Bonding structure, display device and preparation method thereof

Abstract

The present disclosure provides a bonding structure, a display device and a preparation method thereof. The display device includes a bonding structure, a display panel and a conductive adhesive layer, wherein the bonding structure includes a substrate and a plurality of first terminals and a plurality of shading units respectively located on opposite sides of the substrate, the first terminals and the shading units are located in a first bonding area of ​​the substrate, and the orthographic projection of the gap between two adjacent first terminals on the substrate overlaps at least partially with the orthographic projection of the shading unit on the substrate; the display panel includes a second bonding area and a plurality of second terminals located in the second bonding area, the first bonding area and the second bonding area are opposite, and the first terminals and the second terminals are opposite; the conductive adhesive layer is located between the bonding structure and the display panel for connecting the first terminal and the corresponding second terminal. The shading unit can shield the light irradiated to the gap between two adjacent first terminals, avoid the conductive adhesive layer in the corresponding area from curing too fast, and reduce the curing rate difference inside the conductive adhesive layer.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular, to a bonding structure, a display device having the bonding structure, and a preparation method thereof. Background Art

[0002] According to product functional requirements, some components in the display device need to be electrically connected through the bonding process. Compared with the thermal pressure bonding process, the laser bonding process has significant advantages such as small heat-affected zone and short bonding time.

[0003] However, the laser bonding process also has its disadvantages. After bonding, components are prone to peeling, which in turn limits product reliability. Summary of the invention

[0004] The first aspect of the present disclosure provides a display device, which includes a bonding structure, a display panel and a conductive adhesive layer. The bonding structure includes a substrate and a plurality of first terminals and a plurality of shading units located on the substrate, wherein the bonding structure includes a first bonding area defined in the substrate, the first terminal and the shading unit are located in the first bonding area and are respectively located on opposite sides of the substrate, and the orthographic projection of the gap between two adjacent first terminals on the substrate overlaps at least partially with the orthographic projection of the shading unit on the substrate. The display panel includes a second bonding area and a plurality of second terminals located in the second bonding area, wherein the first bonding area of ​​the bonding structure and the second bonding area of ​​the display panel are opposite, and the first terminal in the bonding structure and the second terminal in the display panel are opposite. The conductive adhesive layer is located between the bonding structure and the display panel, and the first terminal and the corresponding second terminal are connected through the conductive adhesive layer.

[0005] In the above display device, a light shielding unit is provided at a position corresponding to the gap between two adjacent first terminals on a side of the substrate of the bonding structure away from the first terminal, so that the light shielding unit is located upstream of the optical path of the gap between two adjacent first terminals during the laser bonding process, so that the light shielding unit can block the light originally irradiated directly to the gap. In this way, it is possible to prevent the portion of the conductive adhesive layer located in the area where the gap is located from being directly irradiated by light and curing too quickly, so that the portion and the portion of the conductive adhesive layer located in the area where the first terminals are located are cured in the form of heat conduction, thereby reducing the difference in curing rates of the two portions, and avoiding peeling caused by uneven curing rate of the conductive adhesive layer.

[0006] In one embodiment of the first aspect, the orthographic projection of the gap between two adjacent first terminals on the substrate coincides with the orthographic projection of the shading unit on the substrate. In other words, the orthographic projection of the shading unit on the substrate can completely cover the orthographic projection of the gap between two adjacent first terminals on the substrate. As a result, the shading unit can better shield the light directly incident on the gap, effectively reducing the laser energy borne by the portion of the conductive adhesive layer corresponding to the gap, thereby effectively reducing the curing speed of the portion.

[0007] In one implementation of the first aspect, the bonding structure may be a flexible circuit board.

[0008] In one embodiment of the first aspect, the material of the shading unit is the same as the material of the first terminal. In this way, the manufacturing cost and process complexity can be reduced, and the relevant parameters of the required shading unit can be more easily calculated according to the relevant parameters of the first terminal (such as thickness, area, etc.), thereby improving the manufacturing efficiency and process accuracy.

[0009] In an implementation of the first aspect, along the thickness direction of the bonding structure, the longitudinal cross-sectional shape of the shading unit is the same as the longitudinal cross-sectional shape of the first terminal. Thus, it is convenient to set the light transmittance of the shading unit to be consistent with the light transmittance of the first terminal, thereby better controlling the curing speed of different parts of the conductive adhesive layer to be consistent, and further improving the uniformity of the curing rate of the conductive adhesive layer.

[0010] In one embodiment of the first aspect, along the thickness direction of the bonding structure, the longitudinal cross-section of the shading unit and the first terminal is a trapezoid, and the lower base of the trapezoid is located between the upper base of the trapezoid and the substrate, that is, the trapezoid is arranged so that the lower base is close to the substrate, that is, the trapezoid is a regular trapezoid or an inverted trapezoid. The trapezoidal first terminal is conducive to filling the gap between adjacent first terminals when the conductive adhesive layer is squeezed, avoiding the occurrence of gaps at the edges of the first terminals and easy peeling; in addition, the trapezoidal shading unit is also conducive to forming other film layers thereon, such as the flat layer described below.

[0011] In one embodiment of the first aspect, the light transmittance of the shading unit is greater than or equal to the light transmittance of the first terminal. The conductive adhesive layer is thinner in the area where the first terminal is located, and thicker in the area where the gap between two adjacent first terminals is located. In order to make the two parts reach the same curing rate, the curing speed of the thicker part can be made greater than the curing speed of the thinner part. To this end, on the basis of heat conduction, the thicker part can absorb a certain amount of laser energy to increase the curing speed, so that its curing rate is consistent with that of the thinner part.

