Roughening device and method for PCB inner layer film pre-treatment

Abstract

The present application relates to the field of circuit board production, and discloses a roughening device for pre-treatment of the inner layer of PCB film lamination, including a conveying component, a top spray component and a bottom spray component. The conveying component is used to support and convey the PCB board from the bottom of the PCB board; the top spray component includes a plurality of top spray heads arranged in an array, and the bottom spray component includes a plurality of bottom spray heads arranged in an array. The top spray head is used to spray etching liquid on the PCB board from the top of the conveying component, and the bottom spray head is used to spray etching liquid on the PCB board from the bottom of the conveying component, and the density of the bottom spray head is greater than that of the top spray head. The conveying component includes a first conveying section, a second conveying section and a third conveying section, and a liquid suction hole is provided on the conveying roller of the first conveying section. The present application can perform high-precision roughening on inner layer PCB boards with different copper thicknesses, and improve the use effect of the inner layer roughening equipment.

Description

Technical Field

[0001] The present application relates to the technical field of circuit board production, and more specifically, to a roughening device and method for pre-treatment of PCB inner layer film lamination. Background Art

[0002] In the production of printed circuit boards (PCBs), the inner layer pre-treatment line is used to pre-treat the inner layer of the PCB board with a film or wet film. The roughening process in the inner layer pre-treatment line includes cleaning and roughening the surface of the PCB board with chemical solutions to increase the bite force between the copper layer and the dry film or wet film, thereby improving the bonding quality of the PCB board during the subsequent lamination process to improve the overall quality of the PCB board. It can be seen that the roughening process of the inner layer PCB board is mainly to enhance the bonding force between the copper foil and the resin layer of the inner layer PCB board, and ensure that the inner layer PCB board will not separate from other layers during the lamination process of the PCB board.

[0003] In the production of PCB boards, there is also an outer layer roughening process. The purpose of roughening the outer layer of the PCB board is to improve the adhesion between the photosensitive film and the copper surface to ensure the stability of the circuit pattern. The outer layer also needs to take into account the stability of subsequent welding and component installation, so the roughening degree of the outer PCB board is usually low. The inner layer roughening of the PCB board usually requires higher requirements, because the inner layer of the PCB board needs to withstand greater thermal stress and mechanical stress in the multi-layer board structure. Patent CN214507513U (application number: 202120778226.X) provides a roughening etching device for PCBs. By combining immersion etching and spray etching, the pool effect generated in spray etching is eliminated, and the roughening etching rate of the etching solution is significantly improved. However, since the degree of etching of the inner layer roughening is often related to the copper thickness of the inner PCB board, the roughening etching device in patent CN214507513U is difficult to perform high-precision roughening on inner PCB boards with different copper thicknesses. Summary of the invention

[0004] The purpose of this application is to provide a roughening device and method for PCB inner layer pre-treatment of film lamination, which solves the technical problem that it is difficult to perform high-precision roughening on inner layer PCB boards with different copper thicknesses, and achieves the technical effect of being able to perform high-precision roughening on inner layer PCB boards with different copper thicknesses.

[0005] An embodiment of the present application provides a roughening device for pre-treatment of the inner layer of a PCB before film lamination, comprising a conveying component, a top spray component and a bottom spray component. The conveying component is used to support and convey a PCB board from the bottom of the PCB board; the top spray component comprises a plurality of top spray heads arranged in an array, and the bottom spray component comprises a plurality of bottom spray heads arranged in an array. The top spray head is used to spray etching liquid on the PCB board from above the conveying component, and the bottom spray head is used to spray etching liquid on the PCB board from below the conveying component. The density of the bottom spray head is greater than that of the top spray head.

[0006] In a possible implementation, the conveying assembly includes a first conveying section, a second conveying section and a third conveying section, each of which includes a plurality of conveying rollers for supporting and conveying the PCB board from the bottom, the conveying rollers can convey the PCB board at different speeds, each conveying roller is provided with a plurality of conveying rollers, the conveying rollers of the first conveying section are provided with suction holes, and the suction holes are used to suck the pre-soak cleaning liquid on the PCB board; it also includes a suction assembly and a control assembly, the suction assembly is connected to the suction holes on the conveying rollers of the first conveying section through a suction gas path, and the control assembly is electrically connected to the suction assembly.

[0007] In another possible implementation, the density of the conveying rollers on each conveying roller of the first conveying section is greater than the density of the conveying rollers on each conveying roller of the second conveying section and the third conveying section.

[0008] In another possible implementation, a negative pressure detection component is provided on the liquid suction gas circuit, and the negative pressure detection component is electrically connected to the control component. The control component is used to control the etching liquid spray pressure value of the bottom spray component corresponding to the first conveying section, the second conveying section and the third conveying section according to the negative pressure detection value of the negative pressure detection component.

[0009] In another possible implementation, the spray pressure of the top spray assembly corresponding to the second conveying section is greater than the top spray pressure value of the top spray assembly corresponding to the first conveying section and the third conveying section.

[0010] In another possible implementation, the control component is used to control the top spray pressure value of the top spray component corresponding to the second conveying section according to the negative pressure detection value of the negative pressure detection component.

[0011] The embodiment of the present application also provides a roughening method for pre-treatment of the inner layer of an inner PCB board before film lamination. The roughening method for pre-treatment of the inner layer of an inner PCB board before film lamination adopts the above-mentioned roughening device. The method includes: determining a target conveying speed, a top spray pressure value, and a bottom spray pressure value according to the copper thickness of the PCB board, the nozzle density and nozzle diameter of the top spray assembly, and the nozzle density and nozzle diameter of the bottom spray assembly; the conveying assembly conveys the PCB board at the target conveying speed, and controls the top spray assembly to spray etching liquid on the PCB board from above the conveying assembly according to the top spray pressure value, and controls the bottom spray assembly to spray etching liquid on the PCB board from below the conveying assembly according to the bottom spray pressure value.

[0012] In another possible implementation, the method further includes: the liquid suction component sucks the liquid suction hole through the liquid suction gas path, and then sucks the pre-immersion cleaning liquid on the PCB board on the first conveying section, and at the same time controls the bottom spray component corresponding to the first conveying section to stop spraying etching liquid on the PCB board.

