A semiconductor chip packaging mechanism and process

Abstract

The present invention relates to the field of semiconductor chips, and specifically discloses a semiconductor chip packaging mechanism and process, including an operating platform horizontally placed on the ground, a conveyor belt is rotatably installed in a groove on the upper surface of the operating platform, and molds are placed at equal intervals above the conveyor belt, material trays are stacked on the upper surface of the operating platform, and a loading mechanism corresponding to the material tray is provided on the upper surface of the operating platform, and the semiconductor chip material in the material tray is placed into the placement mold by the loading mechanism; the placement mold is transported to the inside of a packaging bin fixedly installed in the middle position of the upper surface of the operating platform by the conveyor belt. The semiconductor chip packaging mechanism and process adopts a new structural design and is provided with a heat preservation mechanism. By heating the heat preservation plate, the heat preservation plate heats the extrusion mold attached to the upper surface, thereby maintaining the temperature of the extrusion mold, and preventing the epoxy resin inside from solidifying and affecting the overall fluidity due to cooling when not in operation.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chips, and in particular to a semiconductor chip packaging mechanism and process. Background Art

[0002] Semiconductor chips are highly integrated chips that are widely used in high-tech intelligent fields. During their production process, they need to be packaged using a packaging mechanism. Packaging refers to adding a protective structure to the outside of the chip to protect the high-precision devices inside. Common packaging methods include epoxy resin injection and welding.

[0003] In the prior art, a Chinese patent with publication number CN116884881A discloses a semiconductor packaging device for semiconductor chip production, including a packaging platform and a packaging mechanism fixed on the top of the packaging platform, a suction heating component is fixed on the top of the inner cavity of the packaging platform, a heat-conducting component is fixed on the outer wall of the output end of the packaging mechanism, and the heat-conducting component includes a sleeve and a spiral blade fixed on the outer wall of the output end of the packaging mechanism, and the outer wall of the spiral blade is in abutment with the inner wall of the sleeve. The present invention can suck the harmful gas generated during packaging through the suction heating component, and heat the harmful gas to increase the temperature. The heated hot gas can heat the packaging mechanism through the heat-conducting component, so that the mold sealing liquid discharged from the packaging mechanism can maintain good fluidity, improve the uniformity of the distribution of the mold sealing liquid, and improve the packaging quality. The exhaust pipe can discharge the harmful hot air to other areas to improve the air quality of the packaging area.

[0004] During use, the above-mentioned device utilizes a packaging mechanism to package the chip, and the packaging mechanism needs to be heated. However, after a chip is packaged, a worker is required to perform unloading and loading operations. During this process, if the packaging mechanism stops heating, it will cool down and affect the fluidity of the epoxy resin. If it continues to heat, heat will be wasted.

[0005] In the prior art, a Chinese patent with publication number CN113539902A discloses a packaging structure for a semiconductor chip. In the chip processing industry, it is usually necessary to culture multiple chips separately and assemble them at intervals through a punched silicon wafer to achieve the function under the conditions of smaller volume and area, but the processing is difficult and the scrap rate is high. The transfer diffusion device is installed and fixed on the installation body, the assembly device is installed and fixed on the installation body, the packaging structure is installed and fixed on the installation body, the installation body is installed with other devices and culture circuit devices on the chip, the transfer diffusion device provides transportation and cutting of the entire silicon wafer and separates the single silicon wafers from each other after cutting to generate more circuits to improve space utilization, the assembly device realizes the splicing and assembly of the packaging structure into a packaging structure to realize 3D packaging, completes the function of replacing a single damaged chip, reduces production costs and improves heat dissipation efficiency.

[0006] During the chip packaging process, certain harmful gases will be generated due to high temperature. If the harmful gases are directly discharged without purification, they will pollute the surrounding environment and will also harm the health of workers if inhaled. Summary of the invention

[0007] The purpose of the present invention is to provide a semiconductor chip packaging mechanism and process to solve the problems of heat waste caused by cooling of the heating component and environmental pollution caused by harmful gases proposed in the above-mentioned background technology.

