Liquid metal composite diamond heat-conducting fin as well as preparation method and application thereof

Abstract

The invention relates to a liquid metal composite diamond heat-conducting fin and a preparation method and application thereof, and belongs to the technical field of heat-conducting materials. The liquid metal composite diamond heat-conducting fin comprises indium-based liquid metal and modified diamond filled in the indium-based liquid metal. Wherein the modified diamond comprises diamond micro-powder and a metal coating and / or a metal carbide coating, the surface of the diamond micro-powder is coated with the metal coating and / or the metal carbide coating, the particle size of the diamond micro-powder is 100-150 microns, and the mass ratio of the indium-based liquid metal to the modified diamond is (10-20): 1. The specific indium-based liquid metal is selected as a thermal interface material, the diamond micro-powder with the specific particle size is selected and subjected to metallization modification, the diamond micro-powder can be fully combined with the indium-based liquid metal in a small proportion, the heat conductivity coefficient of the heat-conducting fin can be greatly increased, and the thermal resistance is reduced. And moreover, the modified diamond filled in the indium-based liquid metal can play a certain role in supporting the structure, so that the risk of liquid metal leakage is effectively reduced.

Description

Technical Field

[0001] The present application relates to the technical field of thermal conductive materials, and in particular to a liquid metal composite diamond thermal conductive sheet and a preparation method and application thereof. Background Art

[0002] With the rapid development of chip design and manufacturing technology, high-power and high-performance CPUs are constantly updated and iterated. While pursuing high performance, it also brings huge challenges to the heat dissipation of chips. At this stage, the existence of thermal interface is an unavoidable problem in chip heat dissipation design and one of the bottlenecks for efficient heat dissipation. In order to solve the heat dissipation problem of electronic equipment, the development of thermal interface materials with high thermal conductivity has become a research hotspot in the field of thermal management.

[0003] Existing research uses low-melting-point liquid metal as a thermal interface material and mixes it with nanoparticles to improve thermal conductivity to a certain extent. However, there is a large gap between the nanoparticles and the liquid metal, which cannot remain stable for a long time and cannot limit the flow of the liquid metal, so there is still a risk of liquid metal leakage. Summary of the invention

[0004] In view of the deficiencies in the prior art, the purpose of the embodiments of the present application includes providing a liquid metal composite diamond thermal conductive sheet and a preparation method and application thereof, so as to improve the thermal conductivity of the liquid metal and effectively reduce the risk of liquid metal leakage.

[0005] In a first aspect, an embodiment of the present application provides a liquid metal composite diamond thermal conductive sheet, comprising an indium-based liquid metal and modified diamond filled in the indium-based liquid metal; wherein the modified diamond comprises diamond micropowder and a metal coating and / or a metal carbide coating coated on the surface of the diamond micropowder, and the particle size of the diamond micropowder is 100-150 μm; the mass ratio of the indium-based liquid metal to the modified diamond is (10-20):1.

[0006] In the above technical solution, by selecting indium-based liquid metal as the thermal interface material, using metallized modified diamond to fill the indium-based liquid metal, and controlling the particle size of the diamond micropowder and the amount of modified diamond, the metallized modified diamond can be uniformly and dispersedly filled in the indium-based liquid metal, and the metal coating on the surface of the diamond micropowder can form a thin alloy layer with the indium-based liquid metal, so that the modified diamond and the indium-based liquid metal can be fully combined, greatly improving the thermal conductivity of the heat conducting sheet and reducing thermal resistance. In addition, the interaction between the metal coating and the indium-based liquid metal can limit the flow of the liquid metal to a certain extent, so that the modified diamond fully combined with the liquid metal plays a certain role of a supporting structure, which can effectively reduce the risk of liquid metal leakage.

[0007] In some embodiments of the present application, the indium-based liquid metal includes the following components in percentage by mass: 50-70 parts of indium, 20-40 parts of bismuth, and 5-20 parts of tin.

[0008] In some embodiments of the present application, the indium-based liquid metal is In 69.5 Bi 20.2 Sn 10.3 Ternary alloy.

[0009] In the above technical solution, the indium-based liquid metal with specific composition and content has excellent ductility and low melting point, and can better wet the device surface and fill the gaps.

