A method for preparing an intelligent power module and a packaging module prepared therefrom

Abstract

The invention discloses a preparation method of an intelligent power module and a packaging module prepared by the same, comprising the following steps: preparing an aluminum-based copper-clad laminate: selecting an aluminum-based copper-clad laminate of an appropriate size and cleaning the aluminum-based copper-clad laminate; solder paste printing; component pasting: mounting the component at the position of the printed solder paste on the aluminum-based copper-clad laminate; reflow soldering fixation: reflow soldering the mounted aluminum-based copper-clad laminate to fix the component mounted on the aluminum-based copper-clad laminate; copper wire welding: welding the copper wire, and arranging the copper wire along a direction perpendicular to the injection molding direction of a flow channel during packaging; gold wire welding: welding the gold wire, and arranging the gold wire along a direction parallel to the injection molding direction of the flow channel during packaging; drying injection molding and product testing; The present application aims to propose a preparation method of an intelligent power module and a packaging module prepared by the same, which adopts a wiring manufacturing method combining gold wire and copper wire to reduce the problem of wire punching to a lower level, reduce the product defect rate, and improve the reliability of the product.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor devices, and in particular to a method for preparing an intelligent power module and a packaging module prepared thereby. Background Art

[0002] Intelligent Power Module (IPM) is a power drive product that combines power electronics and integrated circuit technology. It has the advantages of high current, low saturation voltage and high withstand voltage of GTR (high power transistor), and the advantages of high input impedance, high switching frequency and low driving power of MOSFET (field effect transistor). In addition, IPM integrates logic, control, detection and protection circuits, which is easy to use. It not only reduces the size of the system, shortens the development time, but also enhances the reliability of the system. It is suitable for the field of electronic device technology and has been widely used in various fields.

[0003] The IPM module is a power device that is packaged by combining substrate, chip, resistor, capacitor, bonding wire and other materials. During the production process, the selection of metal bonding wires for the product is particularly important, which directly affects the reliability of the product, such as poor welding points, wire collapse, wire punching, wire strain, and bonded chip damage.

[0004] In the existing semiconductor production, the driving HVIC chip of the product generally uses the same specification of binding metal wire, whose wire diameter is about 1.5mil (38um). The wire diameter is very thin, and it is easy to have process problems such as line collapse and line punching, especially the serious line punching phenomenon. When the line punching occurs, the distance between the wires becomes shorter, and it is easy to produce arcing, which leads to the problem that the product is prone to failure in high temperature and high humidity environment, and there are quality risks, which affects the reliability of the product and reduces the service life. On the one hand, under the same voltage specification, in order to minimize the cost, IC manufacturers make the driving HVIC appearance design smaller and smaller, and the layout space of the metal wire is limited; on the other hand, because it is the driving control center, the metal wires that need to be bound are also the most devices in the entire module. The metal wires are numerous and dense, and the distance between the wires is small, which greatly increases the difficulty in packaging technology. Therefore, many semiconductor developers and manufacturers are looking for the best packaging technology solution, so as to ensure the process yield of each production link, improve the packaging technology level of the product, reduce the loss of the production process, realize the benefit of lean manufacturing, and enhance the competitiveness of the product. Summary of the invention

[0005] The purpose of the present invention is to provide a method for preparing an intelligent power module and a packaging module prepared therefrom, which adopts a wiring manufacturing method combining gold wire and copper wire to reduce the wire punching problem to a lower level, reduce the product defect rate and improve the reliability of the product.

