Filling glue and electronic products

Abstract

The present application discloses a filling glue and an electronic product. The filling glue comprises, by weight, a base resin, a curing agent and an auxiliary agent in the ratio of (8 to 35): (8 to 28): (1 to 10); the raw materials of the base resin comprise, by weight percentage, 65% to 85% of an epoxy resin, 5% to 25% of a multifunctional active diluent and 5% to 18% of a monofunctional active diluent; the curing agent comprises a first thiol curing agent, and the first thiol curing agent comprises a multi-branched polythiol curing agent. The filling glue provided by the present application can significantly improve the crosslinking density of the three-dimensional network through the macromolecular crosslinking effect, improve the tensile strength and elongation of the filling glue, and reduce the water absorption rate, and finally the filling glue has good mechanical properties and moisture resistance.

Description

Technical Field

[0001] The present application relates to the field of organic materials, and in particular to a filling glue and an electronic product. Background Art

[0002] Bottom filling technology is a technology that uses epoxy glue filled into the bottom of the device to absorb harmful stress during the use of the device, thereby improving the reliability of device welding. Commonly used bottom filling glue uses epoxy resin as the base material. By adding modifiers to the epoxy material, it is ensured that the bottom filling glue can effectively protect the solder joints during the use of the device. The performance of the bottom filling glue itself is the fundamental guarantee for determining the reliability of the device after bottom filling. Epoxy resin is usually brittle and is prone to cracking due to stress strain, heat, mechanical impact, etc. during the curing process or use.

[0003] Traditional fast-curing underfill glue usually adopts a single thiol-curing-epoxy resin system, which has low mechanical strength and high water absorption, which largely leads to thermomechanical performance failure and moisture failure, thus seriously affecting the protection of the ball grid array package (BGA) from mechanical impact and the effect of moisture on shear strength. Summary of the invention

[0004] Based on this, in order to improve the mechanical properties and moisture resistance of the filling glue, it is necessary to provide a filling glue and an electronic product.

[0005] The present application provides a filling glue, wherein the raw materials include (8~35) : (8~28) : (1~10) of a base resin, a curing agent and an auxiliary agent in parts by weight;

[0006] The raw materials of the base resin include, by mass percentage, 65% to 85% of epoxy resin, 5% to 25% of multifunctional active diluent, and 5% to 18% of monofunctional active diluent;

[0007] The curing agent includes a first thiol curing agent, and the first thiol curing agent includes a multi-branched polythiol curing agent.

[0008] In one embodiment, the viscosity of the epoxy resin is 200mPa.s~2000mPa.s.

[0009] In one embodiment, the thiol content of the multi-branched polythiol curing agent is 0.1 mol / 100 g to 0.5 mol / 100 g, and the structural formula of the multi-branched polythiol curing agent is shown in Formula I

[0010] Formula Ⅰ.

[0011] In one embodiment, the molar percentage of thiol in the multi-branched polythiol curing agent is 3% to 18%.

[0012] In one embodiment, the multifunctional reactive diluent includes one or more of 1,4-cyclohexanedimethanol diglycidyl ether, 1,4-butanediol diglycidyl ether, and 1,6-hexanediol diglycidyl ether.

[0013] In one embodiment, the monofunctional reactive diluent includes one or more of p-tert-butylphenyl glycidyl ether, cardanol glycidyl ether and phenyl glycidyl ether.

[0014] In one embodiment, the curing agent further includes a second thiol curing agent, and the second thiol curing agent includes one or more of pentaerythritol tetrakis-3-mercaptopropionate, pentaerythritol tetrakis mercaptoacetate, pentaerythritol tetrakis(3-mercaptobutyrate), trimethylolpropane tris(2-mercaptoacetate), trimethylolpropane tris(3-mercaptopropionate) and bis(3-mercaptopropionic acid) glycol.

