LED chip mounter with stable chip mount mechanism

Abstract

The present invention discloses an LED chip mounter with a stable chip mount mechanism, wherein a chip suction plate slide bar is slidably installed inside the chip mounter, two chip suction plates are slidably installed on the side wall of the chip suction plate slide bar, ventilation pipes are fixedly installed on the side walls of the two chip suction plates, a nozzle assembly is fixedly installed on the bottom end of the chip suction plate, an adsorption mechanism is fixedly installed inside the nozzle assembly, the adsorption mechanism is used to stably adsorb and pneumatically mount the chip, and a driving component is arranged inside the adsorption mechanism. The present invention realizes the secondary adsorption function of the chip and the pneumatic extrusion chip operation by using the pneumatic driving force and the gravity of the pneumatic block through the coordinated action of the adsorption mechanism and the driving component.

Description

Technical Field

[0001] The invention relates to the technical field of LEDs, and in particular to an LED mounting machine with a stable mounting mechanism. Background Art

[0002] LED lamps have high light conversion efficiency, low power consumption, small size, light weight, long life, and are mercury-free and radiation-free. They are also environmentally friendly and have a wide range of applications, including local lighting, panel backlights, building (scenic spot) lighting, traffic lighting, medical and agricultural and fishery equipment light sources, etc. Therefore, with the increase in demand, the production of semiconductor LED lighting in China has developed rapidly. Various LED lighting lamps must meet the huge market demand. Manual processing alone cannot meet the huge market demand. More efficient automated production equipment and a complete set of production solutions are required.

[0003] In the past, when using LED placement machines, there would be a certain degree of tilting when the nozzle was adsorbing and sticking the patch. At this time, the machine would alarm if it found that the sticking point was tilted during the subsequent automatic detection process, thereby reminding the maintenance personnel to carry out maintenance, which reduced the work efficiency in the production process. In addition, when performing patching, it is necessary to control the sticking pressure to avoid damage to the board during the patching process. However, if the force is set too low, the patch will be unstable. In order to solve the above problems, an LED placement machine with a stable patch mechanism is proposed. Summary of the invention

[0004] The purpose of the present invention is to solve the shortcomings of the prior art and to propose an LED chip mounter with a stable chip mount mechanism.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] An LED chip mounter with a stable chip mount mechanism, comprising:

[0007] A patch suction plate slide bar is slidably installed inside the patch suction plate slide bar, two patch suction plates are slidably installed on the side wall of the patch suction plate slide bar, ventilation pipes are fixedly installed on the side walls of the two patch suction plates, a suction nozzle assembly is fixedly installed on the bottom end of the patch suction plate, and a suction mechanism is fixedly installed inside the suction nozzle assembly, and the suction mechanism is used to stably adsorb and pneumatically mount the patch;

[0008] A driving component, the driving component is arranged inside the adsorption mechanism, and the driving component is used to provide driving force for the stable adsorption and air pressure mounting of the adsorption mechanism;

[0009] A stabilizing component is installed on the side wall of the adsorption mechanism, and is used to re-stabilize and correct the position of the patch when the patch is adsorbed.

[0010] Preferably, the adsorption mechanism includes an adsorption pipe, a positive adsorption block, a side adsorption block, a first rotating rod, a pneumatic rotating plate, a first bevel gear, a side adsorption pipe and an air flow hole. The adsorption pipe is fixedly connected to the side wall of the suction nozzle assembly block, the positive adsorption block is fixedly installed on the bottom end of the adsorption pipe, the two side adsorption blocks are installed on the side wall of the positive adsorption block, the first rotating rod is rotatably installed on the inner side wall of the positive adsorption block, the pneumatic rotating plate is installed on the side wall of the first rotating rod, the first bevel gear is installed on the side wall of the first rotating rod, there is no contact between the first bevel gear and the pneumatic rotating plate, the side adsorption pipe is fixedly connected to the side wall of the side adsorption block, and the air flow hole is opened on the side wall of the side adsorption pipe near the bottom end.

