A microLED film side rotation attachment machine

Abstract

The present application relates to the technical field of screen film pasting, and in particular to a side rotary pasting machine for microLED film material, comprising a bottom plate, a mechanical arm arranged on the bottom plate, a vacuum suction cup arranged at the end of the mechanical arm, a spinner arranged on the bottom plate and located on one side of the mechanical arm, the spinner comprising a base arranged on the bottom plate, and a supporting inclined block symmetrically arranged on the side of the base facing the mechanical arm; when the flexible integrated circuit film is pasted on the side, the pressure sensor installed at the telescopic end of the vacuum suction cup and the adaptive cylinder is used to detect the pasting pressure in real time, so that the side is subjected to constant pressure during pasting, ensuring that the glass substrate will not cause corner collapse and cracks due to excessive local pressure during the pasting process, and the mechanical arm can adjust the pasting position and pasting angle at any time to ensure that the force-bearing surface is constantly perpendicular to the required pasting side during the pasting process, and ensure that there will be no bubble problem caused by uneven force during pasting.

Description

Technical Field

[0001] The present application relates to the technical field of screen film, and in particular to a side rotating attaching machine for microLED film material. Background Art

[0002] MicroLED screens are considered to be the next generation of display technology due to their high resolution and high brightness. Compared with traditional LED screens, microLED screens are smaller in size and have higher pixel density, so more sophisticated splicing is required during the production process. This splicing process requires the design and installation of FPC (flexible printed circuit board) to be different from traditional LED screens.

[0003] In microLED screens, the FPC (flexible circuit board) is usually designed at the bottom of the screen, rather than at one of the four sides of the screen like traditional LED screens. This is because the splicing process of the microLED screen requires more space at the edge of the screen for alignment and splicing. Designing the FPC (flexible circuit board) at the bottom of the screen can reduce the space occupied by the edge of the screen, thereby providing greater flexibility for splicing.

[0004] The existing scheme consists of a flexible integrated circuit film material taking platform, a pre-pressing platform, a flip-attachment arm, a side pressing platform, and a heating platform. The flip-attachment arm absorbs the flexible integrated circuit film and picks up the flexible integrated circuit film, and then sends it to the pre-pressing platform. During the process, the flexible integrated circuit film is heated, and after reaching a certain temperature, it is pre-pressed with the screen glass substrate. After the pre-pressing is completed, the arm picks up the product, and the side of the flexible integrated circuit film is rotated and pressed at the side pressing platform. The flexible integrated circuit film is heated during the pressing process. After the pressing is completed, the flip-attachment arm sends the screen glass substrate to the heating platform, and the screen glass substrate with the side attached is heated and pressed.

[0005] However, the above-mentioned prior art still has some defects when applying screen film:

[0006] 1. In the side flexible integrated circuit film bonding step, the flipping bonding arm and the platform bonding process completely rely on the displacement and rotation of the arm for bonding, and keep friction with the side pressing platform; the real-time pressure cannot be accurately calculated during the bonding process, which makes it easy for the glass substrate to be damaged or fall off during the bonding process.

[0007] 2. In the process of pre-pressing and side laminating, the existing flip-and-attach mechanism has no buffering means on the platform, and all buffering means are designed on the rotating arm, which leads to excessive movements of the rotating arm and unstable laminating accuracy.

[0008] 3. During production, the arm simultaneously completes actions such as film taking, pre-pressing, side pressing, heating and pressure holding, etc., which needs to meet the production requirements of the multi-step process for the arm platform, and the requirements for the arm platform design are too high.

[0009] Based on this, under the above-mentioned viewpoints, the existing technology still has room for improvement in the way of applying screen film. Summary of the invention

[0010] In order to solve the above technical problems, the present application provides a microLED film side rotating attachment machine, which adopts the following technical solutions:

[0011] A microLED film material side rotary attachment machine comprises a bottom plate, a mechanical arm is arranged on the bottom plate, a vacuum suction cup is arranged at the end of the mechanical arm, and a rotary attachment device located on one side of the mechanical arm is arranged on the bottom plate;

[0012] The spinner includes a base arranged on a bottom plate, a supporting inclined block is symmetrically arranged on the side of the base facing the mechanical arm, a connecting support plate is commonly arranged on the inclined surfaces of the two supporting inclined blocks, a sliding support plate is slidably arranged on the connecting support plate, and a spinner roller is rotatably arranged on the sliding support plate through a bracket.

