Ceramic copper-clad carrier board and power supply board capable of mounting chips on both sides and manufacturing method thereof

Abstract

The present invention discloses a ceramic copper-clad carrier board and a power supply board and a manufacturing method for double-sided chip mounting, which relates to the technical field of ceramic copper-clad carrier boards and solves the problem that the existing ceramic copper-clad carrier boards can only mount power chips on one side and the utilization rate of the copper plate is low. A ceramic copper-clad carrier board on which chips can be mounted on both sides according to an embodiment of the present invention comprises a copper-clad carrier board body, wherein the copper-clad carrier board body comprises a ceramic substrate and two first copper plates and a second copper plate respectively fixed on two sides of the ceramic substrate, and further comprises at least one conductive column arranged to penetrate the first copper plate, the ceramic substrate and the second copper plate, and the two ends of the conductive column are respectively conductively connected to the first copper plate and the second copper plate.

Description

Technical Field

[0001] The invention relates to the technical field of ceramic copper-clad carrier boards, and in particular to a ceramic copper-clad carrier board and a power supply board capable of mounting chips on both sides, and a manufacturing method thereof. Background Art

[0002] Ceramic copper-clad substrate is a composite material that combines metal copper foil with a ceramic substrate. It utilizes the high thermal conductivity, high mechanical strength and high insulation of ceramics, as well as the good conductivity and solderability of metal copper foil. It is widely used in power electronics, high-power electronic modules and other fields.

[0003] Ceramic copper-clad laminates include single-sided copper-clad laminates and double-sided copper-clad laminates. Single-sided copper-clad laminates have low costs and relatively simple manufacturing processes, and can only be used in some electronic products that do not require high circuits. Double-sided copper-clad laminates are widely used in electronic products that require high-density wiring and complex circuits due to their excellent conductivity and mechanical strength. However, existing double-sided copper-clad laminates can usually only install power chips on one side of the copper-clad laminate, resulting in low utilization of the copper plate. In addition, when existing power chips are installed on different copper plates of the copper-clad laminate, jumper welding is required to conduct the power chips on different copper plates, resulting in low current overload capacity.

[0004] Based on the above background, the inventor has designed a ceramic copper-clad carrier board and power supply board and a manufacturing method for double-sided chip mounting to solve the above problems, and thus proposed the present application. Summary of the invention

[0005] The purpose of the present application is to provide a ceramic copper-clad carrier board and a power supply board and a manufacturing method for double-sided chip installation, so as to solve the problems that the existing ceramic copper-clad carrier board can only install power chips on one side, the utilization rate of the copper board is low, and when installing power chips, the power chips on different copper boards need to be connected by jumper welding, and the current overload capacity is low.

[0006] In order to solve the above technical problems, the present invention adopts the following solutions:

[0007] On the one hand, the present application provides a ceramic copper-clad carrier board on which chips can be mounted on both sides, including a copper-clad carrier board main body, wherein the copper-clad carrier board main body includes a ceramic substrate and two first copper plates and a second copper plate respectively fixed on both sides of the ceramic substrate, and also includes at least one conductive column arranged through the ceramic substrate, and the two ends of the conductive column are respectively conductively connected to the first copper plate and the second copper plate.

[0008] Optionally, the copper-clad carrier body is further provided with a through hole penetrating the first copper plate, the ceramic substrate and the second copper plate, and the conductive column is located in the through hole.

[0009] Optionally, the first copper plate is provided with a first AC chip mounting slot and a first DC chip mounting slot;

[0010] The second copper plate is provided with a second AC chip mounting slot and a second DC chip mounting slot;

[0011] The through hole includes a first hole segment located in the first copper plate, a second hole segment located in the second copper plate, and a third hole segment located in the ceramic substrate;

[0012] The first hole section is located between the first AC chip mounting slot and the first DC chip mounting slot;

[0013] The second hole section is located between the second AC chip mounting groove and the second DC chip mounting groove.

[0014] Optionally, the through holes and the conductive pillars are arranged perpendicular to the copper-clad substrate body.

[0015] Optionally, a first crimping joint and a second crimping joint are respectively provided at both ends of the conductive column;

[0016] The first crimping joint and the second crimping joint are crimped onto the first copper plate and the second copper plate respectively.

[0017] Optionally, the conductive column is made of copper material.

[0018] Optionally, another aspect of the present application provides a method for manufacturing a ceramic copper-clad carrier capable of mounting chips on both sides, which is used to manufacture any of the above-mentioned ceramic copper-clad carrier capable of mounting chips on both sides, comprising the following steps:

[0019] S1, opening a through hole penetrating the first copper plate, the ceramic substrate and the second copper plate on the copper-clad carrier body;

[0020] S2. Obtain a conductive column that has an interference fit with the through hole and press it into the through hole.

