A surface grinding positioning method based on six-dimensional force sensor

Abstract

The present invention discloses a method for positioning curved surface polishing based on a six-dimensional force sensor, the method comprising: in response to the polishing head of the polishing device contacting the device to be polished, obtaining the first force data of the six-dimensional force sensor; controlling the polishing head to move in a preset direction, and controlling the polishing head to move in a vertical direction according to the first force data, so that the pressure data in the first force data remains constant during the movement; collecting the positioning motion trajectory of the polishing head; obtaining the required surface shape of the device to be polished, and obtaining the actual relative position between the polishing head and the device to be polished according to the positioning trajectory of the polishing head and the required surface shape of the device to be polished. The present invention realizes positioning between the polishing head and the device to be polished based on the six-dimensional force sensor, which can effectively improve the positioning accuracy, thereby improving the polishing quality.

Description

Technical Field

[0001] The present invention relates to the application field of six-dimensional force sensors, and in particular to a surface grinding and positioning method based on six-dimensional force sensors. Background Art

[0002] Polishing and grinding machine tools are widely used in various industries, such as automobile manufacturing, bathroom products, kitchen products, hardware furniture, 3C industry, etc. At present, polishing and grinding robots are mainly used for surface grinding of workpieces, deburring of edges and corners, grinding of welds, deburring of inner cavities and holes, etc. Appropriate intelligent manufacturing solutions for polishing and grinding can not only improve the quality and efficiency of polishing, but also reduce production costs. Six-dimensional force sensors are often used in polishing devices, and the six-dimensional force sensors can sense the changes in external forces in all directions and angles, including three force components and three torque components in three-dimensional space. This all-round force sensing capability makes the force control in the polishing process more precise, thereby improving the accuracy of polishing. On the other hand, during the polishing process, the six-dimensional force sensor can quickly sense the size and direction of the contact force and transmit this information to the robot's control system.

[0003] In order to ensure that polishing can be fully automatic and accurate, image recognition is generally required to identify and locate the component to be polished, so that the subsequent polishing head can be accurately moved to the component to be polished to start polishing. However, during the polishing process, image recognition can easily lead to slight positioning deviations due to the inability to accurately identify the tiny differences of the component to be polished, which in turn reduces the polishing quality. Summary of the invention

[0004] In view of some of the above-mentioned defects in the prior art, the technical problem to be solved by the present invention is to provide a surface grinding positioning method based on a six-dimensional force sensor, aiming to achieve precise grinding positioning and improve the grinding quality.

[0005] To achieve the above object, the present invention provides a surface polishing positioning method based on a six-dimensional force sensor, the method comprising:

[0006] Step S1, in response to the grinding head of the grinding device contacting the device to be polished, obtaining the first force data of the six-dimensional force sensor; controlling the grinding head to move in a preset direction, and controlling the grinding head to move in a vertical direction according to the first force data, so that the pressure data in the first force data remains constant during the movement; in response to the pressure data in the first force data being zero, obtaining the first positioning motion trajectory of the grinding head; wherein the grinding head is connected to the six-dimensional force sensor;

[0007] Step S2, obtaining the required surface shape of the device to be polished, and matching the first area position where the morphology that matches the first positioning motion trajectory is located on the required surface shape of the device to be polished; in response to there being only one first area position, determining the area position corresponding to the first positioning motion trajectory on the device to be polished according to the first area position;

[0008] Step S3, in response to there being multiple first regional positions, controlling the grinding head to move to obtain a second positioning motion trajectory; matching the second regional position where the morphology that matches the second positioning motion trajectory is located on the required surface shape of the device to be polished; in response to there being only one second regional position, determining the actual regional position corresponding to the second positioning motion trajectory on the device to be polished according to the second regional position;

[0009] Step S4: in response to there being a plurality of second regional positions, obtaining a first relative position between the first positioning motion trajectory and the second positioning motion trajectory; determining a first regional group matching the first relative position from a plurality of first regional positions and a plurality of second regional positions according to the first relative position; in response to there being only one first regional group, determining actual regional positions corresponding to the two positioning motion trajectories on the device to be polished according to the first regional group; wherein the first regional group includes a pair of corresponding first regional positions and second regional positions;

[0010] Step S5, in response to the fact that there are multiple first area groups, repeating the steps S3 and S4 until the actual area positions corresponding to the positioning motion trajectories on the device to be polished are determined; wherein, each time the process is repeated, the latest area group will include an area position corresponding to a new positioning motion trajectory;

[0011] Step S6: obtaining the current position relationship between the grinding head and each of the positioning motion trajectories according to the entire motion trajectory of the grinding head; obtaining the actual relative position between the grinding head and the device to be polished according to the actual area position corresponding to any of the positioning motion trajectories on the device to be polished and the current position relationship.

