Display module, electronic device, and method for forming display module

Abstract

The present disclosure relates to a display module, an electronic device, and a method for forming a display module. The display module includes a cover plate, a display panel, a middle frame, and a blocking structure; an ink layer is coated on the cover plate; a buffer structure is provided between the cover plate and the display panel; a bonding structure is provided between the cover plate and the middle frame; and the blocking structure is used to block the diffusion of the diffused substance in the buffer structure to the bonding structure. The present disclosure sets a blocking structure on the ink layer or the outer surface of the buffer structure on the cover plate, thereby blocking the penetration of organic matter in the ink layer, effectively ensuring the dyne value of the ink layer, ensuring the bonding strength between the bonding layer and other material layers, and preventing the debonding phenomenon from occurring easily.

Description

Technical Field

[0001] The present disclosure relates to a glass cover plate, and more particularly to a display module, an electronic device, and a method for forming the display module. Background Art

[0002] At present, when the CG cover plate is processed, it needs to be coated with an ink layer, and a buffer structure is arranged between the CG cover plate and the display panel. Most of the buffer structure is silicone glue. When the silicone glue is cured, it will slowly release volatile organic substances such as (CH3SiOCH3)n and silicone oil. These organic substances will form capillary action due to the poor density of the ink, gradually penetrate from the coating position of the adhesive colloid to the edge, and even affect the dyne value of the ink surface at the non-glue-dispensing position, reduce the bonding strength between it and other module layers, and then affect the glue-dispensing strength of the whole machine, which makes it easy for the screen to separate from the middle frame. Summary of the invention

[0003] In view of the above technical problems, the purpose of the present disclosure is to provide a display module, an electronic device, and a method for forming a display module, so as to set a blocking structure on a substrate to prevent the diffusion material in the buffer structure from diffusing to the bonding structure.

[0004] In order to achieve the above objectives, the technical solutions adopted in this disclosure are as follows:

[0005] According to a first aspect of an embodiment of the present disclosure, there is provided a display module, including a cover plate, a display panel, a middle frame and a blocking structure;

[0006] The cover plate is coated with an ink layer;

[0007] A buffer structure is provided between the cover plate and the display panel;

[0008] A bonding structure is provided between the cover plate and the middle frame;

[0009] The blocking structure is used to block the diffusion substance in the buffer structure from diffusing to the bonding structure.

[0010] Optionally, the blocking structure includes a first structure disposed between the buffer structure and the cover plate, and / or the blocking structure includes a second structure disposed between the buffer structure and the bonding structure.

[0011] Optionally, the capillary force generated by the first structure is greater than the capillary force generated by the ink layer.

[0012] Optionally, the first structure is a carbon nanotube layer.

[0013] Optionally, the second structure is arranged in the diffusion region;

[0014] The diffusion area is a region between the buffer structure and the bonding structure, and the distance from the buffer structure to the bonding structure is less than or equal to the diffusion distance; the diffusion distance is the farthest distance that the diffusion substance diffuses in the ink layer.

[0015] Optionally, an extension direction of the second structure is perpendicular to a diffusion direction of the diffusion substance.

[0016] Optionally, the second structure includes a filling structure and / or a protruding structure provided on the ink layer between the buffer structure and the bonding structure.

[0017] Optionally, the protruding structure is formed by ink and / or by a barrier material;

[0018] The blocking material includes at least one of the following: a material whose molecular volume is smaller than that of ink molecules, an oleophobic material, and a material capable of reducing the capillary force of the ink layer.

[0019] Optionally, the filling structure is a structure formed after the holes on the ink layer are filled with a barrier material;

[0020] The blocking material includes at least one of the following: a material whose molecular volume is smaller than that of ink molecules, an oleophobic material, and a material capable of reducing the capillary force of the ink layer.

[0021] According to a second aspect of an embodiment of the present disclosure, there is provided an electronic device, comprising the aforementioned display module.

