A multi-layer composite circuit board structure, preparation equipment and optimized wiring method thereof

Abstract

The present invention discloses a multi-layer composite circuit board, comprising a base layer and a copper plate, wherein the copper plates are attached to both sides of the base layer; the base layer and the copper plates are both provided with a plurality of groups, wherein the base layer and the copper plates are arranged in sequence, and the outermost layers are all copper plates; and a heat spreader wire is inserted in the base layer. The preparation equipment comprises a pressing assembly, and the base layer and the copper plate are pressed by the pressing assembly. The wiring method performs wiring according to the shortest line principle. The present application distributes a large amount of heat generated locally inside the multi-layer circuit board by inserting a heat spreader wire in the base layer, thereby increasing the heat transfer and reducing the local temperature. Compared with the local area, the heat spreader wire increases the heat dissipation area, enhances the heat dissipation performance of the multi-layer circuit board, and reduces the impact on the working components above the circuit board. The circuits are arranged in sequence according to the shortest line principle, which ensures that the internal resistance of the circuit is minimized, is beneficial to improving the performance of the circuit board, and effectively reduces the heating of the circuit.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit boards, and in particular to a multi-layer composite circuit board structure, a preparation device and an optimized wiring method thereof. Background Art

[0002] Circuit board, PCB, also known as printed circuit board, is the provider of electrical connections for electronic components. It has a history of more than 100 years. Its design is mainly layout design. The main advantage of using circuit boards is that it greatly reduces wiring and assembly errors, improves the level of automation and production labor rate. Multilayer PCB circuit board is a composite structure composed of multiple levels (usually four layers or more) of circuit boards.

[0003] Chinese patent publication number CN220511302U discloses a high-precision multi-layer PCB circuit board, including a base, multiple high-precision PCB substrates and multiple shielding layers, the four corners of the surface of the base are all threaded with columns, and the interior of the columns is provided with a fastening mechanism; the four corners of the high-precision PCB substrate and the shielding layer are provided with limited holes, and the high-precision PCB substrate and the shielding layer can be fastened to the base through the fastening mechanism. The utility model can make multiple high-precision PCB substrates overlap and fasten on the base through the mutual cooperation between the first spring, the slider, the second spring and the limit buckle, saving installation space, and facilitating the disassembly and assembly of multiple high-precision PCB substrates compared to the existing press-fit connection method, and facilitating low-cost repair after the circuit board is damaged.

[0004] When the multi-layer circuit board of the above patent is working, a large amount of heat will accumulate locally inside it, and the heat dissipation performance of the multi-layer circuit board itself is mostly poor. After a long time, it will affect the use of the working components above and affect the service life of the circuit board. Summary of the invention

[0005] The present invention provides a multi-layer composite circuit board structure, a preparation device and an optimized wiring method thereof, which are used to solve the problems raised in the background technology.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions:

[0007] A multi-layer composite circuit board structure comprises a base layer and a copper plate, wherein the copper plate is attached to both sides of the base layer;

[0008] The base layer and the copper plate are both provided in several groups, the base layer and the copper plate are arranged in sequence, and the outermost layer is the copper plate;

[0009] A heat-spreading wire is inserted into the base layer.

[0010] Preferably, the groups of copper plates are connected via through holes, blind holes or buried holes.

[0011] A multi-layer composite circuit board preparation device is used to prepare the multi-layer composite circuit board, wherein a plurality of groups of the base layers and copper plates are pressed together by a pressing assembly;

[0012] The pressing assembly comprises a frame, a bottom pressing plate and a top fixing plate are fixedly connected to the frame, a bottom stabilizing bin is fixedly connected to the bottom pressing plate, a pressing rod is fixedly connected to the top fixing plate, an output end of the pressing rod passes through the top fixing plate, and the output end of the pressing rod is fixedly connected to the top pressing plate, a top stabilizing bin is arranged outside the top pressing plate, and the top stabilizing bin is slidably connected to the output end of the pressing rod;

[0013] The bottom stabilizing bin and the top stabilizing bin are both provided with stabilizing pipes.

