A shock-absorbing dual-refrigerant circulation cooling wafer cutting device

Abstract

The present invention discloses a damping type dual-refrigerant circulation cooling wafer cutting device, which relates to the field of wafer cutting technology, and includes a main body, an air pump and a water pump. A protective cover is provided on one side of the main body, a blade is provided inside the protective cover, a driving motor is provided between the protective cover and the blade, the main body controls the protective cover to move horizontally, the lower end surface of the protective cover is higher than the lower end surface of the blade, a carrier is provided below the inside of the main body, the carrier is used to fix the wafer, and the gap between the protective cover and the blade is filled with coolant, the coolant is mainly located on both sides of the blade, and the coolant is provided to limit the deflection of the blade during rotation. The present invention fills the outer side of the blade with coolant, and when the blade vibrates, that is, deflects, the coolant flow will generate additional torque on the blade, thereby increasing resistance, so that the deflection angle of the blade is reduced, and then the vibration generated by the blade when processing the wafer is reduced.

Description

Technical Field

[0001] The invention relates to the technical field of wafer cutting, and in particular to a shock-absorbing dual-refrigerant circulation cooling wafer cutting device. Background Art

[0002] The DBG wafer cutting process is to first form a groove on the wafer through a half-cutting process. The depth of the groove is approximately half of the thickness of the wafer without completely penetrating the wafer. In the subsequent process, the wafer is turned over and the back side of the wafer is polished until it contacts the groove on the other side of the wafer. The back side thinning is performed on the basis of the groove formed by the half-cutting. By gradually thinning the back side of the wafer, the chip separation is finally achieved.

[0003] Currently, wafers thicker than 100um are mostly separated by diamond blade cutting. DBG uses a high-speed rotating blade to pre-cut the wafer. However, the high-speed rotation of the blade is easily affected by external forces and the coordination between the parts of the device itself, causing the blade to swing during processing, which in turn causes cracks in the edge area of ​​the wafer. Summary of the invention

[0004] The object of the present invention is to provide a shock-absorbing dual-refrigerant circulation cooling wafer cutting device to solve the problems raised in the above-mentioned background technology.

[0005] In order to solve the above technical problems, the present invention provides the following technical solutions: a damping type dual-refrigerant circulation cooling wafer cutting device, comprising a main body, an air pump and a water pump, a protective cover is arranged on one side of the main body, a blade is arranged inside the protective cover, a driving motor is arranged between the protective cover and the blade, the main body controls the protective cover to move horizontally, the lower end surface of the protective cover is higher than the lower end surface of the blade, a carrier plate is arranged at the lower part of the main body, and the carrier plate is used to fix the wafer;

[0006] A chamber is provided inside the protective cover, and a coolant is stored inside the chamber. The gap between the protective cover and the blade is filled with the coolant, and the coolant is mainly located on both sides of the blade. The coolant is provided to limit the deflection of the blade during rotation;

[0007] The water pump pumps the coolant into the chamber, and then the coolant overflows from the bottom of the protective cover, and finally the overflowed coolant moves to the movement path of the blade. The air pump is used to provide high-pressure airflow, and the output end point of the high-pressure airflow is the contact point between the wafer and the blade;

[0008] This device adopts DBG wafer cutting process. The DBG wafer cutting process is to first form a groove on the wafer through a half-cutting process. The depth of the groove is about half of the thickness of the wafer, and the wafer is not completely penetrated. In the subsequent process, the wafer is turned over and the back of the wafer is polished until it contacts the groove on the other side of the wafer. The back thinning is performed on the basis of the groove formed by the half-cutting. By gradually thinning the back of the wafer, the chip separation is finally achieved.