[0013] Preferably, the spinner further comprises an adaptive cylinder arranged on the connecting support plate, and the telescopic end of the adaptive cylinder penetrates through the connecting support plate and is connected to the sliding support plate.

[0014] Preferably, the telescopic end of the adaptive cylinder is provided with a pressure sensor connected to the sliding support plate.

[0015] Preferably, a heating rod is provided inside the spin-sticking roller.

[0016] Preferably, a clamp is provided on the vacuum suction cup;

[0017] The clamp comprises a clamping bracket arranged on one side of the vacuum suction cup, a flip rod is rotatably arranged on the upper end of one side of the clamping bracket, a clamping support rod which is relatively perpendicular to the flip rod is arranged at one end of the flip rod, and a clamping support bracket is arranged at one end of the clamping support rod;

[0018] The clamping support frame is provided with a plurality of top blocks, and the vacuum suction cup is provided with a clamping piece through a bracket.

[0019] Preferably, the clamping member comprises a clamping cylinder arranged on one side of the vacuum suction cup through a bracket, a pin is arranged at the telescopic end of the clamping cylinder, and a connecting block connected to the flip rod is rotatably arranged on the pin;

[0020] A connecting rod rotatably connected to the pin shaft is rotatably arranged at the lower end of one side of the clamping bracket.

[0021] Preferably, the clamping bracket is symmetrically provided with an adjusting push rod threadedly connected thereto.

[0022] Preferably, a material preparation device is provided on the bottom plate;

[0023] The material preparation device comprises a pre-pressing platform slidably arranged on a chassis, and a loading platform is slidably arranged on the chassis.

[0024] Preferably, a pre-compression bracket is provided on the bottom plate, and a pre-compression support plate is slidably provided on one side of the pre-compression bracket;

[0025] A prestressing support located above the prestressing platform is slidably arranged on the prestressing support plate, sliding rods are symmetrically and slidably penetrated on the prestressing support, a clamping suction cup is commonly arranged at the lower ends of the two sliding rods, and a prestressing cylinder connected to the clamping suction cup is arranged on the prestressing support.

[0026] Preferably, a heating rod is embedded in the clamping suction cup.

[0027] In summary, the present application includes at least one of the following beneficial technical effects:

[0028] 1. When the flexible integrated circuit film is attached to the side, the pressure sensor installed at the telescopic end of the vacuum suction cup and the adaptive cylinder is used to detect the attachment pressure in real time, so that the side is subjected to constant pressure during attachment, ensuring that the glass substrate will not be chipped or cracked due to excessive local pressure during the attachment process. The robot arm can adjust the attachment position and attachment angle at any time to ensure that the force-bearing surface is constantly perpendicular to the required attachment side during the attachment process, and to ensure that bubbles caused by uneven force will not occur during attachment.

[0029] 2. When the flexible integrated circuit film of the present invention is attached to the side, the robot arm continuously adjusts the attachment angle and cooperates with the spinner to rotate so as to rotate the side of the flexible integrated circuit film and attach it to the screen glass substrate to cover the FPC (flexible circuit board) on one side of the screen glass substrate. After the attachment is completed, a heating and pressure-maintaining action will be performed for 10 to 15 seconds to ensure uniform pressure while reducing the friction generated by the rotation during the attachment process, thereby reducing the risk of damage to the flexible integrated circuit film during the attachment process.

[0030] 3. The present invention drives the adsorbed flexible integrated circuit film to move downward by clamping the suction cup. When the preheated flexible integrated circuit film is pressed onto the screen glass substrate of the pre-pressed lower platform, a pressure holding action of 10 to 15 seconds is simultaneously completed to press the flexible integrated circuit film onto the screen glass substrate, thereby improving the stability of the side flexible integrated circuit film bonding action. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a structural schematic diagram of the present invention.

[0032] Figure 2 It is a schematic diagram of the structure among the mechanical arm, the spinner and the material preparation device of the present invention.

[0033] Figure 3 It is a schematic diagram of the structure between the mechanical arm and the spinner of the present invention.

[0034] Figure 4 It is a structural schematic diagram of the hair spinner.

[0035] Figure 5 It is a schematic diagram of the structure between the mechanical arm and the gripper of the present invention.

[0036] Figure 6 It is a structural schematic diagram of the clamp of the present invention.

[0037] Figure 7 The present invention Figure 6 A partial enlarged view of point A.

[0038] Figure 8 It is a structural schematic diagram of the material preparation device of the present invention.

[0039] Fig. 9 It is a schematic diagram of the structure between the pre-pressing support plate, the pre-pressing support and the clamping suction cup of the present invention.

