A design method for a water cooling structure of a semiconductor laser and a semiconductor laser

Abstract

The present invention discloses a design method of a water cooling structure of a semiconductor laser and a semiconductor laser; wherein the design method comprises the following steps: step 01, obtaining the cooling parameters of the water cooling structure and the parameters of the laser single tube array, and setting the period range of the partition blades; step 02, establishing finite element models corresponding to different partition blade periods according to the cooling parameters of the water cooling structure, the parameters of the laser single tube array and the period range of the partition blades; step 03, obtaining the coolant flow information in the corresponding water cooling structure and the temperature information of the laser single tube array according to each finite element model; step 04, determining the optimal period of the partition blade according to each coolant flow information and each temperature information. The design method of the present invention can design a suitable partition blade period so that the water cooling structure can achieve the optimal heat dissipation effect.

Description

Technical Field

[0001] The invention belongs to the technical field of laser heat dissipation structures, and in particular relates to a design method for a water cooling structure of a semiconductor laser and a semiconductor laser. Background Art

[0002] With the widespread application of semiconductor lasers in fields such as material processing and solid-state laser pumping, people have higher and higher requirements for the output power of semiconductor lasers. Since semiconductor lasers generate a lot of heat when working, when the temperature of a single laser tube is too high, it will reduce the performance of the semiconductor laser or even completely damage the semiconductor laser. Therefore, when increasing the output power of semiconductor lasers, it is necessary to solve the heat dissipation problem of semiconductor lasers.

[0003] At present, most semiconductor lasers use a water-cooling structure composed of microchannels for heat dissipation and cooling. However, the microchannels are easily eroded or blocked by water flow during long-term operation, causing damage, which in turn affects the heat dissipation of the semiconductor laser. In addition, the existing water-cooling structure design of semiconductor lasers is unreasonable and cannot achieve the optimal heat dissipation effect. Summary of the invention

[0004] In view of the above problems, the present invention discloses a design method of a water cooling structure of a semiconductor laser and a semiconductor laser, so as to overcome the above problems or at least partially solve the above problems.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] The present invention discloses a design method for a water cooling structure of a semiconductor laser, wherein the water cooling structure comprises a water cooling base plate and at least one module water cooling plate;

[0007] Each of the module water-cooling plates is arranged on the water-cooling base plate and is used to carry a laser single-tube array. A water-cooling channel is formed in the water-cooling base plate, and the water-cooling channel includes at least one water inlet and at least one water outlet. A water-cooling cavity is formed in the module water-cooling plate. A plurality of spaced-apart partition blades are arranged in the water-cooling cavity along the flow direction of the coolant. The water inlet end of the water-cooling cavity is communicated with the water inlet, and the water outlet end of the water-cooling cavity is communicated with the water outlet;

[0008] The design method comprises the following steps:

[0009] Step 01, obtaining the cooling parameters of the water cooling structure and the parameters of the laser single tube array, and setting the period range of the separation blades;

[0010] Step 02, establishing a finite element model corresponding to different partition blade periods according to the cooling parameters of the water cooling structure, the parameters of the laser single tube array and the period range of the partition blades;

[0011] Step 03, obtaining the coolant flow information in the corresponding water cooling structure and the temperature information of the laser single tube array according to each of the finite element models;

[0012] Step 04, determining the optimal cycle of the separation blade according to the coolant flow information and the temperature information.

[0013] Furthermore, the step 02 is specifically as follows:

[0014] According to the cooling parameters of the water-cooling structure, the parameters of the laser single-tube array and the period range of the separator blades, shape models corresponding to different separator blade periods are established, finite element meshes are divided for each of the shape models, finite element models corresponding to different separator blade periods are obtained, and material properties of the finite element meshes are set.

[0015] Furthermore, the cooling parameters of the water cooling structure include: parameters of the water cooling channel, parameters of the water cooling cavity and the flow rate of coolant at the inlet of the water cooling channel.