[0009] Before the device works, the wafer to be processed is placed on the carrier, and then the water pump, air pump and main body are started to work. The main body controls the protective cover and the blade to move to one side of the wafer. Then the main body and the carrier adjust the positions of the blade and the wafer respectively. Then the drive motor is started. Under the action of the drive motor, the blade rotates at a high speed relative to the protective cover. At this time, the wafer can be cut. During the wafer cutting process, it is necessary to cut a number of criss-cross grooves on the surface of the wafer, and the spacing between two parallel grooves is the same, and the intersecting grooves are perpendicular to each other. The main body is mainly used to control the horizontal displacement of the blade during the cutting process, and the carrier is used to control the rotation of the wafer to cooperate with the main body and the blade to achieve mutually perpendicular grooves on the wafer surface. Secondly, the main body controls the blade to move relative to the wafer at the same time;

[0010] A cavity is provided inside the protective cover, and the cavity is filled with coolant. Coolant overflow ports are provided on both sides of the bottom of the protective cover, which are located on both sides of the direction of travel of the blade. The function of filling the cavity with coolant is as follows: most areas of the blade are immersed in the coolant. When the blade vibrates during rotation, the blade is deflected in a non-rotating direction in the coolant. When the blade deflects, the surfaces on both sides of the blade are covered with coolant with the axis of the blade as the center of the deflection circle. When the blade vibrates or deflects, the coolant flow will generate additional torque on the blade, thereby increasing resistance, reducing the deflection angle of the blade, and making the deflection angle of the blade meet the error range of processing. At the same time, when the blade rotates normally, due to the low viscosity of the coolant, the surfaces on both sides of the blade are smooth, and the relative position of the blade will not change during operation, so when the blade rotates, the resistance generated by the coolant on the blade is small, and the coolant can cover and cool the blade.

[0011] Furthermore, a spacer ring is provided inside the protective cover, the spacer ring divides the chamber into two inner and outer chambers, and an opening is provided above the spacer ring, the opening is used to connect the inner and outer chambers;

[0012] The inner chamber is circular, the outer chamber is annular, and the coolant in the outer chamber mainly overflows from both sides below the protective cover;

[0013] The spacer ring is set on both sides of the blade to provide a limiting structure for the blade, limit the deflection angle of the blade, and further improve the stability of the blade rotation. At the same time, the spacer ring divides the chamber into two parts, wherein the chamber includes an inner chamber and an outer chamber, and the inner chamber and the outer chamber are connected through an opening on the top. The cooling liquid enters from one side of the inner chamber and then flows from the inner chamber to the outer chamber through the opening. The passing cross-sectional area of ​​the outer chamber is smaller than the passing cross-sectional area of ​​the inner chamber, so that the flow rate of the cooling liquid in the inner chamber is greater than the flow rate of the cooling liquid in the outer chamber. At the same time, the area covered by the cooling liquid in the outer chamber is the working area of ​​the blade, that is, the blade in the outer chamber directly generates friction with the wafer, so that the temperature of the outer side of the blade is higher than the temperature of the inner side of the blade. By accelerating the speed of the cooling liquid flowing through the outer area of ​​the blade, the working area of ​​the blade is quickly cooled;

[0014] At the same time, the working area on the outside of the blade is covered with diamond fragments. From a microscopic perspective, the diamond fragments are protruding relative to the blade. When the blade is cutting the wafer, some debris will be stuck in the grooves of the diamond fragments. The diamond rotates synchronously with the blade. The protruding diamond fragments will drive the nearby coolant to move in the chamber. Since the diamond fragments are irregular in shape, when the diamond fragments drive the coolant to move, the wafer debris stuck in the gap between the diamond fragments will be affected by the coolant with different flow rates in various areas of the surface. There will be differences in pressure in various areas outside the wafer debris. Combined with the centrifugal force on the wafer debris, the wafer debris is separated from the diamond fragments, and finally the debris is separated from the blade, avoiding the debris from participating in the wafer cutting process.

