An electrical connection defect diagnosis system for inductive capacitors

Abstract

The present invention relates to the technical field of electrical connection diagnosis, and is used to solve the problem that the existing method for diagnosing electrical connection defects of various electronic circuits in inductive electrical equipment is one-sided and erroneous, so it is impossible to clearly diagnose whether the electrical connection has defects, and the normal operation of the touch sensing electrical equipment cannot be guaranteed, which greatly hinders the development of the inductive capacitor industry. In particular, an electrical connection defect diagnosis system applied to the inductive capacitor is disclosed, including a data acquisition unit, a primary defect analysis unit, a secondary defect analysis unit, an external defect analysis unit, a comprehensive diagnosis unit, an early warning feedback unit and a display terminal; the present invention performs a comprehensive diagnosis of the defects of the electrical connection of the electronic circuit from different levels, thereby improving the comprehensiveness and accuracy of the electrical connection diagnosis method, while also ensuring the normal operation of the inductive electrical equipment, and promoting the development of the inductive capacitor industry.

Description

Technical Field

[0001] The present invention relates to the technical field of electrical connection diagnosis, and in particular to an electrical connection defect diagnosis system applied to an inductive capacitor. Background Art

[0002] The interaction between two conductors will generate inductive capacitance, and the inductive capacitance principle is widely used in various touch sensing electrical devices. In order to ensure the stability of the operation of touch sensing electrical devices, it is very important to ensure the stability of the electrical connection of each electronic circuit in the touch sensing electrical devices.

[0003] However, in the existing diagnosis of electrical connection defects of various electronic circuits in the inductive electrical equipment, most of them are performed by monitoring the single operation data of the electronic circuit for diagnostic feedback. The method of diagnosing the electrical connection defects of the electronic circuit is one-sided and erroneous, so it is impossible to clearly diagnose whether the electrical connection has defects, and it is impossible to ensure the normal operation of the touch sensing electrical equipment, which greatly hinders the development of the inductive capacitor industry;

[0004] In order to solve the above defects, a technical solution is now provided. Summary of the invention

[0005] The purpose of the present invention is to solve the problem that the existing defect diagnosis method for electrical connection defects of various electronic circuits in inductive electrical equipment is one-sided and erroneous, so it is impossible to clearly diagnose whether the electrical connection has defects, and the normal operation of the touch sensing electrical equipment cannot be guaranteed, which greatly hinders the development of the inductive capacitor industry. Dynamic analysis and model analysis methods are used to accurately diagnose and analyze the defect state of the electrical connection of the electronic circuit from the internal operating state level and the external environmental factor level. Data integration is used to achieve a comprehensive diagnosis of the electrical connection defects of the electronic circuit, thereby improving the comprehensiveness and accuracy of the electrical connection diagnosis method, ensuring the stability of the electrical connection of the electronic circuit, and promoting the development of the inductive capacitor industry. A system for diagnosing electrical connection defects applied to inductive capacitors is proposed.

[0006] The purpose of the present invention can be achieved through the following technical solutions:

[0007] An electrical connection defect diagnosis system applied to an inductive capacitor includes a data acquisition unit, a primary defect analysis unit, a secondary defect analysis unit, an external defect analysis unit, a comprehensive diagnosis unit, an early warning feedback unit and a display terminal;

[0008] The data acquisition unit is used to collect internal defect state information and external influencing factor information of the electronic circuit in the inductive capacitor environment, and send the internal defect state information of the electronic circuit to the primary defect analysis unit and the secondary defect analysis unit respectively, and send the external influencing factor information to the external defect analysis unit;

[0009] The primary defect analysis unit is used to receive the internal defect status information of the electronic circuit in the inductive capacitor environment, and perform dynamic monitoring and analysis processing, thereby generating a thermal stability signal, a slight thermal fluctuation signal and a large thermal fluctuation signal, and sending them all to the comprehensive diagnosis unit;

[0010] The secondary defect analysis unit is used to receive the internal defect state information of the electronic circuit in the inductive capacitor environment to perform interference factor analysis and processing, thereby generating a slight internal interference signal, a general internal interference signal and a serious internal interference signal, and sending them all to the comprehensive diagnosis unit;

[0011] The external defect analysis unit is used to receive information about external influencing factors of the electronic circuit in the inductive capacitor environment and perform environmental data analysis and processing, thereby generating an external influence abnormal signal and an external influence normal signal, and sending them to the comprehensive diagnosis unit;

[0012] The comprehensive diagnosis unit is used to receive various types of judgment signals of the electronic circuit, and perform score determination and judgment analysis processing, thereby generating an overall excellent stability signal, an overall medium stability signal and an overall poor stability signal, and sending them all to the early warning feedback unit;

[0013] The early warning feedback unit is used to receive stability judgment signals of various levels, and perform early warning analysis and processing accordingly, and generate a first-level defect early warning signal, a second-level defect early warning signal and a third-level defect early warning signal, and send them all to the display terminal in the form of text descriptions for warning instructions.

