A refrigeration shaping device for injection molded parts

Abstract

The invention relates to the field of injection molding production technology, and specifically to an injection molding refrigeration and shaping device, comprising a control electrical box, a mounting plate is arranged just above the control electrical box, a plurality of fixed parts of telescopic equipment are equidistantly arranged between the mounting plate and the control electrical box, a heat sink is arranged at the upper end of the mounting plate, a plurality of semiconductor refrigeration plates are equidistantly arranged at the upper end of the heat sink, the upper end of the semiconductor refrigeration plate is fitted with a refrigeration shaping plate, the upper end surface of the refrigeration shaping plate is recessed downward to form a plurality of shaping grooves, the upper side of the front end of the refrigeration shaping plate is fitted with a rectangular block, and the lower end of the rectangular block is hinged to the front end of the refrigeration shaping plate, a rectangular rod is installed in the middle of the front end of the rectangular block, a vertical part of an L-shaped frame is arranged at the front end of the rectangular rod, and the rear end of the vertical part of the L-shaped frame is connected to the movable part of the telescopic equipment. The design realizes rapid cooling and shaping of the product, effectively reduces the deformation of the product, effectively ensures the shape and size of the product, and improves the yield rate of the product.

Description

Technical Field

[0001] The invention relates to a refrigeration and shaping device for injection molded parts, belonging to the technical field of injection molding production. Background Art

[0002] Injection molding is a method of producing industrial products. It is a method of using plastic molding molds to make plastic products of various shapes from thermoplastics or thermosetting materials. After the product is taken out of the injection molding, the injection molded product itself still retains heat. Generally, natural cooling is used to cool the injection molded product. Natural cooling products are prone to deformation and shrinkage, causing the product to have a large deformation amount, resulting in varying degrees of changes in the shape and size of the product, which will affect the product yield. Summary of the invention

[0003] In view of the problems in the prior art, the present invention provides a refrigeration and shaping device for injection molded parts.

[0004] The technical solution adopted by the present invention to solve the technical problem is: an injection molded part refrigeration shaping device, comprising a control electric box, a mounting plate is arranged just above the control electric box, a plurality of fixing parts of telescopic devices are equidistantly arranged between the mounting plate and the control electric box, a heat sink is arranged at the upper end of the mounting plate, a plurality of semiconductor refrigeration plates are equidistantly arranged at the upper end of the heat sink, the upper end of the semiconductor refrigeration plate is attached to the refrigeration shaping plate, the upper end surface of the refrigeration shaping plate is concave downward to form a plurality of shaping grooves, a circulation part is arranged at the rear end of the control electric box, and the circulation part is connected with the heat sink;

[0005] The upper side of the front end of the refrigeration shaping plate fits the rectangular block, and the lower end of the rectangular block is hinged to the front end of the refrigeration shaping plate, a rectangular rod is installed in the middle of the front end of the rectangular block, the vertical part of the L-shaped frame is set at the front end of the rectangular rod, and the L-shaped frame is located on the front side of the control box, the rear end of the vertical part of the L-shaped frame is connected to the movable part of the telescopic device, the rear end of the transverse part of the L-shaped frame is set with a functional part, and the functional part is installed between the mounting plate and the control box, and the functional part and the telescopic device are arranged alternately.

[0006] Further, the functional part includes a straight plate, the straight plate is installed between the mounting plate and the control electric box, a synchronous belt is arranged on the left side of the straight plate, and the synchronous belt is located outside the telescopic device, the inner rear wall of the synchronous belt is engaged with a second gear, the right end of the second gear is installed with a first shaft, and the first shaft is rotatably connected to the left end of the straight plate;

[0007] The inner front wall of the synchronous belt is engaged with the third gear, and a second shaft is set at the right end of the third gear. The second shaft is rotatably connected to the left end of the straight plate, and the second shaft passes through the straight plate. The first gear is set at the right end of the second shaft, and the first gear is located between the straight plate and the telescopic device. The lower end of the first gear is engaged with the rack, and the left end of the rack is slidably connected to the right end of the straight plate. The front end of the rack is connected to the rear end of the horizontal part of the L-shaped frame. A plurality of hammers are equidistantly set at the outer end of the synchronous belt, and the hammers are located between the mounting plate and the control electric box.