[0015] Furthermore, two sliders are provided on both sides of the bottom of the protective cover, the sliders are provided on both sides of the blade, and the sliders are slidably connected to the protective cover;

[0016] The sliders are located on both sides of the bottom of the protective cover, and the coolant inside the chamber leaves from both sides of the bottom of the protective cover, wherein the sliders are used to limit the coolant leaving area, and the main body controls the protective cover and the blade to move horizontally above the wafer. Since multiple parallel grooves need to be processed on the surface of the wafer, the blade needs to reciprocate on the surface of the wafer, and thus the main body needs to control the protective cover and the blade to change direction. When the protective cover and the blade change direction, under the action of inertia, the two sliders below will slide horizontally relative to the protective cover, and the two sliders move in the same direction, that is, one of the sliders approaches the blade. Since the slider is close to the blade, the coolant overflow port under the protective cover is blocked by the slider, so that the coolant overflow port at the slider on the side close to the blade is blocked, and the other slider is away from the blade, so that the coolant overflow port at the slider on the side away from the blade is maximized, that is, when the protective cover and the blade complete the change of direction, the coolant overflow port located in the direction of blade movement is in an open state, ensuring that there is always a clean coolant supply on the blade movement path.

[0017] Furthermore, a channel is provided inside the protective cover, one end of the channel is connected to the air pump, and the output end of the channel faces the contact point between the blade and the wafer;

[0018] As the slider slides, the output end of the channel on the side opposite to the movement direction of the blade is closed by the slider, and the output end of the channel on the other side can naturally output high-pressure air. The output direction of the high-pressure air is toward the contact point between the blade and the wafer, and cooperates with the coolant output on one side of the protective cover to accelerate the flow of coolant in the contact area between the blade and the wafer. At the same time, cooperate with the airflow to further improve the cooling effect of the blade in the contact area with the wafer.

[0019] Furthermore, two liquid storage tanks are provided on one side of the main body, the two liquid storage tanks are respectively a low-pressure tank and a high-pressure tank, a filter is provided inside the low-pressure tank, and a refrigeration device is provided inside the high-pressure tank;

[0020] The used coolant is collected and then enters the low-pressure box. Then the coolant is filtered through the filter and passes through the high-pressure box. Finally, the coolant enters the chamber inside the protective cover again under the action of the water pump.

[0021] During the wafer cutting process, a large amount of coolant containing wafer debris will be generated. The coolant is collected and enters the low-pressure box. The coolant with wafer debris is filtered through the filter and enters the high-pressure box. Finally, under the action of the water pump, the filtered coolant enters the chamber inside the protective cover to participate in the subsequent wafer cutting process and realize the coolant circulation.

[0022] Furthermore, a control pump is provided between the low-pressure box and the high-pressure box, and the control pump extracts air from the low-pressure box and inputs it into the high-pressure box. An atomizing nozzle is provided below the filter screen;

[0023] The setting of the control pump is continuously drawn to continuously extract the air inside the low-pressure box, so that the air pressure inside the low-pressure box is always in a low-pressure state, wherein the coolant is in a high-pressure state before being sprayed out from the inside of the atomizing nozzle, and then when the coolant is sprayed out from the inside of the atomizing nozzle, the coolant with the wafer debris instantly enters the low-pressure space from the high-pressure state, and at the same time, the coolant appears in the low-pressure box in an atomized state at the initial stage of spraying, so that the coolant is quickly atomized, and at the same time, the wafer debris inside the coolant is in a solid state and cannot be vaporized, thereby realizing the separation of the coolant and the wafer debris;

[0024] The internal space of the high-pressure box is in a high-pressure state. At the same time, a refrigeration equipment is installed inside the high-pressure box. The vaporized coolant is liquefied again in the high-pressure and low-temperature space, and then enters the protective cover driven by the water pump. The inside of the protective cover is a normal-pressure space. After the coolant enters the normal-pressure space from the high-pressure space, the temperature will drop further, thereby improving the cooling effect on the blade.

[0025] Furthermore, the filter screen is arranged in multiple layers, there are gaps between each layer of the filter screen, the filter screen is composed of horizontal wires and vertical wires, the nodes where the horizontal wires and the vertical wires of each layer of the filter screen intersect are located on the vertical plane where the diagonal line is located, and the horizontal distance between each group of two adjacent nodes is the same;

[0026] The setting of the filter screen, several layers of filter screens cooperate with each other, the projection spacing between the longitudinal and transverse wires on the plane is denser, the debris moves in a straight line after leaving the atomizing nozzle with the coolant, and is intercepted by the interception net composed of several layers of filter screens during the rising period. Since the gap between each layer of filter screen is large, after the filter screen has an interception effect on the debris, the gap between the filter screens cannot provide support for the debris, and the debris falls naturally under the action of gravity after interception.

