Computer host heat dissipation system and method

Abstract

The invention discloses a computer host heat dissipation system, which belongs to the field of computer heat dissipation technology, including an air cooling device, which uses a blowing method to dissipate heat from a computer host, and is provided with a liquid cooling device and a cleaning device on the air cooling device, wherein the liquid cooling device cools down the computer host by water cooling, and the cleaning device is used to remove dust and clean the heat sink. The copper pipe provided by the invention transfers most of the heat on the mainboard into the heat sink, and the heat sink is designed with a plurality of bent sheets, which increases the heat dissipation area, and the heat sink is arranged horizontally, and the heat inside the heat sink is blown away by a cold side fan toward the side of the heat sink, and the heat inside the heat sink is sent out of the chassis in conjunction with the outward blowing of the side fan, and the outer fan blows from the inside to the outside to increase the heat flow rate inside the heat sink, and the inner fan blows toward the mainboard, and the cold water in the hanging water tank behind the mainboard is used to assist in cooling down the mainboard, thereby greatly improving the heat dissipation effect of the mainboard and components.

Description

Technical Field

[0001] The present invention relates to the technical field of computer heat dissipation, and in particular to a computer host heat dissipation system and method. Background Art

[0002] Whether it is a home computer or a professional computer host, there are certain requirements for heat dissipation. During the use of the computer, short-term high temperature may occur, which will cause the core components to reduce the frequency, and long-term high temperature will reduce the life of the components, thereby affecting the use effect of the computer. The heat dissipation methods of the computer are mainly divided into overall heat dissipation and component heat dissipation. Overall heat dissipation is the computer air duct setting. At present, the size of the chassis is getting smaller and smaller, and the internal space is getting more and more compact. If the chassis air duct is not improved, the chassis will accumulate heat seriously; and component heat dissipation is to independently dissipate the heat of the core components with large heat generation through air cooling or water cooling. The computer host heat dissipation device in the prior art is mainly carried out by fan built-in ordinary water cooling, or a combination of the two. It is impossible to effectively and specifically cool down important components such as the motherboard and CPU in the chassis, and the heat sink will have a lot of dust after being used for a period of time, which is very troublesome to clean. Summary of the invention

[0003] In view of the above technical problems, the technical solution adopted by the present invention is: a computer host heat dissipation system, including an air cooling device, the air cooling device includes a chassis and a heat sink, a mainboard is fixedly installed in the chassis, the air cooling device uses blowing to dissipate the heat of the computer host, the air cooling device is provided with a liquid cooling device and a cleaning device, the liquid cooling device includes a hook, the hook is fixedly installed on the chassis, the liquid cooling device cools the computer host by water cooling, the cleaning device includes an air pump, the air pump is fixedly installed on the chassis, and the cleaning device is used to remove dust and clean the heat sink.

[0004] Furthermore, the air cooling device includes a cold side fan and a side fan installed on the side of the chassis, a side partition is fixedly installed on the chassis, the side partition is located on the outside of the cold side fan, a bottom fan is arranged under the chassis, the cold side fan, the side fan and the bottom fan are all provided with independent motors for driving, a controller is arranged in the chassis, the cold side fan, the side fan and the bottom fan are electrically connected to the controller, the controller is electrically connected to the mainboard, and the rotation speed of the side fan is greater than the rotation speed of the bottom fan and the cold side fan.

[0005] Furthermore, the chassis is provided with a heat dissipation mechanism, which includes an external connecting frame fixedly mounted on the chassis, an internal connecting frame fixedly mounted on the mainboard via a supporting column, and the supporting column can be replaced to adapt to mainboards of different thicknesses, a plurality of pin corners are provided on the internal connecting frame, heat sinks are fixedly mounted on the pin corners, a heat dissipation frame is fixedly mounted on the internal connecting frame, an internal fan is provided on the external connecting frame, an external fan is provided on the heat dissipation frame, a copper tube is fixedly mounted on the internal connecting frame, independent motors are provided inside the internal fan and the external fan for driving, and the internal fan and the external fan are electrically connected to a controller.

[0006] Furthermore, the copper tube is inserted into a heat sink, and the heat sink is composed of several layers of wavy bent sheets.

