A plate positioning fixture and clamping method thereof

Abstract

The present invention discloses a plate positioning fixture and a clamping method thereof, and relates to the technical field of fixtures. The plate positioning fixture comprises a fixed carrier plate and a movable carrier plate. A clamping space for the plate is formed between the movable carrier plate and the fixed carrier plate. The movable carrier plate can reciprocate in a direction approaching and away from the fixed carrier plate through a movable mechanism to adjust the size of the clamping space. In addition, a plurality of adsorption structures are evenly distributed on the upper surfaces of the fixed carrier plate and the movable carrier plate, respectively, to eliminate error gaps between the plate and related components that are not conducive to improving process accuracy, thereby improving the final process effect. The fixture also comprises a rangefinder, which is arranged above the clamping space and is used to obtain distance data between the rangefinder and the plate located in the clamping space, so that the clamping force applied to the plate is unified, thereby enabling the plate positioning fixture to meet higher process requirements and improve the quality of the final product.

Description

Technical Field

[0001] The present invention relates to the technical field of clamps, and in particular to a plate positioning clamp and a clamping method thereof. Background Art

[0002] A plate clamp is a tool used to support plates. It can firmly support plates to prevent them from moving or deforming during processing or assembly, thereby improving processing accuracy and product quality. If the clamping force of the clamp is too large, the pressure generated on the surface of the plate will cause the plate to deform and arch, affecting the effect of related processes. If the clamping effect of the clamp is poor, the plate may be displaced or even moved during the corresponding process, resulting in a decrease in process accuracy or even damage.

[0003] Therefore, the clamping force of the fixture is particularly important for the plate processing. However, the current clamping force of the fixture is generally controlled manually or fixed by preset. For plates with certain processing errors or different sizes and types, the clamping force fluctuates greatly, resulting in uneven process accuracy of the plates, affecting the final quality of the finished product, and making it difficult to meet the current processing needs for high-end products. Summary of the invention

[0004] The purpose of the embodiments of the present invention is to provide a plate positioning fixture and a clamping method thereof, which can solve the above-mentioned problems existing in the prior art.

[0005] To achieve the above object, the present invention adopts the following technical solutions:

[0006] In a first aspect, a plate positioning fixture is provided, comprising:

[0007] securing the carrier plate; and

[0008] A movable carrier plate, wherein the inner side surfaces of the movable carrier plate and the fixed carrier plate are arranged opposite to each other and spaced apart to form a clamping space for the plate therebetween, and the movable carrier plate can reciprocate in a direction approaching and moving away from the fixed carrier plate through a movable mechanism to adjust the size of the clamping space;

[0009] The upper surfaces of the fixed carrier plate and the movable carrier plate are respectively evenly provided with a plurality of adsorption structures;

[0010] A distance meter, disposed above the clamping space, for obtaining distance data between the distance meter and the plate located in the clamping space;

[0011] A first supporting plate, the movable carrier plate being movably mounted on the first supporting plate through the movable mechanism;

[0012] The movable mechanism has a first fixed end and a first driving end, and the movable mechanism is connected to the first supporting plate and the movable carrier plate respectively through the first fixed end and the first driving end;

[0013] The movable mechanism is configured as a cylinder, the cylinder is located between the first support plate and the movable carrier plate, and the piston rod of the cylinder is connected to the movable carrier plate via an attached plate;

[0014] A position-avoiding groove is also provided on one side of the movable carrier plate, and at least a part of the movable plate is movably located in the position-avoiding groove, and a groove wall of the position-avoiding groove and the movable plate are guided and matched with each other through a first guiding mechanism;

[0015] A second guide mechanism is further provided between the first support plate and the movable carrier plate, and at least two second guide mechanisms are provided;

[0016] At least two of the second guide mechanisms are arranged at intervals along the length direction of the movable carrier plate and are respectively connected to the first support plate and the movable carrier plate;

[0017] It also includes a pressing plate mechanism, which is movably arranged on the fixed carrier plate and / or the movable carrier plate, and the pressing plate mechanism has a pressing plate position and a releasing position;

[0018] When the pressing plate mechanism is in the pressing plate position, the pressing plate mechanism at least partially protrudes from the inner side surface of the fixed carrier plate and / or the movable carrier plate; when the pressing plate mechanism is in the releasing position, the pressing plate mechanism retracts into the inner side surface of the fixed carrier plate and / or the movable carrier plate.

[0019] As an optional embodiment, the multiple groups of adsorption structures located on the fixed carrier are arranged at intervals along the extension direction of the inner side surface of the fixed carrier, and the multiple groups of adsorption structures located on the movable carrier are arranged at intervals along the extension direction of the inner side surface of the movable carrier;

[0020] Each group of the adsorption structures includes a plurality of vacuum adsorption holes; in each group of the adsorption structures located on the fixed carrier, the plurality of vacuum adsorption holes are spaced apart from the outer side of the upper surface of the fixed carrier toward the inner side; and in each group of the adsorption structures located on the movable carrier, the plurality of vacuum adsorption holes are spaced apart from the outer side of the upper surface of the movable carrier toward the inner side.

[0021] As an optional implementation, it also includes:

[0022] The lifting mechanism is located between the fixed carrier plate and the movable carrier plate and can perform lifting movement below the clamping space.

[0023] As an optional embodiment, the fixed carrier plate is provided with a first movable opening penetrating through the upper and lower surfaces thereof, and the inner side surface of the fixed carrier plate is further provided with a first telescopic opening communicating with the first movable opening;

[0024] The pressing plate mechanism comprises a first pressing plate assembly, the first pressing plate assembly comprises a first pressing plate driving device and a first pressing plate body, the first pressing plate driving device is arranged at the lower side of the fixed carrier, the first pressing plate driving device has a second fixed end and a second driving end, the second fixed end is relatively fixed to the fixed carrier, the first pressing plate body is arranged at the second driving end and is located in the first movable opening, and the height of the upper surface of the first pressing plate body is less than or equal to the height of the upper surface of the fixed carrier;

[0025] The second driving end is used to move relative to the second fixed end to drive the first pressing plate body to extend out of the inner side surface of the fixed carrier plate through the first telescopic opening or to retract into the first movable opening.