[0010] In some embodiments of the present application, the material of the metal coating includes at least one of titanium or chromium. The material of the metal carbide coating includes at least one of titanium carbide or chromium carbide. Preferably, the surface of the diamond micropowder is coated with a composite coating containing titanium and titanium carbide.

[0011] In the above technical solution, the titanium carbide or chromium carbide in the metal carbide coating is obtained by metallurgical reaction between titanium or chromium and diamond, which can enhance the bonding strength between the metal coating and / or metal carbide coating and diamond. When the titanium or chromium in the metal coating is mixed with liquid metal, it can form a thin alloy layer with the indium-based liquid metal, thereby enhancing the interfacial bonding force between the modified diamond and the liquid metal and improving the fluidity of the liquid metal.

[0012] In a second aspect, the present application provides a method for preparing the above-mentioned liquid metal composite diamond thermal conductive sheet, comprising the following steps:

[0013] The diamond micropowder is subjected to metallization modification to form a metal coating and / or a metal carbide coating on the surface of the diamond micropowder to obtain modified diamond;

[0014] Indium-based liquid metal is mixed with metallized modified diamond, solidified, pressed and sliced ​​to obtain a liquid metal composite diamond thermal conductive sheet.

[0015] In some embodiments of the present application, the metallization modification process includes: mixing diamond micropowder, metal micropowder and chloride molten salt in a certain proportion, treating in a salt bath at 850-1100°C for 1-2 hours under vacuum, forming a metal coating and / or a metal carbide coating on the surface of the diamond micropowder, and obtaining a metallized modified diamond. The particle size of the metal micropowder is 5-10 μm.

[0016] In the above technical solution, a vacuum salt bath plating method is used for metallization modification, and part of the metal powder can undergo a metallurgical reaction with the diamond surface to form a stable chemically bonded metal carbide, thereby making the coating firmly bonded to the diamond.

[0017] In some embodiments of the present application, the metal micropowder includes at least one of titanium micropowder, chromium micropowder, molybdenum micropowder or tungsten micropowder, and the mass ratio of diamond micropowder to metal micropowder is 1:(2-5).

[0018] By controlling the mass ratio of diamond micropowder to metal micropowder, part of the metal micropowder forms a metal carbide coating on the diamond surface to enhance the bonding strength with the diamond, while the other part of the unreacted metal micropowder forms an external metal coating that can be used to react with liquid metal to form a thin alloy layer, thereby improving the interface bonding strength between the modified diamond and the liquid metal.

[0019] In some embodiments of the present application, the metal powder is titanium powder.

[0020] In the above technical solution, the use of specific metal micropowders to metallize the diamond surface can fully improve the wettability between the diamond micropowder and the liquid metal, reduce the interfacial thermal resistance, and significantly reduce the apparent hardness of the diamond. By controlling the particle size and amount of the metal micropowder, the uniformity of the diamond surface modification can be improved, and the thickness of the metal coating and / or metal carbide coating can be adjusted.

[0021] Among them, titanium is a strong carbide-forming element. With respect to carbon (diamond), titanium has strong chemical activity and diffusion ability, and can react with diamond at the interface to form a stable chemically bonded TiC layer, so that the bonding strength between the metal coating and / or metal carbide coating and diamond is high.

[0022] In some embodiments of the present application, the mixing process includes: heating the indium-based liquid metal to melt, adding the metallized modified diamond in a certain proportion, and stirring and mixing.

[0023] In a third aspect, the present application also provides an application of the above-mentioned liquid metal composite diamond thermal conductive sheet, which can be used for heat dissipation of electronic components, for example. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 This is a process flow chart of a method for preparing a liquid metal composite diamond thermal conductive sheet according to an embodiment of the present application;

[0026] Figure 2 This is a schematic diagram of the structure of the liquid metal composite diamond thermal conductive sheet of the present application;

[0027] Icon: 1-Indium-based liquid metal; 2-Metal coating and / or metal carbide coating; 3-Diamond powder; 4-Modified diamond. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be described clearly and completely below. If the specific conditions are not specified in the embodiments, they are carried out according to the conventional conditions or the conditions recommended by the manufacturer. If the manufacturer is not specified for the reagents or instruments used, they are all conventional products that can be purchased commercially.