[0014] Furthermore, the specific operation steps of dynamic monitoring and analysis are as follows:

[0015] Obtain the water vapor value and dust value in the internal defect status information of the electronic circuit per unit time in real time, and calibrate them into sql i 、hcl i And, and normalize them for analysis, according to the formula The additional resistivity dzx is obtained, where e1 and e2 are weighting factors of water vapor value and floating dust value, respectively, and e1>e2>0, e1+e2=1.0391;

[0016] Capture the additional resistance coefficient generated in the inductive capacitance environment per unit time, and use time as the horizontal coordinate and the additional resistance coefficient value as the vertical coordinate to establish a two-dimensional dynamic rectangular coordinate system, and plot the additional resistance coefficient per unit time on the two-dimensional dynamic rectangular coordinate system by plotting points;

[0017] The upper and lower resistance values ​​of the additional resistance coefficient are set, and the upper and lower resistance values ​​are plotted on a two-dimensional dynamic rectangular coordinate system, and the upper and lower reference lines are obtained, and the model data analysis and processing are performed based on this, thereby generating thermal stability signals, slight thermal fluctuation signals, and large thermal fluctuation signals.

[0018] Furthermore, the specific operation steps of the model data analysis and processing are as follows:

[0019] When all the plotted points on the two-dimensional dynamic rectangular coordinate system within a unit time are between the upper limit reference line and the lower limit reference line, a thermal stability signal is generated; when the plotted points on the two-dimensional dynamic rectangular coordinate system within a unit time are above the upper limit reference line and below the lower limit reference line, a depth analysis instruction is generated;

[0020] According to the depth analysis instruction, the total number of additional resistivity values ​​of the effective construction of the two-dimensional dynamic rectangular coordinate system in unit time is obtained, and it is calibrated as sum1, and the total number of points above the upper limit reference line and below the lower limit reference line in the two-dimensional dynamic rectangular coordinate system is counted, and it is calibrated as sum2;

[0021] Perform division analysis on sum1 and sum2, according to the formula Calculate the out-of-circle coefficient qux, set the comparison percentage value pct of the out-of-circle coefficient, if qux≤pct, a slight thermal fluctuation signal is generated, if qux>pct, a large thermal fluctuation signal is generated.

[0022] Further, the specific steps of interference factor analysis and processing are as follows:

[0023] The distance value and stray value in the internal defect state information of the electronic circuit in the inductive capacitance environment are obtained in real time, and are calibrated as dist and zsl, and then normalized and analyzed. According to the formula drx=f1*dist+f2*zsl, the additional capacitance coefficient drx is obtained, where f1 and f2 are the correction factor coefficients of the distance value and the stray value, respectively, and f1>f2>0, and f1+f2=1.021;

[0024] The additional capacitance coefficient drx is compared and analyzed with the preset comparison thresholds Yu1 and Yu2. When the additional capacitance coefficient drx ≤ comparison threshold Yu1, a slight internal interference signal is generated. When the comparison threshold Yu1 < additional capacitance coefficient < comparison threshold Yu2, a general internal interference signal is generated. When the additional capacitance coefficient ≥ comparison threshold Yu2, a serious internal interference signal is generated.

[0025] Furthermore, the specific operation steps of environmental data analysis and processing are as follows:

[0026] Real-time acquisition of humidity value, temperature value and activity value in the external influencing factor information of the electronic circuit in the inductive capacitor environment per unit time, and calibrate them as SDL i 、wdl i and hul i , and analyze it in a formula, according to the formula Obtain the external interference coefficient grx i , where k1, k2 and k3 are weighting factor coefficients of humidity value, temperature value and activity value respectively, and k1>k2>k3>0, k1+k2+k3=10.375;

[0027] The external interference coefficient grx i Substitute the preset environmental interference range value Fa1, when the external interference coefficient grx i When the environmental interference coefficient is within the range Fa1, the external interference normal signal is generated. On the contrary, when the external interference coefficient grx i When it is outside the environmental interference range value Fa1, an external influence abnormal signal is generated.

