Sensor device

Abstract

The present application provides a sensor device, comprising: a housing and a sensing component; the sensing component comprises a circuit substrate, at least one sensing element and a sleeve; the sensor device also has an inner cavity and a channel; the inner cavity and the channel are respectively located on different sides of the thickness direction of the circuit substrate; the sleeve has a barrel wall; the end of the barrel wall along the axial direction of the channel is sealed and connected to the circuit substrate; the barrel wall of the sleeve is located at the periphery of the channel; the housing has a matching portion, and the matching portion has a receiving portion; the sleeve is at least partially accommodated in the receiving portion; the matching portion comprises a first peripheral wall portion forming the receiving portion; the first peripheral wall portion is sealed and connected to the outer peripheral side of the barrel wall of the sleeve; the inner cavity is not connected to the channel. The sealing performance between the inner cavity and the flow channel of the sensor device provided by the present application is good.

Description

Technical Field

[0001] The present application relates to the technical field of signal sensing, and in particular to a sensor device. Background Art

[0002] Sensors in related technologies, such as Figure 1 As described, it includes a bottom shell 1, an upper shell 8, a ceramic base 4, a through hole 15 is opened in the ceramic base 4, a back pressure chip 10 is bonded to the surface of the ceramic base 4 by an adhesive 13, and a flow channel 6 is used to guide the fluid to reach the through hole 15, and then reach the back pressure cavity of the back pressure chip 10. The bottom shell 1 has a groove, and a sealing ring 3 is arranged in the groove. The ceramic base 4 is sealed by the sealing ring 3 to prevent the fluid from the bottom from leaking into the inner cavity of the upper part of the ceramic base 4. However, in practice, especially for high temperature and high pressure fluids, the sealing ring is prone to deformation and failure, and the fluid in the flow channel is at risk of leaking into the inner cavity. Summary of the invention

[0003] The purpose of the present application is to provide a sensor device with good sealing performance.

[0004] The present application provides a sensor device, comprising: a housing and a sensing component; the sensing component comprises a circuit substrate, at least one sensing element and a sleeve; the sensor device further comprises an inner cavity and a channel; the inner cavity and the channel are respectively located on different sides in the thickness direction of the circuit substrate;

[0005] The sleeve is located on one side of the circuit substrate in the thickness direction, and the sleeve has a tube wall; one end of the tube wall along the axial direction of the channel is sealed and connected to the circuit substrate; the tube wall of the sleeve is located at the periphery of the channel; the sensing element is electrically connected to the circuit substrate, and the sensing element can sense the pressure and / or temperature of the fluid in the channel;

[0006] The shell has a mating portion, and the mating portion and the sleeve are located on the same side of the thickness direction of the circuit substrate; the mating portion has a accommodating portion; the sleeve is at least partially accommodated in the accommodating portion; the mating portion includes a first circumferential wall portion forming the accommodating portion; the first circumferential wall portion is sealed and connected to the outer circumferential side of the barrel wall of the sleeve; the inner cavity is not connected to the channel.

[0007] In the sensor device provided in the present application, the sleeve is at least partially accommodated in the accommodating portion, the end of the sleeve wall along the axial direction of the channel is sealed to the circuit substrate, and the outer peripheral side of the sleeve wall is sealed to the first peripheral wall portion of the mating portion, thereby improving the sealing between the inner cavity and the channel. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 It is a schematic diagram of a cross-sectional structure of a sensor device in the related art;

[0009] Figure 2 is a schematic diagram of the three-dimensional structure of the first embodiment of the sensor device of the present application;

[0010] Figure 3 Yes Figure 1 A schematic diagram of the three-dimensional structure of the sensor device from another angle;

[0011] Figure 4 Yes Figure 1 An exploded schematic diagram of the sensor device shown;

[0012] Figure 5 Yes Figure 1 Another exploded schematic diagram of the sensor device shown;

[0013] Figure 6 Yes Figure 1 A schematic cross-sectional view of the sensor device shown;

[0014] Figure 7 Yes Figure 1 A schematic three-dimensional cross-sectional view of the sensor device from another angle;

[0015] Figure 8 Yes Figure 1 A schematic diagram of a three-dimensional structure corresponding to an implementation method of a sensing component;

[0016] Fig. 9 Yes Figure 8 An exploded schematic diagram of the sensing assembly shown;

[0017] Fig.10 Yes Figure 1 A three-dimensional cross-sectional schematic diagram corresponding to another embodiment of the sensing component;

[0018] Fig.11 is a perspective cross-sectional schematic diagram of a second embodiment of the sensor device of the present application;

[0019] Fig.12 is a three-dimensional cross-sectional schematic diagram of a third embodiment of the sensor device of the present application;

[0020] Fig.13 Yes Fig.12 The schematic diagram of the exploded structure of some components of the sensor device shown;

[0021] Fig.14 is an exploded schematic diagram of a fourth embodiment of the sensor device of the present application;

[0022] Fig.15 Yes Fig.14 A schematic cross-sectional view of the sensor device;