[0008] To achieve the above object, the present invention provides the following technical solutions: a semiconductor chip packaging mechanism and process, comprising an operating platform horizontally placed on the ground, a conveyor belt rotatably installed in a groove on the upper surface of the operating platform, and molds are placed at equal intervals above the conveyor belt, and also includes:

[0009] The upper surface of the operating platform is stacked with material trays, and the upper surface of the operating platform is provided with a loading mechanism corresponding to the material trays, and the loading mechanism is used to put the semiconductor chip materials in the material trays into the placement mold;

[0010] The placed mold is conveyed by a conveyor belt to the inside of a packaging bin fixedly installed in the middle position of the upper surface of the operating platform, wherein a glue injection packaging mechanism is provided inside the packaging bin, and the semiconductor chip in the placed mold is packaged by the glue injection packaging mechanism;

[0011] The packaging bin is provided with a heat preservation mechanism inside, and the heat preservation mechanism is used to heat and preserve the glue injection packaging mechanism, so as to prevent the epoxy resin used for packaging from solidifying and agglomerating.

[0012] Preferably, the loading mechanism comprises a support plate and a first telescopic cylinder for driving the support plate to move up and down, and a fixed suction cup for adsorbing the semiconductor chip by negative pressure is installed below the front end of the support plate.

[0013] Preferably, a limiting slider is fixedly installed on the upper surface of the fixed suction cup to drive it to move, and a moving screw driven by a motor is threadedly installed inside the limiting slider, and a sliding structure is formed between the limiting slider and the limiting sliding groove opened inside the support plate.

[0014] Preferably, the glue injection packaging mechanism includes two cyclically working extrusion dies and a second telescopic cylinder driving the extrusion dies to move up and down, and a communication structure is formed between the extrusion dies and a raw material box fixedly installed inside the packaging bin.

[0015] Preferably, a driven gear is coaxially fixedly mounted on the bottom end of the second telescopic cylinder, and the driven gear is meshingly connected with a driving gear on the inner side of the packaging bin.

[0016] Preferably, the insulation mechanism for heating the extrusion die includes an insulation plate fixedly mounted on the upper surface of the operating platform, and filter cotton is fixedly mounted inside the insulation plate, and the insulation plate forms a connecting structure with the purification mechanism inside the packaging bin through a conveying pipeline.

[0017] Preferably, the purification mechanism includes a purification box fixed to the inner wall of the packaging bin, the purification box is filled with chemical agents, a baffle with through holes is fixedly installed inside the purification box, and a heater for heating the chemical agents is fixedly installed inside the purification box, and a negative pressure pump for adsorbing harmful gases is connected to the front side of the purification box.

[0018] Preferably, a feeding box is fixedly mounted on the upper surface of the packaging bin, and the feeding box is connected to the purification box through a first connecting pipe on the side, and a pressure valve is arranged outside the first connecting pipe.

[0019] Preferably, the feeding box forms a connecting structure with the airbag fixedly installed on the upper surface of the support plate through a second connecting pipe fixedly installed on the upper surface of the support plate, and an air intake pipe is installed through the upper surface of the airbag, and a one-way valve is provided on the outside of the air intake pipe and the second connecting pipe, and the airbag is squeezed by using an extrusion plate fixedly installed on the upper end of the limiting slider.

[0020] Compared with the prior art, the beneficial effect of the present invention is that the semiconductor chip packaging mechanism and process adopt a new structural design.

[0021] A heat preservation mechanism is provided to heat the heat preservation plate so that the heat preservation plate heats the extrusion die attached to the upper surface, thereby maintaining the temperature of the extrusion die to prevent the die from cooling down when not in operation and causing the solidification of the epoxy resin inside to affect the overall fluidity;

[0022] Furthermore, the extrusion dies are arranged to be two symmetrical ones, and the extrusion dies are driven to rotate by the meshing transmission between the driving gear and the driven gear, so that the two extrusion dies are switched for cyclic use, and the extrusion dies are attached to the upper surface of the insulation board for insulation when they are resting;

[0023] Furthermore, the heat of the insulation board comes from the heat of the purified exhaust gas. During the packaging process, a negative pressure pump is used to suck the generated harmful gases into the purification box, and the purpose of purification is achieved through chemical reactions with the chemical substances inside the purification box. The heater inside the purification box heats the chemical solution, thereby increasing the activity of the chemical reaction. The purified gas enters the insulation board with the heat.

[0024] A loading mechanism is provided, and the first telescopic cylinder drives the support plate to move up and down, so that the chip product is adsorbed by the fixed suction cup, and then the fixed suction cup is moved by the movable screw rod to realize automatic loading (that is, the chip product is placed inside the mold), and the machine is used to replace manual labor, thereby reducing the workload of personnel;

[0025] Furthermore, when the limit slider drives the fixed suction cup to move, it also drives the extrusion plate to move, so that the extrusion plate squeezes the airbag. At this time, the air in the airbag enters the feeding box through the second connecting pipe, thereby increasing the air pressure inside the feeding box, and adding the chemical liquid raw materials into the purification box to ensure the concentration of the chemical liquid inside the purification box.