[0029] The following is a detailed description of a liquid metal composite diamond thermal conductive sheet and its preparation method and application in an embodiment of the present application.

[0030] Figure 1 This is a process flow chart of the preparation method of the liquid metal composite diamond thermal conductive sheet according to the embodiment of the present application. Figure 1 The present application provides a method for preparing a liquid metal composite diamond thermal conductive sheet, the method comprising the following steps:

[0031] S110, metallizing the diamond powder to form a metal coating and / or a metal carbide coating on the surface of the diamond powder to obtain modified diamond.

[0032] Modified diamond is obtained by metallizing diamond powder and forming a metal coating and / or a metal carbide coating on the surface of the diamond powder, which can effectively improve the defects of poor wettability and high hardness of the surface diamond, thereby enhancing the bonding effect with liquid metal.

[0033] The particle size of the diamond powder is 100-150 μm.

[0034] By selecting diamond micropowders in a specific particle size range, the bonding between modified diamond and liquid metal can be effectively improved, and the thermal conductivity of diamond micropowders can be guaranteed to the greatest extent. When the particle size of diamond micropowders increases within a certain range, the relative contact area with the matrix liquid metal decreases, so the cumulative thermal resistance of the interface becomes smaller, thereby showing a higher thermal conductivity and lower thermal resistance. When the particle size of diamond micropowders is too small, they will cluster during the mixing process with liquid metal and cannot be evenly dispersed. When the particle size is too large, it will have a negative effect on thermal conductive filling and cannot form a good thermal conductive path.

[0035] The material of the metal coating may include at least one of titanium and chromium. The material of the metal carbide coating may include at least one of titanium carbide or chromium carbide. Preferably, the surface of the diamond micropowder is coated with a composite coating containing titanium and titanium carbide. A titanium coating layer, a chromium coating layer or a corresponding metal carbide layer may be formed on the surface of the diamond micropowder by magnetron sputtering, vacuum chemical vapor plating, salt bath plating or the like.

[0036] In the embodiment of the present application, the diamond powder is metallized by vacuum salt bath plating, which includes the following steps:

[0037] The diamond micropowder and metal micropowder are mixed with chloride molten salt in a certain proportion, and treated in a salt bath at 850-1100° C. for 1-2 hours under vacuum to form a metal coating and / or a metal carbide coating on the surface of the diamond micropowder to obtain a metallized modified diamond. The particle size of the metal micropowder is 5-10 μm.

[0038] Optionally, the metal powder includes at least one of titanium powder, chromium powder, molybdenum powder or tungsten powder. Preferably, the metal powder is titanium powder. Titanium is a strong carbide-forming element. With respect to carbon (diamond), titanium has strong chemical activity and diffusion ability, and can react with diamond at the interface to form a stable chemically bonded TiC layer. The strong metallurgical bonding makes the bonding strength between the coating and the diamond high.

[0039] The mass ratio of diamond micropowder to metal micropowder is 1:(2-5). Preferably, the mass ratio of diamond micropowder to metal micropowder is 1:4.

[0040] By controlling the dosage ratio and particle size of diamond micropowder to metal micropowder, the surface of diamond micropowder can be evenly and completely coated without plating leakage, and the thickness of the metal coating and / or metal carbide coating is appropriate, which will not affect the thermal conductivity of the diamond itself.

[0041] The chloride molten salt may be one or more of NaCl, BaCl, LiCl, and KCl. Preferably, the chloride molten salt includes NaCl and BaCl.

[0042] S120, mixing the indium-based liquid metal with the metallized modified diamond, solidifying, pressing, and slicing to obtain a liquid metal composite diamond thermal conductive sheet.

[0043] The indium-based liquid metal comprises the following components by weight: 50-70 parts of indium, 20-40 parts of bismuth, and 5-20 parts of tin. 69.5 Bi 20.2 Sn 10.3 Ternary alloy.

[0044] In some embodiments, the preparation method of indium-based liquid metal may include: placing indium particles, bismuth particles and tin particles in a smelting furnace in proportion, vacuum melting at 400°C for 2 hours, taking out, heating, vacuum stirring and uniformly obtaining indium-based liquid metal.

[0045] In the embodiment of the present application, indium-based liquid metal is used as the thermal interface material. Due to its excellent ductility and low melting point, it can better wet the device surface and fill the gap.