[0008] Furthermore, the vertical parts of multiple vertically arranged L-shaped blocks are equidistantly arranged at the rear end of the mounting plate, and the L-shaped block is located at the rear end of the semiconductor refrigeration plate, the upper end surface of the L-shaped block coincides with the upper end surface of the semiconductor refrigeration plate, and a magnetic plate is installed at the rear end of the vertical part of the L-shaped block, and the magnetic plate is located below the horizontal part of the L-shaped block.

[0009] Further, the heat sink comprises a plurality of first heat sinks, the plurality of first heat sinks are equidistantly arranged on the upper end of the mounting plate, a second heat sink is installed on the upper end of the first heat sink, the semiconductor refrigeration plate is arranged on the upper end of the second heat sink, the upper end surface of the first heat sink is concave downward to form a lower serpentine groove, the lower end surface of the second heat sink is concave upward to form an upper serpentine groove, and the upper serpentine groove is connected to the upper end of the lower serpentine groove;

[0010] A first joint is arranged on the right side of the rear end of the first heat sink, and the first joint is located on the right side of the L-shaped block. The first joint is installed on the rear end of the second heat sink, and the first joint is connected to the inlet of the lower serpentine groove and the inlet of the upper serpentine groove respectively. A second joint is arranged on the left side of the rear end of the second heat sink, and the second joint is located on the left side of the L-shaped block.

[0011] The second joint is installed on the rear end of the second heat dissipation plate, and the second joint is connected to the outlet of the lower serpentine groove and the outlet of the upper serpentine groove respectively. A U-shaped tube is arranged between two adjacent first heat dissipation plates, and one end of the U-shaped tube is connected to the second joint, and the other end of the U-shaped tube is connected to the first joint.

[0012] Furthermore, the circulation component includes a water tank, which is installed on the rear end of the control electrical box. The upper end of the water tank is connected to an extraction device, and the outlet of the extraction device is connected to a first pipe. The other end of the first pipe is connected to a first joint located on the far right, and a second pipe is connected to the rear end of the second joint located on the far left, and the other end of the second pipe is connected to the water tank.

[0013] Furthermore, the rear end surface of the water tank is recessed forward to form a through groove, and the through groove is connected to the inner cavity of the water tank. A transparent plate with scale lines is installed in the through groove. A drain pipe with a switch valve is connected to the lower right end of the water tank, and a water filling pipe is installed in the middle of the upper end of the water tank.

[0014] Beneficial effects of the present invention:

[0015] 1. Through the semiconductor refrigeration plate, refrigeration shaping plate and shaping groove, the outer end surface of the product is fully in contact with the refrigeration shaping plate, so as to achieve rapid cooling and shaping of the product, effectively reduce the deformation of the product, effectively ensure the shape and size of the product, and improve the yield rate of the product.

[0016] 2. The upper serpentine groove and the lower serpentine groove form a serpentine channel, a water tank, a water pump, a first tube, a plurality of U-shaped tubes and a second tube to realize the circulation of the coolant and perform heat dissipation treatment on the lower part of the semiconductor refrigeration plate to ensure continuous refrigeration operation of the semiconductor refrigeration plate. The heat from the lower part of the semiconductor refrigeration plate will pass through the second heat sink and directly exchange heat with the flowing coolant, effectively reducing the resistance to heat and improving the heat dissipation effect.

[0017] 3. The refrigeration shaping plate is pushed backward by the electric push rod, L-shaped frame, rectangular rod and rectangular block, and swings downward under its own weight, and the refrigeration shaping plate is tilted by the magnetic plate, so that the refrigeration shaping plate is flipped, so that the cooled product in the shaping tank falls directly, so that the cooled product can be easily taken out, effectively reducing the probability of product damage and effectively ensuring the cooling effect.

