached to the surface of the metal sheet 5B by glue. The lens holder 2B is set on the circuit board 1B. The filter 3B is held above the photosensitive chip 4B by the lens holder 2B. A closed cavity is formed between the circuit board 1B, the lens holder 2B, the filter 3B and the photosensitive chip 4B. However, in Figure 2 In the camera module shown, the heat generated by the photosensitive chip 4B needs to be diffused through the glue and the metal sheet 5B. Due to the low thermal conductivity of the glue, the heat dissipation efficiency of the structure is still difficult to meet the requirements.

[0007] At present, the temperature control of the camera module has become one of the most critical challenges in the design. How to improve the heat dissipation efficiency of the camera module under the conditions of compact architecture and small operating space is a problem that needs to be solved urgently. Summary of the invention

[0008] One object of the present application is to provide a camera module with high heat dissipation efficiency and an electronic device having the camera module.

[0009] In order to achieve the above objectives, the technical solution adopted in this application is:

[0010] A camera module includes an optical component, a photosensitive component and a lens base that holds the optical component on a light input path of the photosensitive component, the photosensitive component includes a circuit board and a photosensitive chip conductively connected to the circuit board, the lens base is arranged on the circuit board, so as to form a cavity between the optical component, the lens base and the circuit board, the photosensitive chip is located in the cavity, and the camera module also includes a first heat dissipation structure, the first heat dissipation structure is attached to the surface of the lens base, and the first heat dissipation structure extends from the inner surface of the lens base to the outer surface of the lens base, so as to diffuse the heat in the cavity to the outside of the cavity.

[0011] Furthermore, the camera module also includes a second heat dissipation structure, which is in contact with a side of the photosensitive component away from the cavity, so as to diffuse the heat of the photosensitive component out of the cavity.

[0012] Preferably, the first heat dissipation structure is a thermally conductive film, the thermal conductivity of the thermally conductive film along the length and width directions is greater than the thermal conductivity of the thermally conductive film along the thickness direction. Preferably, the thermally conductive film is a graphene thermally conductive film, and the thickness of the thermally conductive film is 50 to 100 μm.

[0013] As another preference, the first heat dissipation structure is a thermal conductive coating. Preferably, the thermal conductive coating is a graphene thermal conductive coating, and the thickness of the thermal conductive coating is 17-30 μm.

[0014] Furthermore, the lens base includes a cylindrical base side wall, the base side wall is arranged on the circuit board, and the first heat dissipation structure extends from the inner surface of the base side wall through the bottom surface of the base side wall to the outer surface of the base side wall.

[0015] Furthermore, the lens base also includes a lens supporting portion located at the upper end of the base side wall and a filter element supporting portion extending inward from the lens supporting portion, the filter element supporting portion defines a light through hole, the optical component includes a lens and a filter element, the lens is arranged on the upper end surface of the lens supporting portion, the filter element is arranged on the upper end surface of the filter element supporting portion, the first heat dissipation structure also extends from the inner surface of the base side wall to the lower end surface of the lens supporting portion, preferably, the first heat dissipation structure also extends from the inner surface of the lens supporting portion to the lower end surface of the filter element supporting portion.

[0016] Furthermore, a groove is provided on the bottom surface of the base side wall, and the groove connects the inner surface and the outer surface of the base side wall. The first heat dissipation structure extends from the inner surface of the base side wall to the outer surface of the base side wall through the groove. Preferably, the base side wall has a plurality of the grooves distributed around its bottom surface.

[0017] Preferably, the photosensitive chip is arranged on the circuit board, and the second heat dissipation structure is arranged on a side of the circuit board away from the cavity.

[0018] Furthermore, the circuit board has a plurality of first heat dissipation through holes, one end of the first heat dissipation through hole is opposite to the bottom surface of the photosensitive chip, and the other end of the first heat dissipation through hole is opposite to the second heat dissipation structure, and the first heat dissipation through hole is filled with thermal conductive material, preferably, the thermal conductive material is thermal conductive silicone grease.

[0019] Furthermore, the second heat dissipation structure includes a heat dissipation plate and a heat dissipation film, the heat dissipation plate is arranged on a side of the circuit board away from the cavity, the heat dissipation film is attached to the outer surface of the heat dissipation plate, and extends from the outer surface of the heat dissipation plate through the outer side surface of the photosensitive component to the outer surface of the lens base. Preferably, the heat dissipation film is in contact with the first heat dissipation structure.

[0020] As another preferred embodiment, the circuit board has a chip through-hole, the photosensitive chip is arranged in the chip through-hole, the second heat dissipation structure is arranged on the circuit board and the side of the photosensitive chip away from the cavity, and the second heat dissipation structure supports the photosensitive chip in the chip through-hole.

