Display substrate, display panel, and method for manufacturing display panel

Abstract

The present application discloses a display substrate, a display panel and a method for manufacturing a display panel. The display substrate includes: a driving substrate, including a substrate, and a plurality of welding terminals and a plurality of barriers arranged in an array on the substrate, wherein the welding terminals are arranged between adjacent barriers; a plurality of solder paste parts arranged on the plurality of welding terminals; a plurality of light-emitting diodes, wherein the light-emitting diodes are electrically connected to the corresponding welding terminals through the solder paste parts; wherein the surface roughness of the surface of the barrier away from the substrate is greater than 0.1 microns, and adjacent solder paste parts are arranged separately from each other. The present application provides a rough surface on the surface of the barrier away from the substrate, so that the solder paste on the welding terminal is not easy to diffuse, and the solder paste on the welding terminal can be prevented from flowing and connecting the solder paste on the adjacent welding terminal, thereby avoiding the problem of short circuit between adjacent welding terminals.

Description

Technical Field

[0001] The present application relates to the field of display, and in particular to a display substrate, a display panel and a method for manufacturing a display panel. Background Art

[0002] Major panel manufacturers are actively developing light-emitting diode display panels (LED panels), especially micro light-emitting diode display panels (MinLED panels or MicroLED panels), which have become a hot topic. Micro light-emitting diode display panels are expected to become the core technology of the next generation of display panels.

[0003] However, with the miniaturization of light-emitting diodes (LEDs), the precision requirements for solder paste screen printing are gradually increasing. Differences in the accuracy of solder paste spraying lead to solder paste adhesion, which easily causes short circuits between adjacent welding terminals, resulting in display abnormalities of the micro-light-emitting display panel and reducing the yield of the micro-light-emitting diode display panel. Summary of the invention

[0004] The embodiments of the present application provide a display substrate, a display panel, and a method for manufacturing the display panel, which can solve the problem of short circuits between adjacent solder terminals that are very likely to occur as the precision requirements for solder paste screen printing gradually increase with the miniaturization of light-emitting diodes (LEDs), thereby solving the problem of abnormal display of the light-emitting diode display panel and reducing the yield of the light-emitting diode display panel.

[0005] The present application provides a display substrate, including:

[0006] A driving substrate, comprising a base, and a plurality of welding terminals and a plurality of blocking members arranged in an array on the base, wherein the welding terminals are arranged between adjacent blocking members;

[0007] A plurality of solder paste pieces, arranged on the plurality of the soldering terminals;

[0008] A plurality of light emitting diodes are arranged in an array on the driving substrate, and the light emitting diodes are electrically connected to the corresponding welding terminals through the solder paste;

[0009] The surface roughness of the barrier component on a side away from the substrate is greater than 0.1 micrometers, and adjacent solder paste components are separated from each other.

[0010] Optionally, in some embodiments of the present application, the surface roughness of the barrier member on a side away from the substrate is 0.5 microns to 1.5 microns.

[0011] Optionally, in some embodiments of the present application, the material of the solder paste part includes tin, silver, and copper, wherein the mass percentage of the tin is greater than 99%, the mass percentage of the silver is 0.3% to 0.5%, and the mass percentage of the copper is less than 0.2%.

[0012] Optionally, in some embodiments of the present application, the material of the barrier is a light-shielding material.

[0013] Optionally, in some embodiments of the present application, the plurality of welding terminals constitute a plurality of welding terminal groups, the welding terminal groups include a first sub-welding terminal and a second sub-welding terminal, and the light-emitting diode includes a first connecting terminal and a second connecting terminal;

[0014] One of the welding terminal groups corresponds to one of the light-emitting diodes, the first sub-welding terminal and the second sub-welding terminal are arranged at both sides of one of the blocking members, the light-emitting diode is arranged on the first sub-welding terminal, the second sub-welding terminal, and the side of the blocking member between the first sub-welding terminal and the second sub-welding terminal away from the substrate, the first connecting terminal is connected to the first sub-welding terminal through one of the solder paste members, and the second connecting terminal is connected to the second sub-welding terminal through another of the solder paste members.

