Display panel and evaporation device

Abstract

The present application discloses a display panel and an evaporation device, wherein the substrate of the organic light-emitting functional layer of the display panel comprises a plurality of first substrates and a second substrate arranged around the plurality of first substrates, wherein the mechanical strength of the first substrates is greater than that of the second substrates; the present application makes the mechanical strength of the first substrate greater than that of the second substrate, so that after the supporting chuck in the evaporation device moves to complete the evaporation process on the substrate, the pinholes on the first substrate and the supporting chuck are arranged correspondingly, so that when the pins lift the substrate to separate the substrate from the supporting chuck, the position where the first substrate is connected to the second substrate is unlikely to break, thereby achieving the technical effect of improving the product yield.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and an evaporation device. Background Art

[0002] Organic Light Emitting Diode (OLED) is an organic thin film electroluminescent device, which has the advantages of easy formation of flexible structure and wide viewing angle; therefore, display technology using organic light emitting diodes has become an important display technology.

[0003] In the current large-size OLED panel production process, in order to prevent the substrate from sagging, adhesive is usually attached to the back of the substrate, and then the back of the substrate and the carrier chuck are adhered to each other to control the amount of substrate sagging; when the substrate film is formed, the pins are raised and lowered to pass through the pinholes of the carrier chuck to lift the substrate, so that the substrate is separated from the bearing surface of the carrier chuck. However, during the separation process, since the substrate and the carrier chuck are too tightly attached, the pins will lift the substrate, which will cause greater stress on the substrate, causing the substrate to easily break at the edge of the adhesive, resulting in product defects and further affecting the production yield of the finished product.

[0004] Therefore, how to reduce the stress generated when the substrate and the pins are separated has become a technical problem that needs to be urgently solved in the evaporation film formation of large-size OLED panels. Summary of the invention

[0005] The present application provides an evaporation device and an evaporation method to improve the technical problem that the substrate and the pins are easily broken when separated during the evaporation film formation of the existing large-size OLED panel.

[0006] To solve the above-mentioned problems, the technical solutions provided by this application are as follows:

[0007] The embodiment of the present application provides a display panel, including a substrate and an organic light-emitting functional layer arranged on the substrate, wherein the substrate includes a plurality of first substrates and a second substrate arranged around the plurality of first substrates;

[0008] Wherein, the mechanical strength of the first substrate is greater than the mechanical strength of the second substrate.

[0009] In the display panel provided in the embodiment of the present application, the first substrate includes a first sub-portion and a second sub-portion connected to the first sub-portion, and the second sub-portion is located on a side of the first sub-portion away from the organic light-emitting functional layer;

[0010] The thickness of the first substrate is the same as the thickness of the second substrate, and the mechanical strength of the second sub-section is greater than the mechanical strength of the first sub-section.

[0011] In the display panel provided in the embodiment of the present application, the first substrate includes a substrate body and a strengthening layer located on the substrate body;

[0012] The thickness of the first substrate is greater than the thickness of the second substrate, and the mechanical strength of the strengthening layer is greater than the mechanical strength of the substrate body.

[0013] In the display panel provided in the embodiment of the present application, the material of the strengthening layer includes any one of a eucryptite crystalline material, a silicon dioxide-rich material, a microcrystalline material and a sodium silicate material.

[0014] In the display panel provided in the embodiment of the present application, the strength ratio of the first substrate to the second substrate is between 1.01 and 5.

[0015] Accordingly, an embodiment of the present application provides an evaporation device for evaporating a display panel as described in any one of the above items, comprising a base and a carrying chuck located on the base, wherein the base is further provided with a pin, and the pin can move relative to the base, and the carrying chuck is provided with a pinhole corresponding to the pin, and the pin passes through the pinhole to adsorb the substrate;

[0016] Wherein, each of the first substrates is arranged in one-to-one correspondence with each of the pinholes.

[0017] In the evaporation device provided in the embodiment of the present application, the pin includes a supporting portion and an ejector portion connected to the supporting portion;

[0018] Wherein, in the top view direction of the base, the orthographic projection area of ​​the ejector portion on the base is greater than or equal to 0.5 times the orthographic projection area of ​​the support portion on the base.

[0019] In the evaporation device provided in the embodiment of the present application, the mechanical strength of the ejector pin portion is smaller than the mechanical strength of the support portion, and the material of the ejector pin portion includes a soft rubber material.

