Compound dispersing agent and composite plating solution
By using compound dispersants in the silver-graphene composite plating solution, including benzenequinone polymers, sodium benzenesulfonate compounds and amide compounds, the graphene agglomeration problem was solved, and the good conductivity of the plating was achieved. Wear resistance ensures efficient dispersion and stability of the coating.
Patent Information
- Application Number
- CN202310686947.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-06-09
- Publication Date
- 2024-12-10
AI Technical Summary
In the prior art, the agglomeration problem of graphene in the dispersion liquid leads to poor dispersion performance of the silver-graphene composite plating liquid, affecting the conductivity and wear resistance of the plating layer.
Complex dispersants, including benzenequinone polymers, sodium benzenesulfonate compounds and amide compounds, are used to uniformly disperse graphene in the plating solution through synergistic action and migrate synchronously with metal ions to form good conductivity , stability and wear resistance coating.
It effectively improves the dispersion of graphene, ensures the conductivity, stability and wear resistance of the coating, and avoids the toxicity of metal ions.
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Abstract
Description
Technical Field
[0001] The present application relates to the field of electroplating technology, and in particular to a compound dispersant and a composite plating solution. Background Art
[0002] Silver plating is widely used as a conductor in electrical devices and solar devices due to its excellent conductivity. For example, the plating of electrical contacts in current transmission and conversion devices such as circuit breakers, relays and starters usually adopts pure silver plating and hard silver plating design. However, the silver plating of such contact heads has poor wear resistance and the silver layer is easy to fall off and slag when in use.
[0003] Graphene is a two-dimensional crystalline material with excellent electrical, thermal, mechanical and stability properties. The thermal conductivity of a single-layer graphene is as high as 5150 W / (m·K), and the carrier mobility is as high as 15000 cm 2 / (V·S). Therefore, in the prior art, graphene is added to a silver plating solution to prepare a silver-graphene composite plating solution, and the silver coating prepared from the silver-graphene composite plating solution has excellent electrical conductivity, thermal conductivity, wear resistance and dielectric corrosion resistance.
[0004] However, due to the strong π-π force between graphene sheets, single-layer graphene dispersed in the dispersion is easy to agglomerate to form graphite, which seriously affects the dispersion performance of the silver-graphene composite plating solution, and further affects the conductivity and wear resistance of the silver coating prepared therefrom.
[0005] Therefore, there is an urgent need for a dispersant that can better promote the dispersion of graphene to enhance the dispersibility of graphene in the silver-graphene composite plating solution. Summary of the invention
[0006] In view of this, the present application provides a compound dispersant, aiming to improve the problem of poor dispersibility of existing dispersants on graphene.
[0007] The embodiment of the present application is implemented as follows: the compound dispersant includes a benzoquinone polymer, a sodium benzenesulfonate compound and an amide compound.
[0008] Optionally, in some embodiments, in the compound dispersant, the content of the benzoquinone polymer is 5 to 15 parts by mass, the content of the sodium benzenesulfonate compound is 7 to 12 parts by mass, and the content of the amide compound is 8 to 20 parts by mass.
[0009] Optionally, in some embodiments, the benzoquinone polymer includes a benzoquinone polymer; and / or
[0010] The sodium benzene sulfonate compound includes sodium alkylbenzene sulfonate, and the sodium alkylbenzene sulfonate includes one or more of sodium methylbenzene sulfonate and sodium dimethylbenzene sulfonate; and / or
[0011] The amide compound includes one or more of vinyl bis stearamide, lauric acid diethanolamide, sodium pyrrolidone carboxylate and polyacrylamide.
[0012] Optionally, in some embodiments, the compound dispersant further includes a succinate surfactant, and the succinate surfactant includes but is not limited to one or more of sodium succinate and potassium succinate.
[0013] Optionally, in some embodiments, in the compound dispersant, the content of the succinate surfactant is 5 to 15 parts by mass.
[0014] Correspondingly, the present application also provides a composite plating solution, including silver salt, cyanide, an anode activator, graphene, water and a compound dispersant, wherein the compound dispersant includes a benzoquinone polymer, a sodium benzenesulfonate compound and an amide compound.
[0015] Optionally, in some embodiments, in the composite plating solution, the concentration of silver ions in the silver salt is 15 to 40 g / L; and / or
[0016] In the composite plating solution, the concentration of the cyanide is 50 to 90 g / L; and / or
[0017] In the composite plating solution, the concentration of the anode activator is 5 to 20 g / L; and / or
[0018] In the composite plating solution, the concentration of the graphene is 5 to 15 g / L; and / or
[0019] In the composite plating solution, the concentration of the benzoquinone polymer is 5 to 15 g / L; and / or
[0020] In the composite plating solution, the concentration of the sodium benzenesulfonate compound is 7 to 12 g / L; and / or
[0021] In the composite plating solution, the concentration of the amide compound is 8-20 g / L.