[0028] Furthermore, the specific operation steps of the score assessment, judgment and analysis process are as follows:

[0029] At the same time, the internal operation type determination signal, the internal environment type determination signal and the external environment type determination signal of the electronic circuit are obtained, and data assignment calibration analysis processing is performed on them respectively, thereby generating data assignments a1, a2 and a3 of the internal operation type determination signal, data assignments b1, b2 and b3 of the internal environment type determination signal, and data assignments c1 and c2 of the external environment type determination signal, and according to the data assignment symbols calibrated by each type of determination signal, one data assignment symbol calibrated by each type is simultaneously extracted for integrated analysis;

[0030] If the data extracted at the same time are assigned symbols a1, b1 and c2 respectively, an overall excellent stable signal is generated. If the data extracted at the same time are assigned symbols a3, b3 and c1 respectively, an overall poor stable signal is generated. In other cases, an overall medium stable signal is generated.

[0031] Furthermore, the specific operation steps of data assignment calibration analysis and processing are as follows:

[0032] At the same time, the internal operation type determination signal, the internal environment type determination signal and the external environment type determination signal of the electronic circuit are obtained, and the thermal stability signal, the slight thermal fluctuation signal and the large thermal fluctuation signal in the internal operation type determination signal are assigned to a1, a2 and a3 respectively;

[0033] The internal interference slight signal, the internal interference general signal and the internal interference severe signal in the internal environment type determination signal are assigned values ​​of b1, b2 and b3 respectively, wherein the performance values ​​of a1, a2 and a3 and the performance values ​​of b1, b2 and b3 all decrease in a gradient manner;

[0034] The external influence abnormal signal and the external influence normal signal in the external environment type determination signal are assigned c1 and c2 respectively, wherein the performance values ​​of c1 and c2 increase in a gradient.

[0035] Furthermore, the specific steps of early warning analysis and processing are as follows:

[0036] When the overall differential stability signal is received, a first-level defect warning signal is generated accordingly, and sent to the display terminal in the form of a text description of "the electrical connection of the electronic circuit used in the inductive capacitor environment is relatively unstable, a major defect problem is diagnosed, and maintenance processing is urgently needed";

[0037] When the overall intermediate stability signal is received, a secondary defect warning signal is generated accordingly and sent to the display terminal in the form of a text description of "the electrical connection of the electronic circuit used in the inductive capacitor environment is generally unstable, a minor defect problem is diagnosed, and maintenance processing is required";

[0038] When an overall excellent stability signal is received, a third-level defect warning signal is generated and sent to the display terminal with a text description such as "the electrical connection of the electronic circuit used in the inductive capacitor environment is relatively stable, no obvious defect problems are diagnosed, and no maintenance is required."

[0039] Compared with the prior art, the present invention has the following beneficial effects:

[0040] (1) The present invention uses normalized analysis, dynamic model building and data analysis to accurately diagnose and analyze the electrical connection state of the electronic circuit from a dynamic analysis level, and uses symbolic calibration and threshold substitution comparative analysis to accurately diagnose and analyze the electrical connection defect state of the electronic circuit from the internal operation state level. While clearly diagnosing the electrical connection defect state of the electronic circuit, it also further improves the normal operation of the touch sensing electrical device;

[0041] (2) The present invention uses symbolic calibration, formulaic processing and signal output to clearly diagnose and analyze the defects of the electrical connection of the electronic circuit from the perspective of external environmental factors, thereby further determining and analyzing the defects of the electrical connection of the electronic circuit and improving the comprehensiveness and accuracy of the electrical connection diagnosis method;

[0042] (3) The present invention utilizes data symbol assignment and integrated analysis to integrate the judgment signals of multiple levels of electronic circuit electrical connection defect diagnosis and analysis, thereby achieving a comprehensive diagnosis of electronic circuit electrical connection defects, ensuring the stability of the electronic circuit electrical connection, and promoting the development of the inductive capacitor industry. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to facilitate understanding by those skilled in the art, the present invention is further described below in conjunction with the accompanying drawings;

