Semiconductor ceramic injection molding equipment and use method thereof

Abstract

The present invention relates to a semiconductor ceramic injection molding device and a method for using the same. An injection box corresponding to a mold transfer frame is fixedly installed in the injection molding box, a plurality of injection nozzles in an array structure and matched with the mold grooves are installed at the bottom of the corresponding injection box, a degreasing heater is fixedly installed in the degreasing box, a heat gathering cover is fixedly installed below the degreasing heater, a degreasing heating coil connected to the degreasing heater is fixedly installed at the bottom of the heat gathering cover, a comprehensive mixing device is arranged in a mixing injection transfer control cabinet on the other side of the transfer operation partition and on an integrated injection molding table, and the comprehensive mixing device is connected to the top of the corresponding injection box through a discharge pipe with a discharge solenoid valve; the device is conducive to the formation and output of molten slurry, and the overall temperature control is accurate, and the temperature can be controlled and adjusted according to the material characteristics, thereby improving the production efficiency and facilitating the rapid and efficient formation of slurry.

Description

Technical Field

[0001] The invention relates to the field of semiconductor ceramic production, and in particular to semiconductor ceramic injection molding equipment and a use method thereof. Background Art

[0002] Semiconductor ceramics refer to ceramics with semiconductor properties and a certain electrical conductivity. The electrical conductivity of semiconductor ceramics changes significantly due to changes in external temperature, light, electric field, atmosphere, etc., so the physical quantity changes of the external environment can be converted into electrical signals and made into sensitive components for various purposes. The production process of semiconductor ceramic sensitive materials is simple, low cost, small size and wide range of uses. Semiconductor is a material with conductivity between conductors and insulators at room temperature. Semiconductors are widely used in fields such as radio, television and temperature measurement. They are materials whose conductivity is controlled from insulators to conductors. The importance of semiconductors is huge both from the perspective of technology and economic development. Most of today's electronic products, such as computers, mobile phones or digital tape recorders, are closely connected with semiconductors. Alumina ceramics are a material with aluminum oxide as the main body, which is used for thick film integrated circuits. Alumina ceramics have good conductivity, mechanical strength and high temperature resistance. It should be noted that ultrasonic cleaning is used. Alumina ceramics are usually made into various ceramic parts, which are usually used in semiconductor devices.

[0003] The current traditional preparation process for alumina ceramics is the dry pressing process, which involves pressing dry powder into shape before processing. However, it is costly and requires high equipment precision, and cannot meet the needs of mass production. The injection molding process can overcome this defect and can prepare alumina ceramic special-shaped parts with complex shapes and high dimensional requirements. my country's alumina ceramic injection molding technology started late, and there are the following defects in the production and preparation process: First, during the injection mixing process, the materials need to be mixed with temperature control. Traditional equipment cannot accurately control the temperature and mixing operations, resulting in excessively high or low temperatures, and the materials cannot be fully fused. The mixing operation and temperature control and stirring operations are carried out at the same time. After the materials are mixed, they need to be fused for a long time, resulting in reduced work and operation efficiency. Secondly, in traditional injection molding projects, the slurry needs to be pressurized and injected and pressure-maintained. When the traditional equipment is running, the corresponding number between the injection head and the mold is effective. Only a small number of injection molding operations can be produced at a time, and the injection speed and injection pressure are not accurately controlled, which can easily lead to fluid defects during slurry injection, resulting in external or internal defects of the embryo, affecting the overall quality of the finished product. Thirdly, in the degreasing and firing process after traditional injection molding, the temperature control is relatively imprecise. At the same time, the equipment needs to be transferred from molding to degreasing and firing, and the degree of equipment integration is low, which increases the product transfer time. The later thermal degreasing process requires a large amount of energy consumption. At the same time, it is difficult to achieve the preset temperature control requirements, resulting in an increase in energy consumption and a decrease in the quality of the finished product.

[0004] To sum up, the present invention provides a semiconductor ceramic injection molding equipment and its use method which has a simple structure, convenient operation, energy saving and environmental protection, simple process, low energy consumption, high working and operating efficiency, improved equipment integration, and integrates mixing, injection molding, degreasing and sintering into one, and is suitable for large-scale production as a whole. The method is simple and easy to operate, and has broad market prospects. Summary of the invention

[0005] In view of the deficiencies in the prior art, the present invention provides a semiconductor ceramic injection molding equipment and a method of using the equipment, which has a simple structure, is easy to operate, is energy-saving and environmentally friendly, has a simple process, low energy consumption, high working and operating efficiency, improves the degree of equipment integration, integrates mixing, injection molding, degreasing and sintering into one, is suitable for large-scale production as a whole, and is simple and easy to operate, so as to overcome the defects in the prior art.

[0006] The technical solution of the present invention is implemented as follows: a semiconductor ceramic injection molding equipment comprises an integrated injection molding table, a mixing injection transfer control cabinet arranged below the integrated injection molding table, a transfer operation partition fixedly installed in the middle of the mixing injection transfer control cabinet in the longitudinal direction, a transfer track fixedly installed on the bottom surface of the mixing injection transfer control cabinet on one side of the transfer operation partition, a track trolley is provided on the transfer track, a hydraulic push rod is fixedly installed on the track trolley, a lifting support is fixedly installed on the top output end of the hydraulic push rod, a mold transfer frame is movably installed on the lifting support, a plurality of mold sleeves with mold grooves on the top arranged in an array structure are clamped on the top of the mold transfer frame, and a lifting support connected to the lifting support is provided on the integrated injection molding table above the transfer track. The injection corresponding holes and the degreasing corresponding holes are matched in shape, and an injection molding box is installed on the top of the injection corresponding holes, and a degreasing box is installed on the top of the degreasing corresponding holes. A corresponding injection box matching the mold transfer frame is fixedly installed in the injection molding box, and a number of injection nozzles in an array structure and matching the mold groove are installed at the bottom of the corresponding injection box. A degreasing heater is fixedly installed in the degreasing box, and a heat gathering hood is fixedly installed below the degreasing heater. A degreasing heating coil connected to the degreasing heater is fixedly installed on the bottom of the heat gathering hood. A comprehensive mixing device is arranged in the mixing injection transfer control cabinet on the other side of the transfer operation partition and on the integrated injection molding table. The comprehensive mixing device is connected to the top of the corresponding injection box through a discharge pipe with a discharge solenoid valve.