[0022] Optionally, in some embodiments, the silver salt includes one or more of silver cyanide, silver nitrate, silver methane sulfonate, silver citrate, silver methane sulfonate, silver phenol-3-sulfonate and silver tartrate; and / or
[0023] The cyanide comprises one or more of potassium cyanide and sodium cyanide; and / or
[0024] The anode activator comprises sodium potassium tartrate; and / or
[0025] The benzoquinone polymer includes a benzoquinone polymer; and / or
[0026] The sodium benzene sulfonate compound includes sodium alkylbenzene sulfonate, and the sodium alkylbenzene sulfonate includes one or more of sodium methylbenzene sulfonate and sodium dimethylbenzene sulfonate; and / or
[0027] The amide compound includes one or more of vinyl bis stearamide, lauric acid diethanolamide, sodium pyrrolidone carboxylate and polyacrylamide.
[0028] Optionally, in some embodiments, the compound dispersant further comprises a succinate surfactant, which is a salt surfactant formed from succinic acid, and includes but is not limited to one or more of sodium succinate and potassium succinate.
[0029] Optionally, in some embodiments, in the composite plating solution, the concentration of the succinate surfactant is 5 to 15 g / L.
[0030] The compound dispersant described in the present application includes the benzoquinone polymer, sodium benzenesulfonate compound, and amide compound. Under the synergistic effect of the benzoquinone polymer, sodium benzenesulfonate compound and amide compound, the compound dispersant can effectively wet the graphene and combine the graphene with the compound dispersant. In this way, when the compound dispersant is used in a metal-based-graphene composite plating solution, the compound dispersant can effectively disperse the graphene and make the graphene evenly dispersed in the plating solution system. When electroplating is performed using the metal-based-graphene composite plating solution including the compound dispersant, the graphene in the composite plating solution can also cooperate with the metal ions in the plating solution to migrate together in proportion (synchronous migration), which is conducive to the preparation of a coating with evenly dispersed graphene, thereby making the coating have good conductivity, stability and wear resistance. In addition, the compound dispersant has no poisoning effect on metal ions in the metal-based-graphene composite plating solution, which is conducive to the coating prepared by the metal-based-graphene composite plating solution including the compound dispersant having good conductivity, stability and wear resistance. DETAILED DESCRIPTION
[0031] The technical solutions in the embodiments of the present application are described clearly and completely below. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work belong to the scope of protection of the present application. In addition, it should be understood that the specific embodiments described herein are only used to illustrate and explain the present application, and are not used to limit the present application.
[0033] In this application, "and / or" describes the association relationship of associated objects, indicating that there may be three relationships. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. A and B can be singular or plural.
[0034] In the present application, "at least one" means one or more, and "plurality" means two or more. "At least one", "at least one of the following" or similar expressions refer to any combination of these items, including any combination of single items or plural items. For example, "at least one of a, b, or c", or "at least one of a, b, and c" can all mean: a, b, c, ab (i.e., a and b), ac, bc, or abc, where a, b, c can be single or multiple, respectively.
[0035] Various embodiments of the present application may be presented in the form of a range; it should be understood that the description in the form of a range is only for convenience and brevity, and should not be understood as a rigid limitation on the scope of the present application; therefore, the range description should be considered to have specifically disclosed all possible sub-ranges and single numerical values within the range. For example, the range description from 1 to 6 should be considered to have specifically disclosed sub-ranges, such as from 1 to 3, from 1 to 4, from 1 to 5, from 2 to 4, from 2 to 6, from 3 to 6, etc., as well as single numbers within the range, such as 1, 2, 3, 4, 5 and 6, which apply regardless of the range. In addition, whenever a numerical range is indicated herein, it is meant to include any cited number (fractional or integer) within the indicated range.
[0036] The technical solution of this application is as follows:
[0037] In a first aspect, the present invention provides a compound dispersant, which is mainly used in a silver-graphene composite plating solution containing graphene, and is used to improve the dispersibility of the graphene in the composite plating solution. The compound dispersant includes a benzoquinone polymer, a sodium benzenesulfonate compound, and an amide compound.
[0038] The benzoquinone polymers include but are not limited to benzoquinone polymers.
[0039] The sodium benzene sulfonate compounds include but are not limited to sodium alkylbenzene sulfonate, which include but are not limited to one or more of sodium methylbenzene sulfonate (also known as sodium p-toluene sulfonate) and sodium dimethylbenzene sulfonate (also known as sodium 3,5-dimethylbenzene sulfonate).
[0040] The amide compounds include, but are not limited to, one or more of vinyl bis stearamide, lauric acid diethanolamide, sodium pyrrolidone carboxylate and polyacrylamide.
[0041] The compound dispersant described in the present application includes the benzoquinone polymer, sodium benzenesulfonate compound, and amide compound. Under the synergistic effect of the benzoquinone polymer, sodium benzenesulfonate compound and amide compound, the compound dispersant can effectively wet the graphene and combine the graphene with the compound dispersant. In this way, when the compound dispersant is used in a metal-based-graphene composite plating solution, the compound dispersant can effectively disperse the graphene and make the graphene evenly dispersed in the plating solution system. When electroplating is performed using the metal-based-graphene composite plating solution including the compound dispersant, the graphene in the composite plating solution can also cooperate with the metal ions in the plating solution to migrate together in proportion (synchronous migration), which is conducive to the preparation of a coating with evenly dispersed graphene, thereby making the coating have good conductivity, stability and wear resistance. In addition, the compound dispersant has no poisoning effect on metal ions in the metal-based-graphene composite plating solution, which is conducive to the coating prepared by the metal-based-graphene composite plating solution including the compound dispersant having good conductivity, stability and wear resistance.