[0015] In one embodiment, the auxiliary agent includes a curing accelerator, a defoaming agent and a filler in a mass ratio of (0.1~5): (0.1~5): (2~8).

[0016] The present application further provides an electronic product, including a chip and a substrate, wherein the chip and the substrate are connected via the filling glue as described above.

[0017] In one embodiment, the substrate includes a printed circuit board or a packaging substrate.

[0018] The filling glue provided in the present application can significantly improve the crosslinking density of the three-dimensional network through the crosslinking effect of macromolecules by optimizing the basic resin composition and using a curing agent containing multi-branched polythiol, thereby improving the tensile strength and elongation of the filling glue and reducing the water absorption rate. Finally, the filling glue has good mechanical properties and moisture resistance. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 The figure is the hydrogen nuclear magnetic resonance spectrum of the multi-branched polythiol curing agent GT-1 used in each example. DETAILED DESCRIPTION

[0021] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are given in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0023] the term:

[0024] The term "and / or" used herein includes any one of two or more related listed items, and also includes any and all combinations of the related listed items, wherein the any and all combinations include any combination of two related listed items, any more related listed items, or all related listed items. For example, "A and / or B" includes three parallel solutions: A, B, and "a combination of A and B".

[0025] In this article, unless otherwise specified, "one or more" means any one of the listed items or any combination of the listed items. Similarly, "one or more" and other expressions that mean "one or more" are also understood in the same way unless otherwise specified.

[0026] In this document, "further", "further", "particularly", "for example", "such as", "example", "for example", etc. are used for descriptive purposes, indicating that the previous and subsequent technical solutions are related in terms of the content covered, but should not be understood as limiting the previous technical solution, nor can they be understood as limiting the scope of protection of this document. In this document, unless otherwise specified, A (such as B) means that B is a non-limiting example of A, and it can be understood that A is not limited to B.

[0027] Herein, "optionally", "optional", and "optional" mean optional, that is, any one of the two parallel schemes of "yes" or "no". If multiple "optional" items appear in a technical solution, unless otherwise specified and there is no contradiction or mutual restriction, each "optional" item is independent of each other. In this application, descriptions such as "optionally contain", "optionally include", etc. mean "contain or not contain". "Optional component X" means that component X exists or does not exist, or means that component X is contained or not contained.

[0028] In this document, the terms "first", "second", "third", "fourth", etc. in "the first aspect", "the second aspect", "the third aspect", "the fourth aspect", etc. are used only for descriptive purposes and cannot be understood as indicating or implying relative importance or quantity, nor can they be understood as implicitly indicating the importance or quantity of the indicated technical features. Moreover, "first", "second", "third", "fourth", etc. only serve the purpose of non-exhaustive enumeration and description, and it should be understood that they do not constitute a closed limitation on quantity.

[0029] In this article, the technical features described in an open manner include closed technical solutions composed of the listed features, and also include open technical solutions containing the listed features.

[0030] Herein, when it comes to a numerical interval (i.e., a numerical range), unless otherwise specified, the distribution of the optional numerical values ​​within the numerical interval is considered to be continuous and includes the two numerical endpoints (i.e., the minimum and maximum values) of the numerical interval, and each numerical value between the two numerical endpoints. Unless otherwise specified, when a numerical interval only refers to integers within the numerical interval, including the two endpoint integers of the numerical range, and each integer between the two endpoints, is equivalent to directly listing each integer. When multiple numerical ranges are provided to describe features or characteristics, these numerical ranges can be combined. In other words, unless otherwise specified, the numerical ranges disclosed herein should be understood to include any and all sub-ranges included therein. The "numerical value" in the numerical interval can be any quantitative value, such as a number, a percentage, a ratio, etc. "Numerical interval" allows broadly including numerical interval types such as percentage intervals, ratio intervals, and ratio intervals.