[0007] The comprehensive mixing device comprises a single-cone molten material extrusion sleeve fixedly mounted on an integrated injection molding table, a central extrusion barrel is sleeved in the single-cone molten material extrusion sleeve, a heating chamber is arranged between the central extrusion barrel and the inner wall of the single-cone molten material extrusion sleeve, a molten material heating coil is wound in the heating chamber, a single-cone discharge extrusion shaft is arranged in the central extrusion barrel, the single-cone discharge extrusion shaft is fixedly connected to the output end of the reduction motor mounted on the outer side of the single-cone molten material extrusion sleeve, a mixed material feed port is arranged at the top of one end of the single-cone molten material extrusion sleeve, a molten material discharge pipe is connected to the bottom of the other end of the single-cone molten material extrusion sleeve, and the bottom of the molten material discharge pipe is connected to the nozzle mounted on the integrated injection molding table. The pressure-maintaining solenoid valve below the molding table is connected, and the pressure-maintaining solenoid valve is connected to the storage bin inside the molten material pressurized storage bin through a pipeline, an independent heating chamber is arranged between the molten material pressurized storage bin and the storage bin, and a molten material heating coil is arranged in the independent heating chamber, and an integrated heater connected to the molten material heating coil and the melt heating coil respectively is fixedly installed at the bottom of the integrated injection molding table, an air compressor is installed at the bottom of the integrated heater, which is connected to the top of the storage bin through a gas pressurized pipeline equipped with a gas control solenoid valve, a pressure relief pipeline with a pressure relief valve is installed at the top center of the storage bin, and the bottom of the storage bin is connected to the feed end of the discharge pipe.

[0008] The integrated injection molding table is a rectangular plate-shaped structure, the mixing injection transfer control cabinet is a square cabinet structure, there are two transfer tracks, and the two transfer tracks are arranged in parallel on the bottom surface of the mixing injection transfer control cabinet on one side of the transfer operation partition. There are at least two hydraulic push rods, and all hydraulic push rods are synchronous hydraulic push rods. A hydraulic workstation connected to the hydraulic push rod is arranged on the top of the track trolley. The lifting support is a rectangular plate-shaped structure, and a guide plate is fixedly installed on the top of the hydraulic push rod, and the lifting support is movably installed above the guide plate.

[0009] The mold transfer frame is a rectangular plate structure with a plurality of mold sleeve fixing grooves matching the bottom of the mold sleeve on the top. The bottom of the mold sleeve is movably inserted into the mold sleeve fixing groove. The injection corresponding holes and the degreasing corresponding holes are both square through hole structures. The shapes and sizes of the injection corresponding holes and the degreasing corresponding holes are respectively equal. The injection molding box and the degreasing box are both square box structures with openings at the bottom. The shapes and sizes of the injection molding box and the degreasing box are respectively equal. Injection observation windows and degreasing observation windows are respectively provided on the injection molding box and the degreasing box.

[0010] The corresponding injection box is a trapezoidal box structure with a small top and a large bottom. An injection cavity is arranged in the corresponding injection box. The top of the injection cavity is connected with the discharge end of the discharge pipe, and the bottom of the injection cavity is connected with each injection nozzle. The axis of each injection nozzle is in the same straight line as the axis of the mold groove arranged in the mold sleeve corresponding to the upper part in the initial state of the rail trolley. The length of the corresponding injection box is not greater than the length of the inner cavity of the injection molding box, the width of the corresponding injection box is not greater than the width of the inner cavity of the injection molding box, the length from the bottom surface of the lifting support to the top surface of the mold sleeve is not greater than one half of the height of the inner cavity of the injection molding box, and the plane where the bottom of the injection nozzle is located is located above the longitudinal middle part of the inner cavity of the injection molding box.

[0011] The heat gathering hood is a plate-like structure with an opening downward and a trapezoidal cross-section. The two ends of the heat gathering hood are fixedly connected to the inner walls of the degreasing box in the length direction, and the two sides of the heat gathering hood are fixedly connected to the inner walls of the degreasing box in the width direction. The plane where the bottom of the heat gathering hood is located is located above the longitudinal middle of the inner cavity of the degreasing box, the plane where the bottom of the heat gathering hood is located is on the same plane as the plane where the bottom of the injection nozzle is located, the bottom of the degreasing heater is fixedly installed at the center position of the top surface of the heat gathering hood, the bottom surface of the degreasing heating coil is located above the plane where the bottom of the heat gathering hood is located, and the outside of the degreasing box is provided with a dehumidification port connected to the cavity below the degreasing heating coil.

[0012] The single-cone melt extrusion sleeve is a transversely arranged conical barrel-shaped structure, the mixed material feed port is arranged above the large-diameter side of the single-cone melt extrusion sleeve, the molten material discharge pipe is arranged below the small-diameter side of the single-cone melt extrusion sleeve, and the outer side of the single-cone melt extrusion sleeve is provided with an insulation box, and the outer wall of the single-cone melt extrusion sleeve is fixedly installed with an extrusion sleeve fixing frame fixedly connected to the top wall of the insulation box and the top surface of the integrated injection molding table, and the outer side of the middle part of the reduction motor is arranged outside the insulation box.

