IGBT modules, motor controllers and vehicles

Abstract

The present invention discloses an IGBT module, a motor controller and a vehicle, wherein the IGBT module comprises: a wafer; a first heat sink and a second heat sink, wherein the first heat sink and the second heat sink are arranged on both sides of the wafer in the thickness direction, wherein the first heat sink has a plurality of first heat sink pins arranged at intervals on one side facing away from the second heat sink, and the second heat sink has a plurality of second heat sink pins arranged at intervals on one side facing away from the first heat sink; and an insulating waterproof housing, wherein the insulating waterproof housing covers the portion of the wafer exposed from the first heat sink and the second heat sink. The IGBT module according to the embodiment of the present invention can not only perform double-sided cooling and has high heat dissipation efficiency, but also has the advantages of reliable connection and good sealing effect.

Description

Technical Field

[0001] The present invention relates to the field of vehicle technology, and in particular to an IGBT module, a motor controller and a vehicle. Background Art

[0002] The IGBT module in the related art usually includes a wafer and a heat sink. The heat sink contacts one side of the wafer to dissipate heat from the wafer. However, since the wafer only dissipates heat on one side, the heat dissipation effect is poor, which makes it difficult to improve the power density of the wafer. Therefore, some IGBT modules are equipped with heat sinks on both sides of the wafer, changing the heat dissipation of the wafer from single-sided to double-sided to improve the power density of the wafer. However, the two heat sinks and wafers of these IGBT modules are not reasonably arranged, resulting in low connection stability between the two heat sinks and the wafer, and poor sealing effect, which leads to low electrical connection reliability of the IGBT module. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, one object of the present invention is to provide an IGBT module that can not only perform double-sided heat dissipation and high heat dissipation efficiency, but also has the advantages of reliable connection and good sealing effect.

[0004] The present invention also provides a motor controller having the above-mentioned IGBT module.

[0005] The present invention also provides a vehicle having the motor controller.

[0006] In order to achieve the above-mentioned purpose, an IGBT module is proposed according to a first aspect of an embodiment of the present invention, wherein the IGBT module comprises: a wafer; a first heat sink and a second heat sink, wherein the first heat sink and the second heat sink are respectively arranged on both sides of the wafer in a thickness direction, a side of the first heat sink facing away from the second heat sink has a plurality of first heat sink needles arranged at intervals, and a side of the second heat sink facing away from the first heat sink has a plurality of second heat sink needles arranged at intervals; and an insulating waterproof shell, wherein the insulating waterproof shell covers the portion of the wafer exposed from the first heat sink and the second heat sink.

[0007] The IGBT module according to the embodiment of the present invention can not only perform double-sided heat dissipation with high heat dissipation efficiency, but also has the advantages of reliable connection and good sealing effect.

[0008] According to some specific embodiments of the present invention, a first insulating heat-conducting sheet is provided between the first heat sink and the wafer; and a second insulating heat-conducting sheet is provided between the second heat sink and the wafer.

[0009] According to some specific embodiments of the present invention, one end of the wafer is connected to a DC connector and the other end is connected to an AC connector, and the DC connector and the AC connector extend from opposite sides of the insulating waterproof housing respectively.

[0010] According to some specific embodiments of the present invention, the DC connector includes a first DC negative input copper bar, a DC positive input copper bar and a second DC negative input copper bar; the AC connector includes an AC output copper bar; and the other end of the wafer is also provided with a signal lead.

[0011] According to some specific embodiments of the present invention, the IGBT module further includes: an axial waterproof component, which is arranged on the end surface of one end of the insulating waterproof shell and extends axially along the end surface; and a radial waterproof component, which is arranged on the outer peripheral surface of the other end of the insulating waterproof shell and extends circumferentially along the outer peripheral surface.

[0012] According to some specific embodiments of the present invention, the end surface of the one end of the insulating waterproof shell is configured with an annular groove, and the axial waterproof component is assembled in the annular groove; the radial waterproof component is integrally formed with the insulating waterproof shell.

[0013] According to some specific embodiments of the present invention, at least one of the first heat sink and the second heat sink is provided with support ribs, and the support ribs are supported between the first heat sink and the second heat sink to form a accommodating cavity between the first heat sink and the second heat sink, and the wafer is arranged in the accommodating cavity.

[0014] According to some specific embodiments of the present invention, the supporting rib is arranged on one of the first heat sink and the second heat sink, the supporting rib is provided with a limiting rib extending along the length direction thereof, the width of the limiting rib is smaller than the width of the supporting rib, the second heat sink and the other of the second heat sink are provided with a limiting groove, and the limiting rib cooperates with the limiting groove.