[0040] Fig.10 It is a cross-sectional view of the clamping suction cup of the present invention.

[0041] Explanation of reference numerals: 1, bottom plate; 2, mechanical arm; 21, vacuum suction cup; 3, spinner; 31, base; 32, support inclined block; 33, connecting support plate; 34, sliding support plate; 35, spinner roller; 36, adaptive cylinder; 37, pressure sensor; 38, heating rod; 4, clamp; 41, clamping bracket; 42, flip rod; 43, clamping support rod; 44, clamping support frame; 45, top block ; 5. Clamping part; 51. Clamping cylinder; 52. Pin shaft; 53. Connecting block; 54. Connecting rod; 55. Adjusting push rod; 6. Material preparation device; 61. Pre-pressing platform; 611. Pre-pressing suction cup; 62. Loading platform; 621. Loading suction cup; 63. Pre-pressing bracket; 64. Pre-pressing support plate; 65. Pre-pressing support; 66. Sliding rod; 67. Clamping suction cup; 68. Pre-pressing cylinder; 69. Heating rod. DETAILED DESCRIPTION

[0042] The following is combined with Figures 1 to 10 This application is described in further detail.

[0043] The embodiment of the present application discloses a microLED film side rotary attaching machine, which preheats the flexible integrated circuit film to increase the starting temperature of the flexible integrated circuit film during side attaching, thereby reducing the action time and holding time of the side attaching of the flexible integrated circuit film without affecting the attaching effect.

[0044] Embodiment 1:

[0045] Reference Figures 1 to 3 , a microLED film side rotating attachment machine includes a base plate 1.

[0046] When the flexible integrated circuit film is rotated and attached sideways, the flexible integrated circuit film is first preheated by the material preparation device 6 arranged on the bottom plate 1 to increase the starting temperature of the flexible integrated circuit film when the side is attached, and the action time and holding time of the side attachment of the flexible integrated circuit film are reduced without affecting the attachment effect. After preheating, visual photography is performed through the existing visual system to adjust the pre-pressing attachment position of the flexible integrated circuit film.

[0047] Then the screen glass substrate is moved to the visual photography station for visual photography alignment and the pre-pressing and attaching position of the screen glass substrate is adjusted. After the photography is completed, the preheated flexible integrated circuit film is pressed onto the screen glass substrate and the pressure holding action is completed for 10 to 15 seconds to press the flexible integrated circuit film onto the screen glass substrate. At this time, the flexible integrated circuit film is located on one side of the FPC (flexible circuit board) on the screen glass substrate, and a part of the flexible integrated circuit film is attached to the screen glass substrate, and the other half is in a hollow position, thereby completing the material preparation.

[0048] Afterwards, the material preparation device 6 moves the screen glass substrate with the flexible integrated circuit film attached to the material picking position of the robot arm 2 set on the base plate 1, and then the robot arm 2 uses the pre-pressed screen glass substrate with the flexible integrated circuit film attached to be adsorbed onto the vacuum suction cup 21 set at the end of the robot arm 2 to complete the material picking.

[0049] During the material picking process, the clamper 4 arranged on the vacuum suction cup 21 performs an evasive action. After the screen glass substrate with the flexible integrated circuit film attached is adsorbed by the vacuum suction cup 21, the clamper 4 clamps the screen glass substrate with the flexible integrated circuit film attached on the vacuum suction cup 21 of the robot arm 2, making it more stable when performing the side flexible integrated circuit film bonding action.

[0050] Then, after the vacuum suction cup 21 of the robot arm 2 adsorbs the screen glass substrate with the flexible integrated circuit film attached, it will move to the spinner 3 located on one side of the robot arm 2 on the bottom plate 1 to perform the side flexible integrated circuit film attachment operation.

[0051] When the flexible integrated circuit film is being attached to the side, the robot arm 2 continuously adjusts the attachment angle and cooperates with the spinner 3 to rotate so as to realize the side rotation attachment of the flexible integrated circuit film to the screen glass substrate, covering the FPC (flexible circuit board) on one side of the screen glass substrate; after the attachment is completed, a heating and pressure holding action will be performed for 10 to 15 seconds. At this time, the robot arm 2 remains still and controls the constant pressure to perform the pressure holding action. After the bonding and pressure holding actions are completed, the robot arm 2 places the screen glass substrate in the unloading area, thereby completing the side rotation attachment of the flexible integrated circuit film on one side.

