Chip transfer system

Abstract

The present invention relates to a chip transfer system. When transferring a chip, a transfer substrate carrying a chip to be transferred can be directly placed in a first chamber. After the chip is separated from the transfer substrate by controlling a first adsorption force generated by a corresponding first adsorption device through an adsorption control device, the chip moves to a set position of the second chamber along with the fluid under the action of a first adsorption force generated by the first adsorption device and a thrust generated by a fluid flowing from the first chamber to the second chamber controlled by a fluid control device. Then, the chip can be dropped onto a corresponding chip bonding area on a target substrate by controlling the first adsorption force generated by the first adsorption device and the fluid. This greatly simplifies the chip transfer process, improves its transfer efficiency, and can well meet the needs of mass transfer of micro LED chips.

Description

Technical Field

[0001] The present invention relates to the field of chip transfer, and in particular to a chip transfer system. Background Art

[0002] Light Emitting Diode (LED) is a semiconductor diode that can convert electrical energy into light energy. It has the characteristics of small size, high brightness and low energy consumption. Through different material combinations and production methods, it can emit light of different colors and is widely used in display screens, backlight sources and lighting fields.

[0003] With the development of micro-LED applications in high-resolution displays, micro-LED technology has attracted increasing attention. Compared with traditional LEDs, micro-LEDs need to be transferred in large quantities after the chips are made. A large number of micro-LED chips (usually tens of thousands to hundreds of thousands) need to be transferred to the target substrate (such as a driver circuit board) to form an LED array. The current method for mass transfer of micro-LED chips is to form a number of micro-LED chips on the substrate, adhere all the micro-LED chips to the same blue film, remove the substrate, diffuse the blue film to increase the distance between adjacent chips on the blue film (i.e., crystal expansion), and finally transfer all the micro-LED chips on the blue film to the target substrate through a crystal bonding machine and other equipment. The micro-LED chip transfer process requires first transferring the micro-LED chip from the substrate to the blue film, then performing crystal expansion, and then transferring it through a crystal bonding machine. The transfer process is cumbersome and inefficient, and cannot well meet the needs of mass transfer of micro-LED chips.

[0004] Therefore, how to solve the low transfer efficiency of micro LED chips is an urgent problem to be solved. Summary of the invention

[0005] In view of the above-mentioned deficiencies in the related technologies, the purpose of the present application is to provide a chip transfer system, aiming to solve the problem of low transfer efficiency of existing micro LED chips.

[0006] A chip transfer system comprises a box, a fluid device and an adsorption device;

[0007] A first chamber and a second chamber communicating with each other are formed in the box body, and a substrate placement structure for placing a transfer substrate and a target substrate into the first chamber and the second chamber respectively, and a liquid inlet and a liquid outlet communicating with the first chamber and the second chamber respectively are provided on the box body;

[0008] The fluid device includes a storage device for storing fluid, the storage device is connected to the liquid inlet through a pipeline, so that the fluid flows into the first chamber and the second chamber in sequence through the liquid inlet; the fluid device also includes a fluid control device for controlling the flow rate of the fluid in the first chamber and the second chamber;

[0009] The adsorption device comprises a plurality of first adsorption devices disposed on the box body and movable between the first chamber and the second chamber, and an adsorption control device for controlling the magnitude of the first adsorption force generated by the first adsorption devices; the first adsorption devices are disposed opposite to the chip carrying surface on the transfer substrate for carrying the chip;

[0010] When the chip is transferred, the chip located on the transfer substrate is detached from the transfer substrate under the action of the first adsorption force generated by the corresponding first adsorption device, and under the action of the thrust generated by the first adsorption force and the fluid flowing from the first chamber to the second chamber, the chip moves to the set position of the second chamber along with the fluid, and then falls onto the corresponding chip bonding area on the target substrate through the control of the first adsorption force and the fluid.

[0011] When transferring chips, the chip transfer system can directly place the transfer substrate carrying the chip to be transferred into the first chamber, and after the chip is separated from the transfer substrate by controlling the first adsorption force generated by the corresponding first adsorption device through the adsorption control device, the chip moves to the set position of the second chamber with the fluid under the action of the first adsorption force generated by the first adsorption device and the thrust generated by the fluid flowing from the first chamber to the second chamber controlled by the fluid control device, and then the chip can be dropped onto the corresponding chip bonding area on the target substrate by controlling the first adsorption force generated by the first adsorption device and the fluid. The chip transfer process no longer needs to transfer the micro LED chip from the substrate to the blue film, then perform the crystal expansion process, and then realize the transfer through the crystal bonding machine, which greatly simplifies the chip transfer process, improves its transfer efficiency, and can well meet the needs of mass transfer of micro LED chips.

[0012] Optionally, the chip transfer system may further include a first alignment plate, on which is provided a first alignment hole corresponding to at least a portion of the chip bonding area on the target substrate; after the chip moves to a set position in the second chamber along with the fluid, it falls onto the corresponding chip bonding area on the target substrate through the first alignment hole.

[0013] The setting of the above-mentioned first alignment plate can make the chip fall onto the corresponding chip bonding area on the target substrate more accurately during the chip transfer process, thereby improving the accuracy of the transfer; at the same time, the setting of the first alignment hole can also prevent the chip that has previously fallen onto the chip bonding area from being carried away from the chip bonding area by the fluid or from being shifted in position in the chip bonding area during the transfer process, thereby further ensuring the accuracy of the chip transfer.

[0014] Optionally, the chip transfer system may further include at least one third adsorption device disposed on the box body and corresponding to at least one chip bonding area on the target substrate, and the adsorption control device is further used to control the magnitude of a third adsorption force generated by the third adsorption device;

[0015] At least one of the third adsorption devices is used to generate a third adsorption force to absorb the interference on the chip bonding area from the chip bonding area before transferring the chip to its corresponding chip bonding area, and remove the second chamber through the liquid outlet.

[0016] The setting of the above-mentioned third adsorption device can use the third adsorption device to remove interferers on the corresponding chip bonding area from the chip bonding area before transferring the chip to its corresponding chip bonding area, thereby ensuring as much as possible that there are no interferers on the chip bonding area when transferring the chip to the chip bonding area, which can further improve the reliability and accuracy of chip transfer. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 Schematic diagram of a chip transfer system provided in an embodiment of the present invention Figure 1 ;

[0018] Figure 2-1 Schematic diagram 2 of a chip transfer system provided by an embodiment of the present invention;

[0019] Figure 2-2 Schematic diagram 3 of a chip transfer system provided by an embodiment of the present invention;

[0020] Figure 2-3 Schematic diagram of the substrate placement structure provided in the embodiment of the present invention Figure 1 ;

[0021] Figure 2-4 A second schematic diagram of a substrate placement structure provided in an embodiment of the present invention;

[0022] Figure 2-5 A schematic diagram of placing a substrate into a box provided by an embodiment of the present invention;

[0023] Figure 2-6 A schematic diagram of a chip being separated from a transfer substrate provided in an embodiment of the present invention;

[0024] Figure 2-7A schematic diagram of a chip moving within a box provided by an embodiment of the present invention;

[0025] Figure 2-8 A schematic diagram of moving a chip to a corresponding chip bonding area provided by an embodiment of the present invention;

[0026] Figure 2-9 A schematic diagram of a chip transfer process provided by an embodiment of the present invention;

[0027] Figure 3-1 A schematic diagram of the distribution of chip bonding areas of a target substrate provided by an embodiment of the present invention;

[0028] Figure 3-2 A schematic diagram of chip transfer of each chip bonding area of ​​a target substrate provided by an embodiment of the present invention;

[0029] Figure 4-1 A schematic diagram of a chip transfer system provided in another optional embodiment of the present invention Figure 1 ;

[0030] Figure 4-2 A schematic diagram of an insert substrate provided for another optional embodiment of the present invention;

[0031] Figure 4-3 A schematic diagram of a chip being separated from a transfer substrate provided in another optional embodiment of the present invention;

[0032] Figure 4-4 A schematic diagram of a chip moving within a box provided in another optional embodiment of the present invention;

[0033] Figure 4-5 A schematic diagram of transferring a chip to a corresponding chip bonding area provided in another optional embodiment of the present invention;

[0034] Figure 4-6 A schematic diagram of a chip transfer process provided by another optional embodiment of the present invention;

[0035] Figure 5-1 A schematic diagram of a first alignment plate provided in another optional embodiment of the present invention;

[0036] Figure 5-2 A schematic diagram of a second alignment plate provided in another optional embodiment of the present invention;

[0037] Figure 5-3 A schematic diagram of a third alignment plate provided for another optional embodiment of the present invention;

[0038] Figure 5-4 A schematic diagram of placing a first alignment plate into a box provided in another optional embodiment of the present invention;

