A bypass module, junction box and photovoltaic module of a photovoltaic module

Abstract

The present invention discloses a bypass module, a junction box and a photovoltaic module of a photovoltaic module. The bypass module includes a first conductive terminal, a second conductive terminal and a bypass element packaging module. The bypass element packaging module includes: a bypass element; a conductor connecting piece; a packaging body; at least one of the conductive connecting piece, the first end of the first conductive terminal and the second end of the second conductive terminal has a heat dissipation surface exposed from the upper surface or the lower surface of the packaging body; the bypass module also includes a first radiator, the first radiator has a connecting plate and a side plate bent upward or downward from the connecting plate, the connecting plate is arranged above or below the bypass element packaging module, the connecting plate and the heat dissipation surface are attached, and the side plate is located on the side of the bypass element packaging module. The bypass module of the present invention can increase the heat dissipation area and improve the heat dissipation effect.

Description

Technical Field

[0001] The invention belongs to the technical field of solar photovoltaic power generation, and in particular relates to a bypass module of a photovoltaic component, a junction box and a photovoltaic component. Background Art

[0002] Solar photovoltaic modules are devices that convert solar energy into electrical energy. In photovoltaic power generation systems, junction boxes play an important role. Their main function is to connect and protect solar photovoltaic modules, connect the electricity generated by solar cells to external lines, and conduct the current generated by photovoltaic modules. The junction box is generally equipped with a bypass module, which is connected to the battery string in the photovoltaic module. When there is damage to the cells in the battery string or a hot spot effect caused by light blocking, the faulty battery string can be separated from the photovoltaic system to avoid adverse effects on the entire photovoltaic system.

[0003] Photovoltaic modules are developing towards high-power modules, which requires the junction box to have a strong overcurrent capability. When a large current passes through, the heat generated by the bypass element in the bypass module will increase. In order to ensure the service life of the junction box, the bypass element must have excellent heat dissipation performance. However, the size of the junction box is limited, which imposes many restrictions on the setting of the radiator. Summary of the invention

[0004] In order to solve the above technical problems, the present invention provides a bypass module, a junction box and a photovoltaic module of a photovoltaic module, which can increase the heat dissipation area and improve the heat dissipation effect while fully utilizing the space of the junction box.

[0005] In order to achieve the above object, the present invention adopts the following technical scheme:

[0006] A bypass module of a photovoltaic assembly comprises a first conductive terminal, a second conductive terminal and a bypass element packaging module arranged between the first conductive terminal and the second conductive terminal, wherein the bypass element packaging module comprises:

[0007] a bypass element disposed on a first end portion of the first conductive terminal;

[0008] a conductor connecting piece electrically connecting the bypass element and the second end of the second conductive terminal;

[0009] A packaging body, which packages the first end, the second end, the bypass element and the conductor connection sheet;

[0010] At least one of the conductive connecting sheet, the first end of the first conductive terminal, and the second end of the second conductive terminal has a heat dissipation surface exposed from the upper surface or the lower surface of the package body;

[0011] The bypass module also includes a first radiator, which has a connecting plate and a side plate bent upward or downward from the connecting plate, the connecting plate is arranged above or below the bypass element packaging module, the connecting plate is in contact with the heat dissipation surface, and the side plate is located on the side of the bypass element packaging module.

[0012] In a preferred embodiment, the conductor connecting piece has a welding section and a heat dissipation section higher or lower than the welding section, the welding section is connected to the bypass element and / or the second end, and the upper surface or lower surface of the heat dissipation section is exposed from the outer surface of the package body to form the heat dissipation surface. The conductor connecting piece can provide electrical interconnection.

[0013] In a preferred embodiment, the conductor connecting piece has a plurality of the heat dissipation segments.

[0014] In a preferred embodiment, the conductor connecting piece extends along the left-right direction of the bypass element packaging module, and the conductor connecting piece has a plurality of welding segments, and the plurality of welding segments are spaced apart along the left-right direction; the first conductive terminal and the second conductive terminal are spaced apart along the left-right direction, the bypass element is connected to at least one of the welding segments, and the second end is connected to at least another of the welding segments.

[0015] In a preferred embodiment, the conductor connecting piece extends along the front-to-back direction of the bypass element packaging module, and the conductor connecting piece has a plurality of welding segments, and the plurality of welding segments are arranged at intervals along the front-to-back direction; the first conductive terminal and the second conductive terminal extend along the left-to-right direction of the bypass element packaging module respectively, the bypass element is connected to at least one of the welding segments, and the second end is connected to at least another of the welding segments.

[0016] In a preferred embodiment, the second end has at least two pins extending in the left-right direction, and at least a portion of the first end is located between at least two of the pins; the conductor connecting piece has at least three welding sections arranged at intervals in the front-back direction, the middle welding section is connected to the bypass element on the first end, and the welding sections on both sides are respectively connected to the second end. When the bypass element is working, the flow conduction capacity is stronger, further improving the heat dissipation effect.