[0013] The central extrusion barrel is a transversely arranged conical barrel structure, the outer wall of the central extrusion barrel is arranged parallel to the single cone melt extrusion sleeve, and the outer wall of the single cone discharge extrusion shaft is fixedly installed with an extrusion discharge spiral matching the inner wall of the central extrusion barrel.

[0014] A fixing frame is arranged on the outside of the integrated heater, a branch line controller is arranged between the integrated heater and the air compressor, an electric control cabinet is arranged on one side of the branch line controller, a heat dissipation fan connected to the outside of the mixing injection transfer control cabinet is arranged above the electric control cabinet, the rail trolley, degreasing heater, control end of the hydraulic push rod, discharging solenoid valve, reduction motor, integrated heater, branch line controller, air compressor, pressure maintaining solenoid valve, gas control solenoid valve and pressure relief valve are respectively connected to the electric control cabinet through wires, and a cabinet door is arranged on the mixing injection transfer control cabinet below the single cone melt extrusion sleeve, and a touch screen controller connected to the electric control cabinet is installed on the cabinet door.

[0015] A method for using the semiconductor ceramic injection molding device as described above, wherein the method is:

[0016] First, a variety of dry materials are mixed evenly, and then fed at a uniform speed through the mixed material feed port, the mixed material enters the inner cavity of the central extrusion barrel, the reduction motor is turned on to drive the single cone discharge extrusion shaft to rotate, and the extrusion discharge spiral transfers the mixed material toward the molten material discharge pipe. During the transfer process, extrusion is formed between the outer wall of the extrusion discharge spiral and the inner wall of the central extrusion barrel, and the bulk material is crushed. At the same time, under the operation of the integrated heater, the molten material heating coil heats the heating chamber. After the heating chamber is heated, it heats the mixed material in the inner cavity of the central extrusion barrel. The mixed material melts into slurry at a preset temperature, and the pressure-maintaining solenoid valve is turned on. The slurry enters the storage bin through the molten material discharge pipe under the action of continuous extrusion and transfer;

[0017] When the filling in the storage bin reaches the preset volume, the molten material heating coil is turned on through the integrated heater to heat the independent heating chamber. After reaching the preset temperature, the independent heating chamber heats the slurry in the storage bin. In the initial state, the rail trolley is close to the transfer operation partition, and the lifting support corresponds to the corresponding injection hole. The hydraulic push rod is turned on to push the lifting support upward, and the lifting support drives the mold transfer frame to move upward. The mold transfer frame drives the mold sleeve to move upward, and each mold slot is moved up to the corresponding position at the bottom of each injection nozzle. Then the gas control solenoid valve is turned on and the pressure holding solenoid valve is closed. The air compressor presses high-pressure air into the top of the storage bin through the gas pressurization pipeline. When the injection operation needs to be implemented, the discharge solenoid valve is opened, and the slurry enters the injection cavity in the corresponding injection box through the bottom of the storage bin and the discharge pipe, and is discharged from the injection nozzle at the bottom of the injection cavity into the mold slot, and the injection molding operation is implemented in the injection molding box;

[0018] After completing the injection molding operation, the hydraulic push rod drives the lifting support to return to the initial position. At this time, the top surface of the mold sleeve is located under the integrated injection molding table. The rail trolley is turned on to drive the mold transfer frame loaded with the mold sleeve to be transferred to the bottom of the corresponding degreasing hole. The output operation of the hydraulic push rod is repeated to transport the mold transfer frame loaded with the mold sleeve to the degreasing box. The degreasing heater runs in advance and drives the degreasing heating coil to heat to the preset temperature. When the molding mold in the mold slot moves up to the preset position, the heat generated by the degreasing heating coil is used to heat and degrease the outer wall of the mold sleeve and the top of the mold slot under the action of the heat gathering hood, and the material is discharged after the preset time.

[0019] The present invention has the following positive effects:

[0020] Firstly, the present invention implements a controllable temperature melting process on the mixed material through a heating chamber. Different from the traditional stirring melting process, the present invention adopts a single-cone screw extrusion method to simultaneously perform melting process operations, which can crush large pieces of auxiliary melting materials and use the high temperature in the heating chamber to quickly melt the materials, which is beneficial to the formation and output of molten slurry. In addition, the overall temperature control is precise, and the temperature can be controlled and adjusted according to the material characteristics, thereby improving production efficiency and facilitating the rapid and efficient formation of slurry.

[0021] Secondly, the present invention utilizes a pressurized storage bin for molten materials to receive the extruded slurry, and the received materials are stored in an independent storage bin, and an independent heating chamber is used to perform temperature insulation and heating and insulation operations on the storage bin. When injection is required, controllable heating and insulation operations are provided to ensure that the fluidity of the injected fluid can meet the preset requirements, thereby ensuring that the injection temperature is accurately controllable. At the same time, during the injection operation, the pressure-maintaining solenoid valve, the gas control solenoid valve, the discharge solenoid valve and the air compressor are coordinated to ensure the injection time and pressure control as well as the injection speed, thereby achieving the optimal injection state. After coordination with the temperature-controlled slurry, the fluidity of the slurry during injection is ensured to form a stable and high-quality molding operation in the mold groove.

[0022] In addition, the present invention utilizes the coordinated use of a rail trolley with a hydraulic push rod and a lifting support, combined with corresponding injection holes and degreasing holes, to implement transfer operations on materials after slurry injection molding between the injection molding box and the degreasing box. The transfer operation is completed under the integrated injection molding table, shortening the transfer distance and reducing the transfer time. It can effectively utilize the residual heat after molding to implement efficient heating and degreasing operations. In order to improve the stability of the present invention, the present invention is provided with a dehumidification port to cooperate with the degreasing operation to ensure that the material can be smoothly degreased in the degreasing box. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the top structure of the present invention.

[0024] Figure 2 It is a schematic diagram of the main structure of the present invention.