[0026] Furthermore, a one-way valve is provided on the outside of the air intake pipe and the second delivery pipe, so that the airbag can re-inhale air through the air intake pipe when it recovers its deformation, but will not discharge air from the air intake pipe, ultimately making the airflow flow in one direction to ensure the normal operation of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0028] Figure 2 It is a schematic diagram of the conveyor belt structure of the present invention;

[0029] Figure 3 This is a schematic diagram of the internal structure of the packaging bin of the present invention;

[0030] Figure 4 This is a schematic diagram of the bottom structure of the packaging bin of the present invention;

[0031] Figure 5 This is a schematic diagram of the internal structure of the purification box of the present invention;

[0032] Figure 6 This is a schematic diagram of the connection relationship between the extrusion die and the raw material box of the present invention;

[0033] Figure 7This is a bottom view of the structure of the support plate of the present invention;

[0034] Figure 8 This is a schematic diagram of the cross-sectional structure of the support plate of the present invention;

[0035] Fig. 9 It is a structural schematic diagram of the connection relationship between the purification box, the charging box and the airbag of the present invention.

[0036] In the figure: 1. operating platform; 2. conveyor belt; 3. mold placement; 4. material tray; 5. first telescopic cylinder; 6. support plate; 7. fixed suction cup; 8. limit slider; 9. moving screw rod; 10. limit slide; 11. packaging bin; 12. extrusion mold; 13. second telescopic airbag; 14. insulation board; 15. purification box; 16. heater; 17. barrier plate; 18. conveying pipeline; 19. filter cotton; 20. negative pressure pump; 21. raw material box; 22. driven gear; 23. driving gear; 24. feeding box; 25. first connecting pipe; 26. second connecting pipe; 27. airbag; 2701, air intake pipe; 28. extrusion plate. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Embodiment 1

[0038] See also Figure 1-Figure 2 , Figure 7-Figure 8 The present invention provides a feeding mechanism in a semiconductor chip packaging mechanism, which automatically feeds chip materials, and specifically discloses: an operating platform 1 horizontally placed on the ground, a conveyor belt 2 is rotatably installed in a groove on the upper surface of the operating platform 1, and molds 3 are placed at equal intervals above the conveyor belt 2, material trays 4 are stacked on the upper surface of the operating platform 1, and a feeding mechanism corresponding to the material tray 4 is provided on the upper surface of the operating platform 1, and the semiconductor chip material in the material tray 4 is placed into the mold 3 by means of the feeding mechanism; the feeding mechanism includes a support plate 6 and a first telescopic cylinder 5 that drives the support plate 6 to move up and down, and a fixed suction cup 7 that uses negative pressure to adsorb the semiconductor chip is installed below the front end of the support plate 6, a limiting slider 8 that drives it to move is fixedly installed on the upper surface of the fixed suction cup 7, and a moving screw rod 9 driven to rotate by a motor is installed through a thread inside the limiting slider 8, and a sliding structure is formed between the limiting slider 8 and a limiting slide groove 10 opened inside the support plate 6.

[0039] When using the device, first place the prepared material tray 4 on the upper surface of the operating platform 1, and then turn on the device. At this time, the first telescopic cylinder 5 works to drive the support plate 6 to move downward, and the support plate 6 is used to drive the fixed suction cup 7 below to move to the position of the material tray 4 and adsorb the prepared chip, and then the chip is lifted. At the same time, the motor drives the moving screw 9 to rotate. During the rotation process, the moving screw 9 uses the limit slider 8 installed with a thread through its outside to drive the fixed suction cup 7 to move, so that the fixed suction cup 7 moves the chip to the top of the placement mold 3, and finally places the chip in the groove of the placement mold 3. After that, the conveyor belt 2 rotates to move the placement mold 3 to the inside of the packaging bin 11 (fixed by the convex block on the inner side of the operating platform 1). Embodiment 2

