A processing technology for high-precision optoelectronic integrated circuit board

Abstract

The present invention provides a processing technology for a high-precision optoelectronic integrated circuit board, belonging to the technical field of circuit board preparation; its preparation process comprises the following steps: preparing a hydrophobic epoxy resin; preparing an adhesive; preparing a wear-resistant hydrophobic coating; preparing a high-precision optoelectronic integrated circuit board. The present invention ball-mills and blends aluminum oxide, mullite powder, silicon dioxide, calcium zirconate, potassium carbonate, an adhesive and a curing agent, and presses and forms a substrate, and then coats the substrate, and then integrates electronic components onto a hydrophobic and wear-resistant substrate to obtain a high-precision optoelectronic integrated circuit board, the integrated circuit board is an aluminum oxide substrate with good anti-scratch and wear-resistant effect, and can reduce the impact of a humid environment on the integrated circuit board.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board preparation, and in particular to a processing technology for a high-precision optoelectronic integrated circuit board. Background Art

[0002] A circuit board can be called a printed circuit board or a printed circuit board. A circuit board is composed of an integrated circuit, a quartz oscillator, a fine-tuning capacitor, and a printed circuit board. The names of circuit boards include: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, etc.

[0003] Circuit substrate is the basic material for manufacturing circuit boards. According to the materials used in circuit substrates, they can be divided into three categories: inorganic substrate materials, organic substrate materials and composite substrate materials. Traditional inorganic substrates are made of Al 2 O 3 , SiC, BeO and AlN are used as substrates. Due to their good performance in thermal conductivity, flexural strength and thermal expansion coefficient, they are widely used in the MCM circuit substrate industry. At present, the integrated circuit substrates developed at home and abroad mainly use low-temperature sintered substrate materials, which can be roughly divided into two categories, one is microcrystalline glass system, and the other is glass plus ceramic system.

[0004] Adhesive is added to the circuit substrate during the preparation process. The addition of adhesive reduces the anti-scratch and wear-resistant effect of the circuit substrate. At the same time, the adhesive absorbs moisture in the air, which increases the humidity of the circuit substrate and affects the normal use of the circuit substrate.

[0005] Therefore, we proposed a processing technology for high-precision optoelectronic integrated circuit boards with hydrophobicity and high wear resistance. Summary of the invention

[0006] In view of the deficiencies in the prior art, the present invention aims to provide a processing technology for a high-precision optoelectronic integrated circuit board.

[0007] A processing technology for high-precision optoelectronic integrated circuit board comprises the following steps:

[0008] S1: Preparation of hydrophobic epoxy resin

[0009] The hydrophobic epoxy resin is prepared by reacting magnesium lignin sulfonate, N,N-dimethylformamide, triethylamine, oleyl chloride, epichlorohydrin and sodium hydroxide;

[0010] S2: Preparation of adhesive

[0011] S3: Preparation of wear-resistant hydrophobic coating type

[0012] A wear-resistant hydrophobic coating type is prepared by reacting isopropyl alcohol, tetramethylammonium hydroxide and dimethyldimethoxysilane, and adding ethyl orthosilicate, n-octyltriethoxysilane, γ-aminopropyltriethoxysilane and hexadecyltrimethoxysilane to react again;

[0013] S4: Preparation of high-precision optoelectronic integrated circuit boards

[0014] A substrate is prepared by ball-milling and blending alumina, mullite powder, silica, calcium zirconate, potassium carbonate, an adhesive and a curing agent, and the substrate is coated to obtain a hydrophobic and wear-resistant substrate. Electronic components are integrated on the hydrophobic and wear-resistant substrate to obtain a high-precision optoelectronic integrated circuit board.