[0015] According to some specific embodiments of the present invention, the support ribs are arranged on two opposite edges of the second heat dissipation plate and extend respectively along the length direction of the edges; one end of each support rib is constructed with a bending portion extending toward an edge adjacent to the edge, and the other end of each support rib is spaced from an edge adjacent to the edge.

[0016] According to some specific embodiments of the present invention, a first groove is provided on the surface of the first heat sink facing away from the second heat sink, and the first groove extends in the circumferential direction of the outer periphery of the first heat sink; a second groove is provided on the surface of the second heat sink facing away from the second heat sink, and the second groove extends in the circumferential direction of the outer periphery of the second heat sink; the first groove and the second groove are filled with the insulating waterproof shell.

[0017] According to some specific embodiments of the present invention, the outer surface of the wafer is covered with an insulating heat dissipation layer.

[0018] According to an embodiment of the second aspect of the present invention, a motor controller is proposed, the motor controller comprising: a liquid-cooled shell, a cooling chamber is defined in the liquid-cooled shell, the liquid-cooled shell is provided with a liquid inlet and a liquid outlet connected to the cooling chamber, and the opposite side walls of the cooling chamber are respectively provided with an insertion hole and an insertion hole; according to the IGBT module described in the embodiment of the first aspect of the present invention, the IGBT module is inserted into the cooling chamber through the insertion hole and extends out of the cooling chamber through the insertion hole, the opposite side surfaces of the IGBT module in the thickness direction form a liquid gap with the inner wall of the cooling chamber, and both ends of the IGBT module are sealed with the liquid-cooled shell to close the insertion hole and the insertion hole.

[0019] The motor controller according to the embodiment of the present invention, by utilizing the IGBT module described in the embodiment of the first aspect of the present invention, can not only perform double-sided heat dissipation with high heat dissipation efficiency, but also has the advantages of reliable connection and good sealing effect.

[0020] According to an embodiment of a third aspect of the present invention, a vehicle is provided, comprising: a motor controller according to an embodiment of the second aspect of the present invention.

[0021] The vehicle according to the embodiment of the present invention has the advantages of good heat dissipation effect and reliable electrical connection by utilizing the motor controller according to the embodiment of the second aspect of the present invention.

[0022] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0024] Figure 1 is a schematic structural diagram of an IGBT module according to an embodiment of the present invention.

[0025] Figure 2 2 is a schematic structural diagram of an IGBT module according to an embodiment of the present invention from another perspective.

[0026] Figure 3 is an exploded diagram of an IGBT module according to an embodiment of the present invention.

[0027] Figure 4 is a cross-sectional view of an IGBT module according to an embodiment of the present invention.

[0028] Figure 5 is another cross-sectional view of an IGBT module according to an embodiment of the present invention.

[0029] Figure 6 It is a schematic diagram of assembling the axial waterproof part of the IGBT module according to an embodiment of the present invention.

[0030] Figure 7 Schematic diagram of the structure of a first heat sink of an IGBT module according to an embodiment of the present invention.

[0031] Figure 8 Schematic diagram of the structure of the second heat sink of the IGBT module according to an embodiment of the present invention.

[0032] Fig. 9 It is a schematic diagram of assembling an IGBT module and a liquid cooling housing according to an embodiment of the present invention.

[0033] Fig.10 is an exploded view of an IGBT module and a liquid cooling housing according to an embodiment of the present invention.

[0034] Fig.11 is a circuit diagram of an IGBT module according to an embodiment of the present invention.

[0035] Reference numerals:

[0036] IGBT module 1, motor controller 2,

[0037] Wafer 100,

[0038] The first heat dissipation plate 200, the first heat dissipation pin 210, the limiting groove 220, the first sink groove 230,

[0039] The second heat dissipation plate 300, the second heat dissipation pin 310, the support rib 320, the limiting rib 321, the bending portion 322, the accommodating cavity 330, the second sink 340,

[0040] Insulation waterproof housing 400, annular groove 410,

[0041] The first insulating thermally conductive sheet 500, the second insulating thermally conductive sheet 510,

[0042] DC connector 600, first DC negative input copper bar 610, DC positive input copper bar 620, second DC negative input copper bar 630, AC connector 640, AC output copper bar 641, signal lead 650,

[0043] Axial waterproofing parts 700, radial waterproofing parts 710,

[0044] Liquid cooling housing 800, cooling chamber 810, insertion hole 811, insertion hole 812, limiting ring edge 813, inclined surface 814, liquid gap 820,

[0045] IGBT upper bridge arm 910 , diode upper bridge arm 920 , IGBT lower bridge arm 930 , diode lower bridge arm 940 . DETAILED DESCRIPTION

[0046] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0047] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0048] In the description of the present invention, "first feature" or "second feature" may include one or more of the features.