[0025] Figure 3 This is one of the internal structure diagrams of the present invention in use state.

[0026] Figure 4 This is the second schematic diagram of the internal structure of the present invention in use state.

[0027] Figure 5 This is the third schematic diagram of the internal structure of the present invention in use state.

[0028] Figure 6 It is a schematic diagram of the structure of the corresponding injection box of the present invention when viewed from above.

[0029] Figure 7 It is a schematic diagram of the top view of the mold transfer frame of the present invention.

[0030] Figure 8 It is a schematic diagram of the structure of the heat gathering cover of the present invention when viewed from above. DETAILED DESCRIPTION

[0031] like Figure 1 , 2As shown in Figures 3, 4, 5, 6, 7 and 8, a semiconductor ceramic injection molding device comprises an integrated injection molding table 1, a mixing injection transfer control cabinet 12 arranged below the integrated injection molding table 1, a transfer operation partition 14 longitudinally fixedly installed in the middle of the mixing injection transfer control cabinet 12, a transfer track 15 fixedly installed on the bottom surface of the mixing injection transfer control cabinet 12 on one side of the transfer operation partition 14, and the transfer track 15 is provided with a track trolley 16, a hydraulic push rod 17 is fixedly installed on the track trolley 16, a lifting support 18 is fixedly installed on the top output end of the hydraulic push rod 17, a mold transfer frame 19 is movably installed on the lifting support 18, a plurality of mold sleeves 20 with mold grooves 29 on the top of the mold transfer frame 19 are clamped in an array structure, and a mold sleeve 20 with a shape of the lifting support 18 is opened on the integrated injection molding table 1 above the transfer track 15. The injection corresponding hole 28 and the degreasing corresponding hole 27 are matched, the injection corresponding hole 28 is set with an injection molding box 5 on the top, and the degreasing corresponding hole 27 is set with a degreasing box 6 on the top. The injection molding box 5 is fixedly installed with a corresponding injection box 21 that matches the mold transfer frame 19, and the bottom of the corresponding injection box 21 is installed with a plurality of injection nozzles 22 in an array structure and matched with the mold groove 29. A degreasing heater 23 is fixedly installed in the degreasing box 6, and a heat gathering cover 24 is fixedly installed below the degreasing heater 23. A degreasing heating coil 25 connected to the degreasing heater 23 is fixedly installed at the bottom of the heat gathering cover 24. A comprehensive mixing device is arranged in the mixing injection transfer control cabinet 12 on the other side of the transfer operation partition 14 and on the integrated injection molding table 1. The comprehensive mixing device is connected to the top of the corresponding injection box 21 through a discharge pipe 7 with a discharge solenoid valve 47.The comprehensive mixing device comprises a single cone melt extrusion sleeve 31 fixedly mounted on the integrated injection molding table 1, a central extrusion barrel 32 is sleeved in the single cone melt extrusion sleeve 31, a heating chamber 33 is arranged between the central extrusion barrel 32 and the inner wall of the single cone melt extrusion sleeve 31, a melt heating coil 34 is wound in the heating chamber 33, a single cone discharge extrusion shaft is arranged in the central extrusion barrel 32, the single cone discharge extrusion shaft is fixedly connected to the output end of the reduction motor 4 mounted on the outer side of the single cone melt extrusion sleeve 31, a mixed material feed port 3 is arranged at the top of one end of the single cone melt extrusion sleeve 31, a molten material discharge pipe 35 is connected to the bottom of the other end of the single cone melt extrusion sleeve 31, and the bottom of the molten material discharge pipe 35 is connected to a pressure-maintaining solenoid valve installed below the integrated injection molding table 1. 48 is connected, the pressure-maintaining solenoid valve 48 is connected with the storage bin 44 inside the molten material pressurized storage bin 40 through a pipeline, an independent heating chamber 45 is arranged between the molten material pressurized storage bin 40 and the storage bin 44, and a molten material heating coil 46 is arranged in the independent heating chamber 45, and an integrated heater 42 connected to the molten material heating coil 46 and the melt heating coil 34 is fixedly installed at the bottom of the integrated injection molding table 1, and an air compressor 38 is installed at the lower part of the integrated heater 42. The air compressor 38 is connected to the top of the storage bin 44 through a gas pressurization pipeline 39 equipped with a gas control solenoid valve 43, and a pressure relief pipeline 49 with a pressure relief valve 50 is installed at the top center of the storage bin 44, and the bottom of the storage bin 44 is connected to the feeding end of the discharge pipe 7.

[0032] The transfer operation partition 14 separates the bottom of the integrated injection molding table into two spaces. A cabinet door 13 is provided on the mixed injection transfer control cabinet 12 below the single cone melt extrusion sleeve 31 on one side. A touch screen controller 11 connected to the electric control cabinet 36 is installed on the cabinet door 13. The other side is the setting space for two transfer rails 15. The rail trolley 16 performs controllable step-by-step stable operation on the two transfer rails 15, and can transfer the mold transfer frame that can be moved, taken out and loaded. Through the flexible plug-in of the mold sleeve and the flexible loading of the mold transfer frame, the corresponding lifting and translation operations are performed on the lifting support to complete the transfer between injection molding and heating degreasing, which greatly saves working time and improves work efficiency.

[0033] The present invention also designs a comprehensive mixing device, which changes the traditional mixing mode and discharging mode, and adopts a combination of a single-cone melt extrusion sleeve with a highly integrated correlation and a molten material pressurized storage bin. An external integrated heater 42 is used to drive the molten material heating coil 46 and the molten material heating coil 34, and the heating chamber 33 is used to melt the mixed material in the extrusion and discharging process, and the independent heating chamber 45 is used to heat and keep the melted material warm. The pressurized feeding operation of the air compressor 38 is cooperated to make the temperature, speed and pressure of the injection operation controllable. When the present invention is in operation, the effective temperature of the melt heating coil 34 is controlled at about 45 degrees, and the injection pressure is controlled at 45 MPa. During injection, the effective temperature of the molten material heating coil 46 is controlled at 75 degrees Celsius, the injection time is controlled at 2 seconds, the injection speed is 10 grams per second, and the holding pressure is controlled at 30 MPa. In the degreasing stage, the effective temperature of the degreasing heating coil is controlled at 450 degrees Celsius, and the overall degreasing time is 1.5 hours.