[0017] In a preferred embodiment, the first end and the second end are located in a first plane, the heat dissipation section is located in a second plane, and the second plane is higher or lower than the first plane.

[0018] In a more preferred embodiment, the first conductive terminal and / or the second conductive terminal are bent upward or downward, so that a portion of the surface of the first end portion and / or the second end portion is exposed outside the package to form the heat dissipation surface, so as to facilitate the installation of a heat sink below the conductor connecting sheet to improve the heat dissipation effect.

[0019] In a preferred embodiment, the first conductive terminal has a terminal body located outside the package body, the terminal body is located on a first plane, the first end is bent upward relative to the terminal body, the upper surface of the first end is exposed outside the package body, the bypass element is arranged on the lower surface of the first end, and the conductor connecting plate is located below the first end.

[0020] In a more preferred embodiment, one end of the conductor connecting piece is connected to the bypass element, and the other end of the conductor connecting piece is connected to the upper surface of the second end.

[0021] In a preferred embodiment, the conductor connecting piece has a welding section and a heat dissipation section lower than the welding section, the welding section is connected to the bypass element or the second end, the lower surface of the heat dissipation section is exposed from the outer surface of the package body, and the lower surface of the heat dissipation section and the upper surface of the first end respectively form the heat dissipation surface. The heat dissipation effect is improved by increasing the heat dissipation area.

[0022] In a preferred embodiment, the first conductive terminal and the second conductive terminal extend along the left and right directions of the bypass element packaging module respectively, and the side plate is located in front and / or rear of the bypass element packaging module to increase the heat dissipation effect of the bypass element in the front and / or rear.

[0023] In a preferred embodiment, the number of the side panels is two or two groups, and the bypass element packaging module is located between the two or two groups of side panels. The side panels improve the heat dissipation effect without occupying much space.

[0024] In a preferred embodiment, the bypass module further includes a second heat sink, and the second heat sink is disposed above or below the bypass element packaging module.

[0025] In a preferred embodiment, the conductor connecting piece has an extension section extending outside the package body, and the extension section can increase the heat dissipation area and improve the heat dissipation effect.

[0026] In a preferred embodiment, the epitaxial section is stacked on the second conductive terminal, and a clearance groove is provided on the epitaxial section, and the clearance groove corresponds to the busbar welding area of ​​the second conductive terminal.

[0027] In a preferred embodiment, the conductor connecting sheet is formed by integrally bending a metal sheet.

[0028] The present invention also adopts the following technical solution:

[0029] A junction box for a photovoltaic assembly comprises a box body and the bypass module mentioned above, wherein the bypass module is arranged in the box body.

[0030] The present invention also adopts the following technical solution:

[0031] A photovoltaic assembly includes a solar panel and a junction box, wherein the junction box includes the above-mentioned bypass module, the first conductive terminal and the second conductive terminal of the bypass module are respectively connected to the bus bar on the solar panel, and the bypass element includes a Schottky diode or an ideal diode.

[0032] The present invention adopts the above solution, which has the following advantages compared with the prior art:

[0033] In the bypass module of the present invention, at least one of the conductor connecting plate, the first end and the second end has a heat dissipation surface and the heat dissipation surface is exposed on the upper surface or the lower surface of the package body, and a first heat sink is arranged on the heat dissipation surface, and the first heat sink has a side plate that is bent upward or downward relative to the connecting plate and the side plate is arranged in front of and behind the bypass element package module. The heat sink is arranged in the space in front and behind, which not only does not need to increase the height of the junction box, but also increases the heat dissipation area and improves the heat dissipation effect. In addition, it can also avoid using more advanced bypass elements while meeting the application requirements of high-power photovoltaic modules, thereby reducing the cost of photovoltaic modules. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solution of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0035] Figure 1 is a three-dimensional diagram of a bypass module according to Embodiment 1 of the present invention;

[0036] Figure 2 is an exploded view of a bypass module according to Embodiment 1 of the present invention;

[0037] Figure 3 is a cross-sectional view of a bypass module according to Embodiment 1 of the present invention;

[0038] Figure 4 is a three-dimensional diagram of a bypass module according to Embodiment 2 of the present invention;

[0039] Figure 5 is an exploded view of a bypass module according to Embodiment 2 of the present invention;

[0040] Figure 6 is a stereoscopic diagram of a bypass module according to Embodiment 3 of the present invention;

[0041] Figure 7 is an exploded view of a bypass module according to Embodiment 3 of the present invention;

[0042] Figure 8 is a cross-sectional view of a bypass module according to Embodiment 3 of the present invention;

[0043] Fig. 9 is a three-dimensional diagram of a bypass module according to Embodiment 4 of the present invention;