[0013] In another possible implementation, the method also includes: obtaining a negative pressure detection value of a negative pressure detection component; when the negative pressure detection value is less than a first negative pressure value, controlling the liquid suction component to stop the liquid suction gas path from sucking the liquid suction hole, and controlling the bottom spray component corresponding to the first conveying section to start spraying etching liquid on the PCB board; when the negative pressure detection value is greater than or equal to the first negative pressure value and less than the second negative pressure value, controlling the liquid suction component to suck the liquid suction hole through the liquid suction gas path, and controlling the bottom spray component corresponding to the first conveying section to stop spraying etching liquid on the PCB board, and increasing the bottom spray pressure value of the bottom spray component corresponding to the second conveying section; when the negative pressure detection value is greater than or equal to the second negative pressure value, controlling the liquid suction component to suck the liquid suction hole through the liquid suction gas path, and controlling the bottom spray component corresponding to the first conveying section to stop spraying etching liquid on the PCB board, and increasing the bottom spray pressure value of the bottom spray component corresponding to the second conveying section and the third conveying section.

[0014] In another possible implementation, the method also includes: when the negative pressure detection value is less than the first negative pressure value, controlling the top spray pressure value of the top spray assembly corresponding to the second conveying section to be the first spray pressure value; when the negative pressure detection value is greater than or equal to the first negative pressure value, controlling the top spray pressure value of the top spray assembly corresponding to the second conveying section to be the second spray pressure value; wherein the second spray pressure value is greater than the first spray pressure value.

[0015] Compared with the prior art, the embodiments of the present invention have the following beneficial effects:

[0016] An embodiment of the present application provides a roughening device for pre-treatment of the inner layer of a PCB before film lamination, comprising a conveying component, a top spray component and a bottom spray component, wherein the conveying component is used to support and convey the PCB board from the bottom of the PCB board; the top spray component comprises a plurality of top spray heads arranged in an array, and the bottom spray component comprises a plurality of bottom spray heads arranged in an array, the top spray head is used to spray etching liquid on the PCB board from above the conveying component, and the bottom spray head is used to spray etching liquid on the PCB board from below the conveying component, and the density of the bottom spray head is greater than that of the top spray head. In the embodiment of the present application, no conveying assembly is provided on the top of the PCB board, thereby not shielding the top of the PCB board. When the PCB board is roughened and etched, the uniformity of the roughening etching on the top of the PCB board is improved; at the same time, the density of the bottom spray head is greater than that of the top spray head, so that the etching liquid sprayed on the bottom of the PCB board is larger than that on the top of the PCB board, which can compensate for the influence of shielding of the bottom of the PCB board by the conveying assembly on the etching speed; at the same time, it can compensate for the rapid loss of the etching liquid at the bottom of the PCB board under the action of gravity; because the bottom of the PCB board is shielded by the conveying assembly, by increasing the density of the bottom spray head at the bottom of the PCB board, the uniformity of the etching liquid spraying on the bottom of the PCB board can be ensured when the conveying assembly is shielded, thereby improving the control accuracy of the spray etching on the top and bottom of the PCB board, and improving the roughening quality of the inner PCB board. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0018] Figure 1 A schematic structural diagram of a roughening device for pre-treatment of an inner layer of a PCB board before laminating a film provided in an embodiment of the present application;

[0019] Figure 2 for Figure 1 A schematic diagram of the local structure of a roughening device at position A used for pre-treatment of the inner layer of an inner PCB board before laminating a film;

[0020] Figure 3 It is a schematic diagram of the internal structure of the conveying roller on the conveying assembly in the embodiment of the present application;

[0021] Figure 4 Schematic diagram of the internal structure of the conveying roller in the embodiment of the present application;

[0022] Figure 5A control schematic diagram of a roughening device for pre-treatment of an inner layer of a PCB board before laminating a film provided in an embodiment of the present application;

[0023] Figure 6 A schematic flow chart of a roughening method for pre-treatment of an inner layer of a PCB film for an inner layer PCB board provided in an embodiment of the present application;

[0024] In the figure, 1. conveying assembly; 11. first conveying section; 12. second conveying section; 13. third conveying section; 101. PCB board; 102. conveying roller; 103. conveying roller; 104. suction hole; 2. top spray assembly; 21. top spray head; 3. bottom spray assembly; 31. bottom spray head; 4. suction assembly; 41. suction air circuit; 411. negative pressure detection assembly; 5. control assembly. DETAILED DESCRIPTION

[0025] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0026] It should be noted that when a component or structure is referred to as being "fixed to" or "disposed on" another component or structure, it may be directly on the other component or structure or indirectly on the other component or structure. When a component or structure is referred to as being "connected to" another component or structure, it may be directly connected to the other component or structure or indirectly connected to the other component or structure.

[0027] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or a component or structure referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0028] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0029] The inner layer roughening of PCB boards usually has higher requirements. Since the etching degree of the inner layer roughening is often related to the copper thickness of the inner layer PCB boards, it is difficult for the roughening etching device to perform high-precision roughening on inner layer PCB boards with different copper thicknesses.

[0030] Based on the above reasons, an embodiment of the present application provides a roughening device for pre-treatment of the inner layer of a PCB film, comprising a conveying component, a top spray component and a bottom spray component. The conveying component is used to support and convey the PCB board from the bottom of the PCB board; the top spray component comprises a plurality of top spray heads arranged in an array, and the bottom spray component comprises a plurality of bottom spray heads arranged in an array. The top spray head is used to spray etching liquid on the PCB board from above the conveying component, and the bottom spray head is used to spray etching liquid on the PCB board from below the conveying component, and the density of the bottom spray head is greater than that of the top spray head. In the embodiment of the present application, no conveying assembly is provided on the top of the PCB board, thereby not shielding the top of the PCB board. When the PCB board is roughened and etched, the uniformity of the roughening etching on the top of the PCB board is improved; at the same time, the density of the bottom spray head is greater than that of the top spray head, so that the etching liquid sprayed on the bottom of the PCB board is larger than that on the top of the PCB board, which can compensate for the influence of shielding of the bottom of the PCB board by the conveying assembly on the etching speed; at the same time, it can compensate for the rapid loss of the etching liquid at the bottom of the PCB board under the action of gravity; because the bottom of the PCB board is shielded by the conveying assembly, by increasing the density of the bottom spray head at the bottom of the PCB board, the uniformity of the etching liquid spraying on the bottom of the PCB board can be ensured when the conveying assembly is shielded, thereby improving the control accuracy of the spray etching on the top and bottom of the PCB board, and improving the roughening quality of the inner PCB board.