[0022] According to a third aspect of an embodiment of the present disclosure, there is provided a method for forming a display module, comprising:

[0023] In the process of forming the display module, a blocking structure is formed;

[0024] Wherein, the blocking structure is used to block the diffusion material in the buffer structure from diffusing to the bonding structure;

[0025] The buffer structure is arranged between the cover plate of the display module and the display panel;

[0026] The bonding structure is arranged between the cover plate and the middle frame of the display module.

[0027] Optionally, in the process of forming the display module, forming a blocking structure includes:

[0028] In the process of forming the display module, a first structure is formed in the area where the buffer structure contacts the cover plate, and the first structure is used as the buffer structure;

[0029] And / or, in the process of forming the display module, a second structure is formed in the area between the buffer structure and the bonding structure, and the second structure is used as the buffer structure.

[0030] Optionally, the capillary force generated by the first structure is greater than the capillary force generated by the ink layer on the cover plate.

[0031] Optionally, in the process of forming the display module, forming a first structure in a region where the buffer structure contacts the cover plate includes:

[0032] In the process of forming the display module, the first structure is formed by a coating process in the area where the buffer structure contacts the cover plate;

[0033] Wherein, the coating process includes needle coating, or the coating process includes needle coating and spray valve coating.

[0034] Optionally, in the process of forming the display module, forming a second structure in a region between the buffer structure and the bonding structure includes:

[0035] In the process of forming the display module, the second structure is formed in the diffusion area of ​​the ink layer on the cover plate;

[0036] The diffusion area is a region between the buffer structure and the bonding structure, and the distance from the buffer structure to the bonding structure is less than or equal to the diffusion distance; the diffusion distance is the farthest distance that the diffusion substance diffuses in the ink layer.

[0037] Optionally, in the process of forming the display module, forming the second structure in the diffusion area of ​​the ink layer on the cover plate includes:

[0038] In the process of forming the display module, a filling structure and / or a protruding structure is formed in the diffusion area of ​​the ink layer as the second structure;

[0039] Wherein, the protruding structure is formed by ink and / or by a barrier material; the filling structure is a structure formed after the holes on the ink layer are filled with a barrier material;

[0040] The barrier material comprises at least one of the following: a material whose molecular volume is smaller than that of ink molecules, an oleophobic material, and a material capable of reducing the capillary force of the ink layer.

[0041] The technical solution provided by the embodiments of the present disclosure may have the following beneficial effects:

[0042] In the embodiments of the present disclosure, in products such as CG cover plates provided with ink layers, a blocking structure can be provided to prevent the diffusion of the diffusion substance in the buffer structure from diffusing to the bonding structure. For example, by providing a blocking structure in the diffusion area or directly coating a nanotube layer on the outer surface of the buffer structure, the organic matter in the buffer structure can be blocked from diffusing to the bonding structure, thereby ensuring the bonding strength between the cover plate and the middle frame, and preventing the debonding phenomenon from occurring easily. As a result, the display module of the embodiments of the present disclosure has improved quality.

[0043] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0045] Figure 1 This is a schematic diagram of the overall structure of a display module according to an embodiment of the present disclosure;

[0046] Figure 2 A schematic diagram of the structure of a display module according to an embodiment of the present disclosure;

[0047] Figure 3 A schematic diagram of a blocking structure according to an embodiment of the present disclosure;

[0048] Figure 4 A schematic diagram of a blocking structure according to an embodiment of the present disclosure;

[0049] Figure 5 A schematic diagram of a blocking structure according to an embodiment of the present disclosure;

[0050] Figure 6 A schematic diagram of the blocking effect of the blocking structure shown in the embodiment of the present disclosure;

[0051] Figure 7 A schematic diagram of a display module processing process according to an embodiment of the present disclosure;

[0052] Figure 8 A block diagram of an electronic device according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0053] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of devices consistent with some aspects of the present disclosure as detailed in the appended claims.