[0012] Optionally, after step S2, the method further includes:

[0013] In response to there being multiple first area positions, the polishing head is controlled to obtain a third positioning motion trajectory; and the third area position where the morphology that matches the third positioning motion trajectory is located is matched from the required surface shape of the device to be polished; in response to there being only one third area position, the actual area position corresponding to the third positioning motion trajectory on the device to be polished is determined according to the third area position; in response to there being multiple third area positions, this step is repeated until there is only one third area position; wherein the third positioning motion trajectory is a different positioning motion trajectory when this step is repeated.

[0014] Optionally, before step S1, the method further includes:

[0015] The grinding head is controlled to move above the component to be polished; the grinding head is controlled to move up and down according to a preset amplitude until the six-dimensional force sensor collects force data, and it is determined that the grinding head contacts the component to be polished.

[0016] Optionally, before step S6, the method further includes:

[0017] The entire motion trajectory of the grinding head is collected; wherein the entire motion trajectory at least includes all of the positioning motion trajectories.

[0018] Optionally, obtaining the first positioning motion trajectory of the grinding head in step S1 includes:

[0019] The moving direction and moving distance of the grinding head at each moment are recorded, and the first positioning motion trajectory of the grinding head is obtained according to the moving direction and the moving distance at each moment.

[0020] Optionally, after step S6, the method further includes:

[0021] A grinding trajectory is determined according to the actual relative position between the grinding head and the component to be polished and the required surface shape of the component to be polished; and the grinding head is controlled to grind the component to be polished along the grinding trajectory.

[0022] Optionally, the method further includes:

[0023] The rotation speed of the grinding head during the grinding process is determined according to the difference between each of the positioning motion trajectories and the required surface shape of the component to be ground.

[0024] Optionally, in step S2, matching the first area position where the morphology that matches the first positioning motion trajectory is located from the required surface shape of the component to be polished; comprising:

[0025] On the required surface shape of the component to be polished, a region position whose morphology differs from the first positioning motion trajectory by no more than a first threshold is determined, and the region position whose difference does not exceed the first threshold is determined as a first region position consistent with the first positioning motion trajectory.

[0026] Beneficial effects of the present invention: 1. The present invention collects the shape trajectory of the surface of the device to be polished by directional movement of the polishing head, and then adjusts the polishing head by monitoring the collected force data through the six-dimensional force sensor to ensure that the trajectory collected by the polishing head is always located on the surface of the device to be polished, so that the final positioning motion trajectory is the same as the trajectory of a certain area on the surface of the device to be polished; then, by matching the required surface shape with the positioning trajectory, the accurate position of the positioning trajectory on the surface of the device to be polished is obtained; finally, the positioning between the polishing head and the device to be polished is realized. Compared with image recognition, the present invention collects the positioning motion trajectory based on the six-dimensional force sensor, which can sense subtle changes and make the positioning more accurate; at the same time, the polishing device of the present invention does not need to add an image recognition system, simplifying the structure of the polishing device. 2. When a positioning motion trajectory cannot be accurately positioned, the present invention can add a new positioning motion trajectory, and then re-position it according to the relative position between them, so that the positioning of the present invention is more accurate and reliable. 3. The present invention performs positioning through the trajectory, and compared with comprehensive scanning positioning, the present invention greatly improves the positioning efficiency.