[0015] Furthermore, step S1 prepares a hydrophobic epoxy resin, which specifically comprises the following steps:

[0016] S1.1: 10-20 parts by weight of dried magnesium lignin sulfonate are placed in a three-necked flask, and then 90-100 parts by weight of N,N-dimethylformamide are added, and the mixture is stirred at 80-90°C to completely dissolve the magnesium lignin sulfonate. After stirring, the temperature is lowered to 60-65°C, and 2-3 parts by weight of triethylamine are added to obtain a reaction system;

[0017] S1.2: Dissolve oleoyl chloride in 10-12 parts by weight of N,N-dimethylformamide to obtain a mixed solution, slowly add the mixed solution dropwise to the reaction system over 20-30 minutes using a peristaltic pump, and continue to react for 2-3 hours to obtain an intermediate product;

[0018] S1.3: The intermediate product is heated to 80-85°C, and then 20-30 parts by weight of epichlorohydrin is added, and then 10-20 parts by weight of 30% sodium hydroxide solution is slowly added to the reaction system within 20-30 minutes to continue the reaction for 2-3 hours, and then 100-120 parts by weight of ice water is added to the reaction system to terminate the reaction to obtain a reaction product;

[0019] S1.3: The reaction product is subjected to reduced pressure distillation to remove unreacted epichlorohydrin, and N,N-dimethylformamide, sodium hydroxide and sodium chloride generated during the reaction are removed by repeated centrifugal washing to obtain a hydrophobic epoxy resin.

[0020] Furthermore, step S2 of preparing the adhesive specifically comprises the following steps:

[0021] 6-8 parts by weight of hydrophobic epoxy resin and 2-3 parts by weight of epoxy resin are added into a disperser, and the mixture is stirred sufficiently and mixed evenly to obtain an adhesive.

[0022] Further, step S3 prepares the wear-resistant hydrophobic coating, which specifically comprises the following steps:

[0023] S3.1: Add 5-8 parts by weight of isopropanol, 0.08-0.09 parts by weight of tetramethylammonium hydroxide and 0.4-0.5 parts by weight of dimethyldimethoxysilane into a beaker, heat to 70-80° C., and stir in a magnetic stirring heater for 5-8 minutes to obtain an intermediate reactant;

[0024] S3.2: Add 1-2 parts by weight of ethyl orthosilicate, 0.5-1 parts by weight of n-octyltriethoxysilane, 0.1-0.2 parts by weight of γ-aminopropyltriethoxysilane and 1-2 parts by weight of hexadecyltrimethoxysilane to the intermediate reactant, and continue the reaction at 70-80°C for 45-50 minutes. After the reaction is completed, cool the mixture to obtain a wear-resistant and hydrophobic coating.

[0025] Furthermore, step S4 prepares a high-precision optoelectronic integrated circuit board, which specifically includes the following steps:

[0026] S4.1: 20-30 parts by weight of aluminum oxide, 3-5 parts by weight of mullite powder, 3-5 parts by weight of silicon dioxide, 4-6 parts by weight of calcium zirconate, 2-3 parts by weight of potassium carbonate, and 1-2 parts by weight of methanol are mixed and added into a ball mill, and ball milled for 20-30 minutes to obtain a mixed slurry;

[0027] S4.2: Add 4-8 parts by weight of adhesive and 2-3 parts by weight of curing agent to the mixed slurry and continue ball milling for 5-8 minutes to mix well to obtain a mixture;

[0028] S4.3: placing the mixture into a mold and keeping it at room temperature for 30-40 minutes, and then pressing and molding it at 100-120° C. to obtain a substrate;

[0029] S4.4: spraying the wear-resistant hydrophobic coating onto the substrate, placing the substrate in a vacuum drying oven for curing, and obtaining a hydrophobic wear-resistant substrate;

[0030] S4.5: Integrate electronic components onto a hydrophobic and wear-resistant substrate to produce a high-precision optoelectronic integrated circuit board.

[0031] Furthermore, in step S1.1, the stirring speed is 600-700 r / min, and the stirring time is 2-3 h.