[0020] In the evaporation device provided in the embodiment of the present application, the orthographic projection of the ejector pin portion on the strengthening layer is located inside the strengthening layer.

[0021] In the evaporation device provided in the embodiment of the present application, the evaporation device further comprises an adhesive layer attached to the substrate, and the adhesive layer is interposed between the substrate and the carrying chuck;

[0022] Wherein, the adhesive layer comprises a plurality of sub-adhesive layers arranged at intervals, and each of the pinholes is arranged between two adjacent sub-adhesive layers.

[0023] Beneficial effects: The present application discloses a display panel and an evaporation device, wherein the display panel includes a substrate and an organic light-emitting functional layer arranged on the substrate, wherein the substrate includes a plurality of first substrates and a second substrate arranged around the plurality of first substrates, wherein the mechanical strength of the first substrate is greater than the mechanical strength of the second substrate; the present application makes the mechanical strength of the first substrate greater than the mechanical strength of the second substrate, so that after the supporting chuck in the evaporation device moves to complete the evaporation process of the substrate, the pinholes on the first substrate and the supporting chuck are arranged correspondingly, so that when the pins lift the substrate to separate the substrate from the supporting chuck, the position where the first substrate is connected to the second substrate is unlikely to break, thereby achieving the technical effect of improving the product yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The technical solution and other beneficial effects of the present application will be made apparent by describing in detail the specific implementation methods of the present application in conjunction with the accompanying drawings.

[0025] Figure 1 A cross-sectional structural diagram of a display panel provided in the first embodiment of the present application;

[0026] Figure 2 A cross-sectional structural diagram of a display panel provided in a second embodiment of the present application;

[0027] Figure 3 A schematic diagram of the structure of the evaporation device provided in an embodiment of the present application;

[0028] Figure 4 A schematic diagram of the distribution of the adhesive layer in the evaporation device provided in an embodiment of the present application;

[0029] Figure 5 This is an enlarged schematic diagram of the evaporation device provided in an embodiment of the present application at point A;

[0030] Figure 6 A step diagram of the evaporation method provided in an embodiment of the present application. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0032] See also Figures 1 to 6The present application provides a display panel 100 and an evaporation device 200, wherein the display panel 100 includes a substrate 11 and an organic light-emitting functional layer 13 arranged on the substrate 11, wherein the substrate 11 includes a plurality of first substrates 111 and a second substrate 112 arranged around the plurality of first substrates 111, wherein the first substrates 111 are arranged corresponding to pinholes 211 arranged on a supporting chuck 21 bonded to the substrate 11 during the evaporation process, wherein the mechanical strength of the first substrate 111 is greater than the mechanical strength of the second substrate 112.

[0033] When the organic light-emitting functional layer 13 is prepared on the substrate 11 through the evaporation process, the substrate 11 is adsorbed on the supporting chuck 21, and then the supporting chuck 21 is moved to complete the evaporation process of the substrate 11. Since the mechanical strength of the first base 111 corresponding to the pinhole 211 is greater than the mechanical strength of the second base 112 located around the first base 111, when the pin 24 lifts the substrate 11 to separate the substrate 11 from the supporting chuck 21, the position where the first base 111 and the second base 112 are connected is unlikely to break, thereby achieving the technical effect of improving the product yield.

[0034] The technical solution of the present application is now described in conjunction with specific embodiments.

[0035] Embodiment 1

[0036] See also Figure 1 , the figure is a cross-sectional structural diagram of the display panel 100 provided in the first embodiment of the present application; wherein, the display panel 100 includes a substrate 11, an array structure layer 12 arranged on the substrate 11, an organic light-emitting functional layer 13 arranged on the array structure layer 12, and a thin film encapsulation layer 14 arranged on the array structure layer 12.

[0037] In the embodiment of the present application, the material of the substrate 11 is glass.

[0038] In the embodiment of the present application, the array structure layer 12 includes a buffer layer, a TFT circuit layer, an anode metal layer and a pixel definition layer arranged from bottom to top. The TFT circuit layer includes an active layer, a source electrode, a drain electrode, a gate electrode and a gate insulation layer, and the source electrode and the drain electrode are respectively in contact with the active layer; the pixel definition layer is used to define an opening area, and the organic light-emitting functional layer 13 is arranged in the opening area.