[0016] Furthermore, the coolant flow information includes: the cooling fluid pressure difference between the inlet and outlet of the water cooling channel and the flow rate of the coolant in each of the water cooling cavities;

[0017] The temperature information includes: an average temperature of the laser tubes in all the laser tube arrays and a maximum temperature of the laser tubes.

[0018] Furthermore, the step 04 is specifically as follows:

[0019] Step 041, construct a weight function W,

[0020]

[0021] in, is the lift coefficient, and its value is 0.1 m -1 ; For lift; is the flow difference coefficient, and its value is 10; is the relative standard deviation of the coolant flow rate between each water-cooling cavity; is the temperature coefficient, and its value is 0.04℃ -1 ; is the average temperature of a single laser tube; is the maximum temperature of a single laser tube; is the temperature difference coefficient, and its value is 1; is the reference temperature, and its value is 50℃;

[0022] Step 042, converting the cooling hydraulic pressure difference between the inlet and outlet of the water-cooling channel into a corresponding head, and calculating the relative standard deviation of the flow rate of the coolant between the water-cooling cavities according to the flow rate of the coolant in each of the water-cooling cavities;

[0023] Step 043, respectively bringing the head, relative standard deviation of flow rate, average temperature of a single laser tube and maximum temperature of a single laser tube corresponding to different partition blade cycles into the weight function W to obtain corresponding weight function values;

[0024] Step 044, selecting the period of the partition blade corresponding to the minimum weight function value as the optimal period of the partition blade.

[0025] Furthermore, the water-cooling base plate is made of aluminum.

[0026] Furthermore, the module water cooling plate is made of copper, aluminum or a composite material with high thermal conductivity.

[0027] Furthermore, the laser single tube array is arranged on an auxiliary heat sink, and the auxiliary heat sink is fixed on the module water cooling plate.

[0028] Furthermore, the auxiliary heat sink is made of silicon carbide or aluminum nitride.

[0029] Another aspect of the present invention discloses a semiconductor laser, comprising a water-cooling structure designed by the above-mentioned method for designing a water-cooling structure of a semiconductor laser.

[0030] The advantages and beneficial effects of the present invention are:

[0031] The design method of the present invention adopts a water-cooling structure composed of partition blades to cool and dissipate heat of a semiconductor laser, which can not only avoid the blockage problem of a microchannel, but also achieve a better heat dissipation effect; and, by establishing a finite element model, the heat transfer and flow of a coolant and a solid in the water-cooling structure are simulated, and the period of the partition blades is determined according to the heat transfer and flow of the coolant and the solid, so that the water-cooling structure can achieve the optimal cooling and heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present invention. Moreover, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0033] Figure 1 A three-dimensional structural diagram of a water cooling structure in one embodiment of the present invention;

[0034] Figure 2A structural perspective view of a water cooling structure in one embodiment of the present invention;

[0035] Figure 3 A partial structural perspective view of a module water cooling plate in one embodiment of the present invention;

[0036] Figure 4 A diagram of implementation steps of a design method in one embodiment of the present invention;

[0037] Figure 5 This is a diagram showing the arrangement structure of the partition blades when the partition blade period is 1.2 mm in one embodiment of the present invention;

[0038] Figure 6 A simulation diagram of the flow rate of the coolant in the water cooling structure when the period of the separation blades is 1.2 mm in one embodiment of the present invention;

[0039] Figure 7 It is a temperature simulation diagram of each laser tube when the period of the partition blades is 1.2 mm in one embodiment of the present invention;

[0040] Figure 8 This is a diagram showing the arrangement structure of the partition blades when the partition blade period is 1.6 mm in one embodiment of the present invention;

[0041] Fig. 9 A simulation diagram of the flow rate of the coolant in the water cooling structure when the period of the partition blades is 1.6 mm in one embodiment of the present invention;