[0049] In the description of the present invention, "plurality" means two or more than two, and "several" means one or more.

[0050] The IGBT module 1 according to an embodiment of the present invention will be described below with reference to the accompanying drawings.

[0051] like Figure 1-Figure 11 As shown, the IGBT module 1 according to the embodiment of the present invention includes a wafer 100 , a first heat sink 200 , a second heat sink 300 and an insulating waterproof housing 400 .

[0052] The first heat sink 200 and the second heat sink 300 are arranged on both sides of the wafer 100 in the thickness direction. The side of the first heat sink 200 facing away from the second heat sink 300 has a plurality of first heat sink pins 210 arranged at intervals. The side of the second heat sink 300 facing away from the first heat sink 200 has a plurality of second heat sink pins 310 arranged at intervals. The insulating waterproof shell 400 covers the portion of the wafer 100 exposed from the first heat sink 200 and the second heat sink 300.

[0053] Optionally, the insulating waterproof housing 400 may be a plastic part, and the insulating waterproof housing 400 may be formed by injection molding. Furthermore, the insulating waterproof housing 400 may be connected to a portion of the first heat sink 200 where the first heat sink pins 210 are not provided and a portion of the second heat sink 300 where the second heat sink pins 310 are not provided. The insulating waterproof housing 400 at least covers the portion of the wafer 100 exposed from the first heat sink 200 and the second heat sink 300.

[0054] According to the IGBT module 1 of the embodiment of the present invention, the first heat sink 200 and the second heat sink 300 are arranged on both sides of the thickness direction of the wafer 100, and the side of the first heat sink 200 facing away from the second heat sink 300 has a plurality of first heat sink pins 210 arranged at intervals, and the side of the second heat sink 300 facing away from the first heat sink 200 has a plurality of second heat sink pins 310 arranged at intervals. In this way, through the first heat sink 200 and the second heat sink 300, the wafer 100 can perform double-sided heat dissipation, that is, the heat generated by the wafer 100 can be quickly dissipated through the first heat sink 200 and the second heat sink 300, and the heat dissipation effect is better. In addition, the arrangement of the plurality of first heat sink pins 210 and the plurality of second heat sink pins 310 can further increase the contact area between the IGBT module 1 and the coolant, thereby further accelerating the heat dissipation efficiency of the IGBT module 1.

[0055] In addition, the insulating waterproof housing 400 covers the portion of the wafer 100 exposed from the first heat sink 200 and the second heat sink 300. For example, the first heat sink 200 and the second heat sink 300 can cover the two opposite sides of the wafer 100 in the thickness direction. The insulating waterproof housing 400 can cover the circumferential side of the wafer 100, thereby improving the sealing of the IGBT module 1, thereby further improving the waterproof performance of the IGBT module 1 and increasing the reliability of the electrical connection of the IGBT module 1. In addition, the insulating waterproof housing 400 can be connected to the wafer 100, the first heat sink 200 and the second heat sink 300, that is, the stability of the relative positions of the wafer 100, the first heat sink 200 and the second heat sink 300 is improved.

[0056] Meanwhile, the first heat sink 200 and the second heat sink 300 may be metal parts, which can shield electromagnetic interference generated by a large current when the wafer 100 is working, thereby improving the EMC (electromagnetic compatibility) effect.

[0057] Thus, the IGBT module 1 according to the embodiment of the present invention can not only perform double-sided heat dissipation with high heat dissipation efficiency, but also has the advantages of reliable connection and good sealing effect.

[0058] According to some specific embodiments of the present invention, the insulating waterproof housing 400 is a nano-injection molded part, which has the advantages of simple processing, low cost, light weight and high overall structural strength, and the insulating waterproof housing 400 molded by nano-injection molding has a better sealing effect on the wafer 100. At the same time, by adopting nano-injection molding for the insulating waterproof housing 400, there is no need to use an additional mechanical connection structure to fix the first heat sink 200 and the second heat sink 300, which can make the IGBT module 1 thinner and smaller in size. In addition, the first heat sink 200 and the second heat sink 300 are both aluminum alloy parts, which have good heat dissipation performance and can further improve the heat dissipation effect of the first heat sink 200 and the second heat sink 300 on the wafer 100. In addition, since aluminum alloy parts are easy to be T-treated, aluminum alloy parts are easier to be used for nano-injection molding of the insulating waterproof housing 400.

