A combiner

Abstract

The present application discloses a combiner. The combiner includes at least two microstrip line filters, at least two cavity filters and an orthogonal bridge, wherein the first signal input end of the orthogonal bridge is respectively connected to the output end of at least one microstrip line filter and the output end of at least one cavity filter, and the second signal input end is respectively connected to the output end of at least another microstrip line filter and the output end of at least another cavity filter. Thus, the present application simultaneously connects the microstrip line filter and the cavity filter through the two signal input ends of the orthogonal bridge, and at least two microstrip line filters and at least two cavity filters share the input end of the orthogonal bridge, which can reduce the volume of the combiner and reduce the manufacturing cost. In addition, the transparent transmission of low-frequency signals can be achieved between the two output ports of the orthogonal bridge, further improving the flexibility of the combiner configuration.

Description

Technical Field

[0001] The present application relates to the field of communication technology, and in particular to a combiner. Background Art

[0002] In mobile communication systems, the required signal is modulated to form a modulated signal, which is carried on a high-frequency carrier signal and transmitted into the air through a transmitting antenna. The signal in the air is received by a receiving antenna. The signal received by the receiving antenna includes not only the required signal, but also harmonics and noise signals of other frequencies. The signal received by the receiving antenna needs to be filtered out by a combiner to remove unnecessary harmonics and noise signals.

[0003] With the rapid development of communication technology, especially the advent of the 5G communication era, more stringent technical requirements are placed on system architecture. While achieving efficient and large-capacity communications, system modules must be highly integrated, miniaturized, lightweight, and low-cost. Summary of the invention

[0004] The main purpose of this application is to provide a combiner to solve the technical problems in the prior art.

[0005] To solve the above problems, the present application provides a combiner, which includes: at least two microstrip line filters, at least two cavity filters and an orthogonal bridge, wherein the first signal input end of the orthogonal bridge is respectively connected to the output end of at least one of the microstrip line filters and the output end of at least one of the cavity filters, and the second signal input end of the orthogonal bridge is respectively connected to the output end of at least another of the microstrip line filters and the output end of at least another of the cavity filters.

[0006] Compared with the prior art, the combiner of the present application includes: at least two microstrip line filters, at least two cavity filters and an orthogonal bridge, the first signal input end of the orthogonal bridge is respectively connected to the output end of at least one microstrip line filter and the output end of at least one cavity filter, and the second signal input end is respectively connected to the output end of at least another microstrip line filter and the output end of at least another cavity filter. Thus, the present application simultaneously connects the microstrip line filter and the cavity filter through the two signal input ends of the orthogonal bridge, and at least two microstrip line filters and at least two cavity filters share the input end of the orthogonal bridge, which can reduce the volume of the combiner and reduce the manufacturing cost. In addition, the transparent transmission of low-frequency signals can be achieved between the two output ports of the orthogonal bridge, further improving the flexibility of the combiner configuration. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0008] Figure 1 It is a schematic structural diagram of an embodiment of a combiner provided by the present application;

[0009] Figure 2 yes Figure 1 The cross-sectional view of the combiner along the AA direction is shown.

[0010] The reference numerals in the accompanying drawings are: combiner 10; housing 11; plate 12; bridge accommodating cavity 13; cavity filter 100; first cavity filter 110; avoidance groove 111; second cavity filter 120; microstrip line filter 200; first microstrip line filter 210; second microstrip line filter 220; orthogonal bridge 300; first signal input terminal 310; second signal input terminal 320; first protrusion 330; second protrusion 340; plastic fixing part 400; signal connector 500; first signal connector 510; second signal connector 520. DETAILED DESCRIPTION

[0011] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. It will be appreciated that the specific embodiments described herein are only used to explain the present application, rather than to limit the present application. It should also be noted that, for ease of description, only some but not all structures related to the present application are shown in the drawings. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the art without making creative work are within the scope of protection of the present application.

[0012] The terms "first", "second", "third" in this application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second", "third" can expressly or implicitly include at least one of the features. In the description of this application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In the embodiments of this application, all directional indications (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the steps or units listed, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0013] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0014] See also Figure 1 , Figure 1 It is a schematic structural diagram of an embodiment of the combiner 10 provided in the present application.

[0015] The combiner 10 includes at least two microstrip line filters 200 , at least two cavity filters 100 , and an orthogonal bridge 300 . The at least two microstrip line filters 200 , at least two cavity filters 100 , and the orthogonal bridge 300 are disposed in a housing 11 of the combiner 10 .

[0016] The first signal input terminal 310 of the orthogonal bridge 300 is respectively connected to the output terminal of at least one microstrip line filter 200 and the output terminal of at least one cavity filter 100, and the second signal input terminal 320 is respectively connected to the output terminal of at least another microstrip line filter 200 and the output terminal of at least another cavity filter 100.