[0042] Fig.10 It is a temperature simulation diagram of each laser tube when the period of the partition blades is 1.6 mm in one embodiment of the present invention;

[0043] Fig.11 This is a diagram showing the arrangement structure of the partition blades when the partition blade period is 2 mm in one embodiment of the present invention;

[0044] Fig.12 It is a simulation diagram of the flow rate of the coolant in the water cooling structure when the period of the separation blades is 2 mm in one embodiment of the present invention;

[0045] Fig.13 This is a temperature simulation diagram of each laser tube when the period of the separation blades is 2 mm in an embodiment of the present invention.

[0046] In the figure: 1. Water-cooled base plate; 2. Module water-cooled plate; 3. Water inlet; 4. Water outlet; 5. Water-cooled cavity; 6. Separation blades; 7. Single laser tube. DETAILED DESCRIPTION

[0047] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the specific embodiments of the present invention and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0048] The technical solutions provided by various embodiments of the present invention are described in detail below in conjunction with the accompanying drawings.

[0049] In one embodiment of the present invention, a method for designing a water cooling structure of a semiconductor laser is provided; wherein, Figures 1 to 3 As shown, the water cooling structure includes a water cooling base plate 1 and at least one module water cooling plate 2 .

[0050] Specifically, each module water-cooling plate 2 is arranged on a water-cooling base plate 1 and is used to carry a laser single-tube array. The laser single-tube array is obtained by arranging multiple laser single tubes 7 according to a certain rule. A water-cooling channel is formed in the water-cooling base plate 1. The inlet and outlet of the water-cooling channel are located on one side or both sides of the water-cooling base plate 1. The water-cooling channel includes at least one water inlet 3 and at least one water outlet 4. The number of water inlets 3 and water outlets 4 is the same and they are arranged at intervals. The number of water inlets 3 and water outlets 4 is also the same as the number of module water-cooling plates 2. A water-cooling cavity 5 is formed in the module water-cooling plate 2. A plurality of spaced-apart partition blades 6 are arranged in the water-cooling cavity 5 along the flow direction of the coolant. The water inlet end of the water-cooling cavity 5 is connected to the water inlet 3, and the water outlet end of the water-cooling cavity 5 is connected to the water outlet 4, that is, the water-cooling cavity 5 is connected between the water inlet 3 and the water outlet 4.

[0051] In this way, the flow route of the coolant in the water cooling structure is: the coolant first enters the water inlet channel 3 through the inlet of the water cooling channel, and enters the water cooling cavity 5 through the water inlet end of the water cooling cavity 5, the coolant flows through the gaps between the dividing blades 6, and then takes away the heat generated by the laser single tube array on the module water cooling plate 2, and then the coolant carrying the heat enters the water outlet channel 4 through the water outlet end of the water cooling cavity 5, and finally the coolant in the water outlet channel 4 is discharged through the outlet of the water cooling channel.

[0052] like Figure 4 As shown, the design method of the water cooling structure of the semiconductor laser includes the following steps:

[0053] Step 01, obtain the cooling parameters of the water-cooling structure and the parameters of the laser single tube array, and set the period range of the partition blades; wherein, the parameters of the laser single tube array include the number of laser single tubes in the laser single tube array, the spacing distance between each laser single tube and the power of the laser single tube, and the cooling parameters of the water-cooling structure include the parameters of the water-cooling channel, the parameters of the water-cooling cavity and the flow rate of the coolant in the inlet of the water-cooling channel. The period of the partition blade refers to the arrangement period of the partition blades within a fixed space width, that is, the sum of the thickness of a partition blade and the gap width between two partition blades within a fixed space width; it should be noted that the thickness of the partition blades always remains unchanged, and adjusting the arrangement period of the partition blades is essentially adjusting the gap width between two partition blades.

