Heat pump compressor oil cooling system

Abstract

This invention provides a heat pump compressor oil supply cooling device, including a high-level oil tank, a thermoelectric cooler, a heat pipe assembly, and a first connecting pipe. The high-level oil tank stores lubricating oil, and the first connecting pipe stores a water-based working medium for heating. The thermoelectric cooler, when energized, forms a cold end and a hot end with a temperature difference. The cold end of the thermoelectric cooler is located on the side wall of the high-level oil tank to cool the lubricating oil. The heat pipe assembly is located at the hot end of the thermoelectric cooler and absorbs heat from the hot end of the thermoelectric cooler, transferring it to the water-based working medium in the first connecting pipe. This invention can cool the oil supply temperature of the heat pump compressor while simultaneously recovering waste heat.

Description

Technical Field

[0001] This invention relates to the field of compressor technology, and in particular to an oil supply and cooling device for a heat pump compressor. Background Technology

[0002] A heat pump is a highly efficient and energy-saving device that fully utilizes low-grade heat energy. Similar to refrigeration, a heat pump transfers heat from a low-temperature heat source to a high-temperature heat source by performing work. It aims to obtain heat from a high-temperature heat source, consuming only a small amount of net reverse cycle work to achieve a large heating capacity. This effectively utilizes low-grade heat energy that is difficult to apply otherwise, achieving energy savings. The heat pump compressor is a key component of the heat pump unit, undertaking the important functions of compressing and transporting the refrigerant; therefore, heat pump compressors have become a current research hotspot. However, the high-temperature operating conditions of the heat pump unit itself pose challenges to the efficient and stable operation of the heat pump compressor. Summary of the Invention

[0003] This invention provides an oil supply cooling device for a heat pump compressor to solve the problem that heat pump compressors cannot operate efficiently and stably in the prior art.

[0004] To address the aforementioned issues, this invention discloses a heat pump compressor oil supply and cooling device, comprising a high-level oil tank, a semiconductor refrigeration chip, a heat pipe assembly, and a first connecting pipe. The high-level oil tank stores lubricating oil, and the first connecting pipe stores a water-based working fluid. The first connecting pipe is used for heat supply via the water-based working fluid.

[0005] When energized, the semiconductor refrigeration chip forms a cold end and a hot end with a temperature difference. The cold end of the semiconductor refrigeration chip is located on the side wall of the high-level oil tank to cool the temperature of the lubricating oil in the high-level oil tank. The heat pipe assembly is located at the hot end of the semiconductor refrigeration chip and is used to absorb heat from the hot end of the semiconductor refrigeration chip and transfer it to the water medium in the first connecting pipe.

[0006] In one exemplary embodiment, the heat pipe assembly includes a plurality of first heat pipes, each heat pipe including a heat pipe wall, a sintered inner wall, and a phase change coolant;

[0007] The first heat pipe is located at one end of the hot end of the semiconductor refrigeration chip, which is the hot end, and the end of the first heat pipe not located at the hot end of the semiconductor refrigeration chip is the cold end. The phase change coolant absorbs heat from the hot end of the semiconductor refrigeration chip at the hot end of the first heat pipe, vaporizes and condenses at the cold end of the first heat pipe, releasing heat. Then, it returns to the hot end of the first heat pipe through the sintered inner wall under capillary action to achieve heat transfer cycle.

[0008] In one exemplary embodiment, the elevated oil tank includes a recess for arranging the semiconductor cooling chip.

[0009] In one exemplary embodiment, the thermoelectric cooler and the heat pipe assembly are fixed to the side of the elevated oil tank by screws.

[0010] In one exemplary embodiment, the heat pipe assembly further includes a heat-conducting block that is attached to the hot end of the thermoelectric cooler, the heat-conducting block being used to uniformly transfer heat absorbed from the hot end of the thermoelectric cooler to the hot end of the first heat pipe.

[0011] In one exemplary embodiment, the material of the heat-conducting block includes copper.

[0012] In an exemplary embodiment, the hot end of the first heat pipe is inserted and fixed in the heat-conducting block by welding, and the cold end of the first heat pipe is inserted and fixed in the first connecting pipe by welding.