[0012] In one embodiment of the first aspect, the first terminal is a non-transparent conductive layer, and the shading unit is a semi-transparent and semi-reflective layer. The thickness of the conductive adhesive layer in the area where the first terminal is located is thinner, while the thickness of the part located in the area where the gap between two adjacent first terminals is located is thicker. In order to make the two parts reach the same curing rate, the curing speed of the thicker part can be made greater than the curing speed of the thinner part. When performing laser bonding, the laser cannot penetrate the first terminal set as a non-transparent conductive layer, so the thinner part of the conductive adhesive layer receives energy through thermal conduction and is cured; and the shading unit can transmit a certain amount of light, so the thicker part of the conductive adhesive layer can absorb the energy provided by the laser passing through the shading unit in addition to the energy received through thermal conduction. As a result, the curing speed of the thicker part of the conductive adhesive layer can be made higher than the curing speed of the thinner part, so that the final curing rates of the two parts tend to be consistent.

[0013] In one embodiment of the first aspect, the bonding structure further comprises a flat layer, which is located on a side of the substrate away from the first terminal and fills the gap between two adjacent shading units. When the bonding structure is pressed onto the display panel, the shading unit is located on the side of the bonding structure that is subjected to force. By filling the gap between the shading units with the flat layer, it is beneficial to make the bonding structure subjected to force uniformly, and it is possible to prevent the position of the shading unit (corresponding to the gap between two adjacent first terminals in the pressing direction) from being subjected to insufficient force due to excessive pressure at the position of the shading unit, so that the conductive adhesive layer between the first terminal and the second terminal can be fully squeezed, thereby better realizing the electrical connection function.

[0014] In one embodiment of the first aspect, the orthographic projection of the flat layer on the substrate coincides with the orthographic projection of the gap between two adjacent shading units on the substrate. In other words, the flat layer can be disposed in the gap between the shading units, thereby avoiding an increase in the thickness of the bonding structure, which is conducive to making the display device thinner and lighter.

[0015] In one embodiment of the first aspect, the distance from the surface of the flat layer facing away from the substrate to the substrate is equal to the distance from the surface of the shading unit facing away from the substrate to the substrate. In other words, the flat layer covers the side surface of the shading unit and has the same thickness as the shading unit. In this way, the surface of the bonding structure facing away from the display panel can be kept substantially horizontal, further ensuring that the bonding structure is subjected to uniform force during lamination.

[0016] In another embodiment of the first aspect, the flat layer covers the shading unit and the gap between two adjacent shading units. That is, the flat layer not only covers the side surface of the shading unit, but also covers the top surface of the shading unit, and the thickness is greater than the thickness of the shading unit. Thus, the requirements for processing accuracy can be reduced, the processing steps can be reduced, and the preparation cost can be reduced.

[0017] In an embodiment of the first aspect, the thickness of the portion of the flat layer located in the gap between two adjacent light shielding units is equal to the thickness of the portion of the conductive adhesive layer located in the gap between two adjacent first terminals. This is conducive to making the flat layer between two adjacent light shielding units and the conductive adhesive layer between two adjacent first terminals have similar light transmittance, and further making the portion of the conductive adhesive layer located in the area where the gap between two adjacent light shielding units is located (that is, the portion located in the area where the first terminals are located) and the portion of the conductive adhesive layer located in the area where the gap between two adjacent first terminals is located absorb substantially the same laser energy, thereby achieving uniform overall curing speed of the conductive adhesive layer.

[0018] A second aspect of the present disclosure provides a method for preparing a display device, the method comprising: providing a bonding structure, wherein the bonding structure comprises a substrate and a plurality of first terminals and a plurality of shading units located on the substrate, the bonding structure comprises a first bonding area defined in the substrate, the first terminal and the shading unit are located in the first bonding area and respectively located on opposite sides of the substrate, and the orthographic projection of the gap between two adjacent first terminals on the substrate at least partially overlaps with the orthographic projection of the shading unit on the substrate; providing a display panel, wherein the display panel comprises a second bonding area and a plurality of second terminals located in the second bonding area; attaching a conductive adhesive layer on the display panel or the bonding structure, and attaching the bonding structure to the display panel so that the first bonding area and the second bonding area are opposite to each other, and the first terminal and the second terminal are opposite to each other, wherein the conductive adhesive layer is located between the bonding structure and the display panel, and the first terminal and the corresponding second terminal are connected through the conductive adhesive layer; and pressing the bonding structure and the display panel, and irradiating light from the side of the bonding structure away from the display panel to cure the conductive adhesive layer.

[0019] In an implementation of the second aspect, the preparation method further includes: forming a flat layer on a side of the substrate away from the first terminal, wherein the flat layer fills a gap between two adjacent shading units; and curing the flat layer.

[0020] A third aspect of the present disclosure provides a bonding structure, which includes a substrate and a plurality of first terminals and a plurality of shading units located on the substrate, wherein a first bonding area is defined in the substrate, the first terminals and the shading units are located in the first bonding area and are respectively located on opposite sides of the substrate, and the orthographic projection of the gap between two adjacent first terminals on the substrate at least partially overlaps with the orthographic projection of the shading unit on the substrate.

[0021] In an implementation of the third aspect, the bonding structure further includes a planar layer, which is located on a side of the substrate away from the first terminal and fills a gap between two adjacent light shielding units. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1Shown is a schematic top view of a display device provided in an embodiment of the present disclosure.

[0023] Figure 2 Shown is a cross-sectional schematic diagram of a display device provided in an embodiment of the present disclosure.