[0015] Optionally, in some embodiments of the present application, the cross-section of the barrier is any one of a trapezoidal, semicircular, and semi-elliptical shape.

[0016] Correspondingly, an embodiment of the present application further provides a display panel, comprising the display substrate described in one of the above items, wherein the display substrate is used as a backlight of the display panel, or the light-emitting diodes of the display substrate are used as display pixels of the display panel.

[0017] Accordingly, an embodiment of the present application further provides a method for manufacturing a display panel, comprising:

[0018] Step S100: providing a driving substrate, the driving substrate comprising a base, and a plurality of welding terminals and a plurality of blocking members arranged in an array on the base, the welding terminals being arranged between adjacent blocking members;

[0019] Step S200: forming a rough surface on a surface of the barrier away from the substrate, wherein the surface roughness of the rough surface is 0.5 micrometers to 1.5 micrometers;

[0020] Step S300: forming solder paste on the plurality of solder terminals, wherein the solder paste includes a solvent and solder paste particles, and the solder paste includes a plurality of solder paste drops, and one solder paste drop is formed on one solder terminal;

[0021] Step S400: providing a light-emitting diode, and soldering the light-emitting diode to the driving substrate, wherein the solder paste particles are melted to form a solder paste member, and the light-emitting diode is electrically connected to the corresponding soldering terminal through the solder paste member.

[0022] Optionally, in some embodiments of the present application, the material of the solder paste particles includes tin, silver, and copper, the mass percentage of the tin in the solder paste particles is greater than 99%, the mass percentage of the silver is 0.3% to 0.5%, and the mass percentage of the copper is less than 0.2%.

[0023] Optionally, in some embodiments of the present application, in the step S200, the method of forming the rough surface of the barrier comprises at least one of plasma bombardment and laser scanning.

[0024] In an embodiment of the present application, a display substrate, a display panel and a method for manufacturing a display panel are provided. The display substrate includes: a driving substrate, including a substrate, and a plurality of intermediate welding terminals and a plurality of barriers arranged in an array on the substrate, wherein the welding terminals are arranged between adjacent barriers; a plurality of solder paste members arranged on the plurality of welding terminals; a plurality of light-emitting diodes arranged in an array on the driving substrate, wherein the light-emitting diodes are electrically connected to the corresponding welding terminals through the solder paste members; wherein the surface roughness of the surface of the barrier member away from the substrate is greater than 0.1 microns, and adjacent solder paste members are arranged separately from each other. The present application provides a rough surface on the surface of the barrier member away from the substrate, so that when the light-emitting diodes are soldered on the solder paste to form the solder paste member, the solder paste on the welding terminal is not easy to diffuse, and the solder paste on the welding terminal can be prevented from flowing and connecting the solder paste on the adjacent welding terminal, thereby avoiding the problem of short circuit between adjacent welding terminals, thereby avoiding display abnormalities of the light-emitting diode display panel and improving the yield of the light-emitting diode display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0026] Figure 1 A schematic diagram of a cross-sectional structure of a display substrate provided in an embodiment of the present application;

[0027] Figure 2 A schematic diagram of a display panel provided in an embodiment of the present application;

[0028] Figure 3A schematic diagram of the process steps of a method for manufacturing a display panel provided in an embodiment of the present application;

[0029] Figure 4 A schematic diagram of a first process of a method for manufacturing a display panel provided in an embodiment of the present application;

[0030] Figure 5 A schematic diagram of a second process of a method for manufacturing a display panel provided in an embodiment of the present application;

[0031] Figure 6 A schematic diagram of a third process of a method for manufacturing a display panel provided in an embodiment of the present application;

[0032] Figure 7 A schematic diagram of a fourth process of a method for manufacturing a display panel provided in an embodiment of the present application;

[0033] Figure 8 A fifth process schematic diagram of a method for manufacturing a display panel provided in an embodiment of the present application;

[0034] Fig. 9 A sixth process schematic diagram of a method for manufacturing a display panel provided in an embodiment of the present application. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the present application, unless otherwise stated, the directional words such as "upper" and "lower" used generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the accompanying drawings; while "inside" and "outside" refer to the outline of the device.