[0031] Herein, the term "room temperature" or "normal temperature" generally refers to 4°C to 35°C, for example, 20°C ± 5°C. In some embodiments herein, "room temperature" or "normal temperature" refers to 10°C to 30°C. In some embodiments herein, "room temperature" or "normal temperature" refers to 20°C to 30°C.

[0032] In this article, if there are multiple steps involved in the method flow, unless there is a clear different description in this article, there is no strict order restriction for the execution of these steps, and they can be executed in other orders than described. Moreover, any step can include multiple sub-steps or multiple stages, and these sub-steps or stages are not necessarily executed at the same time, but can be executed at different times, and their execution order is not necessarily sequential, but can be executed in turn, alternating or simultaneously with other steps or parts of sub-steps or stages of other steps.

[0033] The present application provides a filling glue, wherein the raw materials include (8~35) : (8~28) : (1~10) of a base resin, a curing agent and an auxiliary agent in parts by weight;

[0034] The raw materials of the base resin include, by mass percentage, 65% to 85% of epoxy resin, 5% to 25% of multifunctional active diluent, and 5% to 18% of monofunctional active diluent;

[0035] The curing agent includes a first thiol curing agent, and the first thiol curing agent includes a multi-branched polythiol curing agent.

[0036] The epoxy resin is a low-viscosity epoxy resin, and preferably the viscosity of the epoxy resin is 200 mPa.s to 2000 mPa.s. Specifically, the viscosity of the epoxy resin can be, but is not limited to, 200 mPa.s, 300 mPa.s, 400 mPa.s, 500 mPa.s, 600 mPa.s, 700 mPa.s, 800 mPa.s, 900 mPa.s, 1000 mPa.s, 1100 mPa.s, 1200 mPa.s, 1300 mPa.s, 1400 mPa.s, 1500 mPa.s, 1600 mPa.s, 1700 mPa.s, 1800 mPa.s, 1900 mPa.s or 2000 mPa.s. Optionally, the epoxy resin is a bisphenol F type epoxy resin.

[0037] It is understood that the amount of the multifunctional reactive diluent added to the base resin is greater than or equal to the amount of the monofunctional reactive diluent added.

[0038] Furthermore, the filling glue comprises, by weight, a base resin, a curing agent and an auxiliary agent in a ratio of (15~35): (15~35): (4~8).

[0039] In a specific example, the thiol content of the multi-branched polythiol curing agent is 0.1 mol / 100 g to 0.5 mol / 100 g, and the structural formula of the multi-branched polythiol curing agent is shown in Formula I

[0040] Formula Ⅰ.

[0041] Specifically, the thiol content of the multi-branched polythiol curing agent can be, but is not limited to, 0.1 mol / 100 g, 0.15 mol / 100 g, 0.2 mol / 100 g, 0.21 mol / 100 g, 0.22 mol / 100 g, 0.23 mol / 100 g, 0.24 mol / 100 g, 0.25 mol / 100 g, 0.3 mol / 100 g, 0.35 mol / 100 g, 0.4 mol / 100 g, 0.45 mol / 100 g or 0.5 mol / 100 g.

[0042] Furthermore, the multi-branched polythiol curing agent is prepared by photo-radical reaction of raw materials 1,3-propanedithiol and triallyl isocyanurate under UV light irradiation.

[0043] Specifically, the mass ratio of 1,3-propanedithiol (DMP) and triallyl isocyanurate (TAIC) is (12~20): (15~23), and a photoinitiator of 0.5%~2% of the total mass of 1,3-propanedithiol and triallyl isocyanurate glycidyl ether is added, and then added to an organic solvent for mixing and then subjected to a photo-radical reaction under UV light. It is understood that the photoinitiator may be but is not limited to trimethylbenzoyl-diphenylphosphine oxide, the wavelength of the above-mentioned UV light is 365nm, and the irradiation time is 80s~120s. It is understood that the ratio of 1,3-propanedithiol and triallyl isocyanurate and the organic solvent is (12~20) g: (15~23) g: (25~50) ml. The specific reaction process is shown below

[0044] .