[0054] Step 02, according to the cooling parameters of the water-cooling structure, the parameters of the laser single-tube array and the period range of the separator blades, a finite element model corresponding to different separator blade periods is established, and the cooling condition of the water-cooling structure is simulated by the finite element model.

[0055] The period of the partition blade is selected within the period range of the partition blade, for example Figure 5 , Figure 8 and Fig.11 As shown, the periods of the separator blades are selected as 1.2 mm, 1.6 mm and 2 mm respectively, and the finite element models corresponding to these separator blade periods are established based on the parameters.

[0056] Step 03, according to each finite element model, obtain the coolant flow information in the corresponding water-cooling structure and the temperature information of the laser single tube array; wherein the coolant flow information includes the cooling liquid pressure difference between the inlet and outlet of the water-cooling channel and the flow rate of the coolant in each water-cooling cavity; the temperature information includes the average temperature of the laser single tube in all laser single tube arrays and the maximum temperature of the laser single tube.

[0057] Step 04, determining the optimal cycle of the separation blades according to the coolant flow information and the temperature information.

[0058] Specifically, an evaluation is performed based on the coolant flow information and temperature information calculated by simulation of each finite element model, and a separator blade cycle with the best cooling effect is selected as the optimal cycle of the separator blade.

[0059] In summary, the design method of this embodiment adopts a water-cooling structure composed of partition blades to cool and dissipate heat of the semiconductor laser, which can not only avoid the blockage problem of the microchannel, but also achieve a better heat dissipation effect; and, by establishing a finite element model, the heat transfer and flow of the coolant and solid in the water-cooling structure are simulated, and the period of the partition blades is determined according to the heat transfer and flow of the coolant and solid, so that the water-cooling structure can achieve the optimal cooling and heat dissipation effect.

[0060] In this embodiment, step 02 is specifically as follows:

[0061] According to the cooling parameters of the water-cooling structure, the parameters of the laser single-tube array and the period range of the separator blades, shape models corresponding to different separator blade periods are established, finite element meshing is performed on each shape model, finite element models corresponding to different separator blade periods are obtained, and material properties of the finite element mesh are set. Among them, the material properties of the finite element mesh are the properties of the specific materials used in the water-cooling structure.

[0062] Furthermore, step 04 is specifically as follows:

[0063] Step 041, construct a weight function W,

[0064]

[0065] in, is the lift coefficient, and its value is 0.1 m -1 ; For lift; is the flow difference coefficient, and its value is 10; is the relative standard deviation of the coolant flow rate between each water-cooling cavity; is the temperature coefficient, and its value is 0.04℃ -1 ; is the average temperature of a single laser tube; is the maximum temperature of a single laser tube; is the temperature difference coefficient, and its value is 1; is the reference temperature, and its value is 50℃.

[0066] Step 042, converting the cooling hydraulic pressure difference between the inlet and outlet of the water-cooling channel into a corresponding head, and calculating the relative standard deviation of the coolant flow between each water-cooling cavity based on the coolant flow through each water-cooling cavity.

[0067] Step 043, the head, relative standard deviation of flow rate, average temperature of laser tube and maximum temperature of laser tube corresponding to different partition blade cycles are respectively brought into the weight function W to obtain the corresponding weight function value. In this way, the cooling effect of the cooling structure can be evaluated by the four dimensions of head size (cooling hydraulic pressure difference), flow rate uniformity, temperature height and temperature uniformity, so that the water cooling structure composed of the selected partition blade cycle has a better heat dissipation effect.

[0068] Step 044, select the period of the partition blade corresponding to the minimum weight function value as the optimal period of the partition blade. Specifically, since different partition blade periods have corresponding weight function values, many weight function values ​​will be obtained, and the minimum weight function value is selected from the many weight function values, and the period of the partition blade corresponding to the minimum weight function value is used as the optimal period of the partition blade. It should be noted that the smaller the weight function value, the better the comprehensive cooling and heat dissipation effect of the cooling structure.

