Semiconductor process device

Abstract

The present invention provides a semiconductor process device, in which a liquid spraying pipe is pin-connected to a first ball joint structure and a second ball joint structure respectively, so that the position of the liquid outlet of the liquid spraying pipe can be adjusted; the moving shaft is fixed under a fixed frame; the rotating stator part and the rotating movable part of the rotating driving structure can be rotatably connected, and the moving shaft is fixedly connected to the rotating movable part; the lifting stator part and the lifting movable part of the lifting driving structure can be lifted and slidably connected, and the rotating stator part and the lifting movable part are fixedly connected. The ball joint structure in the present invention allows the position of the liquid spraying pipe to be fixed after manual adjustment, and the usage scenario is flexible, the liquid spraying accuracy is improved, and the replacement cost is reduced; at the same time, the lifting screw controls the height of the ball joint to adjust the liquid spraying pipe, and the adjustment accuracy of the position of the liquid spraying pipe is improved; in addition, the deformable connecting pipe allows the liquid spraying pipe to be retractable, and the degree of freedom of adjusting the position of the liquid spraying pipe is improved; finally, the lifting driving structure and the rotating driving structure expand the adjustment range of the position of the liquid spraying pipe, and the flexibility of use is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor integrated circuit manufacturing, and in particular relates to a semiconductor process device. Background Art

[0002] For the semiconductor industry, wafer cleaning is a very important process, and the liquid supply swing arm that supplies liquid during the wafer cleaning process is a crucial component. During the liquid supply cleaning process, the liquid supply swing arm's liquid spray pipe must ensure both the distance and angle from the wafer and the overall stability during liquid supply.

[0003] However, the position and size of the liquid spray pipe of the traditional liquid supply swing arm are fixed after production, and the height and angle of the liquid outlet of the liquid spray pipe cannot be flexibly adjusted. The liquid spray pipe can only be guaranteed to be in the posture required by the wafer to be cleaned by improving the processing accuracy. This results in the need to equip liquid supply swing arms with different structures to meet the different requirements of the corresponding liquid outlet height and angle when corresponding to wafers of different sizes or wafers that need to be cleaned at different positions, resulting in the need to equip a new liquid supply swing arm for each different liquid outlet position requirement, resulting in poor flexibility in the use of the liquid supply swing arm and high application cost; at the same time, after the liquid supply swing arm has been running for a long time, the position of the liquid outlet will have a certain offset, and the liquid supply swing arm cannot flexibly adjust the position of the liquid spray pipe, and cannot correct the offset angle of the liquid outlet in time. Manual adjustment of the liquid spray pipe cannot ensure that the liquid spray pipe can maintain the adjusted position after being adjusted. Only replacing a new liquid supply swing arm to ensure the position accuracy of the liquid outlet leads to a further increase in the replacement cost of the liquid supply swing arm.

[0004] Therefore, there is an urgent need for a structure or method that can flexibly adjust the position of the liquid spray pipe of the swing arm of the wafer cleaning machine, improve the position accuracy of the liquid spray pipe, and reduce the adjustment cost of the liquid spray pipe.

[0005] It should be noted that the above introduction to the technical background is only for the convenience of providing a clear and complete description of the technical solutions of the present application and for the convenience of understanding by those skilled in the art. It cannot be considered that the above technical solutions are well known to those skilled in the art simply because these solutions are described in the background technology part of the present application. Summary of the invention

[0006] In view of the above shortcomings of the prior art, an object of the present invention is to provide a semiconductor process device for solving the problems of inflexible position adjustment of the liquid spray pipe of the swing arm of the wafer cleaning machine and high replacement cost in the prior art.

[0007] To achieve the above-mentioned object, the present invention provides a semiconductor process device, which comprises: a motion axis, a lifting drive structure, a rotation drive structure and a liquid spray pipe adjustment assembly;

[0008] The liquid spray pipe adjustment assembly includes a fixed frame, a first ball joint structure, a second ball joint structure and a liquid spray pipe; the first ball joint structure is located at an end of the fixed frame away from the liquid outlet of the liquid spray pipe, and the second ball joint structure is located at an end of the fixed frame close to the liquid outlet of the liquid spray pipe; the liquid spray pipe is pin-connected with the first ball joint structure and the second ball joint structure respectively, so that the liquid spray pipe can adjust the position of the liquid outlet by partially rolling in the first ball joint structure and the second ball joint structure; the first ball joint structure includes a first fixing structure, and the second ball joint structure includes a second fixing structure, and the first fixing structure and the second fixing structure can control the liquid spray pipe to be unable to move with the first ball joint structure and the second ball joint structure;

[0009] The moving shaft is fixed under the fixed frame; the rotating driving structure includes a rotating stator part and a rotating movable part, the rotating stator part is rotatably connected to the rotating movable part, and the moving shaft is fixedly connected to the rotating movable part; the lifting and lowering driving structure includes a lifting and lowering stator part and a lifting and lowering movable part, the lifting and lowering stator part is slidably connected to the lifting and lowering movable part, and the rotating stator part is fixedly connected to the lifting and lowering movable part.

[0010] Optionally, the fixed frame includes a pipeline activity cavity, a first axial hole and a second axial hole, the pipeline activity cavity communicates with the first axial hole and the second axial hole; the liquid spraying pipe passes through the pipeline activity cavity and is pin-connected in the first axial hole and the second axial hole, and one end of the liquid outlet of the liquid spraying pipe extends out of the pipeline activity cavity;

[0011] A first ball joint is disposed at a position of the outer wall of the liquid spraying pipe corresponding to the first shaft hole, the first ball joint is located in the first shaft hole and can roll in the first shaft hole, and the first fixing structure can control the first ball joint to be unable to move in the first shaft hole;

[0012] A second ball joint is disposed at a position of the outer wall of the liquid spraying pipe corresponding to the second axial hole, the second ball joint is located in the second axial hole and can roll in the second axial hole, and the second fixing structure can control the second ball joint to be unable to move in the second axial hole;

[0013] The inner diameter of the pipeline movable cavity is set according to a preset distribution, and the spray pipe can rotate in the pipeline movable cavity through the rolling of the first ball joint and the second ball joint to adjust the position of one end of the liquid outlet of the spray pipe.