[0044] Fig.10 is an exploded view of a bypass module according to Embodiment 4 of the present invention;

[0045] Fig.11 is a cross-sectional view of a bypass module according to Embodiment 4 of the present invention;

[0046] Fig.12 is a stereoscopic diagram of a bypass module according to Embodiment 5 of the present invention;

[0047] Fig.13 is an exploded view of a bypass module according to Embodiment 5 of the present invention;

[0048] Fig.14 is a cross-sectional view of a bypass module according to Embodiment 5 of the present invention;

[0049] Fig.15 is a stereoscopic diagram of a bypass module according to Embodiment 6 of the present invention;

[0050] Fig.16 is an exploded view of a bypass module according to Embodiment 6 of the present invention;

[0051] Fig.17 is a cross-sectional view of a bypass module according to Embodiment 6 of the present invention;

[0052] Fig.18 is a stereoscopic diagram of a bypass module according to Embodiment 7 of the present invention;

[0053] Fig.19 is an exploded view of a bypass module according to Embodiment 7 of the present invention;

[0054] Fig. 20 is a cross-sectional view of a bypass module according to Embodiment 7 of the present invention;

[0055] Fig.21 is a stereoscopic diagram of a bypass module according to Embodiment 8 of the present invention;

[0056] Fig. 22 is a cross-sectional view of a bypass module according to Embodiment 8 of the present invention;

[0057] Fig.23 is a stereoscopic diagram of a bypass module according to Embodiment 9 of the present invention;

[0058] Fig.24 is a cross-sectional view of a bypass module according to Embodiment 9 of the present invention;

[0059] Fig.25 is a three-dimensional diagram of a bypass module according to embodiment 10 of the present invention;

[0060] Fig.26 4 is a cross-sectional view of a bypass module according to embodiment 10 of the present invention.

[0061] in,

[0062] 1. bypass module; 11. first conductive terminal; 111. first end; 112. anti-reverse opening; 12. second conductive terminal; 121. second end; 122. busbar welding area; 1221. busbar perforation; 1222. tin block; 123. positioning hole; 13. bypass element packaging module; 131. bypass element; 132. conductor connecting piece; 1321. welding section; 1322. heat dissipation section; 1323. bending section; 1324. pad; 133. packaging body; 1331. hollow part; 134. heat dissipation surface;

[0063] 2. bypass module; 21. first conductive terminal; 211. first end; 22. second conductive terminal; 221. second end; 2211. pin; 2321. welding section; 2322. heat dissipation section; 233. package body; 234. heat dissipation surface; 24. conductor connecting piece;

[0064] 3. bypass module; 32. second conductive terminal; 332. conductor connecting piece; 3321. extension section; 3322. clearance groove; 3323. connecting hole; 333. packaging body;

[0065] 4. bypass module; 41. radiator; 411. first radiator; 4111. connecting plate; 4112. side plate; 412. second radiator; 4121. bottom plate; 4122. ridge; 42. bypass element packaging module; 43. heat dissipation surface;

[0066] 5. bypass module; 51. first heat sink; 511. connection plate; 512. side plate; 52. bypass element packaging module; 543. heat dissipation surface;

[0067] 6. bypass module; 61. radiator; 611. first radiator; 6111. connecting plate; 6112. side plate; 612. second radiator; 6121. bottom plate; 6122. convex edge; 62. heat dissipation surface; 63. bypass element packaging module;

[0068] 7. Bypass module; 71. First conductive terminal; 711. First end; 712. Terminal body; 72. Second conductive terminal; 721. Second end; 73. Heat dissipation surface; 74. Conductor connecting piece; 75. Package body;

[0069] 8. bypass module; 81. conductor connecting piece; 811. welding section; 812. heat dissipation section; 82. heat dissipation surface; 831. first end; 84. packaging body; 85. second end;

[0070] 9. bypass module; 91. radiator; 911. first radiator; 9111. connecting plate; 9112. side plate; 912. second radiator; 9121. bottom plate; 9122. ridge; 92. bypass element packaging module; 93. heat dissipation surface;

[0071] 10. Bypass module; 101. Radiator; 1011. First radiator; 10111. Connecting plate; 10112. Side plate; 1012. Second radiator; 10121. Bottom plate; 10122. Raised ridge; 102. Bypass element packaging module; 103. Heat dissipation surface. DETAILED DESCRIPTION

[0072] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art. It should be noted that the description of these embodiments is used to help understand the present invention, but does not constitute a limitation of the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0073] Example 1

[0074] This embodiment provides a photovoltaic assembly, including a solar panel and a junction box. The junction box can be a single-body junction box, a two-piece junction box, or a three-piece junction box. The junction box includes a bypass module 1 and a box body. The bypass module 1 is arranged in the box body. The bypass module is introduced in detail below:

[0075] Reference Figures 1 to 3As shown, the bypass module 1 of this embodiment includes a first conductive terminal 11, a second conductive terminal 12 and a bypass element packaging module 13. The first conductive terminal 11 and the second conductive terminal 12 are arranged at intervals from left to right, and the bypass element packaging module 13 is arranged between the first conductive terminal 11 and the second conductive terminal 12. The "left-right direction" of this embodiment refers to Figure 2 The direction in which the longer side of the first conductive terminal 11 or the second conductive terminal 12 is located.