[0036] The embodiment of the present application provides a display substrate, including: a driving substrate; a plurality of light-emitting diodes, which are arranged in an array on the driving substrate; an optical adhesive layer, which is arranged on the driving substrate and covers the light-emitting diodes; wherein the optical adhesive layer includes a plurality of microstructures on a surface away from the light-emitting diodes, and each microstructure includes a protrusion or a depression. The embodiment of the present application also provides a display panel including the aforementioned display substrate and a method for manufacturing the display panel. The following is a detailed description of each. It should be noted that the description order of the following embodiments is not intended to limit the preferred order of the embodiments.

[0037] Embodiment 1

[0038] See also Figure 1 , Figure 1 A schematic diagram of a cross-sectional structure of a display substrate 100 provided in an embodiment of the present application.

[0039] The embodiment of the present application provides a display substrate 100, which includes a driving substrate 10, a plurality of solder paste parts 31, and a plurality of light-emitting diodes 20. The driving substrate includes a base 11, and a plurality of welding terminals 12 and a plurality of barriers 13 arranged in an array on the base 11, wherein the welding terminals 12 are arranged between adjacent barriers 13; a plurality of solder paste parts 31 are arranged on the plurality of welding terminals 12; a plurality of light-emitting diodes 20 are arranged in an array on the driving substrate 10, and the light-emitting diodes 20 are electrically connected to the corresponding welding terminals 12 through the solder paste parts 31; wherein the surface roughness of the barrier 13 on the side away from the base 11 is greater than 0.1 microns, and adjacent solder paste parts 31 are arranged separately from each other.

[0040] Specifically, the driving substrate 10 may include a substrate of any material, for example, the driving substrate 10 may include a substrate of glass material, the driving substrate 10 may be an array substrate, and the driving substrate 10 may include wiring and / or thin film transistors for driving light emitting diodes (LEDs).

[0041] Specifically, the light emitting diode may be an LED of a regular size, or may be a micro light emitting diode (MinLED, MicroLED).

[0042] Specifically, a surface of the barrier 13 that is away from the substrate 11 is a first surface 131 .

[0043] Specifically, by providing a rough surface on the surface of the barrier 13 away from the substrate, when the light-emitting diode 20 is soldered on the solder paste to form a solder paste part, the solder paste on the welding terminal 12 is not easy to spread, and the solder paste on the welding terminal 12 can be prevented from flowing and connecting the solder paste on the adjacent welding terminal 12, thereby avoiding the problem of short circuit between adjacent welding terminals 12, thereby avoiding display abnormalities of the light-emitting diode display panel and improving the yield of the light-emitting diode display panel.

[0044] In some embodiments, the surface roughness of the barrier 13 on the side away from the substrate 11 is 0.5 micrometers to 1.5 micrometers.

[0045] Specifically, the surface roughness of the barrier 13 on the side away from the substrate 11 (the first surface 131) is preferably 0.5 microns to 1.5 microns, which can better hinder the flow and diffusion of solder paste on the welding terminal 12, avoid connecting the solder paste on adjacent welding terminals 12, and better avoid the problem of short circuit between adjacent welding terminals 12.

[0046] In some embodiments, the material of the solder paste member 31 includes tin, silver, and copper, wherein the mass percentage of tin is greater than 99%, the mass percentage of silver is 0.3% to 0.5%, and the mass percentage of copper is less than 0.2%.

[0047] Specifically, the material of the solder paste member 31 includes tin, silver, and copper. The beneficial effects of the content of each material in the solder paste member 31 are described in detail in subsequent embodiments.

[0048] In some embodiments, the material of the barrier 13 is a light shielding material.

[0049] Specifically, the material of the barrier 13 is a shading material to avoid crosstalk between light or color between adjacent LEDs. The multiple LEDs may include a red LED, a green LED, and a blue LED. For example, the red light emitted by the red LED and the green light emitted by the green LED may be prevented from crosstalk or interference.