[0044] Figure 1 This is the overall system block diagram of the present invention. DETAILED DESCRIPTION

[0045] The technical solution of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0046] Embodiment 1:

[0047] like Figure 1 As shown, an electrical connection defect diagnosis system applied to an inductive capacitor includes a data acquisition unit, a primary defect analysis unit, a secondary defect analysis unit, an external defect analysis unit, a comprehensive diagnosis unit, an early warning feedback unit and a display terminal;

[0048] The data acquisition unit is used to collect internal defect state information and external influencing factor information of the electronic circuit in the inductive capacitor environment, and send the internal defect state information of the electronic circuit to the primary defect analysis unit and the secondary defect analysis unit respectively;

[0049] When the primary defect analysis unit receives the internal defect status information of the electronic circuit in the inductive capacitor environment, it performs dynamic monitoring and analysis based on the information. The specific operation process is as follows:

[0050] Obtain the water vapor value and dust value in the internal defect status information of the electronic circuit per unit time in real time, and calibrate them into sql i 、hcl iAnd, and normalize them for analysis, according to the formula The additional resistivity dzx is obtained, where e1 and e2 are weight factors of the water vapor value and the floating dust value, respectively, and e1>e2>0, e1+e2=1.0391, where i is a positive integer greater than or equal to 1, and i represents each sub-unit time within a unit time, and the weight factor coefficient is used to balance the weight of each data in the formula calculation, thereby promoting the accuracy of the calculation result;

[0051] It should be pointed out that the water vapor value refers to the data value of the liquid content on the surface of the electrical connection of the electronic circuit, and the floating dust value refers to the data value of the dust accumulation contained in the electrical connection part of the electronic circuit used in the field of inductive capacitance;

[0052] Capture the additional resistance coefficient generated in the inductive capacitance environment per unit time, and use time as the horizontal coordinate and the additional resistance coefficient value as the vertical coordinate to establish a two-dimensional dynamic rectangular coordinate system, and plot the additional resistance coefficient per unit time on the two-dimensional dynamic rectangular coordinate system by plotting points;

[0053] The upper and lower resistance values ​​of the additional resistance coefficient are set, and the upper and lower resistance values ​​are plotted on a two-dimensional dynamic rectangular coordinate system, and the upper and lower reference lines are obtained, and the model data analysis and processing are performed based on them. The specific operation process is as follows:

[0054] When all the plotted points on the two-dimensional dynamic rectangular coordinate system within a unit time are between the upper limit reference line and the lower limit reference line, a thermal stability signal is generated; when the plotted points on the two-dimensional dynamic rectangular coordinate system within a unit time are above the upper limit reference line and below the lower limit reference line, a depth analysis instruction is generated;

[0055] It should be noted that the upper resistance value refers to the maximum controllable additional resistance value generated by the electronic circuit, and the lower resistance value refers to the minimum controllable additional resistance value generated by the electronic circuit. Therefore, the upper resistance value is greater than the lower resistance value, and the upper reference line is located above the lower reference line in the two-dimensional dynamic rectangular coordinate system.

[0056] According to the depth analysis instruction, the total number of additional resistivity values ​​of the effective construction of the two-dimensional dynamic rectangular coordinate system in unit time is obtained, and it is calibrated as sum1, and the total number of points above the upper limit reference line and below the lower limit reference line in the two-dimensional dynamic rectangular coordinate system is counted, and it is calibrated as sum2;

[0057] Perform division analysis on sum1 and sum2, according to the formula Calculate the out-of-circle coefficient qux, set the comparison percentage value pct of the out-of-circle coefficient, if qux≤pct, a slight thermal fluctuation signal is generated, if qux>pct, a large thermal fluctuation signal is generated;

[0058] The generated thermal stability signal, slight thermal fluctuation signal and large thermal fluctuation signal are all sent to the comprehensive diagnosis unit;

[0059] It should also be pointed out that the slight thermal fluctuation signal refers to the trend of the additional resistance generated when the electronic circuit is running tends to be stable. The slight thermal fluctuation signal is used to indicate that the trend of the additional resistance generated when the electronic circuit is running has slight fluctuations, while the large thermal fluctuation signal is used to indicate that the trend of the additional resistance generated when the electronic circuit is running has large fluctuations. When the trend of the additional resistance generated when the electronic circuit is running tends to be more stable, it is more conducive to the stability of the electrical connection of the electronic circuit. On the contrary, it is more unfavorable to the stability of the electrical connection.