[0045] Furthermore, the raw materials of the base resin include, by mass percentage, 68% to 82% of epoxy resin, 8% to 22% of multifunctional active diluent, and 8% to 15% of monofunctional active diluent.

[0046] In a specific example, the molar percentage of mercapto groups in the multi-branched polythiol curing agent is 3% to 18%.

[0047] Specifically, the molar percentage of thiol groups in the hyperbranched polythiol curing agent can be, but is not limited to, 3%, 4%, 5%, 6%, 7%, 8%, 9%, 10%, 11%, 12%, 13%, 14%, 15%, 16%, 17% or 18%.

[0048] In a specific example, the multifunctional reactive diluent includes one or more of 1,4-cyclohexanedimethanol diglycidyl ether, 1,4-butanediol diglycidyl ether, and 1,6-hexanediol diglycidyl ether.

[0049] In a specific example, the monofunctional reactive diluent includes one or more of p-tert-butylphenyl glycidyl ether, cardanol glycidyl ether, and phenyl glycidyl ether.

[0050] In a specific example, the curing agent also includes a second thiol curing agent, and the second thiol curing agent includes one or more of pentaerythritol tetrakis-3-mercaptopropionate, pentaerythritol tetrakis mercaptoacetate, pentaerythritol tetrakis (3-mercaptobutyric acid), trimethylolpropane tris (2-mercaptoacetate), trimethylolpropane tris (3-mercaptopropionate), ethylene glycol 3-mercaptopropionate and ethylene glycol bis (3-mercaptopropionate), and further, the mass ratio of the second thiol curing agent to the first thiol curing agent is (10~35): (1~20).

[0051] In a specific example, the additive includes a curing accelerator, a defoaming agent and a filler in a mass ratio of (0.1~5): (0.1~5): (2~8).

[0052] Furthermore, the curing accelerator may be, but is not limited to, one or more of an imidazole curing accelerator, a tertiary amine curing accelerator, and an organic phosphorus curing accelerator.

[0053] Furthermore, the defoaming agent may be, but is not limited to, one or more of BYK525, BYK530 and BYK535.

[0054] In a specific example, the filler is preferably an inorganic filler, and further, the inorganic filler includes one or more of silicon dioxide, aluminum oxide and calcium carbonate. The particle size D50 of the filler is 0.5 μm to 5 μm, and specifically, the particle size D50 of the filler can be, but is not limited to, 0.5 μm, 1 μm, 1.5 μm, 2 μm, 2.5 μm, 3 μm, 3.5 μm, 4 μm, 4.5 μm or 5 μm.

[0055] Preferably, the mass percentage of the filler in the total raw material of the filling glue is 5% to 15%. Specifically, the mass percentage of the filler in the total raw material of the filling glue can be but is not limited to 5%, 6%, 7%, 8%, 9%, 10%, 11%, 12%, 13%, 14% or 15%.

[0056] In a specific example, the raw materials of the filling glue include (29-31) parts by weight: (24-28) parts by weight: (6-8) parts by weight of the base resin, curing agent and auxiliary agent; the mass ratio of the second thiol curing agent to the first thiol curing agent is (19-21) parts by weight: (4-9) parts by weight, and the molar ratio of the thiol group to the total thiol group in the curing agent is 5%-10%; the raw materials of the base resin include: 68%-72% epoxy resin, 18%-22% multifunctional active diluent and 8%-12% monofunctional active diluent by weight; the auxiliary agent includes a curing accelerator, a defoamer and a filler in a mass ratio of (0.2-0.4) parts by weight: (0.1-0.5) parts by weight: (6-6.5) parts by weight, and the filler accounts for 10% of the total raw materials of the filling glue. It should be noted that the total raw materials of the filling glue also include the filler itself. The monofunctional active diluent is cardanol glycidyl ether.