[0024] Figure 3 Shown is a partial cross-sectional schematic diagram of a display device provided by an embodiment of the present disclosure.

[0025] Figure 4 Shown is a partial cross-sectional schematic diagram of a display device provided by another embodiment of the present disclosure.

[0026] Figure 5 Shown is a partial cross-sectional schematic diagram of a display device provided by another embodiment of the present disclosure.

[0027] Figure 6 Shown is a partial cross-sectional schematic diagram of a display device provided by another embodiment of the present disclosure.

[0028] Figure 7a to Figure 7f Shown is a schematic diagram of the process of the method for preparing the display device provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present disclosure to clearly and completely describe the technical solutions in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present disclosure belong to the scope of protection of the present disclosure.

[0030] In order to enable the display device to realize the display function, it is usually necessary to bond the display panel and the external circuit so as to control the display panel through the external circuit. In the related art, laser is widely used to solidify the colloid used in the bonding process so as to bond the components in the display device.

[0031] Exemplarily, when the display panel and the flexible circuit board are bonded by the laser bonding process, a glue-like connecting layer with anisotropic conductive properties can be arranged between the flexible circuit board and the display panel (for example, an anisotropic conductive film (ACF) that is conductive in the Z-axis direction and insulated in the XY plane can be used, and the Z-axis direction is the pressing direction in the bonding process), and the first terminal on the flexible circuit board and the second terminal on the display panel are aligned, and the stacked structure composed of the flexible circuit board, the connecting layer and the display panel is pressed as a whole, so that the corresponding first terminals and second terminals are electrically connected in the stacking direction (the same as the above-mentioned Z-axis direction), and then the glue-like connecting layer is cured by laser irradiation.

[0032] After long-term research, the inventor found that when curing the connection layer, a laser can be irradiated to the side surface of the flexible circuit board away from the display panel (i.e., the side of the flexible circuit board where the first terminal is not provided). At this time, the light irradiated to different areas will reach the connection layer through different optical paths. Specifically, the light irradiated to the area corresponding to the first terminal needs to pass through the substrate (usually transparent, with high transmittance) of the flexible circuit board and the first terminal (usually opaque metal) before reaching the connection layer. In this process, since the first terminal absorbs most of the energy, this part of the connection layer (i.e., the part of the connection layer located between the first terminal and the second terminal) can hardly absorb the energy brought by the light, and is mainly cured by the heat energy conducted from the first terminal, so the curing speed is slow and the curing rate is low. In contrast, the light irradiated to the area corresponding to the gap between two adjacent first terminals only needs to pass through the substrate of the flexible circuit board to reach the connection layer, so that this part of the connection layer (i.e., the part of the connection layer located between the substrate of the flexible circuit board and the substrate of the display panel) can absorb most of the energy provided by the light, so the curing speed is fast and the curing rate is high.

[0033] In the above example, the curing rates of different parts of the connection layer vary greatly, resulting in uneven curing rates within the connection layer and large differences in curing rates. The bonding strength is insufficient, which can easily cause the flexible circuit board to peel off, affecting the reliability of the product.

[0034] In view of this, the embodiments of the present disclosure provide a display device, a method for preparing the display device, and a bonding structure, which can avoid peeling caused by uneven curing rate inside a connection layer (such as a conductive adhesive layer), thereby improving product reliability.

[0035] The display device includes a bonding structure, a display panel and a conductive adhesive layer. The bonding structure includes a substrate and a plurality of first terminals and a plurality of shading units located on the substrate, wherein the bonding structure includes a first bonding area defined in the substrate, the plurality of first terminals and the plurality of shading units are located in the first bonding area and are respectively located on opposite sides of the substrate, and the orthographic projection of the gap between two adjacent first terminals on the substrate overlaps at least partially with the orthographic projection of the shading unit on the substrate. The display panel includes a second bonding area and a plurality of second terminals located in the second bonding area, wherein the first bonding area of ​​the bonding structure and the second bonding area of ​​the display panel are opposite, and the first terminals in the bonding structure and the second terminals in the display panel are opposite. The conductive adhesive layer is located between the bonding structure and the display panel, and the first terminals and the corresponding second terminals are connected through the conductive adhesive layer.

[0036] For example, the bonding structure and the display panel can be stacked, and the side of the bonding structure with the first binding area is close to the side of the display panel with the second bonding area. In the stacking direction, the orthographic projection of the first bonding area on the display panel at least partially overlaps with the second bonding area, that is, the orthographic projection of the second bonding area on the substrate of the bonding structure at least partially overlaps with the first bonding area. In this way, the first bonding area of ​​the bonding structure and the second bonding area of ​​the display panel are opposite to each other.

[0037] Furthermore, the first terminal and the second terminal may be respectively located in the region where the first bonding area and the second bonding area overlap in the stacking direction, whereby when the first bonding area of ​​the bonding structure and the second bonding area of ​​the display panel are arranged relatively, the first terminal and the second terminal also form a relative positional relationship.

[0038] Here, the first terminal can correspond to the second terminal one by one, that is, one first terminal corresponds to one second terminal. Specifically, a plurality of first terminals can be arranged at equal intervals, and correspondingly, a plurality of second terminals can be arranged at equal intervals at the same intervals as the first terminals, so that when the first bonding area of ​​the bonding structure and the second bonding area of ​​the display panel are relatively arranged, the corresponding first terminal and the second terminal can be easily aligned to facilitate connection. Of course, in other examples, the first terminals can also be arranged at non-equal intervals, and can be arranged in multiple rows and / or multiple columns, or staggered, arc-line, etc. In these examples, the second terminal can be arranged in the same or corresponding manner as the first terminal, so that when the first bonding area of ​​the bonding structure and the second bonding area of ​​the display panel are relatively arranged, it can be easily aligned with the corresponding first terminal.