[0026] As an optional embodiment, the movable carrier plate is provided with a second movable opening penetrating through the upper and lower surfaces thereof, and the inner side surface of the movable carrier plate is further provided with a second telescopic opening connected to the second movable opening;

[0027] The pressing plate mechanism comprises a second pressing plate assembly, the second pressing plate assembly comprises a second pressing plate driving device and a second pressing plate body, the second pressing plate driving device is arranged at the lower side of the movable carrier, the second pressing plate driving device has a third fixed end and a third driving end, the third fixed end is relatively fixed to the movable carrier, the second pressing plate body is arranged at the third driving end and is located in the second movable opening, and the height of the upper surface of the second pressing plate body is less than or equal to the height of the upper surface of the movable carrier;

[0028] The third driving end is used to move relative to the third fixed end to drive the second pressing plate body to extend out of the inner side of the movable carrier plate through the second telescopic opening or to retract into the second movable opening.

[0029] In a second aspect, a plate clamping method is provided, which is applied to the plate positioning fixture as described in the first aspect, and the plate clamping method comprises the steps of:

[0030] S10, obtaining distance data between the plate located in the clamping space by means of a distance meter;

[0031] S20, judging whether the plate in the clamping space is arched according to the distance data;

[0032] S30, adjusting the clamping force applied by the movable carrier plate to the plate by using a proportional servo valve according to the judgment result.

[0033] The beneficial effects of the present invention are as follows: when the plate positioning fixture clamps the plate through the movable carrier and the fixed carrier, the relevant components that need to be processed in cooperation with the plate can be adsorbed and fixed on the fixed carrier and the movable carrier by the adsorption structures evenly distributed on the fixed carrier and the movable carrier, so that the plate and the relevant components can use the positioning fixture as a positioning reference, thereby improving the positioning accuracy of the plate and the relevant components, eliminating the error gap between the plate and the relevant components that is not conducive to improving the process accuracy, and achieving the improvement of the final process effect;

[0034] Furthermore, when the panel is clamped by the movable carrier and the fixed carrier, the rangefinder can determine whether the panel is in an arched state by obtaining the distance data between it and the panel, and adjust the clamping force applied to the panel through the movable carrier according to the judgment result, so as to ensure that the panel is stably clamped while avoiding the situation where the clamping force is too large and causes the panel to arch, thereby affecting the relevant process accuracy, so that the clamping force applied to the panel is unified, so that the panel positioning fixture can meet higher process requirements and achieve the improvement of the quality of the final product. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The present invention is further described in detail below based on the accompanying drawings and embodiments.

[0036] Figure 1 This is one of the schematic diagrams of the plate positioning fixture structure according to an embodiment of the present invention (PCB board omitted);

[0037] Figure 2 This is the second schematic diagram of the plate positioning fixture structure according to the embodiment of the present invention (PCB board and rangefinder are omitted);

[0038] Figure 3 This is the third structural schematic diagram of the plate positioning fixture according to the embodiment of the present invention (the distance meter is omitted);

[0039] Figure 4 A side view of the plate positioning fixture according to an embodiment of the present invention;

[0040] Figure 5 An exploded view of the plate positioning fixture according to an embodiment of the present invention;

[0041] Figure 6 This is a schematic diagram of the bottom structure of the plate positioning fixture according to an embodiment of the present invention (the first support plate is omitted);

[0042] Figure 7 A cross-sectional view of the plate positioning fixture according to an embodiment of the present invention;

[0043] Figure 8 This is a flow chart of the plate clamping method described in an embodiment of the present invention.

[0044] In the figure: 10, fixed carrier plate; 11, first identification plate; 111, first identification hole; 12, first movable opening; 121, first telescopic opening; 13, second support plate; 20, movable carrier plate; 21, movable mechanism; 211, first fixed end; 212, first driving end; 22, first support plate; 23, attached movable plate; 231, guide opening; 24, avoidance groove; 25, first guide mechanism; 251, guide rod; 26, second guide mechanism; 27, second identification plate; 271, second identification hole ; 28. Second movable opening; 281. Second telescopic opening; 30. Clamping space; 40. Adsorption structure; 41. Vacuum adsorption hole; 50. Rangefinder; 60. Pressing plate mechanism; 61. First pressing plate assembly; 611. First pressing plate driving device; 6111. Second fixed end; 6112. Second driving end; 612. First pressing plate body; 62. Second pressing plate assembly; 621. Second pressing plate driving device; 6211. Third fixed end; 6212. Third driving end; 622. Second pressing plate body. DETAILED DESCRIPTION

[0045] In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the embodiments of the present invention are further described in detail below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0046] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0047] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0048] A plate fixture is a tool used to support plates. It can firmly support plates to prevent them from moving or deforming during processing or assembly, thereby improving processing accuracy and product quality.

[0049] In the relevant process flow, if the clamping force applied by the fixture to the plate is too large, a large pressure will be generated on the surface of the plate, which may cause the plate to deform or deform, causing the plate to bulge on the fixture, etc., affecting the matching accuracy between the plate and other processing parts, resulting in a decrease in the relevant process effect. If the clamping force applied by the fixture to the plate is insufficient, the plate may move or slip during the corresponding process due to vibration, external force interference or equipment accuracy problems, resulting in a decrease in process accuracy or even damage.

[0050] Therefore, the clamping force of the fixture is particularly important for the plate processing. When using the fixture to clamp the plate, the clamping force should be reasonably adjusted according to factors such as the material, shape, size and processing requirements of the plate to ensure the processing quality, workpiece performance, fixture life and operation safety. However, the current clamping force of the fixture is generally controlled manually or fixed by preset. For plates with certain processing errors or different sizes and types, the clamping force fluctuates greatly, resulting in uneven process accuracy of the plate, affecting the final quality of the finished product, and it is difficult to meet the current processing needs for high-end products.

[0051] In view of this, the present embodiment provides a panel positioning fixture, which optimizes and adjusts the fixture structure so that the clamping force applied by the fixture to the panel can be adjusted according to the clamping situation of the panel. In addition, the panel positioning fixture can also stabilize the processing parts that need to be processed together with the panel on the fixture by setting an adsorption structure, thereby improving the positioning accuracy between the panel and the processing parts and solving the problem of low process level of the panel.

[0052] This embodiment takes the solder paste printer as an example. The solder paste printer is the front-end equipment of the SMT (surface mount technology) whole-line equipment, wherein the equipment is used to print solder paste evenly onto the corresponding pads of the PCB (printed circuit board), providing precise solder paste coating for subsequent patch and reflow soldering processes, ensuring that electronic components can be accurately and firmly soldered on the PCB board.

[0053] The main function of the board positioning fixture in the solder paste printer is to clamp and fix the PCB board to keep it stable during the printing process and prevent poor printing due to movement or deformation. In the actual operation of the solder paste printer, the board fixture fixes the PCB board on the workbench through the board positioning fixture, so that the PCB board and the steel mesh (the above-mentioned processing component) are accurately aligned. Then, the scraper of the solder paste printer prints the solder paste through the steel mesh onto the pads of the PCB board.