[0007] The controller controls the cold side fan and the bottom fan to blow air into the chassis to cool the motherboard, and the side fan blows air out of the chassis to extract heat. The heat generated by the motherboard when working is introduced into the heat sink by the internal connecting frame and the copper tube. A plurality of pin corners are provided on the surface of the internal connecting frame, and gaps are left in the middle. Part of the heat on the pin corners is blown away by the cold side fan and the bottom fan, and part of the heat is transferred to the heat sink. The copper tube is inserted into the inside of the heat sink, and the copper tube transfers most of the heat into the heat sink. The heat sink is designed with multiple bent plates to increase the heat dissipation area. At the same time, the heat sink is arranged horizontally, and the cold side fan blows air toward the side of the heat sink to blow away the heat in the heat sink, and cooperates with the side fan to blow air outward to send the heat of the heat sink out of the chassis, thereby achieving a better heat dissipation effect. The outer fan blows air from the inside to the outside, increasing the heat flow rate inside the heat sink and increasing the heat dissipation effect. At the same time, the inner fan blows air toward the motherboard, and cooperates with the cold water in the hanging water tank behind the motherboard to assist in cooling the motherboard.

[0008] Furthermore, the liquid cooling device includes a side cooling pipe fixedly installed on the chassis, the side cooling pipe is located on the outside of the side partition, four hooks are fixedly installed on the chassis, a hanging water tank is hung on the hooks, the hanging water tank is filled with water, a water inlet plug is provided on the hanging water tank, a brushless water pump is fixedly installed on the chassis, a water inlet pipe is fixedly installed on the side cooling pipe, the hanging water tank is detachably connected to the brushless water pump, a bottom cooling pipe is fixedly installed on the bottom of the chassis, the bottom cooling pipe is connected to the side cooling pipe through a conversion pipe, the conversion pipe is fixedly installed on the chassis, the bottom cooling pipe is detachably connected to the hanging water tank, and the brushless water pump is electrically connected to the controller.

[0009] The brushless water pump draws the water in the hanging water tank into the side cooling pipe through the water inlet pipe, and then the water enters the bottom cooling pipe through the conversion pipe, and finally the water returns to the hanging water tank to form a water circulation loop to cool the chassis, and cooperates with the cold side fan and the bottom fan to blow cold air into the chassis through the side cooling pipe and the bottom cooling pipe to cool it.

[0010] Water can be added to the hanging water tank by unscrewing the water inlet plug. The hanging water tank can be removed. When the hanging water tank needs to be removed, disassemble the bottom cooling pipe from the hanging water tank, discharge the water in the liquid cooling device through the bottom cooling pipe, and then disassemble the hanging water tank from the brushless water pump. The hanging water tank can be removed and installed in the same way.

[0011] Furthermore, the cleaning device includes a battery fixedly installed on the chassis, the battery is connected to the mainboard by a connecting line, the battery is electrically connected to the controller, an electric cylinder is fixedly installed on the chassis, the electric cylinder is connected to the battery by an electric cylinder line, a slide rail is fixedly installed in the chassis, two sliding blocks are slidably installed on the slide rail, the sliding block next to the electric cylinder is fixedly installed on the top of the electric cylinder, a spring is arranged between the other sliding block and the chassis, a rotating slider is slidably installed on the chassis, an active rotating rod is rotatably installed on the sliding block, the active rotating rod is rotatably installed with the rotating slider, two rotating connecting rods are rotatably installed on the rotating slider, two sliders are slidably installed in the chassis, the slider is rotatably installed with the rotating connecting rod, two moving connecting rods are rotatably installed on the slider, a gun rack is rotatably installed on the moving connecting rod, a sliding column is fixedly installed on the gun rack, and the sliding column is slidably installed with the chassis.

[0012] Furthermore, a dust blowing mechanism is provided on the chassis, and the dust blowing mechanism includes an air pump fixedly mounted on the chassis, an air intake pipe fixedly mounted on the air pump, two dust blowing guns fixedly mounted on the air intake pipe, the dust blowing guns are fixedly mounted on the gun rack, the air pump is electrically connected to the controller, and the air pump is electrically connected to the battery.

[0013] Furthermore, when the computer is turned on, the controller controls the cold side fan, side fan, bottom fan, inner fan, outer fan, and brushless water pump to start simultaneously, and the mainboard charges the battery. When the computer is turned off, the air pump and electric cylinder are controlled by the controller, and the electric energy stored in the battery is used to power the air pump, electric cylinder, and controller.