[0014] Preferably, a locking plate is provided at the outer edge of the top stabilizing bin, a locking rod is provided on the locking plate, and a plug hole is provided on the locking rod;

[0015] A locking groove is fixedly connected to the bottom stabilizing bin, a locking groove is arranged on the locking groove, and the locking groove is arranged corresponding to the locking rod.

[0016] Preferably, a fixing groove is fixedly connected to the bottom stabilizing bin, a gear ring is slidably arranged in the fixing groove, and the gear ring is sleeved on the outer periphery of the bottom stabilizing bin;

[0017] The outer peripheral surface of the gear ring is provided with a sliding groove, a sliding clamp is slidably engaged in the sliding groove, and the sliding clamp is fixedly connected to the inner wall of the fixed groove;

[0018] The upper side of the gear ring is abutted with the lower end of the abutment head, the abutment head penetrates the limit block and is slidably connected to the positioning groove, a spring is arranged between the lower end of the abutment head and the limit block, the spring is sleeved on the abutment head, and the two ends of the spring are respectively fixedly connected to the limit block and the lower end of the abutment head;

[0019] An abutment protrusion is arranged on the upper side surface of the gear ring.

[0020] Preferably, an outer wall of the bottom stabilizing bin is fixedly connected with a placement plate, a driving motor is fixedly connected to the placement plate, an output end of the driving motor is fixedly connected with a driving gear, and the driving gear is meshed with a gear ring.

[0021] Preferably, a stabilization component is provided between the output end of the pressure rod and the top pressing plate, and the stabilization component comprises a connecting sleeve, the connecting sleeve is fixedly connected to the output end of the pressure rod, an inner connecting piece is inserted in the connecting sleeve, a connecting rod is fixedly connected to the inner connecting piece, and the connecting rod is fixedly connected to the top pressing plate;

[0022] The inner connecting member is provided with a connecting head, and a plurality of the connecting heads are evenly arranged along the outer circumference of the inner connecting member, and the connecting head is rotatably connected to the connecting hole, and the connecting hole is arranged at the center of the limiting frame, and the limiting frame is slidably connected to the movable groove arranged in the connecting sleeve;

[0023] A torsion spring is arranged between the connecting head and the connecting hole.

[0024] Preferably, the limiting frame is provided with conical grooves on both sides, a ball group is provided in the conical groove, a limiting sleeve is connected to the limiting frame, a ball hole group is provided on the limiting sleeve, the ball hole group is adapted to the ball group, and the ball group is rollingly connected to the movable groove;

[0025] An elastic sheet is arranged between the limiting sleeve and the inner wall of the connecting sleeve.

[0026] Preferably, the ball group includes ball 1, ball 2, and ball 3, the diameters of ball 1, ball 2, and ball 3 decrease in sequence, and the ball 1, ball 2, and ball 3 are arranged in the tapered groove along the narrowing direction of the tapered groove;

[0027] The first ball, the second ball, the third ball and the conical groove are arranged in opposite directions on the two sides of the limiting frame;

[0028] The ball hole group includes ball hole one, ball hole two, and ball hole three, and the ball hole one, ball hole two, and ball hole three are adapted to ball one, ball two, and ball three.

[0029] A method for optimizing wiring of a multi-layer composite circuit board structure is used to plan the circuit of the multi-layer composite circuit board, comprising the following steps:

[0030] S1: Obtaining circuit data information of a multi-layer composite circuit board, hardware data of the multi-layer composite circuit board, and a prohibited area of ​​the multi-layer composite circuit board, wherein the hardware data of the multi-layer composite circuit board includes the size and shape of the circuit board;

[0031] S2: Divide the circuit data information of the multi-layer composite circuit board into modules, into a plurality of digital circuit modules and analog circuit modules, and sort the plurality of digital circuit modules and analog circuit modules in sequence, and make the priority of the digital circuit module higher than that of the analog circuit module;