[0023] Fig.16 Yes Fig.14 A schematic diagram of a three-dimensional structure corresponding to an implementation method of a sensing component;

[0024] Fig.17 It is a schematic diagram of a three-dimensional structure corresponding to an implementation mode of the valve assembly of the present application;

[0025] Fig.18 Yes Fig.17 A schematic cross-sectional view of a valve assembly is shown. DETAILED DESCRIPTION

[0026] The exemplary embodiments of the present application will be described in detail below in conjunction with the accompanying drawings. If there are several specific embodiments, the features of these embodiments can be combined with each other without conflict. When the description refers to the drawings, unless otherwise specified, the same numbers in different drawings represent the same or similar elements. The contents described in the following exemplary embodiments do not represent all embodiments consistent with the present application; on the contrary, they are merely examples of devices, products and / or methods that are consistent with some aspects of the present application and are recorded in the claims of the present application.

[0027] The terms used in this application are only for the purpose of describing specific embodiments, and are not intended to limit the scope of protection of this application. The singular forms "a", "said" or "the" used in the specification and claims of this application are also intended to include plural forms, unless the context clearly indicates other meanings.

[0028] It should be understood that the words used in the specification and claims of the present application, such as "first", "second" and similar words, do not indicate any order, quantity or importance, but are only used to distinguish the names of features. Similarly, words such as "one" or "one" do not indicate a quantitative limitation, but indicate the existence of at least one. Unless otherwise specified, words such as "front", "back", "left", "right", "upper", "lower" and similar words appearing in this application are only for the convenience of explanation and are not limited to a specific position or a spatial orientation. Words such as "include" or "comprise" are an open-ended expression, meaning that the elements appearing before "include" or "comprise" include the elements appearing after "include" or "comprise" and their equivalents, which does not exclude that the elements appearing before "include" or "comprise" may also include other elements. If "several" appears in this application, it means two or more.

[0029] like Figures 2 to 16 As shown, the present application provides a sensor device 100, which includes a housing 1 and a sensing component 2. At least part of the sensing component 2 is accommodated in the housing 1. The sensor device 100 also has an inner cavity 200 and a channel 231.

[0030] The sensing component 2 includes a circuit substrate 21, at least one sensing element 22, and a sleeve 23. The inner cavity 200 and the channel 231 are respectively located on different sides of the thickness direction of the circuit substrate 21. The circuit substrate 21 includes a first surface 211, a second surface 212, and a side surface 215. The first surface 211 and the second surface 212 are respectively located on different sides of the thickness direction of the circuit substrate 21, and the side surface 215 is located between the first surface 211 and the second surface 212. The first surface 211 can be Figure 8 The upper surface of the circuit substrate 21 shown in FIG. 1 and the second surface 212 may be Figure 8 The lower surface of the circuit substrate 21 shown in the figure. The inner cavity 200 is located on the side where the first surface 211 of the circuit substrate 21 is located, and the channel 231 is located on the side where the second surface 212 of the circuit substrate 21 is located. A plurality of circuit elements 213 may be provided at the first surface 211, that is, the plurality of circuit elements 213 are mostly distributed in the inner cavity 200. The circuit element 213 may be a common circuit component such as a resistor, a capacitor, an inductor, a conditioning chip, a processing chip, etc. The first surface 211 of the circuit substrate 21 may also be provided with a plurality of pads 214 for welding the circuit element 213 and for transmitting electrical signals to the outside world. In the related art, such as in the application scenario of automobile air conditioning, the sensor device 100 can be used to detect the temperature and / or pressure of the refrigerant in the automobile air conditioning system. Since the pressure of automobile air conditioning is relatively high, the pressure of its refrigerant generally reaches 500Psi, so it is more important to ensure the sealing of the internal space of the sensor assembly under a relatively high pressure, and it is particularly important to ensure that the circuit elements are avoided from contacting the fluid as much as possible. Accordingly, in order to ensure the normal operation of the circuit element 213, the inner cavity 200 is not connected to the channel 231 for fluid flow, which is beneficial for ensuring a better sealing performance of the entire sensor device 100.

[0031] The sleeve 23 is located on one side of the circuit substrate 21 in the thickness direction, and has a tube wall 232, which is located outside the channel 231. In some embodiments, the sleeve 23 is a hollow tube structure, and the hollow area of ​​the sleeve 23 forms the channel 231. Of course, in other embodiments, the channel 231 may also be formed by other components located in the sleeve 23.

[0032] The wall 232 of the sleeve 23 has two ends along the axial direction of the channel 231, namely, a first end 233, a second end 234 and a middle section 235 located between the first end 233 and the second end 234. Fig.11 The upper end of the cylinder wall 232 in the second end 234 is Fig.11The first end 233 is sealed and connected to the circuit substrate 21. In this way, when the fluid flows in the channel 231, the fluid is not easy to leak out from the position where the first end 233 of the tube wall 232 is sealed and connected to the circuit substrate 21, that is, it is not easy to leak from the channel 231 to the inner cavity 200.

