Array substrate, method for preparing array substrate, and display device

Abstract

The present application discloses an array substrate, a method for preparing the array substrate, and a display device. The array substrate includes a substrate, a second insulating layer, an organic flat layer, and a transparent electrode layer. The array substrate also includes a plurality of metal repair lines arranged in a crisscross pattern. The metal repair lines are arranged on a side of the organic flat layer close to the transparent electrode layer, and the projection of the metal repair lines on the substrate covers the projection of the scanning line and the data line on the substrate. The overlap between the two metal repair lines is the coincidence point. The metal repair lines are divided into a plurality of cutting parts and a plurality of main parts. The plurality of cutting parts and the plurality of main parts are staggeredly connected. The cutting parts are located on a side of the main part close to the coincidence point. The line width of the metal repair line corresponding to the cutting part is smaller than the line width of the metal repair line corresponding to the main part. Through the above design, it is avoided that when the metal repair line is laser cut, the organic flat layer is deformed or discolored due to excessive energy, the repair effect of the array substrate is improved, and the display abnormality of the display panel is avoided.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to an array substrate, a method for preparing the array substrate, and a display device. Background Art

[0002] Electronic paper display panels are ultra-thin and ultra-light display screens. Currently, their most common application is e-book reading devices, which have the advantages of bright colors and high resolution. Electronic paper display panels display colors by driving particles to move through the upper and lower transparent electrode layers of the array substrate and the electronic film. In large-size electronic paper display panels, in order to avoid crosstalk between the transparent electrode and the underlying metal layer and to reduce power consumption, an organic flat layer is added between the second insulating layer and the transparent electrode layer to reduce the parasitic capacitance between the transparent electrode and the underlying metal layer.

[0003] When testing the array substrate after the manufacturing process is completed, the scan lines and data lines may be broken. Therefore, metal repair lines are added to the organic planar layer to repair the scan lines or data lines that have broken. During the repair, it is necessary to cut the metal repair lines and weld the metal repair lines and the broken data lines or scan lines. During cutting and welding, the laser of the equipment will cause the organic planar layer to deform or discolor, resulting in abnormal display of the display panel. Summary of the invention

[0004] The purpose of the present application is to provide an array substrate, a method for preparing an array substrate and a display device, so as to avoid deformation or discoloration of the organic flat layer caused by excessive energy when repairing the laser-cut metal repair line, improve the repair effect of the array substrate, and avoid display abnormalities of the display panel.

[0005] The present application discloses an array substrate, which includes a substrate, and a first metal layer, a first insulating layer, a second metal layer, a second insulating layer, an organic flat layer and a transparent electrode layer sequentially arranged on the substrate; the array substrate also includes a data line and a scan line, the first metal layer includes a scan line or a data line, the second metal layer includes a data line or the scan line, and the data line and the scan line are arranged in different layers, and the data line and the scan line are arranged in a crisscross manner to define a pixel unit; the array substrate also includes a plurality of metal repair lines arranged in a crisscross manner, the metal repair lines are arranged on a side of the organic flat layer close to the transparent electrode layer, and the projection of the metal repair lines on the substrate covers the projection of the scan line and the data line on the substrate, and the overlap between two metal repair lines arranged in a crisscross manner is a coincidence point;

[0006] The metal repair line is divided into multiple cutting parts and multiple main parts, the multiple cutting parts and the multiple main parts are staggered and connected, the cutting parts are located on the side of the main part close to the overlapping point; the line width of the metal repair line corresponding to the cutting part is smaller than the line width of the metal repair line corresponding to the main part.

[0007] Optionally, the cutting portion includes a first notch and a second notch, the first notch and the second notch are respectively arranged on both sides of the metal repair line in the line width direction, and the orientation of the first notch and the orientation of the second notch are opposite to each other.

[0008] Optionally, the cutting portion further includes a third notch and a fourth notch, the third notch and the fourth notch are respectively arranged on both sides of the metal repair line in the line width direction, and the direction of the third notch and the direction of the fourth notch are arranged opposite to each other;

[0009] The first notch and the third notch are located on the same side, and the first notch and the third notch are spaced apart from each other; the second notch and the fourth notch are located on the same side, and the second notch and the fourth notch are spaced apart from each other.