[0011] Preferably, the driving assembly includes a second rotating rod, a second bevel gear, a limiting ring, a driving rope and an air pressure block. The second rotating rod is rotatably connected to the side wall of the side adsorption block, the second bevel gear is installed on the side wall of the side adsorption block, the two limiting rings are installed on the side wall of the second rotating rod, one end of the driving rope is fixedly connected to the side wall of the second rotating rod, the air pressure block is slidably connected to the side adsorption tube, and the top of the air pressure block is fixedly connected to the other end of the driving rope.

[0012] Preferably, the stabilization assembly includes a stabilization spring, a stabilization plate, a buffer block, a limiting slide plate, a slider and, a plurality of the stabilization springs are fixedly installed on the side wall of the positive adsorption block, the top side wall of the stabilization plate is fixedly connected to the other end of the plurality of stabilization springs, the buffer block is fixedly connected to the bottom side wall of the stabilization plate, the limiting slide plate is fixedly installed on the side wall of the positive adsorption block, the slider is fixedly installed on the side wall of the stabilization plate, the slider is slidably connected to the limiting slide plate, and the slider is installed on the side wall of one end of the stabilization plate close to the positive adsorption block.

[0013] Preferably, the adsorption tube is connected to the ventilation tube, an air pump is provided inside one end of the patch suction plate close to the patch suction plate sliding rod, and the other end of the ventilation tube is connected to the air pump installed inside the patch suction plate.

[0014] Preferably, the two side adsorption blocks are symmetrically arranged about the cross-sectional center axis of the positive adsorption block, and the plane where the bottom end of the side adsorption tube is located is on the same horizontal plane as the plane where the bottom ends of the suction nozzle block and the positive adsorption block are located.

[0015] Preferably, the air flow hole is arranged with a one-way valve port structure, the one-way valve port of the air flow hole points from the external environment to the inside of the side adsorption tube, and the bottom end of the side adsorption tube is a conducting structure.

[0016] Preferably, the side adsorption tube is arranged at a height greater than the height of the air pressure block, the side wall of the air pressure block is tightly fitted with the side wall of the side adsorption tube, the air pressure block will not be separated from the side adsorption tube when sliding, and the second bevel gear is meshed with the first bevel gear.

[0017] Preferably, the two side adsorption blocks are symmetrically arranged about the central axis of the side wall cross section of the stabilization plate, and the side wall passing through the positive adsorption block is fixedly connected to the bottom end of the pneumatic rotating plate.

[0018] Preferably, the plane where the bottom end of the stabilizing plate is located is located at the lower end of the plane where the positive adsorption block is located, and the limiting slide plate performs sliding limit on the sliding block.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] 1. The present invention realizes the secondary adsorption function of the patch and the pneumatic extrusion patch work by using the cooperation of the adsorption mechanism and the driving component and the gravity of the air pressure block.

[0021] 2. The present invention utilizes the coordination between the adsorption mechanism and the stabilizing component and utilizes the air pressure to achieve the stabilization work and anti-dislocation function of the patch during the adsorption process. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic diagram of the overall structure of an LED chip mounter with a stable chip mount mechanism proposed by the present invention;

[0023] Figure 2 This is an enlarged schematic diagram of structure A of an LED chip mounter with a stable chip mount mechanism proposed by the present invention;

[0024] Figure 3 This is a schematic diagram of the main structure of a chip suction plate of an LED chip mounter with a stable chip mount mechanism proposed by the present invention;

[0025] Figure 4 A schematic diagram of the side view structure of a chip placement suction plate of an LED chip placement machine with a stable chip placement mechanism proposed by the present invention;

[0026] Figure 5 A schematic diagram of the connection relationship between a chip suction plate and an adsorption mechanism of an LED chip mounter with a stable chip mount mechanism proposed by the present invention;

[0027] Figure 6A schematic diagram of the structure of an adsorption mechanism of an LED chip mounter with a stable chip mount mechanism proposed by the present invention;