[0052] Reference Figure 3 and Figure 4 Specifically, the spinner 3 includes a base 31 arranged on the bottom plate 1, and a supporting inclined block 32 is symmetrically arranged on the side of the base 31 facing the robot arm 2, and a connecting support plate 33 is commonly arranged on the inclined surfaces of the two supporting inclined blocks 32, and a sliding support plate 34 is slidably arranged on the connecting support plate 33.

[0053] When the vacuum suction cup 21 of the robot 2 adsorbs the screen glass substrate with the flexible integrated circuit film attached, the clamper 4 first makes an evasive action. At this time, part of the flexible integrated circuit film will leak out of the vacuum suction cup 21. After that, the screen glass substrate with the flexible integrated circuit film attached is adsorbed by the vacuum suction cup 21. The clamper 4 clamps the screen glass substrate with the flexible integrated circuit film attached on the vacuum suction cup 21 of the robot 2, making it more stable when performing the side flexible integrated circuit film bonding action, and then moves to the rotation bonding roller 35 on the sliding support plate 34 which is rotated by the bracket.

[0054] Then, the angle of the vacuum suction cup 21 is adjusted by the robot arm 2 so that the side of the screen glass substrate to be attached is perpendicular to the attachment surface of the spin-attachment roller 35. After the adjustment is completed, the vacuum suction cup 21 is driven by the robot arm 2 to press the flexible integrated circuit film attached to the side of the screen glass substrate to the roller surface of the spin-attachment roller 35, and the side of the flexible integrated circuit film is rotated and attached.

[0055] During the attachment process, the robot arm 2 can continuously adjust the attachment angle and rotate with the roller surface of the spin-stick roller 35, that is, the flexible integrated circuit film attached to the side of the screen glass substrate is pressed onto the roller surface, and the vacuum suction cup 21 is driven by the robot arm 2 to make the side of the screen glass substrate contact with the roller surface of the spin-stick roller 35, and then rotate around the roller surface of the spin-stick roller 35. During the rotation process, since the spin-stick roller 35 is resisted, the spin-stick roller 35 will rotate and flip along with the rotation of the screen glass substrate, so that the flexible integrated circuit film will be pressed onto the side of the screen glass substrate by the roller surface of the spin-stick roller 35, covering the FPC (flexible circuit board) on one side of the screen glass substrate; at the same time, the rotation of the spin-stick roller 35 can reduce the friction between the flexible integrated circuit film and the bonding surface during the bonding process, thereby avoiding damage to the flexible integrated circuit film.

[0056] After the attachment is completed, a heating and pressure-maintaining action will be performed for 10 to 15 seconds. At this time, the robot arm 2 remains stationary and controls a constant pressure to perform a pressure-maintaining action to make the flexible integrated circuit film in close contact with the screen glass substrate; at this time, a heating rod 38 and a thermocouple (not shown) are arranged in the spin-stick roller 35, and the outer side of the spin-stick roller 35 is constructed to detect the temperature of the spin-stick roller 35 in real time. The installation position of the spin-stick roller 35 is a bearing installation, which can rotate freely, thereby reducing the friction between the flexible integrated circuit film and the bonding surface during the bonding process, and avoiding damage to the flexible integrated circuit film. During the process of attaching, pressurizing and heating the bottom surface of the flexible integrated circuit film, the robot arm 2 can drive the product to press the spin-stick roller 35 and move back and forth to ensure uniform heating and pressure-maintaining force.

[0057] Reference Figure 4 Among them, the adaptive cylinder 36 is set on the connecting support plate 33, and the telescopic end of the adaptive cylinder 36 penetrates the connecting support plate 33 and is connected to the sliding support plate 34.

[0058] During this process, when the side bonding action is performed, the adaptive cylinder 36 can drive the sliding support plate 34 to move on the connecting support plate 33 to perform buffering, thereby ensuring that the bonding pressure value does not suddenly increase and cause the glass substrate to break.

[0059] The telescopic end of the adaptive cylinder 36 is provided with a pressure sensor 37 connected to the sliding support plate 34. The pressure sensor 37 can monitor the bonding pressure of the flexible integrated circuit film during the flipping and bonding process in real time, and feed back to the robot arm 2 so that it can make real-time action adjustments. In conjunction with the robot arm 2, it can drive the product to move back and forth on the spin-bonding roller 35, further ensuring that the flexible integrated circuit film is evenly heated and pressure-maintained.