[0046] Among them, the mass ratio of indium-based liquid metal to modified diamond is (10-20):1. By controlling the amount of modified diamond added, the modified diamond can be more evenly dispersed in the indium-based liquid metal, and the metal coating on the surface of the diamond powder can form a thin alloy layer with the indium-based liquid metal, so that the modified diamond can be more fully combined with the indium-based liquid metal, and it is easier to form a heat conduction path, thereby improving the thermal conductivity. In addition, the interaction between the metal coating and the indium-based liquid metal can limit the flow of the liquid metal to a certain extent, so that the modified diamond can play the role of a supporting structure, thereby effectively reducing the risk of liquid metal leakage. When the amount of modified diamond is too much, the overall fluidity of the liquid metal will be greatly attenuated, and the surface thermal resistance will also increase. When the amount of modified diamond is too little, the thermal conductive filling is insufficient, and the thermal conductivity cannot be effectively improved, and the problem of liquid metal leakage cannot be solved.

[0047] The mixing process may include: heating the indium-based liquid metal to melt, adding the metallized modified diamond in a certain proportion, and stirring and mixing.

[0048] Among them, the "solidification, pressing, and slicing" process may include: pouring the evenly mixed indium-based liquid metal and modified diamond into a flat mold to solidify into a sheet material, using a rolling mill to roughly roll it into a sheet with a thickness of 2-3mm, and then using a rolling mill for fine rolling to obtain a liquid metal composite diamond thermal conductive sheet with a thickness of 0.01-0.1mm.

[0049] By selecting indium-based liquid metal with excellent ductility and low melting point as the thermal interface material, a metal coating and / or metal carbide coating is modified on the surface of diamond micropowder, and by controlling the particle size of diamond micropowder and the amount of modified diamond added, the modified diamond can be fully and stably combined with the indium-based liquid metal through synergistic effect. Adding a relatively small amount of modified diamond can effectively improve the thermal conductivity of the liquid metal thermal conductive sheet without hindering the fluidity of the liquid metal. The prepared liquid metal composite diamond thermal conductive sheet has high thermal conductivity and low thermal resistance, with a thermal conductivity greater than 21W / m·K and a thermal resistance less than 0.04cm 2 ·K / W. In addition, the preparation method can reduce the production cost of the product while achieving efficient heat conduction and is in line with the concept of environmental protection.

[0050] Figure 2 This is a schematic diagram of the structure of the liquid metal composite diamond heat conductive sheet of this application. Figure 2 The embodiment of the present application also provides a liquid metal composite diamond thermal conductive sheet prepared by the above-mentioned preparation method, comprising an indium-based liquid metal 1 and a modified diamond 4 filled in the indium-based liquid metal 1, wherein the modified diamond 4 is a diamond powder 3 whose surface is modified with a metal coating and / or a metal carbide coating 2.

[0051] The present application also provides an application of the liquid metal composite diamond heat conductive sheet, which can be used, for example, to dissipate heat from electronic components, where the electronic components can be, for example but not limited to, chips or heat sinks.

[0052] The features and performance of the present application are further described in detail below in conjunction with the embodiments.

[0053] Example 1

[0054] This embodiment provides an indium-based liquid metal composite diamond thermal conductive sheet, and the preparation method thereof includes the following steps:

[0055] (1) 4N purity indium particles, bismuth particles, and tin particles were used as raw materials and placed in a vacuum medium frequency melting furnace in a mass ratio of 69.5:20.2:10.3. The mixture was vacuum-heated to 400°C and maintained for 2 h. After the melting was completed, the mixture was taken out and placed in a vacuum heating stirrer. The temperature was maintained at 100°C and stirred at a speed of 400 rad / min for 10 min to obtain a uniform indium-based liquid metal.

[0056] (2) Diamond powder (150 μm) and titanium powder (5 μm) were mixed with chloride molten salt in a mass ratio of 1:4 and placed in a ceramic crucible. The ceramic crucible was covered with chloride molten salt to isolate the air and form a vacuum environment. The ceramic crucible was heated to 1000°C in a box-type resistance furnace for 2 hours, and then the chloride molten salt was washed away with hot water to obtain modified diamond modified with titanium carbide. The chloride molten salt was NaCl and BaCl (mass ratio was 1.3:1).