[0050] Specifically, the barrier 13 may be a black light shielding material. More specifically, the barrier 13 may be a black photoresist or a black matrix (BM).

[0051] Specifically, the height of the barrier 13 is 2 micrometers to 4 micrometers, which can effectively avoid the light or color crosstalk between adjacent light emitting diodes.

[0052] In some embodiments, a plurality of welding terminals 12 constitute a plurality of welding terminal groups 120, the welding terminal group 120 includes a first sub-welding terminal 121 and a second sub-welding terminal 122, and the light-emitting diode 20 includes a first connecting terminal 21 and a second connecting terminal 22; one welding terminal group 120 corresponds to one light-emitting diode 20, the first sub-welding terminal 121 and the second sub-welding terminal 122 are arranged on both side ends of a barrier 13, the light-emitting diode 20 is arranged on the first sub-welding terminal 121, the second sub-welding terminal 122, and the side of the barrier 13 between the first sub-welding terminal 121 and the second sub-welding terminal 122 away from the substrate 11, the first connecting terminal 21 is connected to the first sub-welding terminal 121 through a solder paste member 31, and the second connecting terminal 22 is connected to the second sub-welding terminal 122 through another solder paste member 31.

[0053] Specifically, the display substrate 100 includes a plurality of light-emitting diodes 20 and a plurality of welding terminal groups 120, one welding terminal group 120 corresponds to one light-emitting diode 20, the first connecting terminal 21 is connected to the first sub-welding terminal 121 through a solder paste member 31, the second connecting terminal 22 is connected to the second sub-welding terminal 122 through another solder paste member 31, the solder paste member 31 between the first connecting terminal 21 and the first sub-welding terminal 121 and the solder paste member 31 between the second connecting terminal 22 and the second sub-welding terminal 122 are independent and insulated from each other to avoid short circuit.

[0054] Specifically, the light emitting diode 20 includes a first connection terminal 21 , a second connection terminal 22 , and a light emitting body 23 . The first connection terminal 21 and the second connection terminal 22 provide electrical signals to the light emitting body 23 .

[0055] In some embodiments, the cross section of the barrier 13 is any one of a trapezoidal, semicircular, and semi-elliptical shape.

[0056] Specifically, the cross-section of the barrier 13 is any one of a trapezoidal, semicircular, and semi-elliptical shape, so that when the solder paste is used to weld the light-emitting diode 20 to form a solder paste piece, the solder paste on the welding terminal 12 is not easy to diffuse, and is more likely to gather and reflux on the corresponding welding terminal 12. This can prevent the solder paste on the welding terminal 12 from flowing and connecting the solder paste on the adjacent welding terminal 12, thereby avoiding the problem of short circuit between adjacent welding terminals 12, thereby avoiding display abnormalities in the light-emitting diode display panel and improving the yield of the light-emitting diode display panel.

[0057] Embodiment 2

[0058] See also Figure 2 , Figure 2 A schematic diagram of a display panel 300 provided in an embodiment of the present application.

[0059] This embodiment provides a display panel 300 , and the display panel 300 includes any one of the display substrates 100 in the above embodiments.

[0060] Specifically, the display substrate 100 is used as a backlight of the display panel 300 , or the light emitting diodes 20 of the display substrate 100 are used as display pixels of the display panel 300 , which is not limited here.

[0061] Specifically, the display substrate 100 is used as a component in the backlight of the display panel 300. A display panel body 200 is also provided on the light emitting side of the display substrate 100 or the side of the light emitting diode 20 away from the base 11. The display panel body 200 is used to display images, and the display substrate 100 is used as the light source of the display panel body 200.

[0062] Specifically, the display panel body 200 can be a liquid crystal display panel. The type of the liquid crystal display panel is not limited here. For example, the liquid crystal display panel can be a vertical alignment liquid crystal display panel (VA mode liquid crystal display panel), an edge field switching liquid crystal display panel (FFS mode or IPS mode liquid crystal display panel), or a twisted nematic phase liquid crystal display panel (TN mode liquid crystal display panel).