[0013] In one exemplary embodiment, the system further includes a passive cooling module, which includes a high-level oil tank cover, a sealing plate, a water inlet pipe, a water outlet pipe, a sealing gasket, a ball valve, a second connecting pipe, and a second heat pipe.

[0014] One end of the second heat pipe is immersed in the lubricating oil in the high-level oil tank for heat transfer, and the other end of the second heat pipe is inserted and fixed in the high-level oil tank cover plate by welding. The high-level oil tank cover plate is fixed to the top of the high-level oil tank by screws. The sealing plate is fixed to the top of the high-level oil tank cover plate by screws. The sealing gasket is placed between the high-level oil tank cover plate and the high-level oil tank, and between the high-level oil tank cover plate and the sealing plate.

[0015] The water inlet pipe and the water outlet pipe are fixed to different sides of the high-level oil tank cover by welding. The ball valve is arranged at the end of the water inlet pipe to realize the on / off control of the passive cooling module. The end of the water outlet pipe is connected to the second connecting pipe by welding, and the end of the second connecting pipe is connected to the first connecting pipe by welding.

[0016] In an exemplary embodiment, when the ball valve controls the opening of the passive cooling module, the working fluid flows into the high-level oil tank cover plate through the water inlet pipe. The second heat pipe transfers the heat absorbed from the high-level oil tank to the working fluid of the high-level oil tank cover plate. The working fluid of the high-level oil tank cover plate mixes with the working fluid of the first connecting pipe after passing through the second connecting pipe.

[0017] In one exemplary embodiment, the number of the water inlet pipe and the number of the water outlet pipe are one or more.

[0018] In one exemplary embodiment, the second heat pipes are staggered at the bottom of the high-level oil tank cover.

[0019] The embodiments of the present invention have the following advantages:

[0020] The heat pump compressor oil cooling device of this invention includes a high-level oil tank, a semiconductor refrigeration chip, a heat pipe assembly, and a first connecting pipe. The high-level oil tank stores lubricating oil, and the first connecting pipe stores a water-based working medium. The first connecting pipe is used for heating via the water-based working medium. The semiconductor refrigeration chip, after being energized, forms a cold end and a hot end with a temperature difference. The cold end of the semiconductor refrigeration chip is located on the side wall of the high-level oil tank to cool the lubricating oil inside. The heat pipe assembly is located at the hot end of the semiconductor refrigeration chip and is used to absorb heat from the hot end of the semiconductor refrigeration chip and transfer it to the water-based working medium in the first connecting pipe. This heat pump compressor oil cooling device of this invention cools the lubricating oil temperature in the high-level oil tank of the heat pump compressor through the semiconductor refrigeration chip, thereby solving the problem of excessively high bearing oil supply temperature in the heat pump compressor, thus achieving efficient and stable operation of the heat pump compressor. Simultaneously, by heating the water-based working medium in the first connecting pipe through the semiconductor refrigeration chip, the water supply temperature of the condenser of the heat pump compressor is increased, instead of dissipating the heat into the environment unused, thus achieving waste heat recovery. Attached Figure Description

[0021] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0022] Figure 1 This is a schematic diagram of the structure of a heat pump compressor oil supply and cooling device provided in an embodiment of the present invention;

[0023] Figure 2 This is a cross-sectional view of the internal structure of the first heat pipe of a heat pipe assembly provided in an embodiment of the present invention;

[0024] Figure 3 This is an exploded view of the semiconductor refrigeration structure of a heat pump compressor oil supply cooling device provided in an embodiment of the present invention;

[0025] Figure 4 This is a structural diagram of a passive cooling module of a heat pump compressor oil supply cooling device provided in an embodiment of the present invention;

[0026] Figure 5 This is an exploded view of the passive cooling module of a heat pump compressor oil supply cooling device provided in an embodiment of the present invention;

[0027] Figure 6 This is a heat pipe distribution diagram of a passive cooling module of a heat pump compressor oil supply cooling device provided in an embodiment of the present invention;

