A surface patterning method

Abstract

This invention provides a surface patterning method, comprising the following steps: S1: Surface-treating a temporary substrate to create a hydrophobic layer on its surface; S2: Spin-coating a first polymer coating onto a target substrate; S3: Spin-coating a second polymer coating onto the temporary substrate; S4: Bonding the target substrate and the temporary substrate together, applying pressure and heating simultaneously and maintaining this process for a period of time, causing the first polymer coating on the target substrate and the second polymer coating on the temporary substrate to thermally fuse together; S5: After cooling, separating the target substrate from the temporary substrate. This surface patterning method uses thermal transfer printing to pattern arbitrary surfaces, minimizing damage to the microstructures on the temporary substrate and significantly extending its lifespan; it can pattern micro / nano patterns with high aspect ratios on the target substrate; the entire process, similar to nanoimprinting, is low-cost and suitable for large-scale application.

Description

Technical Field

[0001] The invention relates to the technical field of transfer printing, and in particular to a surface patterning method. Background Art

[0002] The common method of surface patterning is photolithography, which is a relatively expensive method. In addition, nanoimprinting is a more commonly used and less expensive surface patterning solution. However, in nanoimprinting, due to problems such as force during the imprinting process, filling large-area patterns and patterning high aspect ratio structures are two more difficult problems. Summary of the invention

[0003] The object of the present invention is to provide a surface patterning method for performing arbitrary surface treatment by thermal transfer printing.

[0004] The present invention provides a surface patterning method, comprising the following steps:

[0005] S1: performing surface treatment on a temporary substrate having a plurality of microstructures arranged in an array, so that a hydrophobic layer is formed on the surface of the temporary substrate;

[0006] S2: spin coating a first polymer coating on a target substrate and curing the first polymer coating;

[0007] S3: Spin-coating a second polymer coating on the temporary substrate so that the second polymer coating fills the gaps between adjacent microstructures, and then curing the second polymer coating;

[0008] S4: The surface of the target substrate having the first polymer coating is combined with the microstructure of the temporary substrate, and pressure and heating are applied and maintained for a period of time, so that the first polymer coating of the target substrate and the second polymer coating of the temporary substrate are thermally melted together;

[0009] S5: After cooling, the target substrate is separated from the temporary substrate, that is, the microstructure of the temporary substrate is transferred to the target substrate.

[0010] Preferably, the temporary substrate is made of Si.

[0011] Preferably, the microstructure on the temporary substrate is formed by deposition, development and exposure.

[0012] Preferably, the coating material for the surface treatment in step S1 is FDTS or PDMS or a combination of FDTS and PDMS, wherein FDTS is perfluorododecyltrichlorosilane and PDMS is polydimethylsiloxane.

[0013] Preferably, the target substrate is a silicon wafer or a glass substrate.

[0014] Preferably, the thickness of the first polymer coating is greater than 30 nm.

[0015] The present invention also provides a surface patterning method, comprising the following steps:

[0016] S1: performing surface treatment on a temporary substrate having a plurality of microstructures arranged in an array, so that a hydrophobic layer is formed on the surface of the temporary substrate;

[0017] S2: spin coating a first polymer coating on the temporary substrate so that the second polymer coating fills the gaps between adjacent microstructures, and then solidifies the first polymer coating;

[0018] S3: Spin-coating a second polymer coating on a target substrate and curing the second polymer coating;

[0019] S4: The side of the target substrate having the second polymer coating is combined with the microstructure of the temporary substrate, and pressure and heating are applied and maintained for a period of time, so that the second polymer coating of the target substrate and the first polymer coating of the temporary substrate are thermally melted together;

[0020] S5: After cooling, the target substrate is separated from the temporary substrate, that is, the microstructure of the temporary substrate is transferred to the target substrate.

[0021] Preferably, the temporary substrate is made of Si.

[0022] Preferably, the coating material for the surface treatment in step S1 is FDTS or PDMS or a combination of FDTS and PDMS, wherein FDTS is perfluorododecyltrichlorosilane, and PDMS is polydimethylsiloxane.

[0023] Preferably, the thickness of the second polymer coating is greater than 30 nm.