[0031] In some scenarios, a roughening device for pre-treatment of the inner layer of a PCB before film lamination according to an embodiment of the present application can be used to precisely control the etching roughening process of the top and bottom surfaces of the PCB board, and in particular, can precisely control the etching process of the inner layer PCB board, thereby improving the etching control effect of the inner layer PCB board.

[0032] The following is a specific example of a roughening device for pre-treatment of the inner layer of an inner PCB board provided in an embodiment of the present application.

[0033] Figure 1 A schematic diagram of the structure of a roughening device for pre-treatment of the inner layer of a PCB board before laminating the inner layer of the PCB provided in an embodiment of the present application is shown in FIG. Figure 1As shown, the roughening device includes a conveying assembly 1, a top spray assembly 2 and a bottom spray assembly 3. The conveying assembly 1 is used to support and convey the PCB board 101 from the bottom of the PCB board 101. The top spray assembly 2 includes a plurality of top spray heads 21 arranged in an array, and the bottom spray assembly 3 includes a plurality of bottom spray heads 31 arranged in an array. The top spray heads 21 are used to spray etching liquid on the PCB board 101 from above the conveying assembly 1, and the bottom spray heads 31 are used to spray etching liquid on the PCB board 101 from below the conveying assembly 1. The density of the bottom spray heads 31 is greater than that of the top spray heads 21.

[0034] like Figure 1 As shown, the roughening device includes a conveying component 1, a top spray component 2 and a bottom spray component 3. The conveying component 1 is used to support the PCB board 101 from the bottom of the PCB board 101 and convey the PCB board 101, thereby realizing the conveying and roughening etching of the PCB board 101 in the roughening device. The top spray component 2 and the bottom spray component 3 are used to spray etching liquid on the PCB board 101 during the conveying process to realize the roughening etching of the PCB board 101.

[0035] Exemplarily, the PCB board 101 may be an inner layer PCB board, the roughening etching degree of the inner layer PCB board is deeper, and the etching degree effect requirements of the top surface and the bottom surface of the PCB board 101 are similar.

[0036] When the conveying component 1 supports and conveys the PCB board 101 from the bottom of the PCB board 101, since the conveying component 1 will block the bottom of the PCB board 101, it is easy to cause insufficient spraying amount of etching liquid on the bottom of the PCB board 101, resulting in poor etching effect on the bottom of the PCB board 101.

[0037] When the conveying assembly 1 supports and conveys the PCB board 101 from the bottom of the PCB board 101 , the etching liquid at the bottom of the PCB board 101 will quickly flow away due to the influence of gravity, which will affect the etching effect of the bottom of the PCB board 101 .

[0038] like Figure 1 As shown, the top spray assembly 2 includes a plurality of top spray heads 21 arranged in an array. The top spray heads 21 are used to spray etching liquid on the PCB board 101 from above the conveying assembly 1. The top of the PCB board 101 is not blocked by the conveying assembly. When the PCB board 101 is roughened and etched, the uniformity of the roughening etching on the top of the PCB board is improved.

[0039] like Figure 1 As shown, the bottom spray assembly 3 includes a plurality of bottom spray heads 31 arranged in an array. The bottom spray heads 31 are used to spray etching liquid on the PCB board 101 from below the conveying assembly 1 , thereby roughening and etching the bottom of the PCB board 101 .

[0040] like Figure 1 As shown, the density of the bottom spray head 31 is greater than that of the top spray head 21. The density of the bottom spray head 31 is greater than that of the top spray head 21. When the spray flow rates of the etching liquid of the bottom spray head 31 and the top spray head 21 are the same, the etching liquid sprayed on the bottom of the PCB board is larger than that on the top of the PCB board, which can compensate for the influence of the shielding of the bottom of the PCB board by the conveying component on the etching speed.

[0041] like Figure 1 As shown, the density of the bottom shower head 31 is greater than that of the top shower head 21 , which can compensate for the rapid loss of etching liquid at the bottom of the PCB board under the action of gravity, thereby ensuring the etching uniformity of the bottom of the PCB board 101 .

[0042] By increasing the density of the bottom spray head at the bottom of the PCB board, the uniformity of the etching liquid spraying at the bottom of the PCB board can be ensured when the conveying component is blocked, thereby improving the control accuracy of the spray etching on the top and bottom of the PCB board and improving the roughening quality of the inner PCB board.

[0043] The beneficial effect brought about by the above implementation method is that the conveying component will not block the top of the PCB board, and when the PCB board is roughened and etched, the uniformity of the roughening etching on the top of the PCB board is improved.

[0044] The beneficial effect brought about by the above-mentioned implementation method is that, when the etching liquid spray flow rates of the bottom spray head and the top spray head are the same, the density of the bottom spray head is greater than that of the top spray head, so that the etching liquid sprayed on the bottom of the PCB board is larger than that on the top of the PCB board, which can compensate for the influence of the conveying component on the etching speed by blocking the bottom of the PCB board.

[0045] The beneficial effect brought about by the above-mentioned implementation method is that when the etching liquid spray flow rates of the bottom spray head and the top spray head are the same, the density of the bottom spray head is greater than that of the top spray head, which can compensate for the rapid loss of etching liquid at the bottom of the PCB board under the action of gravity and improve the roughening etching effect of the bottom of the PCB board.

[0046] The beneficial effect brought about by the above-mentioned implementation method is that, since the bottom of the PCB board is blocked by the conveying component, by increasing the density of the bottom spray head at the bottom of the PCB board, the uniformity of the etching liquid spraying at the bottom of the PCB board can be ensured when the conveying component is blocked, thereby improving the etching effect on the bottom of the PCB board.