[0060] After the bonding and pressure-maintaining actions are all completed, the robot arm 2 places the screen glass substrate in the unloading area, thereby completing the side rotation attachment of the flexible integrated circuit film on one side.

[0061] Reference Figures 5 to 7 , wherein the clamper 4 includes a clamping bracket 41 arranged on one side of the vacuum suction cup 21.

[0062] When the vacuum suction cup 21 of the robot arm 2 adsorbs the screen glass substrate with the flexible integrated circuit film attached, the clamping member 5 set on the vacuum suction cup 21 through the bracket will be started first, and the clamping member 5 will force the flip rod 42 set on the upper end of one side of the clamping bracket 41 to rotate around the rotation point. The flip rod 42 is flipped outward from the vacuum suction cup 21 under the compulsion of the clamping member 5, and the flip rod 42 will drive the clamping support rod 43 set at one end of the flip rod 42 and which is relatively perpendicular to it to flip together, and the clamping support rod 43 drives the clamping support frame 44 set at one end thereof to flip outward from the bottom of the vacuum suction cup 21 to make an evasive action, and then the screen glass substrate with the flexible integrated circuit film attached is adsorbed by the vacuum suction cup 21.

[0063] Subsequently, the clamping member 5 is started again, and the clamping member 5 will force the flip rod 42 set on the clamping bracket 41 to rotate around the rotation point. The flip rod 42 will flip into the vacuum suction cup 21 under the compulsion of the clamping member 5, and the flip rod 42 will drive the clamping support rod 43 set at one end of the flip rod 42 and which is relatively perpendicular to it to flip together. The clamping support rod 43 drives the clamping support frame 44 set at one end thereof to flip toward the bottom of the vacuum suction cup 21, and a plurality of top blocks 45 set on the clamping support frame 44 are used to contact the screen glass substrate with the flexible integrated circuit film attached from the bottom of the vacuum suction cup 21, so that the screen glass substrate with the flexible integrated circuit film attached is clamped on the vacuum suction cup 21 of the robot arm 2, so that it is more stable when performing the side flexible integrated circuit film bonding action, and then moves to the rotation bonding roller 35 set on the sliding support plate 34 through the rotation of the bracket.

[0064] Continue to refer to Figures 5 to 7 Among them, the clamping member 5 includes a clamping cylinder 51 provided on one side of the vacuum suction cup 21 through a bracket. By starting the clamping cylinder 51, the clamping cylinder 51 will drive the pin 52 provided at the telescopic end of the clamping cylinder 51, and the connecting block 53 rotatably provided on the pin 52 is driven by the pin 52, and the flip rod 42 is driven by the connecting block 53 connected to the flip rod 42, so that the flip rod 42 is flipped to drive the clamping bracket 44 to perform avoidance and clamping actions.

[0065] A connecting rod 54 rotatably connected to a pin shaft 52 is rotatably provided at the lower end of one side of the clamping bracket 41. The connecting rod 54 ensures the flexibility and accuracy of the clamping action. When the clamping bracket 41 clamps the screen glass substrate, the rotatable connection between the connecting rod 54 and the pin shaft 52 can provide stable support to prevent the substrate from moving or tilting during the attachment process, thereby ensuring the stability and consistency of the attachment process.

[0066] Each time the clamping bracket 44 is clamped, the lower end of the adjusting top rod 55 symmetrically arranged on the clamping bracket 41 will contact the clamping bracket 44. Through the threaded connection with the clamping bracket 41, the adjusting top rod 55 can be moved up and down finely, thereby adjusting the clamping force of the top block 45 on the screen glass substrate.

[0067] Reference Figures 8 to 10 Specifically, the material preparation device 6 includes a pre-pressing platform 61 slidably arranged on the chassis, and a pre-pressing bracket 63 is arranged on the bottom plate 1.

[0068] When rotating the flexible integrated circuit film sideways, first place the screen glass substrate on the pre-pressing platform 61 where the pre-pressing suction cup 611 is provided, and perform preliminary positioning through manual or mechanical correction. At the same time, a loading platform 62 is slidably provided on the chassis, and the flexible integrated circuit film is placed on the loading suction cup 621 provided on the loading platform 62. Then, the pre-pressing platform 61 and the loading platform 62 respectively move the screen glass substrate and the flexible integrated circuit film from the loading position to the working position. The pre-pressing suction cup 611 and the loading suction cup 621 can prevent the screen glass substrate and the flexible integrated circuit film from falling off during the movement.