[0054] Figure 1 The overall structure diagram of the display module shown in the embodiment of the present disclosure is as follows: Figure 1 As shown, the display module of the embodiment of the present disclosure includes an ink layer 11 coated on the first surface of the cover plate 10, and a buffer structure 13 is further arranged between the ink layer 11 and other modules such as a TFT glass module. The material of the buffer structure 13 may be, for example, silicone glue, and the silicone glue layer will slowly release volatile organic substances such as (CH3SiOCH3)n and silicone oil when solidified. The organic matter will form capillaries due to the poor density of the ink on the surface of the cover plate 10, and gradually penetrate into the bonding structure on the cover plate 10, thereby affecting the dyne value of the ink surface at the non-glue-dispensing position, reducing the bonding strength between the cover plate 10 and the middle frame, and easily causing the debonding phenomenon to cause a series of problems. Figure 1 In the figure, layer 12 is an organic layer formed by organic matter released from silicone glue or the like.

[0055] The display module of the embodiment of the present disclosure includes a cover plate 10, a display panel 14, a middle frame and a blocking structure. The cover plate 10 is coated with an ink layer 11; a buffer structure 13 is provided between the cover plate 10 and the display panel 14;

[0056] A bonding structure is provided between the cover plate 10 and the middle frame; the cover plate 10 may include a glass substrate, such as a CG plate.

[0057] The blocking structure is used to block the diffusion substance in the buffer structure 13 from diffusing to the bonding structure.

[0058] As an implementation, the blocking structure includes a first structure disposed between the buffer structure and the cover plate, and / or the blocking structure includes a second structure disposed between the buffer structure 13 and the bonding structure. That is, in the embodiment of the present disclosure, a blocking structure for the diffused substance in the buffer structure 13 is implemented in at least two ways. Specifically, the blocking structure is formed by disposing a first structure on the buffer structure 13, and the capillary force generated by the first structure is greater than the capillary force generated by the ink layer. As an implementation, the first structure is a carbon nanotube layer, that is, a carbon nanotube layer is formed on the buffer structure 13 to serve as the blocking structure.

[0059] In the disclosed embodiment, the buffer structure 13 may also be made of other materials that block diffusion of substances, as long as the buffer effect can be guaranteed, for example, a silicone adhesive structure is not used to prevent the penetration of small molecular organic matter.

[0060] In the embodiment of the present disclosure, the blocking structure can also be a second structure arranged between the buffer structure 13 and the bonding structure. Specifically, the second structure is arranged in a diffusion area; the diffusion area is arranged between the buffer structure 13 and the bonding structure, and the distance from the buffer structure 13 to the bonding structure is less than or equal to the diffusion distance; the diffusion distance is the farthest distance that the diffusion substance diffuses in the ink layer. In other words, a second structure capable of blocking the diffusion substance needs to be arranged on the cover plate between the buffer structure 13 and the bonding structure. As an implementation method, the extension direction of the second structure is perpendicular or substantially perpendicular to the diffusion direction of the diffusion substance. Specifically, the second structure includes a filling structure and / or a protruding structure arranged on the ink layer between the buffer structure and the bonding structure. The protruding structure is formed by ink and / or by a blocking material; wherein the blocking material includes at least one of the following: a material with a molecular volume smaller than the molecular volume of ink, an oleophobic material, and a material capable of reducing the capillary force of the ink layer. The filling structure is a structure formed after the holes on the ink layer are filled with a blocking material; wherein the blocking material includes at least one of the following: a material with a molecular volume smaller than the molecular volume of ink, an oleophobic material, and a material capable of reducing the capillary force of the ink layer.

[0061] In the embodiment of the present disclosure, by providing a blocking structure between the buffer structure 13 on the cover plate 10 and the bonding structure or directly coating the blocking structure between the buffer structure 13 and the cover plate 10, organic substances such as (CH3SiOCH3)n released by silicone glue etc. can be prevented from penetrating outwards, or even if they penetrate, the organic substances can be blocked outside the bonding structure by the blocking structure, thereby ensuring the bonding performance of the bonding structure, ensuring that the display module of the embodiment of the present disclosure will not easily come apart, and ensuring the quality.