[0033] The sensing element 22 is electrically connected to the circuit substrate 21. The sensing element 22 can sense the pressure and / or temperature of the fluid in the channel 231. In other words, the sensing element 22 can integrate the functions of temperature sensing and pressure sensing at the same time, and the sensing component 2 can have only one sensing element 22 to realize the sensing of temperature signals and pressure signals. Of course, the sensing element 22 can also be used only for sensing temperature, or only for sensing pressure. When the sensor device 100 has a need for temperature and pressure sensing, the sensing component 2 can be provided with two or more sensing elements 22, so that temperature sensing is realized by one sensing element 22, and pressure sensing is realized by another sensing element 22.

[0034] The housing 1 has a matching portion 11, and the matching portion 11 and the sleeve 23 are located on the same side in the thickness direction of the circuit substrate 21, that is, the matching portion 11 and the sleeve 23 are both located on the side where the second surface 212 of the circuit substrate 21 is located. The matching portion 11 has a receiving portion 111, and the receiving portion 111 can be a through-hole structure that penetrates the matching portion 11. This facilitates processing and manufacturing.

[0035] The sleeve 23 is at least partially received in the accommodating portion 111. The matching portion 11 includes a first peripheral wall portion 112 that forms the accommodating portion 111. The first peripheral wall portion 112 is sealed and connected to the outer peripheral side of the tube wall 232 of the sleeve 23. In this way, it is not easy for the fluid to enter between the tube wall 23 of the sleeve 23 and the first peripheral wall portion 112 of the matching portion 11, and accordingly, it is not easy for the fluid to flow into the inner cavity 200 at the upper portion of the circuit substrate 21.

[0036] refer to Figure 6 As shown in , there is a first sealing position A between the outer side of the barrel wall 23 of the sleeve 23 and the first peripheral wall portion 112 of the matching portion 11, and there is a second sealing position B between the first end 233 of the barrel wall 232 and the second surface 212 of the circuit substrate 21. Through the sealing of the above two key positions, the inner cavity 200 of the sensor device 100 and the channel 231 of the sleeve 23 can be disconnected. The sealing between the inner cavity 200 and the channel 231 is good. Compared with the solution of using a sealing ring to achieve sealing in the related art, the embodiment of the present application uses a connection relationship between different structural parts to achieve sealing, instead of using a sealing ring elastic sealing method, it is not easy to have the problem of sealing ring fatigue failure, and the sealing reliability is higher.

[0037] In some embodiments, the first end 233 of the barrel wall 231 along the axial direction of the channel 231 and the circuit substrate 21 can be sealed and fixed as an integral structure by one of soldering, laser welding, and bonding. The first peripheral wall portion 112 and the outer peripheral side of the barrel wall 232 are sealed and fixed as an integral structure by one of soldering, laser welding, bonding, and ultrasonic welding. During actual processing and manufacturing, the barrel wall 231 and the circuit substrate 21 can be sealed and fixed first. Then the assembly formed by the two is installed in the housing 1, and then the first peripheral wall portion 112 and the outer peripheral side of the barrel wall 232 are sealed, and the installation operation is simpler, which is convenient for processing and manufacturing.

[0038] In some embodiments, the circuit substrate 21 includes a ceramic substrate 24 and a metal bonding portion 25 that is coated on a portion of the surface area of ​​the ceramic substrate 24 through a copper coating process. The metal bonding portion 25 is at least partially located on the lower surface of the ceramic substrate 24. The substrate of the circuit substrate 21 can of course also be made of a common resin circuit board material, but the ceramic substrate 24 is more resistant to high temperatures and corrosion than ordinary resin circuit boards, and is therefore more conducive to a high temperature and high pressure fluid environment. The copper coating process is a process in which the idle space on the circuit substrate is used as a reference surface and then filled with solid copper. The copper coating process is a relatively mature technology in the field of circuit board manufacturing, and this application will not go into detail. The metal bonding portion 25 can form a metal pad 214 for connecting the circuit element 213 and transmitting signals to the outside world, and other circuit board structures with electrical and thermal conductivity.

[0039] The sleeve 23 is made of metal, and the barrel wall 232 of the sleeve 23 is sealed and connected to the metal joint 25 by soldering. The soldering process has low cost and good sealing effect, and is suitable for industrial production. The mating part 11 of the outer shell 1 is also made of metal, and accordingly, the first circumferential wall part 112 of the mating part 11 and the outer peripheral side of the barrel wall 232 are sealed and fixed by laser welding. Laser welding has a good sealing effect, and laser welding is more suitable for welding micro parts and parts with poor accessibility. Laser welding also has the characteristics of low heat input and small welding deformation. When manufacturing the sensor device 100, all components can be assembled first, and laser welding can be used as the last processing step, that is, in the Figure 6 The sealing between the matching part 11 and the cylinder wall 232 is achieved by laser welding at the first sealing position A, and the welding temperature is not easy to damage other components, and the welding process has little effect on the assembly deformation of other components.