[0014] Optionally, the first fixing structure includes a first ball pin, a first tightening threaded hole and a first tightening screw; the first ball pin is a spherical table annular shell located in the first axial hole and can be contracted under force, the spherical table annular shell includes two opposite circular bottom surface openings, and the spray pipe passes through the two circular bottom surface openings of the spherical table annular shell; the first tightening threaded hole is located at a position above the first axial hole corresponding to the fixing frame, and the first tightening threaded hole exposes the first ball pin; the first tightening screw can be threadedly connected to the first tightening threaded hole, and the first tightening screw can be screwed into the first tightening threaded hole to tighten the first ball pin so that the first ball joint in the first ball pin cannot move.

[0015] Optionally, the second fixing structure is a second ball pin, a second clamping threaded hole and a second clamping screw; the second ball pin is a ball table annular shell located in the second axial hole and can be contracted under force, the ball table annular shell includes two opposite circular bottom surface openings, and the spray pipe passes through the two circular bottom surface openings of the ball table annular shell; the second clamping threaded hole is located at a position above the second axial hole corresponding to the fixing frame, and the second clamping threaded hole exposes the second ball pin; the second clamping screw and the second clamping threaded hole can be threadedly connected, and the second clamping screw can be screwed into the second clamping threaded hole to clamp the second ball pin so that the second ball joint in the second ball pin cannot move.

[0016] Optionally, the fixed frame further includes a lifting cavity and a lifting control structure;

[0017] The lifting chamber is located at the position where the pipeline activity chamber passes through the first shaft hole, the lifting chamber includes a lifting block, the first shaft hole is located in the lifting block, the liquid injection pipe passes through the lifting block and is pin-connected in the first shaft hole, and the first fixing structure controls the first ball joint in the first shaft hole from the fixing frame above the lifting block through the lifting block;

[0018] The lifting control structure comprises a lifting threaded hole, a lifting screw, a limiting step hole and a lifting control hole; the lifting threaded hole is located in the fixed frame below the lifting block, and the lifting threaded hole exposes the bottom of the lifting cavity; the limiting step hole is located below the lifting threaded hole, and the aperture of the limiting step hole is larger than the aperture of the lifting threaded hole; the lifting screw comprises a connected head and a stud, the limiting step hole comprises an upper hole surface and a lower hole surface, the head is between the upper hole surface and the lower hole surface of the limiting step hole, and the diameter of the head is larger than the inner hole diameter of the upper hole surface and the lower hole surface of the lifting threaded hole, so that the head can rotate in the limiting step hole but cannot move up and down;

[0019] The stud can be threadedly connected to the lifting threaded hole, and the lifting control hole is located at a position below the fixed frame corresponding to the limiting step hole and penetrates the fixed frame below the limiting step hole, so that the head can be rotated from the lifting control hole at the bottom of the fixed frame, and the rotation of the head can control the lifting block to drive the lifting movement of the first ball joint.

[0020] Optionally, the fixed frame also includes a limiting structure, which includes a limiting threaded hole and a limiting screw; the limiting threaded hole passes through the corresponding position of the fixed frame above the first fixed structure, the limiting screw and the limiting threaded hole can be threadedly connected, and the limiting screw can be screwed into the limiting threaded hole to limit the rising height of the lifting block below.

[0021] Optionally, the fixed frame includes a base plate, an adjustment substrate, a first cover plate and a second cover plate, the adjustment substrate is fixed to the base plate, the first cover plate and the second cover plate are fixed to the adjustment substrate; the first axial hole is located between the adjustment substrate and the first cover plate, and the second axial hole is located between the adjustment substrate and the second cover plate.

[0022] Optionally, the semiconductor process device also includes a connecting pipe, and one end of the liquid spray pipe away from the liquid outlet is connected to the connecting pipe, and the connecting pipe is used to introduce the liquid to be sprayed; the connecting pipe is a deformable hose, and the liquid spray pipe applies stress in the direction of the connecting pipe to deform the connecting pipe so that the liquid spray pipe shifts in the direction of the connecting pipe.

[0023] Optionally, the lifting stator part includes a fixed base plate, a pull plate, a cylinder fixing seat, a lifting guide rail, a cylinder barrel and a rotating table fixing plate, and the lifting mover part includes a piston rod;

[0024] The fixed base plate is arranged in parallel and spaced apart from the cylinder fixing seat, the fixed base plate and the cylinder fixing seat are fixedly connected via two or more pull plates, and the rotating table fixing plate is located between the fixed base plate and the cylinder fixing seat;

[0025] The cylinder fixing seat is fixedly connected to the cylinder barrel, and a piston port is provided at the cylinder fixing seat corresponding to the port position of the cylinder barrel; the rotating stator part is fixed on the rotating table fixing plate, the bottom of the rotating stator part is fixedly connected to one end of the piston rod, the other end of the piston rod passes through the piston port and is located in the cylinder barrel, and a driving pressure supply end is provided at one end of the cylinder barrel away from the piston port, and a driving gas can be introduced into the driving pressure supply end to drive the piston rod to drive the rotating stator part to move up and down, so as to control the lifting and lowering of the liquid spray pipe adjustment assembly;

[0026] The fixed base plate is provided with a lifting through hole at a position corresponding to the rotating drive structure, and the lifting through hole is a space for the rotating drive structure to perform lifting movements; the lifting guide rail is fixed to the side of the pulling plate close to the rotating table fixed plate, and the rotating stator part is slidably connected to the lifting guide rail at a position close to the lifting guide rail.

[0027] Optionally, a first buffer is provided at a position of the cylinder fixing seat close to the piston rod, and the first buffer is used to control the lifting and lowering speed of the piston rod; a second buffer is provided at a position of the rotating table fixing plate close to the rotating stator part, and the second buffer is used to control the lifting and lowering speed of the rotating drive structure.

[0028] As described above, the semiconductor process device of the present invention has the following beneficial effects:

[0029] The present invention provides a ball joint structure in the liquid spray pipe adjustment assembly, so that the liquid spray pipe can be directly manually adjusted to a suitable position and then fixed, which is flexible in use, improves the liquid spray accuracy, and reduces the replacement cost;

[0030] The invention controls the height of the ball joint by means of a lifting screw to adjust the liquid spray pipe, thereby improving the position adjustment accuracy of the liquid spray pipe.