[0014] When the computer is turned on, the battery is charged through the motherboard. When the computer is turned off, the battery provides power to the electric cylinder and the air pump. The controller controls the extension and retraction of the electric cylinder to drive the sliding block to slide along the slide rail, thereby driving the active rotating rod to rotate, thereby driving the rotating slider to slide along the chassis, thereby driving the rotating connecting rod to rotate, thereby driving the slider to slide, thereby driving the moving connecting rod to rotate, thereby driving the gun frame and the sliding column to slide along the chassis, thereby driving the dust blower to move back and forth, and air is ventilated into the dust blower through the air pump and the air intake pipe, and the dust in the heat sink is blown off by the dust blower. After the next startup, the dust is blown out of the chassis through the cold side fan, the bottom fan and the side fan.

[0015] A heat dissipation method for a computer host. When the computer is turned on, the mainboard charges a storage battery, a brushless water pump draws water in a hanging water tank into a side cooling pipe through a water inlet pipe, then the water enters a bottom cooling pipe through a conversion pipe, and then the water returns to the hanging water tank to form a water circulation loop to cool the case, a cold side fan and a bottom fan blow cold air into the case through the side cooling pipe and the bottom cooling pipe to cool the mainboard, the side fan blows air out of the case to extract heat, an internal connecting frame and a copper pipe introduce the heat generated when the mainboard is working into a heat sink, part of the heat on the pin corner is blown away by the cold side fan and the bottom fan, part of the heat is transferred to the heat sink, the copper pipe transfers most of the heat into the heat sink, the cold side fan blows air toward the side of the heat sink to blow away the heat in the heat sink, and cooperates with the side fan to blow air outward to send the heat of the heat sink out of the case, the outer fan blows air from the inside to the outside, the inner fan blows air toward the mainboard, and cooperates with the cold water in the hanging water tank behind the mainboard to assist in cooling the mainboard.

[0016] Compared with the prior art, the present invention has the following advantages: (1) The cold side fan and the bottom fan provided in the present invention blow air inwards, cooperate with the side cooling pipe and the bottom cooling pipe to blow cold air into the chassis, cool the mainboard and the components thereon, and discharge the heat through the side fan, thereby achieving good heat dissipation effect; (2) The internal connecting frame and the bobbin provided in the present invention transfer the heat on the mainboard to the pin corners, part of the heat on the pin corners is blown away by the cold side fan and the bottom fan, and most of the heat is transferred to the heat sink through the copper tube. The heat sink is designed with multiple bent sheets to increase the heat dissipation area. At the same time, the heat sink is arranged horizontally, and the cold side fan blows air toward the side of the heat sink to blow away the heat in the heat sink, and cooperates with the side fan to blow air outwards to discharge the heat from the heat sink. The dust is sent out of the chassis in large quantities, achieving a better heat dissipation effect. The external fan blows air from the inside to the outside, increasing the heat flow rate inside the heat sink and improving the heat dissipation effect. At the same time, the internal fan blows air toward the mainboard, and cooperates with the cold water in the hanging water tank behind the mainboard to assist in cooling the mainboard, greatly improving the heat dissipation effect of the mainboard and components; (3) The cleaning device provided in the present invention is started when the computer is turned off, and the dust inside the heat sink is blown off by the dust blowing gun through the back and forth movement. After the next startup, the dust is blown out of the chassis through the cold side fan, the bottom fan and the side fan. When the computer is turned on, the battery is charged. The heat sink is cleaned every time the computer is shut down, so that dust on the heat sink cannot accumulate and the amount of dust blown off each time is also small. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0018] Figure 2 It is a schematic diagram of the structure of the air cooling device of the present invention.

[0019] Figure 3 The heat dissipation mechanism structure of the present invention is shown in FIG. Figure 1 .

[0020] Figure 4 The heat dissipation mechanism structure of the present invention is shown in FIG. Figure 2 .

[0021] Figure 5 The heat dissipation mechanism structure of the present invention is shown in FIG. Figure 3 .

[0022] Figure 6 The structure of the liquid cooling device of the present invention is shown in FIG. Figure 1 .

[0023] Figure 7 The structure of the liquid cooling device of the present invention is shown in FIG. Figure 2 .

[0024] Figure 8 The cleaning device of the present invention is schematically shown in FIG. Figure 1 .

[0025] Fig. 9 The cleaning device of the present invention is schematically shown in FIG. Figure 2 .

[0026] Fig.10 The cleaning device of the present invention is schematically shown in FIG. Figure 3 .

