A process for repairing the bending insulation of a flexible interconnected flat cable

Abstract

The invention relates to the technical field of cable bending insulation repair, and specifically to a flexible interconnected flat cable bending insulation repair process, comprising the following steps: step 1, cutting the insulation film between the positioned cables with a laser cutting machine; step 2, cleaning the cables after the insulation film cutting is completed, and then repairing them by applying an insulation coating repair liquid; step 3, bending the repaired cables of a corresponding number with a bending machine; the present application adds functionalized microcapsules, the outer layer of which is prepared by chemical crosslinking of butyl methacrylate, methyl methacrylate and functional monomers, the inner core contains polyacrylamide, and the functional monomers have pyrimidine rings, amino groups, disulfide bonds, pyridine groups, thiol groups and flexible long-chain alkane structures, and the toughness and self-repairing performance of the cable are improved through the synergistic effect of the structures.

Description

Technical Field

[0001] The invention relates to the technical field of cable bending insulation repair, and in particular to a flexible interconnected flat cable bending insulation repair process. Background Art

[0002] Flexible interconnect flat cables not only have good high temperature resistance, low temperature resistance, chemical corrosion resistance and other properties, but also adopt a multi-layer structure, which makes them play an important role in electronic equipment and systems.

[0003] During the use of flexible interconnect flat cables, due to the needs of the application scenarios, the cables need to be bent and cut, and other processes. The above processes may cause damage or deterioration of the cables, thereby affecting the transmission performance and safety of the cables. In the prior art, epoxy resin-based insulation coating repair fluids are often used to repair damaged insulation films. However, due to the presence of oxygen-containing structures in the epoxy resin molecular chain, which are sensitive to light, heat, oxygen, etc., aging will occur during storage and use, affecting the comprehensive performance of the insulation coating repair fluid. Antioxidants are usually added to improve their weather resistance, but conventional antioxidants have a small molecular weight and cannot participate in the curing reaction. They are easy to migrate and precipitate, thereby affecting the repair performance and toughness of the repair fluid.

[0004] Based on the above statements, the present invention provides a flexible interconnect flat cable bending insulation repair process. Summary of the invention

[0005] To achieve the above object, the present invention provides the following technical solution: a flexible interconnected flat cable bending insulation repair process, comprising the following steps:

[0006] Step 1: Use a laser cutting machine to cut the insulation film between the positioned cables;

[0007] Step 2, cleaning the cable after the insulation film is cut, and then repairing it by applying insulation coating repair liquid;

[0008] Step 3: Use a bending machine to bend the corresponding number of repaired cables.

[0009] Preferably, the laser cutting machine in step 1 is a carbon dioxide laser cutting machine.

[0010] The present invention further provides a formula of an insulation coating repair liquid, wherein the insulation coating repair liquid in step 2 comprises the following raw materials in parts by weight: 0.5-5 parts of a thermosetting epoxy resin, 0.2-2.4 parts of functionalized microcapsules, 2-10 parts of ethyl acetate, 0.1-0.5 parts of a high temperature resistant antioxidant, 0.24-1.6 parts of a curing agent, 0.01-0.08 parts of a photoinitiator and 0.1-0.3 parts of polyacrylamide.

[0011] The present invention further provides a method for preparing an insulation coating repair liquid. The specific preparation method of the insulation coating repair liquid in step 1 comprises the following steps:

[0012] Step S1, mixing the heat-curing epoxy resin and ethyl acetate uniformly to obtain a first mixed solution;

[0013] Step S2, adding polyacrylamide to the first mixed solution and stirring evenly to obtain a second mixed solution;

[0014] Step S3, adding functionalized microcapsules, high temperature resistant antioxidant, curing agent and photoinitiator to the second mixed liquid, stirring evenly, maintaining the rotation speed unchanged, placing it under ultraviolet irradiation for 12-26 minutes while stirring, and controlling the irradiation temperature to 75-85°C to obtain an insulating coating repair liquid.

[0015] Preferably, in step S3, the high temperature resistant antioxidant is at least one of tetra-tert-butylphenol acrylate and tetra-tert-butyl-p-hydroxyphenyl acrylate.

[0016] Preferably, the heat-curing epoxy resin is bisphenol A epoxy resin.

[0017] Preferably, the curing agent is any one of dicyandiamide or diaminodiphenyl sulfone.

[0018] Preferably, the photoinitiator is a mixture of 2,2-dimethoxy-2-phenylacetophenone and azobisisobutyronitrile in a mass ratio of 1.4:2-6.

[0019] Preferably, the peak wavelength of the ultraviolet light irradiation is 365nm and the intensity is 60-80mw / cm 2 .

[0020] Preferably, the functionalized microcapsules are prepared by the following steps:

[0021] The method comprises the following steps: adding butyl methacrylate, methyl methacrylate and functional monomers to petroleum ether, adding Span-80, Tween-80 and dibenzoyl peroxide while stirring, and dripping polyacrylamide aqueous solution while stirring, and controlling the dripping to be completed within 15 minutes to obtain an emulsion, heating to 65-75°C, stirring and reacting for 3.5-4.5 hours, and after the reaction is completed, filtering, washing and drying to obtain functionalized microcapsules, wherein butyl methacrylate, methyl methacrylate, functional monomers, petroleum ether, Span-80 and dibenzoyl peroxide are added. The mass ratio of Tween-80, Tween-80, dibenzoyl peroxide and polyacrylamide aqueous solution is 2-3: 6.5-7.5: 3-4: 50-60: 0.3-0.4: 0.6-0.9: 0.2-0.3: 15-25. In the above reaction process, butyl methacrylate, methyl methacrylate and functional monomers are used as wall materials, polyacrylamide aqueous solution is used as core material, dibenzoyl peroxide is used as initiator, and functional microcapsules are prepared through free radical initiation reaction.

[0022] Preferably, the mass fraction of the polyacrylamide aqueous solution is 22-26%.

[0023] Preferably, the functional monomer is prepared by the following steps:

[0024] Step A1, 3,3'-dithiodipropionic acid and 2,6-diaminopyridine are added to anhydrous DMF, stirred evenly, and then N,N'-carbonyldiimidazole is added, the temperature is raised to 85-95°C, stirred for reaction for 6-8h, and after the reaction is completed, the temperature is lowered to room temperature, filtered, and the filter cake is washed and dried to obtain a pyridyl monomer, wherein the mass ratio of 3,3'-dithiodipropionic acid, 2,6-diaminopyridine, anhydrous DMF and N,N'-carbonyldiimidazole is 7.4-8.6:3.7-4.3:65-75:5.2-6.0. In the above reaction process, anhydrous DMF is used as a solvent, and the carboxyl group on the 3,3'-dithiodipropionic acid and the amino group on the 2,6-diaminopyridine undergo esterification reaction to obtain a pyridyl monomer. The structural formula of the pyridyl monomer is as follows:

[0025]

[0026] In the above reaction process, the amount of 3,3'-dithiodipropionic acid and 2,6-diaminopyridine is controlled so that there are still remaining amino groups and carboxyl groups that can participate in the subsequent reaction process;

[0027] Step A2, adding a pyridine monomer to anhydrous DMF, stirring evenly, adjusting the pH value to 8-9, then dropping a mixed solution a of octenyl succinic anhydride and isopropanol, heating to 60-70°C, continuing stirring for 4-6h, and then adjusting the pH value to 6.4-6.8, washing with deionized water to neutrality, and drying to obtain an unsaturated monomer, wherein the mass ratio of the pyridine monomer, anhydrous DMF, and mixed solution a is 2-3:40-50:25, and the mass ratio of octenyl succinic anhydride and isopropanol in the mixed solution a is 2.1-2.3:15-25, and the structural formula of the unsaturated monomer is as follows:

[0028]

[0029] In the above reaction process, anhydrous DMF is used as solvent, and the amino group on the pyridine monomer and octenyl succinic anhydride undergo a ring-opening esterification reaction to obtain an unsaturated monomer;

[0030] Step A3, adding unsaturated monomer and 4,6-diamino-2-mercaptopyrimidine to anhydrous DMF, stirring evenly, then adding dicyclohexylcarbodiimide and 4-dimethylaminopyridine, heating to 75-85°C, stirring for reaction for 4-6h, and cooling to room temperature after the reaction, filtering by suction, washing the filter cake, and drying to obtain a functional monomer, wherein the mass ratio of the unsaturated monomer, 4,6-diamino-2-mercaptopyrimidine, anhydrous DMF, dicyclohexylcarbodiimide and 4-dimethylaminopyridine is 8.5-9.5:2.0-2.2:40-60:3.5-3.9:3.6-4.0. In the above reaction process, using anhydrous DMF as solvent, the carboxyl group on the unsaturated monomer undergoes an amidation reaction with the amino group on 4,6-diamino-2-mercaptopyrimidine to obtain a functional monomer, and the structure of the functional monomer is briefly described as follows:

[0031]

[0032] In the above reaction process, the amount of the unsaturated monomer is controlled to be slightly lower than that of 4,6-diamino-2-mercaptopyrimidine, so that the remaining amino groups on 4,6-diamino-2-mercaptopyrimidine can participate in the subsequent reaction process.

[0033] In order to ensure the integrity of the repair, the detailed steps in step 1 are as follows:

[0034] The cable with the insulation film cut is placed in an insulation cleaning liquid, immersed at 35-45°C for 12-16 hours, taken out, and then cleaned with anhydrous ethanol 3-5 times, wiped clean, and then coated with insulation coating repair liquid to make the insulation film of the corresponding cable adhere up and down, and then hot-pressed to obtain the product.

[0035] Preferably, the insulating cleaning liquid for the insulating film is S-4 insulating rubber product cleaning liquid.

[0036] Preferably, the coating has a thickness of 0.5-1 mm.

[0037] Preferably, the temperature of the hot pressing molding is 150-160° C. and the pressure is 15-17 MPa.

[0038] In summary, the present invention has the following beneficial effects:

[0039] The present application adds functionalized microcapsules to the insulation coating repair liquid. The outer layer of the functionalized microcapsules is a structure of chemically cross-linked butyl methacrylate, methyl methacrylate and functional monomers. The inner core contains polyacrylamide. The functional monomers have pyrimidine rings, amino groups, disulfide bonds, pyridyl groups, thiol groups and flexible long-chain alkane structures. The presence of pyrimidine rings and amino groups can produce multiple hydrogen bonds with the epoxy resin substrate, and can work together with dynamic disulfide bonds to give the insulation coating repair liquid self-healing properties. The presence of pyridyl groups not only makes the functionalized microcapsules have better lipophilicity and easier dispersion in the epoxy resin base material, but also the pyridyl groups can be chemically cross-linked with the epoxy resin substrate, further improving the toughness of the insulation coating repair liquid. The presence of thiol groups can chemically bond with high-temperature resistant antioxidants, and can give full play to the synergistic effect between them, significantly improving the repair performance and toughness of the repair liquid. The flexible long-chain alkane structure can entangle with the molecular chains of polyacrylamide and epoxy resin substrates to form a mutually entangled molecular interpenetrating network structure, further improving the toughness of the insulation coating repair liquid.

[0040] In this flexible interconnect flat cable bending insulation repair process, laser cutting is used for cable separation. The laser cutting incision is narrow, the two sides of the cut are parallel and perpendicular to the surface, and the dimensional accuracy of the cut parts can reach ±0.05mm. The cut surface is smooth and beautiful, and the surface roughness is very high. After the main material is laser cut, the width of the heat-affected zone is very small, and the performance of the material near the cut is almost unaffected. The material does not need to be clamped during laser cutting, which can save tooling and fixtures, and save auxiliary time for loading and unloading. Therefore, the part that needs to be bent is cut with a laser cutting machine, and the rest remains as it is.

[0041] This flexible interconnect flat cable bending insulation repair process realizes the special-shaped routing form of the flexible interconnect flat cable. By repairing the single bending insulation of the flexible interconnect flat cable, the performance parameters of the cable such as current carrying capacity, voltage resistance, and service life are still guaranteed to remain unchanged, thereby achieving the goal of safe transmission of aircraft power supply energy. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 It is a schematic diagram of the structural steps of the present invention;

[0043] Figure 2 This is a schematic diagram of the bending of the structural cable of the present invention;

[0044] Figure 3 It is a partial enlarged schematic diagram of the bending of the structural cable of the present invention. DETAILED DESCRIPTION

[0045] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0046] See also Figure 1-3 At the same time, the present application is further described in detail in conjunction with the embodiments.

[0047] Preparation Examples 1-3 and Comparative Preparation Examples 1-2 provide methods for preparing functional monomers.

[0048] Preparation Example 1

[0049] The functional monomer is prepared by the following steps:

[0050] Step A1, add 3,3'-dithiodipropionic acid and 2,6-diaminopyridine to anhydrous DMF, control the speed to 500rpm and stir for 25min until uniform, then add N,N'-carbonyldiimidazole, raise the temperature to 85°C, maintain the speed unchanged, continue stirring and react for 6h, after the reaction is completed, cool to room temperature, filter, wash the filter cake with anhydrous ethanol and deionized water for 3 times, and dry at 50°C to constant weight to obtain a pyridine monomer, wherein the mass ratio of 3,3'-dithiodipropionic acid, 2,6-diaminopyridine, anhydrous DMF and N,N'-carbonyldiimidazole is 7.4:3.7:65:5.2;

[0051] Step A2, adding a pyridine monomer to anhydrous DMF, stirring for 20 min at a controlled speed of 600 rpm until uniform, adjusting the pH value to 8 with a 0.6 M sodium hydroxide aqueous solution, then dropping a mixed solution a of octenyl succinic anhydride and isopropanol, heating to 60° C., maintaining the speed unchanged, continuing to stir and react for 4 h, then adjusting the pH value to 6.4, washing with deionized water to neutrality, and drying at 55° C. to constant weight to obtain an unsaturated monomer, wherein the mass ratio of the pyridine monomer, anhydrous DMF, and mixed solution a is 2:40:25, and the mass ratio of octenyl succinic anhydride and isopropanol in the mixed solution a is 2.1:15;

[0052] Step A3, add unsaturated monomer and 4,6-diamino-2-mercaptopyrimidine to anhydrous DMF, control the speed to 700 rpm and stir for 25 minutes until uniform, then add dicyclohexylcarbodiimide and 4-dimethylaminopyridine, raise the temperature to 75°C, maintain the speed unchanged, stir and react for 4 hours, after the reaction is completed, cool to room temperature, filter, wash the filter cake with anhydrous ethanol and deionized water for 3 times, and dry at 60°C to constant weight to obtain a functional monomer, wherein the mass ratio of unsaturated monomer, 4,6-diamino-2-mercaptopyrimidine, anhydrous DMF, dicyclohexylcarbodiimide and 4-dimethylaminopyridine is 8.5:2.0:40:3.5:3.6.