[0039] Figure 5-5A schematic diagram of transferring a chip to a first group of chip bonding areas provided in another optional embodiment of the present invention;

[0040] Figure 5-6 A schematic diagram of placing a second alignment plate into a box provided in another optional embodiment of the present invention;

[0041] Figure 5-7 A schematic diagram of transferring a chip to a second group of chip bonding areas provided in another optional embodiment of the present invention;

[0042] Figure 5-8 A schematic diagram of a third alignment plate provided in another optional embodiment of the present invention being placed in a box;

[0043] Figure 5-9 A schematic diagram of transferring a chip to a third group of chip bonding regions provided in another optional embodiment of the present invention;

[0044] Figure 5-10 A schematic diagram of removing a target substrate and a third alignment plate provided in another optional embodiment of the present invention;

[0045] Figure 6-1 A schematic diagram of a first alignment plate provided in another optional embodiment of the present invention;

[0046] Figure 6-2 A schematic diagram of a first cover plate provided for another optional embodiment of the present invention;

[0047] Figure 6-3 A schematic diagram of a second cover plate provided in another optional embodiment of the present invention;

[0048] Figure 6-4 A schematic diagram of placing a first alignment plate into a box provided in another optional embodiment of the present invention;

[0049] Figure 6-5 A schematic diagram of transferring a chip to a portion of a chip bonding area and inserting a first cover plate provided in another optional embodiment of the present invention;

[0050] Figure 6-6 A schematic diagram of transferring a chip to another part of the chip bonding area provided by another optional embodiment of the present invention;

[0051] Figure 6-7 A schematic diagram of placing a second cover plate into a box provided in another optional embodiment of the present invention;

[0052] Figure 6-8 A schematic diagram of transferring the chip of the remaining chip bonding area provided by another optional embodiment of the present invention;

[0053] Figure 6-9 A schematic diagram of removing a target substrate provided by another optional embodiment of the present invention;

[0054] Figure 7-1 A schematic diagram of the third adsorption device provided in another optional embodiment of the present invention Figure 1 ;

[0055] Figure 7-2 A second schematic diagram of the third adsorption device provided in another optional embodiment of the present invention;

[0056] Figure 8-1 A schematic diagram of setting an infrared detection device provided in yet another optional embodiment of the present invention;

[0057] Figure 8-2 A schematic diagram of the fourth adsorption device provided in another optional embodiment of the present invention;

[0058] Description of reference numerals:

[0059] 1-box, 11-first chamber, 12-second chamber, 13-liquid inlet, 14-liquid outlet, 15-through hole, 101-upper baffle, 102-lower baffle, 103-left baffle, 104-right baffle, 105-isolation plate, 21-fluid control equipment, 31-first adsorption device, 32-second adsorption device, 33-third adsorption device, 34-fourth adsorption device, 4-transfer substrate, 5-target substrate, 51-chip bonding area, 6-chip, 7-fluid, 81-first alignment plate, 801-first alignment hole, 82-second alignment plate, 802-second alignment hole, 83-third alignment plate, 803-third alignment hole, 84-first cover plate, 804-fourth alignment hole, 85-second cover plate, 805-fifth alignment hole, 9-infrared detection device. DETAILED DESCRIPTION

[0060] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are given in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thoroughly and comprehensively understood.

[0061] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0062] In the related technology, the micro LED chip transfer process requires first transferring the micro LED chip from the substrate to the blue film, then performing crystal expansion, and then transferring it through a crystal bonding machine. The transfer process is cumbersome and inefficient, and cannot meet the needs of mass transfer of micro LED chips.

[0063] Based on this, the present application hopes to provide a solution that can solve the above-mentioned technical problems, the details of which will be described in the subsequent embodiments.

[0064] The chip transfer system provided in this embodiment includes a box, a fluid device and an adsorption device, wherein:

[0065] A first chamber and a second chamber that are in communication are formed in the box body, and a substrate placement structure for placing a transfer substrate and a target substrate into the first chamber and the second chamber respectively, as well as a liquid inlet and a liquid outlet that are in communication with the first chamber and the second chamber respectively, are provided on the box body; the transfer substrate carries a chip to be transferred, and the target substrate is provided with a chip bonding area corresponding to the chip to be transferred; it should be understood that the number of chips to be transferred and the number of corresponding chip bonding areas can be flexibly set according to specific application requirements.

[0066] The fluid device includes a storage device for storing fluid, and the storage device is connected to the liquid inlet through a pipeline, so that the fluid stored in the storage device can flow into the first chamber and the second chamber in sequence through the liquid inlet; the fluid device also includes a fluid control device for controlling the flow rate of the fluid in the first chamber and the second chamber. It should be understood that the fluid in this embodiment may include a liquid. When a liquid is included, the liquid may be selected to be non-conductive and non-corrosive to the chip and the substrate. For example, a liquid suspension may be used but is not limited to; of course, in other examples, a volatile conductive liquid may also be selected. After the chip transfer is completed, the conductive liquid may evaporate and have no effect on the chip. In other application examples, the fluid may not be a liquid, but may be equivalently replaced by other types of fluids, which will not be repeated here.

[0067] The adsorption equipment includes a plurality of first adsorption devices arranged on a box body and movable between a first chamber and a second chamber, and an adsorption control device for controlling the magnitude of a first adsorption force generated by the first adsorption device; the first adsorption device is arranged opposite to a chip carrying surface on a transfer substrate for carrying a chip, so that the first adsorption device can generate a corresponding first adsorption force acting on a corresponding chip.

[0068] When the transfer system is used to transfer the chip, the chip on the transfer substrate in the first chamber can be separated from the transfer substrate under the action of the first adsorption force generated by the corresponding first adsorption device. After the chip is separated from the transfer substrate in the first chamber, it moves to the set position of the second chamber with the fluid under the action of the first adsorption force generated by the corresponding first adsorption device and the thrust generated by the fluid flowing from the first chamber to the second chamber (in one example, the first adsorption device corresponding to the chip can move synchronously with the movement of the chip from the first chamber to the second chamber). The chip falls onto the corresponding chip bonding area on the target substrate by controlling the first adsorption force and the fluid. It can be seen that when the chip transfer system provided by this embodiment is used to transfer the chip, it is no longer necessary to transfer the micro LED chip from the substrate to the blue film, then perform the crystal expansion process, and then realize the transfer through the crystal bonding machine. The transfer process is simpler and the transfer efficiency is higher, so it can better meet the needs of mass transfer of micro LED chips.

[0069] It should be understood that the chip transfer system provided in this embodiment can be used for the transfer of light-emitting chips, and can also be used for the transfer of other chips. For example, it can also be used for but not limited to the transfer of chips such as driver chips and resistor chips. This embodiment does not limit the type of chip. When used for the transfer of light-emitting chips, from the perspective of chip size, the light-emitting chip can be a micro light-emitting chip or a light-emitting chip of ordinary size. When it is a micro light-emitting chip, it can include but is not limited to at least one of a micro-LED chip and a mini-LED chip. From the perspective of electrode setting, the light-emitting chip can include but is not limited to at least one of a top-mounted light-emitting chip, a flip-chip light-emitting chip and a vertical light-emitting chip.

[0070] It should be understood that in some application examples, the chip transfer system in this embodiment may also omit the fluid equipment and the liquid inlet and outlet on the box body. The chip to be transferred on the transfer substrate can be directly under the action of the first adsorption force generated by the corresponding first adsorption device, and after the first adsorption device moves from the first chamber to the second chamber, the chip can fall into the corresponding chip bonding area on the target substrate by controlling the size of the first adsorption force.

[0071] It should be understood that the transfer substrate in this embodiment can be an epitaxial substrate (or growth substrate) for growing chips, or an intermediate substrate for transferring chips from epitaxial substrates. The target substrate in this embodiment can be various functional substrates with chip bonding areas, such as but not limited to drive substrates or other functional substrates, which can be flexibly set according to application requirements.

[0072] For ease of understanding, the chip transfer system provided in this embodiment is exemplarily described below with reference to the accompanying drawings.

[0073] See also Figure 1 In the example shown, the box body 1 of the chip transfer system is composed of a plurality of baffles. It should be understood that in this embodiment, the number of baffles that the box body 1 is composed of, as well as the shape and size of the box body 1, can be flexibly set according to application requirements, and there is no restriction on them in this example. For ease of understanding, in this example, the box body 1 is enclosed by an upper baffle 101, a lower baffle 102, a left baffle 103, a right baffle 104, and a front baffle and a rear baffle (not shown in the figure) as an example for explanation. A first chamber 11 and a second chamber 12 that are connected are formed in the box body 1, and the connection between the two facilitates the movement of the chip from the first chamber 11 to the second chamber 12 along with the fluid. In some examples, there may be no isolation between the first chamber 11 and the second chamber 12, and the two are directly connected. In other examples, see Figure 2-1 As shown, an isolation plate 15 may be provided between the first chamber 11 and the second chamber 12 as required, and the isolation plate 15 is provided with a through hole 15 for connecting the first chamber 11 and the second chamber 12, and the through hole 15 allows the chip to flow from the first chamber 11 to the second chamber 12 along with the fluid. The provision of the isolation plate 15 is more conducive to controlling the flow rate of the fluid in the first chamber 11 and the second chamber 12, respectively, thereby being more conducive to improving the accuracy of chip transfer.