[0032] Furthermore, in step S1.2, the amount of oleoyl chloride added is 25-50% of the corresponding lignin hydroxyl value.

[0033] Furthermore, the epoxy resin in step S2.1 is E-51 epoxy resin.

[0034] Furthermore, in step S4.2, the curing agent is T-31 type curing agent.

[0035] Furthermore, in step S4.4, the drying temperature is 140-150° C., and the curing time is 50-60 min.

[0036] Compared with the prior art, the present invention has at least the following beneficial effects:

[0037] 1. The present invention hydrophobically modifies lignin sulfonate by inserting hydrophobic long chains, and prepares hydrophobic epoxy resin by using the hydrophobic epoxy resin, thereby enhancing the hydrophobicity of the hydrophobic epoxy resin and improving the compatibility of lignin sulfonate with organic reagents in the process of preparing the hydrophobic epoxy resin. The prepared hydrophobic epoxy resin has good compatibility with the E-51 type epoxy resin component. The substrate prepared after adding the adhesive can be used normally in a humid environment, and the adhesive in the substrate can be prevented from absorbing water and affecting subsequent use.

[0038] 2. The present invention uses tetraethyl orthosilicate with good cross-linking function, which can link multiple silane coupling agent molecules into a stable network structure, and n-octyltriethoxysilane and hexadecyltrimethoxysilane have good hydrophobic ends and multiple active sites, so the prepared coating has strong hydrophobicity and stable structure. The coating has certain thermal stability and high high temperature stability, and the wear resistance of the coating can be increased by adding γ-aminopropyltriethoxysilane, thereby increasing the hydrophobicity and wear resistance of the substrate.

[0039] 3. A substrate is prepared by ball-milling and blending alumina, mullite powder, silica, calcium zirconate, potassium carbonate, adhesive and curing agent, and pressing the substrate into a coating. The electronic components are then integrated onto the hydrophobic and wear-resistant substrate to obtain a high-precision optoelectronic integrated circuit board. The integrated circuit board is an alumina substrate with excellent scratch resistance and wear resistance, and can reduce the impact of a humid environment on the integrated circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] The accompanying drawings, which are incorporated herein and constitute a part of the specification, illustrate embodiments of the present disclosure and, together with the description, further serve to explain the principles of the present disclosure and to enable those skilled in the relevant art to make and use the present disclosure.

[0041] Figure 1 The present invention is a process flow chart of a high-precision optoelectronic integrated circuit board. DETAILED DESCRIPTION

[0042] The following is a detailed description of a processing technology of a high-precision optoelectronic integrated circuit board provided by the present invention in combination with the accompanying drawings and specific embodiments. At the same time, it is explained here that in order to make the embodiments more detailed, the following embodiments are the best and preferred embodiments, and those skilled in the art may also adopt other alternative methods to implement some known technologies; and the accompanying drawings are only for a more specific description of the embodiments, and are not intended to specifically limit the present invention. Example 1

[0043] A processing technology for high-precision optoelectronic integrated circuit boards, such as Figure 1 As shown, the following steps are included:

[0044] S1: Preparation of hydrophobic epoxy resin

[0045] S1.1: 10 parts by weight of dried magnesium lignin sulfonate are placed in a three-necked flask, and then 90 parts by weight of N,N-dimethylformamide are added, and the mixture is stirred at 80°C and 600 r / min for 2 hours to completely dissolve the magnesium lignin sulfonate. After stirring, the temperature is lowered to 60°C, and 2 parts by weight of triethylamine are added to obtain a reaction system;

[0046] S1.2: Dissolve oleoyl chloride in 10 parts by weight of N,N-dimethylformamide to obtain a mixed solution, slowly add the mixed solution to the reaction system via a peristaltic pump within 20 minutes, and continue to react for 2 hours to obtain an intermediate product, wherein the amount of oleoyl chloride added is 25% of the corresponding lignin hydroxyl value;