[0027] Furthermore, each layer of the filter screen is provided with only transverse wires or longitudinal wires, and two adjacent layers of the filter screen are provided with transverse wires and longitudinal wires respectively, and the wires in the same direction are equidistantly distributed in the projection;

[0028] Each filter layer is composed of a number of parallel and equidistant filaments. The filaments on the adjacent upper and lower filter layers are perpendicular to each other, that is, a mesh structure is formed between the upper and lower filter layers, and the projection of the filter on the vertical plane is in the same direction, and each group of filaments is equidistantly distributed;

[0029] While keeping the interception density unchanged, the gaps in each layer of filter are transformed from square to long rectangle to reduce the density of debris falling after interception and achieve a self-cleaning effect of the filter.

[0030] Compared with the prior art, the beneficial effects achieved by the present invention are:

[0031] Both sides of the blade are covered with coolant. When the blade vibrates or deflects, the coolant flow will generate additional torque on the blade, thereby increasing resistance, reducing the deflection angle of the blade and reducing the vibration of the blade during high-speed rotation. Secondly, the surfaces of both sides of the blade are smooth, so the coolant generates less resistance to the blade, and the coolant can cover and cool the blade.

[0032] The slider moves under the action of inertia, so that the coolant overflow port located in the direction of blade movement is in an open state, ensuring that there is always a clean supply of coolant on the blade movement path. At the same time, with the high-speed airflow inside the channel, the flow of coolant in the contact area between the blade and the wafer is accelerated, further improving the cooling effect of the blade in the contact area with the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0034] Figure 1 It is a schematic diagram of the main structure of the present invention;

[0035] Figure 2 is a schematic diagram of the three-dimensional structure of the protective cover of the present invention;

[0036] Figure 3 This is a schematic diagram of the overall structure of the protective cover and its internal mechanism according to the present invention;

[0037] Figure 4 This is a schematic diagram of the full cross-sectional structure of the spacer ring of the present invention;

[0038] Figure 5 This is a schematic diagram of the full cross-sectional structure of the channel of the present invention;

[0039] Figure 6 This is a schematic diagram of the full cross-section structure of the low-voltage box of the present invention;

[0040] Figure 7 2 is a schematic diagram of the structure of two adjacent layers of staggered filter screens of the present invention (solid lines and dotted lines are filter screens of different layers);

[0041] Figure 8 It is a schematic diagram of the structure of the layered filter screen with two adjacent layers of transverse and longitudinal wires of the present invention (the solid line and the dotted line represent filter screens of different layers).

[0042] In the figure: 1. main body; 2. protective cover; 201. spacer ring; 3. blade; 4. carrier plate; 5. liquid storage tank; 501. low-pressure tank; 502. high-pressure tank; 6. slider; 7. channel; 8. filter; 9. atomizing nozzle. DETAILED DESCRIPTION

[0043] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0044] See also Figure 1-Figure 8 The present invention provides a technical solution: a damping type dual-refrigerant circulation cooling wafer cutting device, comprising a main body 1, an air pump and a water pump, a protective cover 2 is arranged on one side of the main body 1, a blade 3 is arranged inside the protective cover 2, a driving motor is arranged between the protective cover 2 and the blade 3, the main body 1 controls the protective cover 2 to move horizontally, and the lower end surface of the protective cover 2 is higher than the lower end surface of the blade 3;

[0045] A chamber is provided inside the protective cover 2, and a coolant is stored inside the chamber. The gap between the protective cover 2 and the blade 3 is filled with the coolant, and the coolant is mainly located on both sides of the blade 3. The coolant is provided to limit the deflection of the blade 3 during rotation;