[0027] In summary, the present invention realizes positioning between the grinding head and the component to be ground based on the six-dimensional force sensor, which can effectively improve the positioning accuracy and thus improve the grinding quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a flow chart of a method for grinding and positioning a curved surface based on a six-dimensional force sensor provided by a specific embodiment of the present invention;

[0029] Figure 2 It is a schematic diagram of an overall process cycle of a method for grinding and positioning a curved surface based on a six-dimensional force sensor provided by a specific embodiment of the present invention;

[0030] Figure 3 It is a schematic diagram of an overall process cycle of a surface grinding and positioning method based on a six-dimensional force sensor provided in another specific embodiment of the present invention. DETAILED DESCRIPTION

[0031] The present invention discloses a surface grinding and positioning method based on a six-dimensional force sensor. Those skilled in the art can refer to the content of this article and appropriately improve the technical details. It should be pointed out in particular that all similar replacements and modifications are obvious to those skilled in the art, and they are all deemed to be included in the present invention. The method and application of the present invention have been described through preferred embodiments, and relevant personnel can obviously modify or appropriately change and combine the methods and applications described herein without departing from the content, spirit and scope of the present invention to implement and apply the technology of the present invention.

[0032] The applicant has found through research that: by monitoring the force data of the six-dimensional force sensor, the grinding head can pass through the entire surface of the device to be polished, and then the actual surface shape of the device to be polished can be obtained. Then, by comparing it with the required surface shape, the grinding head can be positioned in the polishing coordinates to achieve precise positioning. However, compared with image recognition, this positioning method that passes through the entire surface can improve accuracy, but its efficiency is greatly reduced. Therefore, a solution that can simultaneously ensure positioning efficiency and positioning accuracy is needed.

[0033] Therefore, the embodiment of the present invention provides a surface polishing positioning method based on a six-dimensional force sensor, such as Figure 1 As shown, the method includes:

[0034] Step S1, in response to the grinding head of the grinding device contacting the device to be polished, obtaining the first force data of the six-dimensional force sensor; controlling the grinding head to move in a preset direction, and controlling the grinding head to move in a vertical direction according to the first force data, so that the pressure data in the first force data remains constant during the movement; in response to the pressure data in the first force data being zero, obtaining the first positioning motion trajectory of the grinding head.

[0035] Wherein, the grinding head is connected with the six-dimensional force sensor.

[0036] It should be noted that, in the process of grinding curved surfaces, it is rare that there are many identical surface trajectories of the curved surface. Even if there are multiple identical trajectories, multiple trajectories can be matched and positioned by adding new trajectories with known relative positions until a unique and accurate positioning is determined. Based on this, the embodiment of the present invention can avoid the solution of using a grinding head to pass through the entire surface of the device to be grinded, and can also achieve precise positioning, and greatly reduce the positioning time and improve the positioning efficiency. On the other hand, the embodiment of the present invention collects force data based on a six-dimensional force sensor, and adjusts the height of the positioning motion trajectory collected by the grinding head according to the force data to ensure that the collected positioning motion trajectory conforms to the surface of the device to be grinded, thereby making the positioning of the embodiment of the present invention more accurate.

[0037] It is worth mentioning that the grinding head does not rotate during the process of collecting the positioning motion trajectory, so as to avoid changes in the positioning motion trajectory due to grinding.

[0038] In this specific embodiment, before step S1, the method further includes:

[0039] The grinding head is controlled to move above the component to be polished; the grinding head is controlled to move up and down according to a preset amplitude until the six-dimensional force sensor collects force data, and it is determined that the grinding head contacts the component to be polished.

[0040] It should be noted that, when controlling the grinding head to move above the component to be polished, it is not necessary to move the grinding head to a certain position accurately, but it only needs to move the grinding head to above the component to be polished.

[0041] In this specific embodiment, the basis for the pressure data in the first force data to be zero is that the grinding head is moved up and down by a preset amplitude, and the pressure data in this process is zero, so it is judged that the pressure data in the first force data is zero.

[0042] In this specific embodiment, obtaining the first positioning motion trajectory of the grinding head in step S1 includes:

[0043] The moving direction and moving distance of the grinding head at each moment are recorded, and the first positioning motion trajectory of the grinding head is obtained according to the moving direction and moving distance at each moment.

[0044] Since the movement of the grinding head is controlled by the control module, the control module can also record the movement data.

[0045] Step S2, obtaining the required surface shape of the device to be polished, and matching the first area position where the morphology consistent with the first positioning motion trajectory is located on the required surface shape of the device to be polished; in response to there being only one first area position, determining the area position corresponding to the first positioning motion trajectory on the device to be polished according to the first area position.

[0046] It should be noted that the required surface shape is the required surface shape of the device to be polished after polishing. Since polishing only removes roughness and burrs, the actual surface shape of the device to be polished and the required surface shape are generally very close. Therefore, the corresponding area position of the positioning motion trajectory on the device to be polished can be determined by matching the required surface shape with the positioning motion trajectory.