[0017] Therefore, the present application connects the microstrip line filter 200 and the cavity filter 100 respectively and simultaneously through the two signal input ends of the orthogonal bridge 300, and at least two microstrip line filters 200 and at least two cavity filters 100 share the input end of the orthogonal bridge 300, which can reduce the volume of the combiner 10 and reduce the manufacturing cost. In addition, the transparent transmission of low-frequency signals can be achieved between the two output ports of the orthogonal bridge 300, further improving the flexibility of the configuration of the combiner 10.

[0018] Among them, the number of at least two microstrip line filters 200 and at least two cavity filters 100 can be two or other numbers, which can be set based on actual needs, and it is only necessary to meet the requirement that the same input end of the orthogonal bridge 300 can be connected to the output end of the microstrip line filter 200 and the output end of the cavity filter 100 at the same time. In one embodiment, the combiner 10 includes two microstrip line filters 200 and two cavity filters 100, and the two microstrip line filters 200 are arranged symmetrically with the center line of the orthogonal bridge 300 along the width direction as the axis, and the two microstrip line filters 200 are arranged symmetrically with the center line of the orthogonal bridge 300 along the width direction as the axis.

[0019] Specifically, Figure 1 In the figure, X may be the width direction of the orthogonal bridge 300, Y may be the length direction of the orthogonal bridge 300, the two microstrip line filters 200 may be the first microstrip line filter 210 and the second microstrip line filter 220, and the two cavity filters 100 may be the first cavity filter 110 and the second cavity filter 120. The first microstrip line filter 210 and the second microstrip line filter 220 are symmetrically arranged along the width direction of the orthogonal bridge 300, and the first cavity filter 110 and the second cavity filter 120 are also symmetrically arranged along the width direction of the orthogonal bridge 300. That is, the first cavity filter 110 and the first microstrip line filter 210 connected to the first signal input terminal 310 of the orthogonal bridge 300 at the same time, and the second cavity filter 120 and the second microstrip line filter 220 connected to the second signal input terminal 320 of the orthogonal bridge 300 at the same time are symmetrically arranged along the width direction of the orthogonal bridge 300.

[0020] Therefore, in this embodiment, the first microstrip line filter 210 and the first cavity filter 110 are symmetrically arranged with the second microstrip line filter 220 and the second cavity filter 120, which can further reduce the volume of the combiner 10, facilitate design and debugging, and improve configuration flexibility.

[0021] Furthermore, two microstrip line filters 200 are disposed adjacent to each other, the cavity filter 100 and the microstrip line filter 200 are arranged along the length direction of the orthogonal bridge 300, and the cavity filter 100 is located on the side of the microstrip line filter 200 along the width direction and outside the side of the orthogonal bridge 300 along the width direction.

[0022] The first microstrip line filter 210 and the second microstrip line filter 220 are located between the first cavity filter 110 and the second cavity filter 120. The first microstrip line filter 210 and the second microstrip line filter 220 are arranged adjacent to each other and separated by the isolation wall of the housing 11 to avoid signal crosstalk between the two. In addition, the resonant cavities of the cavity filter 100 and the microstrip line filter 200 located on the same side of the isolation wall are arranged along the length direction of the orthogonal bridge 300, which is convenient for reducing the volume of the combiner 10 while also reducing the signal crosstalk between the microstrip line filter 200 and the cavity filter 100, thereby improving the controllability of product debugging.

[0023] The input port of the cavity filter 100 is arranged on the same side as the output port of the orthogonal bridge 300 , and is arranged opposite to the input port of the microstrip line filter 200 .

[0024] The input ports of the first cavity filter 110 and the second cavity filter 120 are located on the same side of the output port of the orthogonal bridge 300, and the input ports of the first microstrip line filter 210 and the second microstrip line filter 220 are located on the other side of the first cavity filter 110 and the second cavity filter 120. That is, the input ports of the cavity filter 100 and the microstrip line filter 200 are relatively far apart. When they share the first signal input terminal 310 and the second signal input terminal 320 of the orthogonal bridge 300, the signal crosstalk between the microstrip line filter 200 and the cavity filter 100 can be reduced, thereby improving the controllability of product debugging.

[0025] The cavity filter 100 is composed of 7 resonant cavities. The first to fifth resonant cavities of the cavity filter 100 are arranged along the center line direction of the width direction of the orthogonal bridge 300, the fifth to seventh resonant cavities of the cavity filter 100 are arranged along the center line of the width direction of the orthogonal bridge 300, and the fifth to seventh resonant cavities are located between the microstrip line filter 200 and the first to fifth resonant cavities of the cavity filter 100.