[0047] S1.3: The intermediate product is heated to 80°C, and then 20 parts by weight of epichlorohydrin is added, and then 10 parts by weight of 30% sodium hydroxide solution is slowly added to the reaction system within 20 minutes to continue the reaction for 2 hours, and then 100 parts by weight of ice water is added to the reaction system to terminate the reaction to obtain a reaction product;

[0048] S1.3: removing unreacted epichlorohydrin from the reaction product by vacuum distillation, and removing N,N-dimethylformamide, sodium hydroxide and sodium chloride generated during the reaction by repeated centrifugal washing to obtain a hydrophobic epoxy resin;

[0049] S2: Preparation of adhesive

[0050] Add 6 parts by weight of hydrophobic epoxy resin and 2 parts by weight of E-51 epoxy resin into a disperser, stir them thoroughly, and mix them evenly to obtain an adhesive;

[0051] S3: Preparation of wear-resistant hydrophobic coating

[0052] S3.1: Add 5 parts by weight of isopropanol, 0.08 parts by weight of tetramethylammonium hydroxide and 0.4 parts by weight of dimethyldimethoxysilane into a beaker, heat to 70° C., and stir in a magnetic stirring heater for 5 minutes to obtain an intermediate reactant;

[0053] S3.2: 1 part by weight of ethyl orthosilicate, 0.5 part by weight of n-octyl triethoxysilane, 0.1 part by weight of γ-aminopropyl triethoxysilane and 1 part by weight of hexadecyl trimethoxysilane are added to the intermediate reactant, and the reaction is continued at 70° C. for 45 minutes. After the reaction is completed, the reaction is cooled to obtain a wear-resistant hydrophobic coating;

[0054] S4: Preparation of high-precision optoelectronic integrated circuit boards

[0055] S4.1: 20 parts by weight of aluminum oxide, 3 parts by weight of mullite powder, 3 parts by weight of silicon dioxide, 4 parts by weight of calcium zirconate, 2 parts by weight of potassium carbonate, and 1 part by weight of methanol were mixed and added into a ball mill, and ball milled for 20 minutes to obtain a mixed slurry;

[0056] S4.2: Add 4 parts by weight of adhesive and 2 parts by weight of T-31 curing agent to the mixed slurry and continue ball milling for 5 minutes to mix well to obtain a mixture;

[0057] S4.3: placing the mixture into a mold and keeping it at room temperature for 30 minutes, and then pressing and molding it at 100° C. to obtain a substrate;

[0058] S4.4: spraying the wear-resistant hydrophobic coating onto the substrate, placing the substrate in a vacuum drying oven at 140° C. for curing for 50 min to obtain a hydrophobic wear-resistant substrate;

[0059] S4.5: Integrate electronic components onto a hydrophobic and wear-resistant substrate to produce a high-precision optoelectronic integrated circuit board. Example 2

[0060] A processing technology for high-precision optoelectronic integrated circuit boards, such as Figure 1 As shown, the following steps are included:

[0061] S1: Preparation of hydrophobic epoxy resin

[0062] S1.1: 20 parts by weight of dried magnesium lignin sulfonate were placed in a three-necked flask, and 100 parts by weight of N,N-dimethylformamide were added, and the mixture was stirred at 80°C and 600 r / min for 2 hours to completely dissolve the magnesium lignin sulfonate. After stirring, the temperature was lowered to 60°C, and 3 parts by weight of triethylamine were added to obtain a reaction system;

[0063] S1.2: Dissolve oleoyl chloride in 12 parts by weight of N,N-dimethylformamide to obtain a mixed solution, slowly add the mixed solution to the reaction system via a peristaltic pump within 20 minutes, and continue to react for 2 hours to obtain an intermediate product, wherein the amount of oleoyl chloride added is 50% of the corresponding lignin hydroxyl value;