[0057] (3) The prepared indium-based liquid metal is heated to 100° C., 5 wt % of modified diamond is added, stirred at a speed of 400 rad / min for 10 min, poured into a flat mold and solidified into a sheet material.

[0058] (4) The solidified sheet material is rolled into a composite metal plate with a thickness of 1 mm on a calender. The number of rough rolling passes is determined according to the thickness of the plate. In this example, the composite metal plate is 5 mm thick and is rolled in 5 passes, with each pass being 0.5-1 mm.

[0059] (5) The sheet-like composite metal plate is further subjected to finish rolling by a calender to be rolled into a composite metal foil with a thickness of 0.1 mm. The number of finish rolling passes is 10, with each pass being 0.05-0.1 mm.

[0060] (6) The finely rolled metal foil is cut into the required size and laid flat on a polyethylene film to prevent wrinkles and bulging, thereby obtaining an indium-based liquid metal composite diamond thermal conductive sheet with a thickness of 0.1 mm.

[0061] Example 2

[0062] This embodiment proposes an indium-based liquid metal composite diamond thermal conductive sheet, and its preparation method is substantially the same as that of embodiment 1, except that in step (3), 6.7 wt % of modified diamond is added to the indium-based liquid metal.

[0063] Example 3

[0064] This embodiment proposes an indium-based liquid metal composite diamond thermal conductive sheet, and its preparation method is substantially the same as that of embodiment 1, except that in step (3), 10 wt % of modified diamond is added to the indium-based liquid metal.

[0065] Example 4

[0066] This embodiment proposes an indium-based liquid metal composite diamond thermal conductive sheet, and its preparation method is substantially the same as that of embodiment 1, except that in step (1), the mass ratio of indium particles, bismuth particles, and tin particles is 50:30:20.

[0067] Comparative Example 1

[0068] This comparative example proposes an indium-based liquid metal composite diamond thermal conductive sheet, the preparation method of which is substantially the same as that of Example 1, except that step (2) is not included, that is, the diamond micropowder is not subjected to metallization modification.

[0069] Comparative Example 2

[0070] This comparative example proposes an indium-based liquid metal composite diamond thermal conductive sheet, the preparation method of which is substantially the same as that of Example 1, except that in step (2), the particle size of the diamond micropowder is 200 μm.

[0071] Comparative Example 3

[0072] This comparative example proposes an indium-based liquid metal composite diamond thermal conductive sheet, the preparation method of which is substantially the same as that of Example 1, except that in step (2), the particle size of the diamond micropowder is 40 μm.

[0073] Comparative Example 4

[0074] This comparative example proposes an indium-based liquid metal composite diamond thermal conductive sheet, and its preparation method is substantially the same as that of Example 1, except that in step (3), 20 wt % of modified diamond is added to the indium-based liquid metal.

[0075] Comparative Example 5

[0076] This comparative example proposes an indium-based liquid metal composite diamond thermal conductive sheet, and its preparation method is substantially the same as that of Example 1, except that in step (3), 4 wt % of modified diamond is added to the indium-based liquid metal.

[0077] Some of the preparation conditions of the above examples and comparative examples are shown in Table 1.

[0078] Table 1 Part of the preparation parameters in the examples and comparative examples

[0079]

[0080] Performance testing and result analysis

[0081] The liquid metal composite diamond thermal conductive sheet prepared in the embodiment and the comparative example was tested for thermal conductivity and thermal resistance, the compression condition was 50Psi, the testing standard was ASTM D5470, and the test results are shown in Table 2.

[0082] Table 2 Thermal conductivity of liquid metal composite diamond thermal conductive sheet

[0083]

[0084]

[0085] It can be seen from Table 1 that the liquid metal composite diamond thermal conductive sheets prepared in Examples 1-4 all have good thermal conductivity, with thermal conductivity greater than 21 W / m·K and thermal resistance less than 0.04 cm2·K / W. Within a certain range, the more modified diamond is added, the better the thermal conductivity of the composite thermal conductive sheet, because as the diamond content increases, it is easier to form a thermal conductive path between the liquid metal and the diamond.