[0053] Preparation Example 2

[0054] The functional monomer is prepared by the following steps:

[0055] Step A1, add 3,3'-dithiodipropionic acid and 2,6-diaminopyridine to anhydrous DMF, control the speed to 550rpm and stir for 20min until uniform, then add N,N'-carbonyldiimidazole, raise the temperature to 90°C, maintain the speed unchanged, continue stirring and react for 7h, after the reaction is completed, cool to room temperature, filter, wash the filter cake with anhydrous ethanol and deionized water for 4 times, and dry at 55°C to constant weight to obtain a pyridine monomer, wherein the mass ratio of 3,3'-dithiodipropionic acid, 2,6-diaminopyridine, anhydrous DMF and N,N'-carbonyldiimidazole is 8.0:4.0:70:5.6;

[0056] Step A2, adding a pyridine monomer to anhydrous DMF, stirring for 15 min at a controlled speed of 650 rpm until uniform, adjusting the pH value to 8.5 with a 0.8 M sodium hydroxide aqueous solution, then dropwise adding a mixed solution a of octenyl succinic anhydride and isopropanol, heating to 65° C., continuing stirring for 5 h, then adjusting the pH value to 6.6, washing with deionized water to neutrality, and drying at 55° C. to constant weight to obtain an unsaturated monomer, wherein the mass ratio of the pyridine monomer, anhydrous DMF, and mixed solution a is 2.5:45:25, and the mass ratio of octenyl succinic anhydride and isopropanol in the mixed solution a is 2.2:20;

[0057] Step A3, add unsaturated monomer and 4,6-diamino-2-mercaptopyrimidine to anhydrous DMF, control the speed to 750 rpm and stir for 20 minutes until uniform, then add dicyclohexylcarbodiimide and 4-dimethylaminopyridine, raise the temperature to 85°C, stir and react for 6 hours, after the reaction is completed, cool to room temperature, filter, wash the filter cake, and dry to obtain a functional monomer, wherein the mass ratio of the unsaturated monomer, 4,6-diamino-2-mercaptopyrimidine, anhydrous DMF, dicyclohexylcarbodiimide and 4-dimethylaminopyridine is 9.0:2.1:50:3.7:3.8.

[0058] Preparation Example 3

[0059] The functional monomer is prepared by the following steps:

[0060] Step A1, add 3,3'-dithiodipropionic acid and 2,6-diaminopyridine to anhydrous DMF, control the speed to 600rpm and stir for 15min until uniform, then add N,N'-carbonyldiimidazole, raise the temperature to 95°C, stir and react for 8h, after the reaction is completed, cool to room temperature, filter, wash the filter cake with anhydrous ethanol and deionized water for 5 times, and dry at 60°C to constant weight to obtain a pyridine monomer, wherein the mass ratio of 3,3'-dithiodipropionic acid, 2,6-diaminopyridine, anhydrous DMF and N,N'-carbonyldiimidazole is 8.6:4.3:75:6.0;

[0061] Step A2, adding a pyridine monomer to anhydrous DMF, stirring at a speed of 700 rpm for 10 min until uniform, adjusting the pH value to 9 with a 1M sodium hydroxide aqueous solution, then dropping a mixed solution a of octenyl succinic anhydride and isopropanol, heating to 70°C, maintaining the speed unchanged, continuing to stir and react for 6 hours, then adjusting the pH value to 6.8, washing with deionized water to neutrality, and drying at 65°C to constant weight to obtain an unsaturated monomer, wherein the mass ratio of the pyridine monomer, anhydrous DMF, and mixed solution a is 3:50:25, and the mass ratio of octenyl succinic anhydride and isopropanol in the mixed solution a is 2.3:25;

[0062] Step A3, add the unsaturated monomer and 4,6-diamino-2-mercaptopyrimidine to anhydrous DMF, stir evenly, then add dicyclohexylcarbodiimide and 4-dimethylaminopyridine, raise the temperature to 85°C, stir and react for 6 hours, after the reaction is completed, cool to room temperature, filter, wash the filter cake, and dry it at 70°C to constant weight to obtain a functional monomer, wherein the mass ratio of the unsaturated monomer, 4,6-diamino-2-mercaptopyrimidine, anhydrous DMF, dicyclohexylcarbodiimide and 4-dimethylaminopyridine is 9.5:2.2:60:3.9:4.0.

[0063] Comparative Preparation Example 1

[0064] The functional monomer is prepared by the following steps:

[0065] Step A1, add malonic acid and 2,6-diaminopyridine to anhydrous DMF, control the speed to 500 rpm and stir for 25 minutes until uniform, then add N, N'-carbonyldiimidazole, raise the temperature to 85°C, maintain the speed unchanged, continue stirring and react for 6 hours, after the reaction is completed, cool to room temperature, filter, wash the filter cake with anhydrous ethanol and deionized water for 3 times, and dry at 50°C to constant weight to obtain a pyridine monomer, wherein the mass ratio of malonic acid, 2,6-diaminopyridine, anhydrous DMF and N, N'-carbonyldiimidazole is 7.4:3.7:65:5.2;

[0066] Step A2, adding a pyridine monomer to anhydrous DMF, stirring for 20 min at a controlled speed of 600 rpm until uniform, adjusting the pH value to 8 with a 0.6 M sodium hydroxide aqueous solution, then dropping a mixed solution a of octenyl succinic anhydride and isopropanol, heating to 60° C., maintaining the speed unchanged, continuing to stir and react for 4 h, then adjusting the pH value to 6.4, washing with deionized water to neutrality, and drying at 55° C. to constant weight to obtain an unsaturated monomer, wherein the mass ratio of the pyridine monomer, anhydrous DMF, and mixed solution a is 2:40:25, and the mass ratio of octenyl succinic anhydride and isopropanol in the mixed solution a is 2.1:15;

[0067] Step A3, add unsaturated monomer and 4,6-diamino-2-mercaptopyrimidine to anhydrous DMF, control the speed to 700 rpm and stir for 25 minutes until uniform, then add dicyclohexylcarbodiimide and 4-dimethylaminopyridine, raise the temperature to 75°C, maintain the speed unchanged, stir and react for 4 hours, after the reaction is completed, cool to room temperature, filter, wash the filter cake with anhydrous ethanol and deionized water for 3 times, and dry at 60°C to constant weight to obtain a functional monomer, wherein the mass ratio of unsaturated monomer, 4,6-diamino-2-mercaptopyrimidine, anhydrous DMF, dicyclohexylcarbodiimide and 4-dimethylaminopyridine is 8.5:2.0:40:3.5:3.6.