[0021] Furthermore, the second heat dissipation structure includes a heat dissipation plate and a heat dissipation film, the heat dissipation plate is arranged on a side of the circuit board and the photosensitive chip away from the cavity, the heat dissipation plate is used to support the circuit board and the photosensitive chip, the heat dissipation film is attached to the outer surface of the heat dissipation plate, and extends from the outer surface of the heat dissipation plate through the outer side surface of the photosensitive component to the outer surface of the lens base. Preferably, the heat dissipation film is in contact with the first heat dissipation structure.

[0022] Furthermore, the heat sink has a plurality of second heat dissipation holes, one end of the second heat dissipation hole is opposite to the bottom surface of the photosensitive chip, and the other end of the second heat dissipation hole is opposite to the heat dissipation film, and the second heat dissipation hole is filled with thermal conductive material, preferably, the thermal conductive material is thermal conductive silicone grease.

[0023] Furthermore, the heat conductivity of the heat dissipation film along the length and width directions is greater than that in the thickness direction. Preferably, the heat dissipation film is a graphene thermal conductive film, the thickness of the heat dissipation film is 50-100 μm, and the thickness of the heat dissipation plate is 80-150 μm.

[0024] Furthermore, the camera module also includes a motor housing arranged around the optical component, the first heat dissipation structure extends upward from the outer surface of the lens base to the outer surface of the motor housing, and / or the heat dissipation film extends upward from the outer surface of the lens base to the outer surface of the motor housing.

[0025] Furthermore, the camera module also includes a third heat dissipation structure, which is attached to the surface of the circuit board and extends from inside the cavity to outside the cavity along the upper end surface of the circuit board, so as to diffuse the heat in the cavity to outside the cavity. Preferably, the third heat dissipation structure is in contact with the photosensitive chip.

[0026] Further, the third heat dissipation structure is connected to the first heat dissipation structure located on the inner surface of the lens base, and extends together with the first heat dissipation structure to the outer surface of the lens base; or, the third heat dissipation structure extends to the outer surface of the lens base and is connected to the first heat dissipation structure located on the outer surface of the lens base; or, the third heat dissipation structure extends along the upper end surface of the circuit board through the bottom surface of the lens base to the outer surface of the lens base.

[0027] Furthermore, the third heat dissipation structure is a thermally conductive film, the thermal conductivity of the thermally conductive film along the length and width directions is greater than the thermal conductivity of the thermally conductive film in the thickness direction, and the thickness of the thermally conductive film is 50 to 100 μm; or, the third heat dissipation structure is a thermally conductive coating, and the thickness of the thermally conductive coating is 17 to 30 μm.

[0028] Furthermore, the camera module also includes a motor housing arranged around the outside of the optical component, and the third heat dissipation structure extends upward from the outer surface of the lens base to the outer surface of the motor housing.

[0029] The present application also provides an electronic device having the aforementioned camera module.

[0030] Compared with the prior art, the beneficial effects of the present application are: improving the heat dissipation performance of the miniaturized camera module, improving the heat dissipation efficiency of the camera module, which is beneficial to extending the life of the camera module and reducing the poor imaging problem caused by excessive internal temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 The figure is a cross-sectional schematic diagram of an existing camera module.

[0032] Figure 2 It is a cross-sectional schematic diagram of another existing camera module.

[0033] Figure 3 This is a cross-sectional schematic diagram of the first embodiment of the camera module of the present application.

[0034] Figure 4 It is a cross-sectional schematic diagram of the second embodiment of the camera module of the present application.

[0035] Figure 5 It is a cross-sectional schematic diagram of the third embodiment of the camera module of the present application.

[0036] Figure 6 This is a cross-sectional schematic diagram of the fourth embodiment of the camera module of the present application.

[0037] Figure 7 A schematic diagram of an embodiment of a lens mount of a camera module of the present application.

[0038] Figure 8 This is a partial schematic diagram of an embodiment of the camera module of the present application, showing a circuit board and a second heat dissipation structure.

[0039] Fig. 9 A partial schematic diagram of an embodiment of the camera module of the present application, showing a heat sink.

[0040] Fig.10 This is a schematic diagram of the fifth embodiment of the camera module of the present application.

[0041] Fig.11 This is a schematic diagram of the sixth embodiment of the camera module of the present application.