[0047] In some implementations, the conveying assembly 1 includes a first conveying section 11, a second conveying section 12 and a third conveying section 13. The first conveying section 11, the second conveying section 12 and the third conveying section 13 all include a plurality of conveying rollers 102 for supporting and conveying the PCB board 101 from the bottom. The conveying rollers 102 can convey the PCB board 101 at different speeds. Each conveying roller 102 is provided with a plurality of conveying rollers 103. The conveying rollers 103 of the first conveying section 11 are provided with liquid suction holes 104, and the liquid suction holes 104 are used to suck the pre-impregnation liquid on the PCB board 101.

[0048] like Figure 1 As shown, the conveying assembly 1 includes a first conveying section 11, a second conveying section 12 and a third conveying section 13. The specific conveying structures of the first conveying section 11, the second conveying section 12 and the third conveying section 13 can be the same. The first conveying section 11, the second conveying section 12 and the third conveying section 13 all include a plurality of conveying rollers 102 for supporting and conveying the PCB board 101 from the bottom. The conveying rollers 102 are used to support and convey the PCB board 101.

[0049] When working, the conveying roller 102 can convey the PCB board 101 at different speeds, thereby meeting production requirements with different roughening and etching degree requirements.

[0050] Figure 2 for Figure 1 A schematic diagram of the local structure of a roughening device for inner layer PCB board before laminating film, Figure 3 Schematic diagram of the internal structure of the conveying roller on the conveying assembly in the embodiment of the present application. Figure 4 Schematic diagram of the internal structure of the conveyor roller in the embodiment of the present application. Figures 2 to 4 As shown, each conveying roller 102 is provided with a plurality of conveying rollers 103 . The conveying rollers 103 are structures for directly carrying the PCB board 101 . During use, the conveying rollers 103 rotate to convey the PCB board 101 .

[0051] In the roughening process of PCB board, pre-dip process is an important step. Its role is to improve the quality and efficiency of the subsequent copper deposition process. In the pre-dip process, chemical solution is used to remove oxides on the surface of PCB board and improve the activity of copper layer on the surface of PCB board, which can ensure the cleanliness of copper surface and improve the effect of subsequent roughening etching. After the pre-dip process, the PCB board needs to be cleaned with pre-dip cleaning liquid to remove the pre-dip liquid on the PCB board.

[0052] Exemplarily, the pre-dip cleaning solution may be a water-based cleaning solution, and the water-based cleaning solution will not chemically react with the roughening etching solution.

[0053] During the roughening etching of the PCB board, if the pre-dip cleaning liquid on the PCB board is not cleaned up, the residual pre-dip cleaning liquid may mix with the etching liquid used for roughening etching to reduce the concentration of the roughening etching liquid. Therefore, the pre-dip cleaning liquid can be removed in time on the first conveying section 11 to ensure the roughening etching effect of the subsequent second conveying section 12 and the third conveying section 13 on the PCB board 101.

[0054] like Figures 2 to 4 As shown, a liquid suction hole 104 is provided on the conveying roller 103 of the first conveying section 11, and the liquid suction hole 104 is used to suck the pre-impregnation cleaning liquid on the PCB board 101. The pre-impregnation cleaning liquid is the pre-impregnation cleaning liquid remaining in the pre-impregnation process in the roughening process. The pre-impregnation cleaning liquid is sucked through the liquid suction hole 104. Even if the pre-impregnation cleaning liquid on the PCB board 101 is not completely cleaned, the roughening etching effect on the PCB board 101 can also be guaranteed.

[0055] The pre-impregnation process in the prior art often requires the PCB board to be dried before the roughening etching process can be performed. In the embodiment of the present application, there is no need to clean the pre-impregnation cleaning liquid on the PCB board by drying the pre-impregnation cleaning liquid after pre-impregnation, thereby reducing the production cost of the pre-impregnation process.

[0056] In some implementations, the embodiments of the present application further include a liquid suction component 4 and a control component 5. The liquid suction component 4 is connected to the liquid suction holes 104 on the conveying roller 103 of the first conveying section 11 through a liquid suction air path 41, and the control component 5 and the liquid suction component 4 are electrically connected.

[0057] Figure 5 A control schematic diagram of a roughening device for pre-treatment of an inner layer of a PCB board before laminating a film is provided in an embodiment of the present application, such as Figure 4 and Figure 5 As shown, in the embodiment of the present application, the liquid suction process is completed by providing power through the liquid suction component 4, the liquid suction component 4 can be a liquid suction pump, and the liquid suction component 4 is connected to the liquid suction holes 104 on the conveying roller 103 of the first conveying section 11 through the liquid suction gas path 41, and the rotating shaft of the conveying roller 103 can be a hollow structure. The rotating shaft of the conveying roller 103 and the external liquid suction pipeline are connected to form the liquid suction gas path 41.

[0058] like Figure 5 As shown, in the embodiment of the present application, the control component 5 and the liquid aspiration component 4 are electrically connected, and the liquid aspiration process can be controlled by the control component 5.

[0059] The beneficial effect brought about by the above implementation method is that it is not necessary to clean the pre-dip cleaning liquid on the PCB board by drying the pre-dip liquid after pre-dip, thereby reducing the production cost of the pre-dip process.

[0060] The beneficial effect brought by the above implementation method is that by sucking the pre-immersion cleaning liquid through the liquid suction hole, even if the pre-immersion cleaning liquid on the PCB board is not completely cleaned, a stable roughening etching effect on the PCB board can be guaranteed.

[0061] The beneficial effect brought about by the above-mentioned implementation method is that the liquid absorption process on the first conveying section can be controlled by the control component, so that the pre-immersion cleaning liquid remaining on the PCB board can be cleaned in time at the initial section of the conveying component for roughening etching of the PCB board, thereby improving the control effect of the roughening etching of the PCB board.

[0062] In some implementations, the density of the conveying rollers 103 on each conveying roller 102 of the first conveying section 11 is greater than the density of the conveying rollers 103 on each conveying roller 102 of the second conveying section 12 and the third conveying section 13 .