[0069] Afterwards, by driving the pre-stressing support plate 64 slidingly arranged on one side of the pre-stressing bracket 63 to move, the pre-stressing support plate 64 drives the pre-stressing support 65 slidingly arranged on the pre-stressing support plate 64 and located above the pre-stressing platform 61 to move together, and the pre-stressing support 65 is symmetrically and slidably provided with sliding rods 66, and the pre-stressing support 65 will drive the clamping suction cup 67 jointly arranged at the lower ends of the two sliding rods 66 to move to just above the flexible integrated circuit film on the loading platform 62.

[0070] Subsequently, by driving the pre-stressing support 65 to move on the pre-stressing support plate 64, the pre-stressing cylinder 68 connected to the clamping suction cup 67 arranged on the pre-stressing support 65 is started, and the telescopic end of the pre-stressing cylinder 68 is extended, which will drive the clamping suction cup 67 to press on the flexible integrated circuit film on the loading platform 62, and then the loading suction cup 621 releases the flexible integrated circuit film, and then the clamping suction cup 67 adsorbs the flexible integrated circuit film, and then the telescopic end of the pre-stressing cylinder 68 retracts, which will drive the clamping suction cup 67 to press and lift the adsorbed flexible integrated circuit film from the loading platform 62. At this time, the loading platform 62 moves to the loading position.

[0071] At the same time, by driving the pre-stressing bracket 63 to move the pre-stressing support 65 together, the pre-stressing support 65 will drive the clamping suction cup 67 jointly arranged at the lower ends of the two sliding rods 66, so that the clamping suction cup 67 adsorbs the flexible integrated circuit film and moves it to the visual photography station to perform the lower visual photography alignment and adjust the pre-stressing attachment position of the flexible integrated circuit film. After the photography is completed, the clamping suction cup 67 adsorbs the flexible integrated circuit film and moves it to the pre-stressing platform 61 just above the side of the screen glass substrate.

[0072] During this process, the heating rod 69 embedded in the clamping suction cup 67 will heat the clamping suction cup 67, and preheat the flexible integrated circuit film through the clamping suction cup 67, thereby increasing the starting temperature of the flexible integrated circuit film during side bonding, thereby reducing the action time and holding time of side bonding of the flexible integrated circuit film without affecting the bonding effect.

[0073] After the clamping suction cup 67 moves with the flexible integrated circuit film adsorbed to the top of the screen glass substrate on the pre-pressing platform 61, the pre-pressing support 65 is driven to move on the pre-pressing support plate 64, and the telescopic end of the pre-pressing cylinder 68 is extended, so that the clamping suction cup 67 drives the adsorbed flexible integrated circuit film to move downward, and the preheated flexible integrated circuit film is pressed onto the screen glass substrate on the pre-pressing lower platform, and the pressure-maintaining action is completed for 10 to 15 seconds, so that the flexible integrated circuit film is pressed onto the screen glass substrate.

[0074] After the pre-pressing is completed, the clamping suction cup 67 releases the flexible integrated circuit film, and then drives the pre-pressing support 65 to move on the pre-pressing support plate 64, cooperates with the retraction of the telescopic end of the pre-pressing cylinder 68 to drive the clamping suction cup 67 to lift, and drives the pre-pressing support 65 to move together by driving the pre-pressing bracket 63, so that the pre-pressing support 65 drives the clamping suction cup 67 to move to the avoidance position.

[0075] After that, after the screen glass substrate with the flexible integrated circuit film attached is sucked up by the vacuum suction cup 21, the clamping support 44 flips outward from the bottom of the vacuum suction cup 21 to make an evasive action, and the vacuum suction cup 21 is controlled by the robot arm 2 to suck the pre-pressed suction cup 611 to complete the attachment of the flexible integrated circuit film to the screen glass substrate, and at the same time, the pre-pressed suction cup 611 releases the screen glass substrate with the flexible integrated circuit film attached.

[0076] After the screen glass substrate with the flexible integrated circuit film attached is sucked up by the vacuum suction cup 21, the pre-pressing platform 61 drives the pre-pressing suction cup 611 to move to the loading position for avoidance, and the clamping support frame 44 flips toward the bottom of the vacuum suction cup 21, and through a plurality of top blocks 45 arranged on the clamping support frame 44, the screen glass substrate with the flexible integrated circuit film attached is pressed from the bottom of the vacuum suction cup 21, so that the screen glass substrate with the flexible integrated circuit film attached is clamped on the vacuum suction cup 21 of the robot arm 2, so that it is more stable when performing the side flexible integrated circuit film bonding action, and then moves to the rotation bonding roller 35 arranged on the sliding support plate 34 through the rotation of the bracket to perform the side rotation bonding of the flexible integrated circuit film.