[0006] To achieve this purpose, the present invention adopts the following technical solution: a method for preparing an intelligent power module, comprising the following steps:

[0007] Prepare aluminum-based copper-clad laminate: select aluminum-based copper-clad laminate of appropriate size and clean it;

[0008] Solder paste printing: Print solder paste at the preset position of the aluminum-based copper-clad laminate;

[0009] Component pasting: Mount the components on the printed solder paste position of the aluminum-based copper-clad laminate;

[0010] Reflow soldering fixation: reflow soldering the mounted aluminum-based copper-clad laminate to fix the components mounted on the aluminum-based copper-clad laminate;

[0011] Copper wire welding: welding copper wire, the copper wire is arranged in the vertical direction of the flow channel injection direction during packaging;

[0012] Gold wire welding: welding gold wire, the gold wire is arranged in a direction parallel to the injection direction of the flow channel during packaging;

[0013] Drying and injection molding: Dry the aluminum-based copper-clad laminate with metal wires welded on it, and then perform injection molding and packaging after drying;

[0014] Product testing: Conduct electrical parameter testing on packaged products.

[0015] Preferably, the copper wire welding step specifically includes:

[0016] Fix one end of the copper wire: Use ball welding process to weld the copper wire to the first welding point of the aluminum-based copper-clad laminate;

[0017] Protect the copper wire: During the copper wire welding process, add protective gas to prevent the copper wire from oxidation;

[0018] Fix the other end of the copper wire: Use hot pressing to weld the copper wire to the second welding point of the aluminum-based copper-clad laminate, and the connection direction between the first welding point and the second welding point is perpendicular to the injection direction of the runner during injection molding.

[0019] Preferably, the step of gold wire welding specifically includes:

[0020] Fix one end of the gold wire: Use ball welding process to weld the gold wire to the third welding point of the aluminum-based copper-clad laminate;

[0021] Fix the other end of the gold wire: Use hot pressing to weld the gold wire to the fourth welding point of the aluminum-based copper-clad laminate, and the connection direction between the third welding point and the fourth welding point is parallel to the injection direction of the runner during injection molding.

[0022] Preferably, the step of preparing the aluminum-based copper clad laminate specifically includes: warehousing the aluminum-based copper clad laminate, performing quality control inspection on the aluminum-based copper clad laminate, and cleaning the qualified aluminum-based copper clad laminate by a multi-stage ultrasonic cleaning method.

[0023] Preferably, between the reflow soldering fixation and the copper wire welding steps, a cleaning and drying step is also included: the aluminum-based copper-clad laminate after reflow soldering is cleaned with a cleaning agent, and the cleaned aluminum-based copper-clad laminate is placed in a constant temperature box for pre-baking.

[0024] Preferably, after the copper wire and the gold wire are welded, an automatic optical inspection step is also included, in which the aluminum-based copper clad laminate to which the gold wire is welded is subjected to automatic optical inspection to inspect the welding points between the copper wire and the aluminum-based copper clad laminate and the welding points between the gold wire and the aluminum-based copper clad laminate, and by comparing with the database parameters of the automatic optical inspection, products with unqualified welding points are screened out.

[0025] A packaging module prepared by the preparation method of the intelligent power module comprises an aluminum-based copper-clad laminate, a driving HVIC chip, a triode chip, a copper wire, a gold wire and a pin; the driving HVIC chip, the triode chip and the pin are fixed to the aluminum-based copper-clad laminate by soldering; one end of the copper wire is welded to the driving HVIC chip, the other end of the copper wire is welded to the aluminum-based copper-clad laminate, and the wiring direction of the copper wire is perpendicular to the injection direction of a flow channel during packaging; one end of the gold wire is welded to the driving HVIC chip, the other end of the gold wire is welded to the aluminum-based copper-clad laminate, and the wiring direction of the gold wire is parallel to the injection direction of the flow channel during packaging.

[0026] Preferably, the aluminum-based copper clad laminate includes an aluminum substrate, an insulating layer and a circuit layer, which are stacked from bottom to top, the insulating layer is adhered to the upper surface of the aluminum substrate, and the circuit layer is engraved on the upper surface of the insulating layer by etching.

[0027] Preferably, mounting holes are provided at both ends of the aluminum-based copper-clad laminate, and the mounting holes are used to provide escape space for mounting screws.