[0063] When each conveying roller 102 of the first conveying section 11 cleans the pre-immersion cleaning liquid through the liquid suction hole 104, in order to further improve the cleaning effect of the liquid on the PCB board 101, the density of the conveying roller 103 on each conveying roller 102 of the first conveying section 11 can be set to be greater than the density of the conveying roller 103 on each conveying roller 102 of the second conveying section 12 and the third conveying section 13, thereby ensuring that more densely distributed conveying rollers 102 are correspondingly arranged on the first conveying section 11, and improving the cleaning effect of the pre-immersion cleaning liquid on the PCB board 101.

[0064] The beneficial effect brought about by the above implementation method is that more dense conveying rollers can be correspondingly arranged on the first conveying section, which can improve the cleaning effect of the pre-immersion cleaning liquid on the PCB board and further improve the roughening etching effect on the PCB board.

[0065] In some implementations, a negative pressure detection component 411 is provided on the liquid suction gas circuit 41, and the negative pressure detection component 411 is electrically connected to the control component 5. The control component 5 is used to control the etching liquid spraying pressure value of the bottom spray component 3 corresponding to the first conveying section 11, the second conveying section 12 and the third conveying section 13 according to the negative pressure detection value of the negative pressure detection component 411.

[0066] like Figure 5 As shown, the embodiment of the present application also includes a negative pressure detection component 411, which is arranged on the liquid suction air circuit 41. The negative pressure detection component 411 is electrically connected to the control component 5. The negative pressure detection component 411 is used to detect the negative pressure value on the liquid suction air circuit 41. The negative pressure value on the liquid suction air circuit 41 can reflect whether there is pre-immersion cleaning liquid in the liquid suction air circuit 41.

[0067] Exemplarily, when the negative pressure value on the liquid suction air circuit 41 is higher than the preset negative pressure value, it indicates that there is still pre-immersion cleaning liquid in the PCB board and the liquid suction air circuit 41; when the negative pressure value on the liquid suction air circuit 41 is lower than the preset negative pressure value, it indicates that the pre-immersion cleaning liquid in the PCB board and the liquid suction air circuit 41 has been sucked out, and air is flowing in the liquid suction air circuit 41.

[0068] During operation, since the negative pressure detection value of the negative pressure detection component 411 can reflect the residual amount of pre-immersion cleaning liquid on the PCB board and the liquid suction gas circuit 41, the etching liquid spray pressure value of the bottom spray component 3 corresponding to the first conveying section 11, the second conveying section 12 and the third conveying section 13 can be controlled by the control component 5 according to the negative pressure detection value of the negative pressure detection component 411, and then the etching liquid spray pressure value can be controlled according to the residual amount of pre-immersion cleaning liquid in the PCB board and the liquid suction gas circuit 41, thereby ensuring precise control of the etching process.

[0069] The beneficial effect brought about by the above-mentioned implementation method is that the residual amount of the pre-immersion cleaning liquid on the PCB board and the liquid suction gas path is reflected by the negative pressure detection value of the negative pressure detection component, and then the spray pressure value of the etching liquid is controlled according to the residual amount of the pre-immersion cleaning liquid in the PCB board and the liquid suction gas path, thereby ensuring precise control of the etching process.

[0070] In some implementations, the spray pressure of the top spray assembly 2 corresponding to the second conveying section 12 is greater than the top spray pressure value of the top spray assembly 2 corresponding to the first conveying section 11 and the third conveying section 13 .

[0071] During the roughening etching process, since pre-dip cleaning liquid also remains on the top surface of the PCB board, and due to the pool effect, the etching liquid on the second conveying section 12 may not be able to fully contact the PCB board after the PCB board on the first conveying section 11 is sprayed with etching liquid. The pre-dip cleaning liquid remaining on the top surface of the PCB board may cause the etching liquid concentration on the first conveying section 11 to be too low, affecting the roughening etching effect of the PCB board. Therefore, the spray pressure of the top spray assembly 2 corresponding to the second conveying section 12 can be set to be greater than the top spray pressure value of the top spray assembly 2 corresponding to the first conveying section 11 and the third conveying section 13. The pre-dip cleaning liquid and the roughening etching liquid on the PCB board are removed from the PCB board through the larger spray pressure on the second conveying section 12, thereby ensuring the roughening etching effect of the second conveying section 12 and the third conveying section 13.

[0072] There is also residual pre-dip cleaning liquid on the top surface of the PCB board, but there is no conveying component on the top surface of the PCB board to block the pre-dip cleaning liquid, so the pre-dip cleaning liquid can be flushed by the pressure of the etching liquid sprayed by the top spray component 2 itself.

[0073] The beneficial effect brought about by the above implementation method is that the pre-immersion cleaning liquid and the roughening etching liquid on the PCB board are removed from the top of the PCB board through the larger spray pressure on the second conveying section, thereby ensuring the roughening etching effect of the second conveying section and the third conveying section.

[0074] In some implementations, the control component 5 is used to control the top spray pressure value of the top spray component 2 corresponding to the second conveying section 12 according to the negative pressure detection value of the negative pressure detection component 411.

[0075] During operation, the negative pressure detection value of the negative pressure detection component 411 reflects the residual amount of the pre-immersion cleaning liquid on the PCB board. Therefore, in order to ensure the effect of removing the pre-immersion cleaning liquid and roughening etching liquid on the PCB board through the larger spray pressure on the second conveying section, the top spray pressure value of the top spray component 2 corresponding to the second conveying section 12 can be controlled according to the negative pressure detection value of the negative pressure detection component 411, so that there is sufficient spray pressure on the second conveying section to remove the pre-immersion cleaning liquid and roughening etching liquid on the PCB board.

[0076] During operation, the greater the negative pressure detection value of the negative pressure detection component 411 is, the greater the top spray pressure value of the top spray component 2 corresponding to the second conveying section 12 is.

[0077] The beneficial effect brought about by the above-mentioned implementation method is that the top spray pressure value of the top spray component corresponding to the second conveying section is controlled according to the negative pressure detection value of the negative pressure detection component, thereby ensuring the effect of removing the pre-dip cleaning liquid and roughening etching liquid on the PCB board through the larger spray pressure on the second conveying section.