[0068] Comparative Preparation Example 2

[0069] The functional monomer is prepared by the following steps:

[0070] Step A1, add 3,3'-dithiodipropionic acid and o-phenylenediamine to anhydrous DMF, control the speed to 500 rpm and stir for 25 minutes until uniform, then add N,N'-carbonyldiimidazole, raise the temperature to 85°C, maintain the speed unchanged, continue stirring and react for 6 hours, after the reaction is completed, cool to room temperature, filter, wash the filter cake with anhydrous ethanol and deionized water for 3 times, and dry at 50°C to constant weight to obtain a pyridine monomer, wherein the mass ratio of 3,3'-dithiodipropionic acid, o-phenylenediamine, anhydrous DMF and N,N'-carbonyldiimidazole is 7.4:3.7:65:5.2;

[0071] Step A2, adding a pyridine monomer to anhydrous DMF, stirring for 20 min at a controlled speed of 600 rpm until uniform, adjusting the pH value to 8 with a 0.6 M sodium hydroxide aqueous solution, then dropping a mixed solution a of octenyl succinic anhydride and isopropanol, heating to 60° C., maintaining the speed unchanged, continuing to stir and react for 4 h, then adjusting the pH value to 6.4, washing with deionized water to neutrality, and drying at 55° C. to constant weight to obtain an unsaturated monomer, wherein the mass ratio of the pyridine monomer, anhydrous DMF, and mixed solution a is 2:40:25, and the mass ratio of octenyl succinic anhydride and isopropanol in the mixed solution a is 2.1:15;

[0072] Step A3, add unsaturated monomer and 4,6-diamino-2-mercaptopyrimidine to anhydrous DMF, control the speed to 700 rpm and stir for 25 minutes until uniform, then add dicyclohexylcarbodiimide and 4-dimethylaminopyridine, raise the temperature to 75°C, maintain the speed unchanged, stir and react for 4 hours, after the reaction is completed, cool to room temperature, filter, wash the filter cake with anhydrous ethanol and deionized water for 3 times, and dry at 60°C to constant weight to obtain a functional monomer, wherein the mass ratio of unsaturated monomer, 4,6-diamino-2-mercaptopyrimidine, anhydrous DMF, dicyclohexylcarbodiimide and 4-dimethylaminopyridine is 8.5:2.0:40:3.5:3.6.

[0073] Comparative Preparation Example 3

[0074] The functional monomer is prepared by the following steps:

[0075] Step A1, add 3,3'-dithiodipropionic acid and 2,6-diaminopyridine to anhydrous DMF, control the speed to 500rpm and stir for 25min until uniform, then add N,N'-carbonyldiimidazole, raise the temperature to 85°C, maintain the speed unchanged, continue stirring and react for 6h, after the reaction is completed, cool to room temperature, filter, wash the filter cake with anhydrous ethanol and deionized water for 3 times, and dry at 50°C to constant weight to obtain a pyridine monomer, wherein the mass ratio of 3,3'-dithiodipropionic acid, 2,6-diaminopyridine, anhydrous DMF and N,N'-carbonyldiimidazole is 7.4:3.7:65:5.2;

[0076] Step A2, adding a pyridine monomer to anhydrous DMF, stirring for 20 min at a controlled speed of 600 rpm until uniform, adjusting the pH value to 8 with a 0.6 M sodium hydroxide aqueous solution, then dropwise adding a mixed solution a of succinic anhydride and isopropanol, heating to 60° C., maintaining the speed unchanged, continuing to stir and react for 4 h, then adjusting the pH value to 6.4, washing with deionized water to neutrality, and drying at 55° C. to constant weight to obtain an unsaturated monomer, wherein the mass ratio of the pyridine monomer, anhydrous DMF, and mixed solution a is 2:40:25, and the mass ratio of succinic anhydride and isopropanol in the mixed solution a is 2.1:15;

[0077] Step A3, add unsaturated monomer and 4,6-diamino-2-mercaptopyrimidine to anhydrous DMF, control the speed to 700 rpm and stir for 25 minutes until uniform, then add dicyclohexylcarbodiimide and 4-dimethylaminopyridine, raise the temperature to 75°C, maintain the speed unchanged, stir and react for 4 hours, after the reaction is completed, cool to room temperature, filter, wash the filter cake with anhydrous ethanol and deionized water for 3 times, and dry at 60°C to constant weight to obtain a functional monomer, wherein the mass ratio of unsaturated monomer, 4,6-diamino-2-mercaptopyrimidine, anhydrous DMF, dicyclohexylcarbodiimide and 4-dimethylaminopyridine is 8.5:2.0:40:3.5:3.6.

[0078] Comparative Preparation Example 4

[0079] The functional monomer is prepared by the following steps:

[0080] Step A1, add 3,3'-dithiodipropionic acid and 2,6-diaminopyridine to anhydrous DMF, control the speed to 500rpm and stir for 25min until uniform, then add N,N'-carbonyldiimidazole, raise the temperature to 85°C, maintain the speed unchanged, continue stirring and react for 6h, after the reaction is completed, cool to room temperature, filter, wash the filter cake with anhydrous ethanol and deionized water for 3 times, and dry at 50°C to constant weight to obtain a pyridine monomer, wherein the mass ratio of 3,3'-dithiodipropionic acid, 2,6-diaminopyridine, anhydrous DMF and N,N'-carbonyldiimidazole is 7.4:3.7:65:5.2;

[0081] Step A2, adding a pyridine monomer to anhydrous DMF, stirring for 20 min at a controlled speed of 600 rpm until uniform, adjusting the pH value to 8 with a 0.6 M sodium hydroxide aqueous solution, then dropping a mixed solution a of octenyl succinic anhydride and isopropanol, heating to 60° C., maintaining the speed unchanged, continuing to stir and react for 4 h, then adjusting the pH value to 6.4, washing with deionized water to neutrality, and drying at 55° C. to constant weight to obtain an unsaturated monomer, wherein the mass ratio of the pyridine monomer, anhydrous DMF, and mixed solution a is 2:40:25, and the mass ratio of octenyl succinic anhydride and isopropanol in the mixed solution a is 2.1:15;

[0082] Step A3, add unsaturated monomer and 4,6-diaminopyrimidine to anhydrous DMF, control the speed to 700 rpm and stir for 25 minutes until uniform, then add dicyclohexylcarbodiimide and 4-dimethylaminopyridine, raise the temperature to 75°C, maintain the speed unchanged, stir and react for 4 hours, after the reaction is completed, cool to room temperature, filter, wash the filter cake with anhydrous ethanol and deionized water for 3 times, and dry at 60°C to constant weight to obtain a functional monomer, wherein the mass ratio of unsaturated monomer, 4,6-diaminopyrimidine, anhydrous DMF, dicyclohexylcarbodiimide and 4-dimethylaminopyridine is 8.5:2.0:40:3.5:3.6.

[0083] Preparation Examples 4-6 and Comparative Preparation Examples 6-8 provide a method for preparing functionalized microcapsules.

[0084] Preparation Example 4

[0085] Functionalized microcapsules are prepared by the following steps:

[0086] Butyl methacrylate, methyl methacrylate and the functional monomer prepared in Preparation Example 1 were added to petroleum ether, the rotation speed was controlled to 500 rpm, Span-80, Tween-80 and dibenzoyl peroxide were added while stirring, and a 22% by mass fraction of polyacrylamide aqueous solution was added dropwise while stirring, and the addition was controlled to be completed within 15 minutes to obtain an emulsion, and the temperature was raised to 65°C, and the reaction was stirred for 3.5 hours. After the reaction was completed, the mixture was filtered, washed, and dried at 45°C to constant weight to obtain functionalized microcapsules, wherein the mass ratio of butyl methacrylate, methyl methacrylate, functional monomer, petroleum ether, Span-80, Tween-80, dibenzoyl peroxide and polyacrylamide aqueous solution was 2:6.5:3:50:0.3:0.6:0.2:15.