[0064] S1.3: The intermediate product is heated to 80°C, and then 30 parts by weight of epichlorohydrin is added, and then 20 parts by weight of 30% sodium hydroxide solution is slowly added to the reaction system within 20 minutes and the reaction is continued for 2 hours, and then 120 parts by weight of ice water is added to the reaction system to terminate the reaction to obtain a reaction product;

[0065] S1.3: removing unreacted epichlorohydrin from the reaction product by vacuum distillation, and removing N,N-dimethylformamide, sodium hydroxide and sodium chloride generated during the reaction by repeated centrifugal washing to obtain a hydrophobic epoxy resin;

[0066] S2: Preparation of adhesive

[0067] 8 parts by weight of a hydrophobic epoxy resin and 3 parts by weight of an E-51 epoxy resin were added into a disperser, and the mixture was stirred thoroughly to obtain an adhesive;

[0068] S3: Preparation of wear-resistant hydrophobic coating

[0069] S3.1: 8 parts by weight of isopropanol, 0.09 parts by weight of tetramethylammonium hydroxide and 0.5 parts by weight of dimethyldimethoxysilane are added to a beaker, heated to 70° C., and stirred in a magnetic stirring heater for 5 minutes to obtain an intermediate reactant;

[0070] S3.2: 2 parts by weight of ethyl orthosilicate, 1 part by weight of n-octyl triethoxysilane, 0.2 parts by weight of γ-aminopropyl triethoxysilane and 2 parts by weight of hexadecyl trimethoxysilane are added to the intermediate reactant, and the reaction is continued at 70° C. for 45 minutes. After the reaction is completed, the reaction is cooled to obtain a wear-resistant hydrophobic coating;

[0071] S4: Preparation of high-precision optoelectronic integrated circuit boards

[0072] S4.1: 30 parts by weight of aluminum oxide, 5 parts by weight of mullite powder, 5 parts by weight of silicon dioxide, 6 parts by weight of calcium zirconate, 3 parts by weight of potassium carbonate, and 2 parts by weight of methanol were added to a ball mill and ball-milled for 20 minutes to obtain a mixed slurry;

[0073] S4.2: Add 8 parts by weight of adhesive and 3 parts by weight of T-31 curing agent to the mixed slurry and continue ball milling for 5 minutes to mix well to obtain a mixture;

[0074] S4.3: placing the mixture into a mold and keeping it at room temperature for 30 minutes, and then pressing and molding it at 100° C. to obtain a substrate;

[0075] S4.4: spraying the wear-resistant hydrophobic coating onto the substrate, placing the substrate in a vacuum drying oven at 140° C. for curing for 50 min to obtain a hydrophobic wear-resistant substrate;

[0076] S4.5: Integrate electronic components onto a hydrophobic and wear-resistant substrate to produce a high-precision optoelectronic integrated circuit board. Example 3

[0077] A processing technology for high-precision optoelectronic integrated circuit boards, such as Figure 1 As shown, the following steps are included:

[0078] S1: Preparation of hydrophobic epoxy resin

[0079] S1.1: 10 parts by weight of dried magnesium lignin sulfonate were placed in a three-necked flask, and then 90 parts by weight of N,N-dimethylformamide were added, and the mixture was stirred at 90°C and 700 r / min for 3 hours to completely dissolve the magnesium lignin sulfonate. After stirring, the temperature was lowered to 65°C, and 3 parts by weight of triethylamine were added to obtain a reaction system;

[0080] S1.2: Dissolve oleoyl chloride in 10 parts by weight of N,N-dimethylformamide to obtain a mixed solution, slowly add the mixed solution to the reaction system via a peristaltic pump within 30 minutes, and continue to react for 3 hours to obtain an intermediate product, wherein the amount of oleoyl chloride added is 25% of the corresponding lignin hydroxyl value;

[0081] S1.3: The intermediate product is heated to 85°C, and then 20 parts by weight of epichlorohydrin is added, and then 10 parts by weight of 30% sodium hydroxide solution is slowly added to the reaction system within 30 minutes to continue the reaction for 3 hours, and then 100 parts by weight of ice water is added to the reaction system to terminate the reaction to obtain a reaction product;