[0010] Optionally, the cutting portion includes a first sub-metal wire and a second sub-metal wire, two ends of the first sub-metal wire are respectively connected to the two main bodies, and two ends of the second sub-metal wire are respectively connected to the two main bodies; a gap is provided between the first sub-metal wire and the second sub-metal wire;

[0011] A sum of a line width of the first sub-metal line and a line width of the second sub-metal line is smaller than a line width of the main body.

[0012] Optionally, each of the metal repair lines includes a plurality of first connection areas, and each of the main body portions corresponds to one first connection area;

[0013] At least one first through hole is disposed on the organic planar layer, and an orthographic projection of the first connection region on the substrate covers an orthographic projection of the first through hole on the substrate.

[0014] Optionally, each of the metal repair lines includes a plurality of second connection areas, each of the main body portions corresponds to one second connection area, and the first connection area is not connected to the second connection area;

[0015] At least one second through hole is disposed on the organic planar layer, the orthographic projection of the second connection area on the substrate covers the orthographic projection of the second through hole on the substrate, and the first through hole is not connected to the second through hole.

[0016] Optionally, an annular through hole is further provided on the organic planar layer, and the annular through hole is provided around the first through hole.

[0017] The present application also discloses a method for preparing an array substrate, which is characterized in that it is used to prepare the array substrate, and the method for preparing the array substrate comprises the steps of:

[0018] forming a first metal layer, a first insulating layer, a second metal layer, a second insulating layer and an organic planarization layer in sequence on a substrate;

[0019] forming a plurality of metal repair lines arranged in a crisscross pattern on the organic planar layer;

[0020] forming a transparent electrode layer on the metal repair line;

[0021] Among them, the first metal layer includes a scan line or a data line, the second metal includes a data line or the scan line, and the data line and the scan line are arranged in different layers, the projection of the metal repair line on the substrate covers the projection of the scan line and the data line on the substrate, and the overlapping part between the two metal repair lines arranged in a criss-cross manner is the coincidence point; the metal repair line is divided into a plurality of cutting parts and a plurality of main parts, and the plurality of cutting parts and the plurality of main parts are staggered and connected, and the cutting part is located on the side of the main part close to the coincidence point; the line width of the metal repair line corresponding to the cutting part is smaller than the line width of the metal repair line corresponding to the main part.

[0022] Optionally, between the step of forming a plurality of metal repair lines arranged in a crisscross pattern on the organic planar layer and the step of forming a transparent electrode layer on the metal repair lines, the following steps are further included:

[0023] forming at least one first through hole on the organic planar layer;

[0024] Each of the metal repair lines includes a plurality of first connection areas, each of the main body parts corresponds to one first connection area; and the orthographic projection of the first connection area on the substrate covers the orthographic projection of the first through hole on the substrate.

[0025] The present application also discloses a display device, which includes a backlight module and a display panel. The backlight module provides backlight for the array substrate. The display panel includes an opposing substrate and an array substrate. The opposing substrate and the array substrate are arranged opposite to each other.

[0026] Compared with the solution of making the line width of the entire metal repair line consistent, the present application provides a cutting portion on the metal repair line, and the line width of the cutting portion is smaller than the line width of the main portion. The main portion is used to connect the disconnected data line or scan line. Since the line width of the cutting portion is smaller, the energy required for laser cutting is also less, thereby avoiding the problem of excessive laser energy causing deformation or discoloration of the organic flat layer during laser cutting, avoiding poor display problems at the cutting position, and improving the repair effect of the array substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The included drawings are used to provide a further understanding of the embodiments of the present application, which constitute a part of the specification, are used to illustrate the implementation methods of the present application, and together with the text description, explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. In the drawings:

[0028] Figure 1 is a schematic diagram of a display device according to an embodiment of the present application;

[0029] Figure 2 is a cross-sectional schematic diagram of an array substrate according to the first embodiment of the present application;

[0030] Figure 3 is a plan view of an array substrate according to the first embodiment of the present application;

[0031] Figure 4 A partially enlarged schematic diagram of an array substrate according to the first embodiment of the present application;

[0032] Figure 5 is a schematic diagram of a cutting portion including two cutting points in the first embodiment of the present application;

[0033] Figure 6 is a schematic diagram of a connection area of ​​the first embodiment of the present application;

[0034] Figure 7 is a schematic diagram of a first through hole in the first embodiment of the present application;

[0035] Figure 8 is a schematic diagram of a third through hole of the first embodiment of the present application;

[0036] Fig. 9 is a schematic diagram of a first embodiment of the present application including two connection areas on a main body;

[0037] Fig.10 is a schematic diagram of a first through hole and a second through hole in the first embodiment of the present application;

[0038] Fig.11 is a schematic diagram of an array substrate according to a second embodiment of the present application;

[0039] Fig.12 is a schematic diagram of a method for preparing an array substrate according to an embodiment of the present application;

[0040] Fig.13 It is a process schematic diagram of a method for preparing an array substrate according to an embodiment of the present application.