[0054] From the background technology, it can be known that during the solder paste printing process, the clamping force of the PCB clamp has a significant impact on the effect of solder paste printing. When the clamping force is too large, the PCB board may be deformed due to excessive pressure. This deformation may not only cause the pad position to shift, thereby affecting the printing accuracy and consistency of the solder paste, but may also cause a gap to form between the steel mesh and the PCB board, causing the image acquisition unit to identify the positioning reference to change, affecting the uniformity and accuracy of the final tin brushing. When the clamping force is too small, the PCB board may become loose during the printing process due to the pressure of the scraper or steel mesh. This looseness may cause the solder paste printing position to shift, thereby affecting the printing quality.

[0055] It should be understood that the plate material described in this embodiment refers to a flat sheet material with a certain thickness and area, which can be made of metal, non-metal or composite materials and is used for various structural, decorative or functional purposes.

[0056] Please refer to the instruction manual Figure 2-Figure 6 The plate positioning fixture includes a fixed carrier plate 10 and a movable carrier plate 20. The fixed carrier plate 10 is relatively fixed with the relevant equipment (such as the above-mentioned solder paste printing equipment) in the application. Due to the relatively fixed relationship between the fixed carrier plate 10 and the relevant equipment, a more rigid connection structure can be used between the fixed carrier plate 10 and the relevant equipment, so that the connection strength between the fixed carrier plate 10 and the relevant equipment is higher. Because the fixed carrier plate 10 is more stable, the positioning accuracy of the fixed carrier plate 10 on the relevant equipment is also higher, so it can be used as a positioning reference for the plate in the positioning and clamping process. The movable carrier plate 20 is arranged opposite to the fixed carrier plate 10 and is spaced apart. The inner side surface of the movable carrier plate 20 is opposite to the inner side surface of the fixed carrier plate 10 to form a clamping space 30 that can accommodate the corresponding plate. In order to facilitate a more comprehensive understanding of the scheme, the inner side surfaces of the fixed carrier plate 10 and the movable carrier plate 20 are defined as clamping parts in this embodiment. The movable carrier plate 20 can reciprocate in the direction of approaching and moving away from the fixed carrier plate 10 through the movable mechanism 21, so as to achieve the effect of adjusting the size of the clamping space 30 by the clamping parts on the two carrier plates. The fixed carrier plate 10 and the movable carrier plate 20 are clamped on the opposite sides of the corresponding plate or release the plate through the clamping parts formed by each of them, so that the plate can be positioned, clamped and fixed in the clamping space 30 for subsequent processing, or released after the corresponding process is completed so that the plate can be transported to the next station.

[0057] It can be understood that the structures of the clamping parts of the fixed carrier plate 10 and the clamping parts of the movable carrier plate 20 can be determined according to the structures of the opposite sides of the panel to be clamped. The present embodiment has no strict limitations and requirements on the structure of the clamping parts. For example, when the opposite sides of the panel to be clamped by the clamping parts are two parallel planes, the two clamping parts can be adaptively set as two parallel clamping planes to increase the contact area of ​​the clamping parts on the side of the panel, thereby ensuring that the panel can be stably clamped by the positioning fixture.

[0058] On the basis of improving the positioning accuracy by the second support plate 13 as mentioned above, the movable carrier 20 can contact one side of the panel and push the panel toward the fixed carrier 10, so that the other side of the fixed carrier 10 is against the inner side (clamping portion) of the fixed carrier 10. By using the fixed carrier 10 as a positioning reference, the panel can be clamped and fixed by the panel positioning fixture, and the positioning accuracy of the panel on the relevant equipment is also improved.

[0059] On the basis of the above structure, a plurality of groups of adsorption structures 40 are evenly distributed on the upper surfaces of the fixed carrier 10 and the movable carrier 20, respectively. The adsorption structures 40 are used to adsorb and fix the processing parts that need to be processed in conjunction with the panel in the clamping space 30 to the panel positioning fixture. Specifically, after the panel is fixedly clamped in the clamping area, the processing parts can move above the clamping space 30 in the direction close to the panel positioning spacing and finally be placed on the fixed carrier 10 and the movable carrier 20, and be adsorbed and fixed by the adsorption structures 40 on the fixed carrier 10 and the movable carrier 20, respectively.

[0060] For ease of understanding, in this embodiment, the upper surfaces of the fixed carrier 10 and the movable carrier 20 are defined as the support portion. The fixed carrier 10 is consistent with the movable carrier 20, and the clamping portion thereof is adjacent to the fixed position and is set at an angle. The fixed carrier 10 and the movable carrier 20 are used to provide a loading position for the steel mesh, so that the fixed carrier 10 and the movable carrier 20 can be used as both a clamping component of the plate and a supporting base for the steel mesh. In this way, when the plate is clamped and fixed, the upper side of the plate is substantially flush with the support portion of the fixed carrier 10 and the movable carrier 20. In this way, when the steel mesh is placed on the support portion of the fixed carrier 10 and the movable carrier 20, the plate and the steel mesh can both use the positioning fixture as a positioning reference, and the lower side of the steel mesh can be in a sufficiently close or even mutually fitted state with the upper side of the plate, eliminating the error gap between the plate and the steel mesh that is not conducive to improving the process accuracy, thereby providing the positioning accuracy between the plate and the steel mesh and achieving the improvement of the final process effect.

[0061] In this embodiment, multiple groups of adsorption structures 40 are evenly distributed on the upper surfaces of the fixed carrier 10 and the movable carrier 20, which can ensure that the contact area between the fixed carrier 10 and the movable carrier 20 and the adsorbed steel mesh is maximized, so that the size and distribution of the adsorption force applied by the panel positioning fixture to the steel mesh are uniform, so that the positioning accuracy between the steel mesh and the PCB board is guaranteed.

[0062] It should be understood that the adsorption structure 40 disposed on the fixed carrier 10 and the movable carrier 20 may be, but is not limited to, vacuum adsorption (such as vacuum adsorption holes 41), magnetic adsorption (such as magnets or electromagnets), electrostatic adsorption (such as using electrostatic effects to attach the steel mesh to the support portion), and adhesive adsorption (such as sticky materials or adsorption pads).