[0087] Preparation Example 5

[0088] Functionalized microcapsules are prepared by the following steps:

[0089] Butyl methacrylate, methyl methacrylate and the functional monomer prepared in Preparation Example 2 were added to petroleum ether, the rotation speed was controlled to 600 rpm, Span-80, Tween-80 and dibenzoyl peroxide were added while stirring, and a 24% by mass fraction of polyacrylamide aqueous solution was added dropwise while stirring, and the dropping was controlled to be completed within 15 minutes to obtain an emulsion, and the temperature was raised to 70°C, and the reaction was stirred for 4.0 hours. After the reaction was completed, the filter was filtered, and the filter cake was washed with anhydrous ethanol and deionized water for 4 times, and dried at 50°C to constant weight to obtain functionalized microcapsules, wherein the mass ratio of butyl methacrylate, methyl methacrylate, functional monomer, petroleum ether, Span-80, Tween-80, dibenzoyl peroxide and polyacrylamide aqueous solution was 2.5:7.0:3.5:55:0.35:0.75:0.25:20.

[0090] Preparation Example 6

[0091] Functionalized microcapsules are prepared by the following steps:

[0092] Butyl methacrylate, methyl methacrylate and the functional monomer obtained in Preparation Example 2 were added to petroleum ether, and Span-80, Tween-80 and dibenzoyl peroxide were added while stirring. A 26% by mass fraction of polyacrylamide aqueous solution was added dropwise while stirring, and the dropping was controlled to be completed within 15 minutes to obtain an emulsion. The temperature was raised to 75°C, and the reaction was stirred for 4.5 hours. After the reaction was completed, the filter was filtered, and the filter cake was washed with anhydrous ethanol and deionized water for 5 times, and dried at 55°C to constant weight to obtain functionalized microcapsules, wherein the mass ratio of butyl methacrylate, methyl methacrylate, functional monomer, petroleum ether, Span-80, Tween-80, dibenzoyl peroxide and polyacrylamide aqueous solution was 3:7.5:4:60:0.4:0.9:0.3:25.

[0093] Comparative Preparation Example 5

[0094] Functionalized microcapsules are prepared by the following steps:

[0095] Butyl methacrylate, methyl methacrylate and the functional monomer prepared in comparative preparation example 1 were added to petroleum ether, the rotation speed was controlled to 500 rpm, Span-80, Tween-80 and dibenzoyl peroxide were added while stirring, and a polyacrylamide aqueous solution with a mass fraction of 22% was added dropwise while stirring, and the dropping was controlled to be completed within 15 minutes to obtain an emulsion, the temperature was raised to 65°C, and the reaction was stirred for 3.5 hours. After the reaction was completed, the mixture was filtered, washed, and dried at 45°C to constant weight to obtain functionalized microcapsules, wherein the mass ratio of butyl methacrylate, methyl methacrylate, functional monomer, petroleum ether, Span-80, Tween-80, dibenzoyl peroxide and polyacrylamide aqueous solution was 2:6.5:3:50:0.3:0.6:0.2:15.

[0096] Comparative Preparation Example 6

[0097] Functionalized microcapsules are prepared by the following steps:

[0098] Butyl methacrylate, methyl methacrylate and the functional monomer prepared in comparative preparation example 2 were added to petroleum ether, the rotation speed was controlled to 500 rpm, Span-80, Tween-80 and dibenzoyl peroxide were added while stirring, and a polyacrylamide aqueous solution with a mass fraction of 22% was added dropwise while stirring, and the dropping was controlled to be completed within 15 minutes to obtain an emulsion, the temperature was raised to 65°C, and the reaction was stirred for 3.5 hours. After the reaction was completed, the mixture was filtered, washed, and dried at 45°C to constant weight to obtain functionalized microcapsules, wherein the mass ratio of butyl methacrylate, methyl methacrylate, functional monomer, petroleum ether, Span-80, Tween-80, dibenzoyl peroxide and polyacrylamide aqueous solution was 2:6.5:3:50:0.3:0.6:0.2:15.

[0099] Comparative Preparation Example 7

[0100] Functionalized microcapsules are prepared by the following steps:

[0101] Butyl methacrylate, methyl methacrylate and the functional monomer prepared in comparative preparation example 3 were added to petroleum ether, the rotation speed was controlled to 500 rpm, Span-80, Tween-80 and dibenzoyl peroxide were added while stirring, and a polyacrylamide aqueous solution with a mass fraction of 22% was added dropwise while stirring, and the dropping was controlled to be completed within 15 minutes to obtain an emulsion, the temperature was raised to 65°C, and the reaction was stirred for 3.5 hours. After the reaction was completed, the mixture was filtered, washed, and dried at 45°C to constant weight to obtain functionalized microcapsules, wherein the mass ratio of butyl methacrylate, methyl methacrylate, functional monomer, petroleum ether, Span-80, Tween-80, dibenzoyl peroxide and polyacrylamide aqueous solution was 2:6.5:3:50:0.3:0.6:0.2:15.

[0102] Comparative Preparation Example 8

[0103] Functionalized microcapsules are prepared by the following steps:

[0104] Butyl methacrylate, methyl methacrylate and the functional monomer prepared in Comparative Preparation Example 4 were added to petroleum ether, the rotation speed was controlled to 500 rpm, Span-80, Tween-80 and dibenzoyl peroxide were added while stirring, and a polyacrylamide aqueous solution with a mass fraction of 22% was added dropwise while stirring, and the dripping was controlled to be completed within 15 minutes to obtain an emulsion, the temperature was raised to 65°C, and the reaction was stirred for 3.5 hours. After the reaction was completed, the mixture was filtered, washed, and dried at 45°C to constant weight to obtain functionalized microcapsules, wherein the mass ratio of butyl methacrylate, methyl methacrylate, functional monomer, petroleum ether, Span-80, Tween-80, dibenzoyl peroxide and polyacrylamide aqueous solution was 2:6.5:3:50:0.3:0.6:0.2:15.

[0105] Preparation Examples 7-9 and Comparative Preparation Examples 9-12 provide a method for preparing an insulating coating repair liquid.

[0106] Preparation Example 7

[0107] An insulating coating repair liquid comprises the following raw materials in parts by weight: 0.5 parts of bisphenol A epoxy resin, 0.2 parts of functionalized microcapsules prepared in Preparation Example 4, 2 parts of ethyl acetate, 0.1 parts of tetra-tert-butylphenol acrylate, 0.24 parts of dicyandiamide, 0.01 parts of photoinitiator and 0.1 parts of polyacrylamide, wherein the photoinitiator is a mixture of 2,2-dimethoxy-2-phenylacetophenone and azobisisobutyronitrile in a mass ratio of 1.4:2;

[0108] The insulation coating repair liquid is prepared by the following steps:

[0109] Step S1, stirring bisphenol A epoxy resin and ethyl acetate at a rotation speed of 500 rpm for 20 minutes until they are uniform, to obtain a first mixed solution;

[0110] Step S2, adding polyacrylamide to the first mixed solution, and stirring at a speed of 600 rpm for 25 min until the mixture is uniform, to obtain a second mixed solution;

[0111] Step S3, adding functionalized microcapsules, tetra-tert-butylphenol acrylate, dicyandiamide and photoinitiator to the second mixed solution, controlling the speed to 550 rpm and stirring for 30 min until uniform, maintaining the speed unchanged, placing it under ultraviolet irradiation for 12 min while stirring, controlling the irradiation temperature to 85°C, and obtaining an insulating coating repair liquid, wherein the peak wavelength of the ultraviolet irradiation is 365 nm and the intensity is 60 mw / cm 2 .