[0076] More specifically, the first conductive terminal 11 is a negative copper plate, and the second conductive terminal 12 is a positive copper plate. The first conductive terminal 11 and the second conductive terminal 12 have a positioning hole 123 for installing the bypass module 1 in the junction box, and the first conductive terminal 11 or the second conductive terminal 12 is also provided with an anti-reverse opening 112 to prevent the bypass module 1 from being reversely installed. The shape, position and number of the positioning hole 12 and the anti-reverse opening 22 can be reasonably set according to actual needs.

[0077] The first conductive terminal 11 and the second conductive terminal 12 of the bypass module 1 are respectively connected to the busbar on the solar cell panel through the busbar welding area 122. Specifically, the busbar welding area 122 includes a busbar through-hole 1221 and a tin block 1222. More specifically, the first conductive terminal 11 and the second conductive terminal 12 each have a busbar through-hole 1221 and a tin block 1222, and the busbar through-hole 1221 and the tin block 1222 are both located outside the bypass element packaging module 13, and the busbar on the solar cell panel is inserted into the busbar through-hole 1221 and is conductively connected to the tin block 1222.

[0078] Furthermore, the bypass element packaging module 13 includes a bypass element 131, a conductor connecting piece 132 formed by bending a metal sheet, and a packaging body 133. The bypass element 131 is a Schottky diode or an ideal diode. In this embodiment, the bypass element 131 is specifically a Schottky diode, which is arranged on the first end 111 of the first conductive terminal 11; the conductor connecting piece 132 is used to electrically connect the bypass element 131 and the second end 121 of the second conductive terminal 12; the packaging body 133 encapsulates the first end 111, the second end 121, the bypass element 131 and the conductor connecting piece 132, which prevents electrical connection with other components on the one hand, and plays a waterproof role on the other hand to protect the bypass element, etc.

[0079] Furthermore, at least one of the conductor connecting piece 132, the first end 111 of the first conductive terminal 11, and the second end 121 of the second conductive terminal 12 has a heat dissipation surface 134 exposed from the outer surface of the package body 133, and the heat dissipation surface 134 is a heat sink mounting surface. The heat dissipation surface 134 is exposed from the upper surface and / or lower surface of the package body 133. Specifically in this embodiment, the conductor connecting piece 132 has a heat dissipation surface 134 exposed from the outer surface of the package body 133, and the heat dissipation surface 134 is exposed from the upper surface of the package body 133, which is convenient for installing a heat sink to achieve the purpose of heat dissipation. The package body 133 has a hollow portion 1331, and the structure of the hollow portion 1331 and the heat dissipation surface 134 match. The heat dissipation surface 134 is slightly higher than the outer surface of the package body 133 or flush with the outer surface of the package body 133. The heat generated by the bypass element 131 can be conducted to the conductive connecting piece 132 and dissipated through the heat dissipation surface 134.

[0080] Reference Figure 2 and Figure 3 As shown, the conductor connecting piece 132 extends along the left-right direction of the bypass element packaging module 1, and the conductor connecting piece 132 has a plurality of welding sections 1321, a plurality of heat dissipation sections 1322 higher than the welding sections 1321, and a bending section 1323 located between the welding sections 1321 and the heat dissipation end 1322. The plurality of welding sections 1321 and the plurality of heat dissipation sections 1322 are arranged at intervals along the left-right direction. The welding section 1321 includes a soldering pad 1324, and the soldering pad 1324 is connected to the bypass element 131 by welding; one of the welding sections 1321 is connected to the second end 121 by welding, and the upper surface of the heat dissipation section 1322 is exposed from the outer surface of the packaging body 133 to form a heat dissipation surface 134. Among them, the number of heat dissipation sections 1322 is multiple, which can increase the heat dissipation area. Specifically in this embodiment, the number of heat dissipation sections 1322 is two. The first end 111 and the second end 121 are located in the first plane, and the heat dissipation section 1322 is located in the second plane, and the second plane is higher than the first plane.

[0081] The bypass module of this embodiment improves the heat dissipation capacity by 70%, increases the heat dissipation area without increasing the junction box space, and enhances the heat dissipation effect; meets the application requirements of high-power photovoltaic modules, avoids the use of high-level bypass components, reduces the cost of the photovoltaic system, and can be better applied to the future 40A, 45A, and 50A current junction boxes.