[0059] According to some specific embodiments of the present invention, Figure 3-Figure 5 As shown, a first insulating heat-conducting sheet 500 is provided between the first heat dissipation plate 200 and the wafer 100 , and a second insulating heat-conducting sheet 510 is provided between the second heat dissipation plate 300 and the wafer 100 .

[0060] Specifically, the first insulating thermally conductive sheet 500 and the second insulating thermally conductive sheet 510 are respectively located on opposite sides of the wafer 100 in the thickness direction. The first heat sink 200 and one side of the wafer 100 in the thickness direction clamp the first insulating thermally conductive sheet 500, and the second heat sink 200 and the other side of the wafer 100 in the thickness direction clamp the second insulating thermally conductive sheet 510.

[0061] The first insulating thermally conductive sheet 500 can prevent electrical conduction between the wafer 100 and the first heat sink 200, and at the same time guide the heat on the thick side of the wafer 100 to the first heat sink 200 for heat dissipation. The second insulating thermally conductive sheet 510 can prevent electrical conduction between the wafer 100 and the second heat sink 300, and at the same time guide the heat on the other thick side of the wafer 100 to the second heat sink 300 for heat dissipation, thus taking into account both the safety of electrical connection and the heat dissipation efficiency.

[0062] According to some specific embodiments of the present invention, Figure 1-Figure 5 As shown, one end of the wafer 100 is connected to a DC connector 600 and the other end is connected to an AC connector 640 , and the DC connector 600 and the AC connector 640 extend from opposite sides of the insulating waterproof housing 400 , respectively.

[0063] In this way, the DC connector 600 and the AC connector 640 are respectively arranged at the two ends of the wafer 100, and the DC connector 600 and the AC connector 640 are both located outside the insulating waterproof shell 400. This not only avoids mutual interference between the DC connector 600 and the AC connector 640, which is beneficial to improving EMC (electromagnetic compatibility), but also facilitates electrical connection between the wafer 100 and other electrical components of the vehicle.

[0064] Furthermore, if Figure 1-Figure 5 As shown, the DC connector 600 includes a first DC negative input copper bar 610, a DC positive input copper bar 620 and a second DC negative input copper bar 630, the AC connector 640 includes an AC output copper bar 641, and a signal lead 650 is also provided at the other end of the wafer 100. This is not only conducive to electrical connection, but also can avoid mutual interference between DC and AC.

[0065] Combination Fig.11 , take an example to describe the current conversion process of IGBT module 1:

[0066] Among them, the vehicle has structures such as a DC power supply, a control board, a diode, a drive board and a motor.

[0067] The positive pole of the DC power supply of the vehicle is connected to the DC positive input copper bar 620, and the negative pole of the DC power supply of the vehicle is connected to the first DC negative input copper bar 610 and the second DC negative input copper bar 630. The first DC negative input copper bar 610, the DC positive input copper bar 620 and the second DC negative input copper bar 630 introduce the DC power of the DC power supply into the IGBT upper bridge arm 910, the diode upper bridge arm 920, the IGBT lower bridge arm 930 and the diode lower bridge arm 940 to convert it into AC power, and the AC power is then input into the motor of the vehicle through the AC output copper bar 641. Among them, the signal in the working process of the IGBT module 1 converting the DC current into AC power and the temperature rise sensing signal can be transmitted to the control board through the signal lead 650 via the drive board.

[0068] According to some specific embodiments of the present invention, Figure 5 and Figure 6 As shown, the IGBT module 1 further includes an axial waterproof component 700 and a radial waterproof component 710 .

[0069] The axial waterproof member 700 is disposed on the end surface of one end of the insulating waterproof housing 400 and extends along the axial direction of the end surface, and the radial waterproof member 710 is disposed on the outer peripheral surface of the other end of the insulating waterproof housing 400 and extends along the circumferential direction of the outer peripheral surface. The axial waterproof member 700 may be an O-ring.

[0070] Optionally, the axial waterproof component 700 is arranged at one end of the DC connector 600 adjacent to the IGBT module 1, and the axial waterproof component 700 is attached to the limiting ring edge 813 of the liquid cooling shell 800 described below, thereby achieving the sealing of one end of the DC connector 600 adjacent to the IGBT module 200, and the radial waterproof component 710 surrounds one end of the AC connector 640 adjacent to the IGBT module 1, and the radial waterproof component 710 is attached to the inner wall surface of the liquid cooling shell 800 described below, thereby achieving the sealing of one end of the AC connector 640 adjacent to the IGBT module 1, so that both ends of the IGBT module 200 have a good waterproof effect.

