PCB board manufacturing method, device, electronic equipment, and storage medium

Abstract

The present invention discloses a PCB manufacturing method, device, electronic device, and storage medium, and relates to the technical field of circuit boards. The method comprises: obtaining a copper-clad substrate; drilling holes in the functional area and test area of ​​the copper-clad substrate; cleaning the drilled copper-clad substrate by a cleaning machine; attaching a photosensitive dry film to both sides of the cleaned copper-clad substrate by a film laminating machine; exposing the copper-clad substrate after laminating by an exposure machine; developing the exposed copper-clad substrate by a developing machine; electroplating and etching the developed copper-clad substrate to form circuits in the functional area and test area of ​​the copper-clad substrate; solder masking the copper-clad substrate to form a PCB board; cutting the test area to form slices, and detecting the parameters of the PCB board according to the slices. The PCB manufacturing method according to the embodiment of the present invention can improve production efficiency and reduce production costs.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit boards, and in particular to a method, device, electronic equipment and storage medium for manufacturing a PCB board. Background Art

[0002] The production process of circuit boards involves many production processes and multiple production machines. Therefore, during the production process, the circuit boards need to be transferred between each process / machine. In order to improve the production efficiency and quality of circuit boards, it is necessary to improve the transfer efficiency of circuit boards between each process / machine, as well as the production efficiency and quality of circuit boards in each process. At the same time, after the circuit boards are produced, it is necessary to test various parameters of the circuit boards, such as aperture, line width, copper thickness and other parameters, to ensure that the quality of the produced circuit boards meets the requirements. At present, in order to test the various parameters of the circuit boards, some circuit boards are usually selected from the batch products produced as samples for testing, which will cause these circuit boards used as samples to be scrapped, resulting in product waste and increased costs. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a PCB board manufacturing method, device, electronic device, and storage medium, which can improve production efficiency and reduce production costs.

[0004] On the one hand, the PCB manufacturing method according to the embodiment of the present invention is applied to a PCB manufacturing device, wherein the PCB manufacturing device includes a drilling machine, a cleaning machine, a film laminating machine, an exposure machine, and a developing machine. The PCB manufacturing method includes the following steps:

[0005] Obtain a copper-clad substrate, place a flat pad under the copper-clad substrate, and place a heat sink above the copper-clad substrate; the copper-clad substrate includes a functional area and a test area;

[0006] Placing the heat sink, the copper-clad substrate and the flat pad on the drilling machine, and drilling holes in the functional area and the test area of ​​the copper-clad substrate;

[0007] The copper-clad substrate after drilling is subjected to abrasive belt brushing by the cleaning machine to clean the surface and the inside of the hole of the copper-clad substrate, and the copper-clad substrate is subjected to high-pressure water washing, ultrasonic cleaning and chemical washing;

[0008] Attaching photosensitive dry films to both sides of the copper-clad substrate by the film laminating machine;

[0009] After exposing one side of the copper-clad substrate by the exposure machine, turning over the copper-clad substrate, and then exposing the other side of the copper-clad substrate;

[0010] Developing the exposed copper-clad substrate;

[0011] Electroplating and etching the developed copper-clad substrate to form circuits in the functional area and the test area of ​​the copper-clad substrate;

[0012] Performing solder resistance on the copper-clad substrate to form a PCB board;

[0013] The test area is cut to form slices, and the parameters of the PCB board are detected according to the slices.

[0014] According to some embodiments of the present invention, the drilling machine includes a machine platform, the machine platform is provided with a workbench and a mobile grabbing device located above the workbench, a first drill box, a second drill box and a first detection device are provided on the workbench, a second detection device is provided on the mobile grabbing device, and a plurality of drill bits are placed in the first drill box;

[0015] The step of placing the heat sink, the copper-clad substrate and the flat pad on a drilling machine and drilling holes in the functional area and the test area of ​​the copper-clad substrate comprises:

[0016] Placing the heat sink, the copper-clad substrate and the flat pad on the workbench;

[0017] The mobile grasping device moves to the first drill bit box to grasp the drill bit, and detects the size of the drill bit through the first detection device;

[0018] When the first detection device detects that the size of the drill bit meets the requirement, the mobile grasping device drills holes in the functional area and the test area of ​​the copper clad substrate through the drill bit;

[0019] When the drill bit has drilled a preset number of times, or when the second detection device detects that the size of the drill bit does not meet the requirements, the mobile grasping device places the drill bit into the second drill bit box and replaces a new drill bit in the first drill bit box.

[0020] According to some embodiments of the present invention, the exposure machine includes a first exposure device, a flip device, and a second exposure device, and the first exposure device, the flip device, and the second exposure device are connected through a first conveyor belt;

[0021] After exposing one side of the copper-clad substrate, turning over the copper-clad substrate, and then exposing the other side of the copper-clad substrate comprises:

[0022] After the first exposure device exposes one side of the copper-clad substrate, the first exposure device is transferred to the flipping device via the first conveyor belt;

[0023] The turning device turns over the copper-clad substrate, and then conveys the turned copper-clad substrate to the second exposure device through the first conveyor belt;

[0024] The second exposure device exposes the other surface of the copper-clad substrate.