[0024] The surface patterning method of the present invention performs patterning of any surface by means of thermal transfer printing. The microstructure on the temporary substrate is not easily damaged, and the life of the temporary substrate can be greatly extended. Micro-nano patterns with a high aspect ratio can be patterned on the target substrate. The entire process is similar to nanoimprinting, is low-cost, and can be applied on a large scale. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1It is a schematic diagram of a structure having a microstructure on a temporary substrate in the surface patterning method of the present invention;

[0027] Figure 2 It is a schematic structural diagram of the surface treatment of a temporary substrate in the surface patterning method of the present invention;

[0028] Figure 3 It is a schematic structural diagram of spin coating a polymer coating on a temporary substrate and a target substrate in the surface patterning method of the present invention;

[0029] Figure 4 It is a schematic structural diagram of combining a temporary substrate and a target substrate in the surface patterning method of the present invention;

[0030] Figure 5 It is a schematic structural diagram of separating a temporary substrate and a target substrate in the surface patterning method of the present invention;

[0031] Figure 6 It is a schematic diagram of the structure of a target substrate after surface patterning in the surface patterning method of the present invention. DETAILED DESCRIPTION

[0032] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0033] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, in the description of the present invention, "multiple" means two or more, unless otherwise clearly and specifically defined.

[0034] The invention discloses a surface patterning method, which belongs to the technical field of transfer printing, such as Miro-LED transfer technology.

[0035] A surface patterning method comprises the following steps:

[0036] S1: Figure 1 and Figure 2 As shown, a temporary substrate 10 having a plurality of microstructures 11 arranged in an array is subjected to surface treatment so that a hydrophobic layer 12 is formed on the surface of the temporary substrate 10;

[0037] The material of the temporary substrate 10 is Si; the microstructure 11 on the temporary substrate 10 is formed by deposition, development and exposure; the coating material for surface treatment is FDTS or PDMS or a combination of FDTS and PDMS, wherein FDTS is perfluorododecyltrichlorosilane, for example, C 10 H4Cl3F 17 Si; PDMS is polydimethylsiloxane, for example, CH3[Si(CH3)2)O]nSi(CH3)3.

[0038] S2: Figure 3 As shown, a first polymer coating 21 is spin-coated on a target substrate 20 and the first polymer coating 21 is cured;

[0039] The target substrate 20 is a silicon wafer or a glass substrate; the thickness of the first polymer coating 21 is greater than 30 nm;

[0040] S3: Figure 3 As shown, a second polymer coating 13 is also spin-coated on the temporary substrate 10 so that the second polymer coating 13 fills the gaps between adjacent microstructures 11, and then the second polymer coating 13 is cured;

[0041] S4: Figure 4 As shown, one side of the target substrate 20 having the first polymer coating 21 is combined with the microstructure 11 of the temporary substrate 10, and pressure and heating are applied and maintained for a period of time, so that the first polymer coating 21 of the target substrate 20 and the second polymer coating 13 of the temporary substrate 10 are thermally melted together;

[0042] S5: Figure 5 and Figure 6 After cooling to room temperature, the target substrate 20 is separated from the temporary substrate 10 , that is, the microstructure 11 of the temporary substrate 10 is transferred to the target substrate 20 .

[0043] Through the above method, the target substrate 20 is patterned, and the microstructure 11 is used as a micro-nano pattern and can be used for subsequent processing.

[0044] The order of the above steps S2 and S3 can also be replaced, that is, the surface patterning method includes the following steps:

[0045] S1: Figure 1 and Figure 2 As shown, a temporary substrate 10 having a plurality of microstructures 11 arranged in an array is subjected to surface treatment so that a hydrophobic layer 12 is formed on the surface of the temporary substrate 10;

[0046] The material of the temporary substrate 10 is Si; the microstructure 11 on the temporary substrate 10 is formed by deposition, development and exposure; the coating material for surface treatment is FDTS or PDMS or a combination of FDTS and PDMS, wherein FDTS is perfluorododecyltrichlorosilane, for example, C 10 H4Cl3F 17 Si; PDMS is polydimethylsiloxane, for example, CH3[Si(CH3)2)O]nSi(CH3)3.

[0047] S2: Figure 3 As shown, a first polymer coating is spin-coated on the temporary substrate 10 so that the first polymer coating fills the gaps between adjacent microstructures 11, and then the first polymer coating is cured;

[0048] S3: Figure 3 As shown, a second polymer coating is also spin-coated on a target substrate 20 and the second polymer coating is cured;

[0049] The target substrate 20 is a silicon wafer or a glass substrate; the thickness of the second polymer coating is greater than 30 nm.