[0074] See also Figure 1 As shown, in this example, a liquid inlet 13 and a liquid outlet 14 are provided on the box body 1, which are communicated with the first chamber 11 and the second chamber 12 respectively. The liquid inlet 13 is mainly used for the fluid to enter the first chamber 11, and the liquid outlet 14 is mainly used for the fluid to flow out of the second chamber 12. It should be understood that in this example, the specific positions, numbers, and positional relationship between the liquid inlet 13 and the liquid outlet 14 can be flexibly set. For example, in one example, one (or more) liquid inlets 13 and one (or more) liquid outlets 14 can be provided, and the liquid inlet 13 and the liquid outlet 14 can be relatively arranged in positional relationship, so as to facilitate convection of the fluid. For example, see Figure 1 and Figure 2-1 In the example shown, a liquid inlet 13 is provided on the left baffle 103, and a liquid outlet 14 is provided on the right baffle 104 opposite to the left baffle 103. The liquid inlet 13 and the liquid outlet 14 are opposite in position, so as to facilitate convection of the fluid. Figure 2-2As shown, one or more liquid inlets 13 are provided on the upper baffle 101, and one or more liquid outlets 14 are provided on the right baffle 104. It should be understood that in this example, at least one liquid inlet 13 can be provided on at least one of the left baffle 103, the upper baffle 101, the lower baffle 102, the front baffle, and the rear baffle; at least one liquid outlet 14 can be provided on at least one of the right baffle 104, the lower baffle 102, the front baffle, and the rear baffle; and in some examples, at least one liquid inlet 13 and at least one liquid outlet 14 can also be provided on the same baffle according to needs, which will not be repeated here.

[0075] In this example, the housing 1 is provided with a substrate placement structure for placing a transfer substrate and a target substrate into the first chamber 11 and the second chamber 12, respectively. It should be understood that the substrate placement structure in this embodiment can be flexibly arranged, as long as it at least satisfies the requirement of being able to place a transfer substrate and a target substrate into the first chamber 11 and the second chamber 12, respectively, and ensuring the sealing of the housing 1. For example, in one example, at least one baffle of the housing 1 can be arranged as an openable structure or a detachable assembly structure, and after the baffle is opened or disassembled, the first chamber 11 and the second chamber 12 are respectively connected to the outside for transferring the substrate and the target substrate in separate ways; after the baffle is closed or assembled, the housing 1 is closed. For example, one example see Figure 2-3 As shown, the left baffle 103 and the right baffle 104 can be set to an openable structure, and the openable structure can be a sliding structure, a rotating structure, etc., but not limited to. After the left baffle 103 and the right baffle 104 are opened, the transfer substrate 4 and the target substrate 5 can be placed in the first chamber 11 and the second chamber 12 respectively, wherein the transfer substrate 4 carries the chip 6 to be transferred, and the target substrate 5 is provided with a chip bonding area 51 (also referred to as a solid crystal area). After the transfer substrate 4 and the target substrate 5 are in place, the left baffle 103 and the right baffle 104 are closed. In some examples, when placing the transfer substrate 4 and the target substrate 5, there can be no fluid or only a small amount of fluid in the first chamber 11 and the second chamber 12. For another example, see Figure 2-4 As shown, the upper baffle 101 can be set as an openable structure; of course, according to needs, the front baffle, the rear baffle and / or the lower baffle can also be set as an openable structure.

[0076] Of course, in some examples, the baffle of the box body may be set to a non-openable or non-detachable structure, and at least one of the baffles may be provided with openings that are respectively connected to the first chamber 11 and the second chamber 12 and are used to respectively insert the transfer substrate 4 and the target substrate 5 into the first chamber 11 and the second chamber 12, and a sealing plate that can open and close the opening. This structure will not be described in detail here.

[0077] The fluid device in this example includes a storage device for storing fluid (not shown in the figure), and the storage device is connected to the liquid inlet through a pipeline so that the fluid in the storage device can flow into the first chamber 11 and the second chamber 12 in sequence through the liquid inlet; the fluid device also includes a fluid control device for controlling the flow rate of the fluid in the first chamber 11 and the second chamber 12. The setting position of the fluid control device in this example can be flexibly set. For example, it can be set on the storage device to control the flow rate of the fluid from the source, or it can be set on the box 1 to control the flow rate of the fluid. And it should be understood that there are many mature solutions in the relevant technology on how to achieve the control of the flow rate of the fluid, which will not be repeated here.

[0078] A setting see Figure 2-1 As shown, the fluid control device 21 is disposed on the housing 1 and can control the flow rate of the fluid entering the first chamber 11 through the liquid inlet 13 according to demand.

[0079] The adsorption device in this example includes a plurality of first adsorption devices disposed on the box body 1 and movable between the first chamber 11 and the second chamber 12, and an adsorption control device (not shown in the figure) for controlling the magnitude of the first adsorption force generated by the first adsorption device; in this example, the first adsorption device is disposed opposite to the chip carrying surface on the transfer substrate for carrying the chip, so that the first adsorption device is directly opposite to the chip on the transfer substrate, so that the first adsorption force generated by the first adsorption device can adsorb the chip from the transfer substrate, so that the chip is separated from the transfer substrate. For example, a setting example is shown in Figures 1 to 2-5 As shown, a plurality of first adsorption devices 31 are provided on the upper baffle plate 101 of the box body 1, and the first adsorption devices 331 are opposite to the side of the transfer substrate 4 carrying the chip 6, and each first adsorption device 31 can move between the first chamber 11 and the second chamber 12 along the upper baffle plate 101, and the structure to realize the movement can be flexibly set. For example, a sliding structure (for example, a guide rail + roller method) can be adopted, or other structures can be adopted. And it should be understood that the first adsorption device in this embodiment can adopt various adsorption forces that can generate a preset size on the corresponding chip. For example, an electromagnet device, a suction device (the suction port of the suction device is set corresponding to the chip) can be adopted.

[0080] It should be understood that in another example of the present embodiment, the plurality of first adsorption devices 31 provided on the upper baffle plate may also be arranged to be fixed, and the first adsorption forces generated between adjacent first adsorption devices 31 may overlap in space, or may overlap, but the gap between the two adsorption forces is relatively small, so that when the chip moves to the next first adsorption device 31 under the action of the first adsorption force generated by the previous first adsorption device 31 and the driving force of the fluid, the first adsorption force generated by the next adsorption device 31 may still act on the chip and together with the driving force of the fluid drive the chip forward, and so on. Of course, it is also possible to arrange that a portion of the first adsorption devices 31 are movable, and a portion of the adsorption devices 31 are immovable. These equivalent alternatives are also within the scope of the present embodiment.

[0081] When the chip is transferred, the chip on the transfer substrate in the first chamber 11 is separated from the transfer substrate under the action of the first adsorption force generated by the corresponding first adsorption device, and then, under the action of the thrust generated by the first adsorption force and the fluid flowing from the first chamber 11 to the second chamber 12, the chip moves to the set position of the second chamber 12 with the fluid, and then the chip falls onto the corresponding chip bonding area on the target substrate by controlling the first adsorption force and the fluid.

[0082] In order to facilitate further understanding, the following embodiments are combined with Figure 2-3 to Figure 2-8 , an example of a chip transfer process is given; the transfer process is shown in Figure 2-9 As shown, including:

[0083] S201: Open the substrate placement structure, and place the transfer substrate 4 carrying the chip 6 and the target substrate 5 with the chip bonding area into the first chamber 11 and the second chamber 12 (manually or automatically by a substrate placement device). Figure 2-3 and Figure 2-4 After the substrate is placed in place, close the substrate placement structure.

[0084] S202: Fluid 7 is injected into the first chamber 11 through the liquid inlet 13, the transfer substrate 4 is in a suspended state in the fluid, and the first adsorption device 31 corresponding to the chip on the transfer substrate is controlled to generate an upward first adsorption force Fu according to a set sequence, so that the chip 6 is separated from the transfer substrate 4, see Figure 2-6 shown.