[0063] It is worth mentioning that in the embodiment where the adsorption structure 40 adopts the vacuum adsorption hole 41, one end of each vacuum adsorption hole 41 is connected to the upper surface (supporting portion) of the fixed carrier 10 and the movable carrier 20, respectively, and the other end thereof can be selected to penetrate the lower surface or any side surface of the fixed carrier 10 and the movable carrier 20 according to the design requirements of the positioning fixture, and the other end of the vacuum adsorption hole 41 is connected to the vacuum source outside the panel positioning fixture. However, it should be noted that in order to avoid interference between the vacuum source (or the pipeline between the vacuum source and the vacuum adsorption hole 41) and the PCB board, the other end of the vacuum adsorption hole 41 should avoid penetrating to the inner side surface of the fixed carrier 10 and the movable carrier 20.

[0064] Based on the above technical solution, it should also be noted that the panel positioning fixture also includes a rangefinder 50, which is specifically used to measure the distance between two objects. In this embodiment, the rangefinder 50 can be but is not limited to a laser rangefinder 50, an ultrasonic rangefinder 50, or an infrared rangefinder 50.

[0065] The rangefinder 50 is specifically arranged above the clamping space 30, and is used to obtain the distance data between it and the plate located in the clamping space 30, so as to judge whether the PCB board is arched when being clamped by the plate positioning fixture according to the change of the distance data, and control the clamping force applied by the movable carrier 20 on the PCB board according to the judgment result, so as to ensure that the PCB board can be stably clamped without deformation due to excessive clamping force, and ensure that the PCB board and the steel mesh are in a relatively stable state, so that the positioning accuracy and processing accuracy of the two can be improved.

[0066] At the same time, since the clamping force applied by the movable carrier 20 to the PCB board is determined based on the distance data collected by the rangefinder 50, the clamping force applied by the movable carrier 20 on the board can vary according to the size, type, or deformation coefficient, or dimensional error of the board, so that the clamping effect is unified, thereby enabling the board positioning fixture to meet higher process requirements and improve the quality of the final product.

[0067] Please continue to refer to the attached Figure 2-Figure 7 The plate positioning fixture also includes a first support plate 22, which is used to support the movable carrier 20 in the fixture. The movable carrier 20 is specifically movably mounted on the first support plate 22 through a movable mechanism 21. In this way, the first support plate 22 can provide a corresponding installation position for the movable carrier 20 to be installed on related equipment (such as the above-mentioned solder paste printing equipment), so that the movable carrier 20 can be movably set on the solder paste printing equipment, and the fixed carrier 10 does not need to be set in a movable form, so it can be directly installed on the solder paste printing equipment on the related equipment.

[0068] Furthermore, the movable mechanism 21 has a first fixed end 211 and a first driving end 212. The first driving end 212 can reciprocate along a preset direction relative to the first fixed end 211. The movable mechanism 21 is specifically connected to the first support plate 22 through the first fixed end 211, so that the first fixed end 211 can be relatively fixed to the solder paste printing equipment through the first support plate 22, and the movable carrier 20 is arranged on the first driving end 212, so that the movable carrier 20 can be driven by the first driving end 212 to move along the preset direction during the movement of the first driving end 212 relative to the first fixed end 211.

[0069] It can be understood that the first driving end 212 is the power source for the movable mechanism 21 in this example to achieve reciprocating movement and positioning, and the first driving end 212 can drive the components connected thereto along a preset direction under the action of the power source. Through the above-mentioned setting method, the movable carrier 20 can be stably installed on the first support plate 22. At the same time, the structure between the first support plate 22 and the movable carrier 20 is simple and compact, and does not have other complex connection and matching structures. Only through the movable mechanism 21 and the guide mechanism described in the subsequent content, it can help to improve the matching accuracy between the movable carrier 20 and the first support plate 22. Therefore, on the basis of ensuring the positioning accuracy of the fixed carrier 10, by minimizing the motion error of the movable carrier 20 as much as possible, the stability and accuracy of the plate positioning fixture can be further improved both in the clamping process and in the clamping state.

[0070] In one embodiment, the movable mechanism 21 is set as a cylinder. The design of the cylinder has the characteristics of compact structure and easy installation and maintenance. It is conducive to the arrangement between the movable carrier 20 and the first support plate 22, and is convenient for the installation of the movable carrier 20 and the first support plate 22. At the same time, the spacing between the movable carrier 20 and the first support plate 22 can also be reduced, so that the space area occupied by the plate positioning fixture on the solder paste printing equipment can be controlled, and the vibration generated by the movable carrier 20 when it moves relative to the first support plate 22 can be reduced, thereby improving the control accuracy of the movable carrier 20. Although the positioning accuracy of the cylinder may not be as high as that of the electric actuator, it can still meet the control and adjustment of the clamping force of the movable carrier 20. On the basis of effectively controlling the cost of the movable mechanism 21, the cylinder can meet the demand of the movable carrier 20 for clamping force control. In addition, the movement stroke of the cylinder is large, so that when it is applied between the movable carrier 20 and the first support plate 22, the plate positioning fixture can be suitable for more PCB boards of different sizes and types, thereby improving the versatility of the fixture.

[0071] It can be understood that the first fixed end 211 of the movable mechanism 21 is set as the cylinder body of the cylinder, and the first driving end 212 is set as the piston rod of the cylinder. The movement direction of the piston rod determines the movement direction of the movable carrier 20. Therefore, the piston rod of the cylinder in this embodiment extends from one end set in its cylinder body toward or away from the fixed carrier 10, so that when the piston rod is connected to the movable carrier 20, it drives the movable carrier 20 to reciprocate in the direction of approaching or away from the fixed carrier 10.

[0072] The cylinder body of the air cylinder is specifically arranged between the first support plate 22 and the movable carrier plate 20, so that the movable carrier plate 20 and the first support plate 22 can provide protection for the air cylinder to a certain extent, and can also improve the compactness of the structure between the movable carrier plate 20, the movable mechanism 21 and the first support plate 22. Since the air cylinder can only move along a preset direction, when the air cylinder is located between the first support plate 22 and the piston rod, the piston rod cannot be directly connected to the movable carrier plate 20 (if directly connected, it can only drive the movable carrier plate 20 to rise and fall), and when the cylinder body and the piston rod are arranged parallel to the first support plate 22 and the movable carrier plate 20, the piston rod of the air cylinder is connected to the movable carrier plate 20 through the attachment plate 23. Generally, due to the characteristics of the plate processing technology, the outer side surface of the attachment plate 23 is perpendicular to its front side surface and rear side surface, so that the attachment plate 23 can be arranged perpendicular to the piston rod and the movable carrier plate 20. The attached plate 23 can be arranged perpendicular to the movable carrier plate 20, so that the piston rod is perpendicular to the front side and / or rear side of the attached plate 23, so that the attached plate 23 can be connected to the piston rod through its front side and / or rear side. Of course, the piston rod can also be connected to the attached plate 23 through the limiting mechanism (such as the limiting mechanism) disposed on the front and rear sides of the attached plate 23. Figure 5The nuts shown in the figure drive the attached plate 23 to move in the front and rear directions respectively, and the attached plate 23 can be installed on the lower surface of the movable carrier plate 20 through its outer side surface to reduce the difficulty of assembling the floating plate 20 and the cylinder and improve the assembly accuracy.