[0060] When the secondary defect analysis unit receives the internal defect status information of the electronic circuit in the inductive capacitor environment, it performs interference factor analysis and processing accordingly. The specific operation process is as follows:

[0061] The distance value and stray value in the internal defect state information of the electronic circuit in the inductive capacitance environment are obtained in real time, and are calibrated as dist and zsl, and are normalized and analyzed. According to the formula drx=f1*dist+f2*zsl, the additional capacitance coefficient drx is obtained, where f1 and f2 are the correction factor coefficients of the distance value and the stray value, respectively, and f1>f2>0, and f1+f2=1.021. The correction factor coefficient is used to correct the deviation of various parameters in the formula calculation process, so as to make the calculation more accurate and the parameter data;

[0062] It should be pointed out that the distance value refers to the data value of the distance between the connecting conductors in the electronic circuit. When the distance value is larger, it means that the distance between the connecting conductors in the electronic circuit is larger, and the larger the distance, the lower the stability of the electrical connection between the conductors. The stray value refers to the data value of the stray parasitic capacitance generated when the electronic circuit is running in the inductive capacitance environment. When the stray value is larger, it means that the number of parasitic capacitances scattered in the electronic circuit is larger. When the number of parasitic capacitances generated is larger, it will cause stray oscillation, which seriously affects the stability of the electrical connection of the electronic circuit.

[0063] It should also be pointed out that the larger the value of the additional capacitance coefficient is, the greater the impact on the stability of the electrical connection of the electronic circuit is;

[0064] The additional capacitance coefficient drx is compared and analyzed with the preset comparison thresholds Yu1 and Yu2. When the additional capacitance coefficient drx ≤ the comparison threshold Yu1, a slight internal interference signal is generated. When the comparison threshold Yu1 < additional capacitance coefficient < comparison threshold Yu2, a general internal interference signal is generated. When the additional capacitance coefficient ≥ the comparison threshold Yu2, a serious internal interference signal is generated.

[0065] The generated internal interference slight signal, internal interference normal signal and internal interference severe signal are all sent to the comprehensive diagnosis unit;

[0066] Embodiment 2:

[0067] like Figure 1 As shown, the data acquisition unit is used to collect the external influencing factor information of the electronic circuit in the inductive capacitance environment, and send the external influencing factor information to the external defect analysis unit;

[0068] When the external defect analysis unit is used to receive the external influencing factor information of the electronic circuit in the inductive capacitor environment and perform environmental data analysis and processing accordingly, the specific operation process is as follows:

[0069] Real-time acquisition of humidity value, temperature value and activity value in the external influencing factor information of the electronic circuit in the inductive capacitor environment per unit time, and calibrate them as SDL i 、wdl i and hul i , and analyze it in a formula, according to the formula Obtain the external interference coefficient grx i , where k1, k2 and k3 are weighting factor coefficients of humidity value, temperature value and activity value respectively, and k1>k2>k3>0, k1+k2+k3=10.375;

[0070] It should be noted that the external environment information refers to a type of data information of the external environment in which the electronic circuit in the inductive capacitor environment application is located, the humidity value refers to the data value of the air humidity in the environment in which the electronic circuit in the inductive capacitor environment application is located, the temperature value refers to the data value of the temperature of the environment in which the electronic circuit in the inductive capacitor environment application is located, and the activity value refers to the data value of the content of active gas in the environment in which the electronic circuit is located;

[0071] The external interference coefficient grx i Substitute the preset environmental interference range value Fa1, when the external interference coefficient grx i When the environmental interference coefficient is within the range Fa1, the external interference normal signal is generated. On the contrary, when the external interference coefficient grx i When it is outside the environmental interference range value Fa1, an external influence abnormal signal is generated;

[0072] sending the generated external influence abnormal signal and external influence normal signal to the comprehensive diagnosis unit;

[0073] When the comprehensive diagnosis unit receives the internal operation type judgment signal, internal environment type judgment signal and external environment type judgment signal of the electronic circuit, it performs score assessment, judgment and analysis processing accordingly. The specific operation process is as follows:

[0074] At the same time, the internal operation type determination signal, internal environment type determination signal and external environment type determination signal of the electronic circuit are obtained, and data assignment calibration and analysis are performed on them respectively. The specific operation process is as follows:

[0075] At the same time, the internal operation type determination signal, the internal environment type determination signal and the external environment type determination signal of the electronic circuit are obtained, and the thermal stability signal, the slight thermal fluctuation signal and the large thermal fluctuation signal in the internal operation type determination signal are assigned to a1, a2 and a3 respectively;

[0076] The internal interference slight signal, the internal interference general signal and the internal interference severe signal in the internal environment type determination signal are assigned values ​​of b1, b2 and b3 respectively, wherein the performance values ​​of a1, a2 and a3 and the performance values ​​of b1, b2 and b3 all decrease in a gradient manner;

[0077] The external influence abnormal signal and the external influence normal signal in the external environment type determination signal are assigned values ​​of c1 and c2 respectively, wherein the performance values ​​of c1 and c2 increase in a gradient manner;

[0078] Determine the data assignment symbol of the signal calibration according to each type, and extract one data assignment symbol from each type of calibration for integrated analysis;

[0079] If the symbols of the data extracted at the same time are a1, b1 and c2 respectively, an overall excellent stable signal is generated; if the symbols of the data extracted at the same time are a3, b3 and c1 respectively, an overall poor stable signal is generated; in other cases, an overall medium stable signal is generated;

[0080] The generated overall excellent stability signal, overall medium stability signal and overall poor stability signal are all sent to the early warning feedback unit;

[0081] When the early warning feedback unit receives the overall excellent stability signal, the overall medium stability signal and the overall poor stability signal, it performs early warning analysis and processing accordingly. The specific operation process is as follows:

[0082] When the overall differential stability signal is received, a first-level defect warning signal is generated accordingly, and sent to the display terminal in the form of a text description of "the electrical connection of the electronic circuit used in the inductive capacitor environment is relatively unstable, a major defect problem is diagnosed, and maintenance processing is urgently needed";

[0083] When the overall intermediate stability signal is received, a secondary defect warning signal is generated accordingly and sent to the display terminal in the form of a text description of "the electrical connection of the electronic circuit used in the inductive capacitor environment is generally unstable, a minor defect problem is diagnosed, and maintenance processing is required";

[0084] When an overall excellent stability signal is received, a third-level defect warning signal is generated and sent to the display terminal with a text description such as "the electrical connection of the electronic circuit used in the inductive capacitor environment is relatively stable, no obvious defect problems are diagnosed, and no maintenance is required."

[0085] The above formulas are obtained by collecting a large amount of data and performing software simulation, and a formula close to the actual value is selected. The coefficients in the formula are set by technicians in this field according to actual conditions;

[0086] Such as the formula:

[0087] A technician in this field collects multiple groups of sample data and sets corresponding weight factor coefficients for each group of sample data; substitutes the set weight factor coefficients and the collected sample data into the formula, any three formulas constitute a three-variable linear equation system, and the calculated coefficients are screened and averaged to obtain k1, k2 and k3 values ​​of 3.7548, 2.244 and 4.3762 respectively;

[0088] The size of the coefficient is to quantify each parameter to obtain a specific value for subsequent comparison. The size of the coefficient depends on the amount of sample data and the preliminary setting of the corresponding weight factor coefficient for each group of sample data by technical personnel in this field; as long as it does not affect the proportional relationship between the parameter and the quantized value.

[0089] When the present invention is used, the internal defect state information of the electronic circuit under the inductive capacitance environment is collected, and dynamic monitoring and analysis are performed. The normalized analysis, dynamic model establishment and data analysis are used to accurately diagnose and analyze the electrical connection state of the electronic circuit from the dynamic analysis level. The internal defect state information of the electronic circuit under the inductive capacitance environment is collected, and interference factor analysis is performed. The symbolic calibration and threshold substitution comparative analysis are used to accurately diagnose and analyze the defect state of the electrical connection from the internal operation state level of the electronic circuit. While clearly diagnosing the defect state of the electrical connection of the electronic circuit, the normal operation of the touch sensing electrical equipment is further improved.

[0090] By collecting information on external influencing factors of electronic circuits in an inductive capacitance environment and performing environmental data analysis and processing, and using symbolic calibration, formulaic processing, and signal output, a clear diagnosis and analysis of the defects of the electrical connection of the electronic circuit is performed from the perspective of external environmental factors. This further determines and analyzes the defects of the electrical connection of the electronic circuit, while also improving the comprehensiveness and accuracy of the electrical connection diagnosis method.