[0021] Optionally, a first crimping joint and a second crimping joint are respectively provided at both ends of the conductive column;

[0022] The method also includes step S3 of pressing the first crimping joint and the second crimping joint at both ends of the conductive column onto the first copper plate and the second copper plate respectively.

[0023] A third aspect of the present application provides a power supply board, comprising any one of the above-mentioned ceramic copper-clad carrier boards capable of mounting chips on both sides, and a first AC power chip and a first DC power chip mounted on a first copper board, and a second AC power chip and a second DC power chip mounted on a second copper board;

[0024] The two ends of the conductive column are respectively an A end conductively connected to the first copper plate and a B end conductively connected to the second copper plate;

[0025] The pins of the first AC power chip and the first DC power chip are welded to the A end of the conductive column, and the pins of the second AC power chip and the second DC power chip are welded to the B end of the conductive column.

[0026] A fourth aspect of the present application provides a method for manufacturing a power supply board, which is used to manufacture the above-mentioned power supply board, comprising the following steps:

[0027] Sa. Solder the pins of the first AC power chip and the first DC power chip to the A end of the conductive column; and solder the pins of the second AC power chip and the second DC power chip to the B end of the conductive column.

[0028] The beneficial effects of the present invention compared to the prior art are as follows:

[0029] The present application arranges a conductive column that penetrates the ceramic substrate, and the two ends of the conductive column are conductively connected to the first copper plate and the second copper plate respectively, so that the first copper plate and the second copper plate of the copper-clad carrier body form a whole that can be conductive to each other through the conductive column, so that power chips can be installed on both the first copper plate and the second copper plate of the copper-clad carrier body. Compared with the prior art that power chips can only be installed on one side of the copper plate of the copper-clad carrier body, the installation area of ​​a single copper-clad carrier body is doubled, effectively improving the utilization rate of the copper plate.

[0030] 2. After the power chip of the present application is installed on the first copper plate and the second copper plate, the pins of the power chip can be directly welded to the conductive column, so that the power chips on the first copper plate and the second copper plate do not need to be connected through a jumper. Compared with the prior art in which the power chips on different copper plates need to be connected through jumpers, it can carry a larger current and has a stronger overload capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 This is a structural diagram of Example 1 of the present application.

[0032] Figure 2 for Figure 1 Schematic diagram of the cross-sectional structure of AA.

[0033] Figure 3 This is a schematic diagram of the cross-sectional structure of the copper-clad carrier body in Example 1 of the present application.

[0034] Figure 4 This is a flow chart of Example 2 of the present application.

[0035] Figure 5 This is a schematic diagram of the cross-sectional structure of Example 3 of the present application.

[0036] Figure 6 This is a flow chart of Example 4 of the present application.

[0037] Explanation of the figure marks: 1-first copper plate, 11-first AC chip mounting slot, 12-first DC chip mounting slot, 13-first hole section, 2-second copper plate, 21-second AC chip mounting slot, 22-second DC chip mounting slot, 23-second hole section, 3-ceramic substrate, 31-third hole section, 4-conductive column, 41-first crimping joint, 42-second crimping joint, 51-first AC power chip, 52-first DC power chip, 61-second AC power chip, 62-second DC power chip. DETAILED DESCRIPTION

[0038] The present invention will be further described in detail below in conjunction with embodiments and drawings, but the embodiments of the present invention are not limited thereto.

[0039] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "longitudinal", "lateral", "horizontal", "inside", "outside", "front", "back", "top", "bottom" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, or are the directions or positional relationships in which the inventive product is usually placed when used. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0040] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "disposed", "opened", "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0041] The present invention will be described in detail below with reference to the accompanying drawings and in combination with embodiments.

[0042] Embodiment 1:

[0043] like Figures 1 to 3 As shown, this embodiment provides a ceramic copper-clad carrier board on which chips can be mounted on both sides, including a copper-clad carrier board body, wherein the copper-clad carrier board body includes a ceramic substrate 3 and two first copper plates 1 and a second copper plate 2 respectively fixed on both sides of the ceramic substrate 3, and also includes at least one conductive column 4 arranged to pass through the first copper plate 1, the ceramic substrate 3 and the second copper plate 2, and the two ends of the conductive column 4 are conductively connected to the first copper plate 1 and the second copper plate 2 respectively.