[0085] In this step, the direction of the first adsorption force Fu is Figure 2-6As shown, its magnitude is greater than the force required for the chip 6 to detach from the transfer substrate 4, for example, Fu>Fjunction+Gcore; wherein Fjunction is the binding force between the chip 6 and the transfer substrate 4, and Gcore is the weight of the chip 6; when the fluid 7 gives the chip 6 an upward buoyancy Ffloat, it can also be set to Fu>Fjunction+Gcore-Ffloat. When the first chamber 11 and the second chamber 12 are isolated by an isolation plate, the magnitude of the first adsorption force Fu can be appropriately set so that the chip 6 enters the flow layer of the upper layer of the fluid after detaching from the transfer substrate 4.

[0086] S203: The chip 6 moves from the first chamber 11 to the second chamber 12 under the action of the first adsorption force Fu generated by the corresponding first adsorption device 31 and the thrust generated by the fluid 7. Figure 2-7 shown.

[0087] In this step, the first adsorption device 31 corresponding to the chip 6 can move synchronously with the chip 6. In this example, the magnitude of the first adsorption force Fu generated by the first adsorption device 31 during the movement can be dynamically controlled according to specific application requirements, and it can remain unchanged or gradually decrease, etc. The specific control can be flexibly set according to the specific application environment. Correspondingly, in this step, the flow rate of the fluid 7 can also be dynamically controlled according to specific application requirements, which will not be repeated here.

[0088] S204: After the chip 6 is moved to the preset position of the second chamber 12, the chip 6 is placed into the corresponding chip bonding area 51 on the target substrate 5 by controlling the first adsorption force Fu generated by the first adsorption device 31 and the flow rate of the fluid 7, see Figure 2-8 shown.

[0089] In this example, the density of the fluid 7 used is less than the density of the chip 6, so that the chip 6 can gradually fall onto the target substrate 5 in the fluid 7. The preset position in this example is flexibly set relative to each chip bonding area 5 based on the control of the fluid 7 and the first adsorption force Fu generated by the first adsorption device 31. It should be understood that different control methods and different chip bonding areas can be set at different preset positions, which will not be repeated here.

[0090] In this example, after the chip 6 is moved to the set position in the second chamber 12, the magnitude of the first adsorption force Fu can be flexibly controlled from 0 to gradually decrease, and the flow rate of the fluid 7 can be controlled to gradually decrease, so that the chip 6 slowly and steadily falls into the corresponding chip bonding area, avoiding damage to the chip 6, and further ensuring the reliability of chip transfer.

[0091] It should be understood that, in the present embodiment, the chip bonding area 51 provided on the target substrate 5 may correspond to different types of chips, which may include but are not limited to different luminous colors, different chip sizes, different types of chip pin settings, and different chip functions (such as light-emitting chips and driver chips); in this application scenario, the chip transfer system can be used to transfer chips of different types.

[0092] For example, see Figure 3-1 As shown in the figure, the target substrate 5 is provided with chip bonding areas 51 of three types of chips (the following is an example of light-emitting chips with different luminous colors), which are staggered in columns. One arrangement is that the first column is the bonding area of ​​the light-emitting chip of the first luminous color (for example, red R), the second column is the bonding area of ​​the light-emitting chip of the second luminous color (for example, green G), and the third column is the bonding area of ​​the light-emitting chip of the third luminous color (for example, blue B), and so on. In this application scenario, the chip is transferred by using the chip transfer system. Figure 3-2 As shown, the following process may be included: completing the transfer of the chip of the first luminous color through the A stage and the B stage shown in the figure, and then completing the transfer of the chip of the second luminous color through the C stage and the D stage shown in the figure, and then completing the transfer of the chip of the third luminous color through the E stage and the F stage shown in the figure. Of course, the specific transfer order can be flexibly set according to demand; and in some application scenarios, it is not necessary to wait for a certain type of chip to be transferred before transferring the next type of chip, and the transfer can also be alternated. And it should be understood that the setting of the chip bonding area of ​​different types of chips on the target substrate 5 in this example is not limited to the above-mentioned example scheme, and can be flexibly set according to the specific application scenario requirements. For example, it can also be set alternately in units of chip bonding areas, which is not limited in this example.

[0093] Another optional embodiment of the present invention:

[0094] The chip transfer system provided in this embodiment is different from the chip transfer system in the previous embodiment in that the adsorption device of the chip transfer system in this embodiment also includes a plurality of second adsorption devices arranged on the box body and movable between the first chamber and the second chamber. The second adsorption device is arranged opposite to the chip bearing surface of the transfer substrate, and in some examples, the second adsorption device can be arranged one-to-one with the first adsorption device (it should be understood that the correspondence is not limited to one-to-one correspondence, and can be replaced equivalently according to the needs), and the first adsorption force and the second adsorption force generated by the first adsorption device and the second adsorption device are opposite in direction, and the magnitude can be flexibly controlled according to the specific application requirements, so that the control of the longitudinal force of the chip between the first adsorption device and the second adsorption device is more flexible and accurate. Therefore, in this embodiment, there is no strict restriction relationship between the density of the fluid and the density of the chip, and the density of the fluid can be greater than, equal to or less than the density of the chip; in this embodiment, the adsorption control device is also used to control the magnitude of the second adsorption force generated by the second adsorption device. The implementation method of the second adsorption device can adopt but is not limited to the implementation method of the above-mentioned first adsorption device, which will not be repeated here.

[0095] In this embodiment, when the chip is transferred, the chip on the transfer substrate is detached from the transfer substrate under the action of the first adsorption force Fu generated by the corresponding first adsorption device. Of course, in some examples, in the process of controlling the chip to detach from the transfer substrate, the corresponding second adsorption device can also be controlled to generate a second adsorption force Fd. That is, in this embodiment, Fu>Fjunction+Gcore+Fd can be set, or Fu>Fjunction+Gcore-Ffloat+Fd can be set, so that the chip can be detached from the transfer substrate. And at this stage, the size of Fd can be set to 0, or it can be set to be greater than 0 according to needs. It can be flexibly controlled according to application requirements, and will not be repeated here.

[0096] In this embodiment, after the chip is separated from the transfer substrate in the first chamber by the above-mentioned control method, the corresponding first adsorption device and the second adsorption device can be controlled to move synchronously with the movement of the chip in the fluid, and the magnitude of the first adsorption force and the second adsorption force respectively generated by the first adsorption device and the second adsorption device can be controlled according to demand, so that the chip moves from the first chamber to the second chamber with the fluid under the action of the two and the thrust generated by the fluid, and after the chip moves to the set position of the second chamber 12, the chip is dropped onto the corresponding chip bonding area on the target substrate by controlling the first adsorption force and the second adsorption force respectively generated by the first adsorption device and the second adsorption device and the fluid. The specific control strategy for the first adsorption force and the second adsorption force and the fluid at this stage can be flexibly formulated according to factors such as the positional relationship between the set position and the chip bonding area corresponding to the chip, the fluid density, etc., and will not be repeated here.

[0097] For ease of understanding, the chip transfer system provided in this embodiment is exemplarily described below with reference to the accompanying drawings.

[0098] See also Figure 4-1 As shown, the chip transfer system in this example, compared with the chip transfer system in the previous embodiment, the adsorption equipment also includes a plurality of second adsorption devices 32 arranged on the box body and movable between the first chamber 11 and the second chamber 12. The second adsorption devices 32 are arranged opposite to the chip carrying surface of the transfer substrate 4, and the second adsorption devices 32 are arranged one by one with the first adsorption devices 31. The first adsorption force and the second adsorption force respectively generated by the relative first adsorption devices 31 and the second adsorption devices 32 are in opposite directions.

[0099] In order to facilitate further understanding, the following embodiments are combined with Figure 4-1 to Figure 4-5 , an example of a chip transfer process is given; the transfer process is shown in Figure 4-6 As shown, including:

[0100] S401: Open the substrate placement structure, and place the transfer substrate 4 carrying the chip 6 and the target substrate 5 with the chip bonding area into the first chamber 11 and the second chamber 12 respectively; after the substrates are placed in place, close the substrate placement structure.

[0101] S402: Fluid 7 is injected into the first chamber 11 through the liquid inlet 13, and the transfer substrate 4 is in a suspended state in the fluid. The first adsorption device 31 corresponding to the chip on the transfer substrate is controlled in a set order (the corresponding second adsorption device can also be controlled to generate a second adsorption force in this stage) to generate an upward first adsorption force Fu, so that the chip 6 is separated from the transfer substrate 4, see Figure 4-3 shown.

[0102] S403: The chip 6 moves from the first chamber 11 to the second chamber 12 under the action of the first adsorption force Fu generated by the corresponding first adsorption device 31, the second adsorption force Fd generated by the second adsorption device 32, and the thrust generated by the fluid 7. Figure 4-4 shown.