[0034] The integrated injection molding table 1 is a rectangular plate-like structure, the mixing injection transfer control cabinet 12 is a square cabinet structure, there are two transfer rails 15, and the two transfer rails 15 are arranged in parallel on the bottom surface of the mixing injection transfer control cabinet 12 on one side of the transfer operation partition 14. There are at least two hydraulic push rods 17, and all hydraulic push rods 17 are synchronous hydraulic push rods. A hydraulic workstation connected to the hydraulic push rod 17 is arranged on the top of the track trolley 16. The lifting support 18 is a rectangular plate-like structure, and a guide plate is fixedly installed on the top of the hydraulic push rod 17, and the lifting support 18 is movably installed above the guide plate. The mold transfer frame 19 is a rectangular plate structure with a plurality of mold sleeve fixing grooves matching the bottom of the mold sleeve 20 on the top. The bottom of the mold sleeve 20 is movably inserted into the mold sleeve fixing groove. The injection corresponding hole 28 and the degreasing corresponding hole 27 are both square through-hole structures. The shapes and sizes of the injection corresponding holes 28 and the degreasing corresponding holes 27 are respectively equal. The injection molding box 5 and the degreasing box 6 are both square box structures with openings at the bottom. The shapes and sizes of the injection molding box 5 and the degreasing box 6 are respectively equal. Injection observation windows 9 and degreasing observation windows 10 are respectively provided on the injection molding box 5 and the degreasing box 6.

[0035] In order to improve the stability of the present invention during operation, the inner diameters of the injection corresponding holes 28 and the degreasing corresponding holes 27 are consistent with the outer diameter of the lifting support 18. During specific use, a sealing device is provided on the inner walls of the injection corresponding holes 28 and the degreasing corresponding holes 27 to form a seal between the inner walls of the injection corresponding holes 28 and the degreasing corresponding holes 27 and the outer wall of the lifting support 18. The material of the sealing device is a high-temperature resistant material. This method can ensure the independent sealed space of the injection molding box 5 and the degreasing box 6 during the injection molding and high-temperature degreasing processes, which is beneficial to the operation of the injection molding operation and the heat preservation and pressure maintenance operation during the degreasing heating process.

[0036] The corresponding injection box 21 is a trapezoidal box structure with a small top and a large bottom. An injection cavity 26 is arranged in the corresponding injection box 21. The top of the injection cavity 26 is connected to the discharge end of the discharge pipe 7, and the bottom of the injection cavity 26 is connected to each injection nozzle 22. The axis of each injection nozzle 22 is in the same straight line as the axis of the mold groove 29 arranged in the mold sleeve 20 corresponding to the upper part of the track trolley 16 in the initial state. The length of the corresponding injection box 21 is not greater than the length of the inner cavity of the injection molding box 5, the width of the corresponding injection box 21 is not greater than the width of the inner cavity of the injection molding box 5, the length from the bottom surface of the lifting support 18 to the top surface of the mold sleeve 20 is not greater than one half of the height of the inner cavity of the injection molding box 5, and the plane where the bottom of the injection nozzle 22 is located is located above the longitudinal middle of the inner cavity of the injection molding box 5. The heat gathering hood 24 is a plate-like structure with an opening facing downward and a trapezoidal cross-section. The two ends of the heat gathering hood 24 are fixedly connected to the inner walls of the degreasing box 6 in the length direction, and the two sides of the heat gathering hood 24 are fixedly connected to the inner walls of the degreasing box 6 in the width direction. The plane where the bottom of the heat gathering hood 24 is located is located above the longitudinal middle part of the inner cavity of the degreasing box 6. The plane where the bottom of the heat gathering hood 24 is located is on the same plane as the plane where the bottom of the injection nozzle 22 is located. The bottom of the degreasing heater 23 is fixedly installed at the center position of the top surface of the heat gathering hood 24. The bottom surface of the degreasing heating coil 25 is located above the plane where the bottom of the heat gathering hood 24 is located. The outside of the degreasing box 6 is provided with a dehumidification port 8 connected to the cavity below the degreasing heating coil 25.

[0037] The dehumidification port 8 is opened by a valve and connected to an external dehumidification device. The matching is started according to the dryness and wetness of the blank after injection molding. The dehumidification operation is carried out by preheating and the degreasing operation is carried out by high-temperature heating. While ensuring that the degreasing temperature operates effectively, the dehumidification port 8 may be opened according to the humidity in the degreasing box 6.