[0028] The beneficial effects of a technical solution of the present invention are as follows: gold wire is arranged in a direction parallel to the injection direction of the encapsulation injection molding flow channel, and the binding direction of the gold wire is consistent with the flow direction of the plastic molding material. The impact force from the front is relatively small, and the use of gold wire is relatively wide, and the conduction efficiency is the best, it is not easy to oxidize, has good ductility and fracture characteristics, and has a good wire arc, which can be applied to the connection between a variety of components. Copper wire is arranged in a direction perpendicular to the injection direction of the encapsulation injection molding flow channel, which is relatively low in price, has good conductivity, high hardness, good mechanical properties and expansion strength. The copper wire has the characteristic of greater hardness and can withstand the impact of the injection molding material of the encapsulation injection molding flow channel, which can reduce the occurrence of wire punching or wire collapse caused by the impact of the plastic molding material. The present application uses a combination of gold wire and copper wire manufacturing method. Because the wire diameter is relatively thin, the material procurement cost is not much different from that of using only one binding wire solution, and the cost investment is almost the same. Through the combination of gold wire and copper wire solution, the wire punching problem can be reduced to a lower level, the product defect rate can be reduced, and the reliability of the product can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a structural schematic diagram of an embodiment of the present invention;

[0030] Figure 2 It is a schematic diagram of the structure of an embodiment of the present invention during injection molding;

[0031] Figure 3 It is a schematic diagram of the production process of a preparation method according to an embodiment of the present invention;

[0032] Figure 4 It is an electrical topology diagram of an embodiment of the present invention.

[0033] Among them: aluminum-based copper-clad laminate 1, driving HVIC chip 2, transistor chip 3, copper wire 4, gold wire 5, pin 6, injection molding direction 7. DETAILED DESCRIPTION

[0034] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0035] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0036] In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0037] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] See also Figures 1 to 3 As shown, a method for preparing an intelligent power module comprises the following steps:

[0039] Prepare aluminum-based copper-clad laminate: select aluminum-based copper-clad laminate of appropriate size and clean it;

[0040] Solder paste printing: Print solder paste at the preset position of the aluminum-based copper-clad laminate;

[0041] Component pasting: Mount the components on the printed solder paste position of the aluminum-based copper-clad laminate;

[0042] Reflow soldering fixation: reflow soldering the mounted aluminum-based copper-clad laminate to fix the components mounted on the aluminum-based copper-clad laminate;

[0043] Copper wire welding: welding copper wire, the copper wire is arranged in the vertical direction of the flow channel injection direction during packaging;

[0044] Gold wire welding: welding gold wire, the gold wire is arranged in a direction parallel to the injection direction of the flow channel during packaging;

[0045] Drying and injection molding: Dry the aluminum-based copper-clad laminate with metal wires welded on it, and then perform injection molding and packaging after drying;

[0046] Product testing: Conduct electrical parameter testing on packaged products.

[0047] In the context of miniaturization of product applications, high integration and miniaturization of semiconductors, the reliability design and manufacturing of semiconductors are facing challenges. With the current existing semiconductor manufacturing technology, the bonding process of the HVIC driver of the intelligent power module IPM generally uses the same specification of bonding metal wires, but it is still prone to wire collapse and wire punching, especially the wire punching phenomenon. The wire punching phenomenon shortens the distance between the metal wires and easily causes arcing, making the product more prone to failure in high temperature and high humidity environments, and the product is prone to damage after a period of use. In the manufacturing process design, each type of bonding metal wire has its own advantages and disadvantages. Generally, it is combined with product design and mature manufacturing technology to select a suitable manufacturing process solution, which can effectively reduce the defective rate.

[0048] From the comprehensive parameters, the thermal expansion coefficient is 16.5 for copper and 14.2 for gold. Expansion strength parameter: copper can withstand a tensile strength of 210 to 370N per square millimeter, while gold can only withstand 220 at most. Conductivity parameter: copper is 5.88ohm^-1 at 20 degrees, while gold is 4.55ohm^-1. Combining the comprehensive parameters of copper and gold, copper has higher expansion and thermal expansion capabilities, so copper wire is selected as the welding wire perpendicular to the injection direction, which can have higher impact resistance; the impact resistance of gold wire is weaker than that of copper, but it has the advantage of not being easily oxidized, so gold wire is selected as the welding wire parallel to the injection direction.