[0041] Among them, 10, display device; 20, backlight module; 30, display panel; 31, opposing substrate; 32, array substrate; 41, display area; 42, non-display area; 100, substrate; 110, first metal layer; 120, first insulating layer; 130, second metal layer; 140, second insulating layer; 150, organic flat layer; 151, first through hole; 152, second through hole; 153, annular through hole; 154, third through hole hole; 161, data line; 162, scan line; 200, transparent electrode layer; 300, metal repair line; 310, main body; 311, first connection area; 312, second connection area; 400, cutting part; 410, first notch; 420, second notch; 430, third notch; 440, fourth notch; 451, first sub-metal line; 452, second sub-metal line; 510, driving chip; 610, common electrode line. DETAILED DESCRIPTION

[0042] It should be understood that the terms used herein, the specific structures and functional details disclosed are only for describing specific embodiments and are representative, but the present application can be implemented in many alternative forms and should not be construed as being limited to only the embodiments described herein.

[0043] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating relative importance or implicitly indicating the number of technical features indicated. Therefore, unless otherwise specified, features defined as "first" and "second" may explicitly or implicitly include one or more of the features; "plurality" means two or more. The term "including" and any variation thereof means non-exclusive inclusion, and one or more other features, integers, steps, operations, units, components and / or combinations thereof may exist or be added.

[0044] In addition, terms indicating orientation or positional relationships, such as “center,” “lateral,” “up,” “down,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inside,” and “outside,” are described based on the orientation or relative positional relationships shown in the accompanying drawings and are merely simplified descriptions for the convenience of describing the present application. They do not indicate that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limitations on the present application.

[0045] In addition, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be internally connected between two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0046] The present application is described in detail below with reference to the accompanying drawings and optional embodiments.

[0047] Figure 1 is a schematic diagram of a display device according to an embodiment of the present application. Figure 1 As shown, the present application discloses a display device 10, which includes a backlight module 20 and a display panel 30. The backlight module 20 provides backlight for the array substrate 32. The display panel 30 includes an opposing substrate 31 and an array substrate 32. The opposing substrate 31 and the array substrate 32 are arranged relative to each other.

[0048] Among them, the backlight module 20 includes a direct-type backlight module 20 or an edge-type backlight module 20, which is not limited here. The display panel 30 includes an electronic paper display panel 30 and a TN (Twisted Nematic) display panel 30, an IPS (In-Plane Switching) display panel 30, a VA (Vertical Alignment) display panel 30, an MVA (Multi-Domain Vertical Alignment) display panel 30. Of course, it can also be other types of display panels 30, such as an OLED (Organic Light-Emitting Diode) display panel 30, which can be applicable to the above solution.

[0049] The present application also discloses an array substrate 32, which can be used in the display device 10 described above. For the array substrate 32, the present application provides the following design, which is specifically introduced through several embodiments:

[0050] Embodiment 1:

[0051] Figure 2 is a cross-sectional schematic diagram of an array substrate according to the first embodiment of the present application, Figure 3 is a plan view of an array substrate according to the first embodiment of the present application. Figure 4 A partially enlarged schematic diagram of an array substrate according to the first embodiment of the present application is shown in FIG. Figure 2-4 As shown, Figure 3 Only the repair line 300 and the common electrode line 610 are shown. This embodiment discloses an array substrate 32, which includes a substrate 100, and a first metal layer 110, a first insulating layer 120, a second metal layer 130, a second insulating layer 140, an organic planar layer 150 and a transparent electrode layer 200 arranged in sequence on the substrate 100; the array substrate 32 also includes a data line 162 and a scan line 161, the first metal layer 110 includes a scan line 161 or a data line 162, the second metal includes a data line 162 or the scan line 161, and the data line 162 and the scan line 161 are arranged in different layers, and the data line 162 and the scan line 161 are arranged in a criss-cross manner to define a pixel unit.