[0040] In some embodiments, Figure 6 As shown, the housing 1 includes a first shell 12 and a second shell 13. The first shell 12 includes an outer cylinder 121, the matching portion 11 and a bent portion 122. The axial direction of the outer cylinder 121 (i.e. Figure 6One side (in the vertical direction) of the outer tube 121 is connected to the mating portion 11, and the other side is connected to the bent portion 122. The outer tube 121 is arranged around the circuit substrate 21. The bent portion 122 extends from the outer tube 121 to the axial centerline direction of the outer tube 121.

[0041] The second shell 13 has a main body 131 and an extension 132 , and the inner cavity 200 is located between the main body 131 and the circuit substrate 21 . The extension 132 is located at the outer periphery of the main body 131 , and presses against the circuit substrate 21 , and the bent portion 122 presses against the extension 132 .

[0042] The second shell 13 may be provided with a through hole 133, and the sensor device 100 may include a plurality of conductive members 40, and the conductive members 40 are at least partially received in the through hole 133. Figures 4 to 5 As shown, the conductive member 40 is a metal spring. The conductive member 40 includes a first end 41, a second end 42, and a middle portion 43 connected between the first end 41 and the second end 42. The first end 41 contacts the pad 214 formed on the first surface 211 of the circuit substrate 21, the middle portion 43 is received in the through hole 133 of the second shell 13, and the second end 42 extends upward from the middle portion 43 beyond the second shell 13. The first end 41 of the conductive member 40 is electrically connected to the circuit substrate 21, and the second end 42 of the conductive member 40 is used to electrically connect to the components outside the sensor device 100. For example, the second end 42 contacts the circuit board inside other valve components, that is, the signal sensed by the sensing element 22 can be transmitted to the circuit board of the valve component, which facilitates further control of the valve component. The aperture size of the through hole 133 located on the side of the second shell 13 close to the circuit substrate 21 is larger than the aperture size on the side away from the circuit substrate 21. In some embodiments, in the direction away from the circuit substrate 21 along the axial direction of the through hole 133, the through hole 133 is a tapered hole with a gradually decreasing aperture, and the conductive member 40 is a tapered spring adapted to the aperture of the through hole 133. That is, the conductive member 40 can be a tapered spring with a small top and a large bottom, and the conductive member 40 can be in a compressed state after being connected to other circuit boards, which is conducive to improving the stability of the connection between the conductive member 40 and the external circuit board. Of course, the second shell 13 can also be injection molded with the conductive member 40 as an injection molded insert.

[0043] The first shell 12 can be made of metal material. The purpose of using metal material is to facilitate the processing of flanging to form the bending portion 122, reduce the difficulty of molding, and at the same time, the use of metal material is also convenient for welding and fixing between the matching portion 11 of the first shell 12 and the barrel wall 232 of the sleeve 23. The first shell 11 is a metal part, which can also reduce the electromagnetic interference (EMI) of the outside world to the electronic components inside the sensor device 100. The second shell 13 can be made of plastic. This is conducive to reducing costs and reducing the weight of the sensor device 100. The second shell 13 is an insulating part, so that the first shell 12 and the conductive part 40 can be insulated and isolated.

[0044] In some embodiments, the first shell 12 can be a metal part made of aluminum or a metal part made of stainless steel. The metal part made of aluminum is lighter in weight, so when the sensor device 100 is used in an automotive thermal management system, it is beneficial to the lightweight design of the entire vehicle. The metal part made of stainless steel is slightly heavier than the metal part made of aluminum, but the metal part made of stainless steel has the advantage of being easy to weld. The first shell 12 made of metal can be manufactured by processes such as metal die casting (Die casting) or extrusion molding or metal powder injection molding (Metal Injection Molding, MIM). The second shell 13 is an insulating part made of plastic material, which can be manufactured by an injection molding process. The second shell 12 made of insulating material insulates the conductive part 40 from the first shell 12.

[0045] The specific assembly and molding process between the second shell 13, the sensing component 2 and the first shell 12 is as follows: the bending portion 122 first extends in the longitudinal direction while maintaining the same vertical state as the outer cylinder portion 121. When the sensing component 2 is installed in the internal space of the first shell 12, the extension portion 132 of the second shell 13 and the edge portion of the circuit substrate 21 are at least partially aligned in the longitudinal direction and connected, and then installed in the cylindrical space surrounded by the outer cylinder portion 121. At this time, the vertical bending portion 122 is pressed inward into a horizontal flange by the tooling. Therefore, the extension portion 132 of the second shell 13 and the circuit substrate 21 are clamped and positioned between the bending portion 122 and the matching portion 11, so that the second shell 13 can be installed stably relative to the first shell 12 without falling.

[0046] In some embodiments, Figure 6 As shown, the mating portion 11 includes a transverse wall 113 and a longitudinal wall 114 . The transverse wall 113 extends from the outer cylinder portion 121 along the axial direction of the vertical channel 231 . The longitudinal wall 114 is located on the side of the transverse wall 113 away from the inner cavity 200 and extends along the axial direction of the channel 231 .