[0049] In this embodiment, the gold wire is arranged in a direction parallel to the injection direction of the encapsulation injection molding flow channel. The binding direction of the gold wire is consistent with the flow direction of the plastic molding material. The impact force from the front is relatively small, and the gold wire is widely used, and has the best conduction efficiency, is not easy to oxidize, has good ductility and fracture characteristics, and has a good wire arc, which can be applied to the connection between various components. The copper wire is arranged in a direction perpendicular to the injection direction of the encapsulation injection molding flow channel. The price is relatively low, the conductivity is good, the hardness is large, and the mechanical properties and expansion strength are good. The copper wire has a large hardness and can withstand the impact of the injection molding material of the encapsulation injection molding flow channel, which can reduce the occurrence of the phenomenon of wire punching or wire collapse caused by the impact of the plastic molding material. The present application uses a combination of gold wire and copper wire manufacturing method. Because the wire diameter is relatively thin, the material procurement cost is not much different from the solution of using only one binding wire, and the cost investment is almost the same. Through the combination of gold wire and copper wire, the wire punching problem can be reduced to a lower level, the product defect rate can be reduced, and the reliability of the product can be improved.

[0050] Preferably, the copper wire welding step specifically includes: fixing one end of the copper wire: welding the copper wire to a first welding point of the aluminum-based copper-clad laminate by a ball welding process; protecting the copper wire: adding a protective gas during the welding process of the copper wire to prevent oxidation of the copper wire; fixing the other end of the copper wire: welding the copper wire to a second welding point of the aluminum-based copper-clad laminate by hot pressing, and the connection direction between the first welding point and the second welding point is perpendicular to the injection direction of the runner during injection molding.

[0051] Copper wires are welded by hot-pressed ultrasonic ball welding in the microelectronics packaging industry. The binding method is ball and pressure ring, that is, the first welding point is welded by ball welding, and the second welding point is welded by hot pressing. Protective gas needs to be added during the copper wire welding process. The protective gas can be an inert gas or other gas that can isolate the copper wire from the outside world to prevent the copper wire from oxidation. Copper has stronger mechanical properties, especially when welding copper wires. The growth rate of intermetallic compounds in the solder joints is significantly reduced, thereby reducing resistance and heat generation, and ultimately improving welding reliability and device performance. Excellent ball neck strength and high arc stability can be obtained during the molding and sealing process, and it can withstand greater direct impact force in the direction perpendicular to the flow channel direction.

[0052] Specifically, the step of gold wire welding includes: fixing one end of the gold wire: welding the gold wire to the third welding point of the aluminum-based copper-clad laminate by a ball welding process; fixing the other end of the gold wire: welding the gold wire to the fourth welding point of the aluminum-based copper-clad laminate by hot pressing, and the connection direction between the third welding point and the fourth welding point is parallel to the injection direction of the runner during injection molding.

[0053] The hardness of gold wire is lower than that of copper wire. If it is perpendicular to the flow channel, it will be directly impacted by the plastic sealant during injection molding, especially when the connection points of the gold wire are far apart and the arc of the gold wire is long and high, it is more likely to cause the wire to collapse or lie down. Therefore, the gold wire is set in the direction parallel to the flow channel to reduce the direct impact of the plastic sealant during injection molding. At the same time, the gold wire can be used to connect various components by taking advantage of its characteristics of not being easily oxidized, being widely used, and having good conduction efficiency.

[0054] At the same time, the step of preparing the aluminum-based copper clad laminate specifically includes: warehousing the aluminum-based copper clad laminate, performing quality control inspection on the aluminum-based copper clad laminate, and cleaning the qualified aluminum-based copper clad laminate by a multi-stage ultrasonic cleaning method.