[0073] Continuing with the above embodiment, a avoidance groove 24 is further provided at a position of the fixed carrier plate 10 corresponding to the position where the attached movable plate 23 is provided. The avoidance groove 24 runs through the upper and lower side surfaces of the fixed carrier plate 10, and the groove opening of the avoidance groove 24 is provided at the plate edge of the fixed carrier plate 10. The attached movable plate 23 is at least partially movably located in the avoidance groove 24, so that the portion of the attached movable plate 23 located in the avoidance groove 24 can be arranged relative to the groove wall of the avoidance groove 24 (which can also be understood as the plate edge of the fixed carrier plate 10), providing corresponding installation space for the guide mechanism described later, thereby ensuring that the plate positioning fixture has a compact structure.

[0074] In the above embodiment, due to the small gap between the first support plate 22 and the movable carrier plate 20, a avoidance groove 24 for accommodating part of the attached plate 23 is provided on the fixed carrier plate 10, so as to avoid interference between the attached plate 23 and the fixed carrier plate 10. At the same time, due to the low guiding accuracy of the cylinder itself, a guiding structure can be further provided between the groove wall of the avoidance groove 24 and the attached plate 23 to improve the guiding accuracy of the movable mechanism 21.

[0075] Furthermore, the groove wall of the avoidance groove 24 and the attached plate 23 are guided and matched by a first guide mechanism 25, and the first guide mechanism 25 can be configured as a guide rod 251 disposed between the attached plate 23 and the groove wall of the avoidance groove 24, such as Figure 5 As shown, when the guide rod 251 is arranged on the groove wall of the avoidance groove 24 , the guide rod 251 is arranged parallel to the piston rod of the cylinder, and a guide opening 231 matching the guide rod 251 can be arranged on the movable plate 23 .

[0076] Of course, the structure of the first guide mechanism 25 is not limited to this. The first guide mechanism 25 can also guide the movement direction of the movable carrier plate 20 through other guide structures that are beneficial to improving the stability of the cylinder, such as the cooperation of the guide groove and the guide block. However, it is obvious that the implementation method of using the guide rod 251 and the guide port 231 is more conducive to controlling the cost of the plate positioning fixture.

[0077] In this embodiment, in order to improve the versatility of the panel positioning fixture, the fixed carrier 10 and the movable carrier 20 are set as long and approximately long strip-shaped plate structures. In this way, the movement of the movable carrier 20 relative to the fixed carrier 10 will bring a greater burden to the movable mechanism 21, and the movable carrier 20 will also tilt on the first support plate 22, affecting the clamping effect of the PCB board. Therefore, in one embodiment, in order to improve the movement stability between the first support plate 22 and the movable carrier 20, at least two movable mechanisms 21 are set, and at least two movable mechanisms 21 are spaced apart along the length direction of the panel to ensure that the driving force acting on the movable carrier 20 is more uniform, so that the stability of the movable carrier 20 is improved.

[0078] Of course, in other embodiments, the movable mechanism 21 may also be, but is not limited to, an electric drive device (such as a motor), a hydraulic drive device, or other pneumatic drive devices.

[0079] In one embodiment, please continue to refer to the attached Figure 2-Figure 6 In order to further improve the stability of the movable carrier 20 during the movement relative to the first support plate 22, a second guide mechanism 26 is further provided between the first support plate 22 and the movable carrier 20. The second guide mechanism 26 is provided in at least two numbers. The at least two second guide mechanisms 26 are arranged at intervals along the length direction of the movable carrier 20 and are respectively connected to the first support plate 22 and the movable carrier 20.

[0080] In one embodiment, the second guide mechanism 26 can be respectively disposed near the first support plate 22 and the opposite ends of the movable carrier plate 20 to maximize the guiding range of the second guide mechanism 26 on the movable carrier plate 20 and reduce the tilting of the movable carrier plate 20 relative to the first support plate 22;

[0081] In another embodiment, the second guide mechanism 26 can be alternately arranged with the movable mechanism 21 along the length direction, so that the movable carrier 20 can be uniformly guided and supported by the second guide mechanism 26 in the length direction. In addition, in combination with the above-mentioned implementation method of setting the first guide mechanism 25 on the basis of the movable mechanism 21, the connection area between the movable carrier 20 and the first support plate 22 can be further increased. While improving the coordination stability between the two, the movable carrier 20 also improves its motion positioning accuracy on the solder paste printing equipment through the first support plate 22, so that it can be clamped on the PCB board more stably.

[0082] It is understandable that in order to save the space occupied by the second guide structure and improve the structural compactness of the plate positioning fixture, the second guide mechanism 26 and the movable mechanism 21 are both arranged between the gap between the first support plate 22 and the movable carrier plate 20. In this example, since the second guide mechanism 26 does not need to be integrated with the movable mechanism 21 and other related components, the second guide mechanism 26 has a wider layout space between the movable carrier plate 20 and the first support plate 22. Therefore, the second guide mechanism 26 can adopt a guide structure with stronger guiding stability, which can be, but not limited to, a linear guide rail.

[0083] Please continue to refer to the attached Figure 1-Figure 5 As a specific embodiment of the adsorption structure 40, multiple groups of adsorption structures 40 located on the fixed carrier 10 are arranged at intervals along the extension direction of the inner side surface of the fixed carrier 10, and multiple groups of adsorption structures 40 located on the movable carrier 20 are arranged at intervals along the extension direction of the inner side surface of the movable carrier 20, so that when the steel mesh is placed on the fixed carrier 10 and the movable carrier 20, the opposite sides of the steel mesh can be stably adsorbed on the supporting parts of the two. In addition, since the adsorption structures 40 are evenly distributed along the length direction, the steel mesh as a whole will not have problems such as warping and bulging, so that the PCB board can be evenly attached to the steel mesh, which is beneficial to the subsequent solder paste printing process.