[0039] Specifically, the organic light-emitting functional layer 13 includes an OLED light-emitting layer, a cathode metal layer, a cap layer and a lithium fluoride layer arranged from bottom to top. In addition to the light-emitting layer, the OLED light-emitting layer also includes one or more layers of an electron transport layer, an electron injection layer, a hole transport layer and a hole injection layer. The cap layer is also called a light extraction layer, which has the functions of narrowing, selecting and strengthening the light, and can enhance the light in the direction perpendicular to the array structure layer 12, thereby improving the light emission efficiency.

[0040] Furthermore, in the embodiment of the present application, the organic light-emitting functional layer 13 is prepared by an evaporation process.

[0041] In the embodiment of the present application, the thin film encapsulation layer 14 is formed on the array structure layer 12 ; the thin film encapsulation layer 14 includes a first inorganic encapsulation layer, an organic encapsulation layer and a second inorganic encapsulation layer which are arranged on the array structure layer 12 and cover the organic light-emitting functional layer 13 .

[0042] Furthermore, the first inorganic encapsulation layer and the second inorganic encapsulation layer are prepared by plasma enhanced chemical vapor deposition, atomic layer deposition technology, pulsed laser deposition technology (and sputtering technology and the like. The thickness of the first inorganic encapsulation layer and the second inorganic encapsulation layer is the same; the materials of the first inorganic encapsulation layer and the second inorganic encapsulation layer are any one of silicon nitride, silicon oxynitride, silicon oxide, silicon carbonitride, zinc oxide and aluminum oxide. The material of the organic encapsulation layer is polyimide or epoxy resin.

[0043] In an embodiment of the present application, the substrate 11 includes a plurality of first substrates 111 and a second substrate 112 arranged around the plurality of first substrates 111, the first substrates 111 are arranged corresponding to the pinholes 211 set on the supporting chuck 21 bonded to the substrate 11 in the evaporation process, wherein the mechanical strength of the first substrate 111 is greater than the mechanical strength of the second substrate 112.

[0044] In the embodiment of the present application, the first substrate 111 includes a first sub-portion and a second sub-portion connected to the first sub-portion, and the second sub-portion is located on a side of the first sub-portion away from the organic light-emitting functional layer;

[0045] The thickness of the first substrate 111 is the same as the thickness of the second substrate 112 , and the mechanical strength of the second sub-section is greater than the mechanical strength of the first sub-section.

[0046] Specifically, the first substrate 111 is disposed correspondingly in the non-display area of ​​the display panel 100; the first substrate 111 is prepared by the substrate 11 through a strengthening process (i.e., a local area of ​​the substrate 11 is strengthened), and the second substrate 112 is not subjected to the strengthening process. Therefore, the mechanical strength of the first substrate 111 is greater than that of the second substrate 112.

[0047] Furthermore, the strengthening treatment process includes any one of an ion exchange method, a dealkalization method, a surface crystallization method, and a sodium silicate strengthening method.

[0048] In the embodiment of the present application, the ion exchange method includes any one of a high-temperature ion exchange method and a low-temperature ion exchange method.

[0049] The high temperature ion exchange method mainly involves exchanging Na-containing 2 O or K 2 O glass intrudes into the molten salt of lithium, making the Na + or Li in molten salts with smaller radius + Phase exchange, and then cooled to room temperature, due to the Li + The surface layer and Na + or K + The inner layer has different expansion coefficients, and the surface produces residual pressure and strengthens. At the same time, the glass contains AL 2 O 3 、TiO 2 When the composition is the same as that of the ion exchange, p-eucryptite (LiO, AL 2 O 3 , 2SiO 2 ) crystallization, and a great pressure will be generated on the surface of the cooled glass, which can make the strength of the glass as high as 700MPa.

[0050] The low temperature ion exchange method is mainly to use surface alkali ions (such as Na + ) and monovalent cations with larger ionic radius (such as K + ) and Na + Ion exchange, K + Methods of entering the surface. For example, Na 2 O / CaO / SiO 2 The system glass composed of the three components can be immersed in molten salt at 400 to 500 degrees Celsius for more than ten hours. The low-temperature ion exchange method can easily obtain high strength, with the characteristics of simple processing method, no damage to the transparency of the glass surface, and no deformation.

[0051] The chemically strengthened glass commonly used is manufactured using a low-temperature ion exchange process. The so-called low-temperature system refers to the exchange temperature not higher than the glass transition temperature, which is relative to the high-temperature ion exchange process above the transition temperature and below the softening point.