[0042] In the figure: 1. optical component; 11. lens; 12. filter element; 2. photosensitive component; 21. circuit board; 211. first heat dissipation hole; 212. chip hole; 22. photosensitive chip; 3. lens base; 31. base side wall; 311. groove; 32. lens support; 33. filter element support; 330. light through hole; 4. first heat dissipation structure; 5. second heat dissipation structure; 51. heat sink; 511. second heat dissipation hole; 52. heat dissipation film; 6. third heat dissipation structure; 7. FPC soft board; 80. cavity; 9. motor housing. DETAILED DESCRIPTION

[0043] Below, the present application is further described in conjunction with specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0044] In the description of the present application, it should be noted that directional words, such as the terms "center", "lateral", "longitudinal", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating directions and positional relationships are based on the directions or positional relationships shown in the accompanying drawings, which are only for the convenience of narrating the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and cannot be understood as limiting the specific scope of protection of the present application.

[0045] It should be noted that the terms "first", "second", etc. in the description and claims of the present application are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0046] The terms "including" and "having" and any variations thereof in the specification and claims of this application are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus comprising a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products or apparatuses.

[0047] like Figure 3-6 As shown in Figures 10 and 11, the present application provides a camera module, including an optical component 1, a photosensitive component 2 and a lens base 3, and the lens base 3 holds the optical component 1 on the light input path of the photosensitive component 2.

[0048] The optical component 1 is used to converge incident light so that the incident light forms an image on the photosensitive component 2.

[0049] The photosensitive component 2 includes a circuit board 21 and a photosensitive chip 22 conductively connected to the circuit board 21. The photosensitive chip 22 is used to perform photoelectric conversion, and the light signal passing through the optical component 1 is converted into an electrical signal by the photosensitive chip 22, and the electrical signal of the photosensitive chip 22 is suitable for inputting the circuit board 21. The circuit board 21 can be implemented as a PCB board, a ceramic substrate, etc., which is not limited in this application.

[0050] The lens base 3 is disposed on the circuit board 21, and the optical component 1 is disposed on the lens base 3, so that the lens base 3 holds the optical component 1 on the light-incoming path of the photosensitive chip 22. It can be understood that the light-incoming path of the photosensitive component 2 is also the light-incoming path of the photosensitive chip 22.

[0051] A cavity 80 is formed between the optical component 1, the lens base 3 and the circuit board 21. The photosensitive chip 22 is located in the cavity 80. The bottom of the optical component 1 faces the cavity 80, the upper end surface of the circuit board 21 faces the cavity 80, and the inner surface of the lens base 3 faces the cavity 80.

[0052] When the photosensitive chip 22 is working, a large amount of heat will be generated in the cavity 80. If the heat in the cavity 80 cannot be effectively diffused, the temperature of the photosensitive component 2 will rise and affect the normal operation of the electronic devices therein. In order to solve the heat dissipation problem of the cavity 80, the camera module also includes a first heat dissipation structure 4, which is attached to the surface of the lens base 3, and the first heat dissipation structure 4 extends from the inner surface of the lens base 3 to the outer surface of the lens base 3, so that the heat in the cavity 80 is diffused to the outside of the cavity 80 through the first heat dissipation structure 4. The heat dissipation of the photosensitive component 2 by the first heat dissipation structure 4 is mainly indirect heat dissipation. The heat generated by the photosensitive component 2 enters the cavity 80, and the heat in the cavity 80 is transferred to the first heat dissipation structure 4 provided on the inner surface of the lens base 3, and diffused to the outside of the cavity 80 along the first heat dissipation structure 4.

[0053] It is worth mentioning that opening heat dissipation holes on the side wall of the lens base 3 is also a technical solution (referred to as Solution B) for achieving heat dissipation of the cavity 80. However, compared with the aforementioned technical solution (referred to as Solution A) of attaching the first heat dissipation structure 4 to the surface of the lens base 3: in Solution A, there is no need to modify the original structure of the lens base 3, which is conducive to reducing production costs and will not have an adverse effect on the strength of the lens base 3; the surface area of ​​the lens base 3 is much larger than the area of ​​the heat dissipation holes opened in its thickness direction, and the first heat dissipation structure 4 in Solution A can cover the entire inner and outer surfaces of the lens base 3, with high heat dissipation efficiency, while in Solution B, too many heat dissipation holes cannot be set, and the cross-section of the heat dissipation holes should not be too large, which greatly limits its heat dissipation efficiency.

[0054] The camera module also includes a second heat dissipation structure 5, which is in contact with the side of the photosensitive component 2 away from the cavity 80, so that the heat of the photosensitive component 2 can also be diffused to the outside of the cavity 80 through the second heat dissipation structure 5. The photosensitive component 2 is the main heat source and is also a component that is greatly affected by temperature. Directly dissipating the heat of the photosensitive component 2 through the second heat dissipation structure 5 can reduce the heat diffused into the cavity 80 on the one hand, and can also dissipate the heat and cool the photosensitive component 2 in a timely and rapid manner on the other hand.