[0044] In this embodiment, a conductive column 4 is provided that penetrates the ceramic substrate 3, and both ends of the conductive column 4 are conductively connected to the first copper plate 1 and the second copper plate 2 respectively, so that the first copper plate 1 and the second copper plate 2 of the copper-clad carrier body form a whole that can be conductive to each other through the conductive column 4, so that power chips can be installed on both the first copper plate 1 and the second copper plate 2 of the copper-clad carrier body. Compared with the prior art that only one copper plate of the copper-clad carrier body can be used to install a power chip, the installation area of ​​a single copper-clad carrier body is doubled, which effectively improves the utilization rate of the copper plate.

[0045] In this embodiment, the diameter of the copper pillar is at least 160 microns, and the number of the copper pillar is one. In some embodiments, the number of the copper pillars may be two, three, four or other numbers, which will not be described in detail here.

[0046] Specifically, in the present embodiment, the copper-clad substrate body is further provided with a through hole that penetrates the first copper plate 1, the ceramic substrate 3 and the second copper plate 2, and the conductive column 4 is located in the through hole. In the present embodiment, the conductive column 4 is interference fit with the through hole to ensure the stability of the conductive connection between the two ends of the conductive column 4 and the first copper plate 1 and the second copper plate 2. The technicians can also directly weld the two ends of the conductive column 4 to the first copper plate 1 and the second copper plate 2 respectively to ensure the stability of the conductive connection between the conductive column 4 and the first copper plate 1 and the second copper plate 2.

[0047] Specifically, in this embodiment, the first copper plate 1 is provided with a first AC chip mounting slot 11 and a first DC chip mounting slot 12;

[0048] The second copper plate 2 is provided with a second AC chip mounting slot 21 and a second DC chip mounting slot 22;

[0049] The through hole includes a first hole segment 13 located in the first copper plate 1, a second hole segment 23 located in the second copper plate 2, and a third hole segment 31 located in the ceramic substrate 3;

[0050] The first hole section 13 is located between the first AC chip mounting groove 11 and the first DC chip mounting groove 12;

[0051] The second hole section 23 is located between the second AC chip mounting groove 21 and the second DC chip mounting groove 22 .

[0052] In this embodiment, the first AC chip mounting groove 11 and the first DC chip mounting groove 12 on the first copper plate 1 can be used to install the first AC power chip 51 and the first DC power chip 52; the second AC chip mounting groove 21 and the second DC chip mounting groove 22 on the second copper plate 2 can be used to install the second AC power chip 61 and the second DC power chip 62; and in this embodiment, since the first hole section 13 is located between the first AC chip mounting groove 11 and the first DC chip mounting groove 12, and the second hole section 23 is located between the second AC chip mounting groove 21 and the second DC chip mounting groove 22, the pins of the first AC power chip 51 and the first DC power chip 52 can be directly welded to the portion of the conductive column 4 close to or located in the first hole section 13, and at the same time, the pins of the second AC power chip 61 and the second DC power chip 62 can be directly welded to the portion of the conductive column 4 close to or located in the second hole section 23.

[0053] Specifically, in this embodiment, if Figure 2 As shown, the through hole and the conductive column 4 are arranged perpendicular to the copper-clad substrate body, which facilitates the processing of the through hole and the installation of the conductive column 4. The technicians can set it to other angles as needed.

[0054] In this embodiment, the cross-sections of the conductive pillars 4 and the through holes are both circular. The technicians can design the through holes and the conductive pillars 4 to be rectangular, elliptical, hexagonal, octagonal, triangular or other shapes as needed, which will not be described in detail here.

[0055] Specifically, in this embodiment, if Figure 2 As shown, the two ends of the conductive column 4 are respectively provided with a first crimping joint 41 and a second crimping joint 42;

[0056] The first crimping joint 41 and the second crimping joint 42 are crimped onto the first copper plate 1 and the second copper plate 2, respectively. In this embodiment, the first crimping joint 41 is threadedly connected to the conductive column 4, and the second crimping joint 42 is integrally connected to the conductive column 4. The first crimping joint 41 and the second crimping joint 42 are threadedly connected and integrally connected to the conductive column 4, respectively, which can facilitate the installation of the conductive column 4 into the through hole. The technicians can also set the first crimping joint 41 and the second crimping joint 42, the conductive column 4, and the first copper plate 1 and the second copper plate 2 to be integrally connected as needed.