[0028] Explanation of reference numerals in the attached drawings: High-level oil tank 100; Semiconductor cooling chip 200; Heat pipe assembly 300; First connecting pipe 400; Passive cooling module 500; First heat pipe 310; Heat pipe wall 311; Sintered inner wall 312; Phase change coolant 313; Groove 110; Screw 330; Heat-conducting block 320; Passive cooling module 500; High-level oil tank cover 510; Sealing plate 520; Water inlet pipe 530; Water outlet pipe 540; Sealing gasket 550; Ball valve 560; Second connecting pipe 570; Second heat pipe 580. Detailed Implementation

[0029] Embodiments of the present invention will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0030] The terms "first" and "second" in the specification and claims of this invention may explicitly or implicitly include one or more of those features. In the description of this invention, unless otherwise stated, "a plurality of" means two or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0031] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0032] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0033] In practical applications, the high-temperature operating conditions of heat pump units pose a challenge to the stable operation of heat pump compressors. The high-temperature refrigerant inside the heat pump compressor spontaneously conducts heat and conducts heat convection to other components, indirectly increasing the temperature of the lubricating oil flowing to the bearings. At higher temperatures, the viscosity of the lubricating oil decreases, the rigidity of the oil film between the bearing and the rotor decreases, and the heat carried away from the bearing by the lubricating oil during lubrication also changes. This leads to excessively high bearing and shaft temperatures, bearing-shaft contact wear, and shaft instability, among other adverse phenomena. These adverse phenomena also limit the upper limit of the heat pump compressor's process capacity, thus hindering its development in industrial sectors with higher heating demands.

[0034] Currently, to address the issue of excessively high bearing oil temperature in heat pump compressors, most existing heat pump units employ oil coolers for cooling. Specifically, a high-pressure liquid refrigerant line is drawn from the bottom of the heat pump unit's condenser and enters the oil cooler chamber. Through the gaps and surrounding area of ​​the oil cooler, the lubricating oil continuously flows within, absorbing the cooling energy of the refrigerant (liquid refrigerant) to lower the oil temperature. However, when the heat pump compressor operates at high temperatures, the liquid refrigerant temperature is too high, resulting in less than ideal cooling for the lubricating oil. Furthermore, a bypass pipe needs to be drawn from the main refrigerant line specifically for cooling the lubricating oil, reducing the main refrigerant flow rate and negatively impacting energy efficiency.

[0035] To address the aforementioned problems, the main inventive point of this invention is as follows: For the problem of shaft instability caused by excessively high bearing oil supply temperature in heat pump compressors, a heat pump compressor oil supply cooling device combining semiconductor refrigeration and heat pipe cooling is provided. This device includes a semiconductor refrigeration structure comprising a semiconductor refrigeration chip. Based on the Peltier effect, a temperature difference appears on both sides of the semiconductor refrigeration chip after energization. The cold end of the semiconductor refrigeration chip cools the lubricating oil in the high-level oil tank of the heat pump compressor. Simultaneously, the heat from the hot end of the semiconductor refrigeration chip is transferred to the water supply pipeline through a heat pipe, pre-raising the water supply temperature before it enters the condenser. This device offers advantages such as high energy efficiency, waste heat utilization, simplified components, simple layout, and low cost, comprehensively improving the operating performance and reliability of the heat pump compressor.

[0036] Specifically, the heat pump compressor oil cooling device of this invention innovatively utilizes semiconductor refrigeration to reduce the temperature of the heat pump compressor oil tank, and uses heat pipes to fully transfer the heat generated by the hot end of the semiconductor refrigeration chip to the water medium in the water supply pipeline, thereby increasing the water supply temperature, instead of dissipating the heat into the environment unused, thus achieving waste heat recovery. In particular, this invention also designs a passive cooling module with independent heat pipe cooling, achieving the effect of reducing oil temperature and increasing water supply temperature without external energy input, providing a more efficient and reliable solution for heat pump compressor oil cooling and energy efficiency improvement.

[0037] Reference Figure 1 The diagram shows a schematic of the structure of a heat pump compressor oil supply and cooling device according to an embodiment of the present invention. Specifically, the heat pump compressor oil supply and cooling device includes a high-level oil tank 100, a semiconductor cooling chip 200, a heat pipe assembly 300, and a first connecting pipe 400. The high-level oil tank 100 stores lubricating oil, and the first connecting pipe 400 stores water working fluid. The first connecting pipe 400 is used to supply heat through the water working fluid.