[0069] In this embodiment, Figure 1 As shown, there are two modular water cooling plates, namely modular water cooling plate one and modular water cooling plate two.

[0070] like Figure 5 As shown, the width of the cooling cavity (fixed space width) is 16 mm, the period of the selected partition blade is 1.2 mm, the spacing between the two partition blades is 0.6 mm, and the thickness of the partition blade is 0.6 mm. The corresponding finite element model is established, as shown in Figure 6 and Figure 7 As shown, the flow rate of the coolant in the water cooling structure under the partition blade cycle is simulated, and the temperature of each laser tube is simulated; Figure 8 As shown, the width of the cooling cavity is 16 mm, the period of the selected partition blade is 1.6 mm, the spacing between the two partition blades is 1 mm, and the thickness of the partition blade is 0.6 mm. The corresponding finite element model is established as shown in Fig. 9 and Fig.10 As shown, the flow rate of the coolant in the water cooling structure under the partition blade cycle is simulated, and the temperature of each laser tube is simulated; Fig.11 As shown, the width of the cooling cavity is 16 mm, the period of the selected partition blade is 2 mm, the spacing between the two partition blades is 1.4 mm, and the thickness of the partition blade is 0.6 mm. The corresponding finite element model is established as shown in Fig.12 and Fig.13 As shown, the flow rate of the coolant in the water cooling structure under the partition blade cycle is simulated, and the temperature of each laser tube is simulated. Table 1 shows the coolant flow information and the temperature information of the laser tube calculated by simulating the cycles of three different partition blades.

[0071] <![CDATA[Head L lift (m)]]> <![CDATA[Flow rate F of the first modular water-cooling plate flow1 (L / min)]]> <![CDATA[Flow rate F of the second modular water-cooling plate flow2 (L / min)]]> <![CDATA[Average temperature T of a single laser diode average (°C)]]> <![CDATA[The maximum temperature T of a single laser diode max (°C)]]> Period 1.2 mm (13 blades) 24.9917 18.24 16.52 70.13 77.3 Period 1.6 mm (10 blades) 21.5618 18.65 16.81 68.18 75.87 Period 2 mm (8 blades) 19.8759 18.49 16.24 71.75 79.06

[0072] Table 1

[0073] In this embodiment, the water-cooled bottom plate is made of aluminum, and the module water-cooled plate is made of copper, aluminum or a composite material with high thermal conductivity. Of course, the water-cooled bottom plate and the module water-cooled plate may also be made of other materials, which are also within the scope of protection of the present invention.

[0074] In addition, the laser single tube array is arranged on an auxiliary heat sink, and the auxiliary heat sink is fixed on the module water cooling plate, and the laser single tube array can achieve uniform heat dissipation through the auxiliary heat sink. Among them, many laser single tubes in the laser single tube array can be arranged on the same auxiliary heat sink, or each laser single tube in the laser single tube array corresponds to an auxiliary heat sink and is fixed thereon.

[0075] Furthermore, the auxiliary heat sink is made of silicon carbide or aluminum nitride.

[0076] In another embodiment of the present invention, a semiconductor laser is provided. The semiconductor laser includes a water-cooling structure designed by the design method of the water-cooling structure of the semiconductor laser in the above embodiment, and has excellent cooling effect, longer service life, and more stable operation.