[0046] The water pump pumps the coolant into the chamber, and then the coolant overflows from the bottom of the protective cover 2, and finally the overflowed coolant moves to the movement path of the blade 3. The air pump is used to provide high-pressure airflow, and the output end point of the high-pressure airflow is the contact point between the wafer and the blade 3;

[0047] A spacer ring 201 is provided inside the protective cover 2, and the spacer ring 201 separates the chamber into two inner and outer chambers. An opening is provided above the spacer ring 201, and the opening is used to connect the inner and outer chambers. The inner chamber is circular, and the outer chamber is annular. The coolant in the outer chamber mainly overflows from both sides of the bottom of the protective cover 2;

[0048] Both sides of the blade 3 are covered by coolant. When the blade 3 vibrates, i.e. deflects, the coolant flow will generate additional torque on the blade 3, thereby increasing resistance, so that the deflection angle of the blade 3 is reduced, and vibration of the blade 3 during high-speed rotation is reduced. Secondly, the surfaces of both sides of the blade 3 are smooth, so the coolant generates less resistance to the blade 3, and the coolant can cover and cool the blade 3.

[0049] Two sliders 6 are provided on both sides of the bottom of the protective cover 2. The sliders 6 are provided on both sides of the blade 3. The sliders 6 are slidably connected to the protective cover 2.

[0050] A channel 7 is provided inside the protective cover 2, one end of the channel 7 is connected to the air pump, and the output end of the channel 7 faces the contact point between the blade 3 and the wafer;

[0051] The slider 6 moves under the action of inertia, so that the coolant overflow port located in the moving direction of the blade 3 is in an open state, ensuring that there is always a clean coolant supply on the moving path of the blade 3. At the same time, the high-speed airflow inside the channel 7 accelerates the flow of coolant in the contact area between the blade 3 and the wafer, further improving the cooling effect of the blade 3 in the contact area with the wafer;

[0052] A carrier plate 4 is provided at the lower part of the main body 1, and the carrier plate 4 is used to fix the wafer;

[0053] Two liquid storage tanks 5 are arranged on one side of the main body 1. The two liquid storage tanks 5 are respectively a low-pressure tank 501 and a high-pressure tank 502. A filter screen 8 is arranged inside the low-pressure tank 501, and a refrigeration device is arranged inside the high-pressure tank 502.

[0054] The used coolant is collected and then enters the low-pressure box 501. Then, the coolant is filtered through the filter 8 and passes through the high-pressure box 502. Finally, the coolant enters the chamber inside the protective cover 2 again under the action of the water pump. A control pump is arranged between the low-pressure box 501 and the high-pressure box 502. The control pump extracts the air inside the low-pressure box 501 and inputs it into the high-pressure box 502. An atomizing nozzle 9 is arranged below the filter 8.

[0055] The filter screen 8 is arranged in multiple layers, and there are gaps between each layer of the filter screen 8. The filter screen 8 is composed of horizontal wires and vertical wires. The nodes where the horizontal wires and vertical wires of each layer of the filter screen 8 intersect are located on the vertical plane where the diagonal lines are located, and the horizontal distance between each group of two adjacent nodes is the same.

[0056] Each layer of filter screen 8 is only provided with transverse wires or longitudinal wires, and two adjacent layers of filter screen 8 are provided with transverse wires and longitudinal wires respectively, and the wires in the same direction are equidistantly distributed in the projection.

[0057] Working principle of the present invention:

[0058] This device adopts DBG wafer cutting process. The DBG wafer cutting process is to first form a groove on the wafer through a half-cutting process. The depth of the groove is about half of the thickness of the wafer, and the wafer is not completely penetrated. In the subsequent process, the wafer is turned over and the back of the wafer is polished until it contacts the groove on the other side of the wafer. The back thinning is performed on the basis of the groove formed by the half-cutting. By gradually thinning the back of the wafer, the chip separation is finally achieved.