[0078] Figure 6 A schematic flow chart of a roughening method for pre-treatment of an inner layer of a PCB board before laminating a film is provided in an embodiment of the present application, such as Figure 6 As shown, the roughening method for the inner layer PCB board before film lamination adopts the above-mentioned roughening device, and the method includes S110 to S120, and S110 to S120 are specifically described below.

[0079] S110, determining a target conveying speed, a top spray pressure value, and a bottom spray pressure value according to the copper thickness of the PCB board 101, the nozzle density and nozzle diameter of the top spray assembly 2, and the nozzle density and nozzle diameter of the bottom spray assembly 3.

[0080] When in use, in order to scientifically determine the flow rate of the roughening etching liquid sprayed on the PCB board, the target conveying speed, the top spray pressure value and the bottom spray pressure value can be determined according to the copper thickness of the PCB board 101, the nozzle density and nozzle diameter of the top spray assembly 2, and the nozzle density and nozzle diameter of the bottom spray assembly 3.

[0081] For example, an empirical value table of target conveying speed, top spray pressure value and bottom spray pressure value corresponding to the copper thickness of PCB board 101, the nozzle density and nozzle diameter of top spray assembly 2, and the nozzle density and nozzle diameter of bottom spray assembly 3 can be determined, and then the target conveying speed, top spray pressure value and bottom spray pressure value can be determined according to the empirical value table.

[0082] S120, the conveying component 1 conveys the PCB board 101 according to the target conveying speed, and controls the top spray component 2 to spray the etching liquid on the PCB board 101 from above the conveying component 1 according to the top spray pressure value, and controls the bottom spray component 3 to spray the etching liquid on the PCB board 101 from below the conveying component 1 according to the bottom spray pressure value.

[0083] When the conveying component 1 conveys the PCB board 101 at the target conveying speed, the top spray component 2 can be controlled to spray the etching liquid on the PCB board 101 from above the conveying component 1 according to the top spray pressure value, thereby meeting the roughening etching condition when the top of the PCB board 101 is not blocked by the conveying component; and the bottom spray component 3 can be controlled to spray the etching liquid on the PCB board 101 from below the conveying component 1 according to the bottom spray pressure value, thereby meeting the roughening etching condition when the bottom of the PCB board 101 is blocked by the conveying component.

[0084] The beneficial effect brought by the above implementation method is that when the top of the PCB board is not blocked by the conveying component, the etching liquid can be sprayed on the PCB board from above the conveying component according to the top spray pressure value, and the roughening etching condition when the top of the PCB board is not blocked by the conveying component can be met; when the bottom of the PCB board is blocked by the conveying component, the bottom spraying component is controlled to spray the etching liquid on the PCB board from below the conveying component according to the bottom spray pressure value, and the roughening etching condition when the bottom of the PCB board is blocked by the conveying component can be met, thereby realizing precise control of the roughening etching process of the PCB board.

[0085] In some implementations, the above method also includes: the liquid suction component 4 sucks the liquid suction hole 104 through the liquid suction gas path 41, and then sucks the pre-dip liquid on the PCB board 101 on the first conveying section 11, and at the same time controls the bottom spray component 3 corresponding to the first conveying section 11 to stop spraying etching liquid on the PCB board 101.

[0086] During operation, the liquid suction component 4 is controlled to suck the liquid suction hole 104 through the liquid suction gas path 41, and then the pre-immersion cleaning liquid on the PCB board 101 is sucked on the first conveying section 11, and the bottom spray component 3 corresponding to the first conveying section 11 can be controlled to stop spraying the etching liquid on the PCB board 101, and then after the pre-immersion cleaning liquid of the PCB board 101 is cleaned on the first conveying section 11, the etching liquid can be sprayed on the PCB board 101 through the bottom spray component 3 on the second conveying section 12, so as to ensure the uniformity of the roughening etching of the bottom surface of the PCB board 101 in the second conveying section 12.

[0087] The beneficial effect brought by the above implementation method is that after the pre-immersion cleaning liquid of the PCB board is cleaned in the first conveying section, the etching liquid is sprayed on the PCB board through the bottom spray assembly in the second conveying section to ensure the uniformity of the roughening etching of the bottom surface of the PCB board in the second conveying section.

[0088] In some implementations, the above method further includes S210 to S220, and S210 to S220 are described in detail below.

[0089] S210 , obtaining the negative pressure detection value of the negative pressure detection component 411 .

[0090] During operation, the negative pressure detection value of the negative pressure detection component 411 can be obtained, and then the etching liquid spraying pressure value of the bottom spray component 3 corresponding to the first conveying section 11, the second conveying section 12 and the third conveying section 13 can be controlled by the negative pressure detection value of the negative pressure detection component 411.

[0091] S220, when the negative pressure detection value is less than the first negative pressure value, the liquid suction component 4 is controlled to stop the liquid suction gas circuit 41 from sucking the liquid suction hole 104, and at the same time, the bottom spray component 3 corresponding to the first conveying section 11 is controlled to start spraying etching liquid on the PCB board 101. When the negative pressure detection value is greater than or equal to the first negative pressure value and less than the second negative pressure value, the liquid suction component 4 is controlled to suck the liquid suction hole 104 through the liquid suction gas circuit 41, and at the same time, the bottom spray component 3 corresponding to the first conveying section 11 is controlled to stop spraying etching liquid on the PCB board 101, and the bottom spray pressure value of the bottom spray component 3 corresponding to the second conveying section 12 is increased. When the negative pressure detection value is greater than or equal to the second negative pressure value, the liquid suction component 4 is controlled to suck the liquid suction hole 104 through the liquid suction gas circuit 41, and at the same time, the bottom spray component 3 corresponding to the first conveying section 11 is controlled to stop spraying etching liquid on the PCB board 101, and the bottom spray pressure value of the bottom spray component 3 corresponding to the second conveying section 12 and the third conveying section 13 is increased.