[0077] The implementation principle of the present invention is:

[0078] (1) When rotating the flexible integrated circuit film on the side, first place the screen glass substrate on the pre-pressing platform 61 provided with a pre-pressing suction cup 611, and perform preliminary positioning through manual or mechanical correction. At the same time, a loading platform 62 is slidably provided on the chassis, and the flexible integrated circuit film is placed on the loading suction cup 621 provided on the loading platform 62.

[0079] (2) Subsequently, by driving the pre-pressing support 65 to move on the pre-pressing support plate 64, the pre-pressing cylinder 68 connected to the clamping suction cup 67 provided on the pre-pressing support 65 is coordinated, and the clamping suction cup 67 is designed to absorb the flexible integrated circuit film on the loading platform 62, and move to the visual photography station, perform the visual photography alignment, and adjust the pre-pressing attachment position of the flexible integrated circuit film. After the photography is completed, the clamping suction cup 67 absorbs the flexible integrated circuit film and moves to the pre-pressing platform 61 just above one side of the screen glass substrate.

[0080] (3) Then, by driving the pre-pressing support 65 to move on the pre-pressing support plate 64 and coordinating with the extension of the telescopic end of the pre-pressing cylinder 68, the clamping suction cup 67 drives the adsorbed flexible integrated circuit film to move downward, and the pre-heated flexible integrated circuit film is pressed onto the screen glass substrate of the pre-pressing lower platform, and the pressure holding action is completed for 10 to 15 seconds, so that the flexible integrated circuit film is pressed onto the screen glass substrate.

[0081] (5) After the screen glass substrate to which the flexible integrated circuit film is attached is sucked up by the vacuum suction cup 21, the clamping support frame 44 flips outward from the bottom of the vacuum suction cup 21 to make an evasive action, and the vacuum suction cup 21 is controlled by the robot arm 2 to suck the screen glass substrate to which the flexible integrated circuit film is attached by the pre-pressing suction cup 611, and at the same time, the pre-pressing suction cup 611 releases the screen glass substrate to which the flexible integrated circuit film is attached.

[0082] (6) After the screen glass substrate with the flexible integrated circuit film attached is sucked up by the vacuum suction cup 21, the pre-pressing platform 61 drives the pre-pressing suction cup 611 to move to the loading position for avoidance, and the clamping support frame 44 is turned toward the bottom of the vacuum suction cup 21. Through the plurality of top blocks 45 provided on the clamping support frame 44, the screen glass substrate with the flexible integrated circuit film attached is pressed from the bottom of the vacuum suction cup 21, so that the screen glass substrate with the flexible integrated circuit film attached is clamped on the vacuum suction cup 21 of the robot arm 2, making it more stable when performing the side flexible integrated circuit film bonding action.

[0083] (7) Then, the angle of the vacuum suction cup 21 is adjusted by the robot arm 2 so that the side of the screen glass substrate to be attached is perpendicular to the attachment surface of the spin-attachment roller 35. After the adjustment is completed, the vacuum suction cup 21 is driven by the robot arm 2 to press the flexible integrated circuit film attached to the side of the screen glass substrate onto the roller surface of the spin-attachment roller 35, and the side of the flexible integrated circuit film is rotated and attached.

[0084] (8) During the attachment process, the robot arm 2 can continuously adjust the attachment angle to press the flexible integrated circuit film attached to the side of the screen glass substrate onto the roller surface. The robot arm 2 drives the vacuum suction cup 21 to make the side of the screen glass substrate contact with the roller surface of the spin-attach roller 35, and then rotate around the roller surface of the spin-attach roller 35. During the rotation process, since the spin-attach roller 35 is resisted, the spin-attach roller 35 will rotate and flip along with the rotation of the screen glass substrate, so that the flexible integrated circuit film will be pressed onto the side of the screen glass substrate by the roller surface of the spin-attach roller 35, covering the FPC (flexible circuit board) on one side of the screen glass substrate.