[0112] Preparation Example 8

[0113] An insulating coating repair liquid comprises the following raw materials in parts by weight: 2.75 parts of bisphenol A epoxy resin, 1.3 parts of functionalized microcapsules prepared in Preparation Example 5, 6 parts of ethyl acetate, 0.3 parts of tetra-tert-butyl-p-hydroxyphenyl acrylate, 0.92 parts of diaminodiphenyl sulfone, 0.045 parts of a photoinitiator, and 0.2 parts of polyacrylamide, wherein the photoinitiator is a mixture of 2,2-dimethoxy-2-phenylacetophenone and azobisisobutyronitrile in a mass ratio of 1.4:4;

[0114] The insulation coating repair liquid is prepared by the following steps:

[0115] Step S1, stirring bisphenol A epoxy resin and ethyl acetate at a rotation speed of 550 rpm for 15 minutes until they are uniform, to obtain a first mixed solution;

[0116] Step S2, adding polyacrylamide to the first mixed solution, and stirring at a speed of 650 rpm for 20 minutes until the mixture is uniform, to obtain a second mixed solution;

[0117] Step S3, adding functionalized microcapsules, tetra-tert-butyl-p-hydroxyphenyl acrylate, diaminodiphenyl sulfone and photoinitiator to the second mixed solution, stirring at a speed of 600 rpm for 25 min until uniform, maintaining the speed unchanged, placing under ultraviolet irradiation for 19 min while stirring, and controlling the irradiation temperature to 80° C. to obtain an insulating coating repair solution, wherein the peak wavelength of the ultraviolet irradiation is 365 nm and the intensity is 70 mw / cm 2 .

[0118] Preparation Example 9

[0119] An insulating coating repair liquid comprises the following raw materials in parts by weight: 5 parts of bisphenol A epoxy resin, 2.4 parts of functionalized microcapsules prepared in Preparation Example 6, 10 parts of ethyl acetate, 0.5 parts of tetra-tert-butyl-p-hydroxyphenyl acrylate, 1.6 parts of dicyandiamide, 0.08 parts of a photoinitiator, and 0.3 parts of polyacrylamide, wherein the photoinitiator is a mixture of 2,2-dimethoxy-2-phenylacetophenone and azobisisobutyronitrile in a mass ratio of 1.4:6;

[0120] The insulation coating repair liquid is prepared by the following steps:

[0121] Step S1, stirring bisphenol A epoxy resin and ethyl acetate at a rotation speed of 600 rpm for 10 minutes until they are uniform, to obtain a first mixed solution;

[0122] Step S2, adding polyacrylamide to the first mixed solution, stirring at a speed of 700 rpm for 15 min until the mixture is uniform, to obtain a second mixed solution;

[0123] Step S3, adding functionalized microcapsules, tetra-tert-butyl-p-hydroxyphenyl acrylate, dicyandiamide and photoinitiator to the second mixed solution, controlling the speed to 650 rpm and stirring for 20 min until uniform, maintaining the speed unchanged, placing it under ultraviolet irradiation for 26 min while stirring, controlling the irradiation temperature to 75°C, and obtaining an insulating coating repair liquid, wherein the peak wavelength of the ultraviolet irradiation is 365 nm and the intensity is 80 mw / cm 2 .

[0124] Comparative Preparation Example 9

[0125] An insulating coating repair liquid comprises the following raw materials in parts by weight: 0.5 parts of bisphenol A epoxy resin, 0.2 parts of functionalized microcapsules prepared in Comparative Preparation Example 5, 2 parts of ethyl acetate, 0.1 parts of tetra-tert-butylphenol acrylate, 0.24 parts of dicyandiamide, 0.01 parts of photoinitiator and 0.1 parts of polyacrylamide, wherein the photoinitiator is a mixture of 2,2-dimethoxy-2-phenylacetophenone and azobisisobutyronitrile in a mass ratio of 1.4:2;

[0126] The insulation coating repair liquid is prepared by the following steps:

[0127] Step S1, stirring bisphenol A epoxy resin and ethyl acetate at a rotation speed of 500 rpm for 20 minutes until they are uniform, to obtain a first mixed solution;

[0128] Step S2, adding polyacrylamide to the first mixed solution, and stirring at a speed of 600 rpm for 25 min until the mixture is uniform, to obtain a second mixed solution;

[0129] Step S3, adding functionalized microcapsules, tetra-tert-butylphenol acrylate, dicyandiamide and photoinitiator to the second mixed solution, controlling the speed to 550 rpm and stirring for 30 min until uniform, maintaining the speed unchanged, placing it under ultraviolet irradiation for 12 min while stirring, controlling the irradiation temperature to 85°C, and obtaining an insulating coating repair liquid, wherein the peak wavelength of the ultraviolet irradiation is 365 nm and the intensity is 60 mw / cm 2 .

[0130] Comparative Preparation Example 10

[0131] An insulating coating repair liquid comprises the following raw materials in parts by weight: 0.5 parts of bisphenol A epoxy resin, 0.2 parts of functionalized microcapsules prepared in Comparative Preparation Example 6, 2 parts of ethyl acetate, 0.1 parts of tetra-tert-butylphenol acrylate, 0.24 parts of dicyandiamide, 0.01 parts of photoinitiator and 0.1 parts of polyacrylamide, wherein the photoinitiator is a mixture of 2,2-dimethoxy-2-phenylacetophenone and azobisisobutyronitrile in a mass ratio of 1.4:2;

[0132] The insulation coating repair liquid is prepared by the following steps:

[0133] Step S1, stirring bisphenol A epoxy resin and ethyl acetate at a rotation speed of 500 rpm for 20 minutes until they are uniform, to obtain a first mixed solution;

[0134] Step S2, adding polyacrylamide to the first mixed solution, and stirring at a speed of 600 rpm for 25 min until the mixture is uniform, to obtain a second mixed solution;

[0135] Step S3, adding functionalized microcapsules, tetra-tert-butylphenol acrylate, dicyandiamide and photoinitiator to the second mixed solution, controlling the speed to 550 rpm and stirring for 30 min until uniform, maintaining the speed unchanged, placing it under ultraviolet irradiation for 12 min while stirring, controlling the irradiation temperature to 85°C, and obtaining an insulating coating repair liquid, wherein the peak wavelength of the ultraviolet irradiation is 365 nm and the intensity is 60 mw / cm 2 .

[0136] Comparative Preparation Example 11

[0137] An insulating coating repair liquid comprises the following raw materials in parts by weight: 0.5 parts of bisphenol A epoxy resin, 0.2 parts of functionalized microcapsules prepared in Comparative Preparation Example 7, 2 parts of ethyl acetate, 0.1 parts of tetra-tert-butylphenol acrylate, 0.24 parts of dicyandiamide, 0.01 parts of photoinitiator and 0.1 parts of polyacrylamide, wherein the photoinitiator is a mixture of 2,2-dimethoxy-2-phenylacetophenone and azobisisobutyronitrile in a mass ratio of 1.4:2;

[0138] The insulation coating repair liquid is prepared by the following steps:

[0139] Step S1, stirring bisphenol A epoxy resin and ethyl acetate at a rotation speed of 500 rpm for 20 minutes until they are uniform, to obtain a first mixed solution;

[0140] Step S2, adding polyacrylamide to the first mixed solution, and stirring at a speed of 600 rpm for 25 min until the mixture is uniform, to obtain a second mixed solution;

[0141] Step S3, adding functionalized microcapsules, tetra-tert-butylphenol acrylate, dicyandiamide and photoinitiator to the second mixed solution, controlling the speed to 550 rpm and stirring for 30 min until uniform, maintaining the speed unchanged, placing it under ultraviolet irradiation for 12 min while stirring, controlling the irradiation temperature to 85°C, and obtaining an insulating coating repair liquid, wherein the peak wavelength of the ultraviolet irradiation is 365 nm and the intensity is 60 mw / cm 2 .