[0018] 4. When the L-shaped frame moves backward, the rack will move backward, and through the rack, the first gear, the second shaft, the third gear, the second gear and the synchronous belt, multiple hammers will perform circular motion, and the multiple moving hammers will knock on the refrigeration shaping plate, so that the refrigeration shaping plate will vibrate, and auxiliary operations will be performed on the cooled products, effectively ensuring the normal material removal operation of the cooled products, and achieving linkage between the knocking operation and the pushing operation, effectively reducing the equipment cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Other features, objects and advantages of the present invention will become more apparent from the detailed description of non-limiting embodiments made with reference to the following drawings:

[0020] Figure 1 This is a structural schematic diagram of a refrigeration shaping device for injection molded parts according to the present invention;

[0021] Figure 2 A three-dimensional diagram of a refrigeration shaping device for injection molded parts according to the present invention;

[0022] Figure 3 This is a front view of a refrigeration shaping device for injection molded parts according to the present invention;

[0023] Figure 4 A cross-sectional view of a refrigeration shaping device for injection molded parts according to the present invention;

[0024] Figure 5 for Figure 3 Middle AA section view;

[0025] Figure 6 A three-dimensional diagram of a refrigeration shaping plate in a refrigeration shaping device for injection molded parts according to the present invention;

[0026] Figure 7 It is an assembly diagram of a first heat sink, a semiconductor refrigeration plate and a second heat sink in a refrigeration and shaping device for injection molded parts according to the present invention;

[0027] Figure 8 A three-dimensional diagram of a water tank in a refrigeration and shaping device for injection molded parts according to the present invention;

[0028] Fig. 9 It is an assembly diagram of a straight plate, a hammer head, a synchronous belt, a second gear and a third gear in a refrigeration shaping device for injection molded parts of the present invention;

[0029] Fig.10 The present invention is an assembly diagram of a straight plate, a first gear and a rack in a refrigeration shaping device for injection molded parts.

[0030] In the figure: 1, electric push rod, 2, first heat sink, 3, semiconductor refrigeration plate, 4, control electric box, 5, mounting plate, 6, refrigeration shaping plate, 7, rectangular block, 8, L-shaped frame, 9, straight plate, 21, second heat sink, 22, U-shaped tube, 23, upper serpentine groove, 24, lower serpentine groove, 31, magnetic plate, 32, L-shaped block, 41, water tank, 42, water pump, 43, first tube, 44, second tube, 61, shaping groove, 81, rectangular rod, 82, rack, 91, first gear, 92, hammer head, 93, synchronous belt, 94, second gear, 95, third gear. DETAILED DESCRIPTION

[0031] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0032] Embodiment 1: Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 6 and Figure 7 As shown, a refrigeration shaping device for injection molded parts is provided, including a control electric box 4, a plurality of straight plates 9 are equidistantly installed between the control electric box 4 and a mounting plate 5 located directly above the control electric box 4, and the plurality of straight plates 9 are used together to lift and install the mounting plate 5, and the mounting plate 5 is used to provide a mounting carrier for the first heat sink 2 and other components;

[0033] A plurality of first heat sinks 2 are equidistantly arranged on the upper end of the mounting plate 5, and a second heat sink 21 is mounted on the upper end of the first heat sink 2. The first heat sink 2 and the second heat sink 21 are used together to provide a mounting carrier for the semiconductor refrigeration plate 3 on the one hand, and to dissipate heat for the semiconductor refrigeration plate 3 on the other hand;

[0034] The semiconductor refrigeration plate 3 is arranged at the upper end of the second heat dissipation plate 21, and the refrigeration shaping plate 6 is cooled by the semiconductor refrigeration plate 3, and the refrigeration shaping plate 6 is attached to the upper end of the semiconductor refrigeration plate 3. The refrigeration shaping plate 6 provides a processing carrier for the shaping groove 61, and a plurality of shaping grooves 61 are formed on the upper end surface of the refrigeration shaping plate 6 by being recessed downward. The injection molded product can be shaped by the shaping grooves 61.

[0035] When in use, the circuit of the semiconductor refrigeration plate 3 is first turned on, and then the upper part of the semiconductor refrigeration plate 3 is refrigerated. Because the upper end of the semiconductor refrigeration plate 3 and the lower end of the refrigeration shaping plate 6 are in contact with each other, the low temperature generated by the semiconductor refrigeration plate 3 will cool the refrigeration shaping plate 6.