[0027] Figure numbers: 101-chassis; 102-cold side fan; 103-side fan; 104-bottom fan; 105-side partition; 106-external connecting frame; 107-support column; 108-internal connecting frame; 109-heat sink; 110-internal fan; 111-external fan; 112-heat sink; 113-copper tube; 114-needle angle; 201-hook; 202-hanging water tank; 203-brushless water pump; 204-water inlet pipe; 205-side cooling pipe; 2 06-conversion tube; 207-bottom cooling tube; 208-water inlet plug; 301-air pump; 302-intake pipe; 303-dust blow gun; 304-battery; 305-connecting wire; 306-electric cylinder wire; 307-electric cylinder; 308-slide rail; 309-sliding block; 310-active rotating rod; 311-rotating slider; 312-rotating connecting rod; 313-sliding block; 314-moving connecting rod; 315-gun mount; 316-spring; 317-sliding column; 4-main board. DETAILED DESCRIPTION

[0028] The specific implementation of the present invention will be further described below in conjunction with the accompanying drawings.

[0029] Example: Reference Figure 1-Figure 10A computer host heat dissipation system includes an air cooling device, the air cooling device includes a chassis 101 and a heat sink 112, a mainboard 4 is fixedly installed in the chassis 101, the air cooling device uses blowing to dissipate heat from the computer host, a liquid cooling device and a cleaning device are provided on the air cooling device, the liquid cooling device includes a hook 201, the hook 201 is fixedly installed on the chassis 101, the liquid cooling device cools the computer host by water cooling, the cleaning device includes an air pump 301, the air pump 301 is fixedly installed on the chassis 101, and the cleaning device is used to remove dust and clean the heat sink 112.

[0030] like Figure 2-Figure 5 As shown, the air cooling device includes a cold side fan 102 and a side fan 103 installed on the side of the chassis 101, a side partition 105 is fixedly installed on the chassis 101, and the side partition 105 is located on the outside of the cold side fan 102, and a bottom fan 104 is arranged below the chassis 101, and the cold side fan 102, the side fan 103 and the bottom fan 104 are all provided with independent motors for driving, and a controller is arranged in the chassis 101, and the cold side fan 102, the side fan 103 and the bottom fan 104 are electrically connected to the controller, and the controller is electrically connected to the mainboard 4, and the rotation speed of the side fan 103 is greater than the rotation speed of the bottom fan 104 and the cold side fan 102.

[0031] like Figure 2-Figure 5 As shown, the chassis 101 is provided with a heat dissipation mechanism, which includes an external connecting frame 106 fixedly mounted on the chassis 101, an internal connecting frame 108 fixedly mounted on the mainboard 4 through a supporting column 107, and the supporting column 107 can be replaced to adapt to mainboards 4 of different thicknesses, a plurality of pin corners 114 are provided on the internal connecting frame 108, heat sinks 112 are fixedly mounted on the pin corners 114, a heat dissipation frame 109 is fixedly mounted on the internal connecting frame 108, an internal fan 110 is provided on the external connecting frame 106, an external fan 111 is provided on the heat dissipation frame 109, a copper tube 113 is fixedly mounted on the internal connecting frame 108, and independent motors are provided inside the internal fan 110 and the external fan 111 for driving, and the internal fan 110 and the external fan 111 are electrically connected to the controller.

[0032] like Figure 2-Figure 5 As shown, the copper tube 113 is inserted into the heat sink 112, and the heat sink 112 is composed of several layers of wavy bent sheets.

[0033] The controller controls the cold side fan 102 and the bottom fan 104 to blow air into the chassis 101 to cool the mainboard 4. The side fan 103 blows air out of the chassis 101 to extract heat. The heat generated by the mainboard 4 during operation is introduced into the heat sink 112 by the internal connecting frame 108 and the copper tube 113. A plurality of pin corners 114 are provided on the surface of the internal connecting frame 108, with gaps in the middle. Part of the heat on the pin corners 114 is blown away by the cold side fan 102 and the bottom fan 104, and part of the heat is transferred to the heat sink 112. The copper tube 113 is inserted into the heat sink 112, and the copper tube 113 transfers most of the heat to the heat sink 1 12, the heat sink 112 is designed with multiple bent sheets to increase the heat dissipation area. At the same time, the heat sink 112 is arranged horizontally. The cold side fan 102 blows air towards the side of the heat sink 112 to blow away the heat in the heat sink 112, and cooperates with the side fan 103 to blow air outward to send the heat of the heat sink 112 out of the chassis 101, thereby achieving a better heat dissipation effect. The external fan 111 blows air from the inside to the outside to increase the heat flow rate inside the heat sink 112 and increase the heat dissipation effect. At the same time, the internal fan 110 blows air toward the mainboard 4, and cooperates with the cold water in the hanging water tank 202 behind the mainboard 4 to assist in cooling the mainboard 4.

