Sputtering coating machine for semiconductor coating

Abstract

The present application relates to the technical field related to coating equipment, and discloses a sputtering coating machine for semiconductor coating, in order to solve the problem of space waste caused by a single positioning structure. A plurality of positioning frames are arranged vertically on a rotating base, and when a substrate needs to be fixed, the substrate is clamped between the positioning frames. Since there are a plurality of positioning frames, the spacing between the positioning frames can be used to increase the utilization rate of the internal space of the chassis and reduce space waste.

Description

Technical Field

[0001] The present application relates to the technical field related to coating equipment, and in particular to a sputtering coating machine for semiconductor coating. Background Art

[0002] The sputtering coating machine for semiconductor coating is a precision equipment working in a high vacuum environment. Its core function is to bombard the target material with high-energy particles, so that the atoms or molecules on the surface of the target material are separated and deposited on the surface of the semiconductor material, thereby forming a uniform and dense film. This film can effectively improve the surface properties of semiconductor materials, such as improving conductivity, optical properties or corrosion resistance. Therefore, the sputtering coating machine plays an indispensable and key role in the field of semiconductor manufacturing.

[0003] However, in actual applications, although the base of the sputtering coater is usually designed with multiple equal-angle substrate placement positions, these positions only support the clamping of a single substrate in the vertical direction. Since the sizes of semiconductor substrates may vary, when a smaller substrate is placed on the base, a large amount of unused space will be left above it. Due to the lack of an effective vertical positioning mechanism, these spaces cannot be fully utilized, resulting in a limit on the number of substrates that can be processed in a single coating process, which in turn reduces the overall work efficiency. Summary of the invention

[0004] The present application proposes a sputtering coating machine for semiconductor coating, which has the advantage of multiple positioning frames to fix the substrate, so as to solve the problem of single positioning structure leading to space waste proposed in the above-mentioned background technology.

[0005] To achieve the above-mentioned purpose, the present application adopts the following technical scheme: a sputtering coating machine for semiconductor coating, comprising: a chassis, a chassis door hinged on the surface, a vacuum pump arranged on the top, a rotating base movably installed inside, and the rotating base is connected to the rotating shaft of the motor; a guide rod, installed on the surface of the rotating base, and a positioning bottom frame, a positioning middle frame and a positioning top frame are installed on the outside; the positioning top frame is fixed to the top of the outside of the guide rod, and the positioning bottom frame and the positioning middle frame are movably installed on the outside of the guide rod; the positioning bottom frame, the positioning middle frame and the positioning top frame are strung together by a tightening rope; one end of the tightening rope is fixed to the bottom of the positioning bottom frame, and the top end of the tightening rope is connected to a counterweight structure.

[0006] Furthermore, the first type of counterweight mechanism is composed of counterweight balls.

[0007] Furthermore, the second counterweight structure includes: a sprocket, which is installed on the surface of the rotating base and is connected to the outside through a chain transmission; a rope collecting disk, which is coaxially fixed with the sprocket, and the top end of the tensioning rope is wound around the rope collecting disk; a tensioning box, which is fixed on the outside of the chain and has a tensioning slider installed inside; and a tensioning inclined seat, which is fixed on the surface of the rotating base.

[0008] Furthermore, a reversing wheel is fixedly mounted on the surface of the top positioning frame.

[0009] Furthermore, the positioning middle rack, the positioning top rack and the positioning bottom rack all include: a positioning slot block installed on its surface; a locking slider installed inside it, a locking rod fixed at one end, and a return spring for pushing the locking slider is arranged on one side of the locking rod.

[0010] Furthermore, the cross-section of the positioning groove block is V-shaped.

[0011] Furthermore, a lower positioning bar is fixedly connected to the bottom of the positioning middle shelf.

[0012] Furthermore, an anti-reverse tooth is fixedly installed on the side of the locking slider in the positioning top frame, and an anti-reverse push block that presses against the anti-reverse tooth is movably installed on one side of the locking slider, and an anti-reverse spring is connected between the anti-reverse push block and the positioning top frame.