[0032] S3: performing wiring of the first module according to the order of the digital circuit modules and the analog circuit modules under the constraints of the size and shape of the circuit board and the forbidden area of ​​the multi-layer composite circuit board;

[0033] S4: After completing the wiring of the first module, the wiring of the next module is performed according to the principle of the shortest line and within the limits of the size and shape of the circuit board;

[0034] S5: Determine whether the wiring of the module in S4 passes through the forbidden area of ​​the multi-layer composite circuit board. If it does not pass through the forbidden area of ​​the multi-layer composite circuit board, proceed to the wiring of the next module. If it passes through the forbidden area of ​​the multi-layer composite circuit board, shield the forbidden area passed by the wiring of the module in S4 and return to step S4.

[0035] Compared with the prior art, the present invention has at least the following beneficial effects:

[0036] The present application distributes a large amount of heat generated locally inside the multi-layer circuit board by inserting a heat-spreading wire in the base layer, thereby increasing heat transfer and reducing local temperature. Compared with the local area, the heat-spreading wire increases the heat dissipation area, enhances the heat dissipation performance of the multi-layer circuit board, and reduces the impact on the working components above the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 It is a schematic diagram of the structure of a multi-layer circuit board of the present invention;

[0038] Figure 2 It is a schematic diagram of the structure of the pressing assembly of the present invention;

[0039] Figure 3 It is a schematic diagram of the relative positions of the top stabilizing bin and the top pressing plate of the present invention;

[0040] Figure 4 It is a schematic diagram of the stabilizing bin connection structure of the present invention;

[0041] Figure 5 It is a schematic diagram of the driving connection structure of the stabilizing bin of the present invention;

[0042] Figure 6 It is a schematic diagram of the structure of the stabilizing bin of the present invention;

[0043] Figure 7 It is a schematic diagram of the gear ring structure of the present invention;

[0044] Figure 8 This is a schematic diagram of the explosion structure of the stabilization assembly of the present invention;

[0045] Fig. 9 It is a schematic cross-sectional view of the structure of the stabilization component of the present invention;

[0046] Fig.10 It is a schematic diagram of the structure of the stabilization component of the present invention.

[0047] In the figure: 1, base layer; 2, copper plate; 3, through hole; 4, blind hole; 5, buried hole; 6, pressing assembly; 7, frame; 8, bottom pressing plate; 9, bottom stabilizing bin; 10, top fixing plate; 11, pressing rod; 12, top stabilizing bin; 13, stabilizing tube; 14, top pressing plate; 15, clamping plate; 16, clamping rod; 17, limiting block; 18, clamping slot; 19, fixing slot; 20, gear ring; 21, placement plate; 22, driving motor; 23, driving gear; 24, sliding card 1. abutment; 2. spring; 2. abutment plane; 2. sliding groove; 2. abutment protrusion; 3. connecting sleeve; 3. inner connecting member; 3. limiting frame; 3. ball group; 3. limiting sleeve; 3. movable groove; 3. connecting rod; 3. connecting head; 3. conical groove; 3. connecting hole; 3. ball one; 3. ball two; 3. ball three; 3. ball hole one; 3. ball hole two; 3. ball hole three. DETAILED DESCRIPTION

[0048] In the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes, and do not specifically refer to the order or sequence, nor are they used to limit the present invention. They are only used to distinguish the protective components or operations described with the same technical terms, and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions and technical features between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0049] Example 1

[0050] See also Figure 1 , an embodiment provided by the present invention: a multi-layer composite circuit board structure, comprising a base layer 1 and a copper plate 2, wherein the copper plate 2 is attached to both sides of the base layer 1;

[0051] The base layer 1 and the copper plate 2 are both provided in several groups, the base layer 1 and the copper plate 2 are arranged in sequence, and the outermost layer is the copper plate 2;

[0052] A heat-saturating wire is inserted into the base layer 1 .

[0053] Preferably, several groups of copper plates 2 are connected via through holes 3 , blind holes 4 , and buried holes 5 .