[0034] like Figure 6 , Figure 7 As shown, the liquid cooling device includes a side cooling pipe 205 fixedly mounted on the chassis 101, the side cooling pipe 205 is located outside the side partition 105, four hooks 201 are fixedly mounted on the chassis 101, a hanging water tank 202 is hung on the hooks 201, the hanging water tank 202 is filled with water, a water inlet plug 208 is provided on the hanging water tank 202, a brushless water pump 203 is fixedly mounted on the chassis 101, a water inlet pipe 204 is fixedly mounted on the side cooling pipe 205, the hanging water tank 202 is detachably connected to the brushless water pump 203, a bottom cooling pipe 207 is fixedly mounted on the bottom of the chassis 101, the bottom cooling pipe 207 is connected to the side cooling pipe 205 through a conversion pipe 206, the conversion pipe 206 is fixedly mounted on the chassis 101, the bottom cooling pipe 207 is detachably connected to the hanging water tank 202, and the brushless water pump 203 is electrically connected to the controller.

[0035] The brushless water pump 203 draws the water in the hanging water tank 202 into the side cooling pipe 205 through the water inlet pipe 204, and then the water enters the bottom cooling pipe 207 through the conversion pipe 206, and finally the water returns to the hanging water tank 202 to form a water circulation loop to cool the chassis 101, and cooperates with the cold side fan 102 and the bottom fan 104 to blow cold air into the chassis 101 through the side cooling pipe 205 and the bottom cooling pipe 207 to cool it.

[0036] Water can be added to the hanging water tank 202 by unscrewing the water inlet plug 208. The hanging water tank 202 can be removed. When the hanging water tank 202 needs to be removed, the bottom cooling pipe 207 is disassembled from the hanging water tank 202, and the water in the liquid cooling device is discharged through the bottom cooling pipe 207. Then the hanging water tank 202 is disassembled from the brushless water pump 203. The hanging water tank 202 can be removed and installed in the same way.

[0037] like Figure 8-Figure 10 As shown, the cleaning device includes a battery 304 fixedly mounted on the chassis 101, the battery 304 is connected to the mainboard 4 through a connecting line 305, the battery 304 is electrically connected to the controller, an electric cylinder 307 is fixedly mounted on the chassis 101, the electric cylinder 307 is connected to the battery 304 through an electric cylinder line 306, a slide rail 308 is fixedly mounted in the chassis 101, two sliding blocks 309 are slidably mounted on the slide rail 308, the sliding block 309 next to the electric cylinder 307 is fixedly mounted on the top of the electric cylinder 307, and a spring 316 is arranged between the other sliding block 309 and the chassis 101 A rotating slider 311 is slidably installed on the chassis 101, an active rotating rod 310 is rotatably installed on the sliding block 309, the active rotating rod 310 is rotatably installed with the rotating slider 311, two rotating connecting rods 312 are rotatably installed on the rotating slider 311, two sliders 313 are slidably installed in the chassis 101, the slider 313 is rotatably installed with the rotating connecting rod 312, two moving connecting rods 314 are rotatably installed on the slider 313, a gun rack 315 is rotatably installed on the moving connecting rod 314, a sliding column 317 is fixedly installed on the gun rack 315, and the sliding column 317 is slidably installed with the chassis 101.

[0038] like Figure 8-Figure 10 As shown, a dust blowing mechanism is provided on the chassis 101, and the dust blowing mechanism includes an air pump 301 fixedly mounted on the chassis 101, an air intake pipe 302 fixedly mounted on the air pump 301, two dust blowing guns 303 fixedly mounted on the air intake pipe 302, the dust blowing guns 303 are fixedly mounted on the gun holder 315, the air pump 301 is electrically connected to the controller, and the air pump 301 is electrically connected to the battery 304.

[0039] like Figure 8-Figure 10 As shown, when the computer is turned on, the controller controls the cold side fan 102, the side fan 103, the bottom fan 104, the inner fan 110, the outer fan 111, and the brushless water pump 203 to start simultaneously, and the mainboard 4 charges the battery 304. When the computer is turned off, the air pump 301 and the electric cylinder 307 are controlled by the controller, and the electric energy stored in the battery 304 is used to power the air pump 301, the electric cylinder 307 and the controller.