[0038] The single cone melt extrusion sleeve 31 is a tapered barrel structure arranged transversely, the mixed material feed port 3 is arranged above the large-diameter side of the single cone melt extrusion sleeve 31, the molten material discharge pipe 35 is arranged below the small-diameter side of the single cone melt extrusion sleeve 31, the outer side of the single cone melt extrusion sleeve 31 is sleeved with an insulation box 2, the outer wall of the single cone melt extrusion sleeve 31 is fixedly installed with an extrusion sleeve fixing frame fixedly connected to the top wall of the insulation box 2 and the top surface of the integrated injection molding table 1, and the middle outer side of the reduction motor 4 is arranged outside the insulation box 2. The central extrusion barrel 32 is a tapered barrel structure arranged transversely, the outer wall of the central extrusion barrel 32 is arranged parallel to the single cone melt extrusion sleeve 31, and the outer wall of the single cone discharge extrusion shaft is fixedly installed with an extrusion discharge spiral matched with the inner wall of the central extrusion barrel 32. A fixing frame 41 is arranged outside the integrated heater 42, a branch line controller 37 is arranged between the integrated heater 42 and the air compressor 38, an electric control cabinet 36 is arranged on one side of the branch line controller 37, a heat dissipation fan 30 connected to the outside of the mixing injection transfer control cabinet 12 is arranged above the electric control cabinet 36, the rail trolley 16, the degreasing heater 23, the control end of the hydraulic push rod 17, the discharging solenoid valve 47, the reduction motor 4, the integrated heater 42, the branch line controller 37, the air compressor 38, the pressure maintaining solenoid valve 48, the gas control solenoid valve 43 and the pressure relief valve 50 are respectively connected to the electric control cabinet 36 through wires.

[0039] The touch screen controller 11 is arranged on the cabinet door 13 and connected to the electric control cabinet 36. It implements the overall control operations of the rail trolley 16, the degreasing heater 23, the control end of the hydraulic push rod 17, the discharge solenoid valve 47, the reduction motor 4, the integrated heater 42, the branch line controller 37, the air compressor 38, the pressure maintaining solenoid valve 48, the gas control solenoid valve 43 and the pressure relief valve 50. Through intelligent control, the temperature, pressure, time and other control operations of each component are realized, thereby improving the degree of intelligence during operation.

[0040] When the present invention is in use, firstly, a variety of dry materials are mixed evenly, and then the materials are fed at a uniform speed through the mixed material feed port 3, and the mixed material enters the inner cavity of the central extrusion barrel 32. The reduction motor 4 is turned on to drive the single-cone discharge extrusion shaft to rotate, and the extrusion discharge spiral transfers the mixed material toward the molten material discharge pipe 35. During the transfer process, extrusion is formed between the outer wall of the extrusion discharge spiral and the inner wall of the central extrusion barrel 32 to crush large pieces of material. At the same time, under the operation of the integrated heater 42, the molten material heating coil 34 heats the heating chamber 33. After the heating chamber 33 is heated, it heats the mixed material in the inner cavity of the central extrusion barrel 32. The mixed material melts into slurry at a preset temperature, and the pressure-maintaining solenoid valve 48 is turned on. The slurry enters the storage bin 44 through the molten material discharge pipe 35 under the action of continuous extrusion and transfer.

[0041] When the filling in the storage bin 44 reaches a preset volume, the molten material heating coil 46 is turned on through the integrated heater 42 to heat the independent heating chamber 45. After reaching the preset temperature, the independent heating chamber 45 heats the slurry in the storage bin 44. In the initial state, the rail trolley 16 is close to the transfer operation partition 14, the lifting support 18 corresponds to the injection corresponding hole 28, the hydraulic push rod 17 is turned on to push the lifting support 18 up, the lifting support 18 drives the mold transfer frame 19 to move up, and the mold transfer frame 19 drives the mold sleeve 20 to move up, and each Each mold groove 29 is moved up to the position corresponding to the bottom of each injection nozzle 22, and then the gas control solenoid valve 43 is opened and the pressure holding solenoid valve 48 is closed. The air compressor 38 presses the high-pressure air into the top of the storage bin 44 through the gas pressurization pipeline 39. When the injection operation is required, the discharge solenoid valve 47 is opened, and the slurry enters the injection cavity 26 in the corresponding injection box 21 through the bottom of the storage bin 44 and the discharge pipe 7, and is discharged from the injection nozzle 22 at the bottom of the injection cavity 26 into the mold groove 29, and the injection molding operation is implemented in the injection molding box 5.

[0042] After completing the injection molding operation, the hydraulic push rod 17 drives the lifting support 18 to return to the initial position. At this time, the top surface of the mold sleeve 20 is located below the integrated injection molding table 1. The rail trolley 16 is turned on to drive the mold transfer frame 19 loaded with the mold sleeve 20 to be transferred to the bottom of the degreasing corresponding hole 27. The output operation of the hydraulic push rod 17 is repeated to transport the mold transfer frame 19 loaded with the mold sleeve 20 to the degreasing box 6. The degreasing heater 23 runs in advance and drives the degreasing heating coil 25 to heat to a preset temperature. When the molding mold in the mold groove 29 moves up to the preset position, the heat generated by the degreasing heating coil 25 performs heating and degreasing operations on the outer wall of the mold sleeve 20 and the top of the mold groove 29 under the action of the heat gathering cover 24, and the material is discharged after the preset time.