[0028] Figure 7 A schematic diagram of the side view structure of an adsorption mechanism of an LED chip mounter with a stable chip mount mechanism proposed by the present invention;

[0029] Figure 8 This is a schematic diagram of the disassembled structure of the adsorption mechanism of an LED placement machine with a stable placement mechanism proposed by the present invention;

[0030] Fig. 9 A schematic diagram of the structure of a stable component of an LED chip mounter with a stable chip mount mechanism proposed by the present invention;

[0031] Fig.10 This is a schematic diagram of the internal structure of a side adsorption block of an LED chip mounter with a stable chip mount mechanism proposed by the present invention.

[0032] In the figure: 1. SMT machine; 11. SMT suction plate slide bar; 12. SMT suction plate; 13. Ventilation pipe; 14. Suction nozzle assembly; 2. Adsorption mechanism; 21. Adsorption duct; 22. Positive adsorption block; 23. Side adsorption block; 24. First rotating rod; 25. Pneumatic rotating plate; 26. First bevel gear; 27. Side adsorption tube; 28. Air flow hole; 3. Driving assembly; 31. Second rotating rod; 32. Second bevel gear; 33. Limiting ring; 34. Driving guide rope; 35. Air pressure block; 4. Stabilizing assembly; 41. Stabilizing spring; 42. Stabilizing plate; 43. Buffer block; 44. Limiting slide plate; 45. Slider. DETAILED DESCRIPTION

[0033] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0034] Reference Figure 1-10 , an LED chip mounter with a stable chip mount mechanism, comprising:

[0035] A patch suction plate slide bar 11 is slidably installed inside the patch suction plate slide bar 11, two patch suction plates 12 are slidably installed on the side wall of the patch suction plate slide bar 11, ventilation pipes 13 are fixedly installed on the side walls of the two patch suction plates 12, a suction nozzle assembly 14 is fixedly installed at the bottom end of the patch suction plate 12, and a suction mechanism 2 is fixedly installed inside the suction nozzle assembly 14, and the suction mechanism 2 is used for stable suction and air pressure mounting of the patch;

[0036] A driving component 3, which is disposed inside the adsorption mechanism 2 and is used to provide driving force for the adsorption mechanism 2 to perform stable adsorption and air pressure mounting;

[0037] The stabilizing component 4 is installed on the side wall of the adsorption mechanism 2. The stabilizing component 4 is used to re-stabilize and correct the position of the patch when the patch is adsorbed.

[0038] The present invention is further described in detail: the adsorption mechanism 2 includes an adsorption pipe 21, a positive adsorption block 22, a side adsorption block 23, a first rotating rod 24, a pneumatic rotating plate 25, a first bevel gear 26, a side adsorption pipe 27 and an air flow hole 28, the adsorption pipe 21 is fixedly connected to the side wall of the suction nozzle assembly 14, the positive adsorption block 22 is fixedly installed at the bottom end of the adsorption pipe 21, the two side adsorption blocks 23 are installed on the side wall of the positive adsorption block 22, the first rotating rod 24 is rotatably installed on the inner side wall of the positive adsorption block 22, the pneumatic rotating plate 25 is installed on the side wall of the first rotating rod 24, the first bevel gear 26 is installed on the side wall of the first rotating rod 24, there is no contact between the first bevel gear 26 and the pneumatic rotating plate 25, the side adsorption pipe 27 is fixedly connected to the side wall of the side adsorption block 23, and the air flow hole 28 is opened on the side wall of the side adsorption pipe 27 near the bottom end.

[0039] The present invention is further described in detail: the driving component 3 includes a second rotating rod 31, a second bevel gear 32, a limiting ring 33, a driving rope 34 and an air pressure block 35. The second rotating rod 31 is rotatably connected to the side wall of the side adsorption block 23, the second bevel gear 32 is installed on the side wall of the side adsorption block 23, and two limiting rings 33 are installed on the side wall of the second rotating rod 31. One end of the driving rope 34 is fixedly connected to the side wall of the second rotating rod 31, the air pressure block 35 is slidably connected to the side adsorption tube 27, and the top of the air pressure block 35 is fixedly connected to the other end of the driving rope 34.