[0040] When the computer is turned on, the battery 304 is charged through the motherboard 4. When the computer is turned off, the battery 304 provides power to the electric cylinder 307 and the air pump 301. The controller controls the electric cylinder 307 to extend and retract to drive the sliding block 309 to slide along the sliding rail 308, thereby driving the active rotating rod 310 to rotate, thereby driving the rotating slider 311 to slide along the chassis 101, thereby driving the rotating connecting rod 312 to rotate, thereby driving the slider 313 to slide, thereby driving the moving connecting rod 314 to rotate, thereby driving the gun holder 315 and the sliding column 317 to slide along the chassis 101, thereby driving the dust gun 303 to move back and forth, and air is ventilated into the dust gun 303 through the air pump 301 and the air inlet pipe 302, and the dust in the heat sink 112 is blown down by the dust gun 303. After the computer is turned on next time, the dust is blown out of the chassis 101 through the cold side fan 102, the bottom fan 104 and the side fan 103.

[0041] like Figure 1-Figure 10 As shown, a heat dissipation method for a computer host is shown. When the computer is turned on, the motherboard 4 charges the battery 304, the brushless water pump 203 draws water in the hanging water tank 202 into the side cooling pipe 205 through the water inlet pipe 204, and then the water enters the bottom cooling pipe 207 through the conversion pipe 206, and then the water returns to the hanging water tank 202 to form a water circulation loop to cool the chassis 101, the cold side fan 102 and the bottom fan 104 blow cold air into the chassis 101 through the side cooling pipe 205 and the bottom cooling pipe 207 to cool the motherboard 4, and the side fan 103 blows air outside the chassis 101 to extract heat, and the internal connecting frame 108 and the copper pipe 1 13 introduces the heat generated by the mainboard 4 when it is working into the heat sink 112, part of the heat on the pin corner 114 is blown away by the cold side fan 102 and the bottom fan 104, and part of the heat is transferred to the heat sink 112, and the copper tube 113 transfers most of the heat into the heat sink 112, and the cold side fan 102 blows toward the side of the heat sink 112 to blow away the heat in the heat sink 112, and cooperates with the side fan 103 to blow outward to send the heat of the heat sink 112 out of the chassis 101, the external fan 111 blows from the inside to the outside, and the internal fan 110 blows toward the mainboard 4, and cooperates with the cold water in the hanging water tank 202 behind the mainboard 4 to assist in cooling the mainboard 4.

[0042] The working principle of the computer host cooling system disclosed in the present invention is as follows: when the computer is running, the battery 304 is charged through the mainboard 4, and the controller controls the cold side fan 102, the side fan 103, the bottom fan 104, the inner fan 110, the outer fan 111, and the hook 201 to start at the same time. At this time, the air pump 301 and the electric cylinder 307 do not work, and the brushless water pump 203 pumps the water in the hanging water tank 202 into the side cooling pipe 205 through the water inlet pipe 204, and then the water The water enters the bottom cooling pipe 207 through the conversion pipe 206, and then returns to the hanging water tank 202 to form a water circulation loop to cool the chassis 101. The cold side fan 102 and the bottom fan 104 blow cold air into the chassis 101 through the side cooling pipe 205 and the bottom cooling pipe 207 to cool the mainboard 4. The side fan 103 blows air out of the chassis 101 to extract the heat. The heat generated by the mainboard 4 when working is introduced into the chassis 101 by the internal connecting frame 108 and the copper tube 113. The inner connecting frame 108 is provided with a plurality of pin corners 114 on the surface, with a hole in the middle. Part of the heat on the pin corners 114 is blown away by the cold side fan 102 and the bottom fan 104, and part of the heat is transferred to the heat sink 112. The copper tube 113 is inserted into the heat sink 112, and the copper tube 113 transfers most of the heat to the heat sink 112. The heat sink 112 is designed with a plurality of bent pieces to increase the heat dissipation area. At the same time, the heat sink 112 is arranged horizontally, and the heat is transferred to the heat sink 112 by the cold side fan 102 and the bottom fan 104. The side fan 102 blows air toward the side of the heat sink 112 to blow away the heat in the heat sink 112, and cooperates with the side fan 103 to blow air outward to send the heat of the heat sink 112 out of the chassis 101, thereby achieving a better heat dissipation effect. The external fan 111 blows air from the inside to the outside to increase the internal flow rate of the heat sink 112 and increase the heat dissipation effect. At the same time, the internal fan 110 blows air toward the mainboard 4, and cooperates with the cold water in the hanging water tank 202 behind the mainboard 4 to assist in cooling the mainboard 4.