[0026] The fourth resonant cavity, the fifth resonant cavity and the sixth resonant cavity of the cavity filter 100 are distributed in a triangular shape, that is, the projection of the fifth resonant cavity in the length direction of the orthogonal bridge 300 is located between the projection of the fourth resonant cavity in the length direction of the orthogonal bridge 300 and the projection of the sixth resonant cavity in the length direction of the orthogonal bridge 300, so as to reduce the number of resonant cavities arranged along the length direction of the orthogonal bridge 300 and shorten the length of the cavity filter 100.

[0027] The microstrip line filter 200 is composed of five resonant cavities arranged along the center line direction of the orthogonal bridge 300 in the width direction.

[0028] The microstrip line filter 200 is composed of a connecting strip and five branches, the five branches are respectively connected to the connecting strip, and each branch can be equivalent to a resonant cavity. Among them, the distance between each two adjacent branches in the five branches is equal, and the five branches extend in a direction away from the cavity filter 100 adjacent thereto, so that the microstrip line filter 200 is regularly arranged and occupies less space in the housing 11, which can reduce the volume of the combiner 10.

[0029] Among them, the length of the projection of the cavity filter 100 along the length direction of the orthogonal bridge 300 is equal to the sum of the length of the projection of the microstrip line filter 200 along the length direction of the orthogonal bridge 300 and the length of the projection of the orthogonal bridge 300 along the length direction of the orthogonal bridge 300, so that the internal space of the shell 11 can be effectively utilized, so as to further reduce the volume of the combiner 10 and improve the integration of the combiner 10.

[0030] Further, the combiner 10 includes a board body 12, and the microstrip line in the microstrip line filter 200 is fixed on the board body 12 through a plastic fixing member 400. Specifically, the plastic fixing member 400 can be arranged at both ends of the connecting strip, the connecting strip is passed through the plastic fixing member 400, and the plastic fixing member 400 is connected to the board body 12 of the housing 11, so as to fix the microstrip line on the board body 12.

[0031] The orthogonal bridge 300 is fixed on the plate 12 through a plastic fixing 400. Specifically, there may be a plurality of plastic fixings 400, through which the orthogonal bridge 300 is passed, and the plastic fixings 400 are connected to the plate 12 of the housing 11, so as to fix the orthogonal bridge 300 on the plate 12. The number of plastic fixings 400 may be set according to actual conditions. In the present embodiment, there are six plastic fixings 400, and three plastic fixings 400 are respectively arranged on both sides of the center line of the width direction of the orthogonal bridge 300, and the three plastic fixings 400 on both sides are symmetrically arranged along the center line of the width direction of the orthogonal bridge 300.

[0032] See also Figure 1 and Figure 2 , Figure 2 yes Figure 1 The cross-sectional view of the combiner 10 is shown along the AA direction.

[0033] Furthermore, the shell 11 is provided with a bridge accommodating cavity 13, which is surrounded by an isolation wall. The orthogonal bridge 300 is arranged in the bridge accommodating cavity 13, and the orthogonal bridge 300 is isolated from the cavity filter 100 and the microstrip line filter 200 by the bridge accommodating cavity 13 to avoid signal crosstalk.

[0034] The side wall of the bridge accommodating cavity 13 close to the output port of the first cavity filter 110 and the output port of the first microstrip line filter 210 is provided with a first guide hole (not shown in the figure). The side wall of the bridge accommodating cavity 13 close to the output port of the second cavity filter 120 and the output port of the second microstrip line filter 220 is provided with a second guide hole (not shown in the figure).

[0035] Furthermore, the combiner 10 includes two signal connectors 500 for connecting the input end of the orthogonal bridge 300 with the output end of the microstrip line filter 200 , and for connecting the input end of the orthogonal bridge 300 with the output end of the cavity filter 100 .

[0036] The two signal connectors 500 are respectively a first signal connector 510 and a second signal connector 520. The first signal connector 510 is disposed in the first guide hole and is exposed on both sides of the side wall of the bridge accommodating cavity 13, and one end of the first signal connector 510 is capacitively coupled with the first cavity filter 110 and the first microstrip line filter 210, respectively, and the other end is capacitively coupled with the first signal input terminal 310 of the orthogonal bridge 300. The second signal connector 520 is disposed in the second guide hole and is exposed on both sides of the side wall of the bridge accommodating cavity 13, and one end of the second signal connector 520 is capacitively coupled with the second cavity filter 120 and the second microstrip line filter 220, respectively, and the other end is capacitively coupled with the second signal input terminal 320 of the orthogonal bridge 300.

[0037] One end of the signal connector 500 extends into the last resonant cavity of the cavity filter 100 , and the output end of the microstrip line in the microstrip line filter 200 extends into the last resonant cavity of the cavity filter 100 .