[0092] During operation, when the negative pressure detection value is less than the first negative pressure value, it indicates that the residual amount of the pre-immersion cleaning liquid on the PCB board is small, and there is no pre-immersion cleaning liquid on the PCB board, causing the negative pressure value in the liquid suction air path 41 to increase. At this time, the liquid suction component 4 can be controlled to stop the liquid suction air path 41 from sucking the liquid suction hole 104 to ensure that the liquid suction component 4 will not suck the etching liquid on the PCB board through the liquid suction air path 41, and the bottom spray component 3 corresponding to the first conveying section 11 can be controlled to start spraying the etching liquid on the PCB board 101 at the same time, so as to realize etching of the PCB board 101 on the first conveying section 11.

[0093] During operation, when the negative pressure detection value is greater than or equal to the first negative pressure value and less than the second negative pressure value, the second negative pressure value is greater than the first negative pressure value, indicating that a certain amount of pre-immersion cleaning liquid remains on the PCB board, causing the negative pressure detection value to increase, but the residual amount of pre-immersion cleaning liquid on the PCB board is not large. At this time, the liquid suction component 4 can be controlled to suck the liquid suction hole 104 through the liquid suction air path 41 to achieve the cleaning of the pre-immersion cleaning liquid on the first conveying section 11. At the same time, the bottom spray component 3 corresponding to the first conveying section 11 is controlled to stop spraying etching liquid on the PCB board 101, and the bottom spray pressure value of the bottom spray component 3 corresponding to the second conveying section 12 is increased to offset the influence of a certain amount of pre-immersion cleaning liquid remaining on the PCB board on the roughening etching process.

[0094] Exemplarily, the bottom spraying pressure value of the bottom spraying assembly 3 corresponding to the second conveying section 12 may be increased to the first spraying pressure value.

[0095] During operation, when the negative pressure detection value is greater than or equal to the second negative pressure value, it indicates that there is residual pre-immersion cleaning liquid on the PCB board, causing the negative pressure detection value to increase, and the residual amount of pre-immersion cleaning liquid on the PCB board is large. At this time, the liquid suction component 4 can be controlled to suck the liquid suction hole 104 through the liquid suction gas path 41, and at the same time, the bottom spray component 3 corresponding to the first conveying section 11 is controlled to stop spraying etching liquid on the PCB board 101, so as to clean the pre-immersion cleaning liquid on the first conveying section 11, and increase the bottom spray pressure value of the bottom spray component 3 corresponding to the second conveying section 12 and the third conveying section 13, so as to increase the etching liquid spraying amount on the second conveying section 12 and the third conveying section 13, and offset the influence of the residual pre-immersion cleaning liquid on the PCB board on the roughening etching process.

[0096] Exemplarily, the bottom spraying pressure values ​​of the bottom spraying assemblies 3 corresponding to the second conveying section 12 and the third conveying section 13 may both be increased to the first spraying pressure value.

[0097] The beneficial effect brought about by the above-mentioned implementation method is that the residual amount of the pre-dip cleaning liquid detected by the negative pressure detection value on the first conveying section can be controlled to increase the different etching liquid spraying amounts on the second conveying section and the third conveying section, so as to offset the influence of the large amount of residual pre-dip cleaning liquid on the PCB board on the roughening etching process, thereby improving the etching control effect on the PCB board.

[0098] In some implementations, the above method further includes: when the negative pressure detection value is less than the first negative pressure value, controlling the top spray pressure value of the top spray assembly 2 corresponding to the second conveying section 12 to be the first spray pressure value. When the negative pressure detection value is greater than or equal to the first negative pressure value, controlling the top spray pressure value of the top spray assembly 2 corresponding to the second conveying section 12 to be the second spray pressure value. The second spray pressure value is greater than the first spray pressure value.

[0099] During operation, when the negative pressure detection value is less than the first negative pressure value, it means that the residual amount of pre-immersion cleaning liquid on the PCB board is small. The top spray pressure value of the top spray assembly 2 corresponding to the second conveying section 12 can be controlled to be the first spray pressure value, so that normal roughening etching of the PCB board can be achieved.

[0100] During operation, when the negative pressure detection value is greater than or equal to the first negative pressure value, it means that the residual amount of the pre-immersion cleaning liquid on the PCB board is large, and the top spray pressure value of the top spray assembly 2 corresponding to the second conveying section 12 is controlled to be the second spray pressure value. The second spray pressure value is greater than the first spray pressure value, and the dilution and flushing effect of the pre-immersion cleaning liquid on the top of the PCB board can be guaranteed by increasing the spray amount of the etching liquid on the top of the PCB board, thereby ensuring the etching effect on the top of the PCB board.

[0101] The beneficial effect brought by the above implementation method is that when the roughening etching degree of the top of the PCB board is controlled by the negative pressure detection value, the etching effect on the top of the PCB board is guaranteed by controlling the dilution of the pre-immersion cleaning liquid on the top of the PCB board and the amount of etching liquid for flushing.