[0084] Specifically, each group of adsorption structures 40 includes a plurality of vacuum adsorption holes 41. In each group of adsorption structures 40 located on the fixed carrier 10, the plurality of vacuum adsorption holes 41 are arranged at intervals from the outer side of the upper surface of the fixed carrier 10 to the inner side. And, in each group of adsorption structures 40 located on the movable carrier 20, the plurality of vacuum adsorption holes 41 are arranged at intervals from the outer side of the upper surface of the movable carrier 20 to the inner side. Through the above-mentioned arrangement, the adsorption structure 40 can provide a stable adsorption force in both the length direction and the width direction of the fixed carrier 10 and the movable carrier 20, and the adsorption area of ​​the plate positioning fixture and the steel mesh is increased as much as possible within the limited support area, so that the adsorption stability of the steel mesh on the fixed carrier 10 and the movable carrier 20 is higher, so that even if the steel mesh is subsequently pushed against by the PCB board, it can still maintain a relatively stable matching relationship with the fixed carrier 10 and the movable carrier 20.

[0085] In one embodiment, the distance between any adsorption structure 40 located on the fixed carrier 10 and the inner plate edge of the fixed carrier 10 is set to be greater than the distance between it and the outer plate edge, and the distance between any adsorption structure 40 located on the movable carrier 20 and the inner plate edge of the movable carrier 20 is set to be greater than the distance between it and the outer plate edge. In this way, the difficulty of processing the adsorption structure 40 on the fixed carrier 10 and the movable carrier 20 is reduced on the basis of ensuring a strong adsorption force on the steel mesh, and since one end of the vacuum adsorption hole 41 used for connecting with the vacuum source is set at the outer plate edge of the fixed carrier 10 and the movable carrier 20, the vacuum adsorption hole 41 is set close to the outer side of the carrier, which can reduce the burden of the vacuum source and improve the adsorption capacity of the vacuum adsorption hole 41.

[0086] In one embodiment, please refer to the attached Figure 1-Figure 5 , a first identification hole 111 is provided on the upper surface of the fixed carrier 10, and the first identification hole 111 is arranged near the inner side of the fixed carrier 10. And, a second identification hole 271 is provided on the upper surface of the movable carrier 20, and the second identification hole 271 is arranged near the inner side of the movable carrier 20. The first identification hole 111 on the fixed carrier 10 and the second identification hole 271 on the movable carrier 20 can be set to be multiple, and the first identification hole 111 and the second identification hole 271 are used for positioning and identifying the image acquisition unit (such as a camera) in the board positioning fixture, so that when the board positioning fixture clamps the PCB board, the image acquisition unit can further determine the relative position of the PCB board and the board positioning fixture by identifying the Mark point (positioning point or reference point) on the PCB board, thereby improving the accuracy of the subsequent steel mesh and the accuracy of the tin brushing process.

[0087] It can be understood from the above embodiments that the fixed carrier 10 and the movable carrier 20 are in a long strip structure. In one embodiment, in order to ensure that the positioning accuracy of the two can meet the clamping requirements of the PCB board, the fixed carrier 10 is configured to include a first identification plate 11 located at opposite ends of the body of the fixed carrier 10, the first identification hole 111 is arranged on the first identification plate 11, and the movable carrier 20 is configured to include a second identification plate 27 located at opposite ends of the body of the movable carrier 20. The first identification plate 11 and the second identification plate 27 respectively configure the fixed carrier 10 and the movable carrier 20 as a partially separated structure, which can reduce the difficulty of carrier processing, increase the space for subsequent assembly and debugging, and reduce the risk of the accuracy of the panel positioning fixture decreasing over time.

[0088] In one embodiment, the first identification hole 111 and the second identification hole 271 can be respectively opened on the first identification plate 11 and the second identification plate 27. In this way, the identification holes are processed on the identification plates, which can reduce the processing difficulty of the fixed carrier 10 body and the movable carrier 20 body. Of course, in some embodiments, the first identification hole 111 and the second identification hole 271 can also be respectively set on the fixed carrier 10 body and the movable carrier 20 body, or the first identification hole 111 can also be simultaneously set on the fixed carrier 10 body and the first identification plate 11, and the second identification hole 271 can be simultaneously set on the movable carrier 20 body and the second identification plate 27, so that the image acquisition unit can identify and locate the identification holes of corresponding spacing according to the plates of different types and sizes.

[0089] In one implementation manner, based on any of the above embodiments, Figure 2-Figure 7 As shown, the panel positioning fixture further includes a pressing plate mechanism 60 , which is movably disposed on the fixed carrier plate 10 and / or the movable carrier plate 20 , and has a pressing plate position and a releasing position. When the pressing plate mechanism 60 is in the pressing plate position, the pressing plate mechanism 60 at least partially protrudes from the inner side surface of the fixed carrier 10 and / or the movable carrier 20, so that the pressing plate mechanism 60 protruding from the inner side surface of the fixed carrier 10 and the inner side surface of the movable carrier 20 can be located in the clamping space 30, and the height position of the board in the clamping space 30 is constrained. When the PCB board is lifted upward under the clamping space 30, the upper surface of the PCB board can finally abut against the pressing plate mechanism 60 in the pressing plate position, ensuring that the height position of the PCB board meets the subsequent tin brushing requirements, and then the PCB board is further clamped and fixed; when the pressing plate mechanism 60 is in the releasing position, the pressing plate mechanism 60 is retracted into the inner side surface of the fixed carrier 10 and / or the movable carrier 20 to release the PCB board in the clamping space 30, so that it can move relative to the board positioning fixture to leave the corresponding station, or enter the clamping space 30 from the previous station.

[0090] The existence of the pressing plate mechanism 60 can constrain the height position of the PCB board before it is clamped and fixed, so that the height position of the PCB board on the board positioning fixture can meet the coordination requirements with the steel mesh, making the subsequent tin brushing operation more stable.

[0091] Based on the above embodiment, the panel positioning fixture further includes a lifting mechanism (not shown), which is located between the fixed carrier plate 10 and the movable carrier plate 20 and can perform lifting and lowering movements below the clamping space 30 .

[0092] In actual application scenarios, the PCB board is transported from the previous workstation equipment to the lifting mechanism and supported by the lifting mechanism, so that the lifting mechanism can drive the PCB board to move up and down in the direction close to or away from the clamping space 30 in the above-mentioned movement direction, and can drive the PCB board into or out of the clamping space 30. In cooperation with the above-mentioned pressing plate mechanism 60, before the lifting mechanism drives the PCB board to lift from outside the clamping space 30 to the clamping space 30, the pressing plate mechanism 60 can be switched from the release position to the pressing plate position. In this way, when the PCB board is driven to rise by the lifting mechanism, the height position of the PCB board can be limited by the pressing plate mechanism 60, avoiding the situation where the lifting mechanism over-lifts the PCB board, and ensuring that the final position of the PCB board meets the subsequent tin brushing requirements.