[0039] For example, in some application scenarios, the bonding structure may be a flexible circuit board. It should be understood that in other application scenarios, the bonding structure may also be other components that need to be bonded to the display panel, which is not limited in the embodiments of the present disclosure.

[0040] In the bonding structure of the display device, a light shielding unit is provided at a position corresponding to the gap between two adjacent first terminals on a side of the substrate away from the first terminal, so that the light shielding unit is located upstream of the optical path of the gap between two adjacent first terminals during the laser bonding process, so that the light shielding unit can block the light originally irradiated directly to the gap. Thus, it is possible to prevent the portion of the conductive adhesive layer located in the area where the gap is located from being directly irradiated by light and curing too quickly, so that the portion and the portion of the conductive adhesive layer located in the area where the first terminals are located are cured in the form of heat conduction, thereby reducing the difference in curing rates of the two portions, and avoiding peeling caused by uneven curing rate of the conductive adhesive layer.

[0041] In the following, the display device, the method for manufacturing the display device, and the bonding structure according to at least one embodiment of the present disclosure are described in detail in conjunction with the accompanying drawings. In the accompanying drawings, a spatial rectangular coordinate system is established based on the plane where the display device is located to illustrate the positions of various structures in the display device. In the spatial rectangular coordinate system, the X-axis and the Y-axis are parallel to the plane where the display device is located, and the Z-axis is perpendicular to the plane where the display device is located.

[0042] Figure 1 Shown is a schematic top view of a display device provided in an embodiment of the present disclosure. Figure 2 FIG. 1 is a schematic cross-sectional view of a display device provided by an embodiment of the present disclosure, for example, Figure 1 Schematic diagram of the M1-N1 section. Figure 1 and Figure 2 As shown, the display device 10 may include a bonding structure 100 , a display panel 200 , and a conductive adhesive layer 300 , wherein the bonding structure 100 and the display panel 200 are bonded via the conductive adhesive layer 300 .

[0043] Figure 3 FIG. 1 is a partial cross-sectional schematic diagram of a display device provided by an embodiment of the present disclosure, for example, Figure 1 Schematic diagram of the M2-N2 section. Figure 3 As shown, the components of the display device 10 can be configured as described below.

[0044] Specifically, the bonding structure 100 includes a substrate 110 and a plurality of first terminals 120 and a plurality of light shielding units 130 located on the substrate 110. The bonding structure 100 includes a first bonding region 111 defined in the substrate 110, and the first terminals 120 and the light shielding units 130 are located in the first bonding region 111 and are respectively located on opposite sides of the substrate 110. The orthographic projection of the gap between two adjacent first terminals 120 on the substrate 110 at least partially overlaps with the orthographic projection of the light shielding unit 130 provided corresponding to the gap on the substrate 110.

[0045] By way of example, the bonding structure 100 may be a flexible circuit board.

[0046] It should be noted that from Figure 1 The location of the M1-N1 section can be seen. Figure 2 The cross section shown is located at the gap between two adjacent shading units 130, so the shading unit 130 should not be shown, but in order to make the position of the shading unit 130 on the substrate 110 easier to understand, Figure 2 The light shielding unit 130 is shown in the form of a dotted edge.

[0047] The display panel 200 includes a second bonding area 201 and a plurality of second terminals 210 in the second bonding area 201. The first bonding area 111 of the bonding structure 100 and the second bonding area 201 of the display panel 200 are disposed opposite to each other, and the first terminals 120 in the bonding structure 100 and the second terminals 210 in the display panel 200 are disposed opposite to each other.

[0048] For example, in Figure 1 and Figure 2 In the illustrated scenario, the display panel 200 may further include a display area 202 and a non-display area 203 to implement a display function. Figure 2 In the example shown, the display panel 200 may include a substrate 220, a display function layer 230 located in the display area 202, and a cover plate 240 that are sequentially stacked. The second bonding area 201 may be an area on the substrate 220, that is, the second terminal 210 may be disposed on the substrate 220. It should be understood that the structure of the display panel 200 provided here is only an example and does not constitute a limitation to the embodiments of the present disclosure.

[0049] The conductive adhesive layer 300 is located between the bonding structure 100 and the display panel 200 , and the first terminal 120 and the corresponding second terminal 210 are connected through the conductive adhesive layer 300 .

[0050] Exemplarily, the conductive adhesive layer 300 can realize electrical connection between the first terminals 120 and the second terminals 210 that are opposite in the vertical direction, and can prevent short circuits between different first terminals 120 or the first terminals 120 from being connected to non-corresponding second terminals 210 .

[0051] According to the display device provided by the embodiment of the present disclosure, in the bonding structure, a light shielding unit is provided at a position corresponding to the gap between two adjacent first terminals on the side of the substrate away from the first terminal, so that the light shielding unit is located upstream of the optical path of the gap between two adjacent first terminals during the laser bonding process, so that the light shielding unit can block the light originally irradiated directly to the gap. In this way, it is possible to avoid the portion of the conductive adhesive layer located in the area where the gap is located being directly irradiated by light and curing too fast, so that the portion and the portion of the conductive adhesive layer located in the area where the first terminal is located are cured in the form of heat conduction, thereby reducing the difference in curing rate of the two portions, and avoiding the peeling phenomenon caused by the uneven curing rate of the conductive adhesive layer.