[0057] The filling glue provided in the present application can significantly improve the crosslinking density of the three-dimensional network through the crosslinking effect of macromolecules by optimizing the basic resin composition and using a curing agent containing multi-branched polythiol, thereby improving the tensile strength and elongation of the filling glue and reducing the water absorption rate. Finally, the filling glue has good mechanical properties and moisture resistance.

[0058] Furthermore, the filling adhesive system obtained by compounding the first thiol curing agent including the multi-branched polythiol curing agent provided in the present application with the base resin also has a relatively low viscosity and good injectability.

[0059] The present application further provides an integrated circuit packaging electronic adhesive, which is used in advanced packaging such as 2.5D and 3D packaging to alleviate the stress concentration problem caused by the mismatch of thermal expansion coefficients between flip chips, interconnect materials (solder joints) and substrates, thereby improving the reliability of the packaging during the process.

[0060] The present application also provides an electronic product, including a chip and a substrate, wherein the chip and the substrate are connected via the filling glue as described above.

[0061] In one specific example, the substrate includes a printed circuit board or a packaging substrate.

[0062] The following specific examples are provided to further illustrate the filling glue of the present application. Unless otherwise specified, the raw materials involved in the following specific implementation methods can all be sourced from commercial sources.

[0063] Among them, bisphenol F epoxy resin was purchased from Mitsubishi Chemical, brand 1750;

[0064] 1,4-cyclohexanedimethanol diglycidyl ether was purchased from Anhui Xinyuan Technology Co., Ltd. with the brand name XY630;

[0065] p-tert-Butylphenyl glycidyl ether was purchased from Anhui Xinyuan Technology Co., Ltd. with the brand name XY693;

[0066] The multi-branched polythiol was self-made and the brand was GT-1. The specific preparation method was to mix 16.23 g of 1,3-propanedithiol, 18.68 g of triallyl isocyanurate and TPO, which was 1% of the total weight of the above raw materials as a photoinitiator, in 35 ml of dichloromethane solvent and then perform UV light free radical reaction. The UV curing condition was irradiation with a UV-LED lamp with a wavelength of 365 nm for 100 s. The product was distilled under reduced pressure to obtain a colorless, transparent and viscous liquid GT-1 with a yield of 99.5%. The thiol content was 0.21 mol / 100 g. The hydrogen nuclear magnetic resonance spectrum was as follows: Figure 1 As shown, the abscissa is the chemical shift;

[0067] Pentaerythritol tetrakis-3-mercaptopropionate was purchased from Bruno Bck Company, brand number 340;

[0068] The curing accelerator was purchased from Ajinomoto, brand PN50;

[0069] The defoamer was purchased from BYK Company with the brand name BYK535.

[0070] The present application provides raw materials of the filling glue in each embodiment and comparative example in parts by weight and performs the following performance tests on the obtained filling glue, which are summarized in Tables 1 to 3. In the table, “-” indicates that the substance is not added.

[0071] Example 1

[0072] The filler provided in this embodiment is measured by weight, and the raw materials include a base resin, a curing agent and an auxiliary agent in a ratio of 20:16.88:4.58. The raw materials of the base resin are 80% of bisphenol F epoxy resin, 10% of 1,4-cyclohexanediol diglycidyl ether and 10% of p-tert-butylphenyl glycidyl ether by mass percentage. The curing agent is composed of a multi-branched polythiol and pentaerythritol tetra-3-mercaptopropionic acid ester in a mass ratio of 2.87:14.01. The auxiliary agent is composed of a curing accelerator PN50, a defoamer BYK535 and a D50=1.5μm silica filler in a mass ratio of 0.23:0.2:4.15, and the silica filler accounts for 10% of the total mass of the filler.

[0073] Other Examples and Comparative Examples The compositions of the raw materials in Example 1 are provided in Table 1.

[0074] Detection method:

[0075] (1) Viscosity: The viscosity of the formulated adhesive was measured using a rheometer at 25°C and 60 rpm.