[0077] The above is only a specific embodiment of the present invention. Under the above teachings of the present invention, those skilled in the art can make other improvements or modifications on the basis of the above embodiments. Those skilled in the art should understand that the above specific description is only to better explain the purpose of the present invention, and the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A method for designing a water cooling structure of a semiconductor laser, characterized in that: The water cooling structure includes a water cooling base plate and at least one module water cooling plate; Each of the module water-cooling plates is arranged on the water-cooling base plate and is used to carry a laser single-tube array. A water-cooling channel is formed in the water-cooling base plate, and the water-cooling channel includes at least one water inlet and at least one water outlet. A water-cooling cavity is formed in the module water-cooling plate. A plurality of spaced-apart partition blades are arranged in the water-cooling cavity along the flow direction of the coolant. The water inlet end of the water-cooling cavity is communicated with the water inlet, and the water outlet end of the water-cooling cavity is communicated with the water outlet; The design method comprises the following steps: Step 01, obtaining the cooling parameters of the water cooling structure and the parameters of the laser single tube array, and setting the period range of the separation blades; Step 02, establishing a finite element model corresponding to different partition blade periods according to the cooling parameters of the water cooling structure, the parameters of the laser single tube array and the period range of the partition blades; Step 03, obtaining the coolant flow information in the corresponding water cooling structure and the temperature information of the laser single tube array according to each of the finite element models; Step 04, determining the optimal cycle of the separation blade according to the coolant flow information and the temperature information; The coolant flow information includes: the cooling hydraulic pressure difference between the inlet and outlet of the water cooling channel and the flow rate of the coolant in each of the water cooling cavities; The temperature information includes: the average temperature of the laser tubes in all the laser tube arrays and the maximum temperature of the laser tubes; The step 04 is specifically as follows: Step 041, construct a weight function W, Among them, C lift is the lift coefficient, and its value is 0.1m -1 ; L lift C is the lift; flowdifference is the flow difference coefficient, its value is 10; RSD flow is the relative standard deviation of the coolant flow rate between each water-cooling cavity; C temperature is the temperature coefficient, and its value is 0.04℃ -1 ; T average is the average temperature of a single laser tube; T max is the maximum temperature of a single laser tube; C temperaturedifference is the temperature difference coefficient, its value is 1; T reference is the reference temperature, and its value is 50℃; Step 042, converting the cooling hydraulic pressure difference between the inlet and outlet of the water-cooling channel into a corresponding head, and calculating the relative standard deviation of the flow rate of the cooling liquid between the water-cooling cavities according to the flow rate of the cooling liquid in each of the water-cooling cavities; Step 043, respectively bringing the head, relative standard deviation of flow rate, average temperature of a single laser tube and maximum temperature of a single laser tube corresponding to different partition blade cycles into the weight function W to obtain the corresponding weight function value; Step 044, selecting the period of the partition blade corresponding to the minimum weight function value as the optimal period of the partition blade.

2. The method for designing a water cooling structure of a semiconductor laser according to claim 1, characterized in that: The step 02 is specifically as follows: According to the cooling parameters of the water-cooling structure, the parameters of the laser single-tube array and the period range of the separator blades, shape models corresponding to different separator blade periods are established, finite element meshes are divided for each of the shape models, finite element models corresponding to different separator blade periods are obtained, and material properties of the finite element meshes are set.

3. The method for designing a water cooling structure of a semiconductor laser according to claim 2, characterized in that: The cooling parameters of the water cooling structure include: parameters of the water cooling channel, parameters of the water cooling cavity and the flow rate of the coolant in the inlet of the water cooling channel.

4. The method for designing a water cooling structure of a semiconductor laser according to claim 1, characterized in that: The water-cooling base plate is made of aluminum.

5. The method for designing a water cooling structure of a semiconductor laser according to claim 1, characterized in that: The module water cooling plate is made of copper, aluminum or a composite material with high thermal conductivity.

6. The method for designing a water cooling structure of a semiconductor laser according to any one of claims 1 to 5, characterized in that: The laser single tube array is arranged on an auxiliary heat sink, and the auxiliary heat sink is fixed on the module water cooling plate.

7. The method for designing a water cooling structure of a semiconductor laser according to claim 6, characterized in that: The auxiliary heat sink is made of silicon carbide or aluminum nitride.

8. A semiconductor laser, characterized in that: The invention comprises a water-cooling structure designed by the design method of a water-cooling structure of a semiconductor laser according to any one of claims 1 to 7.

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