[0071] Furthermore, an annular groove 410 is configured on an end surface of one end of the insulating waterproof housing 400 , the axial waterproof component 700 is assembled in the annular groove 410 , and the radial waterproof component 710 is integrally formed with the insulating waterproof housing 400 .

[0072] It is understandable that the annular groove 410 can provide installation space for the axial waterproof component 700 to ensure the installation stability of the axial waterproof component 700 and prevent the axial waterproof component 700 from being separated from the IGBT module 1 due to excessive deformation. Part of the axial waterproof component 700 protrudes from the annular groove 410, so that the axial waterproof component 700 can be deformed and sealed when it fits with the limiting ring edge 813 below. In addition, the radial waterproof component 710 is integrally injection molded with the insulating waterproof shell 400, so that the connection strength between the radial waterproof component 710 and the insulating waterproof shell 400, the first heat sink 200 and the second heat sink 300 is higher, and the processing and molding is simpler, and the radial waterproof component 710 can have a better sealing effect.

[0073] According to some specific embodiments of the present invention, Figure 7 and Figure 8 As shown, at least one of the first heat sink 200 and the second heat sink 300 is provided with a support rib 320, and the support rib 320 is supported between the first heat sink 200 and the second heat sink 300 to form a receiving cavity 330 between the first heat sink 200 and the second heat sink 300, and the wafer 100 is disposed in the receiving cavity 330. The receiving cavity 330 can be configured into a shape adapted to the wafer 100.

[0074] The accommodation cavity 330 can be provided to install the wafer 100 , and the first heat sink 200 and the second heat sink 300 can protect the wafer 100 from being squeezed and damaged.

[0075] Furthermore, if Figure 7 and Figure 8As shown, the support rib 320 is arranged on one of the first heat dissipation plate 200 and the second heat dissipation plate 300, and the support rib 320 is provided with a limiting rib 321 extending along the length direction thereof, and the width of the limiting rib 321 is smaller than the width of the support rib 320, and the other of the first heat dissipation plate 200 and the second heat dissipation plate 300 is provided with a limiting groove 220, and the limiting rib 321 cooperates with the limiting groove 220.

[0076] Optionally, the support ribs 320 can be arranged on the opposite side edges of the second heat dissipation plate 300, the limiting ribs 321 are arranged on the support ribs 320, the limiting grooves 220 can be arranged on the opposite side edges of the first heat dissipation plate 200, and the two limiting ribs 321 correspond one-to-one to the two limiting grooves 220.

[0077] By cooperating with the limiting ribs 321 and the limiting grooves 220, the relative positions of the first heat sink 200 and the second heat sink 300 in the circumferential direction, length direction and width direction of the first heat sink 200 can be pre-fixed, thereby avoiding shaking between the first heat sink 200 and the second heat sink 300, and facilitating the connection of the insulating waterproof shell 400 to the first heat sink 200 and the second heat sink 300 through nano injection molding.

[0078] Furthermore, if Figure 7 As shown in Figure 8, the support ribs 320 are arranged on two opposite edges of the second heat dissipation plate 300 and extend along the length direction of the edges respectively. One end of each support rib 320 is constructed with a bending portion 322 extending toward the edge adjacent to the edge, and the other end of each support rib 320 is spaced from the edge adjacent to the edge.

[0079] Specifically, the support ribs 320 may be spaced apart from the AC connector 640 and the DC connector 600 to avoid affecting the connection between the AC connector 640 and the DC connector 600 and the wafer 100 in the accommodation cavity 330 .

[0080] In addition, the bending portion 322 can be provided at one end of the support rib 320 adjacent to the AC connector 640. The bending portion 322 can not only improve the structural strength of the support rib 320, but also limit the wafer 100 in the width direction of the wafer 100. In addition, a signal lead 650 is provided at one end of the wafer 100 facing the DC connector 600. Since the signal lead 650 occupies a large space, by spacing the other end of each support rib 320 at an edge adjacent to the edge where it is located, interference between the support rib 320 and the signal lead 650 can be avoided, and installation is more convenient.

[0081] According to some specific embodiments of the present invention, Figure 7 and Figure 8As shown, a first sink groove 230 is provided on the surface of the first heat dissipation plate 200 facing away from the second heat dissipation plate 300, and the first sink groove 230 extends in the circumference of the outer periphery of the first heat dissipation plate 200. A second sink groove 340 is provided on the surface of the second heat dissipation plate 300 facing away from the second heat dissipation plate 300, and the second sink groove 340 extends in the circumference of the outer periphery of the second heat dissipation plate 300. The first sink groove 230 and the second sink groove 340 are filled with the insulating waterproof housing 400.