[0025] According to some embodiments of the present invention, the laminating machine is connected to the exposure machine via a second conveyor belt, a conveying device is provided on the second conveyor belt, the conveying device comprises a roller, and a plurality of bearing platforms distributed on the roller in a circular array, each of the bearing platforms comprises a plurality of bearing columns distributed at intervals;

[0026] After the step of attaching the photosensitive dry film to both sides of the copper-clad substrate by the film attaching machine, the method further includes:

[0027] The laminating machine conveys the copper-clad substrate to the corresponding carrying platform on the conveying device through the second conveyor belt;

[0028] The copper-clad substrate on the carrier is transferred to the exposure machine by the rotation of the roller.

[0029] According to some embodiments of the present invention, the cleaning machine includes a loading mechanism and a plurality of cleaning mechanisms; the loading mechanism includes a placement table for placing the copper-clad substrate, a moving device for driving the placement table to move, an adsorption mechanism for adsorbing the copper-clad substrate, a turning table for driving the copper-clad substrate on the adsorption mechanism to turn over, and a third conveyor belt for conveying the copper-clad substrate on the turning table to the cleaning mechanism, and a barb is provided at the bottom of the turning table;

[0030] The step of using the cleaning machine to perform abrasive belt brushing on the copper-clad substrate after drilling to clean the surface and the inside of the hole of the copper-clad substrate, and performing high-pressure water washing, ultrasonic cleaning and chemical washing on the copper-clad substrate includes:

[0031] The moving device drives the placement platform to move toward the adsorption mechanism;

[0032] After the adsorption mechanism adsorbs one of the copper-clad substrates on the placement table to the turning table, the turning table carries the copper-clad substrate via the barb, and the adsorption mechanism releases the copper-clad substrate on the turning table;

[0033] The turning table turns the copper-clad substrate from vertical to horizontal and places it on the third conveyor belt;

[0034] The third conveyor belt sequentially conveys the copper-clad substrate to the plurality of cleaning mechanisms for abrasive belt brushing to clean the surface and the inside of the holes of the copper-clad substrate, and performs high-pressure water washing, ultrasonic cleaning and chemical washing on the copper-clad substrate.

[0035] According to some embodiments of the present invention, the exposure machine and the developer are connected via a fourth conveyor belt and a fifth conveyor belt, and a detachable connection portion is provided between the fourth conveyor belt and the fifth conveyor belt.

[0036] According to some embodiments of the present invention, the step of detecting parameters of the PCB board according to the slices includes:

[0037] placing the slice in a sleeve;

[0038] Pouring crystal glue into the sleeve so that the crystal glue covers the slice, and curing the crystal glue to obtain a piece to be tested;

[0039] After grinding and polishing the surface of the piece to be inspected, the aperture, line width and copper thickness of the slice are measured under an inspection mirror.

[0040] On the other hand, a PCB manufacturing device according to an embodiment of the present invention includes a drilling machine, a cleaning machine, a film laminating machine, an exposure machine and a developing machine, and the PCB manufacturing device is used to implement the PCB manufacturing method described in the above-mentioned embodiment.

[0041] On the other hand, an electronic device according to an embodiment of the present invention includes:

[0042] A memory for storing program instructions;

[0043] The processor is used to call the program instructions stored in the memory and execute the PCB board manufacturing method of the above embodiment according to the obtained program instructions.

[0044] On the other hand, according to the storage medium of the embodiment of the present invention, the storage medium stores computer executable instructions, and the computer executable instructions are used to enable a computer to execute the PCB board manufacturing method described in the above embodiment.

[0045] The PCB manufacturing method, device, electronic device, and storage medium according to the embodiments of the present invention have at least the following beneficial effects: by placing a flat pad under the copper-clad substrate and a heat sink above the copper-clad substrate, the drilling accuracy is improved and the copper-clad substrate is protected; by dividing the copper-clad substrate into a functional area and a test area, the test area can be used to test various parameters of the finally manufactured PCB board to ensure that the quality of the PCB board meets the requirements; at the same time, since the functional area and the test area are separated, cutting the test area separately will not affect the PCB board, thereby preventing product waste and reducing production costs.

[0046] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0048] Figure 1 A flowchart of the steps of the PCB board manufacturing method according to an embodiment of the present invention;

[0049] Figure 2 A schematic structural diagram of a drilling machine according to an embodiment of the present invention;

[0050] Figure 3 It is a structural schematic diagram of a feeding mechanism according to an embodiment of the present invention;

[0051] Figure 4 It is a structural schematic diagram of a film laminating machine according to an embodiment of the present invention;

[0052] Figure 5 It is a structural schematic diagram of an exposure machine according to an embodiment of the present invention;

[0053] Reference numerals:

[0054] Drilling machine 100, machine platform 110, workbench 120, mobile grabbing device 130, first drill box 140, second drill box 150, first detection device 160, second detection device 170;

[0055] Film laminating machine 200, second conveyor belt 210, conveying device 220, roller 221, supporting column 222;

[0056] A feeding mechanism 300, a placing table 310, a moving device 320, an adsorption mechanism 330, a turning table 340, a third conveyor belt 350, a third detection device 360, and a clamping plate 370;

[0057] Exposure machine 400 , first exposure device 410 , turning device 420 , suction cup 421 , second exposure device 430 , first conveyor belt 440 . DETAILED DESCRIPTION

[0058] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and are not to be construed as limitations on the present application. For the step numbers in the following embodiments, they are only provided for the convenience of explanation, and the order between the steps is not limited in any way, and the execution order of each step in the embodiment can be adaptively adjusted according to the understanding of those skilled in the art.