[0142] Comparative Preparation Example 12

[0143] An insulating coating repair liquid comprises the following raw materials in parts by weight: 0.5 parts of bisphenol A epoxy resin, 0.2 parts of functionalized microcapsules prepared in Comparative Preparation Example 8, 2 parts of ethyl acetate, 0.1 parts of tetra-tert-butylphenol acrylate, 0.24 parts of dicyandiamide, 0.01 parts of photoinitiator and 0.1 parts of polyacrylamide, wherein the photoinitiator is a mixture of 2,2-dimethoxy-2-phenylacetophenone and azobisisobutyronitrile in a mass ratio of 1.4:2;

[0144] The insulation coating repair liquid is prepared by the following steps:

[0145] Step S1, stirring bisphenol A epoxy resin and ethyl acetate at a rotation speed of 500 rpm for 20 minutes until they are uniform, to obtain a first mixed solution;

[0146] Step S2, adding polyacrylamide to the first mixed solution, and stirring at a speed of 600 rpm for 25 min until the mixture is uniform, to obtain a second mixed solution;

[0147] Step S3, adding functionalized microcapsules, tetra-tert-butylphenol acrylate, dicyandiamide and photoinitiator to the second mixed solution, controlling the speed to 550 rpm and stirring for 30 min until uniform, maintaining the speed unchanged, placing it under ultraviolet irradiation for 12 min while stirring, controlling the irradiation temperature to 85°C, and obtaining an insulating coating repair liquid, wherein the peak wavelength of the ultraviolet irradiation is 365 nm and the intensity is 60 mw / cm 2 .

[0148] Examples 1-3 and Comparative Examples 1-4 provide a process for repairing the bending insulation of a flexible interconnected flat cable.

[0149] Example 1

[0150] This embodiment provides a flexible interconnect flat cable bending insulation repair process, comprising the following steps:

[0151] Step 1: Use a carbon dioxide laser cutting machine to cut the insulation film between the positioned cables to separate the insulation films between the corresponding number of cables;

[0152] Step 2, placing the cable with the insulation film cut in S-4 insulating rubber product cleaning solution, immersing at 35°C for 12 hours, taking it out, and then cleaning it with anhydrous ethanol for 3 times, wiping it with a clean cloth, and then coating it with the insulation coating repair solution prepared in Preparation Example 7, controlling the coating thickness to be 0.5 mm, so that the insulation film of the corresponding cable is adhered up and down, and then hot pressing it at a temperature of 150°C and a pressure of 15MPa to obtain a corresponding number of repaired cables;

[0153] Step 3: Use a bending machine to bend the corresponding number of repaired cables.

[0154] Example 2

[0155] This embodiment provides a flexible interconnect flat cable bending insulation repair process, comprising the following steps:

[0156] Step 1: Use a carbon dioxide laser cutting machine to cut the insulation film between the positioned cables to separate the insulation films between the corresponding number of cables;

[0157] Step 2, placing the cable with the insulation film cut in an insulation cleaning solution, immersing it at 40°C for 14 hours, taking it out, and then washing it with anhydrous ethanol for 4 times, wiping it with a clean cloth, and then coating it with the insulation coating repair liquid prepared in Preparation Example 8, controlling the thickness of the coating to be 0.75mm, so that the insulation film of the corresponding cable is adhered up and down, and then hot pressing it at a temperature of 155°C and a pressure of 16MPa to obtain a corresponding number of repaired cables;

[0158] Step 3: Use a bending machine to bend the corresponding number of repaired cables.

[0159] Example 3

[0160] This embodiment provides a flexible interconnect flat cable bending insulation repair process, comprising the following steps:

[0161] Step 1: Use a carbon dioxide laser cutting machine to cut the insulation film between the positioned cables to separate the insulation films between the corresponding number of cables;

[0162] Step 2, placing the cable with the insulation film cut in an insulation cleaning solution, immersing it at 45°C for 16 hours, taking it out, and then washing it with anhydrous ethanol for 5 times, wiping it with a clean cloth, and then coating it with the insulation coating repair liquid prepared in Preparation Example 9, controlling the thickness of the coating to be 1 mm, so that the insulation film of the corresponding cable is adhered up and down, and then hot pressing it at a temperature of 160°C and a pressure of 17MPa to obtain;

[0163] Step 3: Use a bending machine to bend the corresponding number of repaired cables.

[0164] Comparative Example 1

[0165] This comparative example provides a flexible interconnect flat cable bending insulation repair process, comprising the following steps:

[0166] Step 1: Use a carbon dioxide laser cutting machine to cut the insulation film between the positioned cables to separate the insulation films between the corresponding number of cables;

[0167] Step 2, placing the cable with the insulation film cut in S-4 insulating rubber product cleaning solution, immersing at 35°C for 12 hours, taking it out, and then washing it with anhydrous ethanol for 3 times, wiping it with a clean cloth, and then coating it with the insulation coating repair liquid prepared in Comparative Preparation Example 9, controlling the thickness of the coating to be 0.5 mm, so that the insulation film of the corresponding cable is adhered up and down, and then hot pressing it at a temperature of 150°C and a pressure of 15MPa to obtain a repaired cable of the corresponding number;

[0168] Step 3: Use a bending machine to bend the corresponding number of repaired cables.

[0169] Comparative Example 2

[0170] This comparative example provides a flexible interconnect flat cable bending insulation repair process, comprising the following steps:

[0171] Step 1: Use a carbon dioxide laser cutting machine to cut the insulation film between the positioned cables to separate the insulation films between the corresponding number of cables;

[0172] Step 2, placing the cable with the insulation film cut in S-4 insulating rubber product cleaning solution, immersing at 35°C for 12 hours, taking it out, and then washing it with anhydrous ethanol for 3 times, wiping it with a clean cloth, and then coating it with the insulation coating repair liquid prepared in Comparative Preparation Example 10, controlling the thickness of the coating to be 0.5 mm, so that the insulation film of the corresponding cable is adhered up and down, and then hot pressing it at a temperature of 150°C and a pressure of 15MPa to obtain a repaired cable of the corresponding number;

[0173] Step 3: Use a bending machine to bend the corresponding number of repaired cables.

[0174] Comparative Example 3

[0175] This comparative example provides a flexible interconnect flat cable bending insulation repair process, comprising the following steps:

[0176] Step 1: Use a carbon dioxide laser cutting machine to cut the insulation film between the positioned cables to separate the insulation films between the corresponding number of cables;

[0177] Step 2, placing the cable with the insulation film cut in S-4 insulating rubber product cleaning solution, immersing it at 35°C for 12 hours, taking it out, and then washing it with anhydrous ethanol for 3 times, wiping it with a clean cloth, and then coating it with the insulation coating repair liquid prepared in Comparative Preparation Example 11, controlling the thickness of the coating to be 0.5 mm, so that the insulation film of the corresponding cable is adhered up and down, and then hot pressing it at a temperature of 150°C and a pressure of 15MPa to obtain a corresponding number of repaired cables;

[0178] Step 3: Use a bending machine to bend the corresponding number of repaired cables.