[0093] Specifically, taking the above implementation as an example, the process of the panel positioning fixture of this implementation for clamping and fixing the PCB board is as follows:

[0094] The PCB board is transported from the previous station equipment of the solder paste printing equipment to the solder paste conveying equipment through the conveyor line and is located below the board positioning fixture. Subsequently, the PCB board rises and enters the clamping space 30 from below the clamping space 30. At this time, the clearance between the movable carrier 20 and the fixed carrier 10 is larger than the width of the PCB board, and the pressure plate mechanism 60 is switched from the release position to the pressure plate position, so that the PCB board can be pressed against the pressure plate mechanism 60 during the rising period and its height position is constrained by the pressure plate mechanism 60. Finally, the movable carrier 20 moves in the direction close to the fixed carrier 10 to push the PCB board to a position against the fixed carrier 10, so that the movable carrier 20 can cooperate with the fixed carrier 10 to clamp the PCB board.

[0095] The image acquisition unit determines the relative position of the PCB board and the board positioning fixture by identifying the first identification hole 111, the second identification hole 271 and the mark point on the PCB board, and places the steel mesh at the position corresponding to the PCB board according to the corresponding position information and fixes it by adsorption through the adsorption structure 40 arranged on the fixed carrier 10 and the movable carrier 20, waiting for the subsequent tin brushing process.

[0096] Please refer to the attached Figure 2-Figure 7In order to ensure that the existence of the pressure plate mechanism 60 does not cause the structure of the plate positioning fixture to be too complicated, the first movable opening 12 penetrating the upper and lower surfaces of the fixed carrier 10 is provided in the present embodiment, and the inner side of the fixed carrier 10 is also provided with a first telescopic opening 121 connected to the first movable opening 12. The pressure plate mechanism 60 includes a first pressure plate assembly 61, the first pressure plate assembly 61 includes a first pressure plate driving device 611 and a first pressure plate body 612, the first pressure plate driving device 611 is arranged at the lower side of the fixed carrier 10, the first pressure plate driving device 611 has a second fixed end 6111 and a second driving end 6112, the second fixed end 6111 is relatively fixed to the fixed carrier 10, the first pressure plate body 612 is arranged at the second driving end 6112 and is located in the first movable opening 12, and the second driving end 6112 is used to move relative to the second fixed end 6111 to drive the first pressure plate body 612 to extend out of the inner side of the fixed carrier 10 through the first telescopic opening 121 or retract into the first movable opening 12.

[0097] The height of the upper surface of the first pressing plate body 612 is less than or equal to the height of the upper surface of the fixed carrier 10 to prevent the steel mesh from being interfered with and arched by the first pressing plate when supported by the fixed carrier 10 and the movable carrier 20 .

[0098] In one embodiment, a groove structure is further provided on the peripheral side of the fixed carrier 10 located at the first movable opening 12, so that the first pressure plate assembly 61 can be partially placed in the groove. By combining with the above-mentioned first movable opening 12, the first pressure plate body 612 can also utilize the thickness size of the fixed carrier 10 to save the space occupied by the first pressure plate assembly 61 on the fixed carrier 10, thereby meeting the design requirements of the fixed carrier 10 for its compact structure.

[0099] In one embodiment, in order to allow the fixed carrier 10 to be stably installed on the solder paste printing equipment, a second support plate 13 is also provided on the lower surface of the fixed carrier 10. The fixed carrier 10 can be installed on the solder paste printing equipment through the second support plate 13, and the second fixed end 6111 of the first pressure plate driving device 611 can also be fixedly connected to the second support plate 13.

[0100] Similar to the fixed carrier plate 10 , the movable carrier plate 20 is provided with a second movable opening 28 penetrating the upper and lower surfaces thereof, and the inner side surface of the movable carrier plate 20 is further provided with a second telescopic opening 281 communicating with the second movable opening 28 . Correspondingly, the pressure plate mechanism 60 includes a second pressure plate assembly 62, and the second pressure plate assembly 62 includes a second pressure plate driving device 621 and a second pressure plate body 622. The second pressure plate driving device 621 is arranged on the lower side of the movable carrier 20. In the above-mentioned embodiment in which the first support plate 22 is arranged, the second pressure plate driving device 621 is located between the movable carrier 20 and the first support plate 22. The second pressure plate driving device 621 has a third fixed end 6211 and a third driving end 6212. The third fixed end 6211 is relatively fixed to the movable carrier 20. The second pressure plate body 622 is arranged at the third driving end 6212 and is located in the second movable opening 28. The third driving end 6212 is used to move relative to the third fixed end 6211 to drive the second pressure plate body 622 to extend out of the inner side of the movable carrier 20 through the second telescopic opening 281 or retract into the second movable opening 28.

[0101] Likewise, the height of the upper surface of the second pressing plate body 622 is less than or equal to the height of the upper surface of the movable carrier plate 20 .

[0102] like Figure 1-Figure 8 As shown, this embodiment also provides a plate clamping method, which is applied to the plate positioning fixture as described above. Specifically, the plate clamping method includes the steps of:

[0103] S10, obtaining the distance data between it and the plate located in the clamping space 30 through the distance meter 50;

[0104] S20, judging whether the plate in the clamping space 30 is arched according to the distance data;

[0105] S30, adjusting the clamping force applied by the movable carrier plate 20 to the plate by using a proportional servo valve according to the judgment result.

[0106] In the above step S30, if the judgment result is yes, the clamping force applied by the movable carrier plate 20 to the plate is reduced through the proportional servo valve;

[0107] If the judgment result is no, the clamping force applied by the movable carrier plate 20 to the plate is increased by the proportional servo valve until the judgment result is yes, and then the clamping force applied by the movable carrier plate 20 to the plate is reduced by the proportional servo valve until the re-judgment result is restored to no. This state can be repeated all the time, or the proportional servo valve can stop controlling the movable carrier plate 20 when the re-judgment result is no, so that the movable carrier plate 20 stays in the current state.

[0108] In the description herein, it should be understood that the terms "upper", "lower", "left", "right", etc., and other directions or positional relationships are only for the convenience of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0109] In the description of this specification, the description with reference to the terms "an embodiment", "example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example.