[0055] By adopting the multi-stage ultrasonic cleaning method, in the actual production process, different cleaning capabilities are achieved through ultrasonic cleaning at different levels, which can effectively perform rosin cleaning or plasma cleaning. Different levels of ultrasonic cleaning can produce different cleaning effects by adjusting the frequency of ultrasonic equipment. This technical means is an existing technology and will not be described in detail here.

[0056] Furthermore, between the reflow soldering fixation and the copper wire welding steps, a cleaning and drying step is also included: the aluminum-based copper-clad laminate after reflow soldering is cleaned with a cleaning agent, and the cleaned aluminum-based copper-clad laminate is placed in a constant temperature box for pre-baking.

[0057] After the reflow soldering step is completed, the equipment is cleaned with rosin cleaning agent, and the pre-baking step before binding is carried out. The cleaned aluminum-based copper-clad laminate is placed in a constant temperature box for pre-baking to clean the moisture, and then enter the next process after completion.

[0058] Preferably, after the copper wire and the gold wire are welded, an automatic optical inspection step is also included, in which the aluminum-based copper clad laminate to which the gold wire is welded is subjected to automatic optical inspection to inspect the welding points between the copper wire and the aluminum-based copper clad laminate and the welding points between the gold wire and the aluminum-based copper clad laminate, and by comparing with the database parameters of the automatic optical inspection, products with unqualified welding points are screened out.

[0059] During automatic optical inspection, the machine automatically scans the surface of the aluminum-based copper-clad laminate through a camera, collects images, and tests the welding points between the copper wire or gold wire and the aluminum-based copper-clad laminate, and compares the parameters of the welding points with the qualified parameters in the database. If the comparison result does not match, the welding point has a defect, and the welding point is displayed through a display or automatic mark to facilitate maintenance personnel to repair it; if the comparison result meets the requirements, the product is a qualified product.

[0060] A packaging module prepared by the preparation method of the above-mentioned intelligent power module comprises an aluminum-based copper-clad laminate 1, a driving HVIC chip 2, a triode chip 3, a copper wire 4, a gold wire 5 and a pin 6; the driving HVIC chip 2, the triode chip 3 and the pin 6 are fixed to the aluminum-based copper-clad laminate 1 by soldering; one end of the copper wire 4 is welded to the driving HVIC chip 2, the other end of the copper wire 4 is welded to the aluminum-based copper-clad laminate 1, and the wiring direction of the copper wire 4 is perpendicular to the injection molding direction of the flow channel during packaging; one end of the gold wire 5 is welded to the driving HVIC chip 2, the other end of the gold wire 5 is welded to the aluminum-based copper-clad laminate 1, and the wiring direction of the gold wire 5 is parallel to the injection molding direction of the flow channel during packaging.

[0061] In the present application, by combining the wiring method of copper wire 4 and gold wire 5, the problem of wire punching is reduced to a lower level, the product defect rate is reduced, and the reliability of the product is improved. Brush solder paste on the position where the aluminum-based copper-clad laminate 1 needs to connect the components, and then place the components such as the driving HVIC chip 2, the triode chip 3 and the pin 6 on the aluminum-based copper-clad laminate 1, and solidify the solder paste through reflow soldering, thereby completing the fixing work of the components such as the driving HVIC chip 2, the triode chip 3 and the pin 6. The copper wire 4 is arranged in a direction perpendicular to the injection molding direction of the flow channel during packaging, and the mechanical properties of the copper wire 4 are stronger, especially when the copper wire is welded, the growth rate of the intermetallic compound in the solder joint is significantly reduced, thereby reducing the resistance, reducing the heat generation, and finally improving the welding reliability and device performance, and excellent ball neck strength and high arc stability can be obtained in the molding and sealing process, and in the direction perpendicular to the flow channel direction, it can withstand a greater direct impact force. The gold wire 5 is arranged in a direction parallel to the injection direction of the flow channel during packaging to reduce the direct impact of the plastic packaging material during injection molding. At the same time, the gold wire can be used to connect various components by taking advantage of its non-oxidation, wide application and good conduction efficiency.