[0040] The present invention is further described in detail: the stabilizing component 4 includes a stabilizing spring 41, a stabilizing plate 42, a buffer block 43, a limiting slide 44, a slider 45 and 46, a plurality of stabilizing springs 41 are fixedly installed on the side wall of the positive adsorption block 22, the top side wall of the stabilizing plate 42 is fixedly connected to the other end of the plurality of stabilizing springs 41, the buffer block 43 is fixedly connected to the bottom side wall of the stabilizing plate 42, the limiting slide 44 is fixedly installed on the side wall of the positive adsorption block 22, the slider 45 is fixedly installed on the side wall of the stabilizing plate 42, the slider 45 is slidably connected to the limiting slide 44, and 46 is installed on the side wall of the stabilizing plate 42 at one end close to the positive adsorption block 22.

[0041] The present invention is further described in detail: the adsorption tube 21 is connected to the ventilation tube 13, an air pump is arranged inside one end of the patch suction plate 12 close to the patch suction plate slide rod 11, and the other end of the ventilation tube 13 is connected to the air pump installed inside the patch suction plate 12.

[0042] The present invention is further described in detail: the two side adsorption blocks 23 are symmetrically arranged about the cross-sectional center axis of the positive adsorption block 22, and the plane where the bottom end of the side adsorption tube 27 is located is located on the same horizontal plane as the plane where the bottom ends of the suction nozzle assembly block 14 and the positive adsorption block 22 are located.

[0043] The present invention is further described in detail: the air flow hole 28 is set with a one-way valve port structure, the one-way valve port of the air flow hole 28 points from the external environment to the inside of the side adsorption tube 27, and the bottom end of the side adsorption tube 27 is a conductive structure.

[0044] The present invention is further described in detail: the height of the side adsorption tube 27 is set to be greater than the height of the air pressure block 35, the side wall of the air pressure block 35 is tightly fitted with the side wall of the side adsorption tube 27, the air pressure block 35 will not be separated from the side adsorption tube 27 when sliding, and the second bevel gear 32 is meshed with the first bevel gear 26.

[0045] The present invention is further described in detail: the two side adsorption blocks 23 are symmetrically arranged about the central axis of the side wall cross section of the stabilizing plate 42, and 46 penetrates the side wall of the positive adsorption block 22 and is fixedly connected to the bottom end of the pneumatic rotating plate 25.

[0046] The present invention is further described in detail: the plane where the bottom end of the stabilizing plate 42 is located is located at the lower end of the plane where the positive adsorption block 22 is located, and the limiting slide plate 44 performs sliding limiting on the sliding block 45.

[0047] The benefits of the present invention are described below:

[0048] The running parts of this device are all made of light materials.

[0049] according to Figure 1 and 2 It can be seen that when the chip mounter 1 is working, the chip mount suction plate 12 starts to perform the chip mount operation, the vacuum pump inside the chip mount suction plate 12 starts to work, and air begins to flow in the ventilation pipe 13;

[0050] According to Figure 5 It can be seen from the disassembled structure that the components in the adsorption mechanism 2 perform the patch adsorption work before the patch;

[0051] according to Figure 6 and 8 It can be seen that the ventilation pipe 13 and the adsorption pipe 21 are in a conducting state. At this time, the internal suction airflow inside the adsorption pipe 21 causes the patch to be adsorbed on the bottom end of the positive adsorption block 22. At this time, the internal suction airflow drives the pneumatic rotating plate 25 to rotate, and the first bevel gear 26 coaxially connected to the pneumatic rotating plate 25 rotates at the same time;

[0052] according to Fig.10It can be known that the second bevel gear 32 meshing with the first bevel gear 26 drives the guide rope 34 to perform the bundling process. At this time, the air pressure block 35 is pulled back. Since the side adsorption tube 27 and the bottom end plane of the positive adsorption block 22 are located on the same plane, during the process of the air pressure block 35 pulling back, the bottom end of the side adsorption tube 27 re-adsorbs the patch by utilizing the principle of piston movement. At the same time, in order to avoid damage to the patch due to excessive air pressure when the air pressure block 35 is pulled back during this adsorption process, an air flow hole 28 is provided. When the suction force reaches a certain threshold, external air bleed treatment is performed.