[0059] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0060] The terms "first", "second", "third" and "fourth" etc. in the specification and claims of the present invention and the drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units that are not listed, or may optionally include other steps or units that are inherent to these processes, methods, products or devices.

[0061] Reference to "embodiments" in the present invention means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present invention. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0062] The production process of circuit boards involves many production processes and multiple production machines. Therefore, during the production process, the circuit boards need to be transferred between each process / machine. In order to improve the production efficiency and quality of circuit boards, it is necessary to improve the transfer efficiency of circuit boards between each process / machine, as well as the production efficiency and quality of circuit boards in each process. At the same time, after the circuit boards are produced, it is necessary to test various parameters of the circuit boards, such as aperture, line width, copper thickness and other parameters, to ensure that the quality of the produced circuit boards meets the requirements. At present, in order to test the various parameters of the circuit boards, some circuit boards are usually selected from the batch products produced as samples for testing, which will cause these circuit boards used as samples to be scrapped, resulting in product waste and increased costs.

[0063] To this end, the embodiments of the present invention provide a PCB manufacturing method, device, electronic device and storage medium. By placing a flat pad under the copper-clad substrate and a heat sink above the copper-clad substrate, the drilling accuracy is improved and the copper-clad substrate is protected. By dividing the copper-clad substrate into a functional area and a test area, the test area can be used to test various parameters of the finally manufactured PCB to ensure that the quality of the PCB meets the requirements. At the same time, since the functional area and the test area are separated, cutting the test area separately will not affect the PCB, thereby preventing product waste and reducing production costs. By optimizing the connection method between each machine and the working method of each machine, the production efficiency is improved.

[0064] The following is combined with Figure 1-5 , describes in detail the PCB board manufacturing method, device, electronic device and storage medium of the embodiments of the present invention.

[0065] On the one hand, an embodiment of the present invention provides a PCB board manufacturing method, which is applied to a PCB board manufacturing device, wherein the PCB board manufacturing device includes a drilling machine 100, a cleaning machine, a film laminating machine 200, an exposure machine 400 and a developing machine, such as Figure 1 As shown, the PCB board manufacturing method includes the following steps:

[0066] Step S100: obtaining a copper-clad substrate, placing a flat pad under the copper-clad substrate, and placing a heat sink above the copper-clad substrate; the copper-clad substrate includes a functional area and a test area;

[0067] It should be noted that in this example, the copper-clad substrate refers to a substrate made of common materials such as FR4 for making PCB boards; the copper-clad substrate is divided into a functional area and a test area, wherein the functional area is the area for making the circuits required for the final PCB board, and the test area is the area for making the circuits used to test the various parameters of the PCB board. After the PCB board is made, the test area needs to be cut off from the copper-clad substrate separately, so as to detect the various parameters of the final produced circuit board based on the test results of the test area to ensure that the quality of the circuit board meets the requirements.

[0068] After the copper-clad substrate is prepared, it is necessary to drill holes in the copper-clad substrate. Before drilling, a flat pad is placed under the copper-clad substrate, and a heat sink is placed above the copper-clad substrate. The flat substrate ensures that the copper-clad substrate is placed flat on the drilling machine 100 to prevent the copper-clad substrate from deforming and affecting the accuracy of drilling. The heat sink dissipates heat from the copper-clad substrate to prevent the surface temperature of the copper-clad substrate from being too high and being damaged during the drilling process. The heat sink can be made of a material with heat conduction function such as an aluminum plate.

[0069] Step S200: placing the heat sink, copper-clad substrate and flat pad on the drilling machine 100, and drilling holes in the functional area and the test area of ​​the copper-clad substrate;

[0070] Specifically, after the heat sink, copper-clad substrate and flat pad are placed from top to bottom, the whole is placed on the drilling machine 100 for drilling, so that holes are drilled in both the functional area and the test area of ​​the copper-clad substrate. The purpose of drilling holes in the functional area of ​​the copper-clad substrate is to form the holes required for the final PCB board; and the purpose of drilling holes in the test area is to subsequently detect whether the aperture meets the requirements. Since the functional area and the test area are drilled under the same conditions, by detecting the aperture of the test area, it can be known whether the aperture of the functional area meets the requirements.

[0071] Step S300: using a cleaning machine to perform abrasive belt brushing on the copper-clad substrate after drilling to clean the surface and the inside of the hole of the copper-clad substrate, and performing high-pressure water washing, ultrasonic cleaning and chemical washing on the copper-clad substrate;

[0072] Specifically, after drilling the copper-clad substrate, since some impurities and dust will be on the copper-clad substrate, it is necessary to clean the copper-clad substrate with a cleaning machine, clean the surface and the inside of the copper-clad substrate by means of abrasive belts and brushes, and then perform high-pressure water washing, ultrasonic cleaning and chemical washing on the copper-clad substrate to ensure that the copper-clad substrate is clean and tidy to avoid affecting subsequent processes.

