Vacuum coating protection method of electronic component and application of vacuum coating protection method

Abstract

The invention belongs to the technical field of electronic components, and discloses a vacuum coating protection method of an electronic component and application thereof, before coating, welding pins of the electronic component need to be protected by glue (including UV curing glue, silica gel, epoxy glue, hot melt glue or the like), and the problems that the pins are difficult to remove after being coated, the pins are not conductive, and the service life of the pins is prolonged are solved. The technology of PECVD (Plasma Enhanced Chemical Vapor Deposition), PVD (Physical Vapor Deposition), ALD (Atomic Layer Deposition) and the like is adopted for coating in a vacuum environment, the adopted coating material is poly-p-xylylene, a silicon-based wear-resistant coating and the like, the coating thickness is required to be 5-20 microns or others, and after the electronic element is coated, the electronic element can be used in batches after glue protected on the pin is removed, so that convenience and rapidness are realized. The invention has the following beneficial effects: the material is colorless and transparent after film coating, the film layer is compact, insulated, waterproof, oil-proof and corrosion-proof, and the problem of failure of an electronic component in an immersed cooling liquid is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic components, and in particular to a vacuum coating protection method for electronic components and application thereof. Background Art

[0002] With the continuous development of power products, high-power, high-density, and small-volume product design is the future development trend, which will lead to more and more devices on the PCBA board. However, due to space limitations, the density of devices used in the power supply is high, resulting in the inability to effectively dissipate heat inside the product. The current air-cooled heat dissipation has reached its capacity ceiling, facing problems such as insufficient heat dissipation, excessive energy consumption, and difficulty in improving efficiency. Therefore, in the selection of cooling media, according to the current development trend, immersion liquid cooling technology meets the market and policy guidance needs from both the economic and heat dissipation efficiency perspectives. Therefore, immersion liquid cooling will gradually replace air cooling to achieve more efficient heat dissipation. However, electronic components are easily damaged and cannot work normally if they are immersed in immersion coolant for a long time, so there are still major problems in the application of immersion liquid cooling technology. For example, the commonly used electrolytic capacitor plugs on the market are all made of rubber. They will gradually expand in immersion liquid cooling (especially insulating mineral oil), lose the original sealing type of the electrolytic capacitor, and eventually cause the coolant to enter the electrolytic capacitor, precipitate the electrolyte, and cause the electrolytic capacitor capacity to decrease rapidly and fail.

[0003] Therefore, it is necessary to provide a vacuum coating protection method for electronic components and its application, by coating the common electronic components as a whole with polymer nano-coating materials to solve the failure problem of electronic components in immersion coolant. Summary of the invention

[0004] The invention discloses a vacuum coating protection method for electronic components and application thereof, which relates to the power supply industry and the field of electronic component protection and can effectively solve the technical problems involved in the background technology.

[0005] To achieve the above object, the technical solution of the present invention is:

[0006] A vacuum coating protection method for electronic components comprises the following steps:

[0007] S1. Use glue to shield and protect the pins of electronic components;

[0008] S2. Vacuum coating the electronic components with a film thickness of 5-30 μm;

[0009] S3. Remove the glue from the pins.

[0010] Common electronic components have low tolerance in immersion liquid cooling (especially insulating mineral oil) and cannot meet the product design life. There is currently no completely effective solution on the market that can solve the tolerance of electronic components in immersion liquid cooling (especially insulating mineral oil). For example, the outer casing film layer wrapped in commonly used electrolytic capacitors is relatively thin, and there is a risk of burns or bruises during use, resulting in the exposure of the aluminum shell and electrical problems. The present invention discloses a protection scheme for electronic components in the application of immersion liquid cooling products, which uses polymer nanomaterials to protect the overall coating (pressure-resistant and anti-corrosion coating) of electronic components. This protective material is coated using PECVD (plasma enhanced chemical vapor deposition), PVD (physical vapor deposition), ALD (atomic layer deposition) and other technologies according to product characteristics. This scheme realizes long-term stable operation of electronic components in an immersion liquid cooling environment, and can be operated in batches with low protection costs.

[0011] As a preferred improvement of the present invention: the electronic components include but are not limited to electrolytic capacitors, relays, electromagnetic components and power tubes.

[0012] As a preferred improvement of the present invention: the thickness of the film layer is 15-20 μm.

[0013] As a preferred improvement of the present invention: in the step S1, before the pins of the electronic components are protected with glue, the electronic components are first cleaned.

[0014] As a preferred improvement of the present invention: the cleaning includes a solvent cleaning process and a drying process.