[0062] The specific implementation of the blocking structure of the embodiment of the present disclosure is explained in detail below through specific examples.

[0063] Figure 2 Schematic diagram of the blocking structure shown in the embodiment of the present disclosure, such as Figure 2 As shown, in this example, a first structure is provided on the outer surface of the buffer structure 13 abutting against the cover plate 10, and the first structure includes a carbon nanotube layer. The first structure serves as a blocking structure of the embodiment of the present disclosure. Through the first structure, organic matter in the buffer structure 13 will not penetrate outward, thereby preventing the organic matter in the buffer structure 13 from penetrating the bonding structure on the flow channel cover plate 10, thereby achieving a blocking effect on the organic matter in the buffer structure 13 and ensuring the bonding performance of the bonding structure.

[0064] Specifically, the first structure of the embodiment of the present disclosure is arranged on the outer surface of the buffer structure 13 where the buffer structure 13 abuts against the cover plate 10. The first structure includes a nanotube layer coated on the outer surface of the buffer structure 13 where the buffer structure 13 abuts against the cover plate 10. The nanotube layer has a fine tubular structure, and the fine tubular structure constitutes a capillary space, and the capillary action of the capillary space is greater than the capillary action generated on the surface of the ink layer.

[0065] like Figure 2 As shown, after the silicone glue is set as a buffer structure 13 on the graphite layer of the cover plate 10, a very thin layer of carbon nanotubes or other nanotube-like structures is coated on the outer surface of the buffer structure 13 where the buffer structure 13 abuts the cover plate 10. The fine tubular structure of the nanotube is used to construct a capillary space that is a thousand times finer than the ink surface. The capillary space formed by the fine tubular structure of the nanotube has a capillary effect that is much greater than the capillary effect generated on the ink surface. Therefore, after the nanotube layer forms a capillary space, the small molecule silicone oil in the silicone glue will diffuse into the nanotube layer and remain in the nanotube layer for a long time. Therefore, the entire buffer structure 13 no longer permeates the small molecule silicone oil, and the organic matter in the buffer structure 13 no longer diffuses to the ink surface, thereby forming a blocking structure on the outer surface of the buffer structure 13 where the buffer structure 13 abuts the cover plate 10, and the small molecule silicone oil is firmly locked in the structure of the nanotube layer.

[0066] Figure 3 Schematic diagram of the blocking structure shown in the embodiment of the present disclosure, such as Figure 3 , Figure 1 As shown, the blocking structure of the embodiment of the present disclosure can also be a second structure 112 arranged between the buffer structure 13 and the bonding structure 15. Specifically, the second structure is arranged in the diffusion area 17; the diffusion area 17 is arranged between the buffer structure 13 and the bonding structure 15, and the distance from the buffer structure 13 to the bonding structure 15 is less than or equal to the diffusion distance; the diffusion distance is the farthest distance that the diffusion substance diffuses in the ink layer. The diffusion area 17 of the embodiment of the present disclosure is a schematic illustration, and the area between the buffer structure 13 and the bonding structure 15 can be used as the diffusion area 17.

[0067] That is to say, a second structure 112 capable of blocking the diffusion substance needs to be provided on the cover plate between the buffer structure 13 and the bonding structure 15. The extension direction of the second structure 112 is perpendicular or approximately perpendicular to the diffusion direction of the diffusion substance. As an implementation, the second structure 112 includes a filling structure and / or a protruding structure provided on the ink layer between the buffer structure 13 and the bonding structure 15. The protruding structure is formed by ink and / or by a blocking material; wherein the blocking material includes at least one of the following: a material having a molecular volume smaller than the molecular volume of the ink, an oleophobic material, and a material capable of reducing the capillary force of the ink layer. The filling structure is a structure formed after the holes on the ink layer are filled with a blocking material; wherein the blocking material includes at least one of the following: a material having a molecular volume smaller than the molecular volume of the ink, an oleophobic material, and a material capable of reducing the capillary force of the ink layer.