[0053] according to Figure 8 and Fig. 9 It can be seen that as the pneumatic rotating plate 25 rotates upward, 46 drives the stabilizing plate 42 to pull back. Since the plane where the bottom end of the stabilizing plate 42 is located is below the plane where the bottom end of the positive adsorption block 22 is located, adsorption is given priority during the adsorption process. As the pneumatic rotating plate 25 rotates, the stabilizing plate 42 clamps, stabilizes and limits the patch, and the anti-dislocation work during the patch installation process is realized by the role of limiting.

[0054] When the adsorption is completed, when the patch suction plate 12 moves to the board to be patched, the suction of the vacuum pump inside the patch suction plate 12 stops, the suction force at the mouth of the positive adsorption block 22 disappears, and the pneumatic rotating plate 25 rotates and resets under the action of its own gravity, and in this process, the guide rope 34 begins to relax, and the air pressure block 35 slides down and resets under the action of its own gravity, and in this process, the patch is pressed by the internal air pressure, so that the patch and the board are bonded. Since the setting height of the air pressure block 35 is lower than the setting height of the side adsorption tube 27, the patch will not be hit and damaged during the sliding process;

[0055] According to the contents described in the article, the present invention realizes the secondary adsorption function of the patch and the pneumatic extrusion patch work through the cooperation of the adsorption mechanism 2 and the driving component 3, utilizing the air pressure driving force and the gravity of the air pressure block 35. In addition, through the cooperation between the adsorption mechanism 2 and the stabilizing component 4, the air pressure is utilized to realize the stabilization work and anti-dislocation function of the patch during the adsorption process.

[0056] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. An LED chip mounter with a stable chip mounting mechanism, characterized in that: include: A patch suction plate slide bar (11) is slidably mounted inside the patch suction plate slide bar (11), two patch suction plates (12) are slidably mounted on the side wall of the patch suction plate slide bar (11), ventilation pipes (13) are fixedly mounted on the side walls of the two patch suction plates (12), a suction nozzle assembly (14) is fixedly mounted on the bottom end of the patch suction plate (12), an adsorption mechanism (2) is fixedly mounted inside the suction nozzle assembly (14), and the adsorption mechanism (2) is used to stably adsorb the patch and air pressure mounting function; a driving component (3), the driving component (3) being arranged inside the adsorption mechanism (2), the driving component (3) being used to provide driving force for the adsorption mechanism (2) to perform stable adsorption and air pressure mounting; a stabilizing component (4), the stabilizing component (4) being installed on the side wall of the adsorption mechanism (2), the stabilizing component (4) being used to perform the function of re-stabilizing and position correction of the patch when the patch is adsorbed; the adsorption mechanism (2) comprising an adsorption passage (21) , a positive adsorption block (22), a side adsorption block (23), a first rotating rod (24), a pneumatic rotating plate (25), a first bevel gear (26), a side adsorption tube (27) and an air flow hole (28), the adsorption tube (21) is fixedly connected to the side wall of the suction nozzle assembly block (14), the positive adsorption block (22) is fixedly installed at the bottom end of the adsorption tube (21), the two side adsorption blocks (23) are installed on the side wall of the positive adsorption block (22), and the first rotating rod (24) is rotated The pneumatic rotating plate (25) is installed on the inner side wall of the positive adsorption block (22), the first bevel gear (26) is installed on the side wall of the first rotating rod (24), and the first bevel gear (26) is installed on the side wall of the first rotating rod (24). There is no contact between the first bevel gear (26) and the pneumatic rotating plate (25). The side adsorption tube (27) is fixedly connected to the side wall of the side adsorption block (23), and the air flow hole (28) is opened on the side wall of the side adsorption tube (27) near the bottom end.