[0031] The present invention enables the liquid spraying pipe to be telescopically adjustable through a deformable connecting pipe, thereby improving the freedom of adjusting the position of the liquid spraying pipe;

[0032] The present invention cooperates with the lifting drive structure and the rotating drive structure to further expand the position adjustment range of the liquid spraying pipe and improve the use flexibility. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a schematic diagram of an overall three-dimensional view of the semiconductor process device in the present invention.

[0034] Figure 2 It is a schematic front view of a semiconductor process device in the present invention.

[0035] Figure 3 Shown is a partial half-section schematic diagram of a semiconductor process device in the present invention.

[0036] Figure 4 Shown is a schematic diagram of a partially enlarged detail view of a semiconductor process device in the present invention.

[0037] Figure 5 It is a schematic diagram of a partial side cross-sectional view of a semiconductor process device in the present invention.

[0038] Figure 6 It is a schematic diagram of a partial front cross-sectional view of a semiconductor process device in the present invention.

[0039] Component number description

[0040] 10. Fixed frame; 11. Bottom plate; 12. Adjustment base plate; 13. First cover plate; 14. Second cover plate; 15. Pipeline activity chamber; 16. First axial hole; 17. Second axial hole; 18. Lifting chamber; 181. Lifting block; 182. Lifting threaded hole; 183. Lifting screw; 1831. Head; 1832. Stud; 184. Limiting step hole; 185. Lifting control hole; 191. Limiting threaded hole; 192. Limiting screw;

[0041] 21. first ball pin; 22. first clamping threaded hole; 23. first clamping screw;

[0042] 31. second ball pin; 311. deformation gap; 32. second clamping threaded hole; 33. second clamping screw;

[0043] 41, liquid spray pipe; 411, first ball joint; 412, second ball joint; 42, connecting pipe;

[0044] 51. Rotating stator part; 52. Rotating mover part; 53. Lifting through hole; 54. Second buffer;

[0045] 61. Fixed base plate; 62. Pull plate; 63. Cylinder fixed seat; 64. Lifting guide rail; 65. Cylinder barrel; 66. Rotary table fixed plate; 67. First buffer; 68. Piston rod;

[0046] 70. Motion axis. DETAILED DESCRIPTION

[0047] The following describes the embodiments of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

[0048] For example, when describing the embodiments of the present invention in detail, for the sake of convenience, the schematic diagrams showing the device structure will not be partially enlarged according to the general scale, and the schematic diagrams are only examples, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0049] For convenience of description, spatially relative terms such as "under", "below", "below", "below", "above", "on", etc. may be used herein to describe the relationship of one element or feature shown in the drawings to other elements or features. It will be understood that these spatially relative terms are intended to encompass other orientations of the device in use or operation in addition to the orientation depicted in the drawings.

[0050] In the context of the present application, a structure in which a first feature is described as being "above" a second feature may include embodiments in which the first and second features are in direct contact, and may also include embodiments in which additional features are formed between the first and second features, such that the first and second features may not be in direct contact.

[0051] It should be noted that the illustrations provided in this embodiment are only used to illustrate the basic concept of the present invention in a schematic manner, and therefore the illustrations only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0052] The present invention provides a Figure 1-Figure 5 The semiconductor process device shown in FIG. Figure 1 This is an overall three-dimensional diagram of a semiconductor process device. Figure 2 It is a front view of a semiconductor process device. Figure 3 This is a partial half-section diagram of a semiconductor process device. The section line is Figure 1 AA', the semiconductor process device includes: a moving shaft 70, a lifting drive structure, a rotating drive structure and a liquid spray pipe adjustment assembly;

[0053] Figure 4 Zhongwei Figure 3 A partial enlarged detail of the middle M part. Figure 5 for Figure 1 The partial side cross-sectional view, with the section line AA', the liquid spray pipe adjustment assembly includes a fixed frame 10, a first ball joint structure, a second ball joint structure and a liquid spray pipe 41; the first ball joint structure is located at an end of the fixed frame 10 away from the liquid outlet of the liquid spray pipe 41, and the second ball joint structure is located at an end of the fixed frame 10 close to the liquid outlet of the liquid spray pipe 41; the liquid spray pipe 41 is pin-connected with the first ball joint structure and the second ball joint structure respectively, so that the liquid spray pipe 41 can adjust the liquid outlet position by partially rolling in the first ball joint structure and the second ball joint structure; the first ball joint structure includes a first fixing structure, and the second ball joint structure includes a second fixing structure, and the first fixing structure and the second fixing structure can control the liquid spray pipe 41 and the first ball joint structure and the second ball joint structure to be unable to move;

[0054] Figure 6 This is a partial front cross-sectional view of a semiconductor process device. The section line is Figure 1BB' in the figure, the moving shaft 70 is fixed under the fixed frame 10; the rotating driving structure includes a rotating stator part 51 and a rotating movable part 52, the rotating stator part 51 is rotatably connected to the rotating movable part 52, and the moving shaft 70 is fixedly connected to the rotating movable part 52; the lifting driving structure includes a lifting stator part and a lifting movable part, the lifting stator part is lifting and slidingly connected to the lifting movable part, and the rotating stator part 51 is fixedly connected to the lifting movable part.

[0055] In the prior art, the liquid spray pipe 41 of the liquid supply swing arm that supplies liquid during the wafer cleaning process must ensure both the distance and angle from the wafer and the overall stability during liquid supply. However, since the position and size of the liquid spray pipe 41 of the traditional liquid supply swing arm are fixed after production, it is generally impossible to flexibly adjust the height and angle of the liquid outlet of the liquid spray pipe 41. The only way to ensure that the liquid spray pipe 41 is in the required posture of the wafer to be cleaned is to improve the processing accuracy. This results in the need to equip liquid supply swing arms with different structures to meet the different requirements of the corresponding liquid outlet height and angle when corresponding to wafers of different sizes or wafers that need to be cleaned at different positions. As a result, a new liquid supply swing arm needs to be equipped for each different liquid outlet position requirement, resulting in poor flexibility in the use of the liquid supply swing arm and high application cost. At the same time, after the liquid supply swing arm has been running for a long time, the position of the liquid outlet will have a certain offset, and the liquid supply swing arm cannot flexibly adjust the position of the liquid spray pipe 41, and cannot correct the offset angle of the liquid outlet in time. Manual adjustment of the liquid spray pipe 41 cannot guarantee that the liquid spray pipe 41 can maintain the adjusted position after being adjusted. Only replacing a new liquid supply swing arm to ensure the position accuracy of the liquid outlet will further increase the replacement cost of the liquid supply swing arm.