[0068] In the disclosed embodiment, the second structure 112 is a generally long and narrow structure, so as to block the small molecules that penetrate from the buffer structure 13 as much as possible and prevent them from diffusing to the bonding structure 15 .

[0069] The barrier structure in the embodiment of the present disclosure can reduce the impact of organic matter such as silicone oil penetration on related products by filling the ink layer with barrier materials. The penetration of silicone glue in different ink layers was tested, and the penetration distance was 0.27mm to 1.3mm after 7 days. After adopting the barrier structure of the embodiment of the present disclosure, the penetration distance limit can be controlled within the design line, achieving the purpose of artificially setting the penetration limit width.

[0070] like Figure 4 As shown, when a blocking structure is provided in the ink layer, a corresponding blocking groove can be provided in the ink layer, and the organic matter in the ink layer can be blocked before the blocking groove by means of the blocking groove. Other blocking structures can also be provided to block the penetration of organic matter, and the shape of the blocking structure is not limited, and can be a groove structure, or a slit structure, etc.

[0071] Figure 4 Schematic diagram of the blocking structure shown in the embodiment of the present disclosure, such as Figure 4As shown, the ink layer is designed with a second structure, which includes setting a corresponding blocking groove 113 in the ink layer 11, and blocking the organic matter by filling the blocking groove 113 with a blocking material. Taking the aforementioned screen printing process as an example, the ink screen printing position accuracy is generally ±0.2mm. Therefore, assuming that the width of the blocking groove 113 is designed to be 0.5mm, when the blocking groove 113 is filled with blocking material, the screen printing width of the filling material in the blocking groove 113 is 0.7mm to achieve the effect that the width of the blocking groove 113 is 0.5mm, thereby effectively blocking the diffusion of organic matter. In the embodiment of the present disclosure, the blocking material filled in the blocking groove 113 can be a high optical density (OD, Optical Density) value greater than the OD value of the coating material such as the ink material in the ink layer. In the embodiment of the present disclosure, by setting the blocking groove 113 and the filling material, the penetration blocking of organic matter is achieved.

[0072] Of course, the larger the OD value of the blocking layer material is, the better. Any material with an OD value greater than a set threshold, such as greater than the OD value of ink and having a certain light blocking property can be used as the material of the blocking layer 113 .

[0073] Figure 5 Schematic diagram of the blocking structure shown in the embodiment of the present disclosure, such as Figure 5 As shown, the ink layer is designed with a barrier structure, including:

[0074] exist Figure 4 On the basis of the blocking structure shown, a blocking line structure 114 is further provided outside the blocking groove 113, and serves as a blocking structure together with the blocking groove 113. In the embodiment of the present disclosure, an oleophobic blocking line structure 114 such as an ink line is added to the outside of the blocking line to further block part of the organic matter of the high silicone oil type silicone glue from overflowing the blocking groove 113, thereby better blocking the penetration of organic matter. In the embodiment of the present disclosure, the blocking line structure 114 can also serve as an auxiliary positioning line.

[0075] In the implementation of the present disclosure, the width of the blocking groove 113 is greater than or equal to a set length, such as the width of the blocking groove 113 is greater than or equal to 0.5 mm, or the width of the blocking groove 113 is greater than or equal to 0.8 mm.

[0076] In the disclosed embodiment, the material of the ink layer includes ink having a density greater than a set threshold, or other oleophobic and opaque materials having a density greater than a set threshold.

[0077] In the embodiment of the present disclosure, the blocking groove 113 and the blocking line structure 114 can be selected according to the requirements, such as according to the silicone oil penetration strength, or can be used at the same time.

[0078] Figure 6 FIG. 1 is a schematic diagram of the blocking effect of the blocking structure shown in the embodiment of the present disclosure, as shown in FIG. Figure 6As shown, when the blocking groove 113 and the blocking line structure 114 of the embodiment of the present disclosure are used, when organic matter penetrates into the blocking groove 113, the organic matter cannot continue to penetrate because the ink layer, such as the ink holes and lines in the ink layer, are blocked. The blocking layer is surrounded by the silk-screen oleophobic ink blocking line structure 114, which can achieve secondary blocking of organic matter.