[0043] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor ceramic injection molding device, comprising an integrated injection molding table (1), a mixing injection transfer control cabinet (12) arranged below the integrated injection molding table (1), and a transfer operation partition (14) vertically fixedly installed in the middle of the mixing injection transfer control cabinet (12), characterized in that: A transfer track (15) is fixedly installed on the bottom surface of the mixing injection transfer control cabinet (12) on one side of the transfer operation partition (14), and a track trolley (16) is provided on the transfer track (15). A hydraulic push rod (17) is fixedly installed on the track trolley (16), and a lifting support (18) is fixedly installed on the top output end of the hydraulic push rod (17). A mold transfer frame (19) is movably installed on the lifting support (18). A plurality of mold sleeves (20) with mold grooves (29) on the top of the mold transfer frame (19) are clamped on the top of the mold transfer frame (19). An injection corresponding hole (28) and a degreasing corresponding hole (27) that match the shape of the lifting support (18) are opened on the integrated injection molding table (1) above the transfer track (15). An injection molding box (5) is installed on the top of the injection corresponding hole (28), and a degreasing corresponding hole (27) is installed on the top of the degreasing corresponding hole (27). The part is provided with a degreasing box (6), a corresponding injection box (21) matched with the mold transfer frame (19) is fixedly installed in the injection molding box (5), a plurality of injection nozzles (22) in an array structure and matched with the mold groove (29) are installed at the bottom of the corresponding injection box (21), a degreasing heater (23) is fixedly installed in the degreasing box (6), a heat gathering cover (24) is fixedly installed below the degreasing heater (23), a degreasing heating coil (25) connected to the degreasing heater (23) is fixedly installed at the bottom of the heat gathering cover (24), and a comprehensive mixing device is arranged in the mixing injection transfer control cabinet (12) on the other side of the transfer operation partition (14) and on the integrated injection molding table (1), and the comprehensive mixing device is connected to the top of the corresponding injection box (21) through a discharge pipe (7) with a discharge solenoid valve (47);The comprehensive mixing device comprises a single cone molten material extrusion sleeve (31) fixedly mounted on an integrated injection molding platform (1), a central extrusion barrel (32) being mounted inside the single cone molten material extrusion sleeve (31), a heating chamber (33) being arranged between the central extrusion barrel (32) and the inner wall of the single cone molten material extrusion sleeve (31), a molten material heating coil (34) being wound inside the heating chamber (33), a single cone discharge extrusion shaft being arranged inside the central extrusion barrel (32), the single cone discharge extrusion shaft being fixedly connected to the output end of a reduction motor (4) mounted outside the single cone molten material extrusion sleeve (31), a mixed material feed port (3) being arranged at the top of one end of the single cone molten material extrusion sleeve (31), a molten material discharge pipe (35) being connected to the bottom of the other end of the single cone molten material extrusion sleeve (31), and the bottom of the molten material discharge pipe (35) being connected to a pressure-maintaining electromagnetic valve (48) mounted below the integrated injection molding platform (1). The pressure-maintaining electromagnetic valve (48) is connected to the storage bin (44) inside the molten material pressurized storage bin (40) through a pipeline. An independent heating chamber (45) is provided between the molten material pressurized storage bin (40) and the storage bin (44). A molten material heating coil (46) is provided in the independent heating chamber (45). An integrated heater (42) connected to the molten material heating coil (46) and the molten material heating coil (34) is fixedly installed at the bottom of the integrated injection molding table (1). An air compressor (38) is installed at the bottom of the integrated heater (42). The air compressor (38) is connected to the top of the storage bin (44) through a gas pressurizing pipe (39) equipped with a gas control electromagnetic valve (43). A pressure relief pipe (49) with a pressure relief valve (50) is installed at the center of the top of the storage bin (44). The bottom of the storage bin (44) is connected to the feeding end of the discharge pipe (7).

2. The semiconductor ceramic injection molding equipment according to claim 1, characterized in that: The integrated injection molding table (1) is a rectangular plate-shaped structure, the mixing injection transfer control cabinet (12) is a square cabinet structure, there are two transfer rails (15), the two transfer rails (15) are arranged in parallel on the bottom surface of the mixing injection transfer control cabinet (12) on one side of the transfer operation partition (14), there are at least two hydraulic push rods (17), all of the hydraulic push rods (17) are synchronous hydraulic push rods, a hydraulic workstation connected to the hydraulic push rods (17) is arranged on the top of the track trolley (16), the lifting support (18) is a rectangular plate-shaped structure, a guide plate is fixedly installed on the top of the hydraulic push rod (17), and the lifting support (18) is movably installed above the guide plate.

3. The semiconductor ceramic injection molding equipment according to claim 1, characterized in that: The mold transfer frame (19) is a rectangular plate-shaped structure with a plurality of mold sleeve fixing grooves matched with the bottom of the mold sleeve (20) on the top. The bottom of the mold sleeve (20) is movably inserted into the mold sleeve fixing groove. The injection corresponding hole (28) and the degreasing corresponding hole (27) are both square through-hole structures. The injection corresponding hole (28) and the degreasing corresponding hole (27) are equal in shape and size. The injection molding box (5) and the degreasing box (6) are both square box structures with openings on the bottom. The injection molding box (5) and the degreasing box (6) are equal in shape and size. The injection molding box (5) and the degreasing box (6) are respectively provided with an injection observation window (9) and a degreasing observation window (10).

4. The semiconductor ceramic injection molding equipment according to claim 1, characterized in that: The corresponding injection box (21) is a trapezoidal box structure with a small top and a large bottom. An injection cavity (26) is arranged in the corresponding injection box (21). The top of the injection cavity (26) is connected to the discharge end of the discharge pipe (7), and the bottom of the injection cavity (26) is connected to each injection nozzle (22). The axis of each injection nozzle (22) is aligned with the axis of the mold groove (29) arranged in the corresponding mold sleeve (20) arranged on the upper part of the track trolley (16) in the initial state. The length of the corresponding injection box (21) is not greater than the length of the inner cavity of the injection molding box (5), the width of the corresponding injection box (21) is not greater than the width of the inner cavity of the injection molding box (5), the length from the bottom surface of the lifting support (18) to the top surface of the mold sleeve (20) is not greater than half the height of the inner cavity of the injection molding box (5), and the plane where the bottom of the injection nozzle (22) is located is located above the longitudinal middle of the inner cavity of the injection molding box (5).

5. The semiconductor ceramic injection molding equipment according to claim 1, characterized in that: The heat gathering hood (24) is a plate-like structure with an opening facing downward and a trapezoidal cross-section. The two ends of the heat gathering hood (24) are respectively fixedly connected to the inner wall of the degreasing box (6) in the length direction. The two sides of the heat gathering hood (24) are respectively fixedly connected to the inner wall of the degreasing box (6) in the width direction. The plane where the bottom of the heat gathering hood (24) is located is located above the longitudinal middle of the inner cavity of the degreasing box (6). The plane where the bottom of the heat gathering hood (24) is located is on the same plane as the plane where the bottom of the injection nozzle (22) is located. The bottom of the degreasing heater (23) is fixedly installed at the center position of the top surface of the heat gathering hood (24). The bottom surface of the degreasing heating coil (25) is located above the plane where the bottom of the heat gathering hood (24) is located. The outer side of the degreasing box (6) is provided with a dehumidification port (8) connected to the cavity below the degreasing heating coil (25).