[0073] Step S400: attaching a photosensitive dry film to both sides of the copper-clad substrate by using a film attaching machine 200;

[0074] Step S500: after exposing one side of the copper-clad substrate by an exposure machine, the copper-clad substrate is turned over, and then the other side of the copper-clad substrate is exposed;

[0075] Step S600: developing the exposed copper-clad substrate;

[0076] Step S700: electroplating and etching the developed copper-clad substrate to form circuits in the functional area and the test area of ​​the copper-clad substrate;

[0077] Step S800: solder resisting the copper-clad substrate to form a PCB board;

[0078] Step S900: cutting the test area to form slices, and detecting parameters of the PCB board according to the slices.

[0079] Specifically, after drilling and cleaning the copper-clad substrate, a photosensitive dry film is attached to both sides of the copper-clad substrate by a film attaching machine 200, and then, after first exposing one side of the copper-clad substrate by an exposure machine, the copper-clad substrate is turned over, and then the other side of the copper-clad substrate is exposed, and after exposure, the copper-clad substrate is developed, and finally the developed copper-clad substrate is electroplated and etched, so as to form circuits in the functional area and the test area of ​​the copper-clad substrate. It should be noted that the circuit is made in the functional area of ​​the copper-clad substrate in order to form the circuit required for the final PCB board; and the circuit is made in the test area of ​​the copper-clad substrate in order to subsequently detect whether the parameters such as line width and copper thickness meet the requirements. Since the functional area and the test area are made under the same conditions, the circuits of the two do not have to be exactly the same, but the line width and copper thickness of the two will be the same, so by detecting the parameters such as the line width and copper thickness of the test area, it can be known whether the parameters such as the line width and copper thickness of the functional area meet the requirements. Therefore, in the end, only the test area needs to be cut separately to form slices, and the various parameters of the PCB board can be detected according to the slices.

[0080] Since the test area and the functional area are separated, cutting the test area will not affect the functional area and will not cause the circuit board used for testing to be scrapped, thereby achieving the purpose of saving production costs and avoiding waste of manufactured products.

[0081] like Figure 2As shown, further, in some embodiments of the present invention, the drilling machine 100 includes a machine platform 110, the machine platform 110 is provided with a workbench 120 and a mobile grabbing device 130 located above the workbench 120, the workbench 120 is provided with a first drill box 140, a second drill box 150 and a first detection device 160, the mobile grabbing device 130 is provided with a second detection device 170, and a plurality of drill bits are placed in the first drill box 140. Among them, the workbench 120 is used to place the copper-clad substrate to be drilled, and the mobile grabbing device 130 is used to grab the drill bit from the first drill box 140, and move it to the corresponding position to drill the copper-clad substrate. It should be noted that in order to ensure that the drill bit grabbed meets the drilling requirements, after the mobile grabbing device 130 grabs the drill bit, the drill bit needs to be moved to the first detection device 160 to detect whether the size of the drill bit meets the drilling requirements. Only after confirming that the size of the drill bit meets the requirements will the drill bit be used for drilling. If it is detected that the size of the drill bit does not meet the requirements, the drill bit will be placed in the second drill bit box 150, and a new drill bit will be grabbed from the first drill bit box 140 to avoid the grabbing of a defective drill bit. At the same time, since the drill bit will be worn to a certain extent during the period of drilling holes in the copper-clad substrate, the drill bit has a certain service life. For this reason, the present application also uses a second detection device 170 located on the side of the drill bit on the mobile grasping device 130 to detect the degree of wear of the drill bit used for drilling in real time. When the number of drilling times of the drill bit reaches a preset number, or when the second detection device 170 detects that the degree of wear of the drill bit reaches a preset degree, the drill bit is scrapped, and the mobile grasping device 130 puts the drill bit back into the second drill bit box 150, grabs a new drill bit from the first drill bit box 140, and repeats the above operation. By providing the first detection device 160 and the second detection device 170, it is ensured that the size of the drill bit meets the requirements, thereby improving the accuracy of drilling. It should be noted that if Figure 2 As shown, a plurality of workstations are arranged on the workbench 120, and each workstation can be used to drill a copper-clad substrate, thereby achieving drilling of a plurality of copper-clad substrates at the same time, thereby improving production efficiency.

[0082] Therefore, in this example, the above step S200: placing the heat sink, the copper-clad substrate and the flat pad on the drilling machine 100, and drilling holes in the functional area and the test area of ​​the copper-clad substrate, specifically includes the following four steps:

[0083] (1) placing a heat sink, a copper-clad substrate and a flat pad on a workbench 120;

[0084] (2) The mobile grasping device 130 moves to the first drill bit box 140 to grasp the drill bit, and the size of the drill bit is detected by the first detection device 160;

[0085] (3) When the first detection device 160 detects that the size of the drill bit meets the requirements, the mobile grasping device 130 uses the drill bit to drill holes in the functional area and the test area of ​​the copper clad substrate;

[0086] (4) When the drill bit has drilled a preset number of times, or when the second detection device 170 detects that the size of the drill bit does not meet the requirements, the mobile grasping device 130 places the drill bit into the second drill bit box 150 and replaces the drill bit with a new one in the first drill bit box 140.