[0076] (2) Glass transition temperature and elastic modulus were measured by DMA. The sample was heated and cured at 100°C for 2 hours to form a 50×2.5×2 mm rectangular solid. The glass transition temperature and elastic modulus were measured by the three-point bending mode of NETZSCH 800.

[0077] (3) The test method for water absorption is as follows: After the sample to be evaluated is heated and cured at 100°C for 2 hours, a 50×2.5×2 mm rectangular solidified product is formed. The sample to be evaluated is weighed for its initial mass, and then placed in distilled water. After 24 hours in a constant temperature water bath at 25°C, it is taken out, wiped dry, and weighed again to calculate the water absorption. The water absorption is calculated according to the following formula: Water absorption (%) = (mass after water absorption - initial mass) / initial mass × 100%.

[0078] Table 1

[0079]

[0080] Table 2

[0081]

[0082] Table 3

[0083]

[0084] In Examples 1, 2, 3, 4, 5, and 6, multi-branched polythiol and pentaerythritol tetra-3-mercaptopropionate are used as mixed curing agents, and bisphenol F type epoxy resin, 1,4-cyclohexanediol diglycidyl ether, and p-tert-butylphenyl glycidyl ether are used as base resins. The molar ratio of thiol in the multi-branched polythiol to the total thiol in the curing agent is 5% to 7.5%, the amount ratio of bisphenol F type epoxy resin, 1,4-cyclohexanediol diglycidyl ether, and p-tert-butylphenyl glycidyl ether is in the range of 80%: 10%: 10% to 70%: 20%: 10%, the initial viscosity is all less than 2000 mPa.s, and the tensile strength and elongation at break of Examples 1, 5, and 6 are all greater than those of Comparative Examples 1, 2, and 3 of a single curing agent. Compared with Comparative Examples 1, 2, and 3, Examples 1, 5, and 6 use a mixed curing agent of multi-branched polythiol and pentaerythritol tetra-3-mercaptopropionate, and their water absorption rates are all lower than those of the comparative examples with the same resin dosage. The molar ratio of the mercapto groups in the multi-branched polythiol to the total mercapto groups in the curing agent is 5% to 10%, the initial viscosity is all less than 2000 mPa.s, and the tensile strength and elongation at break are both higher than those of Comparative Example 1 with a single curing agent.

[0085] Examples 7, 8, 9, 10, 11, and 12 use multi-branched polythiol and pentaerythritol tetra-3-mercaptopropionate as mixed curing agents, bisphenol F type epoxy resin, 1,4-cyclohexanediol diglycidyl ether, and cardanol glycidyl ether as base resins. In the multi-branched polythiol, the molar ratio of the thiol group to the total thiol group in the curing agent is 5% to 10%, the initial viscosity is <2000mPa.s, and the tensile strength and elongation at break are both greater than the comparative example 1 of the single curing agent. Examples 7, 11, and 12 use cardanol glycidyl ether, and their water absorption is less than that of Examples 1, 5, and 6 corresponding to the same molar ratio of tert-butylphenyl glycidyl ether, and the water absorption reaches 0.12% to 0.16%. Compared with Comparative Examples 4, 5, and 6, Examples 7, 11, and 12 use multi-branched polythiol and pentaerythritol tetra-3-mercaptopropionate mixed curing agents, and their water absorption is less than that of the comparative example with the same resin dosage.

[0086] In Comparative Examples 7 to 10, Comparative Example 7 did not add the second thiol curing agent. Although the elongation at break increased significantly, the viscosity of the filling glue was too large, the elastic modulus decreased significantly, and the water absorption rate also increased to a certain extent. Comparative Example 8 did not add a multifunctional active diluent, and Comparative Example 8 did not add a monofunctional active diluent. It can be seen that adding only a monofunctional active diluent or only a multifunctional active diluent will increase the water absorption rate of the final filling glue to a certain extent. In Comparative Example 10, the amount of monofunctional active diluent added was too large and the water absorption amount also increased to a certain extent.