[0056] The present invention provides a ball joint structure in the liquid spray pipe adjustment assembly, which can directly manually adjust the liquid spray pipe 41 to a suitable position and then fix it, so that the semiconductor process device can directly manually adjust the liquid outlet position of the liquid spray pipe 41 when used for different types of wafer cleaning to perform adaptive adjustment of the liquid spray pipe 41, so that one semiconductor process device can be applicable to a variety of wafer cleaning processes of different sizes or types, thereby improving the use flexibility of the semiconductor process device; at the same time, because one semiconductor process device can directly adapt to different wafer cleaning scenarios by adjusting the liquid outlet of the liquid spray pipe 41, there is no need to equip different semiconductor process devices corresponding to different wafer cleaning scenarios, thereby The use cost of semiconductor process equipment can be reduced; and, since the position of the liquid outlet of the liquid spray pipe 41 can be directly adjusted and fixed, when the position of the liquid outlet of the liquid spray pipe 41 that has been running for a long time has a certain offset, the position of the liquid spray pipe 41 can be flexibly adjusted and then fixed, so that the offset angle of the liquid outlet can be corrected in time, and there is no need to replace a new semiconductor process equipment, and the maintenance and replacement cost of the semiconductor process equipment can be further reduced; in addition, the position of the liquid spray pipe adjustment assembly can be adjusted over a large range in cooperation with the lifting drive structure and the rotating drive structure, thereby further expanding the position adjustment range of the liquid spray pipe 41, improving the flexibility of the position adjustment of the liquid spray pipe 41, and expanding the scope of application.

[0057] Specifically, although the concept of the present invention mainly comes from the problem of adjusting the liquid outlet position of the spray pipe 41 used for wafer cleaning, the solution of the present invention can also be used in other semiconductor process equipment that requires flexible adjustment of the liquid outlet position of the spray pipe 41, all of which are within the protection scope of the present invention.

[0058] In one embodiment, Figure 3-Figure 5 As shown, the fixed frame 10 includes a pipeline active cavity 15, a first axial hole 16 and a second axial hole 17, and the pipeline active cavity 15 communicates with the first axial hole 16 and the second axial hole 17; the liquid spraying pipe 41 passes through the pipeline active cavity 15 and is pin-connected in the first axial hole 16 and the second axial hole 17, and one end of the liquid outlet of the liquid spraying pipe 41 extends out of the pipeline active cavity 15;

[0059] A first ball joint 411 is disposed on the outer wall of the liquid spraying pipe 41 at a position corresponding to the first shaft hole 16. The first ball joint 411 is located in the first shaft hole 16 and can roll in the first shaft hole 16. The first fixing structure can control the first ball joint 411 to be unable to move in the first shaft hole 16.

[0060] A second ball joint 412 is disposed on the outer wall of the liquid spraying pipe 41 at a position corresponding to the second shaft hole 17. The second ball joint 412 is located in the second shaft hole 17 and can roll in the second shaft hole 17. The second fixing structure can control the second ball joint 412 to be unable to move in the second shaft hole 17.

[0061] The inner diameter of the pipeline active cavity 15 is set according to a preset distribution, and the spray pipe 41 can rotate in the pipeline active cavity 15 through the rolling of the first ball joint 411 and the second ball joint 412 to adjust the position of one end of the liquid outlet of the spray pipe 41.

[0062] The present invention sets a first ball joint structure and a second ball joint structure, so that the liquid outlet of the liquid spray pipe 41 can be directly manually adjusted to a suitable position by extending out of the pipeline movable cavity 15, and then the first ball joint 411 and the second ball joint 412 are fixed by the first fixing structure and the second fixing structure, so that the liquid outlet position of the liquid spray pipe 41 can be maintained at the adjusted position. The structure is simple, the operation is convenient, and the space occupied is small, which is conducive to the miniaturization and lightweight of semiconductor process equipment, and at the same time improves the adjustment efficiency of the semiconductor process equipment in adjusting the liquid outlet position of the liquid spray pipe 41.

[0063] In one embodiment, Figure 3-Figure 5 As shown, the first fixing structure includes a first ball pin 21, a first clamping threaded hole 22 and a first clamping screw 23; the first ball pin 21 is a ball table annular shell located in the first axial hole 16 and can be contracted under force, the ball table annular shell includes two opposite circular bottom openings, and the spray pipe 41 passes through the two circular bottom openings of the ball table annular shell; the first clamping threaded hole 22 is located at a position above the fixing frame 10 corresponding to the first axial hole 16, and the first clamping threaded hole 22 exposes the first ball pin 21; the first clamping screw 23 can be threadedly connected to the first clamping threaded hole 22, and the first clamping screw 23 can be screwed into the first clamping threaded hole 22 to clamp the first ball pin 21 so that the first ball joint 411 in the first ball pin 21 cannot move.

[0064] In one embodiment, the ball band of the ball table annular shell of the first ball pin 21 includes a deformation gap, and the deformation gap is located on the cross-section of the ball table annular shell perpendicular to the circular bottom opening; when the first ball pin 21 is pressed, the deformation gap shrinks, so that the inner surface of the ball table annular shell presses the first ball joint 411 inside, making the first ball joint 411 unable to move.

[0065] The present invention arranges the first ball pin 21 to include a deformation gap, so that the first ball joint 411 can be fixed by pressing the first ball pin 21 with the first clamping screw 23, thereby fixing the position of the liquid outlet of the spray pipe 41 after adjustment. The structure is simple and the operation is convenient, which is conducive to improving the operating efficiency of the spray pipe adjustment assembly.