[0036] When the refrigeration shaping plate 6 is lowered to the set temperature, the injection molded product is taken out and placed in the shaping groove 61, so that the outer end surface of the product is fully in contact with the refrigeration shaping plate 6, so as to achieve rapid cooling and shaping of the product, effectively reduce the deformation of the product, effectively ensure the shape and size of the product, and improve the yield rate of the product.

[0037] Embodiment 2: During the refrigeration process of the semiconductor refrigeration plate 3, one side of the semiconductor refrigeration plate 3 will be hot while the other side will be cold, and the cold side will be attached to the lower end of the refrigeration shaping plate 6 to perform refrigeration operation. In order to ensure the normal operation of the semiconductor refrigeration plate 3, the hot side will generally be heat-dissipated. At present, the heat dissipation structure generally consists of a rack installed on the semiconductor refrigeration plate 3, a heat dissipation pipe arranged in the rack, and a conveying system connected to the heat dissipation pipe. However, during the heat dissipation process, the heat generated in the semiconductor refrigeration plate 3 must pass through the rack and the wall of the heat dissipation pipe to exchange heat with the coolant flowing in the heat dissipation pipe, causing the rack and the wall of the heat dissipation pipe to cause a large obstacle to the heat, which will affect the heat dissipation effect.

[0038] like Figure 1 , Figure 2 , Figure 4 , Figure 5 , Figure 7 and Figure 8 As shown, the upper end surface of the first heat sink 2 is depressed downward to form a lower serpentine groove 24, and the lower end surface of the second heat sink 21 is depressed upward to form an upper serpentine groove 23 connected to the upper end of the lower serpentine groove 24. The upper serpentine groove 23 cooperates with the lower serpentine groove 24 to provide a flow channel for the coolant;

[0039] A first joint located on the right side of the L-shaped block 32 and mounted on the rear end of the second heat sink 21 and connected to the inlet of the lower serpentine groove 24 and the inlet of the upper serpentine groove 23 is arranged on the right side of the rear end of the first heat sink 2, and coolant is transported into the serpentine channel formed by the upper serpentine groove 23 and the lower serpentine groove 24 through the first joint;

[0040] A second joint located on the left side of the L-shaped block 32 and mounted on the rear end of the second heat sink 21 and connected to the outlet of the lower serpentine groove 24 and the outlet of the upper serpentine groove 23 is arranged on the left side of the rear end of the second heat sink 21, and the coolant flowing in the serpentine channel formed by the upper serpentine groove 23 and the lower serpentine groove 24 is discharged through the second joint;

[0041] One end of a U-shaped tube 22 located between two adjacent first heat dissipation plates 2 and having the other end connected to the first joint is connected to the second joint, so that the adjacent first joints are connected to the second joints through the U-shaped tube 22;

[0042] A water tank 41 is installed at the rear end of the control box 4, and the water tank 41 is used to store the coolant. An extraction device is connected and arranged on the upper end of the water tank 41, and the coolant in the water tank 41 is extracted by the extraction device. The extraction device can be a water pump 42;

[0043] A first tube 43 whose other end is connected to the first joint on the far right is connected and arranged on the outlet of the extraction device, so that the extraction device is connected to the first joint on the far right through the first tube 43, and a second tube 44 whose other end is connected to the water tank 41 is connected and installed on the rear end of the second joint on the far left, so that the second joint on the far left is connected to the water tank 41 through the second tube 44;

[0044] The rear end surface of the water tank 41 is recessed forward to form a through groove connected to the inner cavity of the water tank 41. The through groove provides an installation space for the transparent plate. The transparent plate with scale lines is installed in the through groove. The situation in the water tank 41 can be observed intuitively through the transparent plate. A drain pipe with a switch valve is connected and arranged on the lower side of the right end of the water tank 41. The coolant in the water tank 41 is discharged through the drain pipe. Then a water filling pipe is connected and installed on the middle part of the upper end of the water tank 41. The coolant is added to the water tank 41 through the water filling pipe.