[0038] In specific implementation, the high-level oil tank 100 is an emergency oil supply device for the heat pump compressor bearings. It is typically located on the upper side of the heat pump compressor and is used to continue supplying oil to the bearings when the heat pump compressor stops operating due to power failure, preventing bearing wear. During normal operation of the heat pump compressor, the high-level oil tank 100 serves as an important component of the external oil tank, continuously supplying oil to the heat pump compressor. In this embodiment of the invention, the specific structure of the high-level oil tank 100 is not limited, and the heat pump compressor oil supply and cooling device of this embodiment can be applied to high-level oil tanks in various types of heat pump compressors.

[0039] In practical implementation, the Peltier effect refers to the phenomenon that when current flows through a circuit composed of different conductors, in addition to generating irreversible Joule heating, heat absorption and release phenomena occur at the junctions of different conductors depending on the direction of the current. In this embodiment of the invention, the semiconductor cooling chip 200 is based on the Peltier effect. After being energized, a temperature difference appears on both sides of the semiconductor cooling chip 200, which makes the semiconductor cooling chip 200 divisible into a hot end and a cold end.

[0040] Specifically, after being energized, the semiconductor refrigeration chip 200 can form a cold end and a hot end with a temperature difference. The cold end of the semiconductor refrigeration chip 200 is set on the side wall of the high-level oil tank 100 to cool the temperature of the lubricating oil in the high-level oil tank 100. The heat pipe assembly 300 is set on the hot end of the semiconductor refrigeration chip 200. The heat pipe assembly 300 is used to absorb heat from the hot end of the semiconductor refrigeration chip 200 and transfer it to the water working medium in the first connecting pipe 400. Thus, the water working medium in the first connecting pipe 400 can pre-raise the temperature of the water working medium before it enters the condenser of the heat pump compressor, thereby realizing the recovery of waste heat from the heat pump compressor.

[0041] In this embodiment of the invention, after power is applied, the temperature of the cold end of the semiconductor cooling chip 200 is lower than the temperature of the lubricating oil in the high-level oil tank 100. The heat of the high-level oil tank 100 is conducted to the hot end of the semiconductor cooling chip 200 through the wall, thereby reducing the temperature of the lubricating oil in the high-level oil tank 100.

[0042] The aforementioned heat pump compressor oil cooling device includes a high-level oil tank 100, a semiconductor refrigeration chip 200, a heat pipe assembly 300, and a first connecting pipe 400. The high-level oil tank 100 stores lubricating oil, and the first connecting pipe 400 stores water working fluid. The first connecting pipe 400 is used to supply heat through the water working fluid. The semiconductor refrigeration chip 200 forms a cold end and a hot end with a temperature difference after being energized. The cold end of the semiconductor refrigeration chip 200 is located on the side wall of the high-level oil tank 100 to cool the temperature of the lubricating oil in the high-level oil tank 100. The heat pipe assembly 300 is located at the hot end of the semiconductor refrigeration chip 200 and is used to absorb heat from the hot end of the semiconductor refrigeration chip 200 and transfer it to the water working fluid in the first connecting pipe 400. The semiconductor refrigeration chip 200 of the heat pump compressor oil supply cooling device cools the lubricating oil temperature of the high-level oil tank 100 of the heat pump compressor, thereby solving the problem of excessively high bearing oil supply temperature of the heat pump compressor and realizing the efficient and stable operation of the heat pump compressor. At the same time, the semiconductor refrigeration chip 200 heats the temperature of the water working medium in the first connecting pipe 400, thereby increasing the water supply temperature of the condenser of the heat pump compressor, instead of dissipating the heat into the environment without utilization, thus realizing waste heat recovery.

[0043] In one exemplary embodiment, reference is made to Figure 2 This is a cross-sectional view of the internal structure of the first heat pipe of a heat pipe assembly 300 provided in an embodiment of the present invention, and, with reference to Figure 3 This is an exploded view of the semiconductor refrigeration structure of a heat pump compressor oil supply cooling device provided in an embodiment of the present invention. Specifically, the heat pipe assembly 300 includes a plurality of first heat pipes 310. The number of first heat pipes 310 can be one or more. Each first heat pipe 310 includes a heat pipe wall 311, a sintered inner wall 312, and a phase change coolant 313.