[0038] Specifically, the last resonant cavity of the first cavity filter 110 is provided with an avoidance groove 111, one end of the first signal connector 510 extends to the avoidance groove 111, and the first signal connector 510 is spaced apart from the last resonant cavity of the first cavity filter 110, so that the first cavity filter 110 is capacitively coupled to the orthogonal bridge 300 through the first signal connector 510. The microstrip line output end of the first microstrip line filter 210 extends to the last resonant cavity of the first cavity filter 110, and is located on the side of the first signal connector 510 away from the last resonant cavity of the first cavity filter 110, so as to reduce the problem of signal crosstalk between the first microstrip line filter 210 and the first cavity filter 110, and the first signal connector 510 is spaced apart from the first microstrip line output end, so that the first microstrip line filter 210 is capacitively coupled to the orthogonal bridge 300 through the first signal element. The structure among the second cavity filter 120 , the second microstrip line filter 220 and the second signal connector 520 is the same as the structure among the first cavity filter 110 , the first microstrip line filter 210 and the first signal connector 510 , and will not be described again.

[0039] The first signal input end 310 of the orthogonal bridge 300 is provided with a first avoidance groove, and the other end of the first signal connector 510 extends to the first avoidance groove and is spaced apart from the orthogonal bridge 300. The second signal input end 320 of the orthogonal bridge 300 is provided with a second avoidance groove, and the other end of the second signal connector 520 extends to the second avoidance groove and is spaced apart from the orthogonal bridge 300.

[0040] The bridge arm of the orthogonal bridge 300 extends outward to form a first protrusion 330 and a second protrusion 340, wherein the size of the first protrusion 330 is smaller than the size of the second protrusion 340. The extension length of the first protrusion 330 is smaller than the extension length of the second protrusion 340, and the second protrusion 340 is located in the middle area of ​​the orthogonal bridge 300.

[0041] Therefore, the present application connects the microstrip line filter 200 and the cavity filter 100 respectively and simultaneously through the two signal input ends of the orthogonal bridge 300, and at least two microstrip line filters 200 and at least two cavity filters 100 share the input end of the orthogonal bridge 300, which can reduce the volume of the combiner 10 and reduce the manufacturing cost. In addition, the transparent transmission of low-frequency signals can be achieved between the two output ports of the orthogonal bridge 300, further improving the flexibility of the configuration of the combiner 10.

[0042] Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for those skilled in the art, according to the idea of ​​the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A combiner, characterized in that: include: at least two microstrip line filters; at least two cavity filters; An orthogonal bridge, wherein a first signal input end thereof is respectively connected to an output end of at least one of the microstrip line filters and an output end of at least one of the cavity filters, and a second signal input end thereof is respectively connected to an output end of at least another of the microstrip line filters and an output end of at least another of the cavity filters; The combiner comprises two microstrip line filters and two cavity filters, the two microstrip line filters are arranged symmetrically with the center line of the orthogonal bridge along the width direction as the axis, and the two microstrip line filters are arranged symmetrically with the center line as the axis; The two microstrip line filters are arranged adjacent to each other, the cavity filter and the microstrip line filter are arranged along the length direction of the orthogonal bridge, and the cavity filter is located outside the side of the microstrip line filter along the width direction and the side of the orthogonal bridge along the width direction; The input port of the cavity filter is arranged on the same side as the output port of the orthogonal bridge, and is arranged opposite to the input port of the microstrip line filter.

2. The combiner according to claim 1, characterized in that: The cavity filter is composed of 7 resonant cavities, the first to fifth resonant cavities of the cavity filter are arranged along the center line direction, the fifth to seventh resonant cavities of the cavity filter are arranged along the center line, and the fifth to seventh resonant cavities are located between the microstrip line filter and the first to fifth resonant cavities of the cavity filter.

3. The combiner according to claim 1, characterized in that: The microstrip line filter is composed of five resonant cavities arranged along the center line.

4. The combiner according to claim 1, characterized in that: Further including: Two signal connectors, used to connect the input end of the orthogonal bridge and the output end of the microstrip line filter; And, used to connect the input end of the orthogonal bridge and the output end of the cavity filter.

5. The combiner according to claim 4, characterized in that: One end of the signal connector extends into the last resonant cavity of the cavity filter, and the output end of the microstrip line in the microstrip line filter extends into the corresponding last resonant cavity.

6. The combiner according to claim 1, characterized in that: It further comprises a plate body, and the microstrip lines in the microstrip line filter and the orthogonal bridge are fixed on the plate body through plastic fixing parts.

7. The combiner according to claim 1, characterized in that: A first protrusion and a second protrusion extend outwardly from the bridge arm of the orthogonal bridge, wherein the size of the first protrusion is smaller than the size of the second protrusion.

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