[0087] like Figure 3 As shown, further, in some embodiments of the present invention, the cleaning machine includes a feeding mechanism 300 and a plurality of cleaning mechanisms (not shown); the feeding mechanism 300 includes a placement table 310 for placing a copper-clad substrate, a moving device 320 for driving the placement table 310 to move, an adsorption mechanism 330 for adsorbing the copper-clad substrate, a flipping table 340 for driving the copper-clad substrate on the adsorption mechanism 330 to flip, and a third conveyor belt 350 for conveying the copper-clad substrate on the flipping table 340 to the cleaning mechanism, and a barb is provided at the bottom of the flipping table 340. Specifically, after drilling holes in the copper-clad substrate, the copper-clad substrate needs to be cleaned to keep the copper-clad substrate clean and tidy. When cleaning the copper-clad substrate, multiple copper-clad substrates are placed on the placement table 310, and then the moving device 320 drives the placement table 310 to move as a whole toward the direction of the adsorption mechanism 330; wherein the moving device 320 can be a common structure such as a conveyor belt or a screw drive. The suction mechanism 330 is provided with a plurality of suction nozzles and a telescopic device for driving the suction nozzles to extend and retract. When the placement table 310 gradually approaches the suction mechanism 330, the telescopic device drives the plurality of suction nozzles to move toward the placement table 310, thereby adsorbing one of the outermost copper-clad substrates on the placement table 310. Then, the telescopic device drives the suction nozzles to move in the opposite direction, so that the copper-clad substrate on the suction nozzles is exactly located on the barb of the turning table 340. Subsequently, the suction nozzle releases the copper-clad substrate, and the turning table 340 is turned over, so that the copper-clad substrate is horizontally placed on the third conveyor belt 350, so that the third conveyor belt 350 conveys the copper-clad substrate to the cleaning mechanism for cleaning. In addition, a third detection device 360 ​​and a clamp 370 are provided on the third conveyor belt 350. The third detection device 360 ​​is used to detect the thickness of the copper-clad substrate, so as to adjust the working parameters of the subsequent cleaning mechanism according to the thickness of the copper-clad substrate. There are two clamps 370, which are located on both sides of the third conveyor belt 370. When the copper-clad substrate moves to the clamp 370, the two clamps 370 move toward each other to clamp and adjust the copper-clad substrate so that the copper-clad substrate enters the subsequent cleaning mechanism in a suitable posture.

[0088] By setting the feeding mechanism 300, it is possible to automatically transfer multiple copper-clad substrates to the cleaning mechanism for cleaning in sequence, thereby improving the cleaning efficiency of the copper-clad substrates. At the same time, in this example, the multiple cleaning mechanisms include a first grinding brush machine, a second grinding brush machine, a high-pressure water washer, an ultrasonic cleaning machine, and a drug washing machine. After the feeding mechanism 300 feeds the copper-clad substrate, it is transferred to the first grinding brush machine, and the first grinding brush machine performs a sanding belt grinding on the surface of the copper-clad substrate to clean the surface of the copper-clad substrate. Then, the copper-clad substrate is transferred to the second grinding brush machine, and the second grinding brush machine performs a grinding on the holes of the copper-clad substrate to clean the holes of the copper-clad substrate. Then, the copper-clad substrate is transferred to the high-pressure water washer for high-pressure water washing, and then the copper-clad substrate is transferred to the ultrasonic cleaning machine for ultrasonic cleaning, and then the copper-clad substrate is transferred to the drug washing machine for drug washing, thereby ensuring that the copper-clad substrate is clean and tidy, avoiding affecting the subsequent processes and affecting the quality of the product.

[0089] Therefore, in this example, the above step S300: using a cleaning machine to perform abrasive belt brushing on the copper-clad substrate after drilling to clean the surface and the inside of the hole of the copper-clad substrate, and performing high-pressure water washing, ultrasonic cleaning and chemical washing on the copper-clad substrate, specifically includes the following four steps:

[0090] (1) The moving device 320 drives the placement table 310 to move toward the adsorption mechanism 330;

[0091] (2) After the adsorption mechanism 330 adsorbs a copper-clad substrate on the placement table 310 to the turning table 340, the turning table 340 carries the copper-clad substrate through the barbs, and the adsorption mechanism 330 releases the copper-clad substrate on the turning table 340;

[0092] (3) The turning table 340 turns the copper-clad substrate from vertical to horizontal and places it on the third conveyor belt 350;

[0093] (4) The third conveyor belt 350 sequentially conveys the copper-clad substrate to a plurality of cleaning mechanisms for abrasive belt brushing to clean the surface and the inside of the holes of the copper-clad substrate, and performs high-pressure water washing, ultrasonic cleaning and chemical washing on the copper-clad substrate.

[0094] like Figure 4As shown, further, in some embodiments of the present invention, after the copper-clad substrate is cleaned, it is necessary to send the copper-clad substrate to the film laminating machine 200 to laminat e both sides of the copper-clad substrate. The film laminating machine 200 is connected to the exposure machine 400 via a second conveyor belt 210, and a conveying device 220 is provided on the second conveyor belt 210. The conveying device 220 includes a roller 221 and a plurality of bearing platforms distributed in a ring array on the roller 221, and each bearing platform includes a plurality of bearing columns 222 distributed at intervals. Specifically, a plurality of bearing columns 222 are provided on the roller 221, and a plurality of bearing columns 222 located on the same horizontal line constitute a bearing platform, which can carry a copper-clad substrate, and a plurality of bearing platforms can be formed around the surface of the roller 221, which can simultaneously carry a plurality of copper-clad substrates. After the film laminating machine 200 has finished laminating, the copper-clad substrate needs to be conveyed to the exposure machine through the second conveyor belt 210. During this process, the copper-clad substrate will pass through the conveying device 220. When there are multiple copper-clad substrates on the conveying device, the multiple bearing columns 222 on each bearing platform can carry a copper-clad substrate, and the copper-clad substrate can be gradually moved toward the exposure machine through the rotation of the roller 221. By setting up the conveying device 220, it is possible to simultaneously convey multiple copper-clad substrates and avoid the mutual influence of multiple copper-clad substrates. At the same time, it also plays a certain protective role on the copper-clad substrates.