[0082] S1.3: removing unreacted epichlorohydrin from the reaction product by vacuum distillation, and removing N,N-dimethylformamide, sodium hydroxide and sodium chloride generated during the reaction by repeated centrifugal washing to obtain a hydrophobic epoxy resin;

[0083] S2: Preparation of adhesive

[0084] Add 6 parts by weight of hydrophobic epoxy resin and 2 parts by weight of E-51 epoxy resin into a disperser, stir them thoroughly, and mix them evenly to obtain an adhesive;

[0085] S3: Preparation of wear-resistant hydrophobic coating

[0086] S3.1: Add 5 parts by weight of isopropanol, 0.08 parts by weight of tetramethylammonium hydroxide and 0.4 parts by weight of dimethyldimethoxysilane into a beaker, heat to 80° C., and stir in a magnetic stirring heater for 8 minutes to obtain an intermediate reactant;

[0087] S3.2: 1 part by weight of ethyl orthosilicate, 0.5 part by weight of n-octyl triethoxysilane, 0.1 part by weight of γ-aminopropyl triethoxysilane and 1 part by weight of hexadecyl trimethoxysilane are added to the intermediate reactant, and the reaction is continued at 80° C. for 50 min. After the reaction is completed, the reaction is cooled to obtain a wear-resistant hydrophobic coating;

[0088] S4: Preparation of high-precision optoelectronic integrated circuit boards

[0089] S4.1: 20 parts by weight of aluminum oxide, 3 parts by weight of mullite powder, 3 parts by weight of silicon dioxide, 4 parts by weight of calcium zirconate, 2 parts by weight of potassium carbonate, and 1 part by weight of methanol were mixed and added into a ball mill, and ball milled for 30 minutes to obtain a mixed slurry;

[0090] S4.2: Add 4 parts by weight of adhesive and 2 parts by weight of T-31 curing agent to the mixed slurry and continue to ball mill for 8 minutes to mix well to obtain a mixture;

[0091] S4.3: placing the mixture into a mold and keeping it at room temperature for 40 minutes, and then pressing and molding it at 120° C. to obtain a substrate;

[0092] S4.4: spraying the wear-resistant hydrophobic coating onto the substrate, placing the substrate in a vacuum drying oven at 150° C. for curing for 60 min to obtain a hydrophobic wear-resistant substrate;

[0093] S4.5: Integrate electronic components onto a hydrophobic and wear-resistant substrate to produce a high-precision optoelectronic integrated circuit board.

[0094] Compared with Example 1, the difference between Comparative Example 1 is that Comparative Example 1 is a circuit board substrate disclosed in Chinese patent CN105646862A, and is recorded as Comparative Example 1.

[0095] Compared with Example 1, the difference of Comparative Example 2 is that the adhesive in Comparative Example 2 is E-51 epoxy resin adhesive, and the other steps remain unchanged to prepare a high-precision optoelectronic integrated circuit board, which is recorded as Comparative Example 2.

[0096] The hydrophobic and wear-resistant substrates prepared in Examples 1-3 and the substrates prepared in Comparative Examples 1-2 were weighed, and then all the substrates were immersed in water for 15 hours and 24 hours, and weighed again to calculate the percentage increase in the mass of the substrates. The results are shown in Table 1:

[0097] Percentage of mass increase after immersion for 15h Percentage of mass increase after 24h immersion Example 1 0% 0% Example 2 0% 0.01% Example 3 0% 0.02% Comparative Example 1 1.78% 3.64% Comparative Example 2 3.84% 5.49%

[0098] It can be seen from Table 1 that the hydrophobic and wear-resistant substrate prepared in the embodiment has a lower immersion mass growth percentage than that of comparative examples 1-2, indicating that the hydrophobic and wear-resistant substrate prepared in the embodiment has good waterproof and moisture-proof effects. The immersion mass growth percentage of comparative example 2 is higher than that of the embodiment, indicating that the adhesive added in the embodiment has a certain hydrophobicity, which in turn increases the hydrophobicity of the hydrophobic and wear-resistant substrate.