[0102] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A roughening device for PCB inner layer pre-treatment, characterized in that: The invention comprises a conveying component (1), a top spraying component (2) and a bottom spraying component (3); the conveying component (1) is used for supporting and conveying a PCB board (101) from the bottom of the PCB board (101); the top spraying component (2) comprises a plurality of top spraying heads (21) arranged in an array; the bottom spraying component (3) comprises a plurality of bottom spraying heads (31) arranged in an array; the top spraying heads (21) are used for spraying etching liquid on the PCB board (101) from above the conveying component (1); the bottom spraying heads (31) are used for spraying etching liquid on the PCB board (101) from below the conveying component (1); and the density of the bottom spraying heads (31) is greater than that of the top spraying heads (21); The conveying assembly (1) comprises a first conveying section (11), a second conveying section (12) and a third conveying section (13); the first conveying section (11), the second conveying section (12) and the third conveying section (13) all comprise a plurality of conveying rollers (102) for supporting and conveying the PCB board (101) from the bottom; the conveying rollers (102) are capable of conveying the PCB board (101) at different speeds; each conveying roller (102) is provided with a plurality of conveying rollers (103); the conveying rollers (103) of the first conveying section (11) are provided with liquid suction holes (104); the liquid suction holes (104) are used to suck the pre-soak cleaning liquid on the PCB board (101); the spraying pressure of the top spraying assembly (2) corresponding to the second conveying section (12) is greater than the top spraying pressure values ​​of the top spraying assemblies (2) corresponding to the first conveying section (11) and the third conveying section (13); It also includes a liquid suction component (4) and a control component (5); the liquid suction component (4) is respectively connected to the liquid suction holes (104) on the conveying roller (103) of the first conveying section (11) through the liquid suction gas path (41); the control component (5) and the liquid suction component (4) are electrically connected; the control component (5) is used to control the top spray pressure value of the top spray component (2) corresponding to the second conveying section (12) according to the negative pressure detection value of the negative pressure detection component (411); Roughening is done by: Determining a target conveying speed, a top spray pressure value, and a bottom spray pressure value according to the copper thickness of the PCB board (101), the nozzle density and nozzle diameter of the top spray assembly (2), and the nozzle density and nozzle diameter of the bottom spray assembly (3); The conveying component (1) conveys the PCB board (101) at a target conveying speed, controls the top spray component (2) to spray etching liquid on the PCB board (101) from above the conveying component (1) according to the top spraying pressure value, and controls the bottom spray component (3) to spray etching liquid on the PCB board (101) from below the conveying component (1) according to the bottom spraying pressure value; The liquid suction component (4) sucks the liquid suction hole (104) through the liquid suction gas path (41), thereby sucking the pre-soak cleaning liquid on the PCB board (101) on the first conveying section (11), and at the same time controls the bottom spray component (3) corresponding to the first conveying section (11) to stop spraying the etching liquid on the PCB board (101); A negative pressure detection component (411) is provided on the liquid suction gas circuit (41), the negative pressure detection component (411) is electrically connected to the control component (5), and the control component (5) is used to control the etching liquid spraying pressure value of the bottom spraying component (3) corresponding to the first conveying section (11), the second conveying section (12) and the third conveying section (13) according to the negative pressure detection value of the negative pressure detection component (411); Obtaining a negative pressure detection value of a negative pressure detection component (411); When the negative pressure detection value is less than the first negative pressure value, the liquid suction component (4) is controlled to stop the liquid suction gas path (41) from sucking the liquid suction hole (104), and at the same time, the bottom spray component (3) corresponding to the first conveying section (11) is controlled to start spraying etching liquid on the PCB board (101); when the negative pressure detection value is greater than or equal to the first negative pressure value and less than the second negative pressure value, the liquid suction component (4) is controlled to suck the liquid suction hole (104) through the liquid suction gas path (41), and at the same time, the bottom spray component (3) corresponding to the first conveying section (11) is controlled to stop spraying etching liquid on the PCB board (101) sprays etching liquid, and increases the bottom spray pressure value of the bottom spray assembly (3) corresponding to the second conveying section (12); when the negative pressure detection value is greater than or equal to the second negative pressure value, controls the liquid suction assembly (4) to suck the liquid suction hole (104) through the liquid suction gas path (41), and simultaneously controls the bottom spray assembly (3) corresponding to the first conveying section (11) to stop spraying etching liquid on the PCB board (101), and increases the bottom spray pressure values ​​of the bottom spray assemblies (3) corresponding to the second conveying section (12) and the third conveying section (13).

2. The roughening device according to claim 1, characterized in that: The density of the conveying rollers (103) on each conveying roller (102) of the first conveying section (11) is greater than the density of the conveying rollers (103) on each conveying roller (102) of the second conveying section (12) and the third conveying section (13).

3. A roughening method for PCB inner layer pre-treatment, characterized in that: Using the roughening device according to claim 1 or 2, the method comprises: Determining a target conveying speed, a top spray pressure value, and a bottom spray pressure value according to the copper thickness of the PCB board (101), the nozzle density and nozzle diameter of the top spray assembly (2), and the nozzle density and nozzle diameter of the bottom spray assembly (3); The conveying component (1) conveys the PCB board (101) at a target conveying speed, controls the top spray component (2) to spray etching liquid on the PCB board (101) from above the conveying component (1) according to the top spraying pressure value, and controls the bottom spray component (3) to spray etching liquid on the PCB board (101) from below the conveying component (1) according to the bottom spraying pressure value; The liquid suction component (4) sucks the liquid suction hole (104) through the liquid suction gas path (41), thereby sucking the pre-soak cleaning liquid on the PCB board (101) on the first conveying section (11), and at the same time controls the bottom spray component (3) corresponding to the first conveying section (11) to stop spraying the etching liquid on the PCB board (101); Obtaining a negative pressure detection value of a negative pressure detection component (411); When the negative pressure detection value is less than the first negative pressure value, the liquid suction component (4) is controlled to stop the liquid suction gas path (41) from sucking the liquid suction hole (104), and at the same time, the bottom spray component (3) corresponding to the first conveying section (11) is controlled to start spraying etching liquid on the PCB board (101); when the negative pressure detection value is greater than or equal to the first negative pressure value and less than the second negative pressure value, the liquid suction component (4) is controlled to suck the liquid suction hole (104) through the liquid suction gas path (41), and at the same time, the bottom spray component (3) corresponding to the first conveying section (11) is controlled to stop spraying etching liquid on the PCB board (101) sprays etching liquid, and increases the bottom spray pressure value of the bottom spray assembly (3) corresponding to the second conveying section (12); when the negative pressure detection value is greater than or equal to the second negative pressure value, controls the liquid suction assembly (4) to suck the liquid suction hole (104) through the liquid suction gas path (41), and simultaneously controls the bottom spray assembly (3) corresponding to the first conveying section (11) to stop spraying etching liquid on the PCB board (101), and increases the bottom spray pressure values ​​of the bottom spray assemblies (3) corresponding to the second conveying section (12) and the third conveying section (13).

4. The roughening method according to claim 3, characterized in that: The method further comprises: When the negative pressure detection value is less than the first negative pressure value, the top spray pressure value of the top spray assembly (2) corresponding to the second conveying section (12) is controlled to be the first spray pressure value; when the negative pressure detection value is greater than or equal to the first negative pressure value, the top spray pressure value of the top spray assembly (2) corresponding to the second conveying section (12) is controlled to be the second spray pressure value; wherein the second spray pressure value is greater than the first spray pressure value.

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