[0103] In this step, the first adsorption device 31 and the second adsorption device corresponding to the chip 6 can move synchronously with the chip 6. In this example, the magnitude of the first adsorption force Fu generated by the first adsorption device 31 during the movement can be dynamically controlled according to the specific application requirements, and it can remain unchanged, or gradually decrease or increase, etc.; the magnitude of the second adsorption force Fd generated by the second adsorption device during the movement can also be dynamically controlled according to the specific application requirements, and it can remain unchanged, or gradually decrease or increase, etc. The specific control can also be flexibly set according to the specific application environment. Correspondingly, in this step, the flow rate of the fluid 7 can also be dynamically controlled according to the specific application requirements, which will not be repeated here.

[0104] S404: After the chip 6 is moved to the preset position of the second chamber 12, the chip 6 is placed into the corresponding chip bonding area 51 on the target substrate 5 by controlling the first adsorption force Fu generated by the first adsorption device 31, the second adsorption force Fd generated by the second adsorption device 32 and the flow rate of the fluid 7, see Figure 2-8 shown.

[0105] In this example, the density of the fluid 7 used is less than the density of the chip 6, so that the chip 6 can gradually fall onto the target substrate 5 in the fluid 7. The preset position in this example is flexibly set relative to each chip bonding area 5 based on the control of the fluid 7 and the first adsorption force Fu generated by the first adsorption device 31. It should be understood that different control methods and different chip bonding areas can be set at different preset positions, which will not be repeated here.

[0106] In this example, after the chip 6 moves to the set position in the second chamber 12, the magnitude of the first adsorption force can be flexibly controlled and / or the first adsorption device 31 can be controlled to stop moving, etc., and the magnitude of the second adsorption force can be flexibly controlled and / or the second adsorption device 32 can be controlled to stop moving, etc., as well as the flow rate of the fluid 7 (which can be reduced or kept unchanged), so that the chip 6 falls slowly and steadily into the corresponding chip bonding area, which can further ensure the reliability of chip transfer.

[0107] It should be understood that the chip bonding area 51 set on the target substrate 5 in this embodiment can also correspond to different types of chips, which may include but are not limited to different luminous colors, different chip sizes, different chip pin settings, and different chip functions (such as light-emitting chips and driver chips); in this application scenario, the chip transfer system can be used to transfer different types of chips. It has better compatibility and is more conducive to chip transfer.

[0108] Another optional embodiment of the present invention:

[0109] For ease of understanding, this embodiment further illustrates the chip transfer system based on the above embodiments.

[0110] In the present embodiment, the chip transfer system further comprises a first alignment plate, on which a first alignment hole is provided corresponding to at least a portion of the chip bonding area on the target substrate; before chip transfer, in the process of placing the target substrate into the second chamber, the first alignment plate is also placed into the second chamber to be bonded with the target substrate (the target substrate and the first alignment plate can be placed together after being bonded outside the second chamber, or can be placed separately in sequence), after the two are bonded, at least a portion of the chip bonding area on the target substrate is exposed through the corresponding first alignment hole; the first alignment hole located on the chip bonding area is convenient for accurate alignment when transferring the chip to the chip bonding area, and can also limit the chip transferred to the chip bonding area to the chip bonding area, that is, the chip is positioned to avoid the fluid carrying the chip that has been transferred to the chip bonding area away from the chip bonding area or deviating from the chip bonding area during the subsequent chip transfer process, thereby further ensuring the accuracy and reliability of chip transfer. In this example, during the chip transfer process, the chip (when the chip bonding area corresponding to the chip is provided with a first alignment hole) moves with the fluid to the set position of the second chamber 12, and then falls onto the corresponding chip bonding area on the target substrate through the corresponding first alignment hole.

[0111] It should be understood that the correspondence between the first alignment holes provided on the first alignment plate in this embodiment and the chip bonding area on the target substrate can be flexibly set according to requirements. It can be set that all chip bonding areas on the target substrate correspond to the first alignment holes, or it can be set that only a part corresponds to the first alignment holes; and the chip bonding areas and the first alignment holes can correspond one to one, or it can be set that one first alignment hole corresponds to at least two adjacent chip bonding areas.

[0112] In another example of the present embodiment, at least a portion of the chip bonding area on the target substrate may be a chip bonding area that is concave and has a groove. This arrangement allows the chip transferred to the chip bonding area to be confined within the groove during the chip transfer process, that is, the groove can be used to position the chip, thereby preventing the fluid from carrying the chip that has been previously transferred to the chip bonding area away from or deviating from the chip bonding area during the subsequent chip transfer process, thereby further ensuring the accuracy and reliability of the chip transfer. This example method may be an equivalent alternative to the above-mentioned setting of the first alignment plate (in this case, the setting of the above-mentioned first alignment plate may be omitted); it may also be used in combination with the above-mentioned first alignment plate.

[0113] Another optional embodiment of the present invention:

[0114] For ease of understanding, the present embodiment further illustrates the chip transfer system provided in the present embodiment based on the above-mentioned exemplary solution in which the first alignment plate is provided.

[0115] In this embodiment, the first alignment plate is provided with a first alignment hole corresponding to the first group of chip bonding areas on the target substrate (i.e., a part of the chip bonding areas). After the first alignment plate is covered (i.e., attached) on the target substrate, the first group of chip bonding areas are exposed through the corresponding first alignment holes, and the other parts of the chip bonding areas are covered by the first alignment plate. In this way, when the chip transfer system is used for chip transfer, only the chip bonding areas in the first group of chip bonding areas on the target substrate can be transferred. Since the chip bonding areas of other parts of the target substrate are covered by the first alignment plate, it can be avoided that the chip falls into the chip bonding areas of other parts by mistake during the transfer process, and it can also be avoided that the residues in the chip transfer process fall into the chip bonding areas of other parts, which interferes with the chip transfer of other chip bonding areas, thereby further improving the chip transfer accuracy and further ensuring that the chip can be in good contact with the chip bonding area after being transferred to the chip bonding area.

[0116] In another example of this embodiment, the chip transfer system may further include a second alignment plate, on which second alignment holes corresponding to the second group of chip bonding areas on the target substrate are provided, and the first group of chip bonding areas and the above-mentioned first group of chip bonding areas are chip bonding areas of different areas; the second alignment plate can be used to cover the target substrate after the first alignment plate is removed from the second chamber, and the second group of chip bonding areas on the target substrate are exposed through the corresponding second alignment holes, and other parts of the chip bonding areas are covered by the second alignment plate. At this time, the chips that have been transferred on the first group of chip bonding areas are also covered by the second alignment plate; in this way, when using the chip transfer system to transfer chips, only the chip bonding areas in the second group of chip bonding areas on the target substrate can be transferred, and after the chip moves to the set position of the second chamber with the fluid, it falls onto the corresponding chip bonding area on the target substrate through the second alignment hole. The chip bonding areas (or chips in the bonding areas) in other parts of the target substrate are covered by the second alignment plate, which can prevent the chips from erroneously falling into the chip bonding areas in other parts during the transfer process, and can also prevent the residues in the chip transfer process from falling into the chip bonding areas in other parts and interfering with the chip transfer in other chip bonding areas; at the same time, it can also prevent the chips in the chip bonding areas of other parts where the chips have been transferred from being carried away or deviated from the chip bonding areas by the fluid during the subsequent chip transfer process, thereby further improving the chip transfer accuracy, and further ensuring that the chip can be in good contact with the chip bonding area after being transferred to the chip bonding area, while also providing reliable protection for the chips that have been transferred before.

[0117] In another example of the present embodiment, the chip transfer system may further include a third alignment plate, on which is provided a third alignment hole corresponding to the third group of chip bonding areas on the target substrate; the third alignment plate is used to cover the target substrate after the second alignment plate is removed from the second chamber, and the third group of chip bonding areas on the target substrate are exposed through the corresponding third alignment holes, and other parts of the chip bonding areas are covered by the third alignment plate; at this time, the chips that have been transferred on the first group of chip bonding areas and the second group of chip bonding areas are also covered by the third alignment plate; in this way, when the chip transfer system is used to transfer the chip, only the chip bonding areas in the third group of chip bonding areas on the target substrate can be transferred, and after the chip moves to the set position of the second chamber with the fluid, it falls onto the corresponding chip bonding area on the target substrate through the third alignment hole. The chip bonding areas (or chips in the bonding areas) in other parts of the target substrate are covered by the third alignment plate, which can prevent the chips from erroneously falling into the chip bonding areas in other parts during the transfer process, and can also prevent residues in the chip transfer process from falling into the chip bonding areas in other parts and interfering with the chip transfer in other chip bonding areas; at the same time, it can also prevent the chips in the chip bonding areas of other parts where the chips have been transferred from being carried away or deviated from the chip bonding areas by the fluid during the subsequent chip transfer process.

[0118] It should be understood that in this embodiment, the number of alignment plates is not limited to three as in the above example, and may be one or two, or more than three as required. Correspondingly, the specific grouping of chip bonding areas on the target substrate may also be flexibly set as required. For example, the grouping may be flexibly performed according to at least one of the transfer order of the chips, the type of the chips, etc.