[0099] Compared with Example 1, the difference of Comparative Example 3 is that Comparative Example 3 removes steps S3 and S4.4, and the other steps remain unchanged to prepare a high-precision optoelectronic integrated circuit board, which is recorded as Comparative Example 3.

[0100] The hydrophobic wear-resistant substrates prepared in Examples 1-3 and the substrates prepared in Comparative Examples 1 and 3 were fixed, and the planes of three half steel balls with a diameter of 12 mm were used as abrasive pieces to slide on the substrates. The load between the abrasive pieces and the substrates was 5 N / mm 2 The relative motion speed between the wear piece and the substrate is 3.35 m / s, the dry friction is 10 min, and the wear quality is tested. The results are shown in Table 2:

[0101] Wear mass (g) Percentage of mass increase after immersion for 15h Percentage of mass increase after 24h immersion Example 1 0.012 0% 0% Example 2 0.012 0% 0.01% Example 3 0.014 0% 0.02% Comparative Example 1 0.366 1.78% 3.64% Comparative Example 3 0.142 0.79% 1.21%

[0102] It can be seen from Table 2 that the wear mass of the embodiments is much lower than that of the comparative examples, indicating that the hydrophobic and wear-resistant substrate prepared in the embodiments has higher scratch resistance and wear resistance. The wear mass of comparative example 3 is much higher than that of the embodiments, indicating that the coating can increase the wear resistance of the substrate. The immersion mass growth percentage of comparative example 3 is higher than that of the embodiments, indicating that the coating has a certain waterproof and moisture-proof effect and can increase the waterproof ability of the substrate.

[0103] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A processing technology for high-precision optoelectronic integrated circuit boards, characterized in that: The steps include: S1: Preparation of hydrophobic epoxy resin The hydrophobic epoxy resin is prepared by reacting magnesium lignin sulfonate, N,N-dimethylformamide, triethylamine, oleyl chloride, epichlorohydrin and sodium hydroxide; S2: Preparation of adhesive S3: Preparation of wear-resistant hydrophobic coating A wear-resistant hydrophobic coating is prepared by reacting isopropyl alcohol, tetramethylammonium hydroxide and dimethyldimethoxysilane, and adding ethyl orthosilicate, n-octyltriethoxysilane, γ-aminopropyltriethoxysilane and hexadecyltrimethoxysilane to react again. S4: Preparation of high-precision optoelectronic integrated circuit boards A substrate is prepared by ball-milling and blending alumina, mullite powder, silicon dioxide, calcium zirconate, potassium carbonate, an adhesive and a curing agent, and the substrate is coated to obtain a hydrophobic and wear-resistant substrate, and electronic components are integrated on the hydrophobic and wear-resistant substrate to obtain a high-precision optoelectronic integrated circuit board; Wherein, step S2 prepares the adhesive, specifically comprising the following steps: Add 6-8 parts by weight of hydrophobic epoxy resin and 2-3 parts by weight of epoxy resin into a disperser, stir them thoroughly, and mix them evenly to obtain an adhesive; Step S3 prepares the wear-resistant hydrophobic coating, which specifically includes the following steps: S3.1: Add 5-8 parts by weight of isopropanol, 0.08-0.09 parts by weight of tetramethylammonium hydroxide and 0.4-0.5 parts by weight of dimethyldimethoxysilane into a beaker, heat to 70-80° C., and stir in a magnetic stirring heater for 5-8 minutes to obtain an intermediate reactant; S3.2: 1-2 parts by weight of ethyl orthosilicate, 0.5-1 parts by weight of n-octyl triethoxysilane, 0.1-0.2 parts by weight of γ-aminopropyl triethoxysilane and 1-2 parts by weight of hexadecyl trimethoxysilane are added to the intermediate reactant, and the reaction is continued at 70-80° C. for 45-50 minutes. After the reaction is completed, the reaction is cooled to obtain a wear-resistant hydrophobic coating; Step S4 prepares a high-precision optoelectronic integrated circuit board, which specifically includes the following steps: S4.1: 20-30 parts by weight of aluminum oxide, 3-5 parts by weight of mullite powder, 3-5 parts by weight of silicon dioxide, 4-6 parts by weight of calcium zirconate, 2-3 parts by weight of potassium carbonate, and 1-2 parts by weight of methanol are mixed and added into a ball mill, and ball milled for 20-30 minutes to obtain a mixed slurry; S4.2: Add 4-8 parts by weight of adhesive and 2-3 parts by weight of curing agent to the mixed slurry and continue ball milling for 5-8 minutes to mix well to obtain a mixture; S4.3: placing the mixture into a mold and keeping it at room temperature for 30-40 minutes, and then pressing and molding it at 100-120° C. to obtain a substrate; S4.4: spraying a wear-resistant hydrophobic coating onto a substrate, placing the substrate in a vacuum drying oven for curing, and obtaining a hydrophobic wear-resistant substrate; S4.5: Integrate electronic components onto a hydrophobic and wear-resistant substrate to produce a high-precision optoelectronic integrated circuit board.