[0091] By using data symbol assignment and integrated analysis methods, the judgment signals of multiple levels of electronic circuit electrical connection defect diagnosis and analysis are integrated, thereby achieving a comprehensive diagnosis of electronic circuit electrical connection defects, ensuring the stability of the electronic circuit's electrical connection, and promoting the development of the inductive capacitor industry.

[0092] The preferred embodiments of the present invention disclosed above are only used to help explain the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to only specific implementation methods. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. An electrical connection defect diagnosis system for an inductive capacitor, characterized in that: It includes a data acquisition unit, a primary defect analysis unit, a secondary defect analysis unit, an external defect analysis unit, a comprehensive diagnosis unit, an early warning feedback unit and a display terminal; The data acquisition unit is used to collect internal defect state information and external influencing factor information of the electronic circuit in the inductive capacitor environment, and send the internal defect state information of the electronic circuit to the primary defect analysis unit and the secondary defect analysis unit respectively, and send the external influencing factor information to the external defect analysis unit; The primary defect analysis unit is used to receive the internal defect status information of the electronic circuit in the inductive capacitor environment, and perform dynamic monitoring and analysis processing, thereby generating a thermal stability signal, a slight thermal fluctuation signal and a large thermal fluctuation signal, and sending them all to the comprehensive diagnosis unit; The secondary defect analysis unit is used to perform interference factor analysis on the internal defect state information of the electronic circuit under the receiving inductive capacitor environment, thereby generating a slight internal interference signal, a general internal interference signal and a serious internal interference signal, and sending them to the comprehensive diagnosis unit; the specific operation steps of the interference factor analysis are as follows: Real-time acquisition of distance and stray values ​​in the internal defect state information of the electronic circuit in the inductive capacitance environment, and normalization analysis thereof to obtain the additional capacitance coefficient drx; The additional capacitance coefficient drx is compared and analyzed with the preset comparison thresholds Yu1 and Yu2. When the additional capacitance coefficient drx ≤ the comparison threshold Yu1, a slight internal interference signal is generated. When the comparison threshold Yu1 < additional capacitance coefficient < comparison threshold Yu2, a general internal interference signal is generated. When the additional capacitance coefficient ≥ the comparison threshold Yu2, a serious internal interference signal is generated. The external defect analysis unit is used to receive the external influencing factor information of the electronic circuit in the inductive capacitor environment and perform environmental data analysis and processing, thereby generating an external influence abnormal signal and an external influence normal signal, and sending them to the comprehensive diagnosis unit; the specific operation steps of the environmental data analysis and processing are as follows: Real-time acquisition of humidity value SDL in the external influencing factor information of electronic circuits in the inductive capacitor environment per unit time i , temperature value wdl i and activity value hul i , and analyze it in a formula, according to the formula , and obtain the external interference coefficient grx i , where k1, k2 and k3 are weighting factor coefficients of humidity value, temperature value and activity value respectively, and k1>k2>k3>0, k1+k2+k3=10.375; The external interference coefficient grx i Substitute the preset environmental interference range value Fa1, when the external interference coefficient grx i When the environmental interference coefficient is within the range Fa1, the external interference normal signal is generated. On the contrary, when the external interference coefficient grx i When it is outside the environmental interference range value Fa1, an external influence abnormal signal is generated; The comprehensive diagnosis unit is used to receive various types of judgment signals of the electronic circuit, and perform score determination and judgment analysis processing, thereby generating an overall excellent stability signal, an overall medium stability signal and an overall poor stability signal, and sending them all to the early warning feedback unit; The early warning feedback unit is used to receive stability judgment signals of various levels, and perform early warning analysis and processing accordingly, and generate a first-level defect early warning signal, a second-level defect early warning signal and a third-level defect early warning signal, and send them all to the display terminal in the form of text descriptions for warning instructions.

2. The electrical connection defect diagnosis system for inductive capacitors according to claim 1, characterized in that: The specific steps for dynamic monitoring, analysis and processing are as follows: Real-time acquisition of the water vapor value and the floating dust value in the internal defect state information of the electronic circuit per unit time, and normalization analysis thereof to obtain the additional resistivity; Capture the additional resistance coefficient generated in the inductive capacitance environment per unit time, and use time as the horizontal coordinate and the additional resistance coefficient value as the vertical coordinate to establish a two-dimensional dynamic rectangular coordinate system, and plot the additional resistance coefficient per unit time on the two-dimensional dynamic rectangular coordinate system by plotting points; The upper and lower resistance values ​​of the additional resistance coefficient are set, and the upper and lower resistance values ​​are plotted on a two-dimensional dynamic rectangular coordinate system, and the upper and lower reference lines are obtained, and the model data analysis and processing are performed based on this, thereby generating thermal stability signals, slight thermal fluctuation signals, and large thermal fluctuation signals.