[0043] When the computer is turned off, the battery 304 provides power to the electric cylinder 307 and the air pump 301. The controller controls the electric cylinder 307 to extend and retract, driving the sliding block 309 to slide along the sliding rail 308, thereby driving the active rotating rod 310 to rotate, thereby driving the rotating slider 311 to slide along the chassis 101, thereby driving the rotating connecting rod 312 to rotate, thereby driving the slider 313 to slide, thereby driving the moving connecting rod 314 to rotate, thereby driving the gun holder 315 and the sliding column 317 to slide along the chassis 101, thereby driving the dust blowing gun 303 to move back and forth. At the same time, the controller controls the air pump 301 to start, and air is ventilated into the dust blowing gun 303 through the air pump 301 and the air inlet pipe 302, and the dust in the heat sink 112 is blown down through the dust blowing gun 303. After the computer is turned on next time, the dust is blown out of the chassis 101 through the cold side fan 102, the bottom fan 104 and the side fan 103.

[0044] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A computer host heat dissipation system, comprising an air cooling device, characterized in that: The air cooling device comprises a chassis (101) and a heat sink (112), a mainboard (4) being fixedly mounted in the chassis (101), the air cooling device dissipating heat from a computer host by means of blowing air, a liquid cooling device and a cleaning device being arranged on the air cooling device, the liquid cooling device comprising a hook (201), the hook (201) being fixedly mounted on the chassis (101), the liquid cooling device cooling the computer host by means of water cooling, the cleaning device comprising an air pump (301), the air pump (301) being fixedly mounted on the chassis (101), and the cleaning device being used to remove dust from the heat sink (112); The chassis (101) is provided with a heat dissipation mechanism, the heat dissipation mechanism comprising an external connecting frame (106) fixedly mounted on the chassis (101); an internal connecting frame (108) fixedly mounted on the mainboard (4) via a support column (107); the mainboard (4) having different thicknesses can be adapted by replacing the support column (107); a plurality of pin corners (114) are provided on the internal connecting frame (108); a heat sink (112) is fixedly mounted on the pin corners (114); a heat sink (109) is fixedly mounted on the internal connecting frame (108); an internal fan (110) is provided on the external connecting frame (106); an external fan (111) is provided on the heat sink (109); a copper tube (113) is fixedly mounted on the internal connecting frame (108); independent motors are provided inside the internal fan (110) and the external fan (111) for driving; the internal fan (110) and the external fan (111) are electrically connected to a controller; The cleaning device comprises a battery (304) fixedly mounted on a chassis (101), the battery (304) being connected to a mainboard (4) via a connecting line (305), the battery (304) being electrically connected to a controller, an electric cylinder (307) being fixedly mounted on the chassis (101), the electric cylinder (307) being connected to the battery (304) via an electric cylinder line (306), a slide rail (308) being fixedly mounted inside the chassis (101), two sliding blocks (309) being slidably mounted on the slide rail (308), the sliding block (309) next to the electric cylinder (307) being fixedly mounted to the top of the electric cylinder (307), and a spring (316) being arranged between the other sliding block (309) and the chassis (101). ), a rotating slider (311) is slidably mounted on the chassis (101), an active rotating rod (310) is rotatably mounted on the sliding block (309), the active rotating rod (310) is rotatably mounted with the rotating slider (311), two rotating connecting rods (312) are rotatably mounted on the rotating slider (311), two sliders (313) are slidably mounted in the chassis (101), the sliders (313) are rotatably mounted with the rotating connecting rods (312), two moving connecting rods (314) are rotatably mounted on the slider (313), a gun rack (315) is rotatably mounted on the moving connecting rod (314), a sliding column (317) is fixedly mounted on the gun rack (315), and the sliding column (317) is slidably mounted with the chassis (101); The chassis (101) is provided with a dust blowing mechanism, the dust blowing mechanism comprising an air pump (301) fixedly mounted on the chassis (101), an air intake pipe (302) fixedly mounted on the air pump (301), two dust blowing guns (303) fixedly mounted on the air intake pipe (302), the dust blowing guns (303) fixedly mounted on a gun rack (315), the air pump (301) electrically connected to a controller, and the air pump (301) electrically connected to a storage battery (304); When the computer is turned on, the motherboard (4) charges the battery (304), the brushless water pump (203) draws water in the hanging water tank (202) into the side cooling pipe (205) through the water inlet pipe (204), and then the water enters the bottom cooling pipe (207) through the conversion pipe (206), and then the water returns to the hanging water tank (202) to form a water circulation loop to cool the chassis (101), the cold side fan (102) and the bottom fan (104) blow cold air into the chassis (101) through the side cooling pipe (205) and the bottom cooling pipe (207) to cool the motherboard (4), the side fan (103) blows air outside the chassis (101) to extract heat, and the internal connecting frame (108) and the copper pipe (113) blow the motherboard (4 ) when working, the heat generated is introduced into the heat sink (112), part of the heat on the pin corner (114) is blown away by the cold side fan (102) and the bottom fan (104), and part of the heat is transferred to the heat sink (112). The copper tube (113) transfers most of the heat into the heat sink (112), the cold side fan (102) blows air toward the side of the heat sink (112) to blow away the heat in the heat sink (112), and cooperates with the side fan (103) to blow air outward to send the heat of the heat sink (112) out of the chassis (101), the outer fan (111) blows air from the inside to the outside, and the inner fan (110) blows air toward the mainboard (4), and cooperates with the cold water in the hanging water tank (202) behind the mainboard (4) to assist in cooling the mainboard (4); When the computer is turned off, the battery (304) provides power to the electric cylinder (307) and the air pump (301), and the controller controls the electric cylinder (307) to extend and retract to drive the sliding block (309) to slide along the slide rail (308), thereby driving the active rotating rod (310) to rotate, thereby driving the rotating slide block (311) to slide along the chassis (101), thereby driving the rotating connecting rod (312) to rotate, thereby driving the slide block (313) to slide, thereby driving the moving connecting rod (314) to rotate, thereby driving the gun The frame (315) and the slide column (317) slide along the chassis (101), thereby driving the dust blowing gun (303) to move back and forth. At the same time, the controller controls the air pump (301) to start, and air is ventilated into the dust blowing gun (303) through the air pump (301) and the air inlet pipe (302). The dust in the heat sink (112) is blown down through the dust blowing gun (303). After the machine is turned on next time, the dust is blown out of the chassis (101) through the cold side fan (102), the bottom fan (104) and the side fan (103).