[0082] Specifically, the first sink 230 is recessed from the surface of the first heat dissipation plate 200 facing away from the second heat dissipation plate 300 toward the second heat dissipation plate 300 , and the second sink 340 is recessed from the surface of the second heat dissipation plate 300 facing away from the first heat dissipation plate 200 toward the first heat dissipation plate 200 .

[0083] The provision of the first sink groove 230 and the second sink groove 340 facilitates the positioning of the insulating waterproof shell 400 and the first sink groove 230 and the second sink groove 340 by injection molding, thereby preventing the insulating waterproof shell 400 from covering the first heat dissipation pin 210 of the first heat dissipation plate 200 and the second heat dissipation pin 310 of the second heat dissipation plate 300. In this way, both the heat dissipation effect and the positioning effect are taken into account.

[0084] According to some specific embodiments of the present invention, the outer surface of the wafer 100 is covered with an insulating heat dissipation layer (not shown in the figure).

[0085] Optionally, the insulating heat dissipation layer is made of insulating heat dissipation resin. The insulating heat dissipation layer wraps the circumferential edge of the wafer 100, which can ensure the heat dissipation performance of the wafer 100 while preventing the wafer 100 from being electrically connected to external objects, thereby improving circuit reliability.

[0086] The motor controller 2 according to the embodiment of the present invention is described below.

[0087] According to the embodiment of the present invention, the motor controller 2 includes a liquid cooling housing 800 and an IGBT module 1 .

[0088] A cooling chamber 810 is defined in the liquid cooling housing 800. The liquid cooling housing 800 is provided with a liquid inlet (not shown in the figure) and a liquid outlet (not shown in the figure) communicating with the cooling chamber 810. The opposite side walls of the cooling chamber 810 are respectively provided with an insertion hole 811 and an insertion hole 812. The IGBT module 1 is inserted into the cooling chamber 810 through the insertion hole 811 and extends out of the cooling chamber 810 through the insertion hole 812. The opposite side surfaces of the IGBT module 1 in the thickness direction form a liquid gap 820 with the inner wall of the cooling chamber 810. Both ends of the IGBT module 1 are sealed with the liquid cooling housing 800 to close the insertion hole 811 and the insertion hole 812.

[0089] Optionally, the liquid cooling housing 800 can be processed into a rectangular parallelepiped by die casting and matching machining, and the IGBT module 1 is provided with a wafer 1 with a large heat generation between the DC connector 600 and the AC connector 640, and the IGBT module 1 is waterproofed by covering the insulating waterproof housing 400 between the DC connector 600 and the AC connector 640. The AC connector 640 extends from the insertion hole 811 of the liquid cooling housing 800, and the DC connector 600 extends from the insertion hole 812 of the liquid cooling housing 800, and the wafer 1 is in the cooling chamber 810.

[0090] The cooling liquid is introduced into the liquid cooling housing 800 from the liquid inlet, and the cooling liquid flows into the cooling chamber 810 and passes through the liquid gap 820, and flows out from the liquid outlet after cooling the IGBT module 1. In this way, the two opposite sides of the IGBT module 1 in the thickness direction are completely immersed in the cooling liquid, and the part of the IGBT module 1 with a larger heat generation has a larger contact cooling area with the cooling liquid, thereby achieving double-sided heat dissipation.

[0091] In addition, both ends of the IGBT module 1 are sealed with the liquid cooling shell 800, forming a closed cooling liquid flow path between the liquid cooling shell 800 and the IGBT module 1, thereby closing the insertion hole 811 and the insertion hole 812 for inserting the IGBT module 1. In this way, the liquid cooling shell 800 can be an integrated part without the need for additional welding or other connection processes. The production process is simpler and the cost is lower. The liquid cooling shell 800 can adapt to IGBT modules 1 with higher power density, thereby achieving the purpose of increasing the power of the IGBT module 1.

[0092] The motor controller 2 according to the embodiment of the present invention, by utilizing the IGBT module 1 according to the above embodiment of the present invention, can not only perform double-sided heat dissipation with good heat dissipation effect, but also has the advantages of stable connection and good sealing effect.