[0013] Furthermore, a slope is provided on one side of the locking rod.

[0014] Furthermore, a round tube is arranged on the outer side of the tightening rope.

[0015] The present invention has the following beneficial effects:

[0016] The present application provides a semiconductor sputtering coating machine, which is provided with a rotating base and a vertical multi-positioning frame structure. The rotating base can flexibly adjust the angle to ensure the uniformity and consistency of the coating process. In the vertical direction of the base, multiple positioning frames are arranged, which are not only sturdy and durable, but also can adapt to substrates of different sizes.

[0017] When the substrate needs to be fixed, the operator only needs to clamp the substrate between two adjacent positioning frames and fine-tune the positioning frames to ensure that the substrate is firmly and stably fixed. Due to the large number of positioning frames and the adjustable spacing, the space inside the chassis is fully utilized. Even when processing smaller substrates, the spacing between the positioning frames can be adjusted to reduce the waste of upper space, thereby increasing the number of substrates that can be processed in a single coating process. This design not only improves the working efficiency of the sputtering coater, but also greatly saves production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings, which constitute a part of the specification, illustrate the embodiments disclosed in the present application and, together with the description, serve to explain the principles disclosed in the present application.

[0019] The present application can be more clearly understood from the following detailed description with reference to the accompanying drawings, in which:

[0020] Figure 1 It is a schematic diagram of the overall external three-dimensional structure;

[0021] Figure 2 It is a schematic diagram of the overall internal three-dimensional structure;

[0022] Figure 3 It is a schematic diagram of the distribution of various components in the rotating seat;

[0023] Figure 4 This is a schematic diagram of the positioning frame and chain distribution;

[0024] Figure 5 It is a schematic diagram of the internal three-dimensional structure of the tightening box;

[0025] Figure 6 To locate the external structure diagram of the middle shelf;

[0026] Figure 7 A schematic diagram of the internal three-dimensional structure of the middle shelf is provided for positioning;

[0027] Figure 8 A schematic diagram of the internal three-dimensional structure of the top frame for positioning;

[0028] Fig. 9 It is a schematic diagram of the fixing structure of the positioning frame to the substrate;

[0029] Fig.10 Schematic diagram of the cross section of the tensioning rope.

[0030] In the figure: 1. chassis; 2. door; 3. rotating base; 4. guide rod; 5. positioning bottom shelf; 6. positioning middle shelf; 7. positioning top shelf; 8. sprocket; 9. chain; 10. tightening inclined seat; 11. reversing wheel; 12. tightening rope; 13. tightening box; 130. tightening slider; 14. rope collecting drum; 15. positioning slot block; 16. locking rod; 17. lower positioning strip; 18. locking slider; 180. anti-reverse tooth; 19. reset spring; 20. anti-reverse push block; 21. anti-reverse spring. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0032] Embodiment 1

[0033] See also Figure 1 and Figure 2It can be seen that a door 2 is hinged on the surface of the chassis 1. The interior of the chassis 1 is sealed by opening and closing the door 2. When the vacuum pump sucks the inner cavity of the chassis 1 later, the closing of the door 2 is used to ensure that the inner cavity of the chassis 1 has a vacuum environment.

[0034] The housing 1 is provided with a rotating base 3, which is connected to the rotating shaft of the motor. The motor drives the rotating base 3 to rotate. Figure 2 and Figure 3 It can be seen that the surface of the rotating base 3 is fixedly connected to the guide rod 4, and the outer side of the guide rod 4 is movably installed with a positioning bottom frame 5, a positioning middle frame 6 and a positioning top frame 7, which are all movably installed on the guide rod 4 and can only reciprocate up and down along the guide rod 4. It should be noted that the positioning top frame 7 is fixed to the outer top of the guide rod 4, and the positioning bottom frame 5 and the positioning middle frame 6 are movably installed on the outer side of the guide rod 4. The positioning bottom frame 5, the positioning middle frame 6 and the positioning top frame 7 have the same structure. Figure 3 It can be seen that the bottom positioning rack 5, the middle positioning rack 6 and the top positioning rack 7 are placed in sequence. Fig. 9 It can be clearly seen that the substrate is fixed by clamping them.