[0086] From the comparison of the thermal conductivity of Example 1 and Comparative Example 1, it can be seen that the diamond surface has poor wettability and high hardness. The modified diamond without metallization cannot be fully combined with the liquid metal, resulting in a large interface thermal resistance between the two, which affects the thermal conductivity.

[0087] From the comparison of thermal conductivity between Example 1 and Comparative Examples 2-3, it can be seen that the particle size of modified diamond can seriously affect the thermal conductivity of the composite thermal conductive sheet. When the particle size of diamond micropowder is too large, the distribution of micropowder in liquid metal produces large gaps, the thermal conduction path is uneven, the thermal conductivity is reduced, and the thermal resistance is increased. When the particle size of diamond micropowder is too small, clusters are generated and cannot be evenly dispersed, and the thermal conductivity and thermal resistance performance are reduced.

[0088] From the comparison of the thermal conductivity of Example 1 and Comparative Examples 4-5, it can be seen that the addition amount of modified diamond can seriously affect the thermal conductivity of the composite thermal conductive sheet. When it is too much, the overall fluidity of the liquid metal will be greatly attenuated and the surface thermal resistance will also increase. When it is too little, the thermal conductive filling is insufficient, the thermal conductivity cannot be effectively improved, and the problem of liquid metal leakage cannot be solved.

[0089] The embodiments described above are part of the embodiments of the present application, rather than all of the embodiments. The detailed description of the embodiments of the present application is not intended to limit the scope of the present application for protection, but merely represents the selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present application.

Claims

1. A liquid metal composite diamond thermal conductive sheet, characterized in that: It comprises indium-based liquid metal and modified diamond filled in the indium-based liquid metal; wherein the modified diamond comprises diamond micropowder and a metal coating and / or a metal carbide coating coated on the surface of the diamond micropowder, and the particle size of the diamond micropowder is 100-150 μm; and the mass ratio of the indium-based liquid metal to the modified diamond is (10-20):

1.

2. The liquid metal composite diamond thermal conductive sheet according to claim 1, characterized in that: The indium-based liquid metal comprises the following components in parts by mass: 50-70 parts of indium, 20-40 parts of bismuth, and 5-20 parts of tin.

3. The liquid metal composite diamond thermal conductive sheet according to claim 1 or 2, characterized in that: The indium-based liquid metal is In 69.5 Bi 20.2 Sn 10.3 Ternary alloy.

4. The liquid metal composite diamond thermal conductive sheet according to claim 1, characterized in that: The material of the metal coating includes at least one of titanium or chromium; The material of the metal carbide coating includes at least one of titanium carbide and chromium carbide.

5. A method for preparing a liquid metal composite diamond thermal conductive sheet as claimed in any one of claims 1 to 4, characterized in that: The following steps are involved: The diamond micropowder is subjected to metallization modification to form the metal coating layer and / or metal carbide coating layer on the surface of the diamond micropowder to obtain the modified diamond; The indium-based liquid metal is mixed with the modified diamond that has been metallized, solidified, pressed, and sliced ​​to obtain the liquid metal composite diamond thermal conductive sheet.

6. The preparation method according to claim 5, characterized in that: The metallization modification process comprises: The diamond micropowder, metal micropowder and chloride molten salt are mixed in a certain proportion, and treated in a salt bath at 850-1100° C. for 1-2 hours under vacuum to form the metal coating and / or metal carbide coating on the surface of the diamond micropowder to obtain the modified diamond modified by metallization; wherein the particle size of the metal micropowder is 5-10 μm.

7. The preparation method according to claim 6, characterized in that: The metal micropowder includes at least one of titanium micropowder, chromium micropowder, molybdenum micropowder or tungsten micropowder; the mass ratio of the diamond micropowder to the metal micropowder is 1:(2-5).

8. The preparation method according to claim 7, characterized in that: The metal powder is titanium powder.

9. The preparation method according to claim 5, characterized in that: The mixing process includes: The indium-based liquid metal is heated to melt, and the modified diamond modified by metallization is added in a certain proportion, and stirred and mixed.

10. An application of the liquid metal composite diamond thermal conductive sheet according to any one of claims 1 to 4, characterized in that: The liquid metal composite diamond heat conducting sheet is used for heat dissipation of electronic components.

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