[0047] In this specific embodiment, in step S2, the first area position where the topography that matches the first positioning motion trajectory is located is matched from the required surface shape of the component to be polished; comprising:

[0048] The area position whose topography differs from the first positioning motion trajectory by no more than a first threshold is determined on the required surface shape of the component to be polished, and the area position whose topography differs from the first positioning motion trajectory by no more than the first threshold is determined as the first area position consistent with the first positioning motion trajectory.

[0049] It should be noted that although the required surface shape and the actual surface shape are not much different, there will always be some gaps, which will cause the positioning motion trajectory to not be completely consistent with the position of the corresponding area on the required surface shape. Therefore, it is necessary to set a threshold to ensure that the positioning motion trajectory is roughly the same as the position of the corresponding area on the required surface shape.

[0050] Step S3, in response to there being multiple first area positions, control the movement of the grinding head to obtain a second positioning motion trajectory; and match the second area position where the morphology that matches the second positioning motion trajectory is located based on the required surface shape of the device to be polished; in response to there being only one second area position, determine the actual area position corresponding to the second positioning motion trajectory on the device to be polished according to the second area position.

[0051] It should be noted that a positioning motion trajectory may correspond to multiple regional positions. In this case, a new positioning motion trajectory needs to be added to determine it.

[0052] Step S4, in response to there being multiple second area positions, obtaining a first relative position between the first positioning motion trajectory and the second positioning motion trajectory; according to the first relative position, determining a first area group matching the first relative position from multiple first area positions and multiple second area positions; in response to there being only one first area group, determining the actual area positions corresponding to the two positioning motion trajectories on the device to be polished according to the first area group.

[0053] The first area group includes a pair of corresponding first area positions and second area positions.

[0054] It should be noted that when another positioning motion track corresponds to multiple regional positions and the exact area of ​​the device to be polished cannot be determined, the relative positions between different positioning tracks can be used to determine whether there is a unique regional group that meets the requirements, and positioning can also be performed.

[0055] Step S5, in response to the fact that there are multiple first area groups, repeat steps S3 and S4 until the actual area positions corresponding to each positioning motion trajectory on the device to be polished are determined; wherein, each time the process is repeated, the latest area group will include an area position corresponding to a new positioning motion trajectory.

[0056] It should be noted that when the area group is not unique, a new positioning motion track can be added until the area position corresponding to the new positioning motion track is unique, or the new area group is unique. Each time it is repeated, the latest area group will include an area position corresponding to a new positioning motion track. For example, the area group corresponding to three positioning motion tracks includes the area positions corresponding to these three positioning motion tracks.

[0057] Step S6: According to the entire motion trajectory of the grinding head, the current position relationship between the grinding head and each positioning motion trajectory is obtained; according to the actual area position corresponding to any positioning motion trajectory on the device to be polished and the current position relationship, the actual relative position between the grinding head and the device to be polished is obtained.

[0058] It should be noted that when the position of the positioning motion trajectory on the device to be polished is known, and the relative position of the positioning motion trajectory and the polishing head is also known (the polishing head records the motion trajectory at all times), the relative position between the polishing head and the device to be polished can be obtained. In other words, if the spatial coordinate axis is established with a clear device to be polished, the coordinates of the polishing head can be obtained.

[0059] In this specific embodiment, before step S6, the method further includes:

[0060] The entire motion trajectory of the grinding head is collected; wherein the entire motion trajectory at least includes all positioning motion trajectories.

[0061] It should be noted that, since there may be a travel for moving the grinding head back to above the component to be polished between different positioning motion trajectories, the entire motion trajectory may include this part of the trajectory.

[0062] In this specific embodiment, after step S6, the method further includes:

[0063] A grinding trajectory is determined according to the actual relative position between the grinding head and the device to be polished and the required surface shape of the device to be polished; and the grinding head is controlled to grind the device to be polished along the grinding trajectory.

[0064] In this specific embodiment, the rotation speed of the grinding head during the grinding process is determined according to the difference between each positioning motion trajectory and the required surface shape of the component to be ground.

[0065] It should be noted that the grinding thickness can be determined according to the difference between each positioning motion trajectory and the required surface shape of the component to be polished, and the grinding thickness can determine the rotation speed.