[0062] Specifically, the aluminum-based copper-clad laminate 1 includes an aluminum substrate, an insulating layer and a circuit layer, which are stacked from bottom to top, the insulating layer is adhered to the upper surface of the aluminum substrate, and the circuit layer is engraved on the upper surface of the insulating layer by etching.

[0063] The aluminum substrate is used as a substrate, and an electrical circuit is etched on the upper surface of the insulating layer to form a circuit layer. The insulating layer can achieve electrical isolation between the aluminum substrate and the circuit layer.

[0064] Preferably, mounting holes are provided at both ends of the aluminum-based copper-clad laminate 1, and the mounting holes are used to provide escape space for mounting screws.

[0065] like Figure 4As shown, an intelligent power module 01 includes a control chip 02 and three inverter units. The inverter units include three groups of inverter modules. Each group of inverter modules includes two triode transistors, wherein triode transistor 03 and triode transistor 06 form a group, triode transistor 04 and triode transistor 07 form a group, and triode transistor 05 and triode transistor 08 form a group. Each group of two triode transistors is divided into an upper bridge arm and a lower bridge arm, wherein triode transistor 03 is an upper bridge arm, triode transistor 07 is a lower bridge arm, and triode transistor 04 is an upper bridge arm. , triode transistor 07 is the lower bridge arm, triode transistor 05 is the upper bridge arm, triode transistor 08 is the lower bridge arm, the drain D of the triode transistor 03 of the upper bridge arm is connected to the high voltage input terminal P of the module, the source of the triode transistor 03 of the upper bridge arm is connected to the drain of the triode transistor 06 of the lower bridge arm, the source of the triode transistor 06 of the lower bridge arm is connected to the external pin UN of the module, the gates G of the two triode transistors are connected to the control chip 02, the source S of the triode transistor 04 of the upper bridge arm is connected to the drain D of the triode transistor 07 of the lower bridge arm The source of the triode transistor 07 of the lower bridge arm is connected to the external pin VN of the module, and the gates of the two triode transistors are connected to the control chip 02. The source of the triode transistor 05 of the upper bridge arm is connected to the drain of the triode transistor 08 of the lower bridge arm, and the source of the triode transistor 08 of the lower bridge arm is connected to the external pin WN of the module. The gates of the two triode transistors are connected to the control chip 02. 09 is a high-frequency filter capacitor of the control chip, which is connected to VCC and COM and is as close to the output end of the control chip as possible. Its function is to filter out high-frequency signals. The VCC power supply is +15V, and a 10-47uf capacitor is added for post-stage filtering to prevent false triggering caused by interference of high-voltage signals on the power supply. 10 is the filter capacitor of ITRIP, which is connected to ITRIP and COM. Its function is to filter out high-frequency signals. ITRIP is a voltage-type overcurrent protection terminal with a threshold voltage generally between 0.45v and 0.55V. It is also a terminal that is more susceptible to interference. In order to prevent false triggering caused by interference of high-voltage signals on ITRIP, a 1nf capacitor is added for post-stage filtering.

[0066] In the description of this specification, the description with reference to the terms "embodiment", "example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0067] The technical principle of the present invention is described above in conjunction with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the scope of protection of the present invention in any way. Based on the explanations herein, those skilled in the art can associate other specific implementations of the present invention without paying creative labor, and these methods will fall within the scope of protection of the present invention.