6. The semiconductor ceramic injection molding equipment according to claim 1, characterized in that: The single-cone molten material extrusion sleeve (31) is a transversely arranged conical barrel-shaped structure, the mixed material feed port (3) is arranged above the large-diameter side of the single-cone molten material extrusion sleeve (31), the molten material discharge pipe (35) is arranged below the small-diameter side of the single-cone molten material extrusion sleeve (31), the outer side of the single-cone molten material extrusion sleeve (31) is sleeved with an insulation box (2), the outer wall of the single-cone molten material extrusion sleeve (31) is fixedly mounted with an extrusion sleeve fixing frame fixedly connected to the top wall of the insulation box (2) and the top surface of the integrated injection molding table (1), and the middle outer side of the reduction motor (4) is arranged outside the insulation box (2).

7. The semiconductor ceramic injection molding equipment according to claim 1, characterized in that: The central extrusion barrel (32) is a transversely arranged conical barrel structure, the outer wall of the central extrusion barrel (32) is arranged parallel to the single-cone melt extrusion sleeve (31), and the outer wall of the single-cone discharge extrusion shaft is fixedly installed with an extrusion discharge spiral that matches the inner wall of the central extrusion barrel (32).

8. The semiconductor ceramic injection molding equipment according to claim 1, characterized in that: The integrated heater (42) is provided with a fixing frame (41) outside, a branch line controller (37) is provided between the integrated heater (42) and the air compressor (38), an electric control cabinet (36) is provided on one side of the branch line controller (37), a heat dissipation fan (30) connected to the outside of the mixing injection transfer control cabinet (12) is provided above the electric control cabinet (36), a rail trolley (16), a degreasing heater (23), a control end of a hydraulic push rod (17), a discharge solenoid valve ( 47), a reduction motor (4), an integrated heater (42), a branch line controller (37), an air compressor (38), a pressure-maintaining solenoid valve (48), a gas control solenoid valve (43) and a pressure relief valve (50) are respectively connected to an electric control cabinet (36) through wires. A cabinet door (13) is provided on a mixing injection transfer control cabinet (12) below a single-cone melt extrusion sleeve (31), and a touch screen controller (11) connected to the electric control cabinet (36) is installed on the cabinet door (13).

9. A method for using the semiconductor ceramic injection molding device according to any one of claims 1 to 8, characterized in that: The method is: First, a plurality of dry materials are mixed evenly, and then fed at a uniform speed through a mixed material feed port (3), the mixed material enters the inner cavity of a central extrusion barrel (32), the reduction motor (4) is turned on to drive the single-cone discharge extrusion shaft to rotate, and the extrusion discharge spiral transfers the mixed material toward a molten material discharge pipe (35). During the transfer process, extrusion is formed between the outer wall of the extrusion discharge spiral and the inner wall of the central extrusion barrel (32), and large pieces of material are crushed. At the same time, under the operation of the integrated heater (42), the molten material heating coil (34) heats the heating chamber (33). After the heating chamber (33) is heated, it heats the mixed material in the inner cavity of the central extrusion barrel (32). The mixed material is melted into slurry at a preset temperature, and the pressure-maintaining solenoid valve (48) is turned on. Under the action of continuous extrusion transfer, the slurry enters a storage bin (44) through the molten material discharge pipe (35); When the filling in the storage bin (44) reaches a preset volume, the molten material heating coil (46) is turned on through the integrated heater (42) to heat the independent heating chamber (45). After reaching the preset temperature, the independent heating chamber (45) heats the slurry in the storage bin (44). In the initial state, the rail trolley (16) approaches the transfer operation partition (14), the lifting support (18) corresponds to the injection corresponding hole (28), the hydraulic push rod (17) is turned on to push the lifting support (18) upward, the lifting support (18) drives the mold transfer frame (19) to move upward, and the mold transfer frame (19) drives the mold sleeve (20) to move upward, so that each Each mold groove (29) is moved upward to a position corresponding to the bottom of each injection nozzle (22), and then the gas control solenoid valve (43) is opened and the pressure-maintaining solenoid valve (48) is closed. The air compressor (38) presses high-pressure air into the top of the storage bin (44) through the gas pressurizing pipe (39). When the injection operation needs to be performed, the discharge solenoid valve (47) is opened, and the slurry enters the injection cavity (26) in the corresponding injection box (21) through the bottom of the storage bin (44) and the discharge pipe (7), and is discharged from the injection nozzle (22) at the bottom of the injection cavity (26) into the mold groove (29), and the injection molding operation is performed in the injection molding box (5); After the injection molding operation is completed, the hydraulic push rod (17) drives the lifting support (18) to return to the initial position. At this time, the top surface of the mold sleeve (20) is located below the integrated injection molding table (1). The rail trolley (16) is turned on to drive the mold transfer frame (19) loaded with the mold sleeve (20) to be transferred to the bottom of the degreasing corresponding hole (27). The output operation of the hydraulic push rod (17) is repeated to transport the mold transfer frame (19) loaded with the mold sleeve (20) into the degreasing box (6). The degreasing heater (23) is operated in advance and drives the degreasing heating coil (25) to heat to a preset temperature. When the molding mold in the mold groove (29) moves up to the preset position, the heat generated by the degreasing heating coil (25) performs a heating and degreasing operation on the outer wall of the mold sleeve (20) and the top of the mold groove (29) under the action of the heat gathering cover (24). After the preset time is reached, the material is discharged.

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