[0035] The bottom frame 5, the middle frame 6 and the top frame 7 are connected together by a tensioning rope 12. Fig. 9 It can be seen that one end of the tightening rope 12 is fixed to the bottom of the bottom positioning frame 5, and the top of the tightening rope 12 is connected with a counterweight, preferably a counterweight ball. In actual application, the gravity of the counterweight ball pulls the bottom positioning frame 5 upward and close to the middle positioning frame 6. After that, the bottom positioning frame 5 pushes the middle positioning frame 6 to stick to the bottom of the top positioning frame 7.

[0036] If the substrate needs to be clamped, the positioning middle shelf 6 is manually pulled downward so that the substrate is clamped between the positioning middle shelf 6 and the positioning top shelf 7. If the size of the substrate is large, there is no need to place the substrate between the positioning bottom shelf 5 and the positioning middle shelf 6; if the size of the substrate is small, another substrate can be placed between the positioning bottom shelf 5 and the positioning middle shelf 6, thereby increasing the utilization of the internal space of the chassis 1.

[0037] Finally, as the rotating base 3 rotates, the weighted ball is thrown outward under the influence of centrifugal force, and the clamping force of the bottom positioning frame 5, the middle positioning frame 6 and the top positioning frame 7 on the substrate is increased, thereby further strengthening the fixation of the substrate.

[0038] Afterwards, the inner cavity of the chassis 1 is evacuated through a vacuum pump arranged on the top of the chassis 1, so that the inner cavity of the chassis 1 is in a relative vacuum state. Then, the target material is bombarded with high-energy particles, so that the atoms or molecules on the surface of the target material are separated and deposited on the surface of the substrate, thereby forming a uniform and dense film.

[0039] After coating is completed, turn off the vacuum pump and take out the substrate.

[0040] Embodiment 2

[0041] Further improvement on the basis of the first embodiment, since the first embodiment uses the form of a weight ball to increase weight, but in the actual application process, since the tightening rope 12 has a certain length, if the base plate size is small, the length of the tightening rope 12 extending outward will be too large, and since the space in the inner cavity of the chassis 1 is limited, the weight ball will hit the inner cavity of the chassis 1. In order to solve this problem, the second embodiment of the present invention can refer to Figure 3 and Figure 4 It can be seen that a pair of vertically arranged sprockets 8 are installed on the surface of the rotating base 3, and the outer sides of the sprockets 8 are connected by a chain 9. The sprocket 8 at the top is coaxially fixed with a rope-collecting drum 14, so that the top end of the tensioning rope 12 is wound around the rope-collecting drum 14 through the rotation of the rope-collecting drum 14.

[0042] Combination Figure 4 and Figure 5 It can be seen that the outer side of the chain 9 is fixedly connected with a tightening box 13, and the interior of the tightening box 13 is movably installed with a tightening slider 130. When the rotating base 3 rotates, the tightening slider 130 is pushed outward under the action of centrifuge. Correspondingly, the surface of the rotating base 3 is fixedly installed with a tightening inclined seat 10 located on one side of the tightening slider 130, and the surface of the tightening inclined seat 10 is an inclined surface. When the tightening slider 130 moves downward along the tightening inclined seat 10, the rope collecting disc 14 will rotate, and the bottom positioning frame 5 will be tightened by winding the tightening rope 12.