[0059] Before the device works, the wafer to be processed is placed on the carrier plate 4, and then the water pump, air pump and main body 1 are started to work. The main body 1 controls the protective cover 2 and the blade 3 to move to one side of the wafer. Then the main body 1 and the carrier plate 4 adjust the positions of the blade 3 and the wafer respectively, and then the driving motor is started. Under the action of the driving motor, the blade 3 rotates at a high speed relative to the protective cover 2, and the wafer can be cut at this time. In the wafer cutting process, it is necessary to cut a number of criss-cross grooves on the surface of the wafer, and the spacing between two parallel grooves is the same, and the intersecting grooves are perpendicular to each other. The main body 1 is mainly used to control the horizontal displacement of the blade 3 during the cutting process, and the carrier plate 4 is used to control the rotation of the wafer to cooperate with the main body 1 and the blade 3 to achieve mutually perpendicular grooves on the wafer surface. Secondly, the main body 1 controls the blade 3 to move relative to the wafer at the same time;

[0060] A cavity is provided inside the protective cover 2, and the cavity is filled with coolant. Coolant overflow ports are provided on both sides of the bottom of the protective cover 2, which are located on both sides of the direction of travel of the blade 3. The function of filling the cavity with coolant is that most of the area of ​​the blade 3 is immersed in the coolant. When the blade 3 vibrates during the rotation process, the blade 3 is deflected in the non-rotational direction in the coolant. When the blade 3 deflects, the axis of the blade 3 is taken as the deflection circle center, and both sides of the surface of the blade 3 are covered by coolant. When the blade 3 vibrates, that is, deflects, the coolant flow will generate additional torque on the blade 3, thereby increasing the resistance, so that the deflection angle of the blade 3 is reduced, so that the deflection angle of the blade 3 meets the error range of the processing. At the same time, when the blade 3 rotates normally, due to the low viscosity of the coolant, the surfaces of both sides of the blade 3 are smooth, and the relative position of the blade 3 will not change during operation, so when the blade 3 rotates, the resistance generated by the coolant on the blade 3 is small, and the coolant can cover and cool the blade 3.

[0061] The spacer ring 201 is set, and the spacer ring 201 is set on both sides of the blade 3 to provide a limiting structure for the blade 3, limit the deflection angle of the blade 3, and further improve the rotation stability of the blade 3. At the same time, the spacer ring 201 divides the chamber into two parts, wherein the chamber includes an inner chamber and an outer chamber, and the inner chamber and the outer chamber are connected through an opening at the top. The cooling liquid enters from one side of the inner chamber, and then flows from the inner chamber to the outer chamber through the opening. The cross-sectional area of ​​the outer chamber is smaller than the cross-sectional area of ​​the inner chamber, so that the flow rate of the cooling liquid in the inner chamber is greater than the flow rate of the cooling liquid in the outer chamber. At the same time, the area covered by the cooling liquid in the outer chamber is the working area of ​​the blade 3, that is, the blade 3 in the outer chamber directly generates friction with the wafer, so that the temperature of the outer side of the blade 3 is higher than the temperature of the inner side of the blade 3, and the speed of the cooling liquid flowing through the outer area of ​​the blade 3 is accelerated, thereby quickly cooling the working area of ​​the blade 3;

[0062] At the same time, the working area outside the blade 3 is covered with diamond fragments. From a microscopic perspective, the diamond fragments are protruding relative to the blade 3. When the blade 3 is cutting the wafer, some debris will be stuck in the groove of the diamond fragments. The diamond rotates synchronously with the blade 3. The protruding diamond fragments will drive the nearby coolant to move in the chamber. Since the diamond fragments are irregular in shape, when the diamond fragments drive the coolant to move, the wafer debris stuck in the gap between the diamond fragments will be affected by the coolant with different flow rates in various areas of the surface. There will be differences in the pressure of various areas outside the wafer debris. With the centrifugal force on the wafer debris, the wafer debris is separated from the diamond fragments, and finally the debris is separated from the blade 3, avoiding the debris from participating in the wafer cutting process.