[0052] In some embodiments of the present disclosure, the orthographic projection of the gap between two adjacent first terminals 120 on the substrate 110 coincides with the orthographic projection of the light shielding unit 130 provided corresponding to the gap on the substrate 110. In other words, the orthographic projection of the light shielding unit 130 on the substrate 110 can completely cover the orthographic projection of the gap between the two adjacent first terminals 120 corresponding to the gap on the substrate 110. As a result, all the light that should be directly irradiated to the gap area will be irradiated to the light shielding unit, so that the light shielding unit can more effectively reduce the laser energy borne by the conductive adhesive layer in the area, and prevent the conductive adhesive layer in the area from curing too fast.

[0053] In some embodiments of the present disclosure, the material of the light shielding unit 130 may be the same as that of the first terminal 120. In this way, the manufacturing cost and process complexity can be reduced, and the relevant parameters of the required light shielding unit can be more easily calculated according to the relevant parameters of the first terminal (such as thickness, area, etc.), thereby improving the manufacturing efficiency and process accuracy. For example, when it is necessary to make the transmittance of the light shielding unit 130 the same or substantially the same as that of the first terminal 120, since the two are made of the same material, the two can have the same or substantially the same transmittance by setting the same thickness for the two.

[0054] In some embodiments of the present disclosure, along the thickness direction of the bonding structure 100, the longitudinal cross-sectional shape of the light shielding unit 130 may be the same as the longitudinal cross-sectional shape of the first terminal 120. Thus, it is convenient to set the light transmittance of the light shielding unit to be consistent with the light transmittance of the first terminal, thereby better controlling the curing speed of different parts of the conductive adhesive layer to be consistent, and further improving the uniformity of the curing rate of the conductive adhesive layer.

[0055] For example, along the thickness direction of the bonding structure 100, the longitudinal cross-section of the light shielding unit 130 and the first terminal 120 can be a trapezoid, and the lower base of the trapezoid is located between the upper base of the trapezoid and the substrate 110, that is, the trapezoid is a regular trapezoid or an inverted trapezoid. The trapezoidal first terminal 120 is conducive to filling the gap between adjacent first terminals 120 when the conductive adhesive layer 300 is squeezed, avoiding the occurrence of gaps at the edges of the first terminals 120 and easy peeling; in addition, the trapezoidal light shielding unit 130 is also conducive to forming other film layers thereon, such as the flat layer 140 described below.

[0056] It can be understood that the thickness of the conductive adhesive layer 300 in the area where the first terminals 120 are located is relatively thin, while the thickness of the conductive adhesive layer 300 in the area where the gap between two adjacent first terminals 120 is located is relatively thick. Therefore, the same curing rate can be achieved in the two parts by controlling the curing speed of the thicker part to be greater than the curing speed of the thinner part.

[0057] In order to make the curing speed of the thicker part of the conductive adhesive layer 300 faster than that of the thinner part, in some embodiments, the transmittance of the light shielding unit 130 can be set to be greater than or equal to the transmittance of the first terminal 120. Preferably, the transmittance of the light shielding unit 130 can be set to be greater than the transmittance of the first terminal 120. As a result, the laser energy passing through the light shielding unit 130 will be greater than the laser energy passing through the first terminal 120, that is, the conductive adhesive layer 300 corresponding to the area where the light shielding unit 130 is located (i.e., the thicker part) will absorb more laser energy than the conductive adhesive layer 300 corresponding to the area where the first terminal 120 is located (i.e., the thinner part). In this way, in addition to the energy absorbed by heat conduction, the thicker part of the conductive adhesive layer 300 will also absorb the energy brought by the light, so that the curing speed will be higher than the curing speed of the thinner part. In this way, the influence of the thickness difference can be eliminated, and the curing rate of the thicker part and the curing rate of the thinner part can be made consistent.

[0058] In some exemplary embodiments, the first terminal 120 may be a non-transparent conductive layer, and the shading unit 130 may be a semi-transparent and semi-reflective layer. During laser bonding, the laser cannot penetrate the first terminal 120 which is set as a non-transparent conductive layer, so the conductive adhesive layer 300 (i.e., the thinner portion) corresponding to the area where the first terminal 120 is located receives energy mainly in the form of heat conduction when being cured. Since the shading unit 130 has the characteristics of semi-transmission and semi-reflection, part of the light can pass through the shading unit 130 and reach the conductive adhesive layer 300 (i.e., the thicker portion) corresponding to the area where the shading unit 130 is located, so that the thicker portion of the conductive adhesive layer 300 can absorb the energy provided by this part of the light in addition to the energy received in the form of heat conduction. As a result, the curing speed of the thicker portion of the conductive adhesive layer can be higher than that of the thinner portion, so that the final curing rates of the two portions tend to be consistent.

[0059] Figure 4 FIG. 2 is a partial cross-sectional schematic diagram of a display device provided by another embodiment of the present disclosure. Figure 4 As shown, in some embodiments of the present disclosure, the bonding structure 100 may further include a planar layer 140. The planar layer 140 is located on a side of the substrate 110 away from the first terminal 120 and fills a gap between two adjacent light shielding units 130.

[0060] It can be understood that when the bonding structure 100 is pressed onto the display panel 200, the shading unit 130 is located on the side of the bonding structure 100 that is subjected to force. According to the display device provided by the embodiment of the present disclosure, in the bonding structure, by filling the gaps between adjacent shading units with a flat layer, it is beneficial to make the bonding structure subjected to force uniformly, and it can prevent the position of the shading unit (the gap corresponding to the first terminal in the pressing direction) from being subjected to insufficient force due to excessive pressure at the position of the shading unit, so that the conductive adhesive layer between the first terminal and the second terminal can be fully squeezed, and the electrical connection function can be better realized.