Claims

1. A method for preparing an intelligent power module, characterized in that: The steps include: Prepare aluminum-based copper-clad laminate: select aluminum-based copper-clad laminate of appropriate size and clean it; Solder paste printing: Print solder paste at the preset position of the aluminum-based copper-clad laminate; Component pasting: Mount the components on the printed solder paste position of the aluminum-based copper-clad laminate; Reflow soldering fixation: reflow soldering the mounted aluminum-based copper-clad laminate to fix the components mounted on the aluminum-based copper-clad laminate; Copper wire welding: welding copper wire, the copper wire is arranged in the vertical direction of the flow channel injection direction during packaging; Gold wire welding: welding gold wire, the gold wire is arranged in parallel with the injection direction of the flow channel during packaging; Drying and injection molding: Dry the aluminum-based copper-clad laminate with metal wires welded on it, and then perform injection molding and packaging after drying; Product testing: Conduct electrical parameter testing on packaged products; The copper wire welding step specifically includes: Fix one end of the copper wire: Use ball welding process to weld the copper wire to the first welding point of the aluminum-based copper-clad laminate; Protect the copper wire: During the copper wire welding process, add protective gas to prevent the copper wire from oxidation; Fix the other end of the copper wire: weld the copper wire to the second welding point of the aluminum-based copper-clad laminate by hot pressing, and the connection direction between the first welding point and the second welding point is perpendicular to the injection direction of the runner during injection molding; The gold wire welding step specifically includes: Fix one end of the gold wire: Use ball welding process to weld the gold wire to the third welding point of the aluminum-based copper-clad laminate; Fix the other end of the gold wire: Use hot pressing to weld the gold wire to the fourth welding point of the aluminum-based copper-clad laminate, and the connection direction between the third welding point and the fourth welding point is parallel to the injection direction of the runner during injection molding.

2. The method for preparing an intelligent power module according to claim 1, characterized in that: The step of preparing the aluminum-based copper-clad laminate specifically includes: warehousing the aluminum-based copper-clad laminate, performing quality control inspection on the aluminum-based copper-clad laminate, and cleaning the qualified aluminum-based copper-clad laminate by a multi-stage ultrasonic cleaning method.

3. The method for preparing an intelligent power module according to claim 1, characterized in that: Between the reflow soldering and copper wire soldering steps, a cleaning and drying step is also included: the aluminum-based copper-clad laminate after reflow soldering is cleaned with a cleaning agent, and the cleaned aluminum-based copper-clad laminate is placed in a constant temperature box for pre-baking.

4. The method for preparing an intelligent power module according to claim 1, characterized in that: After the copper wire and the gold wire are welded, an automatic optical inspection step is also included, in which the aluminum-based copper clad laminate to which the gold wire is welded is subjected to automatic optical inspection to inspect the welding points between the copper wire and the aluminum-based copper clad laminate and the welding points between the gold wire and the aluminum-based copper clad laminate, and by comparing with the database parameters of the automatic optical inspection, products with unqualified welding points are screened out.

5. A packaged module prepared by the method for preparing an intelligent power module according to any one of claims 1 to 4, characterized in that: It comprises an aluminum-based copper-clad laminate, a driving HVIC chip, a transistor chip, copper wires, gold wires and pins; the driving HVIC chip, the transistor chip and the pins are fixed to the aluminum-based copper-clad laminate by soldering; one end of the copper wire is welded to the driving HVIC chip, the other end of the copper wire is welded to the aluminum-based copper-clad laminate, and the wiring direction of the copper wire is perpendicular to the injection direction of the flow channel during packaging; one end of the gold wire is welded to the driving HVIC chip, the other end of the gold wire is welded to the aluminum-based copper-clad laminate, and the wiring direction of the gold wire is parallel to the injection direction of the flow channel during packaging.

6. A packaging module according to claim 5, characterized in that: The aluminum-based copper-clad laminate comprises an aluminum substrate, an insulating layer and a circuit layer, which are stacked from bottom to top, the insulating layer is adhered to the upper surface of the aluminum substrate, and the circuit layer is engraved on the upper surface of the insulating layer by etching.

7. A packaging module according to claim 5, characterized in that: Both ends of the aluminum-based copper-clad laminate are provided with mounting holes, and the mounting holes are used to provide escape space for mounting screws.

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