[0044] In this embodiment of the invention, the first heat pipe 310 is disposed at one end of the hot end of the semiconductor cooling chip 200 as the hot end, and the first heat pipe 310 is not disposed at the other end of the hot end of the semiconductor cooling chip 200 as the cold end.

[0045] In a specific implementation, since the hot end of the thermoelectric cooler 200 in this embodiment of the invention concentrates a large amount of heat from the high-level oil tank 100, it is necessary to dissipate heat from the hot end of the thermoelectric cooler 200 in a timely manner to ensure that the thermoelectric cooler 200 can work reliably and continuously. Specifically, the hot end of the first heat pipe 310 absorbs the heat from the hot end of the thermoelectric cooler 200, and the phase change coolant 313 vaporizes the heat absorbed by the hot end of the thermoelectric cooler 200 at the hot end of the first heat pipe 310 and releases heat after condensation at the cold end of the first heat pipe 310. Then, driven by capillary action, the heat is returned to the hot end of the first heat pipe 310 through the sintered inner wall 312, thereby realizing the heat transfer cycle.

[0046] In one exemplary embodiment, reference is made to Figure 3 This is an exploded view of the semiconductor refrigeration structure of a heat pump compressor oil cooling device provided in an embodiment of the present invention. Specifically, the high-level oil tank 100 may include a groove 110 for arranging the semiconductor refrigeration chip 200. The groove 110 is used to reduce the thermal resistance of the oil tank wall thickness between the lubricating oil in the high-level oil tank 100 and the semiconductor refrigeration chip 200, so that the semiconductor refrigeration chip 200 can more fully absorb the heat of the lubricating oil in the high-level oil tank 100.

[0047] In one exemplary embodiment, reference is made to Figure 3 The semiconductor cooling chip 200 and the heat pipe assembly 300 are fixed to the side of the high-level oil tank 100 by screws 330.

[0048] In one exemplary embodiment, reference is made to Figure 3 In addition to the first heat pipe 310, the heat pipe assembly 300 may also include a heat-conducting block 320. The heat-conducting block 320 absorbs heat from the hot end of the thermoelectric cooler 200 and evenly transfers the heat to the first heat pipe 310. Specifically, the heat-conducting block 320 is attached to the hot end of the thermoelectric cooler 200, and is used to evenly transfer the heat absorbed from the hot end of the thermoelectric cooler 200 to the hot end of the first heat pipe 310. Optionally, the heat-conducting block 320 can preferably be made of copper or other materials with high thermal conductivity, so that the heat-conducting block 320 can evenly transfer heat to the first heat pipe 310 and improve heat transfer efficiency.

[0049] In one exemplary embodiment, the hot end of the first heat pipe 310 can be inserted and fixed in the heat-conducting block 320 by welding, and the cold end of the first heat pipe 310 can be inserted and fixed in the first connecting pipe 400 by welding. Of course, the first heat pipe 310 can also be fixed in the heat-conducting block 320 or the first connecting pipe 400 by other means besides welding, and the embodiments of the present invention do not impose any limitations on this.

[0050] In one exemplary embodiment, reference is made to Figure 4 and Figure 5 , Figure 4 This is a structural diagram of a passive cooling module of a heat pump compressor oil supply cooling device provided in an embodiment of the present invention. Figure 5 This is an exploded view of the passive cooling module of a heat pump compressor oil supply cooling device according to an embodiment of the present invention. Specifically, the heat pump compressor oil supply cooling device of the present invention may further include a passive cooling module 500. The passive cooling module 500 may include a high-level oil tank cover plate 510, a sealing plate 520, a water inlet pipe 530, a water outlet pipe 540, a sealing gasket 550, a ball valve 560, a second connecting pipe 570, and a second heat pipe 580.

[0051] One end of the second heat pipe 580 is immersed in the lubricating oil in the high-level oil tank 100 for heat transfer, and the other end of the second heat pipe 580 is welded and fixed in the high-level oil tank cover plate 510. The high-level oil tank cover plate 510 is fixed to the top of the high-level oil tank 100 with screws. The sealing plate 520 is fixed to the top of the high-level oil tank cover plate 510 with screws. The sealing gasket 550 is placed between the high-level oil tank cover plate 510 and the high-level oil tank 100, and between the high-level oil tank cover plate 510 and the sealing plate 520 to achieve a sealing function.