[0085] (9) After the attachment is completed, a heating and pressure-maintaining action will be performed for 10 to 15 seconds. At this time, the robot arm 2 remains stationary and controls a constant pressure to perform a pressure-maintaining action so that the flexible integrated circuit film is in close contact with the screen glass substrate; at this time, a heating rod 38 and a thermocouple are arranged in the spin-to-stick roller 35, and the outer side of the spin-to-stick roller 35 is structured so that the temperature of the spin-to-stick roller 35 can be monitored in real time. The spin-to-stick roller 35 is installed at a bearing position and can rotate freely, thereby reducing the friction between the flexible integrated circuit film and the bonding surface during the bonding process and avoiding damage to the flexible integrated circuit film. During the process of attaching the flexible integrated circuit film to the bottom surface and maintaining pressure and heating, the robot arm 2 can drive the product to press the spin-to-stick roller 35 and move back and forth to ensure uniform heating and pressure-maintaining force.

[0086] (10) After the bonding and pressure-holding operations are completed, the robot arm 2 places the screen glass substrate in the unloading area, thereby completing the side rotation bonding of the flexible integrated circuit film on one side.

[0087] The embodiments of this specific implementation method are all preferred embodiments of the present invention, and are not intended to limit the protection scope of the present invention. Therefore, any equivalent changes made based on the structure, shape, and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A microLED film side rotation attachment machine, comprising a base plate (1), on which a mechanical arm (2) is arranged, characterized in that: A vacuum suction cup (21) is arranged at the end of the mechanical arm (2), and a spinner (3) located on one side of the mechanical arm (2) is arranged on the bottom plate (1); the spinner (3) comprises a base (31) arranged on the bottom plate (1), support inclined blocks (32) are symmetrically arranged on the base (31) on one side facing the mechanical arm (2), a connecting support plate (33) is commonly arranged on the inclined surfaces of the two supporting inclined blocks (32), a sliding support plate (34) is slidably arranged on the connecting support plate (33), and a spinner roller (35) is rotatably arranged on the sliding support plate (34) through a bracket; An adaptive cylinder (36) is provided on the connecting support plate (33), a telescopic end of the adaptive cylinder (36) penetrates the connecting support plate (33) and is connected to the sliding support plate (34), and a pressure sensor (37) connected to the sliding support plate (34) is provided at the telescopic end of the adaptive cylinder (36).

2. The microLED film side rotating attachment machine according to claim 1, characterized in that: A heating rod (38) is arranged inside the spin-sticking roller (35).

3. The microLED film side rotation attaching machine according to claim 1, characterized in that: The vacuum suction cup (21) is provided with a clamp (4); the clamp (4) comprises a clamping bracket (41) provided on one side of the vacuum suction cup (21); a flip rod (42) is rotatably provided on the upper end of one side of the clamping bracket (41); a clamping support rod (43) which is relatively perpendicular to the flip rod (42) is provided at one end of the flip rod (42); a clamping support frame (44) is provided at one end of the clamping support rod (43); a plurality of top blocks (45) are provided on the clamping support frame (44); and a clamping member (5) is provided on the vacuum suction cup (21) via the bracket.

4. The microLED film side rotation attaching machine according to claim 3, characterized in that: The clamping member (5) comprises a clamping cylinder (51) arranged on one side of the vacuum suction cup (21) through a bracket, a pin shaft (52) being arranged at the telescopic end of the clamping cylinder (51), a connecting block (53) being rotatably arranged on the pin shaft (52) and being connected to the flip rod (42); and a connecting rod (54) being rotatably arranged on the lower end of one side of the clamping bracket (41) and being rotatably connected to the pin shaft (52).

5. The microLED film side rotation attaching machine according to claim 3, characterized in that: The clamping bracket (41) is symmetrically provided with an adjusting push rod (55) threadedly connected thereto.

6. The microLED film side rotation attaching machine according to claim 1, characterized in that: A material preparation device (6) is provided on the bottom plate (1); the material preparation device (6) comprises a pre-pressing platform (61) slidably provided on the chassis, and a material loading platform (62) is slidably provided on the chassis.

7. The microLED film side rotation attaching machine according to claim 6, characterized in that: A pre-stressing bracket (63) is arranged on the bottom plate (1), and a pre-stressing support plate (64) is slidably arranged on one side of the pre-stressing bracket (63); a pre-stressing support seat (65) located above the pre-stressing platform (61) is slidably arranged on the pre-stressing support plate (64), sliding rods (66) are symmetrically and slidably arranged on the pre-stressing support seat (65), a clamping suction cup (67) is commonly arranged at the lower ends of the two sliding rods (66), and a pre-stressing cylinder (68) connected to the clamping suction cup (67) is arranged on the pre-stressing support seat (65).

8. The microLED film side rotation attaching machine according to claim 7, characterized in that: A heating rod (69) is embedded in the clamping suction cup (67).

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