[0045] When the multiple semiconductor refrigeration plates 3 work synchronously, the lower parts of the multiple semiconductor refrigeration plates 3 will generate heat. At this time, the water pump 42 is started to extract the coolant in the water tank 41, and then the extracted coolant is transported to the serpentine channel formed by the upper serpentine groove 23 and the lower serpentine groove 24 on the far right through the first pipe 43;

[0046] The coolant is made to flow in the rightmost serpentine channel, and then the coolant is made to flow in order in the multiple serpentine channels through the multiple U-shaped tubes 22, and the coolant is made to flow back into the water tank 41 through the second tube 44, so as to realize the recycling of the coolant;

[0047] In addition, as the coolant flows in the serpentine channel, the coolant will exchange heat with the lower part of the corresponding semiconductor refrigeration plate 3, thereby dissipating heat from the lower part of the semiconductor refrigeration plate 3 to ensure that the semiconductor refrigeration plate 3 performs continuous refrigeration operation. During the heat dissipation process, the heat from the lower part of the semiconductor refrigeration plate 3 will pass through the second heat sink 21 and directly exchange heat with the flowing coolant, effectively reducing the resistance to heat and improving the heat dissipation effect.

[0048] Embodiment 3: A structure formed by using a semiconductor refrigeration plate 3, a refrigeration shaping plate 6 and a shaping groove 61 is used to quickly cool the newly-injected product. During the cooling process, the newly-injected product is generally placed in the shaping groove 61 for cooling. After the product is cooled, the product needs to be removed. Generally, an internal clamping method is used to remove the product from the shaping groove 61. However, this method is prone to falling back, making it difficult to remove the material. In addition, the internal clamping method has a high probability of damaging the product, which will affect the cooling effect.

[0049] In order to solve the above problems, Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the fixed parts of multiple telescopic devices alternately arranged with the straight plates 9 are equidistantly installed between the mounting plate 5 and the control electric box 4. The L-shaped frame 8 is driven to move forward and backward through the telescopic device. The telescopic device can use an electric push rod 1, and the rectangular block 7 whose lower end is hinged to the front end of the refrigeration shaping plate 6 is attached to the upper side of the front end of the refrigeration shaping plate 6. The refrigeration shaping plate 6 can be driven to move forward and backward through the rectangular block 7.

[0050] The rectangular rod 81 is installed on the middle part of the front end of the rectangular block 7, and the vertical part of the L-shaped frame 8 located on the front side of the control electric box 4 is set on the front end of the rectangular rod 81, and then the movable part of the telescopic device is connected to the rear end of the vertical part of the L-shaped frame 8. The rectangular rod 81 and the L-shaped frame 8 are used together to connect the rectangular block 7 and the telescopic device.

[0051] A plurality of vertically arranged L-shaped blocks 32 are located at the rear end of the semiconductor refrigeration plate 3 and their upper end faces coincide with the upper end face of the semiconductor refrigeration plate 3. The vertical portions of the blocks are equidistantly arranged on the rear end of the mounting plate 5. The L-shaped blocks 32 are used to avoid direct collision between the semiconductor refrigeration plate 3 and the refrigeration shaping plate 6. The magnetic plate 31 located below the lateral portion of the L-shaped block 32 is installed on the rear end of the vertical portion of the L-shaped block 32. The magnetic plate 31 is used to assist the refrigeration shaping plate 6 in discharging operations.

[0052] When in use, the product after injection molding is first taken out and placed in the shaping groove 61, so as to quickly cool and shape the product. After cooling, the electric push rod 1 is started, thereby driving the L-shaped frame 8 to move backward, so that the rectangular rod 81 moves backward, and then the rectangular block 7 moves backward, thereby pushing the refrigeration shaping plate 6 backward, and the refrigeration shaping plate 6 moves to the upper end of the L-shaped block 32 and continues to move;

[0053] When the cooling shaping plate 6 is separated from the L-shaped block 32, the rectangular block 7 is hinged to the cooling shaping plate 6, so the cooling shaping plate 6 swings downward under its own weight and swings to the rear end of the magnetic plate 31. At this time, the magnetic plate 31 generates an adsorption force on the cooling shaping plate 6.

[0054] Under the action of the adsorption force, the refrigeration shaping plate 6 is tilted, so that the opening of the shaping groove 61 faces backward and downward, and the refrigeration shaping plate 6 completes the flipping operation, so that the cooled product in the shaping groove 61 falls directly, so that the cooled product can be easily taken out, the probability of product damage is effectively reduced, and the cooling effect is effectively guaranteed.