[0087] The filling glue provided in this application has good performance, with a viscosity of 820 mPa.s~3161 mPa.s, a Tg℃ of 35℃~46℃, an elastic modulus of 1960 MPa~3601 MPa, a tensile strength of 18.4 MPa~55.6 MPa, an elongation at break of 4.5%~56%, and a water absorption of 0.12%~0.42%.

[0088] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0089] The above-described embodiments only express several implementation methods of the present invention, which are convenient for understanding the technical solutions of the present invention in detail, but they cannot be understood as limiting the scope of protection of the invention patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. It should be understood that the technical solutions obtained by those skilled in the art through logical analysis, reasoning or limited experiments on the basis of the technical solutions provided by the present invention are all within the protection scope of the claims attached to the present invention. Therefore, the protection scope of the patent of the present invention shall be based on the contents of the attached claims, and the description can be used to interpret the contents of the claims.

Claims

1. A filling glue, characterized in that: In parts by weight, the raw materials include (8-35) : (8-28) : (1-10) of a base resin, a curing agent and an auxiliary agent; The raw materials of the base resin include, by mass percentage, 65% to 85% of epoxy resin, 5% to 25% of multifunctional active diluent, and 5% to 18% of monofunctional active diluent; The amount of the multifunctional active diluent added is greater than or equal to the amount of the monofunctional active diluent added; The curing agent includes a first thiol curing agent and a second thiol curing agent, wherein the first thiol curing agent includes a multi-branched polythiol curing agent, and the second thiol curing agent includes one or more of pentaerythritol tetrakis(3-mercaptopropionic acid) ester, pentaerythritol tetrakisthioacetic acid ester, pentaerythritol tetrakis(3-mercaptobutyric acid) ester, trimethylolpropane tris(2-mercaptoacetic acid ester), trimethylolpropane tris(3-mercaptopropionic acid ester) and bis(3-mercaptopropionic acid) glycol; The multi-branched polythiol curing agent is prepared by a photo-free radical reaction of raw materials 1,3-propanedithiol and triallyl isocyanurate under UV light irradiation; The molar percentage of the thiol groups in the multi-branched polythiol curing agent to the total thiol groups in the curing agent is 3% to 18%.

2. The filling glue according to claim 1, characterized in that: The viscosity of the epoxy resin is 200mPa.s~2000mPa.s.

3. The filling glue according to claim 1, characterized in that: The multi-branched polythiol curing agent has a thiol content of 0.1 mol / 100 g to 0.5 mol / 100 g.

4. The filling glue according to claim 1, characterized in that: The multifunctional active diluent includes one or more of 1,4-cyclohexanedimethanol diglycidyl ether, 1,4-butanediol diglycidyl ether and 1,6-hexanediol diglycidyl ether.

5. The filling glue according to claim 1, characterized in that: The monofunctional active diluent includes one or more of p-tert-butylphenyl glycidyl ether, cardanol glycidyl ether and phenyl glycidyl ether.

6. The filling glue according to claim 1, characterized in that: The mass ratio of the second thiol curing agent to the first thiol curing agent is (10-35): (1-20).

7. The filling glue according to any one of claims 1 to 6, characterized in that: The auxiliary agent includes a curing accelerator, a defoaming agent and a filler in a mass ratio of (0.1~5): (0.1~5): (2~8).

8. The filling glue according to claim 7, characterized in that: The curing accelerator includes one or more of an imidazole curing accelerator, a tertiary amine curing accelerator and an organic phosphorus curing accelerator.

9. An electronic product, characterized in that: The invention comprises a chip, a filling glue and a substrate, wherein the chip and the substrate are connected by the filling glue as claimed in any one of claims 1 to 8.

10. The electronic product according to claim 9, characterized in that: The substrate includes a printed circuit board or a packaging substrate.

Images