[0061] In some embodiments of the present disclosure, the orthographic projection of the flat layer 140 on the substrate 110 coincides with the orthographic projection of the gap between two adjacent light shielding units 130 on the substrate 110. In other words, the flat layer 140 can be disposed in the gap between two adjacent light shielding units 130 and not higher than the surface of the light shielding unit 130 away from the substrate 110. In this way, the thickness of the bonding structure can be prevented from increasing, which is conducive to the thinning of the bonding area.

[0062] Alternatively, if Figure 4 As shown, the distance between the surface of the flat layer 140 facing away from the substrate 110 and the substrate 110 is equal to the distance between the surface of the light shielding unit 130 facing away from the substrate 110 and the substrate 110. In other words, the flat layer 140 covers the side surface of the light shielding unit 130, and the thickness of the flat layer 140 is consistent with the thickness of the light shielding unit 130. In this way, the surface of the bonding structure facing away from the display panel can be kept basically horizontal, further ensuring that the bonding structure is evenly stressed during lamination.

[0063] Figure 5 FIG. 2 is a partial cross-sectional schematic diagram of a display device provided by another embodiment of the present disclosure. Figure 5 As shown, the flat layer 140 covers the light shielding unit 130 and the gap between two adjacent light shielding units 130. That is, the flat layer 140 not only covers the side surface of the light shielding unit 130, but also can cover the top surface of the light shielding unit 130, and the thickness of the flat layer 140 is greater than the thickness of the light shielding unit 130. Therefore, the requirements for processing accuracy can be reduced, the processing steps can be reduced, and the preparation cost can be reduced.

[0064] For example, the light shielding unit 130 can be formed by etching. In this case, the cross-sectional shape of the light shielding unit 130 can be a trapezoid. When laying the flat layer 140, a liquid material (such as liquid polyimide) can be injected into the gap between two adjacent light shielding units 130 along the inclined side surface of the light shielding unit 130 (i.e., the surface where the side of the trapezoid is located) until the liquid material overflows the upper surface (i.e., the top surface) of the light shielding unit 130. Afterwards, the liquid material is solidified to obtain the flat layer 140 without further flattening processing.

[0065] Figure 6 FIG. 2 is a partial cross-sectional schematic diagram of a display device provided by another embodiment of the present disclosure. Figure 6 As shown, the thickness d1 of the portion of the planar layer 140 located in the gap between two adjacent light shielding units 130 is equal to the thickness d2 of the portion of the conductive adhesive layer 300 located in the gap between two adjacent first terminals 120 .

[0066] It can be understood that before reaching the portion of the conductive adhesive layer 300 located between the first terminal 120 and the corresponding second terminal 210 (i.e., the thinner portion), the energy (which may include thermal energy and / or laser energy) needs to pass through the flat layer 140, the substrate 110, and the first terminal 120; before reaching the portion of the conductive adhesive layer 300 close to the substrate 220, the energy needs to pass through the shading unit 130, the substrate 110, and the thicker portion of the conductive adhesive layer 300.

[0067] Therefore, in an embodiment in which the shading unit 130 and the first terminal 120 have the same or similar transmittance (for example, the material of the shading unit 130 is the same as the material of the first terminal 120), by setting the thickness d1 of the portion of the flat layer 140 located in the gap between two adjacent shading units 130 to be the same as the thickness d2 of the thicker portion of the conductive adhesive layer 300, it is beneficial to allow the laser (and / or thermal energy) irradiated to different areas to pass through the same or similar medium, thereby making the energy absorbed by the thinner portion of the conductive adhesive layer 300 and the portion of the conductive adhesive layer 300 close to the substrate 220 (that is, the bottom of the conductive adhesive layer 300) tend to be the same, so that the overall curing rate of the conductive adhesive layer 300 is more uniform.

[0068] In addition, in an embodiment where the transmittance of the shading unit 130 is greater than the transmittance of the first terminal 120 (for example, the shading unit 130 is a semi-transmissive and semi-reflective layer, and the first terminal 120 is a non-transparent conductive layer), by setting the thickness d1 of the portion of the flat layer 140 located in the gap between two adjacent shading units 130 to be the same as the thickness d2 of the thicker portion of the conductive adhesive layer 300, the thickness (i.e., d1) of the flat layer 140 in the gap between two adjacent shading units 130 (i.e., corresponding to the first terminal 120 in the Z-axis direction) is thicker and has a lower transmittance; while the thickness of the flat layer 140 above the shading unit 130 is thinner (less than d1) and has a higher transmittance. As a result, the difference between the light transmittance of the area corresponding to the light shielding unit 130 and the light transmittance of the area corresponding to the first terminal 120 is further increased, ensuring that the laser energy passing through the light shielding unit 130 is greater than the laser energy passing through the first terminal 120, so that the conductive adhesive layer 300 corresponding to the area where the light shielding unit 130 is located (i.e., the thicker part) absorbs more laser energy than the conductive adhesive layer 300 corresponding to the area where the first terminal 120 is located (i.e., the thinner part). In this way, the influence of the thickness difference between different parts of the conductive adhesive layer 300 on the uniformity of the curing rate can be effectively eliminated, and the curing rate of the thicker part of the conductive adhesive layer 300 is consistent with the curing rate of the thinner part.