[0057] Specifically, in this embodiment, the conductive column 4, the first crimping joint 41 and the second crimping joint 42 are all made of copper material. The conductive column 4, the first crimping joint 41 and the second crimping joint 42 made of copper material are made of the same material as the first copper plate 1 and the second copper plate 2, which can ensure the consistency of the main structure of the entire copper-clad carrier board.

[0058] Embodiment 2:

[0059] like Figure 4 As shown, this embodiment provides a method for manufacturing a ceramic copper-clad carrier board capable of mounting chips on both sides, which is used to manufacture a ceramic copper-clad carrier board capable of mounting chips on both sides as described in the above embodiment 1, comprising the following steps:

[0060] S1, opening a through hole penetrating the first copper plate 1, the ceramic substrate 3 and the second copper plate 2 on the copper-clad carrier body;

[0061] S2, obtaining a conductive pillar 4 that is interference-fitted with the through hole and pressing it into the through hole.

[0062] In this embodiment, through the above steps S1 and S2, the first copper plate 1 and the second copper plate 2 of the copper-clad carrier body can be conductively connected through the conductive column 4.

[0063] In step S1 of the present embodiment, when a through hole is opened on the copper-clad substrate body, a water-conducting laser is used to open the hole to ensure the verticality of the side wall of the through hole and avoid the side wall of the through hole being tilted, resulting in a gap between the conductive column 4 and the side wall of the through hole after the conductive column 4 is pressed into the through hole, thereby affecting the stability of the conductive connection.

[0064] The technicians may also use other processes such as drilling to open through holes on the copper-clad substrate body as needed, which will not be described in detail here.

[0065] Specifically, in this embodiment, the two ends of the conductive column 4 are respectively provided with a first crimping joint 41 and a second crimping joint 42;

[0066] The method further includes step S3, in which the first crimping joint 41 and the second crimping joint 42 at both ends of the conductive column 4 are respectively pressed onto the first copper plate 1 and the second copper plate 2, which can further improve the stability of the conductive connection between the conductive column 4 and the first copper plate 1 and the second copper plate 2.

[0067] In this embodiment, the first crimping joint 41 and the second crimping joint 42 are arranged at the end of the conductive column 4 in a threaded connection manner, and the second crimping joint 42 is arranged at the other end of the conductive column 4 by welding. By screwing the first crimping joint 41 or the second crimping joint 42, the first crimping joint 41 and the second crimping joint 42 can be respectively pressed onto the first copper plate 1 and the second copper plate 2, thereby further improving the conductive stability between the conductive column 4 and the first copper plate 1 and the second copper plate 2.

[0068] In this embodiment, the conductive pillar 4 , the first crimping joint 41 , and the second crimping joint 42 are all made of copper material.

[0069] Embodiment 3:

[0070] On the basis of the above-mentioned embodiment 1, Figure 5As shown, this embodiment provides a power supply board, including a ceramic copper-clad carrier board capable of mounting chips on both sides as described in Embodiment 1, and a first AC power chip 51 and a first DC power chip 52 mounted on a first copper board 1, and a second AC power chip 61 and a second DC power chip 62 mounted on a second copper board 2;

[0071] The two ends of the conductive column 4 are respectively an A end conductively connected to the first copper plate 1 and a B end conductively connected to the second copper plate 2;

[0072] The pins of the first AC power chip 51 and the first DC power chip 52 are welded to the A end of the conductive column 4 , and the pins of the second AC power chip 61 and the second DC power chip 62 are welded to the B end of the conductive column 4 .

[0073] In this embodiment, the pins of the first AC power chip 51 and the first DC power chip 52, as well as the second AC power chip 61 and the second DC power chip 62 are all welded to the ends of the conductive column 4, so that the power chips on the first copper plate 1 and the second copper plate 2 do not need to be connected through a jumper wire. Compared with the prior art in which the power chips on different copper plates need to be connected through a jumper wire, it can carry a larger current and has a stronger overload capacity.

[0074] The first AC power chip 51 and the first DC power chip 52 , as well as the second AC power chip 61 and the second DC power chip 62 in this embodiment are all existing devices and will not be described in detail herein.

[0075] In this embodiment, the first AC power chip 51 and the first DC power chip 52 are respectively welded in the first AC chip mounting groove 11 and the first DC chip mounting groove 12 of the first copper plate 1, and the second AC power chip 61 and the second DC power chip 62 are respectively welded in the second AC chip mounting groove 21 and the second DC chip mounting groove 22 of the first copper plate 1.

[0076] The rest of the structure of this embodiment is the same as that of the above-mentioned embodiment 1 and will not be described again here.