[0082] Example 2

[0083] Reference Figure 4 and Figure 5As shown, the bypass module 2 of this embodiment is basically the same as the embodiment 1, except that the conductor connecting piece 24 extends along the front-to-back direction of the bypass element packaging module 2, and the conductor connecting piece 24 has a plurality of welding segments 2321, and the plurality of welding segments 2321 are arranged at intervals along the front-to-back direction. The "front-to-back direction" here refers to the direction perpendicular to Figure 5 In the paper directions shown, "front" refers to the direction out of the paper, and "back" refers to the direction into the paper.

[0084] Furthermore, the second end 221 has at least two pins 2211 extending in the left-right direction, and at least a portion of the first end 211 is located between at least two pins 2211. The conductor connecting piece 24 has at least three welding sections 2321 spaced apart in the front-to-back direction. Specifically in this embodiment, the number of welding sections is three, and in other embodiments, the number of welding sections may not be limited to three. A middle welding section is connected to the bypass element 131 on the first end 211, and the welding sections 2321 on both sides are respectively connected to the second end 221. The conduction path from the second conductive terminal 22 to the first conductive terminal 21 through the conductor connecting piece 24 becomes two, so that when the bypass element is in the working state, the conduction capacity is stronger, and the heat can also be transferred along two paths, and the heat dissipation effect is better.

[0085] Example 3

[0086] Reference Figures 6 to 8 As shown, the bypass module 3 of this embodiment is basically the same as the embodiment 1, except that the conductor connecting piece 332 has an extension section 3321 extending outside the package body 333, and the extension section 3321 can further increase the heat dissipation surface area, and the heat inside the package body 333 can be conducted to the extension section 3321 for heat dissipation, thereby enhancing the heat dissipation effect and improving the junction temperature capacity and thermal escape capacity of the bypass module 3. Specifically, the extension section 3321 is stacked on the second conductive terminal 32, and a clearance groove 3322 and a connection hole 3323 are provided on the extension section 3321. The clearance groove 3322 corresponds to the busbar through hole 1221 of the second conductive terminal 32, and the tin block passes through the connection hole 3323.

[0087] Example 4

[0088] Reference Figures 9 to 11 As shown, the bypass module 4 of this embodiment is basically the same as the embodiment 1, except that the bypass module 4 further includes a heat sink 41 disposed on the heat dissipation surface 43. Further, the heat sink 41 includes a first heat sink 411 and a second heat sink 412, and the first heat sink 411 and the second heat sink 412 can be made of copper or aluminum.

[0089] The first heat sink 411 has a connecting plate 4111 and a side plate 4112 bent downward from the connecting plate 4111. The connecting plate 4111 is arranged above or below the bypass element packaging module 42 and is attached to the heat dissipation surface 43 (can be combined by welding), the side plate 4112 is located on the side of the bypass element packaging module 42, the number of the side plates 4112 is two or two groups, the bypass element packaging module 42 is located between the two or two groups of side plates, and the connecting plate 4111 and the side plate 4112 are provided with a plurality of holes to further increase the heat dissipation area. Specifically in this embodiment, the connecting plate 4111 is arranged above the bypass element packaging module 42, the number of the side plates 4112 is two, the bypass element packaging module 42 is located between the two side plates 4112, and the shape is similar to an "I-shaped". The heat inside the bypass element packaging module 42 can be conducted to the first heat sink 41 for heat dissipation. By dissipating the heat from the side, the heat dissipation area on the front and rear sides is increased. The heat dissipation path is shorter and the heat dissipation effect is better than increasing the area of ​​the first conductive terminal and the second conductive terminal. That is, the first heat sink 411 can increase the heat dissipation area and thus enhance the heat dissipation effect, thereby improving the junction temperature capacity and thermal escape capability of the photovoltaic bypass module.

[0090] The second heat sink 412 is arranged above or below the bypass element packaging module 42. Specifically in this embodiment, the second heat sink 412 is arranged above the bypass element packaging module 42, and is specifically arranged above the connecting plate 4111. The second heat sink 412 includes a bottom plate 4121 and a plurality of ridges 4122 arranged on the bottom plate 4121. The bottom plate 4121 can be fixedly connected to the connecting plate 4111 by welding, or the bottom plate 4121 and the connecting plate 4111 are integrally arranged. The design of the plurality of ridges 4122 can increase the heat dissipation surface area, enhance the heat dissipation effect, and improve the junction temperature capacity and thermal escape capacity of the photovoltaic bypass module.

[0091] It should be noted that, in other embodiments, according to the actual current size and heat dissipation requirements, only the first heat sink or only the second heat sink may be used for heat dissipation.