[0066] In this specific embodiment, the grinding head positioning process can be as follows: Figure 2 As shown, including:

[0067] Step S201, obtaining a first positioning motion trajectory;

[0068] Step S202, matching the first area position where the morphology that matches the first positioning motion trajectory is located based on the required surface shape of the component to be polished;

[0069] Step S203, determine whether the first area position is unique, if so, proceed to step S208; if not, proceed to step S204;

[0070] Step S204, controlling the movement of the polishing head to obtain a second positioning motion trajectory; and matching the second region position where the morphology that matches the second positioning motion trajectory is located on the required surface shape of the component to be polished;

[0071] Step S205, determine whether the second area position is unique, if so, proceed to step S208; if not, proceed to step S206;

[0072] Step S206, obtaining a first relative position between the first positioning motion trajectory and the second positioning motion trajectory; and determining a first area group matching the first relative position from a plurality of first area positions and a plurality of second area positions according to the first relative position;

[0073] Step S207, determine whether the first region is unique, if so, proceed to step S208; if not, return to step S204;

[0074] Step S208: determining the actual area position of the positioning motion trajectory on the device to be polished.

[0075] In another specific embodiment, after step S2, the method further includes:

[0076] In response to there being multiple first area positions, the polishing head is controlled to obtain a third positioning motion trajectory; and the third area position where the morphology that matches the third positioning motion trajectory is located is matched from the required surface shape of the device to be polished; in response to there being only one third area position, the actual area position corresponding to the third positioning motion trajectory on the device to be polished is determined according to the third area position; in response to there being multiple third area positions, this step is repeated until there is only one third area position; wherein the third positioning motion trajectory is a different positioning motion trajectory when this step is repeated.

[0077] The specific grinding head positioning process can be as follows Figure 3 As shown, including:

[0078] Step S301, obtaining a first positioning motion trajectory;

[0079] Step S302, matching the first area position where the morphology that matches the first positioning motion trajectory is located based on the required surface shape of the component to be polished;

[0080] Step S303, determining whether the first area position is unique, if so, proceeding to step S304; if not, returning to step S301; wherein the first positioning motion trajectory obtained again is different from the previous one;

[0081] Step S304: determine the actual area position of the positioning motion trajectory on the device to be polished.

[0082] The embodiment of the present invention collects the shape trajectory of the surface of the device to be polished by directional movement of the polishing head, and then uses a six-dimensional force sensor to monitor the collected force data to adjust the polishing head to ensure that the trajectory collected by the polishing head is always located on the surface of the device to be polished, so that the final positioning motion trajectory is the same as the trajectory of a certain area on the surface of the device to be polished; then, by matching the required surface shape with the positioning trajectory, the accurate position of the positioning trajectory on the surface of the device to be polished is obtained; finally, the positioning between the polishing head and the device to be polished is achieved. Compared with image recognition, the embodiment of the present invention collects the positioning motion trajectory based on a six-dimensional force sensor, which can sense subtle changes and make positioning more accurate; at the same time, the polishing device of the embodiment of the present invention does not need to add an image recognition system, which simplifies the structure of the polishing device.

[0083] In the embodiment of the present invention, when one positioning motion trajectory cannot be accurately positioned, a new positioning motion trajectory can be added, and then re-positioning can be performed based on the relative positions between them, thereby making the positioning of the embodiment of the present invention more accurate and reliable.

[0084] The embodiment of the present invention performs positioning through trajectories. Compared with full scanning positioning, the embodiment of the present invention greatly improves positioning efficiency.

[0085] In summary, the embodiments of the present invention realize positioning between the grinding head and the component to be ground based on the six-dimensional force sensor, which can effectively improve the positioning accuracy and thus improve the grinding quality.

[0086] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0087] Each embodiment in this specification is described in a related manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the system embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0088] The above are only preferred embodiments of the present invention and are not intended to limit the protection scope of the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention are included in the protection scope of the present invention.