[0079] The disclosed embodiment also describes a method for forming a display module, including:

[0080] In the process of forming the display module, a blocking structure is formed;

[0081] Wherein, the blocking structure is used to block the diffusion material in the buffer structure from diffusing to the bonding structure;

[0082] The buffer structure is arranged between the cover plate of the display module and the display panel;

[0083] The bonding structure is arranged between the cover plate and the middle frame of the display module.

[0084] As an implementation method, in the process of forming the display module, forming the blocking structure includes:

[0085] In the process of forming the display module, a first structure is formed in the area where the buffer structure contacts the cover plate, and the first structure is used as the buffer structure;

[0086] And / or, in the process of forming the display module, a second structure is formed in the area between the buffer structure and the bonding structure, and the second structure is used as the buffer structure.

[0087] As an implementation manner, the capillary force generated by the first structure is greater than the capillary force generated by the ink layer on the cover plate.

[0088] As an implementation manner, in the process of forming the display module, forming a first structure in the area where the buffer structure contacts the cover plate includes:

[0089] In the process of forming the display module, the first structure is formed by a coating process in the area where the buffer structure contacts the cover plate;

[0090] Wherein, the coating process includes needle coating, or the coating process includes needle coating and spray valve coating.

[0091] As an implementation manner, in the process of forming the display module, forming a second structure in the area between the buffer structure and the bonding structure includes:

[0092] In the process of forming the display module, the second structure is formed in the diffusion area of ​​the ink layer on the cover plate;

[0093] The diffusion area is a region between the buffer structure and the bonding structure, and the distance from the buffer structure to the bonding structure is less than or equal to the diffusion distance; the diffusion distance is the farthest distance that the diffusion substance diffuses in the ink layer.

[0094] As an implementation manner, in the process of forming the display module, forming the second structure in the diffusion area of ​​the ink layer on the cover plate includes:

[0095] In the process of forming the display module, a filling structure and / or a protruding structure is formed in the diffusion area of ​​the ink layer as the second structure;

[0096] Wherein, the protruding structure is formed by ink and / or by a barrier material; the filling structure is a structure formed after the holes on the ink layer are filled with a barrier material;

[0097] The barrier material comprises at least one of the following: a material whose molecular volume is smaller than that of ink molecules, an oleophobic material, and a material capable of reducing the capillary force of the ink layer.

[0098] The relevant physical structures for forming the blocking structure in the display module have been described in the aforementioned embodiments, and the structural details thereof will not be elaborated here.

[0099] Figure 7 FIG. 1 is a schematic diagram of a display module processing process according to an embodiment of the present disclosure, such as Figure 7 As shown, the display module of the embodiment of the present disclosure includes a CG cover plate, a display panel (TFT), a middle frame and other modules. The embodiment of the present disclosure first coats silicone glue on the TFT display panel through a coating needle to form a silicone glue buffer structure. The height of the silicone glue buffer structure is roughly equivalent to the height of the display panel module. After the silicone glue is cured, a buffer structure is formed. Figure 7 The upper surface of the buffer structure shown is coated with nanotubes through a spray valve to form a nanotube layer. The capillary force generated by the nanotube layer is greater than the capillary force generated by the ink layer. The nanotube layer can prevent the diffusion of the diffused substances in the buffer structure from diffusing outward. The nanotube layer serves as a blocking structure of the embodiment of the present disclosure. After the nanotube layer is coated on the side of the buffer structure that contacts the CG cover plate, the CG cover plate is placed on the display panel module. The CG cover plate is attached to the nanotube layer on the buffer structure and placed in a vacuum bonding platform to bond the CG cover plate to the display panel. After the CG cover plate is bonded, the display module of the embodiment of the present disclosure is formed.