2. A computer host cooling system according to claim 1, characterized in that: The air cooling device comprises a cold side fan (102) and a side fan (103) which are arranged and installed on the side of a chassis (101); a side partition (105) is fixedly installed on the chassis (101); the side partition (105) is located outside the cold side fan (102); a bottom fan (104) is arranged below the chassis (101); the cold side fan (102), the side fan (103) and the bottom fan (104) are all provided with independent motors for driving; a controller is arranged in the chassis (101); the cold side fan (102), the side fan (103) and the bottom fan (104) are electrically connected to the controller; the controller is electrically connected to a mainboard (4); the rotation speed of the side fan (103) is greater than the rotation speeds of the bottom fan (104) and the cold side fan (102).

3. A computer host cooling system according to claim 2, characterized in that: The copper tube (113) is inserted into the heat sink (112), and the heat sink (112) is composed of a plurality of layers of wavy bent sheets.

4. A computer host cooling system according to claim 2, characterized in that: The liquid cooling device comprises a side cooling pipe (205) fixedly mounted on the chassis (101), the side cooling pipe (205) being located outside the side partition (105), four hooks (201) fixedly mounted on the chassis (101), a hanging water tank (202) being hung on the hooks (201), the hanging water tank (202) being filled with water, a water inlet plug (208) being provided on the hanging water tank (202), a brushless water pump (203) being fixedly mounted on the chassis (101), the side cooling pipe (205) being located outside the side partition (105), four hooks (201) being fixedly mounted on the chassis (101), a hanging water tank (202) being hung on the hooks (201), the hanging water tank (202) being filled with water, a water inlet plug (208) being provided on the hanging water tank (202), 05), a water inlet pipe (204) is fixedly installed on the hanging water tank (202) and the brushless water pump (203) are detachably connected, a bottom cooling pipe (207) is fixedly installed on the bottom of the chassis (101), the bottom cooling pipe (207) and the side cooling pipe (205) are connected via a conversion pipe (206), the conversion pipe (206) and the chassis (101) are fixedly installed, the bottom cooling pipe (207) and the hanging water tank (202) are detachably connected, and the brushless water pump (203) is electrically connected to the controller.

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