[0066] In one embodiment, Figure 3-Figure 5 As shown, the second fixing structure is a second ball pin 31, a second clamping threaded hole 32 and a second clamping screw 33; the second ball pin 31 is a ball table annular shell located in the second axial hole 17 and can be contracted under force, the ball table annular shell includes two opposite circular bottom openings, and the spray pipe 41 passes through the two circular bottom openings of the ball table annular shell; the second clamping threaded hole 32 is located at a position above the fixing frame 10 corresponding to the second axial hole 17, and the second clamping threaded hole 32 exposes the second ball pin 31; the second clamping screw 33 can be threadedly connected to the second clamping threaded hole 32, and the second clamping screw 33 can be screwed into the second clamping threaded hole 32 to clamp the second ball pin 31 so that the second ball joint 412 in the second ball pin 31 cannot move.

[0067] The present invention sets the first ball pin 21 and the second ball pin 31 as a ball table annular shell that can be contracted under force, so that the position of the ball joint can be fixed by tightening the ball pin by a tightening screw, thereby fixing the position of the liquid outlet of the spray pipe 41 after adjustment. The structure is simple and the operation is convenient, which is beneficial to improving the operating efficiency of the spray pipe adjustment assembly.

[0068] In one embodiment, Figure 4 As shown, the ball band of the ball table annular shell of the second ball pin 31 includes a deformation gap 311, and the deformation gap 311 is located on the cross section of the ball table annular shell perpendicular to the circular bottom opening; when the second ball pin 31 is pressed, the deformation gap 311 shrinks, so that the inner surface of the ball table annular shell presses the second ball joint 412 inside, making the second ball joint 412 unable to move.

[0069] The present invention arranges the second ball pin 31 to include a deformation gap 311, so that the second ball joint 412 can be fixed by pressing the second ball pin 31 with the second clamping screw 33, thereby fixing the position of the liquid outlet of the spray pipe 41 after adjustment. The structure is simple and the operation is convenient, which is conducive to improving the operating efficiency of the spray pipe adjustment assembly.

[0070] In one embodiment, Figure 3-Figure 5 As shown, the fixed frame 10 also includes a lifting chamber 18 and a lifting control structure;

[0071] The lifting chamber 18 is located at the position where the pipeline active chamber 15 passes through the first shaft hole 16. The lifting chamber 18 includes a lifting block 181. The first shaft hole 16 is located in the lifting block 181. The liquid spraying pipe 41 passes through the lifting block 181 and is pin-connected in the first shaft hole 16. The first fixing structure controls the first ball joint 411 in the first shaft hole 16 from the fixing frame 10 above the lifting block 181 through the lifting block 181.

[0072] The lifting control structure includes a lifting threaded hole 182, a lifting screw 183, a limiting step hole 184 and a lifting control hole 185; the lifting threaded hole 182 is located on the fixed frame 10 below the lifting block 181, and the lifting threaded hole 182 reveals the bottom of the lifting cavity 18; the limiting step hole 184 is located below the lifting threaded hole 182, and the aperture of the limiting step hole 184 is larger than the aperture of the lifting threaded hole 182; the lifting screw 183 includes a connected head 1831 and a stud 1832, the limiting step hole 184 includes an upper hole surface and a lower hole surface, the head 1831 is between the upper hole surface and the lower hole surface of the limiting step hole 184, and the diameter of the head 1831 is larger than the inner hole diameter of the upper hole surface and the lower hole surface of the lifting threaded hole 182, so that the head 1831 can rotate in the limiting step hole 184 but cannot move up and down;

[0073] The stud 1832 can be threadedly connected to the lifting threaded hole 182, and the lifting control hole 185 is located at a position below the fixed frame 10 corresponding to the limiting step hole 184 and passes through the fixed frame 10 below the limiting step hole 184, so that the head 1831 can be rotated from the lifting control hole 185 at the bottom of the fixed frame 10, and the rotation of the head 1831 can control the lifting block 181 to drive the lifting movement of the first ball joint 411.

[0074] By setting up a lifting chamber 18 and a lifting control structure, the present invention can control the height of the first ball joint 411 through the lifting screw 183, thereby further improving the position adjustment accuracy of the liquid outlet of the spray pipe 41, thereby further improving the position accuracy of the liquid outlet of the spray pipe 41 and improving the adaptability of the semiconductor process equipment to different wafer cleaning scenarios.

[0075] In one embodiment, Figure 3-Figure 5As shown, the fixed frame 10 also includes a limiting structure, which includes a limiting threaded hole 191 and a limiting screw 192; the limiting threaded hole 191 passes through the fixed frame 10 at a corresponding position above the first fixed structure, and the limiting screw 192 can be threadedly connected to the limiting threaded hole 191. The limiting screw 192 can be screwed into the limiting threaded hole 191 to limit the rising height of the lifting block 181 below.

[0076] The present invention can limit the rising height of the lifting block 181 by setting a limiting structure, thereby preventing the lifting screw 183 from being rotated when the lifting block 181 rises to the limit position, causing deformation and damage to the pipeline active cavity 15, and affecting the service life of the spray pipe adjustment assembly; at the same time, by understanding the depth of the limiting screw 192 screwed into the limiting threaded hole 191, it can be determined that the rising height of the lifting block 181 corresponding to different wafer cleaning scenarios is different, thereby increasing the control of the semiconductor process device on the liquid outlet position adjustment of the spray pipe 41 for different wafer cleaning scenarios during the adjustment process, thereby improving the adaptability of the semiconductor process device.

[0077] In one embodiment, Figure 1-Figure 4 As shown, the fixed frame 10 includes a bottom plate 11, an adjusting substrate 12, a first cover plate 13 and a second cover plate 14; the adjusting substrate 12 is fixed on the bottom plate 11, and the first cover plate 13 and the second cover plate 14 are fixed on the adjusting substrate 12; the first axial hole 16 is located between the adjusting substrate 12 and the first cover plate 13, and the second axial hole 17 is located between the adjusting substrate 12 and the second cover plate 14.

[0078] The present invention adopts different cover plates by setting the first axial hole 16 and the second axial hole 17 respectively, thereby reducing the possibility of problems such as poor structural strength and easy breakage caused by uneven stress distribution inside the cover plate due to different stresses generated by the first ball joint 411 and the second ball joint 412 on the cover plate during rolling, thereby improving the structural reliability and service life of the spray pipe adjustment assembly.