3. The electrical connection defect diagnosis system for inductive capacitors according to claim 2, characterized in that: The specific steps for model data analysis and processing are as follows: When all the plotted points on the two-dimensional dynamic rectangular coordinate system within a unit time are between the upper limit reference line and the lower limit reference line, a thermal stability signal is generated; when the plotted points on the two-dimensional dynamic rectangular coordinate system within a unit time are above the upper limit reference line and below the lower limit reference line, a depth analysis instruction is generated; According to the depth analysis instruction, the total number of additional resistivity values ​​of the effective construction of the two-dimensional dynamic rectangular coordinate system in unit time is obtained, and it is calibrated as sum1, and the total number of points above the upper limit reference line and below the lower limit reference line in the two-dimensional dynamic rectangular coordinate system is counted, and it is calibrated as sum2; Divide sum1 and sum2 to calculate the out-of-circle coefficient qux, and set the comparison percentage value pct of the out-of-circle coefficient. If qux≤pct, a slight thermal fluctuation signal is generated. If qux>pct, a large thermal fluctuation signal is generated.

4. The electrical connection defect diagnosis system for inductive capacitors according to claim 1, characterized in that: The specific steps of score assessment, judgment and analysis are as follows: At the same time, the internal operation type determination signal, the internal environment type determination signal and the external environment type determination signal of the electronic circuit are obtained, and data assignment calibration analysis processing is performed on them respectively, thereby generating data assignments a1, a2 and a3 of the internal operation type determination signal, data assignments b1, b2 and b3 of the internal environment type determination signal, and data assignments c1 and c2 of the external environment type determination signal, and according to the data assignment symbols calibrated by each type of determination signal, one data assignment symbol calibrated by each type is simultaneously extracted for integrated analysis; If the data extracted at the same time are assigned symbols a1, b1 and c2 respectively, an overall excellent stable signal is generated. If the data extracted at the same time are assigned symbols a3, b3 and c1 respectively, an overall poor stable signal is generated. In other cases, an overall medium stable signal is generated.

5. The electrical connection defect diagnosis system for inductive capacitors according to claim 4, characterized in that: The specific steps for data assignment, calibration, analysis and processing are as follows: At the same time, the internal operation type determination signal, the internal environment type determination signal and the external environment type determination signal of the electronic circuit are obtained, and the thermal stability signal, the slight thermal fluctuation signal and the large thermal fluctuation signal in the internal operation type determination signal are assigned to a1, a2 and a3 respectively; The internal interference slight signal, the internal interference general signal and the internal interference severe signal in the internal environment type determination signal are assigned values ​​of b1, b2 and b3 respectively, wherein the performance values ​​of a1, a2 and a3 and the performance values ​​of b1, b2 and b3 all decrease in a gradient manner; The external influence abnormal signal and the external influence normal signal in the external environment type determination signal are assigned c1 and c2 respectively, wherein the performance values ​​of c1 and c2 increase in a gradient.

6. The electrical connection defect diagnosis system for inductive capacitors according to claim 1, characterized in that: The specific steps for early warning analysis and processing are as follows: When the overall differential stability signal is received, a first-level defect warning signal is generated accordingly, and sent to the display terminal in the form of a text description of "the electrical connection of the electronic circuit used in the inductive capacitor environment is relatively unstable, a major defect problem is diagnosed, and maintenance processing is urgently required"; When the overall intermediate stability signal is received, a secondary defect warning signal is generated accordingly and sent to the display terminal in the form of a text description of "the electrical connection of the electronic circuit used in the inductive capacitor environment is generally unstable, a minor defect problem is diagnosed, and maintenance processing is required"; When an overall excellent stability signal is received, a third-level defect warning signal is generated based on it and sent to the display terminal in the form of a text description of "the electrical connection of the electronic circuit used in the inductive capacitor environment is relatively stable, no obvious defect problems are diagnosed, and no maintenance is required."

Images