[0055] The present application combines indirect heat dissipation and direct heat dissipation, which greatly improves the heat dissipation efficiency of the photosensitive component 2 in the camera module, and helps to reduce the problem of poor shooting performance of the camera module due to excessive temperature.

[0056] In some embodiments, the first heat dissipation structure 4 is a heat conductive film, and the heat conductivity of the first heat dissipation structure 4 along the length and width directions is greater than the heat conductivity along the thickness direction. Preferably, the thickness of the heat conductive film is 50-100 μm.

[0057] The first heat dissipation structure 4 is a heat-conducting film, which has little effect on the volume and weight of the camera module, and basically does not produce particulate matter that affects the imaging quality. The first heat dissipation structure 4 can be attached to the lens base 3 by adhesives such as glue. The first heat dissipation structure 4 has strong thermal conductivity along the length and width directions, which is conducive to the rapid diffusion of heat from the inner surface of the lens base 3 to the outer surface along the first heat dissipation structure 4. It can be understood by those skilled in the art that the anisotropy of the thermal conductivity of the thermally conductive film is caused by its unique grain orientation. It can dissipate heat evenly along the length and width directions, and has a heat-insulating effect in the thickness direction. Specifically, the chemical composition of the thermally conductive film is mainly carbon. A graphitized thermally conductive film can be obtained by chemical methods under high temperature and high pressure. The film has excellent electrical and thermal conductivity like metal materials, and also has plasticity like plastic. In some embodiments, the thermally conductive film is a graphene thermally conductive film.

[0058] In other embodiments, the first heat dissipation structure 4 is a thermal conductive coating, that is, a thermal conductive material is applied to the surface of the lens base 3 to form the first heat dissipation structure 4. Specifically, the thermal conductive coating is a graphene thermal conductive coating, which has a good heat dissipation effect. It is worth mentioning that the method of applying the thermal conductive material can be but is not limited to spraying. The process of applying the thermal conductive coating on the lens base 3 is simpler and easier to operate than the process of attaching the thermal conductive film to the lens base 3. Preferably, the thickness of the thermal conductive coating is 17 to 30 μm.

[0059] In the present application, when the first heat dissipation structure 4 extends from the inner surface of the lens base 3 to the outer surface of the lens base 3, it can extend from the inner surface to the outer surface via the top surface of the lens base 3, or from the inner surface to the outer surface via the bottom surface of the lens base 3. Considering that the top surface structure of the lens base 3 is more complex than the bottom surface structure, it is preferred that the first heat dissipation structure 4 extends from the inner surface to the outer surface via the bottom surface of the lens base 3.

[0060] Specifically, the lens base 3 includes a cylindrical base side wall 31, a lens support portion 32 located at the upper end of the base side wall 31, and a filter element support portion 33 extending inward from the lens support portion 32. The base side wall 31 is disposed on the circuit board 21, and the filter element support portion 33 defines a light through hole 330. The optical component 1 includes a lens 11 and a filter element 12. The lens 11 is disposed on the upper end surface of the lens support portion 32, and the filter element 12 is disposed on the upper end surface of the filter element support portion 33. The inner surface of the base side wall 31, the lower end surface of the lens support portion 32, the lower end surface of the filter element support portion 33, and the bottom surface of the filter element 12 face the cavity 80.

[0061] The first heat dissipation structure 4 extends from the inner surface of the base side wall 31 through the bottom surface of the base side wall 31 to the outer surface of the base side wall 31. Preferably, the first heat dissipation structure 4 also extends from the inner surface of the base side wall 31 to the lower end surface of the lens supporting portion 32. More preferably, the first heat dissipation structure 4 also extends from the inner surface of the lens supporting portion 32 to the lower end surface of the filter element supporting portion 33.

[0062] When the first heat dissipation structure 4 extends through the bottom surface of the lens base 3, the installation flatness of the lens base 3 may be affected. In order to solve this problem, in some preferred embodiments, a groove 311 is provided on the bottom surface of the base side wall 31, and the groove 311 connects the inner surface and the outer surface of the base side wall 31. Figure 7 As shown, the first heat dissipation structure 4 extends from the inner surface of the base side wall 31 to the outer surface of the base side wall 31 through the groove 311. The provision of the groove 311 can not only solve the problem of the installation flatness of the lens base 3, but also avoid the increase in the height of the lens base 3 due to the addition of the first heat dissipation structure 4.