[0093] According to some specific embodiments of the present invention, Fig. 9 and Fig.10 As shown, the inner wall of the insertion hole 812 is constructed with a limiting ring edge 813 extending along its circumferential direction, one end of the IGBT module 1 stops at the limiting ring edge 813 and is sealed with the limiting ring edge 813, and the other end of the IGBT module 1 is sealed with the inner wall of the insertion hole 811.

[0094] For example, the axial waterproof component 700 of the IGBT module 1 may be interference fit with the limiting ring edge 813 , and the radial waterproof component 710 of the IGBT module 1 may be interference fit with the inner peripheral wall surface of the insertion hole 811 .

[0095] The limiting ring edge 813 can block the IGBT module 1 at the insertion hole 812 to prevent the IGBT module 1 from being separated from the liquid cooling housing 800 from the insertion hole 812, and the limiting ring edge 813 can play a role in positioning the IGBT module 1. At the same time, the axial waterproof member 700 can cooperate with the side of the limiting ring edge 813 facing the IGBT module to prevent the coolant from flowing out of the insertion hole 812, so as to facilitate the sealing of the IGBT module and the liquid cooling housing 800 at the insertion hole 811.

[0096] According to some specific embodiments of the present invention, Fig. 9 and Fig.10 As shown, the surface of the liquid cooling housing 800 with the insertion hole 812 is provided with an inclined surface 814 , which is arranged around the insertion hole 812 and gradually inclines toward the inside of the cooling chamber 810 along the direction toward the insertion hole 812 .

[0097] The inclined surface 814 may be disposed on a side of the limiting ring edge 813 facing away from the IGBT module, so that the inclined surface 814 is integrated with the limiting ring edge 813 , thereby reducing the structural complexity of the liquid cooling housing 800 and improving production efficiency.

[0098] For example, the liquid cooling housing 800 is formed by metal die-casting. By providing an inclined surface 814 around the insertion hole 812, the electrical distance between the DC connector 600 and the liquid cooling housing 800 can be increased to avoid problems such as short circuits, thereby meeting electrical safety requirements. In addition, the metal liquid cooling housing 800 can shield the wafer 100, further avoiding electromagnetic interference caused by large currents when the motor controller 2 is working, which is conducive to improving the EMC (electromagnetic compatibility) effect.

[0099] According to some specific embodiments of the present invention, Fig. 9 and Fig.10 As shown, there are multiple cooling chambers 810, and the multiple cooling chambers 810 are arranged along the length direction of the liquid cooling housing 800, the liquid inlet, the multiple cooling chambers 810 and the liquid outlet are connected in sequence, multiple insertion holes 811 are provided on one side surface of the liquid cooling housing 800 in the width direction, and multiple plug-out holes 812 are provided on the other side surface of the liquid cooling housing 800 in the width direction. There are multiple IGBT modules 1, and the multiple IGBT modules 1 are inserted into the multiple cooling chambers 810 through the multiple insertion holes 811 and extend out of the multiple cooling chambers 810 through the multiple plug-out holes 812 in a one-to-one correspondence.

[0100] For example, multiple cooling chambers 810 can be arranged in a straight line, and the coolant can flow into each cooling chamber 810 from the liquid inlet in sequence, and finally flow out from the liquid outlet. The coolant in each cooling chamber 810 dissipates heat for the corresponding IGBT module 1, and the coolant flows to multiple cooling chambers 810 in sequence, so that the coolant can fully exchange heat with the IGBT modules 1 in the multiple cooling chambers 810, so that the coolant can be efficiently utilized.

[0101] In addition, the liquid inlet and the liquid outlet can be located at both ends of the liquid cooling housing 800, and the coolant flows along the length direction of the liquid cooling housing 800, so that the coolant flows more smoothly in the multiple cooling chambers 810. Moreover, the coolant flows along the length direction of the liquid cooling housing 800, so that the coolant can flow through a longer distance to achieve a sufficient cooling effect. The IGBT module 1 is inserted along the width direction of the liquid cooling housing 800, matching the flow direction of the coolant, so that the coolant can fully flow through the opposite side surfaces of the IGBT module 1 in the thickness direction.

[0102] Of course, by adjusting the flow direction of the coolant along the liquid-cooled shell 800, it is not limited to arranging the liquid inlet and the liquid outlet at opposite ends of the liquid-cooled shell 800. The liquid inlet and the liquid outlet can also be located at the same end of the liquid-cooled shell 800. The specific implementation method can be matched according to the flow direction of the coolant.

[0103] A vehicle according to an embodiment of the present invention will be described below.

[0104] The vehicle according to the embodiment of the present invention includes the motor controller 2 according to the above-mentioned embodiment of the present invention.