[0047] refer to Figure 6 As shown, the mating portion 11 is provided with a groove 115, and the notch of the groove 115 is arranged toward the circuit substrate 21. The groove wall of the mating portion 11 forming the groove 115 can be formed by protruding from the transverse wall 113 toward the second surface 112 of the circuit substrate 21. Of course, the groove wall of the mating portion 11 forming the groove 115 can also be a part of the transverse wall 113, that is, the groove 115 is formed by being recessed from the transverse wall 113 toward the second surface 112 of the circuit substrate 21. Figure 6In the illustrated manner, the mating portion 11 further includes a plurality of protruding structures protruding from the lateral wall 113 toward the second surface 112 of the circuit substrate 21 toward the circuit substrate 21, and the second surface 112 of the circuit substrate 21 can be pressed against the above-mentioned protruding structures. The sensor device 100 further includes a buffer 5, and the buffer 5 is at least partially accommodated in the groove 115, and one side of the buffer 5 contacts the circuit substrate 21, and the other side contacts the groove bottom of the groove 115. The provision of the buffer 5 here can produce a buffering effect on the process of press-fitting the circuit substrate 21 to the mating portion 11, thereby reducing the risk of damaging the circuit substrate 21 due to hard contact between the second surface 212 of the circuit substrate 21 and the inner wall surface of the mating portion 11 facing the second surface 212 of the circuit substrate 21. Figure 6 In the illustrated embodiment, the buffer member 5 may be a sealing ring with a certain elasticity. The sealing ring used as the buffer member 5 can also play a double sealing role, thereby being more conducive to enhancing the sealing performance of the sensor device 100 .

[0048] Of course, the sensor device 100 may not be provided with the buffer 5, and reference may be made to Fig.11 As shown, some step structures can be provided at the transverse wall 113 to support the circuit substrate 21. Since the contact area between the circuit substrate 21 and the mating portion 11 is small, the risk of extrusion damage during the assembly process is also small. Figure 6 The structure is basically the same, and this application will not go into details.

[0049] like Figures 6 to 11 As shown, in some embodiments provided in the present application, the sensing element 22 has a back-pressure chip structure, and the sensing element 22 is at least partially located on the side of the circuit substrate 21 close to the inner cavity 200, that is, the sensing element 22 can be located on the side where the first surface 211 is located. The circuit substrate 21 is provided with a through hole 26, and the sensing element 22 has a sensing cavity 221, and the sensing cavity 221 is not connected to the inner cavity 200. The through hole 26 connects the sensing cavity 221 of the sensing element 22 with the channel 231. In other words, one end of the through hole 26 is connected to the channel 231, and the sensing element 22 is located at the other end of the through hole 26, and the sensing cavity 221 of the sensing element 22 is connected to the through hole 26. Reference Fig. 9 As described above, the sensing cavity 221 of the sensing element 22, the through hole 26 of the circuit substrate 21 and the channel 231 of the sleeve 23 can be distributed along the axis X in a straight line, which is beneficial to shorten the flow path of the fluid and facilitate product miniaturization.

[0050] refer to Fig.10As shown, the sensing element 22 and the circuit substrate 21 can be bonded and fixed by a sealant 27. That is, the bottom of the sensing element 22 and the substrate structure around the through hole 26 are sealed and bonded by the sealant 27, and the sensing cavity 221 is open on one side and closed on the other side, so that the sensing cavity 221 is connected with the through hole 26, but the sensing cavity 221 is not connected with the inner cavity 200. Of course, the sensing element 22 may not be fixed to the circuit substrate 21 by the sealant 27, and the sensing element 22 may be welded to the circuit substrate 21 by eutectic welding. This welding method makes the sealing performance of the sensing element 22 to the through hole 26 better, and the fluid is not easy to enter the inner cavity 200 from the through hole 26.

[0051] In one embodiment of the present application, the sensing element 22 is a back pressure temperature pressure chip, that is, the sensing element 22 is a back pressure pressure temperature sensor chip that integrates pressure and temperature at the same time, and the back pressure sensing element includes a glass substrate and a silicon wafer and other structures. The fluid enters the sensing cavity 221 from the bottom hole of the sensing element 22, and the front of the back pressure sensing element 22 does not contact the fluid. The surface of the sensing cavity 221 formed on the silicon wafer can be prepared by MEMS (Micro Electromechanical System, micro-electromechanical system) technology to form a pressure-sensitive area and a temperature-sensitive area. The chip size prepared by MEMS technology is small, and the corresponding product size is generally in the millimeter level, or even smaller. The sensing area can realize pressure detection through a piezoresistive Wheatstone bridge. When the circuit is connected, when there is no pressure acting on the film of the silicon wafer, the Wheatstone bridge is balanced and the output voltage is 0. When there is pressure acting on the film of the silicon wafer, the balance of the Wheatstone bridge is broken, and there is a voltage output. Therefore, the change of pressure can be reflected by the change of the electrical signal in the detection circuit, thereby realizing the pressure detection function. The temperature sensing area can realize temperature detection through a PN junction diode circuit. The use of the back-pressure temperature-pressure integrated sensing element 22 improves the integration level and helps to reduce the volume of the sensor device 100 .