[0063] When the first heat dissipation structure 4 is a thermal conductive coating, the coating is sprayed on the inner surface, outer surface and inner surface of the groove 311 of the base side wall 31, and the heat in the cavity 80 contacts the thermal conductive coating on the inner surface of the base side wall 31. The thermal conductive coating transfers the heat to the outside of the cavity 80 and contacts the external air, thereby achieving the purpose of heat dissipation.

[0064] In some preferred embodiments, the base sidewall 31 has a plurality of grooves 311 distributed around its bottom surface, and the first heat dissipation structure 4 arranged around the inner surface of the base sidewall 31 extends to the outer surface of the base sidewall 31 through the plurality of grooves 311 .

[0065] In some preferred embodiments, Figure 5 , 6As shown in FIGS. 10 and 11, the second heat dissipation structure 5 includes a heat dissipation plate 51 and a heat dissipation film 52. The heat dissipation plate 51 contacts the side of the photosensitive component 2 away from the cavity 80. The heat dissipation film 52 is attached to the outer surface of the heat dissipation plate 51. The heat dissipation film 52 extends from the outer surface of the heat dissipation plate 51 to the outer surface of the lens base 3 and contacts the first heat dissipation structure 4. The heat of the photosensitive component 2 first diffuses to the heat dissipation plate 51, and then diffuses to the heat dissipation film 52 through the heat dissipation plate 51. The heat is diffused to the outside of the cavity 80 through the heat dissipation film 52. Contacting the heat dissipation film 52 with the first heat dissipation structure 4 is conducive to improving the heat dissipation efficiency.

[0066] It is worth mentioning that Figure 8 As shown (the photosensitive chip 22 is not shown), one of the four sides of the circuit board 21 is a side L 1 The FPC soft board 7 needs to be connected, so the heat dissipation film 52 passes through the other three sides L of the circuit board 21 2 , L 3 , L 4 The heat dissipation film 52 and the first heat dissipation structure 4 may be in contact with each other in the following manners: the heat dissipation film 52 covers the first heat dissipation structure 4, or the first heat dissipation structure 4 covers the heat dissipation film 52, and the first heat dissipation structure 4 and the heat dissipation film 52 may be connected by an adhesive.

[0067] Specifically, the material of the heat sink 51 is a metal material with excellent thermal conductivity, and the thickness of the heat sink 51 is preferably 80-150 μm. Preferably, the heat conductivity of the heat sink film 52 along the length and width directions is greater than the heat conductivity of the heat sink film 52 along the thickness direction. The material of the heat sink film 52 can be the same as the aforementioned thermal conductive film of the present application, and its thickness is preferably 50-100 μm.

[0068] Furthermore, if Figure 6 , 9 As shown in FIGS. 10 and 11 , the heat dissipation plate 51 has a plurality of second heat dissipation through holes 511, one end of the second heat dissipation through hole 511 is opposite to the photosensitive component 2, and the other end is opposite to the heat dissipation film 52. The second heat dissipation through hole 511 is filled with a thermal conductive material, and the heat of the photosensitive component 2 can be quickly transferred to the heat dissipation film 52 through the thermal conductive material in the second heat dissipation through hole 511, and then the heat is diffused out through the heat dissipation film 52. The thermal conductive material filled in the second heat dissipation through hole 511 can be, but is not limited to, thermal conductive silicone grease.

[0069] In some embodiments, Fig.10As shown, the camera module also includes a third heat dissipation structure 6, which is attached to the upper end surface of the circuit board 21 and extends from the cavity 80 to the outside of the cavity 80 along the upper end surface of the circuit board 21, so that the heat in the cavity 80 can be diffused to the outside of the cavity 80 through the third heat dissipation structure 6. Specifically, the third heat dissipation structure 6 can be first connected to the first heat dissipation structure 4 on the inner surface of the lens base 3, and then extend to the outer surface of the lens base 3 together with the first heat dissipation structure 4; or, the third heat dissipation structure 6 can also be extended to the outer surface of the lens base 3 and then connected to the first heat dissipation structure 4; or, the third heat dissipation structure 6 can also be extended to the outer surface of the lens base 3 alone. The third heat dissipation structure 6 can be a thermally conductive film or a thermally conductive coating. The thermally conductive film or the thermally conductive coating can refer to the description of the thermally conductive film and the thermally conductive coating in the previous text of this application, which will not be repeated here. The third heat dissipation structure 6 and the first heat dissipation structure 4 can have the same or different forms.

[0070] Furthermore, the third heat dissipation structure 6 is in contact with the photosensitive chip 22 , so that the third heat dissipation structure 6 can directly dissipate the heat for the photosensitive chip 22 .