[0063] The sliders 6 are located on both sides of the lower part of the protective cover 2, and the coolant in the chamber leaves from both sides of the lower part of the protective cover 2, wherein the sliders 6 are used to limit the area where the coolant leaves. The main body 1 controls the protective cover 2 and the blade 3 to move horizontally above the wafer. Since multiple parallel grooves need to be processed on the surface of the wafer, the blade 3 needs to reciprocate on the surface of the wafer, and thus the main body 1 needs to control the protective cover 2 and the blade 3 to change direction. When the protective cover 2 and the blade 3 change direction, under the action of inertia, the two sliders 6 below will slide horizontally relative to the protective cover 2, and the two sliders 6 move in the same direction, that is, one of the sliders 6 approaches the blade 3. Since the slider 6 is close to the blade 3, the coolant overflow outlet under the protective cover 2 is blocked by the slider 6, so that the coolant overflow outlet at the slider 6 on the side close to the blade 3 is blocked, and the other slider 6 is away from the blade 3, so that the coolant overflow outlet at the slider 6 on the side away from the blade 3 is maximized, that is, when the protective cover 2 and the blade 3 complete the change of direction, the coolant overflow outlet located in the movement direction of the blade 3 is in an open state, ensuring that there is always a clean coolant supply on the movement path of the blade 3;

[0064] As the slider 6 slides, the output end of the channel 7 on the side opposite to the moving direction of the blade 3 is closed by the slider 6, and the output end of the channel 7 on the other side can naturally output high-pressure air. The output direction of the high-pressure air is toward the contact point between the blade 3 and the wafer, and cooperates with the coolant output from one side of the protective cover 2 to accelerate the flow of the coolant in the contact area between the blade 3 and the wafer, and cooperates with the airflow to further improve the cooling effect of the blade 3 in the contact area with the wafer;

[0065] During wafer cutting, a large amount of coolant containing wafer debris is generated. The coolant is collected and enters the low-pressure box 501. The coolant containing wafer debris is filtered by the filter 8 and enters the high-pressure box 502. Finally, the filtered coolant enters the chamber inside the protective cover 2 under the action of the water pump, so as to participate in the subsequent wafer cutting process and realize the coolant circulation.

[0066] The setting of the control pump is to continuously extract the air inside the low-pressure box 501, so that the air pressure inside the low-pressure box 501 is always in a low-pressure state, wherein the coolant is in a high-pressure state before being sprayed out from the inside of the atomizing nozzle 9, and then when the coolant is sprayed out from the inside of the atomizing nozzle 9, the coolant with the wafer debris instantly enters the low-pressure space from the high-pressure state, and at the same time, the coolant appears in the low-pressure box 501 in an atomized state at the initial stage of spraying, so that the coolant is quickly atomized, and at the same time, the wafer debris inside the coolant is in a solid state and cannot be vaporized, thereby realizing the separation of the coolant and the wafer debris;

[0067] The internal space of the high-pressure box 502 is in a high-pressure state. At the same time, a refrigeration device is arranged inside the high-pressure box 502. The vaporized coolant is liquefied again in the high-pressure and low-temperature space, and then enters the protective cover 2 driven by a water pump. The inside of the protective cover 2 is a normal-pressure space. After the coolant enters the normal-pressure space from the high-pressure space, the temperature will further drop, thereby improving the cooling effect on the blade 3.

[0068] Embodiment 1: The setting of the filter screen 8, several layers of filter screens 8 cooperate with each other, the projection spacing between the longitudinal and transverse wires on the plane is denser, the debris follows the coolant to leave the atomizing nozzle 9 and moves in a straight line, and is intercepted by the interception net composed of several layers of filter screens 8 during the rising period. Since the gap between each layer of filter screen 8 is large, after the filter screen 8 has an interception effect on the debris, the gap between the filter screen 8 cannot provide support for the debris, and the debris falls naturally under the action of gravity after interception.

[0069] Embodiment 2: Each layer of the filter screen 8 is composed of a plurality of parallel equidistantly distributed filaments, and the filaments on the adjacent upper and lower layers of the filter screen 8 are perpendicular to each other, that is, a mesh structure is formed between the upper and lower layers of the filter screen 8, and the projection of the filter screen 8 on the vertical plane is in the same direction, and each group of filaments is equidistantly distributed;

[0070] While keeping the interception density unchanged, the gaps in each layer of the filter screen 8 are transformed from square to long rectangle to reduce the blocking density of debris falling after interception, thereby achieving the self-cleaning effect of the filter screen 8.