[0052] In order to better transfer fluid heat and reduce the impact of temperature difference on temperature detection, refer to Fig.10 As shown, the metal bonding portion 25 includes a heat conducting sub-portion 251, and the heat conducting sub-portion 251 is located on a side of the ceramic substrate 24 close to the sleeve 23, and the heat conducting sub-portion 251 is opposite to at least a portion of the channel 231. The heat conducting sub-portion 251 is also a metal structure covered on the surface of the ceramic substrate 24 by a copper coating process. And / or, the circuit substrate 21 includes a second peripheral wall portion 261 forming a through hole 26, and at least a portion of the second peripheral wall portion 261 is made of metal. The through hole 26 can be similar to a via of a circuit board or is realized by using a via of a circuit board, and a copper plating process is used to make the second peripheral wall portion 261 corresponding to the through hole 26 also made of metal.

[0053] In this way, when the fluid flows in the channel 231, it is easier for the fluid to contact the heat conducting sub-portion 251 and the second peripheral wall portion 261 than the sensing cavity 221 of the sensing element 22. The heat conducting sub-portion 251 and the second peripheral wall portion 261 are both made of metal, which has good thermal conductivity, and accordingly, it is easier to transfer the temperature of the fluid to the sensing element 22. Thus, the detection of the temperature signal is more accurate.

[0054] like Fig.12 As shown, in another embodiment of the present application, the sensing component 2 includes two sensing elements 22, the two sensing elements 22 are respectively a back pressure type pressure sensing element 71 and a pin type temperature sensing element 72. The structure of the back pressure type pressure sensing element 71 can refer to Figure 6 As shown in the middle back pressure sensing element 22, the temperature sensing element 72 includes a temperature sensing portion 721 and a conductive pin 722. The temperature sensing portion 721 is located on the side of the circuit substrate 21 where the sleeve 23 is provided, that is, the temperature sensing portion 721 is closer to the channel 231 than the pressure sensing element 71, and accordingly, the temperature sensing portion 721 can be closer to the fluid to detect the temperature signal. The temperature sensing portion 721 can be located in the channel 231 or at least partially exposed outside the sleeve 23. The conductive pin 722 is at least partially located in the channel 231, and the conductive pin 722 electrically connects the temperature sensing portion 721 and the circuit substrate 21. In practice, the circuit substrate 21 can be provided with a plurality of vias 216, and the conductive pin 722 can be at least partially located in the via 216. Optionally, the conductive pin 722 can extend through the hole 216 to the first surface 211 of the circuit substrate 21, and the conductive pin 722 is fixed by soldering at the via 216.

[0055] In some embodiments, the sensing component 2 further includes an insulating protective shell 8 , which is at least partially located in the channel 231 , and has a protective cavity 81 for accommodating at least a portion of the conductive pins 722 .

[0056] Optionally, the insulating protective shell 8 is made of plastic. Fig.13 As shown, the insulating protective shell 8 includes a Fig.13The conductive pin 722 is at least partially located in the protective cavity 81. For example, the conductive pin 722 of the temperature sensing element 72 penetrates from the lower end of the insulating protective shell 8, and penetrates from the upper end of the insulating protective shell 8 and is welded to the circuit substrate 21. In some embodiments, the upper end of the insulating protective shell 8 can be fixed to the second surface 212 of the circuit substrate 21 by physical structure fixation, gluing, soldering, etc., thereby enhancing the stability of the insulating protective shell 8 when it is impacted by the refrigerant. The insulating protective shell 8 can also be directly sandwiched between the temperature sensing part 721 and the circuit substrate 21, so that the structure is simpler and the production process is less. The lower end of the insulating protective shell 8 is adjacent to the temperature sensing part 721, thereby maximally protecting the conductive pin 722. The design of the insulating protective shell 8 reduces the risk of the conductive pin 722 of the temperature sensing unit 72 being impacted and corroded by the refrigerant, thereby increasing the service life of the sensor device 100. The conductive pins 722 may also be coated with a coating resistant to refrigerant corrosion, thereby further reducing the effect of the conductive pins 722 being corroded by the refrigerant. Fig.13 In the embodiment, the upper end of the insulating protective shell 8 is in an integral cylindrical shape, and the lower end is in two mutually coupled cylindrical shapes. Such a design can play a foolproof design and prevent the insulating protective shell 8 from being inserted in the wrong direction. Optionally, one side of the insulating protective shell 8 contacts the circuit substrate 21, and the other side contacts the temperature sensing portion 721. The insulating protective shell 8 can be sandwiched between the circuit substrate 21 and the temperature sensing portion 721.

[0057] refer to Figures 14 to 16 As shown, in another embodiment of the present application, the sensing element 22 is a positive pressure temperature and pressure integrated chip, or the sensing element 22 is a positive pressure pressure chip, or the sensing element 22 is a patch type NTC temperature element, and the sensing element 22 is at least partially located in the channel 231. The barrel wall 232 of the sleeve 23 is arranged around the sensing element 22.