[0040] See also Figure 3-Figure 4 , Figure 5-Figure 6 The present invention provides a feeding mechanism in a semiconductor chip packaging mechanism, which automatically feeds chip materials, and specifically discloses: using a conveyor belt 2 to transport a placement mold 3 to the inside of a packaging bin 11 fixedly installed at a middle position on the upper surface of an operating platform 1, a glue injection packaging mechanism is provided inside the packaging bin 11, and the semiconductor chip in the placement mold 3 is packaged by the glue injection packaging mechanism; a heat preservation mechanism is provided inside the packaging bin 11, and the heat preservation mechanism is used to heat and keep the glue injection packaging mechanism warm to prevent the epoxy resin used for packaging from solidifying and agglomerating, a driven gear 22 is coaxially fixedly installed at the bottom end of a second telescopic cylinder 13, and the driven gear 22 is meshedly connected with a driving gear 23 inside the packaging bin 11, and the glue injection packaging mechanism includes two cyclically working extrusion molds 12 and a driving gear 23 that drives the extrusion mold 12 up and down. The movable second telescopic cylinder 13 forms a connecting structure between the extrusion die 12 and the raw material box 21 fixedly installed inside the packaging bin 11. The heat preservation mechanism for heating the extrusion die 12 includes a heat preservation plate 14 fixedly installed on the upper surface of the operating platform 1, and a filter cotton 19 is fixedly installed inside the heat preservation plate 14, and the heat preservation plate 14 forms a connecting structure with the purification mechanism inside the packaging bin 11 through a conveying pipe 18. The purification mechanism includes a purification box 15 fixed on the inner wall of the packaging bin 11, and the purification box 15 is filled with chemical agents, and a baffle plate 17 with through holes is fixedly installed inside the purification box 15, and a heater 16 for heating the chemical agents is fixedly installed inside the purification box 15, and a negative pressure pump 20 for adsorbing harmful gases is connected to the front side of the purification box 15.

[0041] After the mold 3 is fixed in the packaging bin 11, the second telescopic cylinder 13 is turned on to drive the extrusion mold 12 to move downward, and the chip inside the mold 3 is extruded and placed by the extrusion mold 12 and epoxy resin is injected (after the processing is completed, the second telescopic cylinder 13 contracts to drive the extrusion mold 12 to move upward, so that the driven gear 22 moves to a position meshing with the driving gear 23, and the transmission between the driving gear 23 and the driven gear 22 drives the extrusion mold 12 to rotate, thereby switching the cycle work). When the extrusion mold 12 is not working, it fits the upper surface of the insulation board 14. At this time, the negative pressure pump 20 is turned on to suck the harmful gas generated during packaging into the purification box 15 (the heater 16 inside the purification box 15 heats the chemical liquid, so that the heated liquid purifies the harmful gas, and the barrier plate 17 slows down the flow speed of the gas). The purified gas enters the insulation board 14 through the delivery pipe 18, heats the insulation board 14, and makes the insulation board 14 heat and insulate the extrusion mold 12 to prevent it from cooling when not working and affecting the fluidity of the epoxy resin inside the extrusion mold 12. Embodiment 3

[0042] See also Figure 1 , Figure 7-Figure 9 The present invention provides a feeding mechanism in a semiconductor chip packaging mechanism, which automatically feeds chip materials, and specifically discloses: a feeding box 24 is fixedly installed on the upper surface of the packaging bin 11, and the feeding box 24 forms a communication structure with the purification box 15 through a first connecting pipe 25 on the side, and a pressure valve is arranged outside the first connecting pipe 25, and the feeding box 24 forms a communication structure with a blast airbag 27 fixedly installed on the upper surface of the support plate 6 through a second connecting pipe 26 fixedly installed on the upper surface, and an air intake pipe 2701 is installed through the upper surface of the blast airbag 27, and a one-way valve is arranged outside the air intake pipe 2701 and the second connecting pipe 26, and the blast airbag 27 is squeezed by the squeezing plate 28 fixedly installed on the upper end of the limit slider 8.

[0043] In the process of the limit slider 8 driving the fixed suction cup 7 to move, the extrusion plate 28 above the limit slider 8 moves synchronously to squeeze the airbag 27 above the support plate 6. When the airbag 27 is squeezed, the air inside enters the feeding box 24 through the second connecting pipe 26. At this time, the pressure inside the feeding box 24 increases, and the internal chemical liquid is squeezed into the purification box 15 through the first connecting pipe 25, thereby ensuring the concentration of the liquid inside the purification box 15. When the extrusion plate 28 leaves the airbag 27, the airbag 27 recovers its deformation under the action of its own elasticity, and at this time, the air is re-inhaled using the intake pipe 2701.