[0079] In one embodiment, Figure 3-Figure 5 As shown, the semiconductor process device also includes a connecting pipe 42, and the end of the liquid spraying pipe 41 away from the liquid outlet is connected to the connecting pipe 42, and the connecting pipe 42 is used to introduce the liquid to be sprayed; the connecting pipe 42 is a deformable hose, and the liquid spraying pipe 41 applies stress in the direction of the connecting pipe 42 to deform the connecting pipe 42 so that the liquid spraying pipe 41 is displaced in the direction of the connecting pipe 42.

[0080] The present invention provides a deformable connecting tube 42 to connect with the end of the liquid spraying tube 41 away from the liquid outlet, so that the liquid spraying tube 41 can be extended and retracted along the direction of the pipeline active cavity 15, and the length of the liquid outlet of the liquid spraying tube 41 extending out of the pipeline active cavity 15 can be adjusted, thereby further improving the freedom of adjusting the liquid spraying position of the liquid spraying tube 41, which is beneficial to further improving the flexibility of use of semiconductor process equipment.

[0081] Specifically, the inner diameter distribution of the pipeline active cavity 15 needs to make the range of the spray pipe 41 during the rotation process meet the range requirement of the spray pipe 41 adjustment. The inner diameter distribution of the pipeline active cavity 15 needs to be designed accordingly between the first axial hole 16 and the second axial hole 17, from the second axial hole 17 to the position where the spray pipe 41 extends out of the pipeline active cavity 15, and the position where the spray pipe 41 is connected to the connecting pipe 42.

[0082] In one embodiment, Figure 1-Figure 3 and Figure 6 As shown, the lifting stator part includes a fixed base plate 61, a pull plate 62, a cylinder fixing seat 63, a lifting guide rail 64, a cylinder barrel 65 and a rotating table fixing plate 66, and the lifting mover part includes a piston rod 68;

[0083] The fixed base plate 61 is arranged parallel to and spaced from the cylinder fixing seat 63. The fixed base plate 61 and the cylinder fixing seat 63 are fixedly connected via two or more pull plates 62. The rotating table fixing plate 66 is located between the fixed base plate 61 and the cylinder fixing seat 63.

[0084] The cylinder fixing seat 63 is fixedly connected to the cylinder barrel 65, and the cylinder fixing seat 63 is provided with a piston port at the port position corresponding to the cylinder barrel 65; the rotating stator part 51 is fixed on the rotating table fixing plate 66, and the bottom of the rotating stator part 51 is fixedly connected to one end of the piston rod 68, and the other end of the piston rod 68 passes through the piston port and is located in the cylinder barrel 65. The end of the cylinder barrel 65 away from the piston port is provided with a driving pressure supply end, and the driving pressure supply end can pass driving gas to drive the piston rod 68 to drive the rotating stator part 51 to move up and down, so as to control the lifting and lowering of the liquid spray pipe adjustment assembly;

[0085] The fixed base plate 61 is provided with a lifting through hole 53 at a position corresponding to the rotating drive structure, and the lifting through hole 53 is a space for the rotating drive structure to perform lifting movements; the lifting guide rail 64 is fixed to the side of the pulling plate 62 close to the rotating table fixed plate 66, and the rotating stator part 51 is slidably connected to the lifting guide rail 64 at a position close to the lifting guide rail 64.

[0086] The present invention realizes a large-scale lifting and rotating movement of the liquid spray pipe adjustment assembly of the semiconductor process device by setting the structural coordination of the rotating drive structure and the lifting drive structure, and cooperates with the first ball joint structure, the second ball joint structure and the connecting pipe 42 to realize the small-scale rotation and telescopic movement of the liquid spray pipe 41 in the liquid spray pipe adjustment assembly, so that the liquid spray pipe adjustment assembly of the semiconductor process device can realize three-dimensional free movement adjustment in both large and small ranges, thereby not only improving the position adjustment freedom and adjustment range of the liquid spray pipe 41 in the semiconductor process device, but also improving the position adjustment accuracy of the liquid spray pipe 41 of the semiconductor process device, and realizing a dual coordination adjustment mechanism for coarse adjustment and fine adjustment of the position of the liquid spray pipe 41.

[0087] In one embodiment, two pull plates 62 are disposed opposite to each other.

[0088] In one embodiment, the pull plate 62 is fixed to the fixed base plate 61 by bolts, the cylinder fixing seat 63 is fixed to the two pull plates 62 by bolt connection, the cylinder barrel 65 is fixed to the cylinder fixing seat 63 by bolt connection, the rotating stator part 51 is connected to the rotating table fixing plate 66 by a slot, the lifting guide rail 64 is fixed to the rotating table fixing plate 66 by bolt connection, and the moving shaft 70 is installed on the rotating stator part 51 by bolt connection; the bottom plate 11 in the spray pipe adjustment assembly is installed on the top of the moving shaft 70 by bolt connection, and the adjustment base plate 12 is installed on the bottom plate 11 by bolt connection; the first cover plate 13 is installed on the adjustment base plate 12 by bolt connection, and the second cover plate 14 is fixed to the adjustment base plate 12 by bolt connection; the lifting block 181 is connected to the inside of the adjustment base plate 12 by a pin shaft, and can slide up and down in the adjustment base plate 12.

[0089] In one embodiment, Figure 2 and Figure 6 As shown, a first buffer 67 is provided at a position of the cylinder fixing seat 63 close to the piston rod 68, and the first buffer 67 is used to control the lifting and lowering speed of the piston rod 68; a second buffer 54 is provided at a position of the rotating table fixing plate 66 close to the rotating stator part 51, and the second buffer 54 is used to control the lifting and lowering speed of the rotating drive structure.

[0090] The present invention can control the lifting and lowering speed of the liquid spray pipe adjusting assembly driven by the lifting and lowering driving structure to be stable by setting the first buffer 67 and the second buffer 54, thereby avoiding damage to the connection strength of the rotating driving structure or the liquid spray pipe adjusting assembly due to the excessive lifting speed of the rotating driving structure caused by the overshoot of the drive, thereby improving the stability of the liquid spray pipe 41, reducing the impact force when the liquid spray pipe adjusting assembly stops, improving the structural reliability and service life of the semiconductor process equipment, and improving the efficiency of adjusting the position of the liquid spray pipe 41.