[0092] Example 5

[0093] Reference Figure 12 to Figure 14As shown, the bypass module 5 of this embodiment is basically the same as that of embodiment 2, except that the bypass module 5 also includes a first radiator 51 arranged on the heat dissipation surface 543, the first radiator 51 has a connecting plate 511 and a side plate 512 bent downward from the connecting plate 511, the connecting plate 511 is arranged above or below the bypass element packaging module 52 and is in contact with the heat dissipation surface 543, the side plate 512 is located on the side of the bypass element packaging module 52, the number of the side plates 512 is two or two groups, and the bypass element packaging module 52 is located between the two or two groups of side plates. Specifically in this embodiment, the connecting plate 511 is arranged above the bypass element packaging module 52, the number of the side plates 512 is two, and the bypass element packaging module 52 is located between the two side plates 512. It should be noted that, according to the actual current size and heat dissipation requirements, only the second radiator as shown in embodiment 4 can be arranged, or the first radiator and the second radiator can be used to enhance heat dissipation.

[0094] Example 6

[0095] Reference Figures 15 to 17 As shown, the bypass module 6 of this embodiment is basically the same as the embodiment 3, except that the bypass module 6 also includes a heat sink 61 arranged on the heat dissipation surface 62, and the heat sink 61 includes a first heat sink 611 and a second heat sink 612. The first heat sink 611 and the second heat sink 612 can be made of copper or aluminum. The first heat sink 611 has a connecting plate 6111 and a side plate 6112 bent downward from the connecting plate 6111. The connecting plate 6111 is arranged above or below the bypass element packaging module 63 and is attached to the heat dissipation surface 62. The side plate 6112 is located on the side of the bypass element packaging module 63. The number of the side plates 6112 is two or two groups. The bypass element packaging module 63 is located between the two or two groups of side plates. The connecting plate 6111 and the side plate 6112 are provided with a plurality of holes to further increase the heat dissipation area. Specifically in this embodiment, the connecting plate 6111 is arranged above the bypass element packaging module 63, the number of the side plates 6112 is two, and the bypass element packaging module 63 is located between the two side plates 6112. The shape of the first heat sink is similar to an "I-shaped". The heat inside the bypass element packaging module 63 can be conducted to the first heat sink 61 for heat dissipation. The heat dissipation path is short and the heat dissipation effect is better than that of expanding the area of ​​the first conductive terminal and the second conductive terminal. That is, the first heat sink 61 can increase the heat dissipation surface area and thus enhance the heat dissipation effect, thereby improving the junction temperature capacity and thermal escape capacity of the photovoltaic bypass module.

[0096] The second heat sink 612 is arranged above or below the bypass element packaging module 63. The second heat sink 612 includes a bottom plate 6121 and a plurality of ridges 6122 arranged on the bottom plate 6121. The design of the plurality of ridges 6122 can increase the heat dissipation surface area, enhance the heat dissipation effect, and improve the junction temperature capacity and thermal escape capacity of the photovoltaic bypass module. Specifically in this embodiment, the second heat sink 612 is arranged above the bypass element packaging module 63. It should be noted that in other embodiments, according to the actual current size and heat dissipation requirements, only the first heat sink or only the second heat sink can be used for heat dissipation.

[0097] Example 7

[0098] Reference Figures 18 to 20 As shown, the bypass module 7 of this embodiment is basically the same as the embodiment 1, except that the first conductive terminal 71 and / or the second conductive terminal 72 are bent upward or downward, so that a portion of the surface of the first end 711 and / or the second end 721 is exposed to the outside of the package 133 to form a heat dissipation surface 73. The first conductive terminal 71 and / or the second conductive terminal 72 are bent upward or downward to provide a placement space for the conductor connecting piece 74. After the conductor connecting piece 74 is connected to the bypass element 131, the position of the conductor connecting piece 74 moves up so that there is enough space below it to install a heat sink, and the heat sink can also be electrically connected to the heat dissipation surface 73 exposed to the outside of the package 75. Specifically in this embodiment, the first conductive terminal 71 is bent upward, and a portion of the surface of the first end 711 is exposed to the outside of the package 133 to form a heat dissipation surface 73. The bypass element 131 of this embodiment is located on the first conductive terminal 71, and the heat dissipation effect is better.

[0099] Specifically, the first conductive terminal 71 has a terminal body 712 located outside the package body 75, the terminal body 712 is located on the first plane, the first end 711 is bent upward relative to the terminal body 712, the upper surface of the first end 711 is exposed to the outside of the package body 75, the bypass element 131 is disposed on the lower surface of the first end 711, and the conductor connecting piece 74 is located below the first end 711. One end of the conductor connecting piece 74 is connected to the bypass element 131, and the other end of the conductor connecting piece 74 is connected to the upper surface of the second end 721.