[0043] During specific application, under the gravity of the tightening box 13 itself, the tightening box 13 moves downward, so that the reversing wheel 11 drives the rope collecting drum 14 to rotate through the sprocket 8. After the rope collecting drum 14 rotates, it winds the tightening rope 12. By pulling the rope collecting drum 14, the bottom of the tightening rope 12 will move upward by pulling the positioning bottom frame 5 until the positioning bottom frame 5, the positioning middle frame 6 and the positioning top frame 7 are attached together. At this time, the positioning bottom frame 5, the positioning middle frame 6 and the positioning top frame 7 are all located below the positioning top frame 7.

[0044] When the substrate needs to be tightened, the positioning middle frame 6 is manually pulled downward, so that the tightening rope 12 is pulled downward, the rope reel 14 rotates, and the tightening box 13 moves upward. At this time, the substrate is clamped between the positioning middle frame 6 and the positioning top frame 7. Afterwards, using this method, the substrate is also clamped between the positioning middle frame 6 and the positioning bottom frame 5.

[0045] After the base plate is clamped and fixed, the rotating base 3 is rotated, so that the tightening slider 130 is thrown outward under the centrifugal force, and the tightening slider 130 is pressed against the inclined surface of the tightening inclined seat 10, so that the tightening slider 130 moves downward along the inclined surface of the tightening inclined seat 10, and further drags the chain 9 downward. The chain 9 pulled downward is wound up by the rope-winding drum 14, so as to further enhance the clamping strength between the bottom positioning frame 5, the middle positioning frame 6 and the top positioning frame 7.

[0046] In order to ensure that the tensioning rope 12 between the top frame 7 and the rope reel 14 is reversed, refer to Figure 3 and Figure 4 It can be clearly seen in the figure that a reversing wheel 11 is fixedly mounted on the surface of the top positioning frame 7, and the tensioning rope 12 is wound around the outside of the reversing wheel 11, so that the reversing wheel 11 is used to reverse the tensioning rope 12.

[0047] Embodiment 3

[0048] For further improvements based on Example 2, please refer to Figure 3-Figure 8 As can be seen, the positioning middle frame 6, the positioning top frame 7 and the positioning bottom frame 5 are all movably installed with positioning groove blocks 15, and the cross-sectional shape of the positioning groove blocks 15 is V-shaped, so as to position the substrate. Figure 7 It can be seen that a locking slider 18 is movably installed inside the positioning middle layer frame 6, and one end of the locking slider 18 is an inclined surface. When the positioning groove block 15 is pressed downward, one end of the positioning groove block 15 will push against the inclined surface of the locking slider 18. One end of the locking slider 18 is fixedly connected to a locking rod 16 extending to one side of the chain 9, and a return spring 19 is installed between the locking slider 18 and the positioning middle layer frame 6. Therefore, under the elastic force of the return spring 19, the return spring 19 pushes the locking slider 18 to move in the direction of the positioning groove block 15. At this time, the locking slider 18 pulls the locking rod 16 away from the chain 9, and the positioning groove block 15 is forced to be pushed upward by the inclined surface of the locking slider 18.

[0049] It should be noted that the reference Figure 6-Figure 9It can be seen that the positioning middle frame 6, the positioning top frame 7 and the positioning bottom frame 5 all contain positioning groove blocks 15, locking sliders 18, return springs 19 and locking rods 16. The positioning groove blocks 15 in the positioning top frame 7 are vertically downward, and the positioning groove blocks 15 in the positioning middle frame 6 and the positioning bottom frame 5 are vertically upward, so that the positioning groove blocks 15 are used to clamp and fix the substrate. The bottom of the positioning middle frame 6 is fixedly connected with a lower positioning bar 17, and the lower positioning bar 17 has the same cross-sectional shape as the positioning groove block 15. Therefore, the lower positioning bar 17 can be used to fix the substrate between the positioning middle frame 6 and the positioning bottom frame 5. When the substrate is pressed between the positioning bottom frame 5, the positioning middle frame 6 and the positioning top frame 7, the locking slider 18 will push the locking rod 16 to be inserted into the chain 9.