[0063] Specifically, when the light emitting diodes 20 of the display substrate 100 are used as display pixels of the display panel 300 , the display substrate 100 directly displays an image.

[0064] Embodiment 3

[0065] See also Figures 3 to 9 , Figure 3 A schematic diagram of the process steps of a method for manufacturing a display panel provided in an embodiment of the present application; Figure 4 A schematic diagram of a first process of a method for manufacturing a display panel provided in an embodiment of the present application; Figure 5 A schematic diagram of a second process of a method for manufacturing a display panel provided in an embodiment of the present application; Figure 6 A schematic diagram of a third process of a method for manufacturing a display panel provided in an embodiment of the present application; Figure 7 A schematic diagram of a fourth process of a method for manufacturing a display panel provided in an embodiment of the present application; Figure 8 A fifth process schematic diagram of a method for manufacturing a display panel provided in an embodiment of the present application; Fig. 9 A sixth process schematic diagram of a method for manufacturing a display panel provided in an embodiment of the present application.

[0066] The present embodiment provides a display panel. Any display panel 300 in the above embodiments can be manufactured using the display panel manufacturing method of the present embodiment, or any display substrate 100 in the above embodiments can be manufactured using the display panel manufacturing method of the present embodiment. The display panel manufacturing method includes the steps of: step S100, step S200, step S300, and step S400.

[0067] Step S100: providing a driving substrate, the driving substrate comprising a base, and a plurality of welding terminals and a plurality of blocking members arranged in an array on the base, wherein the welding terminals are arranged between adjacent blocking members.

[0068] Specifically, Figure 4 As shown, a driving substrate 10 is provided. The driving substrate 10 includes a base 11 , and a plurality of welding terminals 12 and a plurality of blocking members 13 arranged in an array on the base 11 . The welding terminals 12 are arranged between adjacent blocking members 13 .

[0069] Step S200: forming a rough surface on a surface of the barrier away from the substrate, wherein the surface roughness of the rough surface is 0.5 micrometers to 1.5 micrometers.

[0070] Specifically, Figure 5 As shown, a rough surface is formed on the surface of the barrier 13 away from the substrate 11 , and the surface roughness of the rough surface is 0.5 microns to 1.5 microns.

[0071] Specifically, the surface of the barrier 13 away from the substrate 11 is a first surface 131 , and the surface roughness of the first surface 131 is 0.5 micrometers to 1.5 micrometers.

[0072] Step S300: forming solder paste on a plurality of soldering terminals, the solder paste comprising a solvent and solder paste particles, the solder paste comprising a plurality of solder paste drops, and one solder paste droplet being formed on one soldering terminal.

[0073] Specifically, Figure 6 As shown, solder paste 30 is formed on a plurality of solder terminals 12 . The solder paste 30 includes a solvent 321 and solder paste particles 322 . The solder paste 30 includes a plurality of solder paste drops 32 , and one solder paste drop 32 is formed on one solder terminal 12 .

[0074] Specifically, a high-precision glue coating machine or inkjet printing equipment is used to accurately print the solder paste 30 onto the welding terminal 12, and the viscosity of the solvent 321 in the solder paste 30 is 140-180 Pa.s.

[0075] Specifically, the material of the solvent may include epoxy resin.

[0076] Step S400: providing a light-emitting diode, and soldering the light-emitting diode to the driving substrate, wherein the solder paste particles are melted to form a solder paste member, and the light-emitting diode is electrically connected to the corresponding soldering terminal through the solder paste member.

[0077] Specifically, Figure 7 , Figure 8 , Fig. 9 As shown, a light emitting diode 20 is provided, and the light emitting diode 20 is soldered to the driving substrate 10 , the solder paste particles 322 are melted to form a solder paste member 31 , and the light emitting diode 20 is connected to the corresponding soldering terminal 12 through the solder paste member 31 .