[0100] Example 8

[0101] Reference Fig.21 and Fig. 22As shown, the bypass module 8 of this embodiment is basically the same as the embodiment 7, except that the conductor connecting piece 81 has a welding section 811 and a heat dissipation section 812 lower than the welding section 811, the welding section 811 is connected to the bypass element 131 and the second end 85, the lower surface of the heat dissipation section 812 is exposed from the outer surface of the packaging body 84, and the lower surface of the heat dissipation section 812 and the upper surface of the first end 831 respectively form a heat dissipation surface 82. Through the lower surface of the heat dissipation section 812 and the upper surface of the first end 831, the heat dissipation area is further increased, and the heat dissipation effect is improved.

[0102] Example 9

[0103] Reference Fig.23 and Fig.24 As shown, the bypass module 9 of this embodiment is basically the same as the embodiment 7, except that the bypass module 9 also includes a radiator 91 disposed on the heat dissipation surface 93. Further, the radiator 91 includes a first radiator 911 and a second radiator 912, the first radiator 911 has a connecting plate 9111 and a side plate 9112 bent downward from the connecting plate 9111, the connecting plate 9111 is disposed above or below the bypass element packaging module 92 and is attached to the heat dissipation surface 93, the side plate 9112 is located on the side of the bypass element packaging module 92, the number of the side plates 9112 is two or two groups, and the bypass element packaging module 92 is located between the two or two groups of side plates. Specifically in this embodiment, the connecting plate 9111 is disposed above the bypass element packaging module 92, the number of the side plates 9112 is two, and the bypass element packaging module 92 is located between the two side plates 9112.

[0104] The second heat sink 912 is arranged above or below the bypass element packaging module 92. The second heat sink 912 includes a bottom plate 9121 and a plurality of ridges 9122 arranged on the bottom plate 9121. The design of the plurality of ridges 9122 can increase the heat dissipation surface area, enhance the heat dissipation effect, and improve the junction temperature capacity and thermal escape capacity of the photovoltaic bypass module. Specifically in this embodiment, the second heat sink 912 is arranged below the bypass element packaging module 92. It should be noted that in other embodiments, according to the actual current size and heat dissipation requirements, only the first heat sink or only the second heat sink can be used for heat dissipation.

[0105] Example 10

[0106] The bypass module 10 of this embodiment is basically the same as that of the embodiment 8, except that the bypass module 10 further includes a heat sink 101 disposed on the heat dissipation surface 103. Further, the heat sink 101 includes a first heat sink 1011 and a second heat sink 1012, the first heat sink 1011 has a connecting plate 10111 and a side plate 10112 bent downward from the connecting plate 10111, the connecting plate 10111 is disposed above or below the bypass element packaging module 102 and is attached to the heat dissipation surface 103, the side plate 10112 is located on the side of the bypass element packaging module 102, the number of the side plates 10112 is two or two groups, and the bypass element packaging module 102 is located between the two or two groups of side plates. Specifically in this embodiment, the connecting plate 10111 is disposed above the bypass element packaging module 102, the number of the side plates 10112 is two, and the bypass element packaging module 102 is located between the two side plates 10112.

[0107] The second heat sink 1012 is arranged above or below the bypass element packaging module 102. The second heat sink 1012 includes a bottom plate 10121 and a plurality of ridges 10122 arranged on the bottom plate 10121. The design of the plurality of ridges 10122 can increase the heat dissipation surface area, enhance the heat dissipation effect, and improve the junction temperature capacity and thermal escape capacity of the photovoltaic bypass module. Specifically in this embodiment, the second heat sink 1012 is arranged below the bypass element packaging module 102. It should be noted that in other embodiments, according to the actual current size and heat dissipation requirements, only the first heat sink or only the second heat sink can be used for heat dissipation.

[0108] As shown in this specification and claims, the terms "comprises" and "include" only indicate the inclusion of the steps and elements that have been clearly identified, and these steps and elements do not constitute an exclusive list, and the method or device may also include other steps or elements. The term "and / or" as used herein includes any combination of one or more of the relevant listed items.

[0109] It should be noted that, unless otherwise specified, when a feature is referred to as being "fixed" or "connected" to another feature, it may be directly fixed or connected to the other feature, or it may be indirectly fixed or connected to the other feature. In addition, the descriptions of up, down, left, right, etc. used in the present invention are only relative to the relative positional relationship of the components of the present invention in the drawings.