[0077] Embodiment 4:

[0078] Based on the above embodiment 2, Figure 6 As shown, this embodiment provides a method for manufacturing a power supply board, and manufactures a power supply board described in the above embodiment 3, and the manufacturing method includes the following steps:

[0079] Sa. Solder the pins of the first AC power chip 51 and the first DC power chip 52 to the A end of the conductive column 4 ; solder the pins of the second AC power chip 61 and the second DC power chip 62 to the B end of the conductive column 4 .

[0080] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A ceramic copper-clad carrier board capable of mounting a power module on both sides, comprising a copper-clad carrier board body, wherein the copper-clad carrier board body comprises a ceramic substrate (3) and two first copper plates (1) and a second copper plate (2) respectively fixed on two sides of the ceramic substrate (3), characterized in that: It also comprises at least one conductive column (4) which passes through the ceramic substrate (3), and two ends of the conductive column (4) are respectively conductively connected to the first copper plate (1) and the second copper plate (2); The first copper plate (1) is provided with a first AC chip mounting groove (11) and a first DC chip mounting groove (12); The second copper plate (2) is provided with a second AC chip mounting groove (21) and a second DC chip mounting groove (22); The two ends of the conductive column (4) are respectively provided with a first crimping joint (41) and a second crimping joint (42) for directly mounting power chip pins; The first crimping joint (41) and the second crimping joint (42) are crimped onto the first copper plate (1) and the second copper plate (2), respectively; The first crimping joint (41) and the second crimping joint (42) protrude upward from the first copper plate (1) and the second copper plate (2) respectively.

2. A ceramic copper-clad substrate capable of mounting a power module on both sides according to claim 1, characterized in that: The copper-clad carrier body is also provided with a through hole penetrating the first copper plate (1), the ceramic substrate (3) and the second copper plate (2), and the conductive column (4) is located in the through hole.

3. A ceramic copper-clad substrate capable of mounting a power module on both sides according to claim 2, characterized in that: The through hole comprises a first hole segment (13) located in the first copper plate (1), a second hole segment (23) located in the second copper plate (2), and a third hole segment (31) located in the ceramic substrate (3); The first hole section (13) is located between the first AC chip mounting groove (11) and the first DC chip mounting groove (12); The second hole section (23) is located between the second AC chip mounting groove (21) and the second DC chip mounting groove (22).

4. The ceramic copper-clad substrate capable of mounting a power module on both sides according to claim 2, characterized in that: The through hole and the conductive column (4) are arranged perpendicular to the copper-clad carrier body.

5. A ceramic copper-clad substrate capable of double-sided mounting of power modules according to any one of claims 1 to 4, characterized in that: The conductive column (4) is made of copper material.

6. A method for manufacturing a ceramic copper-clad substrate capable of mounting a power module on both sides, for manufacturing a ceramic copper-clad substrate capable of mounting a power module on both sides as claimed in any one of claims 1 to 5, characterized in that: The following steps are involved: S1. A through hole is provided on the copper-clad carrier body, the through hole penetrating the first copper plate (1), the ceramic substrate (3) and the second copper plate (2); S2, obtaining a conductive column (4) having an interference fit with the through hole and pressing it into the through hole.

7. The method for manufacturing a ceramic copper-clad substrate capable of mounting a power module on both sides according to claim 6, characterized in that: The two ends of the conductive column (4) are respectively provided with a first crimping joint (41) and a second crimping joint (42); The method further comprises step S3 of pressing the first crimping joint (41) and the second crimping joint (42) at both ends of the conductive column (4) onto the first copper plate (1) and the second copper plate (2) respectively.

8. A power supply board, characterized in that: A ceramic copper-clad carrier board capable of double-sided mounting of a power module according to any one of claims 1 to 5, a first AC power chip (51) and a first DC power chip (52) mounted on a first copper board (1), and a second AC power chip (61) and a second DC power chip (62) mounted on a second copper board (2); The two ends of the conductive column (4) are respectively an A end conductively connected to the first copper plate (1) and a B end conductively connected to the second copper plate (2); The pins of the first AC power chip (51) and the first DC power chip (52) are welded to the A end of the conductive column (4), and the pins of the second AC power chip (61) and the second DC power chip (62) are welded to the B end of the conductive column (4).

9. A method for manufacturing a power supply board, used for manufacturing a power supply board as claimed in claim 8, characterized in that: The following steps are involved: Sa. Solder the pins of the first AC power chip (51) and the first DC power chip (52) to the A end of the conductive column (4); and solder the pins of the second AC power chip (61) and the second DC power chip (62) to the B end of the conductive column (4).

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