[0052] The dealkalization method mainly uses a Pt catalyst to treat glass in a high-temperature atmosphere containing sulfurous acid gas and water, so that Na+ ions seep out from the surface of the glass and react with sulfurous acid, so that the surface layer becomes a silicon oxide-rich layer. As a result, the surface layer becomes a low-expansion glass, which generates compressive stress when cooled. 2 O / CaO / SiO 2 Although the glass composed of these three components can be used, the effect is not so obvious.

[0053] The surface crystallization method is mainly a method of forming low expansion coefficient microcrystals on the surface through heat treatment to strengthen it. This method must use glass that precipitates low expansion micro-mirrors, with a composition of Li 2 O / Al 2 O 3 / SiO 2 The representative is the system glass composed of the three components. However, it is difficult to melt and is easy to deform during the precipitation of microcrystals.

[0054] The sodium silicate strengthening method mainly involves treating an aqueous solution of sodium silicate at a temperature above 100 degrees Celsius and at several atmospheres of pressure to obtain high-strength glass with a surface that is difficult to scratch.

[0055] In the embodiment of the present application, the strength ratio of the first substrate 111 to the second substrate 112 is between 1.01 and 5; wherein, when the strength ratio of the first substrate 111 to the second substrate 112 is less than 1.01, the reinforcement degree of the first substrate 111 is not high, which may easily lead to that when the organic light-emitting functional layer 13 is formed by the evaporation process, the pin 24 is used to lift the substrate 11 to separate the substrate 11 from the supporting chuck 21, the position where the first substrate 111 and the second substrate 112 are connected may be easily broken, thereby affecting the product yield.

[0056] When the strength ratio of the first substrate 111 to the second substrate 112 is greater than 5, the degree of reinforcement of the first substrate 111 is too high, which may easily lead to the first substrate 111 crushing the pins 24 when the substrate 11 is lifted up by the pins 24 to separate the substrate 11 from the supporting chuck 21 after the organic light-emitting functional layer 13 is formed by the evaporation process, thereby making it difficult to separate the substrate 11 from the supporting chuck 21.

[0057] In view of the technical problem that the substrate 11 and the pins 24 are prone to breakage when separated during the evaporation film formation of the existing large-size OLED panel, the present application obtains the first base 111 by performing a strengthening treatment on a local area of ​​the substrate 11, so that the mechanical strength of the first base 111 is greater than the mechanical strength of the second base 112 located around the first base 111. When the organic light-emitting functional layer 13 is prepared on the substrate 11 by the evaporation process, the substrate 11 is adsorbed on the supporting chuck 21, and then the supporting chuck 21 is moved to complete the evaporation process of the substrate 11. Since the mechanical strength of the first base 111 corresponding to the pinhole 211 is greater than the mechanical strength of the second base 112 located around the first base 111, when the pin 24 lifts the substrate 11 to separate the substrate 11 from the supporting chuck 21, the position where the first base 111 and the second base 112 are connected is unlikely to break, thereby achieving the technical effect of improving the product yield.

[0058] Embodiment 2

[0059] like Figure 2 , which is a cross-sectional structural diagram of a display panel 100 provided in the second embodiment of the present application; wherein, the structure of the display panel 100 in the second embodiment of the present application is the same as or similar to the structure of the display panel 100 in the first embodiment of the present application, and the only difference is that the first substrate 111 includes a substrate body 1111 and a strengthening layer 1112 located on the substrate body 1111, and the second substrate 112 only includes the substrate body 1111;

[0060] The thickness of the first substrate 111 is greater than the thickness of the second substrate 112 , and the mechanical strength of the strengthening layer 1112 is greater than the mechanical strength of the substrate body 1111 .

[0061] In an embodiment of the present application, the strengthening layer 1112 is formed on the substrate 11 by any one of the ion exchange method, the dealkalization method, the surface crystallization method, and the sodium silicate strengthening method, and the strengthening layer 1112 is located on the side of the substrate 11 away from the organic light-emitting functional layer 13.

[0062] Furthermore, the material of the strengthening layer 1112 includes any one of eucryptite crystalline material, silica-rich material, microcrystalline material and sodium silicate material.