[0105] The vehicle according to the embodiment of the present invention has the advantages of good heat dissipation effect and reliable electrical connection by utilizing the motor controller 2 according to the above embodiment of the present invention.

[0106] The IGBT module 1, the motor controller 2 and other components and operations of the vehicle according to the embodiment of the present invention are well known to those skilled in the art and will not be described in detail here.

[0107] In the description of this specification, the description with reference to the terms "specific embodiment", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example.

[0108] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. An IGBT module, characterized in that: include: Wafer; A first heat dissipation plate and a second heat dissipation plate, wherein the first heat dissipation plate and the second heat dissipation plate are respectively arranged on both sides of the wafer in the thickness direction, a surface of the first heat dissipation plate facing away from the second heat dissipation plate has a plurality of first heat dissipation pins arranged at intervals, and a surface of the second heat dissipation plate facing away from the first heat dissipation plate has a plurality of second heat dissipation pins arranged at intervals; An insulating waterproof housing, wherein the insulating waterproof housing covers a portion of the wafer exposed from the first heat sink and the second heat sink; A first insulating heat-conducting sheet is provided between the first heat sink and the wafer, and a second insulating heat-conducting sheet is provided between the second heat sink and the wafer; An axial waterproof member, which is disposed on an end surface of one end of the insulating waterproof housing and extends in the axial direction of the end surface, and a radial waterproof member, which is disposed on an outer peripheral surface of the other end of the insulating waterproof housing and extends in the circumferential direction of the outer peripheral surface; The end surface of the one end of the insulating waterproof shell is configured with an annular groove, the axial waterproof component is assembled in the annular groove, and the radial waterproof component is integrally formed with the insulating waterproof shell.

2. The IGBT module according to claim 1, characterized in that: One end of the wafer is connected to a DC connector and the other end is connected to an AC connector. The DC connector and the AC connector extend from opposite sides of the insulating waterproof housing respectively.

3. The IGBT module according to claim 2, characterized in that: The DC connector includes a first DC negative pole input copper bar, a DC positive pole input copper bar, and a second DC negative pole input copper bar; The AC connector includes an AC output copper busbar; The other end of the wafer is also provided with a signal lead.

4. The IGBT module according to claim 1, characterized in that: At least one of the first heat sink and the second heat sink is provided with a supporting rib, and the supporting rib is supported between the first heat sink and the second heat sink to form a receiving cavity between the first heat sink and the second heat sink, and the wafer is arranged in the receiving cavity.

5. The IGBT module according to claim 4, characterized in that: The supporting rib is arranged on one of the first heat sink and the second heat sink, and the supporting rib is provided with a limiting rib extending along the length direction thereof, and the width of the limiting rib is smaller than the width of the supporting rib, and the other of the first heat sink and the second heat sink is provided with a limiting groove, and the limiting rib cooperates with the limiting groove.

6. The IGBT module according to claim 4, characterized in that: The supporting ribs are arranged at two opposite edges of the second heat dissipation plate and extend along the length direction of the edges respectively; One end of each support rib is configured with a bending portion extending toward an edge adjacent to the edge where the rib is located, and the other end of each support rib is spaced from an edge adjacent to the edge where the rib is located.

7. The IGBT module according to claim 1, characterized in that: A first sink groove is provided on a surface of the first heat dissipation plate facing away from the second heat dissipation plate, and the first sink groove extends in the circumferential direction of the outer periphery of the first heat dissipation plate; A second sink groove is provided on the surface of the second heat dissipation plate facing away from the first heat dissipation plate, and the second sink groove extends in the circumferential direction of the outer periphery of the second heat dissipation plate; The first sink and the second sink are filled with the insulating waterproof shell.

8. The IGBT module according to claim 1, characterized in that: The outer surface of the wafer is covered with an insulating heat dissipation layer.

9. A motor controller, characterized in that: include: A liquid cooling housing, wherein a cooling chamber is defined in the liquid cooling housing, the liquid cooling housing is provided with a liquid inlet and a liquid outlet communicated with the cooling chamber, and opposite side walls of the cooling chamber are respectively provided with an insertion hole and an insertion hole; According to the IGBT module according to any one of claims 1-8, the IGBT module is inserted into the cooling chamber through the insertion hole and extends out of the cooling chamber through the insertion hole, the opposite side surfaces of the IGBT module in the thickness direction form a liquid gap with the inner wall of the cooling chamber, and both ends of the IGBT module are sealed with the liquid cooling shell to close the insertion hole and the insertion hole.

10. A vehicle, characterized in that: include: A motor controller according to any one of claim 9.

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