[0069] An embodiment of the present disclosure also provides a method for manufacturing a display device. Figure 7a to Figure 7d Shown is a schematic diagram of the process of the method for preparing the display device provided in an embodiment of the present disclosure.

[0070] Specifically, the preparation method may include:

[0071] 1) Provide a bonding structure 100 (such as Figure 7a ), wherein the bonding structure 100 includes a substrate 110 and a plurality of first terminals 120 and a plurality of light shielding units 130 located on the substrate 110, the bonding structure includes a first bonding region defined in the substrate 110, the first terminals 120 and the light shielding units 130 are located in the first bonding region and are respectively located on opposite sides of the substrate 110, and the orthographic projection of the gap between two adjacent first terminals 120 on the substrate 110 at least partially overlaps with the orthographic projection of the light shielding units 130 on the substrate 110;

[0072] 2) Provide a display panel 200 (such as Figure 7b As shown), wherein the display panel 200 includes a second bonding area and a plurality of second terminals 210 located in the second bonding area;

[0073] 3) Attaching a conductive adhesive layer 300 (eg, Figure 7cIn the example shown, the conductive adhesive layer 300 is attached to the display panel 200, and the bonding structure 100 is attached to the display panel 200 so that the first bonding area and the second bonding area are opposite to each other, and the first terminal 120 and the second terminal 210 are opposite to each other, wherein the conductive adhesive layer 300 is located between the bonding structure 100 and the display panel 200, and the first terminal 120 and the corresponding second terminal 210 are connected through the conductive adhesive layer 300;

[0074] 4) Press-fit bonding structure and display panel (such as Figure 7d As shown), and irradiating light from the side of the bonding structure facing away from the display panel to cure the conductive adhesive layer.

[0075] It should be understood that the order of the above step 1) and step 2) can be swapped, or step 1) and step 2) can be performed simultaneously. Under the premise that it is feasible and does not cause contradictions, the order of each step of the preparation method provided in the embodiment of the present disclosure can be adjusted according to actual needs, and the present disclosure does not limit this.

[0076] According to the method for preparing a display device provided by an embodiment of the present disclosure, a light shielding unit is provided at a position corresponding to the gap between two adjacent first terminals on a side of the substrate away from the first terminal, so that the light shielding unit is located upstream of the optical path of the gap between the first terminals during the laser bonding process, so that the light shielding unit can block the light originally irradiated directly to the gap. In this way, it is possible to prevent the portion of the conductive adhesive layer located in the area where the gap is located from being directly irradiated by light and curing too quickly, so that the portion and the portion of the conductive adhesive layer located in the area where the first terminal is located are both cured in the form of heat conduction, thereby reducing the difference in curing rates of the two portions, and avoiding peeling caused by uneven curing rate of the conductive adhesive layer.

[0077] Optionally, in some embodiments, before laminating the bonding structure and the display panel, the preparation method may further include: forming a flat layer 140 (eg, Figure 7e As shown in FIG. 1 , the flat layer 140 fills the gap between two adjacent light shielding units 130; and the flat layer 140 is cured. On this basis, the cross-sectional structure of the display device obtained by laminating the bonding structure 100 and the display panel 200 can be, for example, as shown in FIG. Figure 7f shown.

[0078] According to the method for preparing a display device provided by an embodiment of the present disclosure, by filling a flat layer in the gap between two adjacent shading units, it is beneficial to make the bonding structure evenly stressed, and can prevent excessive pressure at the location of the shading unit from resulting in insufficient force at the location of the first terminal, so that the conductive adhesive layer between the first terminal and the second terminal can be fully squeezed to better achieve the electrical connection function.

[0079] It should be noted that Figure 7e to Figure 7f The form of the flat layer 140 shown is only an example of the present disclosure. In the preparation method provided in the embodiment of the present disclosure, the flat layer 140 can also be formed into a form as provided in any display device embodiment of the present disclosure, and has corresponding or the same technical effects. To avoid repetition, it will not be described here.

[0080] An embodiment of the present disclosure also provides a bonding structure, including a substrate and a plurality of first terminals and a plurality of shading units located on the substrate, wherein a first bonding area is defined in the substrate, the first terminals and the shading units are located in the first bonding area and are respectively located on opposite sides of the substrate, and the orthographic projection of the gap between two adjacent first terminals on the substrate at least partially overlaps with the orthographic projection of the shading unit on the substrate.

[0081] Optionally, the bonding structure may further include a planar layer, which is located on a side of the substrate away from the first terminal and fills a gap between two adjacent light shielding units.

[0082] For example, the bonding structure provided in this embodiment can be as follows Figure 1 to Figure 6 The specific structure, deformation and corresponding technical effects of the bonding structure 100 in the display device provided by any of the embodiments shown can be referred to the aforementioned embodiments and will not be described in detail here.

[0083] It should be noted that in the embodiments of the present disclosure, the specific structures of other components in the display device are not limited and can be designed as needed.

[0084] For example, the display device in the embodiments of the present disclosure may be any product or component with a display function, such as a television, a digital camera, a mobile phone, a watch, a tablet computer, a laptop computer, a navigator, or the like.

[0085] It should be noted that, for the sake of clarity, not all structures of the above display device are described. To achieve the necessary functions of the display panel, those skilled in the art may set other structures according to specific application scenarios, and the embodiments of the present disclosure are not limited thereto.