[0063] In view of the technical problem that the substrate 11 and the pins 24 are prone to breakage when they are separated during the evaporation film formation of the existing large-size OLED panel, the present application forms the first base 111 by adding a layer of the strengthening layer 1112 in a local area of ​​the substrate 11, so that the mechanical strength of the first base 111 is greater than the mechanical strength of the second base 112 located around the first base 111. When the organic light-emitting functional layer 13 is prepared on the substrate 11 by the evaporation process, the substrate 11 is adsorbed on the supporting chuck 21, and then the supporting chuck 21 is moved to complete the evaporation process of the substrate 11. Since the mechanical strength of the first base 111 corresponding to the pinhole 211 is greater than the mechanical strength of the second base 112 located around the first base 111, when the pin 24 lifts the substrate 11 to separate the substrate 11 from the supporting chuck 21, the position where the first base 111 and the second base 112 are connected is difficult to break, thereby achieving the technical effect of improving the product yield.

[0064] like Figure 3 , which is a schematic diagram of the structure of the evaporation device 200 provided in an embodiment of the present application; wherein the evaporation device 200 includes a base 23 and a carrier chuck 21 located on the base 23, the base 23 is further provided with a pin 24, the pin 24 can move relative to the base 23, the carrier chuck 21 is provided with a pinhole 211 corresponding to the pin 24, the pin 24 passes through the pinhole 211 to adsorb the substrate 11. wherein the pin 24 is connected to an air compression device (not shown).

[0065] In the embodiment of the present application, each first base 111 is arranged in one-to-one correspondence with each pinhole 211; the carrying chuck 21 is used to carry the substrate 11, and the evaporation process of the substrate 11 is realized by moving and rotating the carrying chuck 21. The carrying chuck 21 is placed on the base 23.

[0066] like Figure 4 FIG. 2 is a schematic diagram showing the distribution of the adhesive layer 22 in the evaporation device 200 provided in the embodiment of the present application; please refer to FIG. Figure 3 as well as Figure 4 , the evaporation device 200 further includes an adhesive layer 22 attached to the substrate 11, and the adhesive layer 22 is between the substrate 11 and the carrying chuck 21;

[0067] In the embodiment of the present application, the adhesive layer 22 is a photosensitive adhesive, and the substrate 11 and the carrier chuck 21 are detachably connected by the photosensitive adhesive. The viscosity of the photosensitive adhesive decreases under the action of a light source, so that the substrate 11 and the carrier chuck 21 can be separated smoothly.

[0068] Furthermore, the light source is an ultraviolet light source.

[0069] Obviously, in other embodiments, the photosensitive adhesive may also be other forms of adhesive, as long as the adhesiveness of the adhesive can be reduced by a certain treatment method. For example, the photosensitive adhesive may also be a heat-sensitive adhesive, and the above-mentioned effect can also be achieved by replacing the light source with a heat source. This application is only an illustrative example, and any modification, equivalent replacement and improvement made within the spirit and principle of the above-mentioned embodiments shall be included in the protection scope of this technical solution.

[0070] Furthermore, the carrier chuck 21 is made of a transparent material so that the ultraviolet light source can pass through the carrier chuck 21 to illuminate the photosensitive adhesive, thereby separating the carrier chuck 21 and the substrate 11 .

[0071] like Figure 5 , which is an enlarged schematic diagram of the evaporation device 200 provided in the embodiment of the present application at A; please refer to Figure 4 as well as Figure 5 The adhesive layer 22 includes a plurality of spaced-apart sub-adhesive layers 221, and each pinhole 211 is disposed between two adjacent sub-adhesive layers 221. The adhesive layer 22 is formed in the non-film-forming area of ​​the substrate 11 to avoid affecting the display area of ​​the display panel 100.

[0072] Specifically, a plurality of the sub-adhesive layers 221 form a minimum repeating pattern unit, and a portion of the display panel 100 within the minimum repeating pattern unit may be used as a sub-display panel 100 after being cut.

[0073] It is understandable that the evaporation device 200 of the present application also includes a control system, a moving mechanism, a rotating mechanism, an evaporation mechanism, etc. Since these mechanisms are not the focus of the present application, they are not introduced in detail here.

[0074] See also Figure 3 In the embodiment of the present application, the pin 24 includes a supporting portion 241 and a pin portion 242 connected to the supporting portion 241;

[0075] In the top view direction of the base 23, the orthographic projection area of ​​the ejector portion 242 on the base 23 is greater than or equal to 0.5 times the orthographic projection area of ​​the support portion 241 on the base 23. This arrangement can reduce the contact area between the pins 24 and the substrate 11, so as to facilitate the separation of the substrate 11 from the carrier chuck 21 after the evaporation is completed. In the carrier chuck 21, the pinholes 211 are arranged in an array, and the pins 24 are arranged in the area between the pinholes 211. The pinholes 211 correspond to the pins 24 one by one.