[0044] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor chip packaging mechanism, comprising an operating platform (1) placed horizontally on the ground, a conveyor belt (2) rotatably mounted in a groove on the upper surface of the operating platform (1), and molds (3) are placed at equal intervals above the conveyor belt (2), characterized in that: Also includes: Material trays (4) are stacked and placed on the upper surface of the operating platform (1), and a loading mechanism corresponding to the material trays (4) is provided on the upper surface of the operating platform (1), and the loading mechanism is used to place the semiconductor chip material in the material trays (4) into the placement mold (3); The placement mold (3) is conveyed by means of a conveyor belt (2) to the interior of a packaging bin (11) fixedly mounted at a middle position on the upper surface of the operating platform (1); a glue injection packaging mechanism is provided inside the packaging bin (11); and the semiconductor chip in the placement mold (3) is packaged by means of the glue injection packaging mechanism; The packaging bin (11) is provided with a heat preservation mechanism inside, and the heat preservation mechanism is used to heat and preserve the glue injection packaging mechanism, so as to prevent the epoxy resin used for packaging from solidifying and agglomerating; The loading mechanism comprises a support plate (6) and a first telescopic cylinder (5) for driving the support plate (6) to move up and down, and a fixed suction cup (7) for adsorbing the semiconductor chip by using negative pressure is installed below the front end of the support plate (6); The glue injection packaging mechanism comprises two cyclically operating extrusion dies (12) and a second telescopic cylinder (13) for driving the extrusion dies (12) to move up and down, and a communication structure is formed between the extrusion dies (12) and a raw material box (21) fixedly installed inside the packaging bin (11); A driven gear (22) is coaxially fixedly mounted on the bottom end of the second telescopic cylinder (13), and the driven gear (22) is meshingly connected with a driving gear (23) inside the packaging bin (11); The heat preservation mechanism for heating the extrusion die (12) comprises a heat preservation plate (14) fixedly mounted on the upper surface of the operating platform (1), a filter cotton (19) fixedly mounted inside the heat preservation plate (14), and the heat preservation plate (14) forms a communication structure with the purification mechanism inside the packaging bin (11) via a conveying pipe (18); The purification mechanism comprises a purification box (15) fixed to the inner wall of the packaging bin (11), wherein chemical agents are contained in the purification box (15), a baffle plate (17) with through holes is fixedly installed in the purification box (15), and a heater (16) for heating the chemical agents is fixedly installed in the purification box (15), and a negative pressure pump (20) for adsorbing harmful gases is connected to the front side of the purification box (15).

2. A semiconductor chip packaging structure according to claim 1, characterized in that: A limit slider (8) is fixedly mounted on the upper surface of the fixed suction cup (7) to drive the fixed suction cup (7) to move, and a movable screw rod (9) driven to rotate by a motor is threadedly mounted inside the limit slider (8), and a sliding structure is formed between the limit slider (8) and a limit slide groove (10) provided inside the support plate (6).

3. The semiconductor chip packaging structure according to claim 1, characterized in that: A feeding box (24) is fixedly mounted on the upper surface of the packaging bin (11), and the feeding box (24) forms a communication structure with the purification box (15) via a first connecting pipe (25) on the side, and a pressure valve is arranged outside the first connecting pipe (25).

4. A semiconductor chip packaging structure according to claim 3, characterized in that: The charging box (24) forms a communication structure with the airbag (27) fixedly mounted on the upper surface of the support plate (6) through a second connecting pipe (26) fixedly mounted on the upper surface, and an air intake pipe (2701) is installed through the upper surface of the airbag (27), and one-way valves are provided on the outside of the air intake pipe (2701) and the second connecting pipe (26), and the airbag (27) is squeezed by a squeezing plate (28) fixedly mounted on the upper end of the limit slider (8).

5. A semiconductor chip packaging process, using a semiconductor chip packaging mechanism as claimed in claim 1, characterized in that: The following steps are involved: Package substrate preparation: Prepare the package substrate, which is supported by plastic, ceramic or metal materials for mounting and connecting chips; Chip testing: Before packaging, the manufactured semiconductor chips are tested using testing equipment to ensure that they operate normally and function properly; Bonding: Bond the chip to the packaging substrate, and use welding or adhesive to connect and fix the chip and the substrate; Wire connection: Use metal wires to connect the chip to the pins on the package substrate to achieve the connection between the chip and the external circuit; Packaging material injection: The packaging material is injected into the packaging substrate, thereby completely encapsulating the chip inside, protecting the chip from the influence of the external environment and achieving the purpose of buffer protection.

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