[0052] The array substrate 32 also includes a display area 41 and a non-display area 42, and the non-display area 42 is arranged around the display area 411. The array substrate 32 also includes at least one driving chip 510, and the data line 161 and the scan line 162 are both connected to the driving chip 510. The specific connection method can be designed according to needs and is not limited here. The array substrate 32 also includes a common electrode line 610, and the common electrode line 610 is also connected to the driving chip 510.

[0053] The active switch in the array substrate 32 includes a bottom gate structure and a top gate structure. When the active switch is a bottom gate structure, the first metal layer 110 includes a scan line 161, and the second metal layer 130 includes a data line 162; when the active switch is a top gate structure, the first metal layer 110 includes a data line 162, and the second metal layer 130 includes a scan line 161. The present application takes the structure of the active switch as an example of a bottom gate structure, that is, the first metal layer 110 includes a scan line 161, and the second metal layer 130 includes a data line 162 for explanation.

[0054] The array substrate 32 also includes a plurality of metal repair lines 300 arranged in a criss-cross pattern. The metal repair lines 300 are arranged on a side of the organic planar layer 150 close to the transparent electrode layer 200, and the projections of the metal repair lines 300 on the substrate 100 cover the projections of the scanning lines 161 and the data lines 162 on the substrate 100. The overlapping parts of the two metal repair lines 300 arranged in a criss-cross pattern are coincidence points.

[0055] The metal repair line 300 is divided into a plurality of cutting parts 400 and a plurality of main parts 310, and the plurality of cutting parts 400 and the plurality of main parts 310 are staggeredly connected, and the cutting part 400 is located on the side of the main part 310 close to the overlapping point; the line width of the metal repair line 300 corresponding to the cutting part 400 is smaller than the line width of the metal repair line 300 corresponding to the main part 310.

[0056] The metal repair line 300 can be divided into a horizontally arranged metal repair line 300 and a vertically arranged metal repair line 300. The projection of the horizontally arranged metal repair line 300 on the substrate 100 covers the scan line 161 below, and the projection of the vertically arranged metal repair line 300 on the substrate 100 covers the data line 162 below.

[0057] Among them, repair lines 300 are also set in the non-display area 42 corresponding to the data lines 161 and the scan lines 162, and in the non-display area 42, the repair lines 300 above the data lines 161 are projected to cover the data lines 161, and the repair lines 300 above the scan lines 162 are projected to cover the scan lines 162, and the repair lines 300 in the display area 411 are not connected to the repair lines 300 in the non-display area 42.

[0058] In the existing solutions, when making the repair lines of the data lines 162 or the scan lines 161, the repair lines of the data lines 162 and the repair lines of the scan lines 161 are usually prepared in layers, which will cause the film layer of the array substrate 32 to become thicker and the process will also be increased. However, the present application makes the metal repair lines 300 of the data lines 162 and the scan lines 161 in the same layer. For example, when the data line 162 is broken, it is only necessary to laser weld the metal repair line 300 above the broken position and the data lines 162 on both sides of the broken position, and then laser cut the metal repair line 300 connected to the broken data line 162 and other metal repair lines 300 to complete the repair. The solution of the present application does not require two layers of metal repair lines 300 and has fewer processes.

[0059] Compared with the solution of making the line width of the entire metal repair line 300 consistent, the present application sets a cutting portion 400 on the metal repair line 300, and the line width of the cutting portion 400 is smaller than the line width of the main body 310. The main body 310 is used to connect the disconnected data line 162 or the scanning line 161. Since the line width of the cutting portion 400 is smaller, the energy required for laser cutting is also less, thereby avoiding the problem of excessive laser energy causing deformation or discoloration of the organic planarizing layer 150 during laser cutting, avoiding poor display problems at the cutting position, and improving the repair effect of the array substrate 32.

[0060] Exemplary: Figure 3 Point L in the middle is the broken position of the data line 162. The metal repair line 300 points A, B, C and D are cut by laser, and then points E and F are laser welded to repair the data line 162. Point A, B, C and D are all cutting parts 400. In short, the present application provides cutting parts 400 on the metal repair lines 300 corresponding to the four sides of the overlapping points.

[0061] Among them, the cutting portion 400 includes a first notch 410 and a second notch 420, and the first notch 410 and the second notch 420 are respectively arranged on both sides of the metal repair line 300 in the line width direction, and the direction of the first notch 410 and the direction of the second notch 420 are arranged opposite to each other. The first notch 410 and the second notch 420 jointly define the cutting portion 400 with a contracted line width to ensure that it can be cut using a laser with a small amount of energy.