[0055] Embodiment 4: The electric push rod 1, rectangular block 7, L-shaped frame 8 and rectangular rod 81 are used to flip the refrigeration shaping plate 6, so as to complete the material removal operation of the cooled product. However, adsorption is easily generated between the product and the shaping groove 61, resulting in a high probability that the cooled product is still in the shaping groove 61 after the refrigeration shaping plate 6 is flipped, which will affect the material removal operation.

[0056] In order to solve the above problems, Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Fig. 9 and Fig.10 As shown, the second gear 94 is meshed with the inner rear wall of the synchronous belt 93 located outside the telescopic device and on the left side of the straight plate 9, and the synchronous belt 93 is used to provide a mounting carrier for the hammer head 92, and the first shaft rotatably connected to the left end of the straight plate 9 is mounted on the right end of the second gear 94, and the second gear 94 is movably mounted between the straight plate 9 through the first shaft;

[0057] The third gear 95 is meshed with the inner front wall of the synchronous belt 93, and the second gear 94 is used in conjunction with the third gear 95 to make the synchronous belt 93 circulate, and the second shaft which is rotatably connected to the left end of the straight plate 9 and passes through the straight plate 9 is set on the right end of the third gear 95, and the third gear 95 and the straight plate 9 are movably installed through the second shaft, and then a plurality of hammer heads 92 located between the mounting plate 5 and the control electric box 4 are equidistantly set on the outer end of the synchronous belt 93, and the refrigeration shaping plate 6 can be knocked through the hammer heads 92;

[0058] The first gear 91 located between the straight plate 9 and the telescopic device is set on the right end of the second shaft. The second shaft is rotated through the first gear 91, and the rack 82 whose left end is slidably connected to the right end of the straight plate 9 and whose front end is connected to the rear end of the horizontal part of the L-shaped frame 8 is meshed with the lower end of the first gear 91. The first gear 91 is rotated through the rack 82.

[0059] When the L-shaped frame 8 moves backward, the rack 82 moves backward. Since the rack 82 meshes with the first gear 91, the backward movement of the rack 82 causes the first gear 91 to rotate, thereby causing the second shaft to rotate, thereby causing the third gear 95 to rotate, and with the assistance of the second gear 94, the synchronous belt 93 rotates, thereby causing the plurality of hammer heads 92 to circulate.

[0060] When the refrigeration shaping plate 6 swings downward, multiple moving hammer heads 92 will knock on the refrigeration shaping plate 6, thereby causing the refrigeration shaping plate 6 to vibrate, thereby performing auxiliary operations on the cooled products, effectively ensuring the normal material removal operations of the cooled products, and achieving linkage between the knocking operation and the pushing operation, effectively reducing equipment costs.

[0061] Although this specification is described according to implementation modes, not every implementation mode includes only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A refrigeration shaping device for injection molded parts, characterized in that: It comprises a control electric box (4), a mounting plate (5) is arranged directly above the control electric box (4), a plurality of fixing parts of telescopic devices are equidistantly installed between the mounting plate (5) and the control electric box (4), a heat sink is arranged at the upper end of the mounting plate (5), a plurality of semiconductor refrigeration plates (3) are equidistantly installed at the upper end of the heat sink, the upper end of the semiconductor refrigeration plate (3) is attached to a refrigeration shaping plate (6), the upper end surface of the refrigeration shaping plate (6) is recessed downward to form a plurality of shaping grooves (61), a circulation component is installed at the rear end of the control electric box (4), and the circulation component is arranged in communication with the heat sink; The upper side of the front end of the refrigeration shaping plate (6) is in contact with the rectangular block (7), and the lower end of the rectangular block (7) is hinged to the front end of the refrigeration shaping plate (6); a rectangular rod (81) is installed in the middle of the front end of the rectangular block (7); the vertical part of the L-shaped frame (8) is arranged at the front end of the rectangular rod (81), and the L-shaped frame (8) is located at the front side of the control electric box (4); the rear end of the vertical part of the L-shaped frame (8) is connected to the movable part of the telescopic device; the rear end of the horizontal part of the L-shaped frame (8) is provided with a functional part, and the functional part is installed between the mounting plate (5) and the control electric box (4); the functional part and the telescopic device are arranged alternately; The functional part comprises a straight plate (9), the straight plate (9) being mounted between the mounting plate (5) and the control electric box (4), a synchronous belt (93) being arranged on the left side of the straight plate (9), and the synchronous belt (93) being located outside the telescopic device, an inner rear wall of the synchronous belt (93) being meshed with a second gear (94), a first shaft being mounted on the right end of the second gear (94), and the first shaft being rotatably connected to the left end of the straight plate (9); The inner front wall of the synchronous belt (93) meshes with a third gear (95); a second shaft is arranged at the right end of the third gear (95); the second shaft is rotatably connected to the left end of the straight plate (9), and the second shaft penetrates the straight plate (9); a first gear (91) is arranged at the right end of the second shaft, and the first gear (91) is located between the straight plate (9) and the telescopic device; the lower end of the first gear (91) meshes with a rack (82), and the left end of the rack (82) is slidably connected to the right end of the straight plate (9); the front end of the rack (82) is connected to the rear end of the transverse part of the L-shaped frame (8); a plurality of hammer heads (92) are equidistantly arranged at the outer end of the synchronous belt (93), and the hammer heads (92) are located between the mounting plate (5) and the control electric box (4).