[0086] The above description is only a preferred embodiment of the present disclosure and is not intended to limit the present disclosure. Any modifications, equivalent substitutions, etc. made within the spirit and principles of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A display device, characterized in that: include: A bonding structure, comprising a substrate, and a plurality of first terminals and a plurality of light shielding units located on the substrate, wherein the bonding structure comprises a first bonding region defined in the substrate, the first terminals and the light shielding units are located in the first bonding region and are respectively located on opposite sides of the substrate, and an orthographic projection of a gap between two adjacent first terminals on the substrate at least partially overlaps with an orthographic projection of the light shielding units on the substrate; The display panel includes a second bonding area and a plurality of second terminals located in the second bonding area, wherein the first bonding area and the second bonding area are opposite to each other, and the first terminals and the second terminals are opposite to each other; and A conductive adhesive layer is located between the bonding structure and the display panel, wherein the conductive adhesive layer fills the gap between adjacent first terminals, the first terminal and the corresponding second terminal are connected through the conductive adhesive layer, and the conductive adhesive layer is configured to be laser cured from the side of the bonding structure away from the display panel, so that the conductive adhesive layer electrically connects the first terminal and the second terminal opposite to each other in a vertical direction, and avoids short circuits between different first terminals or the first terminal being connected to a non-corresponding second terminal.

2. The display device according to claim 1, characterized in that An orthographic projection of a gap between two adjacent first terminals on the substrate coincides with an orthographic projection of the shading unit on the substrate.

3. The display device according to claim 2, characterized in that: The bonding structure includes a flexible circuit board.

4. The display device according to any one of claims 1 to 3, characterized in that: The material of the light shielding unit is the same as that of the first terminal.

5. The display device according to claim 4, characterized in that: Along the thickness direction of the bonding structure, a longitudinal cross-sectional shape of the light shielding unit is the same as a longitudinal cross-sectional shape of the first terminal.

6. The display device according to claim 5, characterized in that: Along the thickness direction of the bonding structure, the longitudinal cross-section shapes of the shading unit and the first terminal are both trapezoidal, and the lower base of the trapezoid is located between the upper base of the trapezoid and the substrate.

7. The display device according to any one of claims 1 to 3, characterized in that: The light transmittance of the shading unit is greater than or equal to the light transmittance of the first terminal.

8. The display device according to claim 7, characterized in that: The first terminal is a non-transparent conductive layer, and the shading unit is a semi-transparent and semi-reflective layer.

9. The display device according to any one of claims 1 to 3, characterized in that: The bonding structure also includes: The planar layer is located on a side of the substrate away from the first terminal and fills a gap between two adjacent light shielding units.

10. The display device according to claim 9, characterized in that: The orthographic projection of the planar layer on the substrate coincides with the orthographic projection of the gap between two adjacent light-shielding units on the substrate.

11. The display device according to claim 10, characterized in that: The distance between the surface of the planar layer facing away from the substrate and the substrate is equal to the distance between the surface of the light shielding unit facing away from the substrate and the substrate.

12. The display device according to claim 9, characterized in that: The planar layer covers the light shielding unit and a gap between two adjacent light shielding units.

13. The display device according to claim 12, characterized in that: The thickness of a portion of the planar layer located in a gap between two adjacent light shielding units is equal to the thickness of a portion of the conductive adhesive layer located in a gap between two adjacent first terminals.

14. A method for preparing a display device, characterized in that: include: A bonding structure is provided, wherein the bonding structure comprises a substrate and a plurality of first terminals and a plurality of light shielding units located on the substrate, the bonding structure comprises a first bonding region defined in the substrate, the first terminals and the light shielding units are located in the first bonding region and are respectively located on opposite sides of the substrate, and an orthographic projection of a gap between two adjacent first terminals on the substrate at least partially overlaps with an orthographic projection of the light shielding units on the substrate; Providing a display panel, wherein the display panel comprises a second bonding area and a plurality of second terminals located in the second bonding area; Attaching a conductive adhesive layer to the display panel or the bonding structure, and attaching the bonding structure to the display panel so that the first bonding area and the second bonding area are opposite to each other, and the first terminal and the second terminal are opposite to each other, wherein the conductive adhesive layer is located between the bonding structure and the display panel, and the first terminal and the corresponding second terminal are connected through the conductive adhesive layer; and The bonding structure and the display panel are pressed together, and light is irradiated from the side of the bonding structure facing away from the display panel to cure the conductive adhesive layer, so that the conductive adhesive layer electrically connects the first terminal and the second terminal opposite to each other in the vertical direction, and avoids short circuits between different first terminals or the first terminal being connected to non-corresponding second terminals.

15. A bonding structure, characterized in that: Used to be combined with a display panel through a conductive adhesive layer, wherein the bonding structure includes a substrate and a plurality of first terminals and a plurality of light shielding units located on the substrate, wherein: A first bonding region is defined in the substrate, the first terminal and the shading unit are located in the first bonding region and are respectively located on opposite sides of the substrate, and an orthographic projection of a gap between two adjacent first terminals on the substrate at least partially overlaps with an orthographic projection of the shading unit on the substrate, and The display panel includes a plurality of second terminals, the first terminals and the second terminals are opposite to each other, the conductive adhesive layer fills the gaps between adjacent first terminals, the first terminals and the corresponding second terminals are connected through the conductive adhesive layer, and the conductive adhesive layer is configured to be laser cured from a side of the bonding structure away from the display panel, so that the conductive adhesive layer electrically connects the first terminals and the second terminals opposite to each other in a vertical direction, and avoids short circuits between different first terminals or the first terminals being connected to non-corresponding second terminals.

16. The bonding structure according to claim 15, characterized in that: Also includes: The planar layer is located on a side of the substrate away from the first terminal and fills a gap between two adjacent light shielding units.

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