[0015] As a preferred improvement of the present invention: in step S1, the glue includes but is not limited to one or more of UV curing glue, silicone glue, epoxy glue and hot melt glue.

[0016] As a preferred improvement of the present invention: in the step S2, the vacuum coating method includes plasma enhanced chemical vapor deposition or physical vapor deposition or atomic layer deposition.

[0017] As a preferred improvement of the present invention: in the step S2, the film layer material used for vacuum coating is polyparaxylene or a silicon-based wear-resistant coating.

[0018] As a preferred improvement of the present invention: the electrolytic capacitor includes an aluminum shell, one end of the aluminum shell is open, a core is arranged inside the aluminum shell, a rubber sealing plug is arranged at the opening, and a pin is located outside the aluminum shell, and the pin passes through the rubber sealing plug to be connected to the core.

[0019] The protection method is used for processing electronic components immersed in cooling liquid for a long time, and the cooling liquid includes but is not limited to one or more of fluorinated liquid, mineral oil, and synthetic oil.

[0020] The beneficial effects of the present invention are as follows:

[0021] By coating electronic components with polymer nano-coatings for protection, common electronic components can be used stably in immersion liquid cooling applications. At the same time, the insulation, waterproof, oil-proof and corrosion-resistant capabilities of the components can be enhanced, solving the problem that there are currently no completely effective electronic components available on the market in immersion liquid cooling environments. Common electrolytic capacitors can operate stably in immersion liquid cooling applications, and the material protection level can be improved after coating. The coating is waterproof, oil-proof and corrosion-resistant. The coating of common electrolytic capacitors is compatible with air-cooled and oil-cooled designs. The cost of general materials is low, material control is convenient, and the overall cost of the enterprise is saved. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work, among which:

[0023] Figure 1 It is a structural schematic diagram of an electrolytic capacitor;

[0024] Figure 2 This is a schematic diagram of pin protection. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present invention will be described clearly and completely below in combination with the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0027] In addition, in the present invention, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0028] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0029] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in the field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0030] See also Figure 1 The structure of the electrolytic capacitor is shown in the figure. The electrolytic capacitor includes an aluminum shell, one end of which is open. A core is provided inside the aluminum shell, and a rubber sealing plug is provided at the opening. The pin is located outside the aluminum shell, and the pin passes through the rubber sealing plug to connect with the core. The rubber plug of the electrolytic capacitor is made of rubber material, which will gradually expand in immersion liquid cooling, lose the original sealing type of the electrolytic capacitor, and cause the capacity of the electrolytic capacitor to decrease rapidly and fail.

[0031] The present invention provides a vacuum coating protection method for electronic components, which solves the problem that common electronic components cannot be used stably in immersion liquid cooling, and comprises the following steps: S1, shielding and protecting the pins of the electronic components with glue; S2, vacuum coating the electronic components with a film thickness of 5-30 μm; S3, removing the glue on the pins.

[0032] As an embodiment, the thickness of the film layer is 15-20 μm. In the step S1, before the pins of the electronic components are protected with glue, the electronic components are first cleaned, and the cleaning includes a solvent cleaning process and a drying process. In the step S1, the glue includes but is not limited to one or more of UV curing glue, silicone, epoxy glue and hot melt glue. In the step S2, the vacuum coating method includes plasma enhanced chemical vapor deposition or physical vapor deposition or atomic layer deposition, and the film layer material used for vacuum coating is polyparaxylene or epoxy resin or silicon-based wear-resistant coating.

[0033] As an implementation method, the present invention needs to protect the welding pins of the plug-in electrolytic capacitor with glue (including UV curing glue, silicone, epoxy glue, hot melt glue or other, etc.) before coating to prevent the pins from being difficult to remove after coating, causing the pins to be non-conductive. The coating technology of the present invention adopts PECVD (plasma enhanced chemical vapor deposition), PVD (physical vapor deposition), ALD (atomic layer deposition) technology to carry out coating in a vacuum environment. The coating materials used are polyparaxylene, silicon-based wear-resistant coatings, etc. The coating thickness is required to be 15-20μm or other. After coating, the material is colorless and transparent, the film layer is dense, and it is pressure-resistant and corrosion-resistant. After the product is coated, the glue protecting the pins can be removed and it can be used in batches, which is convenient and quick.