[0062] The line width of the main body 310 is greater than the line width of the data line 162 , which is greater than the line width of the scan line 161 , and the line width of the cutting portion 400 is smaller than the line width of the data line 162 , which is smaller than the line width of the scan line 161 .

[0063] Figure 5 is a schematic diagram of a cutting portion including two cutting points in the first embodiment of the present application, such as Figure 5As shown, after the cutting portion 400 is cut off, since the main body portions 310 on both sides of the cutting portion 400 are close to each other, it is easy to send a possibility of breakdown, so the present application also sets a third notch 430 and a fourth notch 440, specifically: the cutting portion 400 also includes a third notch 430 and a fourth notch 440, the third notch 430 and the fourth notch 440 are respectively arranged on both sides of the metal repair line 300 in the line width direction, and the direction of the third notch 430 and the direction of the fourth notch 440 are arranged opposite to each other; the first notch 410 and the third notch 430 are located on the same side, and the first notch 410 and the third notch 430 are arranged at intervals, and the second notch 420 and the fourth notch 440 are located on the same side, and the second notch 420 and the fourth notch 440 are arranged at intervals.

[0064] When using laser cutting, it is necessary to cut the metal repair line 300 corresponding to the first notch 410 and the second notch 420, and cut the metal repair line 300 corresponding to the third notch 430 and the fourth notch 440. Therefore, two unconnected breakpoints will appear after cutting, thereby greatly improving the possibility of anti-breakdown.

[0065] Figure 6 is a schematic diagram of a connection area of ​​the first embodiment of the present application, Figure 7 is a schematic diagram of a first through hole in the first embodiment of the present application, such as Figure 6-7 As shown, when repairing a broken data line 162 or scan line 161, it is necessary to perform laser welding on the metal repair line 300 and the broken data line 162 or scan line 161. Too much energy generated by the laser may also cause the organic planar layer 150 below to deform or change color and affect the display effect.

[0066] Therefore, the present application also sets a first connection area 311 on the main body 310, and the metal wire complex on the first connection area 311 is used for laser welding with the data line 162 or the scanning line 161 below, and then sets a first through hole 151 at a position corresponding to the first connection area 311 in the organic planar layer 150. Specifically: each of the metal repair lines 300 includes a plurality of first connection areas 311, and each of the main body 310 corresponds to one first connection area 311; at least one first through hole 151 is set on the organic planar layer 150, and the orthographic projection of the first connection area 311 on the substrate 100 covers the orthographic projection of the first through hole 151 on the substrate 100.

[0067] The first through hole 151 is provided so that, on the one hand, when the metal repair line 300 is laser-welded with the broken data line 162 or the scanning line 161, the energy of the laser will not directly act on the organic planar layer 150; and on the other hand, the distance between the metal repair line 300 and the underlying data line 162 or the scanning line 161 is shortened, so that the metal repair line 300 and the data line 162, or the metal repair line 300 and the scanning line 161 can be connected without such a high-energy laser, thereby avoiding deformation and color change of the organic planar layer 150, thereby not affecting the display effect of the repaired area.

[0068] Furthermore, an annular through hole 153 may be provided on the organic flat layer 150, that is, the organic flat layer 150 is also provided with an annular through hole 153, and the annular through hole 153 is provided around the first through hole 151. The annular through hole 153 can not only isolate the heat generated by the laser welding metal repair line 300 from being transmitted to other areas of the organic flat layer 150, but also reserve expansion space for the organic flat layer 150, so that when the organic flat layer 150 close to the first connection area 311 expands, the space of the annular through hole 153 will be compressed, thereby preventing deformation and avoiding display abnormality.

[0069] Furthermore, a plurality of annular through holes 153 may be provided, and the axes of the plurality of annular through holes 153 are in a straight line and coaxial with the axis of the first through hole 151. This further prevents the heat generated by the laser welding metal repair line 300 from being transferred to other areas of the organic planar layer 150, thereby preventing the organic planar layer 150 from being deformed or discolored.