[0091] In one embodiment, the first buffer 67 and the second buffer 54 are hydraulic pipes that can spray variable pressure gas. By setting hydraulic pipes that can spray different pressure gases on the moving track for lifting the lifting mover part and the rotating drive structure, the lifting speed of the lifting mover part and the rotating drive structure can be controlled, and the lifting speed of the lifting mover part and the rotating drive structure can be buffered. Specifically, the first buffer 67 and the second buffer 54 can also be other suitable buffer structures, all of which are within the protection scope of the present invention.

[0092] In one embodiment, a method of using the semiconductor process device is:

[0093] The driving pressure supply end of the control cylinder barrel 65 drives the driving piston rod 68 to rise, and the piston rod 68 drives the rotating driving structure to rise, driving the liquid spray pipe adjustment assembly to rise to a preset position. During the rising process, the first buffer 67 and the second buffer 54 control the rising speed of the piston rod 68 and the rotating driving structure to be stable;

[0094] The rotary drive structure is started, the rotating movable part 52 drives the liquid spray pipe adjustment assembly to rotate to a preset position around the moving shaft 70, and the rotary drive structure is stopped;

[0095] Loosen the first clamping screw 23 and the second clamping screw 33, thereby releasing the pressure of the first ball pin 21 and the second ball pin 31 on the ball joint, so that the first ball joint 411 and the second ball joint 412 included in the liquid spraying pipe 41 can move freely in the first ball pin 21 and the second ball pin 31;

[0096] The position of the liquid outlet of the liquid spray pipe 41 is adjusted by manually directly moving one end of the liquid spray pipe 41 extending out of the pipeline active cavity 15; and / or after rotating the limit screw 192 to a preset limit height, the lifting screw 183 is rotated to drive the lifting block 181 to drive the first ball joint 411 to perform lifting and lowering movements, thereby driving the rotation of the liquid spray pipe 41 to adjust the liquid outlet of the liquid spray pipe 41 to a suitable position; and / or the connecting pipe 42 is deformed by pushing and pulling the liquid spray pipe 41 along the direction of the pipeline active cavity 15 to adjust the length position of the liquid outlet of the liquid spray pipe 41 extending out of the pipeline active cavity 15;

[0097] Tighten the first clamping screw 23 and the second clamping screw 33 to prevent the first ball joint 411 and the second ball joint 412 from moving in the first ball pin 21 and the second ball pin 31, thereby fixing the position of the liquid outlet of the liquid spray pipe 41;

[0098] The connecting pipe 42 is started to pass the cleaning liquid into the liquid spraying pipe 41, and the liquid outlet of the liquid spraying pipe 41 sprays the cleaning liquid to the target position of the wafer, and the rotary driving structure is started at the same time, so that the liquid outlet of the liquid spraying pipe 41 is evenly sprayed at each target position of the wafer;

[0099] After cleaning is completed, stop the connecting pipe 42 from introducing cleaning liquid, and stop the rotating drive structure after the rotating drive structure rotates the spray pipe adjustment assembly to the preset position; start the lifting drive structure, control the driving pressure supply end of the cylinder barrel 65 to make the piston rod 68 descend, drive the rotating drive structure to descend, drive the spray pipe adjustment assembly to descend to the preset position, complete the position restoration of the spray pipe 41, and end the cleaning process.

[0100] In summary, the semiconductor process device of the present invention can be provided with a ball joint structure in the spray pipe adjustment assembly, and the spray pipe can be directly manually adjusted to the appropriate position and then fixed, which has flexible usage scenarios, improves the spray accuracy, and reduces replacement costs; at the same time, the height of the spray pipe is controlled by the lifting screw to adjust the ball joint, which can improve the spray pipe position adjustment accuracy; in addition, the deformable connecting pipe makes the spray pipe telescopically adjustable, which improves the freedom of the spray pipe position adjustment; finally, in conjunction with the lifting drive structure and the rotation drive structure, the spray pipe position adjustment range is further expanded to improve the flexibility of use.

[0101] Therefore, the present invention effectively overcomes various shortcomings in the prior art and has high industrial utilization value.

[0102] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical ideas disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A semiconductor process device, characterized in that: The semiconductor process device comprises: a motion axis, a lifting drive structure, a rotation drive structure and a liquid spray pipe adjustment assembly; The liquid spray pipe adjustment assembly includes a fixed frame, a first ball joint structure, a second ball joint structure and a liquid spray pipe; the first ball joint structure is located at an end of the fixed frame away from the liquid outlet of the liquid spray pipe, and the second ball joint structure is located at an end of the fixed frame close to the liquid outlet of the liquid spray pipe; the liquid spray pipe is pin-connected to the first ball joint structure and the second ball joint structure respectively, so that the liquid spray pipe can adjust the liquid outlet position by partially rolling in the first ball joint structure and the second ball joint structure; the first ball joint structure includes a first fixed structure, and the second ball joint structure The structure includes a second fixing structure, and the first fixing structure and the second fixing structure can control the liquid spray pipe and the first ball joint structure and the second ball joint structure to be unable to move; the movement shaft is fixed below the fixed frame; the rotation driving structure includes a rotating stator part and a rotating movable part, the rotating stator part is rotatably connected to the rotating movable part, and the movement shaft is fixedly connected to the rotating movable part; the lifting driving structure includes a lifting stator part and a lifting movable part, the lifting stator part is lifting and slidingly connected to the lifting movable part, and the rotating stator part is fixedly connected to the lifting movable part; The fixed frame includes a pipeline activity cavity, a first axial hole and a second axial hole, wherein the pipeline activity cavity communicates with the first axial hole and the second axial hole; the liquid spraying pipe passes through the pipeline activity cavity and is pin-connected in the first axial hole and the second axial hole, and one end of the liquid outlet of the liquid spraying pipe extends out of the pipeline activity cavity; A first ball joint is disposed at a position of the outer wall of the liquid spraying pipe corresponding to the first shaft hole, the first ball joint is located in the first shaft hole and can roll in the first shaft hole, and the first fixing structure can control the first ball joint to be unable to move in the first shaft hole; A second ball joint is disposed at a position of the outer wall of the liquid spraying pipe corresponding to the second axial hole, the second ball joint is located in the second axial hole and can roll in the second axial hole, and the second fixing structure can control the second ball joint to be unable to move in the second axial hole; The inner diameter of the pipeline movable cavity is set according to a preset distribution, and the liquid spraying pipe can rotate in the pipeline movable cavity through the rolling of the first ball joint and the second ball joint to adjust the position of one end of the liquid outlet of the liquid spraying pipe; The fixed frame also includes a lifting cavity and a lifting control structure; The lifting chamber is located at the position where the pipeline activity chamber passes through the first shaft hole, the lifting chamber includes a lifting block, the first shaft hole is located in the lifting block, the liquid injection pipe passes through the lifting block and is pin-connected in the first shaft hole, and the first fixing structure controls the first ball joint in the first shaft hole from the fixing frame above the lifting block through the lifting block; The lifting control structure comprises a lifting threaded hole, a lifting screw, a limiting step hole and a lifting control hole; the lifting threaded hole is located in the fixed frame below the lifting block, and the lifting threaded hole exposes the bottom of the lifting cavity; the limiting step hole is located below the lifting threaded hole, and the aperture of the limiting step hole is larger than the aperture of the lifting threaded hole; the lifting screw comprises a connected head and a stud, the limiting step hole comprises an upper hole surface and a lower hole surface, the head is between the upper hole surface and the lower hole surface of the limiting step hole, and the diameter of the head is larger than the inner hole diameter of the upper hole surface and the lower hole surface of the lifting threaded hole, so that the head can rotate in the limiting step hole but cannot move up and down; The stud can be threadedly connected to the lifting threaded hole, and the lifting control hole is located at a position below the fixed frame corresponding to the limiting step hole and penetrates the fixed frame below the limiting step hole, so that the head can be rotated from the lifting control hole at the bottom of the fixed frame, and the rotation of the head can control the lifting block to drive the lifting movement of the first ball joint.