[0054] The working principle and beneficial effects of the above scheme:

[0055] The present application distributes a large amount of heat generated locally inside the multi-layer circuit board by inserting a heat-spreading wire into the base layer 1, thereby increasing heat transfer and reducing local temperature. Compared with the local area, the heat-spreading wire increases the heat dissipation area, enhances the heat dissipation performance of the multi-layer circuit board, and reduces the impact on the working components above the circuit board.

[0056] Example 2

[0057] See also Figure 2-7 , a multi-layer composite circuit board preparation device, used for preparing the multi-layer composite circuit board, wherein a plurality of groups of the base layer 1 and the copper plate 2 are pressed together by a pressing assembly 6;

[0058] The pressing assembly 6 includes a frame 7, a bottom pressing plate 8 and a top fixing plate 10 are fixedly connected to the frame 7, a bottom stabilizing bin 9 is fixedly connected to the bottom pressing plate 8, a pressing rod 11 is fixedly connected to the top fixing plate 10, an output end of the pressing rod 11 passes through the top fixing plate 10, and a top pressing plate 14 is fixedly connected to the output end of the pressing rod 11, a top stabilizing bin 12 is arranged outside the top pressing plate 14, and the top stabilizing bin 12 is slidably connected to the output end of the pressing rod 11;

[0059] The bottom stabilizing bin 9 and the top stabilizing bin 12 are both provided with stabilizing pipes 13 .

[0060] Preferably, a locking plate 15 is provided at the outer edge of the top stabilizing bin 12, a locking rod 16 is provided on the locking plate 15, and a plug hole is provided on the locking rod 16;

[0061] The bottom stabilizing bin 9 is fixedly connected with a locking groove 18 , and the locking groove 18 is provided on the locking groove 18 , and the locking groove 18 is provided corresponding to the locking rod 16 .

[0062] Preferably, a fixing groove 19 is fixedly connected to the bottom stabilizing bin 9, a gear ring 20 is slidably arranged in the fixing groove 19, and the gear ring 20 is sleeved on the outer periphery of the bottom stabilizing bin 9;

[0063] The outer circumferential surface of the gear ring 20 is provided with a sliding groove 28, and a sliding clamp 24 is slidably engaged in the sliding groove 28, and the sliding clamp 24 is fixedly connected to the inner wall of the fixing groove 19;

[0064] The upper side of the gear ring 20 is abutted against the lower end of the abutment head 25, the abutment head 25 penetrates the limit block 17 and is slidably connected to the positioning groove 18, a spring 26 is provided between the lower end of the abutment head 25 and the limit block 17, the spring 26 is sleeved on the abutment head 25, and the two ends of the spring 26 are respectively fixedly connected to the limit block 17 and the lower end of the abutment head 25;

[0065] The upper side of the gear ring 20 is provided with an abutment protrusion 29 .

[0066] Preferably, a placement plate 21 is fixedly connected to the outer wall of the bottom stabilizing bin 9 , a driving motor 22 is fixedly connected to the placement plate 21 , a driving gear 23 is fixedly connected to the output end of the driving motor 22 , and the driving gear 23 meshes with the gear ring 20 .

[0067] The working principle and beneficial effects of the above scheme:

[0068] In the production process of a multi-layer circuit board, the multi-layer base layer 1 and the copper plate 2 need to be pressed together to form a multi-layer circuit board. During the pressing, the temperature of the base layer 1 and the copper plate 2 needs to be kept in a staged change state, that is, it needs to be kept at different temperatures for a certain period of time so that the base layer 1 and the copper plate 2 fit perfectly.

[0069] The present application reduces the influence of the external environment on the pressing by pressing the base layer 1 and the copper plate 2 in a closed environment composed of a bottom stabilizing bin 9 and a top stabilizing bin 12, ensures the stability of the pressing temperature, and because the closed space composed of the bottom stabilizing bin 9 and the top stabilizing bin 12 is isolated from the outside world, the temperature can be adjusted more quickly during the pressing process, which is beneficial to saving energy consumption and improving efficiency.