[0119] For ease of understanding, this embodiment is described below in conjunction with Figure 5-1 to Figure 5-10 Provide an example.

[0120] See also Figure 5-1 The first alignment plate 81 shown in the figure is provided with first alignment holes 801 corresponding to the first group of chip bonding areas on the target substrate 5. Figure 5-2 The second alignment plate 82 shown in the figure is provided with second alignment holes 802 corresponding to the second group of chip bonding areas on the target substrate 5. Figure 5-3 The second alignment plate 83 shown is provided with third alignment holes 803 corresponding to the third group of chip bonding areas on the target substrate 5 .

[0121] See also Figure 5-4 When transferring the chip, the first alignment plate 81 can be attached to the target substrate 5. At this time, the first group of chip bonding areas on the target substrate 5 are exposed through the corresponding first alignment holes 801. Then, the chip 6 can be transferred to the first group of chip bonding areas on the target substrate by the methods in the above embodiments. Figure 5-5As shown, in this application example, the chip 6 transferred in the first group of chip bonding areas can be set to be a red light-emitting chip.

[0122] Then, the first alignment plate 81 is taken out from the second chamber 12, and the second alignment plate 82 is put into the second chamber 12 to be bonded to the target substrate. At this time, the second group of chip bonding areas on the target substrate are exposed through the corresponding second alignment holes 802, and the chip bonding areas in other areas or the chips on the chip bonding areas are covered by the second alignment plate. Figure 5-6 As shown, the chip 6 can be transferred to the second group of chip bonding areas on the target substrate by the methods in the above embodiments, see Figure 5-7 As shown, in this application example, the chip 6 transferred into the second group of chip bonding areas can be set to be a green light-emitting chip.

[0123] Then, the second alignment plate 82 is taken out from the second chamber 12, and the third alignment plate 83 is put into the second chamber 12 to be bonded to the target substrate. At this time, the third group of chip bonding areas on the target substrate are exposed through the corresponding third alignment holes 803, and the chip bonding areas in other areas or the chips on the chip bonding areas are covered by the second alignment plate. Figure 5-8 As shown, the chip 6 can be transferred to the third group of chip bonding areas on the target substrate in the manner of the above embodiments, see Figure 5-9 As shown, in this application example, the chip 6 transferred in the third group of chip bonding areas can be set to be a blue light-emitting chip.

[0124] After all chips are transferred through the above process, the target substrate and the third alignment plate 83 can be taken out from the second chamber 12, and then the chips on the target substrate can be bonded to their corresponding chip bonding areas.

[0125] For ease of understanding, this embodiment also provides another equivalent alternative scheme, in which three independent boxes can be used. After the chip transfer of the first group of chip bonding areas is completed by the first box and the first alignment plate in the above manner, the target substrate is transferred to the second chamber of the second box, and the second alignment plate is placed to complete the transfer of the second group of chip bonding areas. Then, the target substrate is transferred to the second chamber of the third box, and the third alignment plate is placed to complete the transfer of the third group of chip bonding areas. Since this method uses three different boxes, the fluids in the three different boxes may not be shared during the transfer process, so the interference of residues during the transfer process can be further avoided. In some examples, before transferring the target substrate from one box to another, the chip that has completed the transfer on the target substrate can be bonded to the corresponding chip bonding area, and then transferred to another box to avoid the position displacement of the transferred chip during the transfer process. In this scheme, the specific number of boxes and alignment plates used can also be flexibly set according to specific application requirements, which will not be repeated here.

[0126] Another optional embodiment of the present invention:

[0127] For ease of understanding, this embodiment provides another example for easy understanding of the chip transfer system provided in this embodiment based on the above-mentioned example solution with a first alignment plate.

[0128] In this embodiment, the first alignment plate is provided with first alignment holes corresponding to the chip bonding areas on the target substrate. After the first alignment plate is covered on the target substrate, the chip bonding areas on the target substrate are exposed through the corresponding first alignment holes. The chip transfer system also includes a first cover plate, and the first cover plate is provided with a plurality of fourth alignment holes. The plurality of fourth alignment holes correspond to the chip bonding areas on the target substrate to which the chips have not been transferred when the first cover plate is placed in the second chamber. In this way, after the first cover plate is covered on the first alignment plate, the chips that have been transferred to the target substrate are exposed. The first cover plate covers, and each chip bonding area of ​​the untransferred chip is exposed through the corresponding fourth alignment hole; therefore, it can prevent the chips in the chip bonding area of ​​other parts of the transferred chips from being carried away or deviated from the chip bonding area by the fluid during the subsequent chip transfer process, and can also prevent the chips from falling into the chip bonding area of ​​the transferred chip during the subsequent transfer process. The setting of the fourth alignment hole can further facilitate the precise alignment during the transfer process; at this time, after the chip enters the set position of the second chamber 12 with the fluid, it falls onto the corresponding chip bonding area on the target substrate through the fourth alignment hole.

[0129] In another example of the present embodiment, based on the above-mentioned first cover plate, the chip transfer system may further include a second cover plate, and the second cover is provided with a plurality of fifth alignment holes, and the plurality of fifth alignment holes correspond to the chip bonding areas on the target substrate to which the chips have not been transferred when the second cover plate is placed in the second chamber; after the second cover plate covers the first cover plate, the chips transferred to the target substrate are covered by the first cover plate and the second cover plate, and the chip bonding areas of the chips not transferred are exposed through the corresponding fifth alignment holes; this can further prevent the chips in the chip bonding areas of other parts of the transferred chips from being carried away or deviated from the chip bonding areas by the fluid during the subsequent chip transfer process, and can also prevent the chips from falling into the chip bonding areas of the transferred chips during the subsequent transfer process, and the provision of the fifth alignment holes can further facilitate the precise alignment during the subsequent transfer process; at this time, after the chip enters the set position of the second chamber 12 with the fluid, it falls to the corresponding chip bonding area on the target substrate through the fifth alignment holes.

[0130] Of course, in this embodiment, the specific number of cover plates and the specific number and position of the alignment holes on the cover plates can also be flexibly set according to specific application scenarios. Since the specific setting schemes are not exhaustive, they will not be described one by one here. Figure 6-1 to Figure 6-9 The examples shown are explained for understanding.

[0131] See also Figure 6-1 The first alignment plate 81 shown in the figure is provided with first alignment holes 801 corresponding to the chip bonding areas on the target substrate 5. Figure 6-2 The first cover plate 84 shown in the figure is provided with a fourth alignment hole 804. Figure 6-3 The second cover plate 85 shown is provided with a fifth alignment hole 805 .

[0132] See also Figure 6-4 When transferring the chip, the first alignment plate 81 can be attached to the target substrate 5. At this time, each chip bonding area on the target substrate 5 is exposed through the corresponding first alignment hole 801. Then, the chip 6 can be transferred to the corresponding part of the chip bonding area on the target substrate by the methods in the above embodiments. Figure 6-5 As shown, in this application example, the chip 6 transferred in this part of the chip bonding area can be set as a blue light emitting chip.

[0133] Then, the first cover plate 84 is placed in the second chamber 12 and fits with the first alignment plate 81. Figure 6-5 As shown, at this time, the bonding area of ​​the target substrate where the chip is not transferred is exposed through the corresponding fourth alignment hole 804, and the chips on the chip bonding area in other areas are covered by the first cover plate 84. Then, the chip 6 can be transferred to the corresponding other part of the chip bonding area on the target substrate by the methods in the above embodiments, see Figure 6-6 As shown, in this application example, the chip 6 transferred in this part of the chip bonding area can be set as a red light-emitting chip.

[0134] Then, the second cover plate 85 is placed in the second chamber 12 and attached to the first cover plate 84. At this time, the chip bonding area of ​​the target substrate where the chip is not transferred is exposed through the corresponding fifth alignment hole 805, and the chips on the chip bonding area in other areas are covered by the second cover plate 85. Figure 6-7 As shown, the chip 6 can be transferred to the chip bonding area of ​​the target substrate in the manner described in the above embodiments. Figure 6-8 As shown, in this application example, the chip 6 transferred in this part of the chip bonding area can be set as a blue light emitting chip.

[0135] After completing the transfer of all chips through the above process, the target substrate, the first alignment plate 81, the first cover plate 84 and the second cover plate 85 can be taken out from the second chamber 12, and then the chips on the target substrate can be bonded to their corresponding chip bonding areas.

[0136] Another optional embodiment of the present invention:

[0137] This embodiment provides another exemplary chip transfer system based on the above embodiments. In this embodiment, the alignment plate, the cover plate, and the second adsorption device in the above embodiments can be retained or omitted.