[0100] As an alternative, the embodiment of the present disclosure can also only use a needle to apply silicone glue on the display panel, and apply the nanotube layer on the surface of the silicone glue buffer structure that abuts the CG cover plate, but the method of applying only with a needle has low precision; therefore, the embodiment of the present disclosure adopts the aforementioned Figure 7 In the coating process shown, the amount of nanotubes to be sprayed is very small, so the amount can be well controlled by spray valve coating. However, because silicone adhesive has a relatively high viscosity, it is not suitable for spray valve coating. Therefore, when the combination of needle coating and spray valve coating is used, the needle coating is used first, and then the spray valve coating is used.

[0101] The disclosed embodiment also describes an electronic device, including the display module of the aforementioned embodiment.

[0102] Figure 8 is a block diagram of an electronic device 800 according to an exemplary embodiment. Figure 8 As shown, the electronic device 800 supports multi-screen output, and the electronic device 800 may include one or more of the following components: a processing component 802, a memory 804, a power component 806, a multimedia component 808, an audio component 810, an input / output (I / O) interface 812, a sensor component 814, and a communication component 816.

[0103] The processing component 802 generally controls the overall operation of the electronic device 800, such as operations associated with display, phone calls, data communications, camera operations, and recording operations. In addition, the processing component 802 may include one or more modules to facilitate interaction between the processing component 802 and other components. For example, the processing component 802 may include a multimedia module to facilitate interaction between the multimedia component 808 and the processing component 802.

[0104] The memory 804 is configured to store various types of data to support operations on the device 800. Examples of such data include instructions for any application or method operating on the electronic device 800, contact data, phone book data, messages, pictures, videos, etc. The memory 804 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk or optical disk.

[0105] The power component 806 provides power to the various components of the electronic device 800. The power component 806 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power for the electronic device 800.

[0106] The multimedia component 808 includes a screen that provides an output interface between the electronic device 800 and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touch screen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touch, slide, and gestures on the touch panel. The touch sensor may not only sense the boundaries of the touch or slide action, but also detect the duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component 808 includes a front camera and / or a rear camera. When the device 800 is in an operating mode, such as a shooting mode or a video mode, the front camera and / or the rear camera may receive external multimedia data. Each front camera and the rear camera may be a fixed optical lens system or have a focal length and optical zoom capability.

[0107] The audio component 810 is configured to output and / or input audio signals. For example, the audio component 810 includes a microphone (MIC), and when the electronic device 800 is in an operating mode, such as a call mode, a recording mode, and a voice recognition mode, the microphone is configured to receive an external audio signal. The received audio signal can be further stored in the memory 804 or sent via the communication component 816. In some embodiments, the audio component 810 also includes a speaker for outputting audio signals.

[0108] I / O interface 812 provides an interface between processing component 802 and peripheral interface modules, such as keyboards, click wheels, buttons, etc. These buttons may include but are not limited to: home button, volume button, start button, and lock button.

[0109] The sensor assembly 814 includes one or more sensors for providing various aspects of status assessment for the electronic device 800. For example, the sensor assembly 814 can detect the open / closed state of the device 800, the relative positioning of components, such as the display and keypad of the electronic device 800, and the sensor assembly 814 can also detect the position change of the electronic device 800 or a component of the electronic device 800, the presence or absence of contact between the user and the electronic device 800, the orientation or acceleration / deceleration of the electronic device 800, and the temperature change of the electronic device 800. The sensor assembly 814 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. The sensor assembly 814 may also include an optical sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly 814 may also include an accelerometer, a gyroscope sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.

[0110] The communication component 816 is configured to facilitate wired or wireless communication between the electronic device 800 and other devices. The electronic device 800 can access a wireless network based on a communication standard, such as Wi-Fi, 2G or 3G, or a combination thereof. In an exemplary embodiment, the communication component 816 receives a broadcast signal or broadcast-related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, the communication component 816 also includes a near field communication (NFC) module to facilitate short-range communication. For example, the NFC module can be implemented based on radio frequency identification (RFID) technology, infrared data association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology and other technologies.

[0111] In an exemplary embodiment, the electronic device 800 may be implemented by one or more application specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components.