[0070] Before pressing, the top stabilizing bin 12 is placed above the bottom stabilizing bin 9, and the bottom stabilizing bin 9 and the top stabilizing bin 12 are rotated relative to each other, the locking rod 16 is inserted into the locking groove 18, and the driving motor 22 is started to drive the gear ring 20 to rotate, and the abutment protrusion 29 is rotated to the bottom of the abutment joint 25, so that the abutment joint 25 overcomes the elastic force of the spring 26 and moves upward, and is inserted into the socket on the locking rod 16, completing the relative fixation of the bottom stabilizing bin 9 and the top stabilizing bin 12, effectively avoiding the separation of the bottom stabilizing bin 9 and the top stabilizing bin 12 under unexpected conditions, and then causing temperature fluctuations in the bottom stabilizing bin 9 and the top stabilizing bin 12, resulting in failure of pressing of the base layer 1 and the copper plate 2.

[0071] Example 3

[0072] See also Figure 2 , 3 8-10. On the basis of Example 2, a stabilization component is provided between the output end of the pressure rod 11 and the top pressing plate 14, and the stabilization component includes a connecting sleeve 30, the connecting sleeve 30 is fixedly connected to the output end of the pressure rod 11, an inner connecting member 31 is inserted into the connecting sleeve 30, a connecting rod 36 is fixedly connected to the inner connecting member 31, and the connecting rod 36 is fixedly connected to the top pressing plate 14;

[0073] The inner connecting member 31 is provided with a connecting head 37 , and a plurality of the connecting heads 37 are evenly arranged along the outer circumference of the inner connecting member 31 . The connecting head 37 is rotatably connected in a connecting hole 39 , and the connecting hole 39 is arranged at the center of the limiting frame 32 , and the limiting frame 32 is slidably connected to a movable groove 35 arranged in the connecting sleeve 30 .

[0074] A torsion spring is provided between the connecting head 37 and the connecting hole 39 .

[0075] Preferably, the two sides of the limiting frame 32 are provided with tapered grooves 38, the tapered grooves 38 are provided with ball groups 33, the limiting frame 32 is connected with a limiting sleeve 34, the limiting sleeve 34 is provided with a ball hole group, the ball hole group is adapted to the ball group 33, and the ball group 33 is rollingly connected with the movable groove 35;

[0076] A torsion spring is provided between the connecting head 37 and the connecting hole 39 .

[0077] Preferably, the ball group 33 includes a first ball 331, a second ball 332, and a third ball 333, wherein the diameters of the first ball 331, the second ball 332, and the third ball 333 are successively reduced, and the first ball 331, the second ball 332, and the third ball 333 are arranged in the tapered groove 38 along the narrowing direction of the tapered groove 38;

[0078] The ball 1 331, the ball 2 332, the ball 3 333, and the tapered groove 38 are arranged in opposite directions on the two sides of the limiting frame 32;

[0079] The ball hole group includes ball hole 1 341 , ball hole 2 342 , and ball hole 343 , and the ball hole 1 341 , ball hole 2 342 , and ball hole 343 are adapted to ball 1 331 , ball 2 332 , and ball 3 333 .

[0080] The working principle and beneficial effects of the above scheme:

[0081] In the production process of the multi-layer circuit board, in order to avoid the situation where the lamination of the base layer 1 and the copper plate 2 fails due to different lamination pressures between the base layer 1 and the copper plate 2, a stabilization component is provided, and the relative positions of the bottom lamination plate 8 and the top lamination plate 14 are adjusted by the stabilization component, so that the top lamination plate 14 can be perfectly fitted with the bottom lamination plate 8 when the bottom lamination plate 8 is tilted, so that the pressure between the bottom lamination plate 8 and the top lamination plate 14 is in a stable state, thereby ensuring the lamination quality of the base layer 1 and the copper plate 2;