[0138] The chip transfer system provided in this embodiment also includes at least one third adsorption device arranged on the box body, corresponding to at least one chip bonding area on the target substrate, and the adsorption control device is also used to control the magnitude of the third adsorption force generated by the third adsorption device; wherein: the implementation method of the third adsorption device can adopt but is not limited to the implementation method of the above-mentioned first adsorption device, which will not be repeated here.

[0139] In an embodiment, at least one of the third adsorption devices is used to generate a third adsorption force to suck out the interference (if any) on the chip bonding area from the chip bonding area before transferring the chip to the corresponding chip bonding area, and remove it from the second chamber through the liquid outlet. That is, in this embodiment, for at least one of the chip bonding areas on the target substrate, before transferring the chip thereto by the methods in the above embodiments, the interference on the chip bonding area can be purified by the corresponding third adsorption device, and the interference may include but is not limited to at least one of the residues in the chip transfer process, the chip mistakenly transferred to the chip bonding area, etc.

[0140] It should be understood that in some examples of the present embodiment, at least one third adsorption device can be realized by, but not limited to, reusing the first adsorption device. That is, the first adsorption device can generate a first adsorption force for chip transfer during chip transfer, and can also be moved to the corresponding chip bonding area to generate a third adsorption force for purification during the above-mentioned purification process. In other examples, an additional adsorption device can be set separately as the third adsorption device, that is, the first adsorption device is not reused; or in some other examples, a part of the third adsorption device can be realized by reusing the first adsorption device, and a part of the third adsorption device is set additionally. The specific method can be flexibly set according to needs.

[0141] It should be understood that the specific number of the third adsorption devices in this embodiment can also be flexibly set according to the needs. For example, in some examples, for the part of the chip bonding area on the target substrate where the chip is first transferred, the third adsorption device may not be set correspondingly, and the other chip bonding areas are respectively set correspondingly to the third adsorption devices. Or a third adsorption device is set correspondingly to each chip bonding area, that is, the chip transfer system includes a plurality of third adsorption devices arranged on the box body, which correspond to each chip bonding area on the target substrate. And the correspondence between the set third adsorption device and the chip bonding area can be one-to-one, or a third adsorption device can be set to correspond to multiple chip bonding areas (for example, at this time, the third adsorption force generated by this third adsorption device can directly cover these multiple chip bonding areas, or this third adsorption device can be moved between these multiple chip bonding areas, etc.), and the specific correspondence can also be flexibly set according to the specific application requirements, which will not be repeated here.

[0142] For ease of understanding, this embodiment is described below in conjunction with Figure 7-1 and Figure 7-2 The third adsorption device setting example shown is further explained for ease of understanding.

[0143] See also Figure 7-1 As shown, a plurality of third adsorption devices 33 are provided on the upper baffle plate 101 of the box body, and each third adsorption device 33 corresponds one-to-one to a corresponding chip bonding area on a portion of the target substrate (for example, it can be the second group of chip bonding areas and the third group of chip bonding areas in the above example), and another portion of the chip bonding area on the target substrate that does not correspond to the third adsorption device (for example, it can be the first group of chip bonding areas in the above example) is the chip bonding area for chip transfer in the first stage (that is, first) during chip transfer. This part of the chip bonding area is the first to perform chip transfer, so the probability of interference thereon is relatively small, and therefore, the third adsorption device may not be provided accordingly, thereby reducing the complexity of the chip transfer system structure, reducing costs and improving chip transfer efficiency.

[0144] See also Figure 7-2 As shown, a plurality of third adsorption devices 33 are provided on the upper baffle plate 101 of the box body, and each third adsorption device 33 corresponds to each chip bonding area on the target substrate. In this example, the chip can be processed by the above-mentioned interference purification method before being transferred to each chip bonding area. The chip can also be selectively processed by the above-mentioned interference purification method before being transferred to a certain part of the chip bonding area according to the needs.

[0145] By means of the third adsorption device provided in this embodiment, before transferring the chip to its corresponding chip bonding area, the interference substances on the chip bonding area can be removed from the chip bonding area by means of the third adsorption device, thereby avoiding the interference substances from affecting the subsequent chip transfer and further improving the accuracy and reliability of the chip transfer.

[0146] Another optional embodiment of the present invention:

[0147] This embodiment provides another example of a chip transfer system based on the above embodiments. The chip transfer system in this embodiment further adds a number of chip detection devices. The several chip detection devices are arranged on the box body, corresponding to each chip bonding area on the target substrate; the chip detection device is used to detect whether a chip is placed on the corresponding chip bonding area. In this embodiment, after the chip is transferred to each chip bonding area, the chip detection device corresponding to the chip bonding area can be used to detect whether a chip is placed on the chip bonding area. It can also be detected by the chip detection device after the chips in all the chip bonding areas on the target substrate are transferred and before the target substrate is moved out of the second chamber. In this embodiment, when it is detected that no chip is placed in a chip bonding area, the chip can be re-transferred to the chip bonding area by the chip transfer system provided in the above embodiments, or the chip can be re-transferred to the chip bonding area by other existing chip transfer methods.

[0148] It should be understood that the corresponding relationship between the chip detection device and the chip bonding area in this embodiment can be one-to-one, or one chip detection device can correspond to multiple chip bonding areas, which can be flexibly set according to application requirements. And the chip detection device in this embodiment can adopt various devices that can realize chip detection. For example, in one example, the chip detection device can adopt an infrared detection device, and the infrared detection device can include an infrared signal transmitting device and a corresponding infrared signal receiving device; the infrared signal transmitting device and the infrared signal receiving device are correspondingly arranged on the upper and lower sides of the chip bonding area of ​​the target substrate (for example, one is arranged on the upper baffle 101, and the other is arranged on the lower baffle 102), and the infrared signal received by the infrared signal receiving device is used to determine whether there is a chip on the chip bonding area. For example, in another example, the chip detection device can be implemented by an image acquisition device, for example, by arranging an image acquisition device at a corresponding position of the upper baffle 101, performing image acquisition on the corresponding chip bonding area on the target substrate, and analyzing whether there is a chip on the chip bonding area based on the acquired image. Of course, in another example, the chip detection can be realized by combining the infrared detection device and the image acquisition device. The above examples are only for illustration purposes, and the chip detection device may also be implemented in other equivalent replacement ways, which will not be described in detail here.

[0149] In another example of this embodiment, in order to further ensure the accuracy of chip transfer, the chip detection device can also be used to detect whether the chip on the corresponding chip bonding area is placed in place. That is, when the presence of a chip on the chip bonding area is detected, it can also be further detected whether the chip is placed in place in the chip bonding area, thereby further improving the accuracy of chip transfer.

[0150] For example, in one example, infrared detection devices may be set at multiple positions corresponding to a chip bonding area, and the signals detected by the multiple infrared detection devices are used to determine whether the chip is properly placed in the chip bonding area. Figure 8-1 As shown, infrared detection devices can be respectively arranged in the four corner areas corresponding to a chip bonding area. When some of the infrared detection devices detect the chip, it indicates that a chip is placed in the chip bonding area; when all the infrared detection devices detect the chip, it indicates that the chip is properly placed in the chip bonding area; when only some of the infrared detection devices detect the chip and the other parts do not detect it, it indicates that the chip is not properly placed in the chip bonding area.

[0151] For example, in another example, when the chip detection device is implemented by an image acquisition device, at least one image acquisition device can be set corresponding to a chip bonding area, and then the image including the chip bonding area acquired by the image acquisition device is compared and analyzed with the standard image of the chip placed in place in the chip bonding area, so as to determine whether there is a chip in the chip bonding area and whether the chip is placed in place.

[0152] In this embodiment, when it is detected that a chip on a chip bonding area is not placed in place, the chip in the chip bonding area can also be adjusted. The adjustment method can be adopted but not limited to the following two methods:

[0153] Method 1: Remove the chip in the chip bonding area from the chip bonding area, and then re-transfer the chip to the chip bonding area. The chip can be re-transferred to the chip bonding area by the chip transfer system provided in the above embodiments, or by other existing chip transfer methods.

[0154] For example, in one example, the chip transfer system also includes a plurality of fourth adsorption devices arranged on the box body, corresponding to each chip bonding area on the target substrate, and the adsorption control device is also used to control the magnitude of the fourth adsorption force generated by the fourth adsorption device; wherein the implementation method of the fourth adsorption device can adopt but is not limited to the implementation method of the above-mentioned first adsorption device, which will not be repeated here.

[0155] The fourth adsorption device is used to generate a fourth adsorption force to suck the chip on the chip bonding area from the chip bonding area when the chip on the corresponding chip bonding area is not placed in place, and remove the second chamber through the liquid outlet to transfer the chip to the chip bonding area again.