[0112] In the embodiment of the present disclosure, the display screen in the electronic device adopts the display module of the aforementioned embodiment.

[0113] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. The present disclosure is intended to cover any variations, uses or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The description and examples are to be considered exemplary only, and the true scope and spirit of the present disclosure are indicated by the following claims.

[0114] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A display module, characterized in that: Including a cover plate, a display panel, a middle frame and a blocking structure; The cover plate is coated with an ink layer; A buffer structure is provided between the cover plate and the display panel; A bonding structure is provided between the cover plate and the middle frame; The blocking structure is used to block the diffusion material in the buffer structure from diffusing to the bonding structure; the blocking structure includes a first structure arranged between the buffer structure and the cover plate, and the capillary force generated by the first structure is greater than the capillary force generated by the ink layer; The first structure is arranged on the outer surface of the buffer structure abutting against the cover plate; The first structure is a carbon nanotube layer; The blocking structure includes a second structure arranged between the buffer structure and the bonding structure; the second structure is arranged in a diffusion area; wherein the diffusion area is an area between the buffer structure and the bonding structure, and the distance from the buffer structure to the bonding structure is less than or equal to the diffusion distance; the diffusion distance is the farthest distance that the diffusion substance diffuses in the ink layer; the extension direction of the second structure is perpendicular to the diffusion direction of the diffusion substance.

2. The display module according to claim 1, characterized in that: The second structure includes a filling structure and / or a protruding structure disposed on the ink layer between the buffer structure and the bonding structure.

3. The display module according to claim 2, characterized in that: The protruding structure is formed by ink and / or by a barrier material; The blocking material includes at least one of the following: a material whose molecular volume is smaller than that of ink molecules, an oleophobic material, and a material capable of reducing the capillary force of the ink layer.

4. The display module according to claim 2, characterized in that: The filling structure is a structure formed after the holes on the ink layer are filled with a barrier material; The blocking material includes at least one of the following: a material whose molecular volume is smaller than that of ink molecules, an oleophobic material, and a material capable of reducing the capillary force of the ink layer.

5. An electronic device, characterized in that: A display module comprising any one of claims 1 to 4.

6. A method for forming a display module, characterized in that: include: In the process of forming a display module, a blocking structure is formed, comprising: in the process of forming the display module, a first structure is formed in the area where the buffer structure contacts the cover plate, and the first structure is used as the blocking structure; the capillary force generated by the first structure is greater than the capillary force generated by the ink layer on the cover plate; the first structure is a carbon nanotube layer; in the process of forming the display module, a second structure is formed in the diffusion area of ​​the ink layer on the cover plate; wherein the diffusion area is an area between the buffer structure and the bonding structure, and the distance from the buffer structure to the bonding structure is less than or equal to the diffusion distance; the diffusion distance is the farthest distance that the diffusion substance diffuses in the ink layer; and the second structure is used as the blocking structure; Wherein, the blocking structure is used to block the diffusion material in the buffer structure from diffusing to the bonding structure; The buffer structure is arranged between the cover plate of the display module and the display panel; The bonding structure is arranged between the cover plate and the middle frame of the display module.

7. The method according to claim 6, characterized in that In the process of forming the display module, forming a first structure in the area where the buffer structure contacts the cover plate includes: In the process of forming the display module, the first structure is formed by a coating process in the area where the buffer structure contacts the cover plate; Wherein, the coating process includes needle coating, or the coating process includes needle coating and spray valve coating.

8. The method according to claim 6, characterized in that In the process of forming the display module, forming the second structure in the diffusion area of ​​the ink layer on the cover plate comprises: In the process of forming the display module, a filling structure and / or a protruding structure is formed in the diffusion area of ​​the ink layer as the second structure; Wherein, the protruding structure is formed by ink and / or by a barrier material; the filling structure is a structure formed after the holes on the ink layer are filled with a barrier material; The barrier material comprises at least one of the following: a material whose molecular volume is smaller than that of ink molecules, an oleophobic material, and a material capable of reducing the capillary force of the ink layer.

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