[0095] Therefore, in this example, after the above step S400: attaching the photosensitive dry film to both sides of the copper clad substrate by the film attaching machine, the following two steps are also included:

[0096] (1) The laminating machine 200 conveys the copper-clad substrate to the corresponding carrying platform on the conveying device 220 via the second conveyor belt 210;

[0097] (2) The copper-clad substrate on the carrier is transferred to the exposure machine 400 by rotating the roller 221 .

[0098] like Figure 5 As shown, further, in some embodiments of the present invention, the exposure machine 400 includes a first exposure device 410, a flipping device 420, and a second exposure device 430, and the first exposure device 410, the flipping device 420, and the second exposure device 430 are connected through a first conveyor belt 440. The above-mentioned step S500: after exposing one side of the copper-clad substrate, turning the copper-clad substrate over, and then exposing the other side of the copper-clad substrate, includes the following three steps:

[0099] (1) After the first exposure device 410 exposes one side of the copper-clad substrate, it is transferred to the flipping device 420 via the first conveyor belt 440;

[0100] (2) The turning device 420 turns over the copper-clad substrate, and then the turned copper-clad substrate is conveyed to the second exposure device 430 via the first conveyor belt 440;

[0101] (3) The second exposure device 430 exposes the other surface of the copper-clad substrate.

[0102] Specifically, the flipping device 420 may include two groups of suction cups 421 arranged above the copper-clad substrate and arranged up and down. After the first exposure device 410 exposes one side of the copper-clad substrate, the lower suction cup 421 sucks the copper-clad substrate through the suction cup 421 of the flipping device 420, and then the copper-clad substrate is flipped; then, the upper suction cup 421 sucks the copper-clad substrate, and the copper-clad substrate is placed on the first conveyor belt 440, and is conveyed to the second exposure device 430 through the first conveyor belt 440, and the other side of the copper-clad substrate is exposed through the second exposure device 430.

[0103] Furthermore, in some embodiments of the present invention, the exposure machine 400 is connected to the developer through a fourth conveyor belt and a fifth conveyor belt, and a detachable connection portion is provided between the fourth conveyor belt and the fifth conveyor belt. Since many machines are required to make PCB boards, and each machine is relatively large, they need to be connected through a conveyor belt. In order to prevent the conveyor belt from taking up too much space, in this example, the fourth conveyor belt and the fifth conveyor belt are connected through a detachable connection portion. During operation, the fourth conveyor belt and the fifth conveyor belt are connected together. When there is no need to convey the substrate, the fourth conveyor belt and the fifth conveyor belt can be disassembled to provide a space for operators to pass through.

[0104] Further, in some embodiments of the present invention, the above step: the step of detecting the parameters of the PCB board according to the slices, includes the following three steps:

[0105] (1) Place the slice in the sleeve;

[0106] (2) pouring crystal glue into the sleeve so that the crystal glue covers the slice, and curing the crystal glue to obtain the piece to be tested;

[0107] (3) After grinding and polishing the surface of the test piece, measure the aperture, line width and copper thickness of the slice under the inspection microscope.

[0108] Specifically, after the production of the PCB board is completed, in order to detect various parameters of the PCB board, the test area is cut separately to form slices, and then the slices are placed in a sleeve, and crystal glue is poured into the sleeve to make the crystal glue cover the slices, and the crystal glue is cured so that the slices are fixed in the crystal glue to obtain the part to be tested. Then, after grinding and polishing the surface of the part to be tested, the slices inside the crystal glue can be clearly viewed, and the aperture, line width and copper thickness of the slices are measured under the detection microscope, so as to obtain various parameters of the PCB board and realize the quality inspection of the PCB board.

[0109] According to the PCB manufacturing method of the embodiment of the present invention, a flat pad is placed under the copper-clad substrate and a heat sink is placed above the copper-clad substrate to improve drilling accuracy and protect the copper-clad substrate; the copper-clad substrate is divided into a functional area and a test area, so that the test area can be used to test various parameters of the finally manufactured PCB board to ensure that the quality of the PCB board meets the requirements; at the same time, since the functional area and the test area are separated, cutting off the test area alone will not affect the PCB board, thereby preventing product waste and reducing production costs; and production efficiency is improved by optimizing the connection method between various machines and the working method of each machine.

[0110] On the other hand, an embodiment of the present invention further proposes a PCB board manufacturing device, including a drilling machine 100, a cleaning machine, a film laminating machine 200, an exposure machine 400 and a developing machine. The PCB board manufacturing device is used to implement the PCB board manufacturing method described in the above-mentioned embodiment.

[0111] It should be noted that the contents of the above method embodiments are all applicable to the present device embodiments, the functions specifically implemented by this embodiment are the same as those of the above method embodiments, and the beneficial effects achieved are also the same as those achieved by the above method embodiments.