2. The injection molded part refrigeration shaping device according to claim 1, characterized in that: The rear end of the mounting plate (5) is equidistantly provided with vertical portions of a plurality of vertically arranged L-shaped blocks (32), and the L-shaped block (32) is located at the rear end of the semiconductor refrigeration plate (3), the upper end surface of the L-shaped block (32) coincides with the upper end surface of the semiconductor refrigeration plate (3), and a magnetic plate (31) is installed at the rear end of the vertical portion of the L-shaped block (32), and the magnetic plate (31) is located below the horizontal portion of the L-shaped block (32).

3. The injection molded part refrigeration shaping device according to claim 2, characterized in that: The heat sink comprises a plurality of first heat sinks (2), the plurality of first heat sinks (2) being equidistantly arranged on the upper end of a mounting plate (5), a second heat sink (21) being installed on the upper end of the first heat sink (2), the semiconductor refrigeration plate (3) being arranged on the upper end of the second heat sink (21), the upper end surface of the first heat sink (2) being concave downward to form a lower serpentine groove (24), the lower end surface of the second heat sink (21) being concave upward to form an upper serpentine groove (23), and the upper serpentine groove (23) being arranged in communication with the upper end of the lower serpentine groove (24); A first joint is provided on the right side of the rear end of the first heat sink (2), and the first joint is located on the right side of the L-shaped block (32); the first joint is mounted on the rear end of the second heat sink (21), the first joint is connected to the inlet of the lower serpentine groove (24) and the inlet of the upper serpentine groove (23), respectively; a second joint is provided on the left side of the rear end of the second heat sink (21), and the second joint is located on the left side of the L-shaped block (32); The second joint is mounted on the rear end of the second heat sink (21), the second joint is connected to the outlet of the lower serpentine groove (24) and the outlet of the upper serpentine groove (23) respectively, a U-shaped tube (22) is arranged between two adjacent first heat sinks (2), one end of the U-shaped tube (22) is connected to the second joint, and the other end of the U-shaped tube (22) is connected to the first joint.

4. The injection molded part refrigeration shaping device according to claim 3, characterized in that: The circulation component comprises a water tank (41), the water tank (41) being mounted on the rear end of the control electric box (4), the upper end of the water tank (41) being connected to an extraction device, the outlet of the extraction device being connected to a first pipe (43), the other end of the first pipe (43) being connected to a first joint located on the far right, the rear end of the second joint located on the far left being connected to a second pipe (44), the other end of the second pipe (44) being connected to the water tank (41).

5. The injection molded part refrigeration shaping device according to claim 4, characterized in that: The rear end surface of the water tank (41) is recessed forward to form a through groove, and the through groove is connected to the inner cavity of the water tank (41). A transparent plate with scale lines is installed in the through groove. A drainage pipe with a switch valve is connected to the lower side of the right end of the water tank (41), and a water supply pipe is connected to the middle part of the upper end of the water tank (41).

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