[0050] refer to Figure 8 It can be seen that the side of the locking slider 18 in the positioning top frame 7 is fixedly installed with an anti-reverse tooth 180, and one side of the locking slider 18 is movably installed with an anti-reverse push block 20 that presses on the anti-reverse tooth 180, and an anti-reverse spring 21 is connected between the anti-reverse push block 20 and the positioning top frame 7, and the elastic force of the anti-reverse spring 21 is used to make the anti-reverse push block 20 move away from the anti-reverse tooth 180. One end of the anti-reverse push block 20 is located on one side of the tightening rope 12. When the anti-reverse push block 20 presses against the anti-reverse tooth 180, the anti-reverse push block 20 limits the anti-reverse tooth 180, which restricts the locking slider 18 from moving. At the same time, Figure 8 It can also be seen in FIG. 1 that one side of the locking lever 16 is provided with an inclined surface.

[0051] In specific implementation, the substrate is placed between the bottom positioning frame 5, the middle positioning frame 6 and the top positioning frame 7 in the manner described in the second embodiment, and is limited and fixed by the positioning groove block 15 therebetween. At this time, the tightening slider 130 is affected by its own gravity, which causes the substrate between the bottom positioning frame 5, the middle positioning frame 6 and the top positioning frame 7 to be clamped, but the clamped substrate will not cause the locking slider 18 to be pushed outward due to the pressing of the positioning groove block 15, so the locking rod 16 is still away from the chain 9.

[0052] When the rotating base 3 rotates, the tightening slider 130 will move downward along the inclined surface of the tightening inclined seat 10 under the action of the centrifugal force, thereby pulling the positioning bottom frame 5 to be lifted upward. At this time, the weight borne by the positioning groove block 15 on the positioning bottom frame 5 will increase first. The reason is that when the positioning bottom frame 5 is pulled upward, the positioning groove block 15 on the positioning bottom frame 5 bears the weight of the positioning middle frame 6, the weight of the two substrates and the pressure applied upward by the positioning bottom frame 5.

[0053] As the pressure of the positioning groove block 15 on the positioning bottom frame 5 increases, the positioning groove block 15 will be forced to press the locking slider 18 downward, and the locking slider 18 will push outward and compress the return spring 19 until the locking rod 16 is stuck in the chain 9. At this time, the positioning groove block 15 will move upward with the chain 9 through the locking rod 16.

[0054] As the tightening slider 130 continuously moves downward along the tightening inclined seat 10, the locking rod 16 in the positioning middle frame 6 is also inserted into the chain 9. Since the locking rods 16 on the positioning bottom frame 5 and the positioning middle frame 6 are both inserted into the chain 9, the spacing between the positioning bottom frame 5 and the positioning middle frame 6 is relatively fixed. As the positioning middle frame 6 is pressed upward again until the locking rod 16 on the positioning top frame 7 is inserted into the chain 9, the pre-fixation of the substrate between the positioning bottom frame 5, the positioning middle frame 6 and the positioning top frame 7 is completed. At this time, the rotating base 3 rotates rapidly, and the tightening slider 130 has an outward throwing force through rotation. However, during actual coating, the rotation speed of the rotating base 3 is relatively slow.

[0055] In order to ensure that the spacing between the bottom positioning frame 5, the middle positioning frame 6 and the top positioning frame 7 can still maintain a certain length when the rotating base 3 rotates at a low speed, Fig.10 It can be seen that a sealed plastic tube is arranged on the outside of the tightening rope 12. When the rotating base 3 rotates to clamp the substrate between the bottom frame 5, the middle frame 6 and the top frame 7, the inner cavity of the chassis 1 is evacuated by a vacuum pump. Since the tightening rope 12 is in the chassis 1, when the chassis 1 is vacuumed, the sealed tube on the outside of the tightening rope 12 will expand under the influence of the vacuum, thereby pushing the anti-reverse push block 20 to press against the anti-reverse tooth 180. Afterwards, when the rotating base 3 rotates at a low speed, the anti-reverse push block 20 presses against the anti-reverse tooth 180, limiting the movement of the locking slider 18, so that the locking rod 16 is always inserted into the chain 9, and combined with the positioning top frame 7, it is fixed to the bottom of the guide rod 4. Therefore, the locking rod 16 in the positioning top frame 7 is inserted into the chain 9, which limits the chain 9 from rotating.