2. The LED chip mounter with a stable chip mounting mechanism according to claim 1, characterized in that: The driving assembly (3) includes a second rotating rod (31), a second bevel gear (32), a limiting ring (33), a driving rope (34) and an air pressure block (35); the second rotating rod (31) is rotationally connected to the side wall of the side adsorption block (23); the second bevel gear (32) is installed on the side wall of the side adsorption block (23); the two limiting rings (33) are installed on the side wall of the second rotating rod (31); one end of the driving rope (34) is fixedly connected to the side wall of the second rotating rod (31); the air pressure block (35) is slidably connected to the side adsorption tube (27); and the top end of the air pressure block (35) is fixedly connected to the other end of the driving rope (34).

3. The LED chip mounter with a stable chip mount mechanism according to claim 2, characterized in that: The stabilizing assembly (4) includes a stabilizing spring (41), a stabilizing plate (42), a buffer block (43), a limiting slide plate (44), a slider (45) and a slider (46). The plurality of stabilizing springs (41) are fixedly mounted on the side wall of the positive adsorption block (22). The top side wall of the stabilizing plate (42) is fixedly connected to the other end of the plurality of stabilizing springs (41). The buffer block (43) is fixedly connected to the bottom side wall of the stabilizing plate (42). The limiting slide plate (44) is fixedly mounted on the side wall of the positive adsorption block (22). The slider (45) is fixedly mounted on the side wall of the stabilizing plate (42). The slider (45) is slidably connected to the limiting slide plate (44). The slider (46) is mounted on the side wall of one end of the stabilizing plate (42) close to the positive adsorption block (22).

4. The LED chip mounter with a stable chip mount mechanism according to claim 1, characterized in that: The adsorption passage (21) is connected to the ventilation pipe (13); an air pump is provided inside one end of the patch suction plate (12) close to the patch suction plate sliding rod (11); and the other end of the ventilation pipe (13) is connected to the air pump installed inside the patch suction plate (12).

5. The LED chip mounter with a stable chip mount mechanism according to claim 1, characterized in that: The two side adsorption blocks (23) are symmetrically arranged about the cross-sectional center axis of the positive adsorption block (22), and the plane where the bottom end of the side adsorption tube (27) is located is located on the same horizontal plane as the plane where the bottom ends of the suction nozzle assembly block (14) and the positive adsorption block (22) are located.

6. The LED chip mounter with a stable chip mount mechanism according to claim 2, characterized in that: The air flow hole (28) is arranged with a one-way valve port structure, the one-way valve port of the air flow hole (28) points from the external environment to the inside of the side adsorption tube (27), and the bottom end of the side adsorption tube (27) is a conducting structure.

7. The LED chip mounter with a stable chip mount mechanism according to claim 2, characterized in that: The height of the side adsorption tube (27) is greater than the height of the air pressure block (35), the side wall of the air pressure block (35) is tightly fitted with the side wall of the side adsorption tube (27), the air pressure block (35) will not be separated from the side adsorption tube (27) when sliding, and the second bevel gear (32) is meshed with the first bevel gear (26).

8. The LED chip mounter with a stable chip mount mechanism according to claim 3, characterized in that: The two side adsorption blocks (23) are symmetrically arranged about the central axis of the side wall section of the stabilizing plate (42), and the sliding block (46) penetrates the side wall of the positive adsorption block (22) and is fixedly connected to the bottom end of the pneumatic rotating plate (25).

9. The LED chip mounter with a stable chip mounting mechanism according to claim 3, characterized in that: The plane where the bottom end of the stabilizing plate (42) is located is located at the lower end of the plane where the positive adsorption block (22) is located, and the limiting slide plate (44) performs sliding limiting on the sliding block (45).

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