[0078] Specifically, the soldering process of the light emitting diode 20 may include pre-pressing and reflow soldering of the light emitting diode. The pre-pressing conditions of the light emitting diode are: a temperature of 110-130 degrees Celsius, a time of 50-70 seconds, and a distance of 6-12 microns between the first connection terminal 21 and the second connection terminal 22 of the light emitting diode 20 and the soldering terminal 12. The reflow soldering conditions are: an air pressure of 0.1 MPa, a temperature of 220-250 degrees Celsius, and a time of 120-150 seconds.

[0079] In some embodiments, the material of the solder paste particles 322 includes tin, silver, and copper. The mass percentage of tin in the solder paste particles 322 is greater than 99%, the mass percentage of silver is 0.3% to 0.5%, and the mass percentage of copper is less than 0.2%.

[0080] In some embodiments, in step S200 , the method of forming the rough surface of the barrier 13 includes at least one of plasma bombardment and laser scanning.

[0081] Specifically, a rough surface can be formed by bombarding the surface of the barrier 13 on the side away from the substrate 11 with plasma; and a rough surface can be formed by scanning the surface of the barrier 13 on the side away from the substrate 11 with laser.

[0082] Specifically, the cross-section of the barrier 13 is any one of a trapezoidal, semicircular, and semi-elliptical shape, so that the solder paste droplet 32 ​​is not easy to diffuse from its corresponding welding terminal to the adjacent welding terminal, and when the solder paste droplet 32 ​​is on the surface of the barrier 13 away from the substrate 11, it is easier to flow back to the corresponding welding terminal 12.

[0083] Specifically, when a rough surface is provided on the surface of the barrier 13 away from the substrate, such as Figure 7 and Fig. 9 As shown, the rough surface can block or prevent the solder paste droplet 32 ​​from flowing from the portion corresponding to one soldering terminal 12 to the portion corresponding to the adjacent soldering terminal 12, that is, the flow of the solder paste droplet 32 ​​is blocked, and the solder paste on the soldering terminal 12 is not easy to spread, thereby avoiding the problem of short circuit between adjacent soldering terminals 12. Figure 8 and Fig. 9 As shown, the contact between a solder paste drop 32 at the first portion 41 and another solder paste drop 32 at the second portion 42 is avoided, thereby avoiding display abnormality of the LED display panel and improving the yield of the LED display panel.

[0084] Specifically, further, when a rough surface is set on the surface of the barrier 13 away from the substrate, and the self-polymerizing solder paste in the present application is used, the solder paste 30 includes a solvent 321 and solder paste particles 322, and the material of the solder paste particles 322 includes tin, silver, and copper. The mass percentage of tin in the solder paste particles 322 is greater than 99%, the mass percentage of silver is 0.3% to 0.5%, and the mass percentage of copper is less than 0.2%. The solder paste in the present application is a self-polymerizing solder paste, and the self-polymerizing solder paste is matched with the rough surface of the barrier 13 away from the substrate. Figure 7 and Figure 8 , and see Fig. 9 As shown, the solder paste particles 322 in the solder paste droplet 32 ​​will flow back to the corresponding soldering terminal 12 after being heated. Figure 7 and Figure 8The first adjacent portion 40 shown ( Figure 7 The solder paste particles 322 in the first part 41 and the solder paste particles 322 in the second part 42 flow back to the corresponding soldering terminals 12 respectively. The principle is that the solder paste particles 322 form a stable metal complex on the soldering terminal 12, thereby inducing other solder paste particles 322 in the solder paste droplet 32 ​​to move toward the corresponding soldering terminal 12, and finally forming a solder paste part 31 on the soldering terminal 12. The combination of the rough surface and the self-polymerizing solder paste can better prevent the problem of short circuit between adjacent soldering terminals 12, thereby avoiding display abnormalities of the light-emitting diode display panel and improving the yield of the light-emitting diode display panel.

[0085] It should be noted that if Fig. 9 As shown, the solvent 321 in the solder paste droplet forms a protective layer 33 of the solder paste member 31 after the light-emitting diode 20 is soldered, and the protective layer 33 is located outside the solder paste member 31. It can be understood that after soldering is completed, the solvent 321 in the solder paste droplet 32 ​​solidifies to form the protective layer 33, and the solder paste particles 322 in the solder paste droplet 32 ​​melt to form the solder paste member 31. The solder paste droplet 32 ​​forms a connector after soldering, and the connector includes the solder paste member 31 and the protective layer 33.