[0179] Comparative Example 4

[0180] This comparative example provides a flexible interconnect flat cable bending insulation repair process, comprising the following steps:

[0181] Step 1: Use a carbon dioxide laser cutting machine to cut the insulation film between the positioned cables to separate the insulation films between the corresponding number of cables;

[0182] Step 2, placing the cable with the insulation film cut in S-4 insulating rubber product cleaning solution, immersing it at 35°C for 12 hours, taking it out, and then washing it with anhydrous ethanol for 3 times, wiping it with a clean cloth, and then coating it with the insulation coating repair liquid prepared in Comparative Preparation Example 12, controlling the thickness of the coating to be 0.5 mm, so that the insulation film of the corresponding cable is adhered up and down, and then hot pressing it at a temperature of 150°C and a pressure of 15MPa to obtain a repaired cable corresponding to the number z;

[0183] Step 3: Use a bending machine to bend the corresponding number of repaired cables.

[0184] Sample preparation

[0185] Preparation of test samples: The insulation coating repair liquid prepared in Preparation Examples 7-9 and Comparative Preparation Examples 9-12 was placed in a tetrafluoroethylene mold, and after curing at room temperature for 7 days, the mold was removed and dumbbell-shaped tensile specimens were prepared according to "IOS527-2:2012".

[0186] Performance Testing

[0187] Flexibility test: According to GB / T1040 standard, the test samples prepared in Preparation Examples 7-9 and Comparative Preparation Examples 9-12 were tested to test their tensile strength and elongation at break.

[0188] Self-repair performance test: A number of defect points n1 were artificially created on the surface of the test samples prepared in Preparation Examples 7-9 and Comparative Preparation Examples 9-12, and the test samples were subjected to accelerated corrosion tests by means of salt spray, wet heat, etc. The number of points n2 repaired on the surface of the test sample coating was recorded, and the ratio of n2 to n1 was the self-repair rate.

[0189] Table 1 Mechanical properties and self-repairing performance test of insulation coating repair fluid

[0190]

[0191] It can be seen from the above table that compared with Preparation Examples 7-9, the insulation coating repair liquid prepared in Comparative Preparation Examples 9-12 has excellent toughness and self-repairing properties.

[0192] This specific embodiment is only an explanation of the present invention, and it is not a limitation of the present invention. After reading this specification, those skilled in the art can make non-creative modifications to this embodiment as needed, but as long as it is within the scope of the claims of the present invention, it is protected by the patent law.

Claims

1. A flexible interconnect flat cable bending insulation repair process, characterized in that: The steps include: Step 1: Use a laser cutting machine to cut the insulation film between the positioned cables; Step 2, cleaning the cable after the insulation film is cut, and then repairing it by applying insulation coating repair liquid; Step 3: Use a bending machine to bend the repaired cables of the corresponding number; The insulation coating repair solution in step 2 comprises the following raw materials in parts by weight: 0.5-5 parts of thermosetting epoxy resin, 0.2-2.4 parts of functionalized microcapsules, 2-10 parts of ethyl acetate, 0.1-0.5 parts of high temperature resistant antioxidant, 0.24-1.6 parts of curing agent, 0.01-0.08 parts of photoinitiator and 0.1-0.3 parts of polyacrylamide; The functionalized microcapsules are prepared by the following steps: Add butyl methacrylate, methyl methacrylate and functional monomers to petroleum ether, add Span-80, Tween-80 and dibenzoyl peroxide while stirring, add polyacrylamide aqueous solution dropwise while stirring, and control the dripping to be completed within 15 minutes to obtain an emulsion, heat to 65-75°C, stir and react for 3.5-4.5 hours, and after the reaction is completed, filter, wash and dry to obtain functionalized microcapsules, wherein the mass ratio of butyl methacrylate, methyl methacrylate, functional monomer, petroleum ether, Span-80, Tween-80, dibenzoyl peroxide and polyacrylamide aqueous solution is 2-3:6.5-7.5:3-4:50-60:0.3-0.4:0.6-0.9:0.2-0.3:15-25; The functional monomer is prepared by the following steps: Step A1, add 3,3'-dithiodipropionic acid and 2,6-diaminopyridine to anhydrous DMF, stir evenly, then add N,N'-carbonyldiimidazole, raise the temperature to 85-95°C, stir and react for 6-8h, after the reaction is completed, cool to room temperature, filter by suction, wash and dry the filter cake to obtain a pyridine monomer; Step A2, adding the pyridine monomer to anhydrous DMF, stirring evenly, adjusting the pH value to 8-9, then dropwise adding a mixture of octenyl succinic anhydride and isopropanol a, heating to 60-70° C., continuing stirring for 4-6 hours, then adjusting the pH value to 6.4-6.8, washing with deionized water to neutrality, and drying to obtain an unsaturated monomer; Step A3, add the unsaturated monomer and 4,6-diamino-2-mercaptopyrimidine to anhydrous DMF, stir evenly, then add dicyclohexylcarbodiimide and 4-dimethylaminopyridine, raise the temperature to 75-85°C, stir and react for 4-6 hours, after the reaction is completed, cool to room temperature, filter, wash and dry the filter cake to obtain a functional monomer.

2. A flexible interconnect flat cable bending insulation repair process according to claim 1, characterized in that: The specific preparation method of the insulation coating repair liquid in step 2 comprises the following steps: Step S1, mixing the heat-curable epoxy resin and ethyl acetate uniformly to obtain a first mixed solution; Step S2, adding polyacrylamide to the first mixed solution and stirring evenly to obtain a second mixed solution; Step S3, add functionalized microcapsules, high temperature resistant antioxidant, photoinitiator and curing agent to the second mixed liquid, stir evenly, maintain the rotation speed unchanged, place it under ultraviolet irradiation for 12-26 minutes while stirring, control the irradiation temperature to 75-85°C, and obtain an insulating coating repair liquid.

3. A flexible interconnect flat cable bending insulation repair process according to claim 1, characterized in that: In the step A1, the mass ratio of 3,3'-dithiodipropionic acid, 2,6-diaminopyridine, anhydrous DMF and N,N'-carbonyldiimidazole is 7.4-8.6:3.7-4.3:65-75:5.2-6.

0.

4. A flexible interconnect flat cable bending insulation repair process according to claim 1, characterized in that: In the step A2, the mass ratio of the pyridine monomer, anhydrous DMF and the mixed solution a is 2-3:40-50:25, and in the mixed solution a, the mass ratio of octenyl succinic anhydride and isopropanol is 2.1-2.3:15-25.

5. A flexible interconnect flat cable bending insulation repair process according to claim 1, characterized in that: In the step A3, the mass ratio of the unsaturated monomer, 4,6-diamino-2-mercaptopyrimidine, anhydrous DMF, dicyclohexylcarbodiimide and 4-dimethylaminopyridine is 8.5-9.5: 2.0-2.2: 40-60: 3.5-3.9: 3.6-4.

0.

6. A flexible interconnect flat cable bending insulation repair process according to claim 1, characterized in that: In step 2, the detailed steps are: The cable with the insulation film cut is placed in an insulation cleaning liquid, immersed at 35-45°C for 12-16 hours, taken out, and then cleaned with anhydrous ethanol 3-5 times, wiped clean, and then coated with insulation coating repair liquid to make the insulation film of the corresponding cable adhere up and down, and then hot-pressed to obtain the product.

7. A flexible interconnect flat cable bending insulation repair process according to claim 1, characterized in that: The photoinitiator is a mixture of 2,2-dimethoxy-2-phenylacetophenone and azobisisobutyronitrile in a mass ratio of 1.4:2-6.

8. A flexible interconnect flat cable bending insulation repair process according to claim 1, characterized in that: The high temperature resistant antioxidant is at least one of tetra-tert-butylphenol acrylate and tetra-tert-butyl-p-hydroxyphenyl acrylate.

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