[0034] The principle of CVD technology (chemical vapor deposition technology) is mainly to use gaseous raw materials to form a solid film on the surface of the substrate through chemical reactions. This process involves introducing gaseous raw materials into the reaction chamber. Under specific conditions, these gaseous raw materials undergo chemical reactions to generate solid substances and deposit on the surface of the substrate. The reason why the CVD method is widely used is that the prepared film can be tightly attached to the substrate and has almost no dependence on the geometric shape of the substrate. By changing the gas composition or deposition conditions (such as temperature, air pressure, etc.), the chemical or physical properties of the film can be changed, and the thickness is also easy to control. CVD technology includes a variety of specific methods, such as: MOCVD (metal organic chemical vapor deposition) technology, which uses metal organic compounds as reaction precursors to form a thin film on the substrate through thermal decomposition reactions. PCVD (plasma chemical vapor deposition) uses low-temperature plasma generated by gas glow discharge to enhance the chemical activity of the reactants and promote chemical reactions between gases, thereby depositing high-quality coatings at lower temperatures. Photo-CVD (photochemical vapor deposition) introduces light energy into the chemical vapor deposition system, and forms a thin film at a relatively low temperature through gas phase photolysis of the reactant molecules, surface photolysis, photosensitization reaction, and substrate surface heating. In addition, CVD technology also includes chemical vapor doping, which is a process of doping impurity elements into the film through the gas phase while chemical vapor deposition of the film. This technology is used to appropriately dope a certain amount of impurities to achieve the purpose of modification. For example, semiconductor films can become n-type and p-type semiconductors after doping with donor elements or acceptor elements. The doping amount is usually very low, ranging from ten to the negative ninth power to ten to the negative eighth power. By controlling the reaction conditions and selecting appropriate reaction precursors and doping elements, CVD technology can prepare thin film materials with specific properties and functions on the substrate, which has a better protective effect.

[0035] The protection method provided by the present invention can cover electronic components in all directions without dead angles, providing more comprehensive protection. The coating material has good environmental resistance and high reliability, can effectively improve the service life of electrolytic capacitors in harsh environments such as immersion liquid cooling, and has little effect on the heat dissipation performance of electrolytic capacitors, will not cause electronic products to overheat due to protection, the cost of general materials is low, material control is convenient, saving the overall cost of the enterprise, and can achieve mass production.

[0036] Although the embodiments of the present invention have been disclosed as above, they are not limited to the applications listed in the specification and the embodiments. They can be fully applied to various fields suitable for the present invention. For those familiar with the art, additional modifications can be easily implemented. Therefore, without departing from the general concept defined by the claims and the scope of equivalents, the present invention is not limited to the specific details and the illustrations shown and described herein.

Claims

1. A vacuum coating protection method for electronic components, characterized in that: The following steps are involved: S1. Use glue to shield and protect the pins of electronic components; S2. Vacuum coating the electronic components with a film thickness of 5-30 μm; S3. Remove the glue from the pins.

2. The vacuum coating protection method for electronic components according to claim 1, characterized in that: The electronic components include but are not limited to electrolytic capacitors, relays, electromagnetic components and power tubes.

3. The vacuum coating protection method for electronic components according to claim 1, characterized in that: The film layer has a thickness of 15-20 μm.

4. The vacuum coating protection method for electronic components according to claim 1, characterized in that: In the step S1, the electronic components are cleaned before the pins of the electronic components are protected with glue.

5. The vacuum coating protection method for electronic components according to claim 4, characterized in that: The cleaning includes a solvent cleaning process and a drying process.

6. The vacuum coating protection method for electronic components according to claim 1, characterized in that: In step S1, the glue includes but is not limited to one or more of UV curing glue, silicone glue, epoxy glue and hot melt glue.

7. The vacuum coating protection method for electronic components according to claim 1, characterized in that: In the step S2, the vacuum coating method includes plasma enhanced chemical vapor deposition, physical vapor deposition or atomic layer deposition.

8. The vacuum coating protection method for electronic components according to claim 1, characterized in that: In the step S2, the film material used for vacuum coating is polyparaxylene or silicon-based wear-resistant coating.

9. The vacuum coating protection method for electronic components according to claim 2, characterized in that: The electrolytic capacitor comprises an aluminum shell, one end of which is open, a core is arranged inside the aluminum shell, a rubber sealing plug is arranged at the opening, pins are located outside the aluminum shell, and the pins pass through the rubber sealing plug to connect with the core.

10. Application of the vacuum coating protection method for electronic components according to claim 1, characterized in that: The protection method is used for processing electronic components immersed in cooling liquid for a long time, and the cooling liquid includes but is not limited to one or more of fluorinated liquid, mineral oil, and synthetic oil.

Images