[0086] The above is a detailed introduction to a display substrate, a display panel and a method for manufacturing a display panel provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea; at the same time, for technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A display substrate, characterized in that: include: A driving substrate, comprising a base, and a plurality of welding terminals and a plurality of blocking members arranged in an array on the base, wherein the welding terminals are arranged between adjacent blocking members; A plurality of solder paste pieces, arranged on the plurality of the soldering terminals; A plurality of light emitting diodes are arranged in an array on the driving substrate, and the light emitting diodes are electrically connected to the corresponding welding terminals through the solder paste; The surface roughness of the barrier member on the side away from the substrate is greater than 0.1 micrometers, and the adjacent solder paste members are separated from each other; the thickness of the barrier member is greater than the thickness of the welding terminal.

2. The display substrate according to claim 1, wherein: The surface roughness of the barrier element on a side away from the substrate is 0.5 micrometers to 1.5 micrometers.

3. The display substrate according to claim 2, wherein: The materials of the solder paste include tin, silver and copper, wherein the mass percentage of the tin is greater than 99%, the mass percentage of the silver is 0.3% to 0.5%, and the mass percentage of the copper is less than 0.2%.

4. The display substrate according to claim 1, wherein: The material of the barrier is a light-shielding material.

5. The display substrate according to claim 4, wherein: The plurality of welding terminals constitute a plurality of welding terminal groups, the welding terminal groups include a first sub-welding terminal and a second sub-welding terminal, and the light-emitting diode includes a first connecting terminal and a second connecting terminal; One of the welding terminal groups corresponds to one of the light-emitting diodes, the first sub-welding terminal and the second sub-welding terminal are arranged at both sides of one of the blocking members, the light-emitting diode is arranged on the first sub-welding terminal, the second sub-welding terminal, and the side of the blocking member between the first sub-welding terminal and the second sub-welding terminal away from the substrate, the first connecting terminal is connected to the first sub-welding terminal through one of the solder paste members, and the second connecting terminal is connected to the second sub-welding terminal through another of the solder paste members.

6. The display substrate according to claim 5, wherein: The cross section of the barrier is any one of a trapezoidal, semicircular and semi-elliptical shape.

7. A display panel, characterized in that: It comprises the display substrate as claimed in any one of claims 1 to 6, wherein the display substrate is used as a backlight of the display panel, or the light emitting diodes of the display substrate are used as display pixels of the display panel.

8. A method for manufacturing a display panel, characterized in that: Prepare the display panel as claimed in claim 7, wherein the manufacturing method of the display panel comprises: Step S100: providing a driving substrate, the driving substrate comprising a base, and a plurality of welding terminals and a plurality of blocking members arranged in an array on the base, the welding terminals being arranged between adjacent blocking members; Step S200: forming a rough surface on a surface of the barrier away from the substrate, wherein the surface roughness of the rough surface is 0.5 micrometers to 1.5 micrometers; Step S300: forming solder paste on the plurality of solder terminals, wherein the solder paste includes a solvent and solder paste particles, and the solder paste includes a plurality of solder paste drops, and one solder paste drop is formed on one solder terminal; Step S400: providing a light-emitting diode, and soldering the light-emitting diode to the driving substrate, wherein the solder paste particles are melted to form a solder paste member, and the light-emitting diode is electrically connected to the corresponding soldering terminal through the solder paste member.

9. The method for manufacturing a display panel according to claim 8, wherein: The materials of the solder paste particles include tin, silver and copper. The mass percentage of tin in the solder paste particles is greater than 99%, the mass percentage of silver is 0.3% to 0.5%, and the mass percentage of copper is less than 0.2%.

10. The method for manufacturing a display panel according to claim 8, wherein: In the step S200 , the method of forming the rough surface of the barrier element includes at least one of plasma bombardment and laser scanning.

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