[0070] Figure 8 is a schematic diagram of a third through hole in the first embodiment of the present application, combined with Figure 8 As shown, the first insulating layer 120, the second insulating layer 140 and the organic planar layer 150 are arranged between the metal repair line 300 and the scan line 162 of the present application. Therefore, if the first through hole 151 is only set on the organic planar layer 150 below the metal repair line 300 corresponding to the scan line 162, the distance between the metal line complex line 300 above the scan line 162 and the scan line 162 is still large. Therefore, the present application sets a third through hole 154. Specifically: a third through hole 154 is set on the second insulating layer 140, and the third through hole 154 is connected to the first through hole 151, that is, the projection of the third through hole 154 on the substrate 100 overlaps with the projection of the first through hole 151 on the substrate 100. In simple terms, when the first through hole 151 corresponds to the scan line 162, the first through hole 151 also penetrates the second insulating layer 140.

[0071] This further reduces the distance between the metal repair line 300 and the scan line 162 below in the first connection area 311, thereby reducing the energy required to weld the metal repair line 300 and the scan line 162 below, avoiding deformation or color change of the organic planar layer 150 when welding the metal repair line 300 and the scan line 162 below, and improving the repair effect.

[0072] Fig. 9 is a schematic diagram of a first embodiment of the present application including two connection areas on a main body, Fig.10 is a schematic diagram of a first through hole and a second through hole in the first embodiment of the present application, such as Figure 9-10 As shown, it can be understood that a first connection area 311 is provided on the main body 310 of the metal repair line 300 corresponding to the four sides of each pixel unit, and when the data line 162 or the scan line 161 is broken, it is necessary to laser weld the metal repair line 300 on the two first connection areas 311 closest to the corresponding broken position with the data line 162 or the scan line 161 below. If the breakpoint of the data line 162 or the scan line 161 is located just below the first connection area 311, the length of the repair line will be too long, which is not conducive to the stability of signal transmission.

[0073] Therefore, in order to prevent the breakpoints of the data line 162 and the scan line 161 from appearing just below the first through hole 151, that is, the breakpoints appear just below the first connection area 311, which makes it difficult to repair: the present application further provides a second connection area 312 on the main body 310 of the metal repair line 300 around each pixel unit, specifically:

[0074] Each of the metal repair lines 300 includes a plurality of second connection areas 312, each of the main body parts 310 corresponds to a second connection area 312, and the first connection area 311 and the second connection area 312 are not connected; at least one second through hole 152 is provided on the organic planarizing layer 150, and the orthographic projection of the second connection area 312 on the substrate 100 covers the orthographic projection of the second through hole 152 on the substrate 100, and the first through hole 151 and the second through hole 152 are not connected.

[0075] Exemplary: Figure 7 The point L in the middle is the location where a breakpoint appears on the data line 162, and the breakpoint is just below the first connection area 311. Therefore, points A, B, C and D are cut by laser, and then points G and H are laser welded to avoid the problem of the metal repair line 300 being too long and affecting the signal transmission of the array substrate 32, thereby ensuring the reliability of the repair.

[0076] Embodiment 2:

[0077] Fig.11 is a schematic diagram of an array substrate according to a second embodiment of the present application. Fig.11 As shown, the difference from the first embodiment is that the cutting portion 400 of this embodiment is composed of a first sub-metal wire 451 and a second sub-metal wire 452. Specifically, the cutting portion 400 includes a first sub-metal wire 451 and a second sub-metal wire 452. The two ends of the first sub-metal wire 451 are respectively connected to the two main bodies 310, and the two ends of the second sub-metal wire 452 are respectively connected to the two main bodies 310. A gap is set between the first sub-metal wire 451 and the second sub-metal wire 452.

[0078] The sum of the line width of the first sub-metal line 451 and the line width of the second sub-metal line 452 is smaller than the line width of the main body 310 .

[0079] Compared with the solution of the first embodiment, even if the line width of the cutting portion 400 of this embodiment is the same as that of the cutting portion 400 of the first embodiment, the cutting portion 400 of this embodiment can use less energy during laser cutting; that is, the energy required for laser cutting a cutting portion 400 with a line width of d is Q, and the energy required for laser cutting a cutting portion 400 with a line width of the first sub-metal wire 451 and a line width of the second sub-metal wire 452 being the sum of d is Q', and Q' is less than Q.