[0112] On the other hand, an embodiment of the present invention further provides an electronic device, including:

[0113] A memory for storing program instructions;

[0114] The processor is used to call the program instructions stored in the memory and execute the above-mentioned PCB board manufacturing method according to the obtained program instructions.

[0115] The processor may be implemented by a general-purpose central processing unit (CPU), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of the present application;

[0116] The memory can be implemented in the form of a read-only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM). The memory can store an operating system and other application programs. When the technical solution provided in the embodiment of this specification is implemented by software or firmware, the relevant program code is stored in the memory, and the processor calls and executes the PCB board manufacturing method of the embodiment of this application; the memory and the processor can be connected through a bus, etc.

[0117] On the other hand, an embodiment of the present invention further provides a storage medium, which is a computer-readable storage medium and stores a computer program. When the computer program is executed by a processor, the above-mentioned PCB board manufacturing method is implemented.

[0118] As a non-transient computer-readable storage medium, the memory can be used to store non-transient software programs and non-transient computer executable programs. In addition, the memory may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage devices. In some embodiments, the memory may optionally include a memory remotely arranged relative to the processor, and these remote memories may be connected to the processor via a network. Examples of the above-mentioned networks include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and a combination thereof. The device embodiments described above are merely schematic, wherein the units described as separate components may or may not be physically separated, and are implemented to be located in one place, or may also be distributed to multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the present embodiment.

[0119] Although specific embodiments are described herein, those of ordinary skill in the art will recognize that many other modifications or alternative embodiments are also within the scope of the present disclosure. For example, any of the functions and / or processing capabilities described in conjunction with a particular device or component may be performed by any other device or component. In addition, although various exemplary implementations and architectures have been described according to embodiments of the present disclosure, those of ordinary skill in the art will recognize that many other modifications to the exemplary implementations and architectures described herein are also within the scope of the present disclosure.

[0120] Some aspects of the present disclosure are described above with reference to the block diagram and flow chart of the system, method, system and / or computer program product according to the exemplary embodiments.It should be understood that the combination of one or more blocks in the block diagram and the flow chart and the blocks in the block diagram and the flow chart can be realized by executing computer executable program instructions respectively.Equally, according to some embodiments, some blocks in the block diagram and the flow chart may not need to be executed in the order shown, or may not need to be executed in full.In addition, additional components and / or operations beyond those components and / or operations shown in the blocks in the block diagram and the flow chart may be present in certain embodiments.

[0121] Therefore, the blocks in the block diagrams and flow charts support the combination of devices for performing the specified functions, the combination of elements or steps for performing the specified functions, and the program instruction devices for performing the specified functions. It should also be understood that each block in the block diagrams and flow charts and the combination of blocks in the block diagrams and flow charts can be implemented by a special-purpose hardware computer system or a combination of special-purpose hardware and computer instructions that performs a specific function, element or step.

[0122] The program modules, applications, etc. described herein may include one or more software components, including, for example, software objects, methods, data structures, etc. Each such software component may include computer-executable instructions that, in response to execution, cause at least a portion of the functionality described herein (e.g., one or more operations of the illustrative methods described herein) to be performed.

[0123] Software components can be encoded with any of various programming languages. An exemplary programming language can be a low-level programming language, such as an assembly language associated with a specific hardware architecture and / or an operating system platform. The software component comprising assembly language instructions may need to be converted to executable machine code by an assembler before being executed by hardware architecture and / or platform. Another exemplary programming language can be a higher-level programming language, which can be transplanted across multiple architectures. The software component comprising a higher-level programming language may need to be converted to an intermediate representation by an interpreter or a compiler before execution. Other examples of programming languages ​​include but are not limited to macro languages, shells or command languages, job control languages, scripting languages, database queries or search languages ​​or report writing languages. In one or more exemplary embodiments, the software component comprising the instruction of one of the above-mentioned programming language examples can be directly executed by an operating system or other software components, without first being converted into another form.

[0124] Software components may be stored as files or other data storage structures. Software components of similar type or related functions may be stored together, such as in a specific directory, folder, or library. Software components may be static (e.g., preset or fixed) or dynamic (e.g., created or modified at execution time).