[0071] In such Figure 3 In the embodiment shown, the photosensitive chip 22 is arranged on the circuit board 21, and the second heat dissipation structure 5 is arranged on the side of the circuit board 21 away from the cavity 80. In this embodiment, the second heat dissipation structure 5 is in direct contact with the circuit board 21 of the photosensitive component 2, and the heat of the circuit board 21 can be directly diffused to the outside of the cavity 80. The second heat dissipation structure 5 is not in direct contact with the photosensitive chip 22, and the heat of the photosensitive chip 22 needs to be transferred to the circuit board 21 first, and then diffused to the outside of the cavity 80 through the second heat dissipation structure 5. It can be understood that Figure 3 The second heat dissipation structure 5 may include only the heat dissipation plate 51, or may include the heat dissipation plate 51 and the heat dissipation film 52, which is not limited in the present application.

[0072] exist Figure 4 In the illustrated embodiment, the photosensitive chip 22 is disposed on the circuit board 21, and the second heat dissipation structure 5 is disposed on the side of the circuit board 21 away from the cavity 80. The circuit board 21 has a plurality of first heat dissipation holes 211, one end of the first heat dissipation hole 211 is opposite to the bottom surface of the photosensitive chip 22, and the other end is opposite to the second heat dissipation structure 5. The first heat dissipation hole 211 is filled with a thermally conductive material, and the heat of the photosensitive chip 22 can be quickly transferred to the second heat dissipation structure 5 through the thermally conductive material in the first heat dissipation hole 211, and then the heat is diffused out through the second heat dissipation structure 5. The thermally conductive material can be a thermally conductive adhesive, which basically does not produce debris that affects the imaging of the camera module, and has a better heat dissipation effect. The thermally conductive adhesive can be but is not limited to thermally conductive silicone grease. It can be understood that, Figure 4 The second heat dissipation structure 5 may include only the heat dissipation plate 51, or may include the heat dissipation plate 51 and the heat dissipation film 52, which is not limited in the present application.

[0073] exist Figure 5 In the illustrated embodiment, the circuit board 21 has a chip through hole 212, the photosensitive chip 22 is disposed in the chip through hole 212, and the photosensitive chip 22 is conductively connected to the circuit board 21 through a wire (not shown in the figure). The second heat dissipation structure 5 is disposed on the side of the circuit board 21 and the photosensitive chip 22 away from the cavity 80, and the second heat dissipation structure 5 supports the photosensitive chip 22 in the chip through hole 212. The heat of the circuit board 21 and the photosensitive chip 22 can be directly diffused to the outside of the cavity 80 through the second heat dissipation structure 5. Specifically, the second heat dissipation structure 5 includes a heat dissipation plate 51 and a heat dissipation film 52, the heat dissipation plate 51 is disposed on the side of the circuit board 21 and the photosensitive chip 22 away from the cavity 80, the heat dissipation plate 51 is used to support the circuit board 21 and the photosensitive chip 22, the heat dissipation film 52 is attached to the outer surface of the heat dissipation plate 51, and the heat dissipation film 52 extends from the outer surface of the heat dissipation plate 51 to the outer surface of the lens base 3 and contacts the first heat dissipation structure 4. The heat of the circuit board 21 and the photosensitive chip 22 is diffused to the heat dissipation film 52 through the heat dissipation plate 51 , and then diffused to the outside of the cavity 80 through the heat dissipation film 52 .

[0074] exist Figure 6 In the illustrated embodiment, the circuit board 21 has a chip through hole 212, the photosensitive chip 22 is disposed in the chip through hole 212, and the photosensitive chip 22 is conductively connected to the circuit board 21 through a wire (not shown in the figure). The heat sink 51 is disposed on the side of the circuit board 21 and the photosensitive chip 22 away from the cavity 80, and the heat sink 51 is used to support the circuit board 21 and the photosensitive chip 22. The heat dissipation film 52 is attached to the outer surface of the heat sink 51, and the heat dissipation film 52 extends from the outer surface of the heat sink 51 to the outer surface of the lens base 3 and contacts the first heat dissipation structure 4. The heat sink 51 has a plurality of second heat dissipation through holes 511, one end of the second heat dissipation through hole 511 is opposite to the photosensitive chip 22, and the other end is opposite to the heat dissipation film 52. The second heat dissipation through hole 511 is filled with a heat conductive material, and the heat of the photosensitive chip 22 can be quickly transferred to the heat dissipation film 52 through the heat conductive material in the second heat dissipation through hole 511, and then the heat is diffused out through the heat dissipation film 52. In the actual production process, firstly, a heat sink 51 having a second heat dissipation through hole 511 is manufactured according to a preset size; then, the circuit board 21 is attached to the heat sink 51, and the photosensitive chip 22 is arranged in the chip through hole 212; then, a heat conductive material is filled in the second heat dissipation through hole 511; and finally, the heat dissipation film 52 is attached to the heat sink 51. In the present application, it is not necessary to pre-arrange a heat conductive member on the circuit board 21, which is conducive to simplifying the production process of the circuit board 21.