[0056] Afterwards, the substrate is subjected to a coating process in the manner described in the first embodiment.

[0057] After the coating is completed, the vacuum inside the chassis 1 is released, and the round tube outside the tightening rope 12 will not press the anti-reverse push block 20 after the vacuum is released. At this time, the anti-reverse push block 20 will be pushed away from the anti-reverse tooth 180 by the anti-reverse spring 21. After the anti-reverse push block 20 releases the restriction on the anti-reverse tooth 180, it will push the locking slider 18 inward under the influence of the elastic force of the reset spring 19 until the locking rod 16 is away from the chain 9. At this point, the substrate between the bottom positioning frame 5, the middle positioning frame 6 and the top positioning frame 7 returns to the clamping state mentioned above. The staff can take out the coated substrate in the above manner.

Claims

1. A sputtering coating machine for semiconductor coating, characterized in that: include: A machine case (1) has a case door (2) hinged on its surface, a vacuum pump is arranged on the top, and a rotating base (3) is movably installed inside, wherein the rotating base (3) is connected to the rotating shaft of the motor; A guide rod (4) is mounted on the surface of the rotating base (3), and a bottom positioning frame (5), a middle positioning frame (6) and a top positioning frame (7) are mounted on the outside thereof; The top positioning frame (7) is fixed to the outer top of the guide rod (4), and the bottom positioning frame (5) and the middle positioning frame (6) are movably mounted on the outer side of the guide rod (4); The bottom positioning frame (5), the middle positioning frame (6) and the top positioning frame (7) are connected together by a tightening rope (12); One end of the tightening rope (12) is fixed to the bottom of the bottom positioning frame (5), and the top end of the tightening rope (12) is connected to a counterweight structure; The counterweight structure includes: A sprocket (8) is mounted on the surface of the rotating base (3) and is connected to the outer side via a chain (9); A rope collecting disc (14) is coaxially fixed with the sprocket (8), and the top end of the tensioning rope (12) is wound around the rope collecting disc (14); A tightening box (13) is fixed to the outside of the chain (9) and has a tightening slider (130) installed inside; A tightening inclined seat (10) is fixed on the surface of the rotating base (3); The positioning middle shelf (6), the positioning top shelf (7) and the positioning bottom shelf (5) all include: A positioning groove block (15) is mounted on the surface thereof; A locking slider (18) is installed inside the locking slider, and a locking rod (16) is fixed at one end thereof. A return spring (19) for pushing the locking slider (18) is arranged on one side of the locking rod (16).

2. The semiconductor sputtering coating machine according to claim 1, characterized in that: A reversing wheel (11) is fixedly mounted on the surface of the top positioning frame (7).

3. The semiconductor sputtering coating machine according to claim 1, characterized in that: The cross-section of the positioning groove block (15) is V-shaped.

4. The semiconductor sputtering coating machine according to claim 1, characterized in that: A lower positioning strip (17) is fixedly connected to the bottom of the positioning middle shelf (6).

5. The semiconductor sputtering coating machine according to claim 1, characterized in that: An anti-reverse tooth (180) is fixedly mounted on the side of the locking slider (18) in the positioning top frame (7), and an anti-reverse push block (20) that presses against the anti-reverse tooth (180) is movably mounted on one side of the locking slider (18), and an anti-reverse push spring (21) is connected between the anti-reverse push block (20) and the positioning top frame (7).

6. The semiconductor sputtering coating machine according to claim 5, characterized in that: One side of the locking rod (16) is provided with an inclined surface.

7. The semiconductor sputtering coating machine according to claim 5, characterized in that: A round tube is arranged on the outer side of the tightening draw cord (12).

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