[0110] The above embodiment is only for illustrating the technical concept and features of the present invention, and is a preferred embodiment. Its purpose is to enable people familiar with the technology to understand the content of the present invention and implement it accordingly, and it cannot be used to limit the protection scope of the present invention. Any equivalent transformation or modification made according to the principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A bypass module of a photovoltaic assembly, comprising a first conductive terminal, a second conductive terminal and a bypass element packaging module disposed between the first conductive terminal and the second conductive terminal, wherein the bypass element packaging module comprises: a bypass element disposed on a first end portion of the first conductive terminal; a conductor connecting piece electrically connecting the bypass element and the second end of the second conductive terminal; A packaging body, which packages the first end, the second end, the bypass element and the conductor connection sheet; The invention is characterized in that at least one of the conductor connecting piece, the first end of the first conductive terminal and the second end of the second conductive terminal has a heat dissipation surface exposed from the upper surface or the lower surface of the package body; The conductor connecting piece has a welding section and a heat dissipation section lower than the welding section, the welding section is connected to the bypass element or the second end, the lower surface of the heat dissipation section is exposed from the outer surface of the package body, the lower surface of the heat dissipation section and the upper surface of the first end respectively form the heat dissipation surface, the conductor connecting piece has an extension section extending outside the package body, the extension section is stacked on the second conductive terminal, and a clearance groove is provided on the extension section, and the clearance groove corresponds to the busbar welding area of ​​the first conductive terminal; The bypass module also includes a first radiator, which has a connecting plate and a side plate bent upward or downward from the connecting plate, the connecting plate is arranged above or below the bypass element packaging module, the connecting plate is in contact with the heat dissipation surface, and the side plate is located in front of and behind the bypass element packaging module. The first radiator is in an I-shape, and the length of the side plate of the first radiator in the left-right direction is slightly shorter than the first conductive terminal, the second conductive terminal and the bypass element packaging module as a whole, and the left-right direction is the direction of the longer side of the first conductive terminal or the second conductive terminal.

2. The bypass module according to claim 1, characterized in that: The conductor connecting piece has a welding section and a heat dissipation section higher or lower than the welding section, the welding section is connected to the bypass element or the second end, and the upper surface or lower surface of the heat dissipation section is exposed from the outer surface of the packaging body to form the heat dissipation surface.

3. The bypass module according to claim 2, characterized in that: The conductor connecting plate has a plurality of heat dissipation segments.

4. The bypass module according to claim 3, characterized in that: The conductor connecting piece extends along the left-right direction of the bypass element packaging module, and the conductor connecting piece has a plurality of welding segments, and the plurality of welding segments are spaced apart along the left-right direction; the first conductive terminal and the second conductive terminal are spaced apart along the left-right direction, the bypass element is connected to at least one of the welding segments, and the second end is connected to at least another of the welding segments.

5. The bypass module according to claim 3, characterized in that: The conductor connecting piece extends along the front-to-back direction of the bypass element packaging module, and the conductor connecting piece has a plurality of welding segments, and the plurality of welding segments are arranged at intervals along the front-to-back direction; the first conductive terminal and the second conductive terminal extend along the left-to-right direction of the bypass element packaging module respectively, the bypass element is connected to at least one of the welding segments, and the second end is connected to at least another of the welding segments.

6. The bypass module according to claim 5, characterized in that: The second end portion has at least two pins extending in the left-right direction, and at least a portion of the first end portion is located between at least two of the pins; the conductor connecting plate has at least three welding segments arranged at intervals along the front-to-back direction, the middle welding segment is connected to the bypass element on the first end portion, and the welding segments on both sides are respectively connected to the second end portion.

7. The bypass module according to claim 3, characterized in that: The first end and the second end are located in a first plane, the heat dissipation section is located in a second plane, and the second plane is higher or lower than the first plane.

8. The bypass module according to claim 1, characterized in that: The first conductive terminal and / or the second conductive terminal are bent upward or downward, so that a portion of the surface of the first end portion and / or the second end portion is exposed outside the package to form the heat dissipation surface.

9. The bypass module according to claim 8, characterized in that: The first conductive terminal has a terminal body located outside the package body, the terminal body is located on a first plane, the first end is bent upward relative to the terminal body, the upper surface of the first end is exposed outside the package body, the bypass element is arranged on the lower surface of the first end, and the conductor connecting plate is located below the first end.

10. The bypass module according to claim 9, characterized in that: One end of the conductor connecting piece is connected to the bypass element, and the other end of the conductor connecting piece is connected to the upper surface of the second end.

11. The bypass module according to any one of claims 1 to 10, characterized in that: The bypass module also includes a second heat sink, which is arranged above or below the bypass element packaging module.

12. The bypass module according to any one of claims 1 to 10, characterized in that: The conductor connecting sheet is formed by integrally bending a metal sheet.

13. A junction box for a photovoltaic module, comprising a box body, characterized in that: The invention comprises a bypass module according to any one of claims 1 to 12, wherein the bypass module is arranged in the box body.

14. A photovoltaic assembly, comprising a solar panel and a junction box, characterized in that: The junction box includes the bypass module according to any one of claims 1 to 10, and the first conductive terminal and the second conductive terminal of the bypass module are respectively connected to the busbars on the solar cell panel.

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