[0075] exist Fig.10In the illustrated embodiment, the photosensitive chip 22 is disposed in the chip through hole 212 of the circuit board 21, the photosensitive chip 21 and the circuit board 21 are supported by the heat sink 51, the third heat dissipation structure 6 extends inward through the heat sink 51 to contact the photosensitive chip 22, and the third heat dissipation structure 6 extends outward through the bottom surface of the base side wall 31 to the outer surface of the lens base 3. The third heat dissipation structure 6 can directly dissipate the heat of the photosensitive chip 22 on the one hand, and on the other hand, it is also conducive to quickly diffusing the heat in the cavity 80 to the outside of the cavity 80.

[0076] exist Fig.11 In the illustrated embodiment, the camera module further includes a motor housing 9, which is disposed around the outside of the lens 11. The first heat dissipation structure 4 and / or the heat dissipation film 52 extend upward to the outer surface of the motor housing 9 through the lens base 3, thereby increasing the heat dissipation area. Usually, the material of the motor housing is a metal material with excellent thermal conductivity, so the heat dissipation structure extends outside the motor housing to further improve the heat dissipation effect. In some embodiments, the third heat dissipation structure 6 may also extend to the outer surface of the motor housing 9.

[0077] In addition, the heat dissipation structures of the present application can not only extend to the motor housing 9, but also extend to the camera module and even other components of the mobile terminal to increase the heat dissipation area, and the present application does not limit this.

[0078] The above describes the basic principles, main features and advantages of the present application. Those skilled in the art should understand that the present application is not limited by the above embodiments, and the above embodiments and the specification only describe the principles of the present application. The present application may have various changes and improvements without departing from the spirit and scope of the present application, and these changes and improvements fall within the scope of the present application for which protection is sought. The scope of protection claimed by the present application is defined by the attached claims and their equivalents.

Claims

1. A camera module, comprising an optical component, a photosensitive component, and a lens base for holding the optical component on a light-incoming path of the photosensitive component, characterized in that: The photosensitive component includes a circuit board and a photosensitive chip conductively connected to the circuit board. The lens base is arranged on the circuit board, so as to form a cavity between the optical component, the lens base and the circuit board. The photosensitive chip is located in the cavity. The camera module also includes a first heat dissipation structure, which is attached to the surface of the lens base. The first heat dissipation structure is a thermally conductive film or a thermally conductive coating. The thickness of the thermally conductive film is 50 to 100 μm, and the thickness of the thermally conductive coating is 17 to 30 μm. The first heat dissipation structure extends from the inner surface of the lens base to the outer surface of the lens base to diffuse the heat in the cavity to the outside of the cavity. The thermal conductivity of the first heat dissipation structure along the length and width directions is greater than its thermal conductivity in the thickness direction.

2. The camera module according to claim 1, characterized in that: It also includes a second heat dissipation structure, which is in contact with a side of the photosensitive component away from the cavity, so as to diffuse the heat of the photosensitive component out of the cavity.

3. The camera module according to claim 1, characterized in that: The thermally conductive film is a graphene thermally conductive film.

4. The camera module according to claim 1, characterized in that: The thermal conductive coating is a graphene thermal conductive coating.

5. The camera module according to claim 1, characterized in that: The lens base includes a cylindrical base side wall, the base side wall is arranged on the circuit board, and the first heat dissipation structure extends from the inner surface of the base side wall through the bottom surface of the base side wall to the outer surface of the base side wall.

6. The camera module according to claim 4, characterized in that: The lens base also includes a lens support portion located at the upper end of the base side wall and a filter element support portion extending inward from the lens support portion, the filter element support portion defines a light through hole, the optical component includes a lens and a filter element, the lens is arranged on the upper end surface of the lens support portion, the filter element is arranged on the upper end surface of the filter element support portion, the first heat dissipation structure also extends from the inner surface of the base side wall to the lower end surface of the lens support portion, and the first heat dissipation structure also extends from the inner surface of the lens support portion to the lower end surface of the filter element support portion.