[0052] The water inlet pipe 530 and the water outlet pipe 540 are fixed to different sides of the high-level oil tank cover plate 510 by welding. A ball valve 560 is arranged at the end of the water inlet pipe 530 to control the opening and closing of the passive cooling module 500. The end of the water outlet pipe 540 is connected to the second connecting pipe 570 by welding, and the end of the second connecting pipe 570 is connected to the first connecting pipe 400 by welding. Specifically, when the ball valve 560 is open, the passive cooling module 500 can be controlled to open; conversely, when the ball valve 560 is closed, the passive cooling module 500 can be controlled to close. Optionally, the ball valve 560 is arranged at the end of the water outlet pipe 540 to control the opening and closing of the passive cooling module 500; this embodiment of the invention does not impose any limitation on this arrangement.

[0053] As an optional embodiment, the number of water inlet pipe 530 and water outlet pipe 540 can be one or more. For example, when the water inlet pipe 530 and water outlet pipe 540 are pipes with a larger diameter, the number can be one; when the water inlet pipe 530 and water outlet pipe 540 are pipes with a smaller diameter, the number can be three. When there are three or more water inlet pipes 530 and water outlet pipes 540, the flow rate of the heated water can be increased, and the flow characteristics of the water after entering the high-level oil tank cover plate 510 can be improved, thereby increasing convective heat transfer.

[0054] As an optional embodiment, refer to Figure 6 This is a heat pipe distribution diagram of a passive cooling module of a heat pump compressor oil supply cooling device provided in an embodiment of the present invention. Specifically, there can be multiple second heat pipes 580, which are staggered and interwoven and welded at certain intervals to cover the bottom of the high-level oil tank cover plate 510, which can enhance turbulent flow and increase convective heat transfer.

[0055] In an exemplary embodiment, when the ball valve 560 controls the opening of the passive cooling module 500, water working fluid flows into the high-level oil tank cover plate 510 through the water inlet pipe 530. The second heat pipe 580 transfers the heat absorbed from the high-level oil tank 100 to the water working fluid in the high-level oil tank cover plate 510. The water working fluid in the high-level oil tank cover plate 510 mixes with the water working fluid in the first connecting pipe 400 after passing through the second connecting pipe 570. Specifically, the second heat pipe 580 of the passive cooling module 500 directly exchanges heat with the lubricating oil in the high-level oil tank 100 and transfers the heat to the water working fluid in the high-level oil tank cover plate 510. After passing through the second connecting pipe 570, it mixes with the water working fluid in the first connecting pipe 400, which can improve the water supply heating efficiency and heating water flow rate of the condenser. The passive cooling module 500 of this invention realizes heat transfer without an external power supply device. On the one hand, it further cools the bearing oil supply temperature of the heat pump compressor, and on the other hand, it improves the condenser water supply heating efficiency and heating water flow of the heat pump compressor, which is beneficial to improving the energy efficiency of the heat pump compressor.

[0056] In summary, the embodiments of the present invention design a heat pump compressor oil cooling device that combines semiconductor refrigeration and heat pipe heat dissipation structure. The cold end of the semiconductor refrigeration structure cools the lubricating oil temperature in the high-level oil tank of the heat pump compressor, and the heat from the hot end of the semiconductor refrigeration structure is transferred to the water pipeline through the heat pipe to increase the water supply temperature, thereby achieving full utilization of waste heat.