[0082] When the bottom pressing plate 8 is tilted, when the top pressing plate 14 is pressed, the top pressing plate 14 first fits with the high side of the bottom pressing plate 8. When the pressure continues to be downward, the top pressing plate 14 and the bottom pressing plate 8 are stressed, causing the torsion spring to deflect and the spring sheet to contract, thereby causing the top pressing plate 14 to tilt in the same manner as the bottom pressing plate 8, so that the bottom pressing plate 8 and the top pressing plate 14 fit perfectly. Under the action of the torsion spring and the spring sheet, the downward pressure of the pressure rod 11 is applied to the base layer 1 and the copper plate 2, and the phenomenon of serious uneven force on the base layer 1 and the copper plate 2 caused by the tilt of the bottom pressing plate 8 is greatly reduced, thereby greatly improving the pressing quality of the base layer 1 and the copper plate 2.

[0083] The arrangement of the ball hole 1 341 , the ball hole 2 342 , and the ball hole 3 343 of different sizes in opposite directions on the two sides of the limiting frame 32 ensures the relative stability of the connecting sleeve 30 and the inner connecting member 31 and avoids the separation of the two.

[0084] Example 4

[0085] A method for optimizing wiring of a multi-layer composite circuit board structure is used to plan the circuit of the multi-layer composite circuit board, comprising the following steps:

[0086] S1: Obtaining circuit data information of a multi-layer composite circuit board, hardware data of the multi-layer composite circuit board, and a prohibited area of ​​the multi-layer composite circuit board, wherein the hardware data of the multi-layer composite circuit board includes the size and shape of the circuit board;

[0087] S2: Divide the circuit data information of the multi-layer composite circuit board into modules, into a plurality of digital circuit modules and analog circuit modules, and sort the plurality of digital circuit modules and analog circuit modules in sequence, and make the priority of the digital circuit module higher than that of the analog circuit module;

[0088] S3: performing wiring of the first module according to the order of the digital circuit modules and the analog circuit modules under the constraints of the size and shape of the circuit board and the forbidden area of ​​the multi-layer composite circuit board;

[0089] S4: After completing the wiring of the first module, the wiring of the next module is performed according to the principle of the shortest line and within the limits of the size and shape of the circuit board;

[0090] S5: Determine whether the wiring of the module in S4 passes through the forbidden area of ​​the multi-layer composite circuit board. If it does not pass through the forbidden area of ​​the multi-layer composite circuit board, proceed to the wiring of the next module. If it passes through the forbidden area of ​​the multi-layer composite circuit board, shield the forbidden area passed by the wiring of the module in S4 and return to step S4.

[0091] The working principle and beneficial effects of the above scheme:

[0092] By arranging the lines in sequence according to the principle of the shortest line, the internal resistance of the line is minimized, which is beneficial to improving the performance of the circuit board and effectively reducing the heating of the line.

[0093] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. A multi-layer composite circuit board preparation device, characterized in that: For preparing a multi-layer composite circuit board, The multilayer composite circuit board comprises a base layer (1) and a copper plate (2), wherein the copper plate (2) is attached to both sides of the base layer (1); The base layer (1) and the copper plate (2) are both provided in a plurality of groups, the base layer (1) and the copper plate (2) are provided in sequence, and the outermost layer is the copper plate (2); A heat-saturating wire is inserted into the base layer (1); A plurality of groups of the base layers (1) and copper plates (2) are pressed together by a pressing assembly (6); The pressing assembly (6) comprises a frame (7), a bottom pressing plate (8) and a top fixing plate (10) are fixedly connected to the frame (7), a bottom stabilizing bin (9) is fixedly connected to the bottom pressing plate (8), a pressing rod (11) is fixedly connected to the top fixing plate (10), an output end of the pressing rod (11) passes through the top fixing plate (10), and a top pressing plate (14) is fixedly connected to the output end of the pressing rod (11), a top stabilizing bin (12) is arranged outside the top pressing plate (14), and the top stabilizing bin (12) is slidably connected to the output end of the pressing rod (11); The bottom stabilizing bin (9) and the top stabilizing bin (12) are both provided with stabilizing pipes (13); A locking plate (15) is provided at the outer edge of the top stabilizing bin (12), a locking rod (16) is provided on the locking plate (15), and a plug hole is provided on the locking rod (16); A locking groove (18) is fixedly connected to the bottom stabilizing bin (9), a locking groove (18) is arranged on the locking groove (18), and the locking groove (18) is arranged corresponding to the locking rod (16); A fixing groove (19) is fixedly connected to the bottom stabilizing bin (9), a gear ring (20) is slidably arranged in the fixing groove (19), and the gear ring (20) is sleeved on the outer periphery of the bottom stabilizing bin (9); The outer peripheral surface of the gear ring (20) is provided with a sliding groove (28), a sliding clamp (24) is slidably engaged in the sliding groove (28), and the sliding clamp (24) is fixedly connected to the inner wall of the fixed groove (19); The upper side surface of the gear ring (20) is in contact with the lower end of an abutment head (25); the abutment head (25) penetrates the limit block (17) and is slidably connected to the locking groove (18); a spring (26) is provided between the lower end of the abutment head (25) and the limit block (17); the spring (26) is sleeved on the abutment head (25); and two ends of the spring (26) are respectively fixedly connected to the limit block (17) and the lower end of the abutment head (25); An abutment protrusion (29) is provided on the upper side of the gear ring (20).