7. The camera module according to claim 4, characterized in that: A groove is provided on the bottom surface of the base side wall, and the groove connects the inner surface and the outer surface of the base side wall. The first heat dissipation structure extends from the inner surface of the base side wall to the outer surface of the base side wall through the groove. The base side wall has a plurality of grooves distributed around its bottom surface.

8. The camera module according to claim 2, characterized in that: The photosensitive chip is arranged on the circuit board, and the second heat dissipation structure is arranged on a side of the circuit board away from the cavity.

9. The camera module according to claim 8, characterized in that: The circuit board has a plurality of first heat dissipation through holes, one end of the first heat dissipation through hole is opposite to the bottom surface of the photosensitive chip, and the other end of the first heat dissipation through hole is opposite to the second heat dissipation structure, and the first heat dissipation through hole is filled with a thermal conductive material, and the thermal conductive material is thermal conductive silicone grease.

10. The camera module according to claim 8, characterized in that: The second heat dissipation structure includes a heat dissipation plate and a heat dissipation film. The heat dissipation plate is arranged on a side of the circuit board away from the cavity. The heat dissipation film is attached to the outer surface of the heat dissipation plate and extends from the outer surface of the heat dissipation plate to the outer surface of the lens base. The heat dissipation film is in contact with the first heat dissipation structure.

11. The camera module according to claim 2, characterized in that: The circuit board has a chip through hole, the photosensitive chip is arranged in the chip through hole, the second heat dissipation structure is arranged on the circuit board and the side of the photosensitive chip away from the cavity, and the second heat dissipation structure supports the photosensitive chip in the chip through hole.

12. The camera module according to claim 11, characterized in that: The second heat dissipation structure includes a heat dissipation plate and a heat dissipation film. The heat dissipation plate is arranged on a side of the circuit board and the photosensitive chip away from the cavity. The heat dissipation plate is used to support the circuit board and the photosensitive chip. The heat dissipation film is attached to the outer surface of the heat dissipation plate and extends from the outer surface of the heat dissipation plate to the outer surface of the lens base. The heat dissipation film is in contact with the first heat dissipation structure.

13. The camera module according to claim 12, characterized in that: The heat sink is provided with a plurality of second heat dissipation through holes, one end of the second heat dissipation through hole is opposite to the bottom surface of the photosensitive chip, and the other end of the second heat dissipation through hole is opposite to the heat dissipation film, and the second heat dissipation through hole is filled with a thermal conductive material, and the thermal conductive material is thermal conductive silicone grease.

14. The camera module according to claim 10, 12 or 13, characterized in that: The heat conductivity of the heat dissipation film along the length and width directions is greater than that in the thickness direction. The heat dissipation film is a graphene thermal conductive film. The thickness of the heat dissipation film is 50-100 μm, and the thickness of the heat dissipation plate is 80-150 μm.

15. The camera module according to claim 10, 12 or 13, characterized in that: The camera module also includes a motor housing arranged around the optical component, the first heat dissipation structure extends upward from the outer surface of the lens base to the outer surface of the motor housing, and / or the heat dissipation film extends upward from the outer surface of the lens base to the outer surface of the motor housing.

16. The camera module according to any one of claims 1 to 15, characterized in that: It also includes a third heat dissipation structure, which is attached to the upper end surface of the circuit board and extends along the upper end surface of the circuit board from inside the cavity to outside the cavity, so as to diffuse the heat in the cavity to outside the cavity, and the third heat dissipation structure is in contact with the photosensitive chip.

17. The camera module according to claim 16, characterized in that: The third heat dissipation structure is connected to the first heat dissipation structure located on the inner surface of the lens base, and extends together with the first heat dissipation structure to the outer surface of the lens base; Alternatively, the third heat dissipation structure extends to the outer surface of the lens base and is connected to the first heat dissipation structure located on the outer surface of the lens base; Alternatively, the third heat dissipation structure extends along the upper end surface of the circuit board through the bottom surface of the lens base to the outer surface of the lens base.

18. The camera module according to claim 16, characterized in that: The third heat dissipation structure is a heat-conducting film, the heat-conducting capacity of the heat-conducting film along the length and width directions is greater than the heat-conducting capacity of the heat-conducting film along the thickness direction, and the thickness of the heat-conducting film is 50-100 μm; Alternatively, the third heat dissipation structure is a thermal conductive coating, and the thickness of the thermal conductive coating is 17-30 μm.

19. The camera module according to any one of claims 16 to 18, characterized in that: The camera module also includes a motor housing arranged around the outside of the optical component, and the third heat dissipation structure extends upward from the outer surface of the lens base to the outer surface of the motor housing.

20. An electronic device, characterized in that: Comprising the camera module described in any one of claims 1-19.

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