[0080] Fig.12 is a schematic diagram of a method for preparing an array substrate according to an embodiment of the present application. Fig.13 FIG. 1 is a schematic diagram of a process of manufacturing an array substrate according to an embodiment of the present application. Figure 12-13 As shown, the present application also discloses a method for preparing an array substrate 32, which is used to prepare the array substrate 32 described in the above embodiment. The method for preparing the array substrate 32 comprises the following steps:

[0081] S1: forming a first metal layer, a first insulating layer, a second metal layer, a second insulating layer and an organic planarization layer in sequence on a substrate;

[0082] S2: forming a plurality of metal repair lines arranged in a crisscross pattern on the organic planar layer;

[0083] S3: forming a transparent electrode layer on the metal repair line 300;

[0084] Among them, the first metal layer 110 includes a scan line 161 or a data line 162, the second metal includes a data line 162 or the scan line 161, and the data line 162 and the scan line 161 are arranged in different layers, the projection of the metal repair line 300 on the substrate 100 covers the projection of the scan line 161 and the data line 162 on the substrate 100, and the overlapping part between the two metal repair lines 300 arranged in a criss-cross manner is the coincidence point; the metal repair line 300 is divided into a plurality of cutting parts 400 and a plurality of main parts 310, and the plurality of cutting parts 400 and the plurality of main parts 310 are staggered and connected, and the cutting part 400 is located on the side of the main part 310 close to the coincidence point; the line width of the metal repair line 300 corresponding to the cutting part 400 is smaller than the line width of the metal repair line 300 corresponding to the main part 310.

[0085] The line width of the cutting portion 400 is shrunk. Compared with the solution of making the line width of the entire metal repair line 300 consistent, the present application sets a cutting portion 400, and the line width of the cutting portion 400 is smaller than the line width of the main body 310. The main body 310 is used to connect the disconnected data line 162 or the scanning line 161. Since the line width of the cutting portion 400 is smaller, the energy required for laser cutting is also less, thereby avoiding the problem of excessive laser energy causing deformation or discoloration of the organic planarizing layer 150 during laser cutting, avoiding poor display problems at the cutting position, and improving the repair effect of the array substrate 32.

[0086] Furthermore, between step S1: sequentially forming a first metal layer, a first insulating layer, a second metal layer, a second insulating layer and an organic planar layer on a substrate and step S2: forming a plurality of metal repair lines arranged in a crisscross pattern on the organic planar layer, the following steps are further included:

[0087] S11: forming at least one first through hole on the organic planar layer;

[0088] Each of the metal repair lines 300 includes a plurality of first connection areas 311 , and each of the main body parts 310 corresponds to one first connection area 311 ; the orthographic projection of the first connection area 311 on the substrate 100 covers the orthographic projection of the first through hole 151 on the substrate 100 .

[0089] The first through hole 151 is provided so that, on the one hand, when the metal repair line 300 is laser-welded with the broken data line 162 or the scanning line 161, the energy of the laser will not directly act on the organic planar layer 150; and on the other hand, the distance between the metal repair line 300 and the underlying data line 162 or the scanning line 161 is shortened, so that the metal repair line 300 and the data line 162, or the metal repair line 300 and the scanning line 161 can be connected without such a high-energy laser, thereby avoiding deformation and color change of the organic planar layer 150, thereby not affecting the display effect of the repaired area.

[0090] It should be noted that the limitations on the various steps involved in this solution, without affecting the implementation of the specific solution, are not deemed to limit the order of the steps. The steps written in front can be executed first, or later, or even simultaneously. As long as this solution can be implemented, it should be deemed to fall within the scope of protection of this application.

[0091] It should be noted that the inventive concept of the present application can form a large number of embodiments, but the length of the application document is limited and it is impossible to list them one by one. Therefore, under the premise of no conflict, the embodiments or technical features described above can be arbitrarily combined to form new embodiments. After the embodiments or technical features are combined, the original technical effects will be enhanced.

[0092] The above content is a further detailed description of the present application in combination with specific optional implementation methods, and it cannot be determined that the specific implementation of the present application is limited to these descriptions. For ordinary technicians in the technical field to which the present application belongs, several simple deductions or substitutions can be made without departing from the concept of the present application, which should be deemed to fall within the scope of protection of the present application.