[0058] The sensing component 2 further includes a corrosion-resistant glue 60 filling the channel 231 . The corrosion-resistant glue 60 adheres to the inner circumference of the cylinder wall 232 . The corrosion-resistant glue 60 covers the sensing element 22 so that the sensing element 22 does not directly contact the fluid.

[0059] In this embodiment, if Fig.16As shown, the sensing component 2 includes two sensing elements 22, namely a temperature sensing element 51 and a pressure sensing element 52. Both sensing elements 22 adopt a positive pressure chip structure. The temperature sensing element 51 is a chip NTC structure, and the pressure sensing element 52 is a chip positive pressure MEMS structure. The chip NTC structure is a chip thermistor, and the thermistor temperature sensor decreases in resistance as the temperature increases. The temperature sensing element corresponding to the chip thermistor is relatively small in size, and some products are about 1.0mm×0.5mm in size. By wrapping the chip temperature sensing element 51 and the chip pressure sensing element 52 with corrosion-resistant glue 60, it is beneficial to protect the temperature sensing element 51 and the pressure sensing element 52 from corrosion, impact, etc. of the refrigerant. Optionally, the corrosion-resistant glue 104 can be a fluorine-containing flexible silicone.

[0060] refer to Fig.16 As shown, in some embodiments, the sensing component 2 may further include a conditioning chip 53, which is disposed on the side where the second surface 212 of the circuit substrate 21 is located, and is also wrapped and covered by the corrosion-resistant glue 60. The function of the conditioning chip 53 is to perform denoising, signal amplification, signal compensation and other processing on the pressure signal or the temperature signal to improve the signal quality.

[0061] refer to Fig.17 and Fig.18 As shown, an embodiment of the present application further provides a valve assembly 300 , which includes the sensor device 100 in the above embodiment. The valve assembly 300 also includes a valve body 301 , the sensor device 100 is fixedly mounted on the valve body 301 , and the valve body 301 includes a first flow channel 302 .

[0062] exist Fig.18 In the schematic cross-sectional structure, a sealing element 91 is further provided between the housing 1 and the valve body 301 of the sensor device 100. The valve body 301 is provided with an installation cavity, and the sensor device 100 is at least partially accommodated in the installation cavity of the valve body 301. The sealing element 91 can be pressed between the wall portion of the valve body 301 forming the installation cavity and the transverse wall 113 of the housing 1. The housing 1 and the valve body 301 are sealed by the sealing element 91, so that the channel 231 forms a liquid-tight channel that allows the fluid to flow along its axial direction.

[0063] The valve assembly 300 also includes a clamping nut 92. For the sensor device 100, the transverse wall 113 of its first shell 12 radially protrudes outward relative to the outer cylinder portion 121, and at least part of the protruding structure cooperates with the clamping nut 92. The clamping nut 92 is annular and is arranged on the outer peripheral side of the outer cylinder portion 121. The outer periphery of the clamping nut 92 is threadedly connected to the valve body portion 301 to fix the sensor device 100 and the valve body portion 301 together.

[0064] The valve assembly 300 provided in the embodiment of the present application may also include a fluid control assembly, which is fixed to the valve body portion 301. The fluid control assembly may be an electronic expansion valve, which is used for refrigerant flow control in an automobile air-conditioning system to achieve throttling of the refrigerant. The fluid control assembly correspondingly includes structures such as a coil assembly, which will not be described in detail in this application. The sensor device 100, as an integrated temperature and pressure sensor, can be used to detect the pressure and temperature of the refrigerant passing through the fluid control assembly. Of course, the fluid control assembly may also be other control valves or thermal management system components, etc., which can achieve corresponding control of the refrigerant in the thermal management system components.

[0065] The above embodiments are only used to illustrate the present application but not to limit the technical solutions described in the present application. The understanding of this specification should be based on the technical personnel in the relevant technical field. For example, the directional descriptions such as "front", "back", "left", "right", "up", and "down" are described in detail in this specification with reference to the above embodiments. However, ordinary technical personnel in the field should understand that technical personnel in the relevant technical field can still modify or replace the present application with equivalents, and all technical solutions and improvements that do not depart from the spirit and scope of the present application should be included in the scope of the claims of the present application.