[0156] It should be understood that in some examples of the present embodiment, at least one fourth adsorption device can be realized by, but not limited to, reusing the third adsorption device in the above embodiment. That is, the third adsorption device can generate a third adsorption force to remove interferences on the chip bonding area, and can also generate a fourth adsorption force to suck the chip on the chip bonding area from the chip bonding area, and remove the second chamber through the liquid outlet for re-transferring the chip to the chip bonding area. In other examples, an additional adsorption device can also be set separately as the fourth adsorption device, that is, the third adsorption device is not reused; or in some other examples, a part of the fourth adsorption device can be realized by reusing the third adsorption device, and a part of the fourth adsorption device is set additionally. Which method to adopt can be flexibly set according to needs.

[0157] For ease of understanding, this embodiment is described below in conjunction with Figure 8-2 An example of a setting is shown for explanation.

[0158] See also Figure 8-2 As shown, the chip transfer system also includes a plurality of fourth adsorption devices 34 arranged on the first baffle of the box body, corresponding to each chip bonding area on the target substrate. When it is detected that the chip on a chip bonding area is not placed in place, the chip can be removed from the chip bonding area by the fourth adsorption force generated by the corresponding fourth adsorption device on the chip bonding area, and the second chamber can be removed through the liquid outlet (for example, the chip can be removed from the liquid outlet along with the fluid).

[0159] Method 2: The chip transfer system may also include a chip position adjustment device, through which the chip position in the chip bonding area is adjusted. For example, in one example, a control device can be provided to make the box vibrate or shake in a preset direction, force and frequency, and the control device controls the box to vibrate or shake to adjust the position of the chip in the chip bonding area, and after the adjustment, the chip detection device is used to re-detect, and if there are still chips that are not in place, further adjustments can be made until all or a preset number of chips are in place.

[0160] Another optional embodiment of the present invention:

[0161] This embodiment provides a display backplane, which includes a backplane body, on which a plurality of chip bonding areas are arranged, and the backplane body is used as a target substrate, and the light-emitting chip is transferred to the chip bonding area on the backplane body through the chip transfer system shown in the above embodiments. Compared with the existing display backplane, it has better manufacturing efficiency and yield rate, and lower cost.

[0162] This embodiment also provides a display device, which can be various electronic devices that use the display backplane shown above to display, such as but not limited to various smart mobile terminals, vehicle-mounted terminals, PCs, monitors, electronic billboards, etc.

[0163] It should be understood that the application of the present invention is not limited to the above examples. For ordinary technicians in this field, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A chip transfer system, characterized in that: Including box, fluid equipment and adsorption equipment; A first chamber and a second chamber communicating with each other are formed in the box body, and a substrate placement structure for placing a transfer substrate and a target substrate into the first chamber and the second chamber respectively, and a liquid inlet and a liquid outlet communicating with the first chamber and the second chamber respectively are provided on the box body; The fluid device includes a storage device for storing fluid, the storage device is connected to the liquid inlet through a pipeline, so that the fluid flows into the first chamber and the second chamber in sequence through the liquid inlet; the fluid device also includes a fluid control device for controlling the flow rate of the fluid in the first chamber and the second chamber; The adsorption device comprises a plurality of first adsorption devices and second adsorption devices which are arranged on the box body and can move between the first chamber and the second chamber, and an adsorption control device for controlling the first adsorption device to generate a first adsorption force and controlling the second adsorption device to generate a second adsorption force; the first adsorption device is arranged opposite to a chip carrying surface on the transfer substrate for carrying the chip; the second adsorption device is arranged opposite to a side opposite to the chip carrying surface; When the chip is transferred, the chip located on the transfer substrate is detached from the transfer substrate under the action of the first adsorption force generated by the corresponding first adsorption device, and under the action of the thrust generated by the first adsorption force, the second adsorption force generated by the corresponding second adsorption device and the fluid flowing from the first chamber to the second chamber, the chip moves to the set position of the second chamber along with the fluid, and then falls onto the corresponding chip bonding area on the target substrate through the control of the first adsorption force, the second adsorption force and the fluid.

2. The chip transfer system according to claim 1, characterized in that: The chip transfer system further comprises a first alignment plate, wherein the first alignment plate is provided with first alignment holes corresponding to at least a portion of the chip bonding area on the target substrate; After the chip moves to a set position in the second chamber along with the fluid, it falls onto a corresponding chip bonding area on the target substrate through the first alignment hole.

3. The chip transfer system according to claim 2, characterized in that: The first alignment plate is provided with first alignment holes corresponding to the first group of chip bonding areas on the target substrate. After the first alignment plate is covered on the target substrate, the first group of chip bonding areas are exposed through the corresponding first alignment holes, and other parts of the chip bonding areas are covered by the first alignment plate; The chip transfer system also includes a second alignment plate, on which second alignment holes corresponding to the second group of chip bonding areas on the target substrate are provided; the second alignment plate is used to cover the target substrate after the first alignment plate is removed from the second chamber, the second group of chip bonding areas on the target substrate are exposed through the corresponding second alignment holes, and other parts of the chip bonding areas are covered by the second alignment plate; after the chip moves to the set position of the second chamber along with the fluid, it falls onto the corresponding chip bonding area on the target substrate through the second alignment hole.

4. The chip transfer system according to claim 3, characterized in that: The chip transfer system also includes a third alignment plate, on which is provided a third alignment hole corresponding to the third group of chip bonding areas on the target substrate; the third alignment plate is used to cover the target substrate after the second alignment plate is removed from the second chamber, the third group of chip bonding areas on the target substrate are exposed through the corresponding third alignment holes, and other parts of the chip bonding areas are covered by the third alignment plate; after the chip moves to the set position of the second chamber along with the fluid, it falls onto the corresponding chip bonding area on the target substrate through the third alignment hole.

5. The chip transfer system according to claim 2, characterized in that: The first alignment plate is provided with first alignment holes corresponding to the chip bonding areas on the target substrate, and after the first alignment plate is covered on the target substrate, the chip bonding areas on the target substrate are exposed through the corresponding first alignment holes; The chip transfer system further comprises a first cover plate, wherein the first cover plate is provided with a plurality of fourth alignment holes, wherein the plurality of fourth alignment holes correspond to chip bonding areas on the target substrate to which the chips have not been transferred when the first cover plate is placed into the second chamber; After the first cover plate covers the first alignment plate, each chip that has been transferred to the target substrate is covered by the first cover plate, and each chip bonding area of ​​the untransferred chip is exposed through the corresponding fourth alignment hole; after the chip enters the set position of the second chamber along with the fluid, it falls onto the corresponding chip bonding area on the target substrate through the fourth alignment hole.

6. The chip transfer system according to claim 5, characterized in that: The chip transfer system further comprises a second cover plate, wherein the second cover plate is provided with a plurality of fifth alignment holes, wherein the plurality of fifth alignment holes correspond to chip bonding areas on the target substrate to which the chips have not been transferred when the second cover plate is placed into the second chamber; After the second cover plate covers the first cover plate, each chip that has been transferred to the target substrate is covered by the first cover plate and the second cover plate, and each chip bonding area of ​​the untransferred chip is exposed through the corresponding fifth alignment hole; after the chip enters the set position of the second chamber along with the fluid, it falls onto the corresponding chip bonding area on the target substrate through the fifth alignment hole.

7. The chip transfer system according to any one of claims 1 to 6, characterized in that: The chip transfer system further comprises at least one third adsorption device disposed on the box body and corresponding to at least one chip bonding area on the target substrate, and the adsorption control device is further used to control the magnitude of a third adsorption force generated by the third adsorption device; At least one of the third adsorption devices is used to generate a third adsorption force to absorb the interference on the chip bonding area from the chip bonding area before transferring the chip to its corresponding chip bonding area, and remove the second chamber through the liquid outlet.

8. The chip transfer system according to claim 7, characterized in that: The chip transfer system comprises a plurality of third adsorption devices which are arranged on the box body and correspond to the chip bonding areas on the target substrate respectively.

9. The chip transfer system according to any one of claims 1 to 6, characterized in that: The chip transfer system further includes a plurality of chip detection devices disposed on the box body and corresponding to each chip bonding area on the target substrate; The chip detection device is used to detect whether a chip is placed on the corresponding chip bonding area.

10. The chip transfer system according to claim 9, characterized in that: The chip detection device is also used to detect whether the chip on the corresponding chip bonding area is placed in place; The chip transfer system further includes a plurality of fourth adsorption devices disposed on the box body and corresponding to the chip bonding areas on the target substrate, respectively, and the adsorption control device is further used to control the magnitude of the fourth adsorption force generated by the fourth adsorption device; The fourth adsorption device is used to generate a fourth adsorption force to suck the chip on the chip bonding area from the chip bonding area when the chip on the corresponding chip bonding area is not placed in place, and remove the second chamber through the liquid outlet to transfer the chip to the chip bonding area again.

Images