[0050] S4: Figure 4 As shown, the side of the target substrate 20 having the second polymer coating is combined with the microstructure 11 of the temporary substrate 10, and pressure and heating are applied and maintained for a period of time, so that the second polymer coating of the target substrate 20 and the first polymer coating of the temporary substrate 10 are thermally melted together;

[0051] S5: Figure 5 and Figure 6 After cooling to room temperature, the target substrate 20 is separated from the temporary substrate 10 , that is, the microstructure 11 of the temporary substrate 10 is transferred to the target substrate 20 .

[0052] The surface patterning method of the present invention performs patterning of any surface by means of thermal transfer printing. The microstructure on the temporary substrate is not easily damaged, and the life of the temporary substrate can be greatly extended. Micro-nano patterns with a high aspect ratio can be patterned on the target substrate. The entire process is similar to nanoimprinting, is low-cost, and can be applied on a large scale.

[0053] What is disclosed above is only a preferred embodiment of the present invention, and it certainly cannot be used to limit the scope of rights of the present invention. Ordinary technicians in this field can understand that all or part of the processes of the above embodiment and equivalent changes made according to the claims of the present invention still fall within the scope of the invention.

Claims

1. A surface patterning method, characterized in that: The steps include: S1: performing surface treatment on a temporary storage substrate (10) having a plurality of microstructures (11) arranged in an array, so that a hydrophobic layer (12) is formed on the surface of the temporary storage substrate (10); S2: spin coating a first polymer coating (21) on a target substrate (20) and curing the first polymer coating (21); S3: Spin-coating a second polymer coating (13) on the temporary substrate (10) so that the second polymer coating (13) fills the gaps between adjacent microstructures (11), and then curing the second polymer coating (13); S4: The surface of the target substrate (20) having the first polymer coating (21) is combined with the microstructure (11) of the temporary substrate (10), and pressure and heating are applied and maintained for a period of time, so that the first polymer coating (21) of the target substrate (20) and the second polymer coating (13) of the temporary substrate (10) are thermally melted together; S5: After cooling, the target substrate (20) is separated from the temporary substrate (10), that is, the microstructure (11) of the temporary substrate (10) is transferred to the target substrate (20).

2. The surface patterning method according to claim 1, characterized in that: The temporary substrate is made of Si.

3. The surface patterning method according to claim 1, characterized in that: The microstructure (11) on the temporary substrate (10) is formed by deposition, development and exposure.

4. The surface patterning method according to claim 1, characterized in that: The coating material for the surface treatment in step S1 is FDTS or PDMS or a combination of FDTS and PDMS, wherein FDTS is perfluorododecyltrichlorosilane and PDMS is polydimethylsiloxane.

5. The surface patterning method according to claim 1, characterized in that: The target substrate (20) is a silicon wafer or a glass substrate.

6. The surface patterning method according to claim 1, characterized in that: The thickness of the first polymer coating (21) is greater than 30 nm.

7. A surface patterning method, characterized in that: The steps include: S1: performing surface treatment on a temporary storage substrate (10) having a plurality of microstructures (11) arranged in an array, so that a hydrophobic layer (12) is formed on the surface of the temporary storage substrate (10); S2: spin coating a first polymer coating on the temporary substrate (10) so that the first polymer coating fills the gaps between adjacent microstructures (11), and then solidifies the first polymer coating; S3: similarly spin coating a second polymer coating on a target substrate (20) and curing the second polymer coating; S4: The side of the target substrate (20) having the second polymer coating is combined with the microstructure (11) of the temporary substrate (10), and pressure and heating are applied and maintained for a period of time, so that the second polymer coating (13) of the target substrate (20) and the first polymer coating of the temporary substrate (10) are thermally melted together; S5: After cooling, the target substrate (20) is separated from the temporary substrate (10), that is, the microstructure (11) of the temporary substrate (10) is transferred to the target substrate (20).

8. The surface patterning method according to claim 7, characterized in that: The material of the temporary storage substrate (10) is Si.

9. The surface patterning method according to claim 7, characterized in that: The coating material for the surface treatment in step S1 is FDTS or PDMS or a combination of FDTS and PDMS, wherein FDTS is perfluorododecyltrichlorosilane and PDMS is polydimethylsiloxane.

10. The surface patterning method according to claim 7, characterized in that: The thickness of the second polymer coating (13) is greater than 30 nm.

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