2. A multi-layer composite circuit board manufacturing device according to claim 1, characterized in that: A plurality of groups of copper plates (2) are connected via through holes (3), blind holes (4) and buried holes (5).

3. The multi-layer composite circuit board manufacturing device according to claim 1, characterized in that: The outer wall of the bottom stabilizing bin (9) is fixedly connected to a placement plate (21), the placement plate (21) is fixedly connected to a drive motor (22), the output end of the drive motor (22) is fixedly connected to a drive gear (23), and the drive gear (23) is meshed with a gear ring (20).

4. The multi-layer composite circuit board manufacturing device according to claim 1, characterized in that: A stabilization component is provided between the output end of the pressure rod (11) and the top pressing plate (14), the stabilization component comprising a connecting sleeve (30), the connecting sleeve (30) being fixedly connected to the output end of the pressure rod (11), an inner connecting piece (31) being inserted into the connecting sleeve (30), a connecting rod (36) being fixedly connected to the inner connecting piece (31), and the connecting rod (36) being fixedly connected to the top pressing plate (14); The inner connecting member (31) is provided with a connecting head (37), a plurality of the connecting heads (37) are evenly arranged along the outer circumference of the inner connecting member (31), the connecting heads (37) are rotatably connected to a connecting hole (39), the connecting hole (39) is arranged at the center of the limiting frame (32), and the limiting frame (32) is slidably connected to a movable groove (35) arranged in the connecting sleeve (30); A torsion spring is provided between the connecting head (37) and the connecting hole (39).

5. The multi-layer composite circuit board manufacturing device according to claim 4, characterized in that: The limiting frame (32) is provided with conical grooves (38) on both sides, a ball group (33) is provided in the conical grooves (38), a limiting sleeve (34) is connected to the outer surface of the limiting frame (32), a ball hole group is provided on the limiting sleeve (34), the ball hole group is adapted to the ball group (33), and the ball group (33) is rollingly connected to the movable groove (35); An elastic sheet is provided between the limiting sleeve (34) and the inner wall of the connecting sleeve (30).

6. The multi-layer composite circuit board manufacturing device according to claim 5, characterized in that: The ball group (33) comprises a first ball (331), a second ball (332), and a third ball (333); the diameters of the first ball (331), the second ball (332), and the third ball (333) decrease in sequence, and the first ball (331), the second ball (332), and the third ball (333) are arranged in the tapered groove (38) along the narrowing direction of the tapered groove (38); The first ball (331), the second ball (332), the third ball (333), and the conical groove (38) are arranged in opposite directions on two side surfaces of the limiting frame (32); The ball hole group includes ball hole one (341), ball hole two (342), and ball hole three (343), and the ball hole one (341), ball hole two (342), and ball hole three (343) are compatible with ball one (331), ball two (332), and ball three (333).

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