[0125] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A method for manufacturing a PCB board, characterized in that: Applicable to a PCB board manufacturing device, the PCB board manufacturing device includes a drilling machine, a cleaning machine, a film laminating machine, an exposure machine and a developing machine, the drilling machine includes a machine platform, the machine platform is provided with a workbench and a mobile grabbing device located above the workbench, the workbench is provided with a first drill box, a second drill box and a first detection device, the mobile grabbing device is provided with a second detection device, and a plurality of drill bits are placed in the first drill box; The PCB board manufacturing method comprises the following steps: Obtain a copper-clad substrate, place a flat pad under the copper-clad substrate, and place a heat sink above the copper-clad substrate; the copper-clad substrate includes a functional area and a test area; Placing the heat sink, the copper-clad substrate and the flat pad on the drilling machine, and drilling holes in the functional area and the test area of ​​the copper-clad substrate; The copper-clad substrate after drilling is subjected to abrasive belt brushing by the cleaning machine to clean the surface and the inside of the hole of the copper-clad substrate, and the copper-clad substrate is subjected to high-pressure water washing, ultrasonic cleaning and chemical washing; Attaching photosensitive dry films to both sides of the copper-clad substrate by the film laminating machine; After exposing one side of the copper-clad substrate by the exposure machine, turning over the copper-clad substrate, and then exposing the other side of the copper-clad substrate; Developing the exposed copper-clad substrate by the developer; Electroplating and etching the developed copper-clad substrate to form circuits in the functional area and the test area of ​​the copper-clad substrate; Performing solder resistance on the copper-clad substrate to form a PCB board; Cutting the test area to form slices, and detecting parameters of the PCB board according to the slices; The step of placing the heat sink, the copper-clad substrate and the flat pad on a drilling machine and drilling holes in the functional area and the test area of ​​the copper-clad substrate comprises: Placing the heat sink, the copper-clad substrate and the flat pad on the workbench; The mobile grasping device moves to the first drill bit box to grasp the drill bit, and detects the size of the drill bit through the first detection device; When the first detection device detects that the size of the drill bit meets the requirement, the mobile grasping device drills holes in the functional area and the test area of ​​the copper clad substrate through the drill bit; When the drill bit has drilled a preset number of times, or when the second detection device detects that the size of the drill bit does not meet the requirements, the mobile grasping device places the drill bit into the second drill bit box and replaces a new drill bit in the first drill bit box.

2. The PCB manufacturing method according to claim 1, characterized in that: The exposure machine comprises a first exposure device, a flip device and a second exposure device, wherein the first exposure device, the flip device and the second exposure device are connected via a first conveyor belt; After exposing one side of the copper-clad substrate, turning over the copper-clad substrate, and then exposing the other side of the copper-clad substrate comprises: After the first exposure device exposes one side of the copper-clad substrate, the first exposure device is transferred to the flipping device via the first conveyor belt; The turning device turns over the copper-clad substrate, and then conveys the turned copper-clad substrate to the second exposure device through the first conveyor belt; The second exposure device exposes the other surface of the copper-clad substrate.

3. The PCB manufacturing method according to claim 1, characterized in that: The laminating machine is connected to the exposure machine via a second conveyor belt, a conveying device is provided on the second conveyor belt, the conveying device comprises a roller, and a plurality of bearing platforms distributed on the roller in a circular array, each of the bearing platforms comprises a plurality of bearing columns distributed at intervals; After the step of attaching the photosensitive dry film to both sides of the copper-clad substrate by the film attaching machine, the method further includes: The laminating machine conveys the copper-clad substrate to the corresponding carrying platform on the conveying device through the second conveyor belt; The copper-clad substrate on the carrier is transferred to the exposure machine by the rotation of the roller.

4. The PCB manufacturing method according to claim 1, characterized in that: The cleaning machine comprises a feeding mechanism and a plurality of cleaning mechanisms; the feeding mechanism comprises a placing table for placing the copper-clad substrate, a moving device for driving the placing table to move, an adsorption mechanism for adsorbing the copper-clad substrate, a turning table for driving the copper-clad substrate on the adsorption mechanism to turn over, and a third conveyor belt for conveying the copper-clad substrate on the turning table to the cleaning mechanism, and a barb is provided at the bottom of the turning table; The step of using the cleaning machine to perform abrasive belt brushing on the copper-clad substrate after drilling to clean the surface and the inside of the hole of the copper-clad substrate, and performing high-pressure water washing, ultrasonic cleaning and chemical washing on the copper-clad substrate includes: The moving device drives the placement platform to move toward the adsorption mechanism; After the adsorption mechanism adsorbs one of the copper-clad substrates on the placement table to the turning table, the turning table carries the copper-clad substrate via the barb, and the adsorption mechanism releases the copper-clad substrate on the turning table; The turning table turns the copper-clad substrate from vertical to horizontal and places it on the third conveyor belt; The third conveyor belt sequentially conveys the copper-clad substrate to the plurality of cleaning mechanisms for abrasive belt brushing to clean the surface and the inside of the holes of the copper-clad substrate, and performs high-pressure water washing, ultrasonic cleaning and chemical washing on the copper-clad substrate.

5. The PCB manufacturing method according to claim 1, characterized in that: The exposure machine is connected to the developing machine through a fourth conveyor belt and a fifth conveyor belt, and a detachable connecting part is provided between the fourth conveyor belt and the fifth conveyor belt.

6. The PCB manufacturing method according to claim 1, characterized in that: The step of detecting the parameters of the PCB board according to the slices comprises: placing the slice in a sleeve; Pouring crystal glue into the sleeve so that the crystal glue covers the slice, and curing the crystal glue to obtain a piece to be tested; After grinding and polishing the surface of the piece to be inspected, the aperture, line width and copper thickness of the slice are measured under an inspection mirror.

7. A PCB board manufacturing device, characterized in that: The PCB manufacturing device comprises a drilling machine, a cleaning machine, a film attaching machine, an exposure machine and a developing machine, and is used to implement the PCB manufacturing method according to any one of claims 1 to 6.

8. An electronic device, characterized in that: include: A memory for storing program instructions; A processor is used to call the program instructions stored in the memory, and execute the PCB board manufacturing method according to any one of claims 1-6 according to the obtained program instructions.

9. A storage medium, characterized in that: The storage medium stores computer-executable instructions, and the computer-executable instructions are used to enable a computer to execute the PCB board manufacturing method according to any one of claims 1 to 6.

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