Claims

1. A sensor device, characterized in that: include: A housing (1) and a sensing component (2); the sensing component (2) comprises a circuit substrate (21), at least one sensing element (22) and a sleeve (23); the sensor device (100) further comprises an inner cavity (200) and a channel (231); the inner cavity (200) and the channel (231) are respectively located on different sides of the circuit substrate (21) in a thickness direction; The sleeve (23) is located on one side of the circuit substrate (21) in the thickness direction, and the sleeve (23) has a tube wall (232); one end of the tube wall (232) along the axial direction of the channel (231) is sealed and connected to the circuit substrate (21); the tube wall (232) of the sleeve (23) is located on the outer periphery of the channel (231); the sensing element (22) is electrically connected to the circuit substrate (21), and the sensing element (22) is capable of sensing the pressure and / or temperature of the fluid in the channel (231); The housing (1) comprises a mating portion (11), wherein the mating portion (11) and the sleeve (23) are located on the same side of the circuit substrate (21) in a thickness direction; the mating portion (11) comprises a receiving portion (111); the sleeve (23) is at least partially received in the receiving portion (111); the mating portion (11) comprises a first peripheral wall portion (112) forming the receiving portion (111); the first peripheral wall portion (112) is sealedly connected to the outer peripheral side of the sleeve wall (232) of the sleeve (23); the inner cavity (200) is not connected to the channel (231); The end of the barrel wall (232) along the axial direction of the channel (231) is sealed and fixed to the circuit substrate (21) by soldering or laser welding; the first peripheral wall portion (112) is sealed and fixed to the outer peripheral side of the barrel wall (232) by soldering, laser welding, bonding, or ultrasonic welding; The circuit substrate (21) comprises a ceramic substrate (24) and a metal bonding portion (25) coated on a portion of the surface area of ​​the ceramic substrate (24) by a copper coating process; the sleeve (23) is made of metal; the barrel wall (232) and the metal bonding portion (25) are sealed and connected by soldering; the matching portion (11) is made of metal, and the first peripheral wall portion (112) and the outer peripheral side of the barrel wall (232) are sealed and fixed by laser welding; The housing (1) comprises a first shell (12) and a second shell (13); the first shell (12) comprises an outer cylinder (121), the matching portion (11) and a bent portion (122); one side of the outer cylinder (121) in the axial direction is connected to the matching portion (11), and the other side is connected to the bent portion (122); the outer cylinder (121) is arranged around the circuit substrate (21); the bent portion (122) extends from the outer cylinder (121) in the direction of the axial center line of the outer cylinder (121); The second shell (13) comprises a main body (131) and an extension portion (132); the inner cavity (200) is located between the main body (131) and the circuit substrate (21); the extension portion (132) is located at the periphery of the main body (131); the extension portion (132) presses against the circuit substrate (21), and the bent portion (122) presses against the extension portion (132).

2. The sensor device according to claim 1, characterized in that The matching portion (11) comprises a transverse wall (113) and a longitudinal wall (114), wherein the transverse wall (113) extends from the outer cylinder portion (121) in a direction perpendicular to the axial direction of the channel (231), and the longitudinal wall (114) is located on a side of the transverse wall (113) away from the inner cavity (200) and extends in the axial direction of the channel (231); The matching portion (11) is provided with a groove (115), and the notch of the groove (115) faces the circuit substrate (21); The sensor device (100) further comprises a buffer member (5), wherein the buffer member (5) is at least partially accommodated in the groove (115), and one side of the buffer member (5) is in contact with the circuit substrate (21), and the other side is in contact with the bottom of the groove (115).

3. The sensor device according to claim 1, characterized in that The sensing element (22) is located on a side of the circuit substrate (21) close to the inner cavity (200); the circuit substrate (21) is provided with a through hole (26); the sensing element (22) has a sensing cavity (221); the sensing cavity (221) is not connected to the inner cavity (200); and the through hole (26) connects the sensing cavity (221) of the sensing element (22) with the channel (231).

4. The sensor device according to claim 3, characterized in that The metal bonding portion (25) comprises a heat conducting sub-portion (251), the heat conducting sub-portion (251) being located on a side of the circuit substrate (21) close to the sleeve (23), and at least a portion of the heat conducting sub-portion (251) is opposite to the channel (231); And / or, the circuit substrate (21) comprises a second peripheral wall portion (261) forming the through hole (26), and at least a part of the second peripheral wall portion (261) is made of metal.

5. The sensor device according to claim 1, characterized in that The sensing element (22) is located in the channel (231); the wall (232) of the sleeve (23) is arranged around the sensing element (22); The sensing component (2) further comprises a corrosion-resistant glue (60) filled in the channel (231), wherein the corrosion-resistant glue (60) adheres to the inner circumference of the cylinder wall (232); the corrosion-resistant glue (60) covers the sensing element (22) so that the sensing element (22) does not directly contact the fluid.

6. The sensor device according to claim 1, characterized in that The at least one sensing element (22) comprises a temperature sensing element (72); the temperature sensing element (72) comprises a temperature sensing portion (721) and a conductive pin (722); the temperature sensing portion (721) is located on a side of the circuit substrate (21) close to the sleeve (23); the conductive pin (722) is at least partially located in the channel (231); and the conductive pin (722) electrically connects the temperature sensing portion (721) and the circuit substrate (21).

7. The sensor device according to claim 6, characterized in that The sensing component (2) further comprises an insulating protective shell (8), wherein the insulating protective shell (8) is located in the channel (231); the insulating protective shell (8) comprises a protective cavity (81) for accommodating at least a portion of the conductive pins (722); one side of the insulating protective shell (8) is in contact with the circuit substrate (21), and the other side is in contact with the temperature sensing portion (721); the insulating protective shell (8) is sandwiched between the circuit substrate (21) and the temperature sensing portion (721).

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