2. The semiconductor process device according to claim 1, characterized in that: The first fixing structure includes a first ball pin, a first tightening threaded hole and a first tightening screw; the first ball pin is a ball table annular shell located in the first axial hole and can be contracted under force, the ball table annular shell includes two opposite circular bottom openings, and the spray pipe passes through the two circular bottom openings of the ball table annular shell; the first tightening threaded hole is located at a position above the first axial hole corresponding to the fixing frame, and the first tightening threaded hole exposes the first ball pin; the first tightening screw can be threadedly connected to the first tightening threaded hole, and the first tightening screw can be screwed into the first tightening threaded hole to tighten the first ball pin so that the first ball joint in the first ball pin cannot move.

3. The semiconductor process device according to claim 1, characterized in that: The second fixing structure is a second ball pin, a second clamping threaded hole and a second clamping screw; the second ball pin is a ball table annular shell located in the second axial hole and can be contracted under force, the ball table annular shell includes two opposite circular bottom surface openings, and the spray pipe passes through the two circular bottom surface openings of the ball table annular shell; the second clamping threaded hole is located at a position above the fixing frame corresponding to the second axial hole, and the second clamping threaded hole exposes the second ball pin; the second clamping screw and the second clamping threaded hole can be threadedly connected, and the second clamping screw can be screwed into the second clamping threaded hole to clamp the second ball pin so that the second ball joint in the second ball pin cannot move.

4. The semiconductor process device according to claim 1, characterized in that: The fixed frame also includes a limiting structure, which includes a limiting threaded hole and a limiting screw; the limiting threaded hole passes through the corresponding position of the fixed frame above the first fixed structure, the limiting screw and the limiting threaded hole can be threadedly connected, and the limiting screw can be screwed into the limiting threaded hole to limit the rising height of the lifting block below.

5. The semiconductor process device according to claim 1, characterized in that: The fixed frame comprises a bottom plate, an adjustment substrate, a first cover plate and a second cover plate, the adjustment substrate is fixed on the bottom plate, and the first cover plate and the second cover plate are fixed on the adjustment substrate; The first shaft hole is located between the adjusting substrate and the first cover plate, and the second shaft hole is located between the adjusting substrate and the second cover plate.

6. The semiconductor process device according to claim 1, characterized in that: The semiconductor process device also includes a connecting pipe, one end of the liquid spraying pipe away from the liquid outlet is connected to the connecting pipe, and the connecting pipe is used to introduce the liquid to be sprayed; the connecting pipe is a deformable hose, and the liquid spraying pipe applies stress in the direction of the connecting pipe to deform the connecting pipe so that the liquid spraying pipe is displaced in the direction of the connecting pipe.

7. The semiconductor process device according to claim 1, characterized in that: The lifting stator part includes a fixed base plate, a pull plate, a cylinder fixing seat, a lifting guide rail, a cylinder barrel and a rotating table fixing plate, and the lifting mover part includes a piston rod; the fixed base plate and the cylinder fixing seat are arranged in parallel and spaced apart, the fixed base plate and the cylinder fixing seat are fixedly connected by two or more pull plates, and the rotating table fixing plate is located between the fixed base plate and the cylinder fixing seat; The cylinder fixing seat is fixedly connected to the cylinder barrel, and the cylinder fixing seat is provided with a piston port at a port position corresponding to the cylinder barrel; the rotating stator part is fixed on the rotating table fixing plate, the bottom of the rotating stator part is fixedly connected to one end of the piston rod, the other end of the piston rod passes through the piston port and is located in the cylinder barrel, and a driving pressure supply end is provided at the end of the cylinder barrel away from the piston port, and the driving pressure supply end can pass driving gas to drive the piston rod to drive the rotating stator part to rise and fall, so as to control the rise and fall of the spray pipe adjustment assembly; the fixed base plate is provided with a lifting through hole at a position corresponding to the rotating drive structure, and the lifting through hole is a space for the rotating drive structure to perform lifting and falling movements; the lifting guide rail is fixed on the side of the pulling plate close to the rotating table fixing plate, and the position of the rotating stator part close to the lifting guide rail is slidably connected to the lifting guide rail.

8. The semiconductor process device according to claim 7, characterized in that: A first buffer is provided at a position of the cylinder fixing seat close to the piston rod, and the first buffer is used to control the lifting speed of the piston rod; a second buffer is provided at a position of the rotating table fixing plate close to the rotating stator part, and the second buffer is used to control the lifting speed of the rotating drive structure.

Images