Claims

1. An array substrate, comprising a substrate, and a first metal layer, a first insulating layer, a second metal layer, a second insulating layer, an organic flat layer and a transparent electrode layer sequentially arranged on the substrate; the array substrate further comprises a data line and a scan line, the first metal layer comprises a scan line or a data line, the second metal comprises a data line or the scan line, and the data line and the scan line are arranged in different layers, and the data line and the scan line are arranged in a crisscross manner to define a pixel unit; characterized in that: The array substrate further comprises a plurality of metal repair lines arranged in a crisscross pattern, wherein the metal repair lines are arranged on a side of the organic flat layer close to the transparent electrode layer, and the projections of the metal repair lines on the substrate cover the projections of the scanning lines and the data lines on the substrate, and the overlap between two metal repair lines arranged in a crisscross pattern is a coincidence point; The metal repair line is divided into a plurality of cutting parts and a plurality of main parts, the plurality of cutting parts and the plurality of main parts are staggered and connected, the cutting part is located on a side of the main part close to the overlap point; the line width of the metal repair line corresponding to the cutting part is smaller than the line width of the metal repair line corresponding to the main part; Each of the metal repair lines includes a plurality of first connection areas, and each of the main body parts corresponds to one first connection area; at least one first through hole is provided on the organic planar layer, and the orthographic projection of the first connection area on the substrate covers the orthographic projection of the first through hole on the substrate; The organic flat layer is also provided with an annular through hole, which is arranged around the first through hole to isolate the heat generated by the laser welding metal repair line and reserve expansion space.

2. The array substrate according to claim 1, characterized in that: The cutting portion includes a first notch and a second notch, wherein the first notch and the second notch are respectively arranged at two sides of the metal repair line in a line width direction, and the first notch and the second notch are arranged in opposite directions.

3. The array substrate according to claim 2, characterized in that: The cutting portion further includes a third notch and a fourth notch, wherein the third notch and the fourth notch are respectively arranged at two sides of the metal repair line in the line width direction, and the direction of the third notch is opposite to the direction of the fourth notch; The first notch and the third notch are located on the same side, and the first notch and the third notch are spaced apart from each other; the second notch and the fourth notch are located on the same side, and the second notch and the fourth notch are spaced apart from each other.

4. The array substrate according to claim 1, characterized in that: The cutting portion includes a first sub-metal wire and a second sub-metal wire, wherein two ends of the first sub-metal wire are respectively connected to the two main bodies, and two ends of the second sub-metal wire are respectively connected to the two main bodies; a gap is provided between the first sub-metal wire and the second sub-metal wire; A sum of a line width of the first sub-metal line and a line width of the second sub-metal line is smaller than a line width of the main body.

5. The array substrate according to claim 1, characterized in that: Each of the metal repair lines comprises a plurality of second connection areas, each of the main body parts corresponds to one second connection area, and the first connection area is not connected to the second connection area; At least one second through hole is disposed on the organic planar layer, the orthographic projection of the second connection area on the substrate covers the orthographic projection of the second through hole on the substrate, and the first through hole is not connected to the second through hole.

6. A method for preparing an array substrate, characterized in that: For preparing an array substrate as claimed in any one of claims 1 to 5, the method for preparing the array substrate comprises the steps of: forming a first metal layer, a first insulating layer, a second metal layer, a second insulating layer and an organic planarization layer in sequence on a substrate; forming a plurality of metal repair lines arranged in a crisscross pattern on the organic planar layer; forming a transparent electrode layer on the metal repair line; Among them, the first metal layer includes a scan line or a data line, the second metal includes a data line or the scan line, and the data line and the scan line are arranged in different layers, the projection of the metal repair line on the substrate covers the projection of the scan line and the data line on the substrate, and the overlapping part between the two metal repair lines arranged in a criss-cross manner is the coincidence point; the metal repair line is divided into a plurality of cutting parts and a plurality of main parts, and the plurality of cutting parts and the plurality of main parts are staggered and connected, and the cutting part is located on the side of the main part close to the coincidence point; the line width of the metal repair line corresponding to the cutting part is smaller than the line width of the metal repair line corresponding to the main part.

7. The method for preparing an array substrate according to claim 6, characterized in that: The method further includes the following steps between the step of forming a plurality of metal repair lines arranged in a crisscross pattern on the organic planar layer and the step of forming a transparent electrode layer on the metal repair lines: forming at least one first through hole on the organic planar layer; Each of the metal repair lines includes a plurality of first connection areas, each of the main body parts corresponds to one first connection area; and the orthographic projection of the first connection area on the substrate covers the orthographic projection of the first through hole on the substrate.

8. A display device, characterized in that: The display device comprises a backlight module and a display panel, wherein the backlight module provides backlight for the array substrate, and the display panel comprises an opposing substrate and the array substrate as claimed in any one of claims 1 to 5, wherein the opposing substrate and the array substrate are arranged opposite to each other.

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