[0076] Specifically, when the orthographic projection area of ​​the ejector portion 242 on the base 23 is smaller than 0.5 times the orthographic projection area of ​​the support portion 241 on the base 23, it is difficult for the pin 24 to disperse the stress on the substrate 11 when it is separated from the supporting chuck 21, thereby causing the position where the first base 111 and the second base 112 are connected to break, thereby reducing the product yield of the display panel 100.

[0077] Furthermore, the cross section of the ejector pin portion 242 close to the substrate 11 is a flat-top design. Compared with the existing cone-top design, this design increases the contact area between the pin 24 and the substrate 11 and reduces the compressive stress on the portion of the substrate 11 corresponding to the pin 24.

[0078] In the embodiment of the present application, the mechanical strength of the ejector portion 242 is less than that of the support portion 241 , and the material of the ejector portion 242 includes a soft rubber material. This is to prevent the ejector portion 242 from piercing the substrate 11 .

[0079] In the embodiment of the present application, the first substrate 111 further includes the strengthening layer 1112, the strengthening layer 1112 is located between the pinholes 211, and the orthographic projection of the ejector portion 242 on the strengthening layer 1112 is located within the strengthening layer 1112. This arrangement is to prevent the pins 24 from contacting the portion of the substrate 11 that has not been strengthened, so as to prevent the first substrate 111 from being broken at the connection position with the second substrate 112 when the pins 24 lift the substrate 11 to separate the substrate 11 from the carrier chuck 21, thereby reducing the product yield of the display panel 100.

[0080] In an embodiment of the present application, the pressure and time for the pin 24 to lift the substrate 11 can be pre-set in the control system so that when the pin 24 descends and the substrate 11 is just attached to the supporting chuck 21, the pin 24 just releases the adsorption effect on the substrate 11.

[0081] The evaporation device 200 provided in the present application strengthens the portion of the substrate 11 corresponding to the pinhole 211 (direct local strengthening or coating a strengthening layer 1112), and then attaches the substrate 11 to the supporting chuck 21 through the adhesive layer 22, and then completes the evaporation process of the substrate 11 by moving the supporting chuck 21. After the evaporation is completed, the substrate 11 is lifted up by the pins 24 to be separated from the supporting chuck 21, so that the portion of the substrate 11 near the adhesive layer 22 is difficult to break, thereby achieving the technical effect of improving the product yield.

[0082] Accordingly, if Figure 6 FIG. 1 is a diagram showing the steps of the evaporation method provided in an embodiment of the present application. The steps include:

[0083] S10 , placing the carrier chuck 21 on the base 23 , and the pins 24 on the base 23 extend out and pass through the pinholes 211 on the carrier chuck 21 .

[0084] Specifically, the S10 further includes:

[0085] First, the carrier chuck 21 is placed on the base 23 , and the pins 24 on the base 23 extend out and pass through the pin holes 211 on the carrier chuck 21 .

[0086] S20 , placing the substrate 11 on the pins 24 , and the pins 24 adsorb the substrate 11 .

[0087] Specifically, the S20 further includes:

[0088] Afterwards, the substrate 11 is placed on the pin 24, and the pin 24 absorbs the substrate 11; wherein the substrate 11 includes a first base 111 arranged corresponding to the pinhole 211 and a second base 112 located around the first base 111, and the mechanical strength of the first base 111 is greater than the mechanical strength of the second base 112.

[0089] S30 , the pins 24 are retracted into the base 23 , so that the substrate 11 is bonded to the carrier chuck 21 .

[0090] Specifically, the S30 further includes:

[0091] Afterwards, the pin 24 is moved toward the base 23 so that the substrate 11 contacts the carrier chuck 21 and the two are bonded together by the adhesive layer 22 on the substrate 11; at this time, the pin 24 continues to retract to the base 23 so that the pin 24 is separated from the substrate 11, and the substrate 11 is adhered to the carrier chuck 21.

[0092] S40 , performing an evaporation process on the substrate 11 to form the organic light-emitting functional layer 13 .

[0093] Specifically, the S40 further includes:

[0094] Afterwards, the carrying chuck 21 is moved and rotated to perform vapor deposition on the substrate 11 to form the organic light-emitting functional layer 13 . After the vapor deposition is completed, the carrying chuck 21 is placed back on the base 23 .