2. The processing technology of a high-precision optoelectronic integrated circuit board according to claim 1 is characterized in that: Step S1 prepares a hydrophobic epoxy resin, specifically comprising the following steps: S1.1: 10-20 parts by weight of dried magnesium lignin sulfonate are placed in a three-necked flask, and then 90-100 parts by weight of N,N-dimethylformamide are added, and stirred at 80-90°C to completely dissolve the magnesium lignin sulfonate. After stirring, the temperature is lowered to 60-65°C, and 2-3 parts by weight of triethylamine are added to obtain a reaction system; S1.2: Dissolve oleoyl chloride in 10-12 parts by weight of N,N-dimethylformamide to obtain a mixed solution, slowly add the mixed solution dropwise to the reaction system over 20-30 minutes using a peristaltic pump, and continue to react for 2-3 hours to obtain an intermediate product; S1.3: The intermediate product is heated to 80-85°C, and then 20-30 parts by weight of epichlorohydrin is added, and then 10-20 parts by weight of 30% sodium hydroxide solution is slowly added to the reaction system within 20-30 minutes to continue the reaction for 2-3 hours, and then 100-120 parts by weight of ice water is added to the reaction system to terminate the reaction to obtain a reaction product; S1.4: The reaction product is subjected to reduced pressure distillation to remove unreacted epichlorohydrin, and N,N-dimethylformamide, sodium hydroxide and sodium chloride generated during the reaction are removed by repeated centrifugal washing to obtain a hydrophobic epoxy resin.

3. The processing technology of a high-precision optoelectronic integrated circuit board according to claim 2 is characterized in that: In step S1.1, the stirring speed is 600-700 r / min, and the stirring time is 2-3 h.

4. The processing technology of a high-precision optoelectronic integrated circuit board according to claim 2, characterized in that: In step S1.2, the amount of oleoyl chloride added is 25-50% of the corresponding lignin hydroxyl value.

5. The processing technology of a high-precision optoelectronic integrated circuit board according to claim 1, characterized in that: The epoxy resin in step S2 is E-51 epoxy resin.

6. The processing technology of a high-precision optoelectronic integrated circuit board according to claim 1, characterized in that: The curing agent in step S4.2 is T-31 type curing agent.

7. The processing technology of a high-precision optoelectronic integrated circuit board according to claim 1, characterized in that: In step S4.4, the drying temperature is 140-150° C. and the curing time is 50-60 min.

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