[0057] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0058] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A heat pump compressor oil supply cooling device, characterized in that, It includes a high-level oil tank (100), a semiconductor cooling chip (200), a heat pipe assembly (300), and a first connecting pipe (400). The high-level oil tank (100) stores lubricating oil, and the first connecting pipe (400) stores water working medium. The first connecting pipe (400) is used to supply heat through the water working medium. The semiconductor refrigeration chip (200) forms a cold end and a hot end with a temperature difference after being energized. The cold end of the semiconductor refrigeration chip (200) is disposed on the side wall of the high-level oil tank (100) to cool the temperature of the lubricating oil in the high-level oil tank (100). The heat pipe assembly (300) is disposed at the hot end of the semiconductor refrigeration chip (200). The heat pipe assembly (300) is used to absorb heat from the hot end of the semiconductor refrigeration chip (200) and transfer it to the water medium in the first connecting pipe (400). The heat pipe assembly (300) includes a plurality of first heat pipes (310), each of which includes a heat pipe wall (311), a sintered inner wall (312), and a phase change coolant (313). The first heat pipe (310) is located at one end of the hot end of the semiconductor refrigeration chip (200) as the hot end, and the end of the first heat pipe (310) not located at the hot end of the semiconductor refrigeration chip (200) as the cold end; the phase change coolant (313) absorbs the heat from the hot end of the semiconductor refrigeration chip (200) at the hot end of the first heat pipe (310), vaporizes to the cold end of the first heat pipe (310), condenses and releases heat, and then returns to the hot end of the first heat pipe (310) through the sintered inner wall (312) under capillary action to realize the heat transfer cycle.

2. The heat pump compressor oil supply cooling device according to claim 1, characterized in that, The high-level oil tank (100) includes a recess (110) for arranging the semiconductor cooling chip (200).

3. The heat pump compressor oil supply cooling device according to claim 1, characterized in that, The semiconductor cooling chip (200) and the heat pipe assembly (300) are fixed to the side of the high-level oil tank (100) by screws (330).

4. The heat pump compressor oil supply cooling device according to claim 1, characterized in that, The heat pipe assembly (300) further includes a heat-conducting block (320) which is attached to the hot end of the semiconductor cooling chip (200). The heat-conducting block (320) is used to uniformly transfer the heat absorbed from the hot end of the semiconductor cooling chip (200) to the hot end of the first heat pipe (310).

5. The heat pump compressor oil supply cooling device according to claim 4, characterized in that, The heat-conducting block (320) is made of copper.

6. The heat pump compressor oil supply cooling device according to claim 4, characterized in that, The hot end of the first heat pipe (310) is inserted and fixed in the heat-conducting block (320) by welding, and the cold end of the first heat pipe (310) is inserted and fixed in the first connecting pipe (400) by welding.

7. The heat pump compressor oil supply cooling device according to claim 1, characterized in that, It also includes a passive cooling module (500), which includes a high-level oil tank cover (510), a sealing plate (520), a water inlet pipe (530), a water outlet pipe (540), a sealing gasket (550), a ball valve (560), a second connecting pipe (570), and a second heat pipe (580). One end of the second heat pipe (580) is immersed in the lubricating oil in the high-level oil tank (100) for heat transfer. The other end of the second heat pipe (580) is inserted and fixed in the high-level oil tank cover plate (510) by welding. The high-level oil tank cover plate (510) is fixed to the top of the high-level oil tank (100) by screws. The sealing plate (520) is fixed to the top of the high-level oil tank cover plate (510) by screws. The sealing gasket (550) is placed between the high-level oil tank cover plate (510) and the high-level oil tank (100) and between the high-level oil tank cover plate (510) and the sealing plate (520). The water inlet pipe (530) and the water outlet pipe (540) are fixed to different sides of the high-level oil tank cover plate (510) by welding. The ball valve (560) is arranged at the end of the water inlet pipe (530) to realize the on / off control of the passive cooling module (500). The end of the water outlet pipe (540) is connected to the second connecting pipe (570) by welding. The end of the second connecting pipe (570) is connected to the first connecting pipe (400) by welding.

8. The heat pump compressor oil supply cooling device according to claim 7, characterized in that, When the ball valve (560) controls the opening of the passive cooling module (500), the water working medium flows into the high-level oil tank cover plate (510) through the water inlet pipe (530). The second heat pipe (580) transfers the heat absorbed from the high-level oil tank (100) to the water working medium of the high-level oil tank cover plate (510). The water working medium of the high-level oil tank cover plate (510) mixes with the water working medium of the first connecting pipe (400) after passing through the second connecting pipe (570).

9. The heat pump compressor oil supply cooling device according to claim 7, characterized in that, The number of water inlet pipes (530) and water outlet pipes (540) is one or more.

10. The heat pump compressor oil supply cooling device according to claim 7, characterized in that, The second heat pipe (580) is staggered at the bottom of the high-level oil tank cover plate (510).

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