Claims

1. A surface polishing positioning method based on a six-dimensional force sensor, characterized in that: The method comprises: Step S1, in response to the grinding head of the grinding device contacting the device to be polished, obtaining the first force data of the six-dimensional force sensor; controlling the grinding head to move in a preset direction, and controlling the grinding head to move in a vertical direction according to the first force data, so that the pressure data in the first force data remains constant during the movement; in response to the pressure data in the first force data being zero, obtaining the first positioning motion trajectory of the grinding head; wherein the grinding head is connected to the six-dimensional force sensor; Step S2, obtaining the required surface shape of the device to be polished, and matching the first area position where the morphology that matches the first positioning motion trajectory is located on the required surface shape of the device to be polished; in response to there being only one first area position, determining the area position corresponding to the first positioning motion trajectory on the device to be polished according to the first area position; Step S3, in response to there being multiple first regional positions, controlling the grinding head to move to obtain a second positioning motion trajectory; matching the second regional position where the morphology that matches the second positioning motion trajectory is located on the required surface shape of the device to be polished; in response to there being only one second regional position, determining the actual regional position corresponding to the second positioning motion trajectory on the device to be polished according to the second regional position; Step S4: in response to there being a plurality of second regional positions, obtaining a first relative position between the first positioning motion trajectory and the second positioning motion trajectory; determining a first regional group matching the first relative position from a plurality of first regional positions and a plurality of second regional positions according to the first relative position; in response to there being only one first regional group, determining actual regional positions corresponding to the two positioning motion trajectories on the device to be polished according to the first regional group; wherein the first regional group includes a pair of corresponding first regional positions and second regional positions; Step S5, in response to the fact that there are multiple first area groups, repeating the steps S3 and S4 until the actual area positions corresponding to the positioning motion trajectories on the device to be polished are determined; wherein, each time the process is repeated, the latest area group will include an area position corresponding to a new positioning motion trajectory; Step S6: obtaining the current position relationship between the grinding head and each of the positioning motion trajectories according to the entire motion trajectory of the grinding head; obtaining the actual relative position between the grinding head and the device to be polished according to the actual area position corresponding to any of the positioning motion trajectories on the device to be polished and the current position relationship.

2. The surface polishing and positioning method based on the six-dimensional force sensor according to claim 1 is characterized in that: After step S2, the method further includes: In response to there being multiple first area positions, the polishing head is controlled to obtain a third positioning motion trajectory; and the third area position where the morphology that matches the third positioning motion trajectory is located is matched from the required surface shape of the device to be polished; in response to there being only one third area position, the actual area position corresponding to the third positioning motion trajectory on the device to be polished is determined according to the third area position; in response to there being multiple third area positions, this step is repeated until there is only one third area position; wherein the third positioning motion trajectory is a different positioning motion trajectory when this step is repeated.

3. The method for curved surface polishing and positioning based on a six-dimensional force sensor according to claim 1, characterized in that: Before step S1, the method further includes: The grinding head is controlled to move above the component to be polished; the grinding head is controlled to move up and down according to a preset amplitude until the six-dimensional force sensor collects force data, and it is determined that the grinding head contacts the component to be polished.

4. The surface polishing and positioning method based on a six-dimensional force sensor according to claim 1 is characterized in that: Before step S6, the method further includes: The entire motion trajectory of the grinding head is collected; wherein the entire motion trajectory at least includes all of the positioning motion trajectories.

5. The method for curved surface polishing and positioning based on a six-dimensional force sensor according to claim 1, characterized in that: The step S1 of obtaining the first positioning motion trajectory of the grinding head includes: The moving direction and moving distance of the grinding head at each moment are recorded, and the first positioning motion trajectory of the grinding head is obtained according to the moving direction and the moving distance at each moment.

6. The method for curved surface polishing and positioning based on a six-dimensional force sensor according to claim 1, characterized in that: After step S6, the method further includes: A grinding trajectory is determined according to the actual relative position between the grinding head and the component to be polished and the required surface shape of the component to be polished; and the grinding head is controlled to grind the component to be polished along the grinding trajectory.

7. The method for curved surface polishing and positioning based on a six-dimensional force sensor according to claim 1, characterized in that: The method further comprises: The rotation speed of the grinding head during the grinding process is determined according to the difference between each of the positioning motion trajectories and the required surface shape of the component to be ground.

8. The method for curved surface polishing and positioning based on a six-dimensional force sensor according to claim 1, characterized in that: In the step S2, the first area position where the topography that matches the first positioning motion trajectory is located is matched from the required surface shape of the component to be polished; comprising: On the required surface shape of the component to be polished, a region position whose morphology differs from the first positioning motion trajectory by no more than a first threshold is determined, and the region position whose difference does not exceed the first threshold is determined as a first region position consistent with the first positioning motion trajectory.

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