[0071] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0072] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A damping type dual-refrigerant circulation cooling wafer cutting device, comprising a main body (1), an air pump and a water pump, characterized in that: A protective cover (2) is provided on one side of the main body (1), a blade (3) is provided inside the protective cover (2), a driving motor is provided between the protective cover (2) and the blade (3), the main body (1) controls the protective cover (2) to move horizontally, the lower end surface of the protective cover (2) is higher than the lower end surface of the blade (3), a carrier plate (4) is provided below the inside of the main body (1), and the carrier plate (4) is used to fix the wafer; The protective cover (2) has a chamber formed inside, and a gap between the protective cover (2) and the blade (3) is filled with a coolant, the coolant being mainly located on both sides of the blade (3), and the coolant being provided to limit deflection of the blade (3) during rotation; The water pump pumps the coolant into the chamber, and then the coolant overflows from the bottom of the protective cover (2), and finally the overflowed coolant moves to the movement path of the blade (3). The air pump is used to provide high-pressure airflow, and the output end point of the high-pressure airflow is the contact point between the wafer and the blade (3).

2. The damping type dual-refrigerant circulation cooling wafer cutting device according to claim 1, characterized in that: A spacer ring (201) is provided inside the protective cover (2), the spacer ring (201) partitioning the chamber into two inner and outer chambers, and an opening is provided above the spacer ring (201), the opening being used to connect the two inner and outer chambers; The inner chamber is circular, and the outer chamber is annular. The coolant in the outer chamber mainly overflows from both sides below the protective cover (2).

3. The damping type dual-refrigerant circulation cooling wafer cutting device according to claim 2, characterized in that: Two sliders (6) are provided on both sides below the protective cover (2); the sliders (6) are provided on both sides of the blade (3); and the sliders (6) are slidably connected to the protective cover (2).

4. The damping type dual-refrigerant circulation cooling wafer cutting device according to claim 3 is characterized in that: A channel (7) is provided inside the protective cover (2), one end of the channel (7) is connected to an air pump, and an output end of the channel (7) faces the contact point between the blade (3) and the wafer.

5. A damping type dual-refrigerant circulation cooling wafer cutting device according to claim 1 or 4, characterized in that: Two liquid storage tanks (5) are arranged on one side of the main body (1), the two liquid storage tanks (5) being a low-pressure tank (501) and a high-pressure tank (502), respectively; a filter screen (8) is arranged inside the low-pressure tank (501), and a refrigeration device is arranged inside the high-pressure tank (502); The used coolant is collected and enters the low-pressure box (501), and then the coolant is filtered through the filter (8) and passes through the high-pressure box (502). Finally, the coolant enters the chamber in the protective cover (2) again under the action of the water pump.

6. The damping type dual-refrigerant circulation cooling wafer cutting device according to claim 5, characterized in that: A control pump is provided between the low-pressure box (501) and the high-pressure box (502), and the control pump extracts air from the low-pressure box (501) and inputs the air into the high-pressure box (502). An atomizing nozzle (9) is provided below the filter screen (8).

7. The damping type dual-refrigerant circulation cooling wafer cutting device according to claim 6, characterized in that: The filter screen (8) is arranged in multiple layers, and there are gaps between each layer of the filter screen (8). The filter screen (8) is composed of transverse wires and longitudinal wires. The intersection of the transverse wires and the longitudinal wires of each layer of the filter screen (8) is a node, and the horizontal distance between each group of two adjacent nodes is the same.

8. The damping type dual-refrigerant circulation cooling wafer cutting device according to claim 6, characterized in that: Each layer of the filter screen (8) is provided with only transverse threads or longitudinal threads, and two adjacent layers of the filter screen (8) are provided with transverse threads and longitudinal threads respectively, and threads in the same direction are equidistantly distributed in projection.

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