[0110] In addition, it should be understood that although this specification is described according to implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0111] The technical principle of the present invention is described above in conjunction with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the scope of protection of the present invention in any way. Based on the explanations herein, those skilled in the art can associate other specific implementations of the present invention without paying creative labor, and these methods will fall within the scope of protection of the present invention.

Claims

1. A plate positioning fixture, characterized in that: include: Fixing the carrier plate (10); as well as A movable carrier plate (20), wherein the inner side surfaces of the movable carrier plate (20) and the fixed carrier plate (10) are arranged opposite to each other and spaced apart so as to form a clamping space (30) for the plate therebetween, and the movable carrier plate (20) can reciprocate in a direction approaching and moving away from the fixed carrier plate (10) through a movable mechanism (21) to adjust the size of the clamping space (30); A plurality of groups of adsorption structures (40) are evenly distributed on the upper surfaces of the fixed carrier plate (10) and the movable carrier plate (20); a distance meter (50), arranged above the clamping space (30), and used to obtain distance data between the distance meter and a plate located in the clamping space (30); a first supporting plate (22), the movable carrier plate (20) being movably mounted on the first supporting plate (22) via the movable mechanism (21); The movable mechanism (21) has a first fixed end (211) and a first driving end (212), and the movable mechanism (21) is connected to the first supporting plate (22) and the movable carrier plate (20) respectively through the first fixed end (211) and the first driving end (212); The movable mechanism (21) is configured as a cylinder, the cylinder is located between the first support plate (22) and the movable carrier plate (20), and the piston rod of the cylinder is connected to the movable carrier plate (20) via an attached plate (23); A position-avoiding groove (24) is also provided on one side of the movable carrier plate (20), and the movable plate (23) is at least partially movably located in the position-avoiding groove (24), and the groove wall of the position-avoiding groove (24) and the movable plate (23) are guided and matched by a first guiding mechanism (25); A second guiding mechanism (26) is further provided between the first supporting plate (22) and the movable carrier plate (20), and the number of the second guiding mechanisms (26) is at least two; At least two of the second guide mechanisms (26) are arranged at intervals along the length direction of the movable carrier plate (20) and are respectively connected to the first support plate (22) and the movable carrier plate (20); It also includes a pressing plate mechanism (60) which is movably arranged on the fixed carrier plate (10) and / or the movable carrier plate (20), and the pressing plate mechanism (60) has a pressing plate position and a releasing position; When the pressing plate mechanism (60) is in the pressing plate position, the pressing plate mechanism (60) at least partially protrudes from the inner side surface of the fixed carrier plate (10) and / or the movable carrier plate (20); when the pressing plate mechanism (60) is in the releasing position, the pressing plate mechanism (60) is retracted into the inner side surface of the fixed carrier plate (10) and / or the movable carrier plate (20).

2. The plate positioning fixture according to claim 1, characterized in that: The plurality of groups of adsorption structures (40) located on the fixed carrier (10) are arranged at intervals along the extension direction of the inner side surface of the fixed carrier (10), and the plurality of groups of adsorption structures (40) located on the movable carrier (20) are arranged at intervals along the extension direction of the inner side surface of the movable carrier (20); Each group of the adsorption structures (40) comprises a plurality of vacuum adsorption holes (41); in each group of the adsorption structures (40) located on the fixed carrier (10), the plurality of vacuum adsorption holes (41) are arranged at intervals from the outer side of the upper surface of the fixed carrier (10) to the inner side; and in each group of the adsorption structures (40) located on the movable carrier (20), the plurality of vacuum adsorption holes (41) are arranged at intervals from the outer side of the upper surface of the movable carrier (20) to the inner side.

3. The plate positioning fixture according to claim 1, characterized in that: Also includes: A lifting mechanism is located between the fixed carrier plate (10) and the movable carrier plate (20) and can perform lifting movement below the clamping space (30).

4. The plate positioning fixture according to claim 1, characterized in that: The fixed carrier plate (10) is provided with a first movable opening (12) penetrating the upper and lower surfaces thereof, and the inner side surface of the fixed carrier plate (10) is also provided with a first telescopic opening (121) communicating with the first movable opening (12); The pressure plate mechanism (60) comprises a first pressure plate assembly (61), the first pressure plate assembly (61) comprises a first pressure plate driving device (611) and a first pressure plate body (612), the first pressure plate driving device (611) is arranged on the lower side of the fixed carrier (10), the first pressure plate driving device (611) has a second fixed end (6111) and a second driving end (6112), the second fixed end (6111) is relatively fixed to the fixed carrier (10), the first pressure plate body (612) is arranged at the second driving end (6112) and is located in the first movable opening (12), and the height of the upper surface of the first pressure plate body (612) is less than or equal to the height of the upper surface of the fixed carrier (10); The second driving end (6112) is used to move relative to the second fixed end (6111) to drive the first pressing plate body (612) to extend out of the inner side surface of the fixed carrier plate (10) through the first telescopic opening (121) or to retract into the first movable opening (12).

5. The plate positioning fixture according to claim 1, characterized in that: The movable carrier plate (20) is provided with a second movable opening (28) penetrating the upper and lower surfaces thereof, and the inner side surface of the movable carrier plate (20) is also provided with a second telescopic opening (281) communicating with the second movable opening (28); The pressure plate mechanism (60) comprises a second pressure plate assembly (62), the second pressure plate assembly (62) comprises a second pressure plate driving device (621) and a second pressure plate body (622), the second pressure plate driving device (621) is arranged on the lower side of the movable carrier (20), the second pressure plate driving device (621) has a third fixed end (6211) and a third driving end (6212), the third fixed end (6211) is relatively fixed to the movable carrier (20), the second pressure plate body (622) is arranged at the third driving end (6212) and is located in the second movable opening (28), and the height of the upper surface of the second pressure plate body (622) is less than or equal to the height of the upper surface of the movable carrier (20); The third driving end (6212) is used to move relative to the third fixed end (6211) to drive the second pressing plate body (622) to extend out of the inner side of the movable carrier plate (20) through the second telescopic opening (281) or to retract into the second movable opening (28).

6. A plate clamping method, characterized in that: Applied to the panel positioning fixture according to any one of claims 1 to 5, the panel clamping method comprises the steps of: S10, obtaining distance data between the plate located in the clamping space by means of a distance meter; S20, judging whether the plate in the clamping space is arched according to the distance data; S30, adjusting the clamping force applied by the movable carrier plate to the plate by using a proportional servo valve according to the judgment result.

Images