[0095] S50 , the pin 24 extends out and passes through the pin hole 211 on the carrying chuck 21 to lift up the substrate 11 , so that the substrate 11 is separated from the carrying chuck 21 .

[0096] Specifically, the S50 further includes:

[0097] Finally, the pins 24 on the base 23 are extended and passed through the pinholes 211 on the carrier chuck 21 to lift up the substrate 11, so that the substrate 11 is separated from the carrier chuck 21. At this time, the pins 24 are in contact with the first base 111. Since the mechanical strength of the first base 111 is relatively high, the portion of the substrate 11 near the adhesive layer 22 is unlikely to break during the separation process between the substrate 11 and the carrier chuck 21, thereby achieving the technical effect of improving the product yield.

[0098] In the embodiment of the present application, before the step of extending the pin 24 and passing through the pin hole 211 on the carrier chuck 21 to lift the substrate 11 and separate the substrate 11 from the carrier chuck 21, the step further includes:

[0099] A light source is used to illuminate the adhesive layer 22 disposed between the substrate 11 and the carrier chuck 21 to reduce the viscosity thereof.

[0100] Beneficial effects: The present application discloses a display panel 100 and an evaporation device 200, wherein the display panel 100 comprises a substrate 11 and an organic light-emitting functional layer 13 disposed on the substrate 11, wherein the substrate 11 comprises a plurality of first substrates 111 and a second substrate 112 disposed around the plurality of first substrates 111, wherein the first substrates 111 are disposed corresponding to pinholes 211 disposed on a carrier chuck 21 bonded to the substrate 11 in an evaporation process, wherein the mechanical strength of the first substrate 111 is greater than the mechanical strength of the second substrate 112; the present application forms an organic light-emitting functional layer 13 on the substrate 11 by an evaporation process; When preparing the organic light-emitting functional layer 13, the substrate 11 is adsorbed on the supporting chuck 21, and then the supporting chuck 21 is moved to complete the evaporation process of the substrate 11. Since the mechanical strength of the first base 111 corresponding to the pinhole 211 is greater than the mechanical strength of the second base 112 located around the first base 111, when the pin 24 lifts the substrate 11 to separate the substrate 11 from the supporting chuck 21, the position where the first base 111 and the second base 112 are connected is difficult to break, thereby achieving the technical effect of improving the product yield.

[0101] The above is a detailed introduction to a display panel 100 and an evaporation device 200 provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the technical solutions and core ideas of the present application. Ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A vapor deposition device for vapor deposition of a display panel, characterized in that: The display panel comprises: A substrate, comprising a plurality of first substrates and a second substrate arranged around the plurality of first substrates; An organic light-emitting functional layer is disposed on the substrate; Wherein, the mechanical strength of the first substrate is greater than the mechanical strength of the second substrate; The evaporation device comprises a base and a carrying chuck located on the base, the base is further provided with a pin, the pin can move relative to the base, the carrying chuck is provided with a pinhole corresponding to the pin, the pin passes through the pinhole to adsorb the substrate; Wherein, each of the first substrates is arranged in one-to-one correspondence with each of the pinholes.

2. The evaporation device according to claim 1, characterized in that: The pin comprises a supporting portion and an ejector portion connected to the supporting portion; Wherein, in the top view direction of the base, the orthographic projection area of ​​the ejector portion on the base is greater than or equal to 0.5 times the orthographic projection area of ​​the support portion on the base.

3. The evaporation device according to claim 2, characterized in that: The mechanical strength of the ejector pin portion is lower than that of the supporting portion, and the material of the ejector pin portion includes a soft rubber material.

4. The evaporation device according to claim 2, characterized in that: The first substrate comprises a substrate body and a strengthening layer located on the substrate body; Wherein, the thickness of the first substrate is greater than the thickness of the second substrate, and the mechanical strength of the strengthening layer is greater than the mechanical strength of the substrate body; The orthographic projection of the ejector pin portion on the strengthening layer is located within the strengthening layer.

5. The evaporation device according to claim 1, characterized in that: The evaporation device further comprises an adhesive layer attached to the substrate, wherein the adhesive layer is interposed between the substrate and the carrying chuck; Wherein, the adhesive layer comprises a plurality of sub-adhesive layers arranged at intervals, and each of the pinholes is arranged between two adjacent sub-adhesive layers.

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