[0042] In the composite dispersant, the content of the benzoquinone polymer is 5 to 15 parts by weight, the content of the sodium benzenesulfonate compound is 7 to 12 parts by weight, and the content of the amide compound is 8 to 20 parts by weight.
[0043] Under the synergistic effect of the content range of each component, the compound dispersant can have good dispersibility, especially good dispersibility for graphene. When electroplating is carried out using a metal-based-graphene composite plating solution including the compound dispersant, the graphene in the composite plating solution can also cooperate with the metal ions in the plating solution to migrate together in proportion (synchronous migration), which is conducive to the preparation of a coating with uniform graphene dispersion.
[0044] In some embodiments, the compound dispersant further comprises a succinate surfactant. The succinate surfactant is a salt surfactant formed from succinic acid. The succinate surfactant includes but is not limited to one or more of sodium succinate and potassium succinate.
[0045] In the composite dispersant, the content of the succinate surfactant is 5 to 15 parts by mass.
[0046] Under the synergistic effect of the succinate surfactant and the benzoquinone polymer, sodium benzenesulfonate compound and amide compound, the composite dispersant can more effectively wet the graphene, so that the graphene and the dispersant can be more effectively combined, and during electroplating, the graphene in the composite plating solution can more effectively cooperate with the metal ions in the plating solution to migrate together in proportion (synchronous migration), which is more conducive to the preparation of a coating with uniform graphene dispersion, and thus the coating has better conductivity, stability and wear resistance.
[0047] In a third aspect, an embodiment of the present application further provides a composite plating solution, which includes a silver salt, a cyanide, an anode activator, graphene, water and a compound dispersant, wherein the compound dispersant includes a quinone polymer, a sodium benzenesulfonate compound and an amide compound.
[0048] In some embodiments, the compound dispersant further includes a succinate surfactant.
[0049] The benzoquinone polymer, sodium benzenesulfonate compound, amide compound and succinate surfactant are described above and will not be described in detail here.
[0050] The silver salt includes, but is not limited to, one or more of silver cyanide, silver nitrate, silver methane sulfonate, silver citrate, silver methane sulfonate, silver phenol-3-sulfonate, and silver tartrate.
[0051] The cyanide includes, but is not limited to, one or more of potassium cyanide (KCN) and sodium cyanide (NaCN).
[0052] The anode activator includes but is not limited to potassium sodium tartrate.
[0053] In the composite plating solution, the concentration of silver ions in the silver salt is 15-40 g / L, for example, 15-30 g / L, 18-32 g / L, 20-34 g / L, 25-35 g / L, 26-38 g / L, 28-40 g / L, etc.
[0054] In the composite plating solution, the concentration of the cyanide is 50-90 g / L, for example, 50-70 g / L, 55-75 g / L, 60-80 g / L, 65-85 g / L, 68-90 g / L, etc.
[0055] In the composite plating solution, the concentration of the anode activator is 5 to 20 g / L, for example, 5 to 12 g / L, 8 to 15 g / L, 10 to 20 g / L, etc.
[0056] In the composite plating solution, the concentration of the graphene is 5 to 15 g / L, for example, 5 to 10 g / L, 8 to 12 g / L, 10 to 15 g / L, etc.
[0057] In the composite plating solution, the concentration of the benzoquinone polymer is 5 to 15 g / L, for example, 5 to 10 g / L, 8 to 12 g / L, 10 to 15 g / L, etc.
[0058] In the composite plating solution, the concentration of the sodium benzenesulfonate compound is 7 to 12 g / L, for example, 7 to 10 g / L, 8 to 11 g / L, 9 to 12 g / L, etc.
[0059] In the composite plating solution, the concentration of the amide compound is 8 to 20 g / L, for example, 8 to 15 g / L, 10 to 16 g / L, 12 to 18 g / L, 14 to 20 g / L, etc.
[0060] In the composite plating solution, the concentration of the succinate surfactant is 5 to 15 g / L, for example, 5 to 10 g / L, 8 to 12 g / L, 10 to 15 g / L, etc.
[0061] The composite plating solution described in the present application includes the compound dispersant described above, and the compound dispersant can effectively disperse the graphene in the composite plating solution, so that the graphene is evenly dispersed in the plating solution system. During electroplating, the graphene in the composite plating solution can also cooperate with the metal ions in the composite plating solution to migrate together in proportion (synchronous migration), which is conducive to preparing a coating with uniform graphene dispersion, and then making the coating have good electrical conductivity, stability and wear resistance. In addition, the compound dispersant has no poisoning effect on the metal ions (silver ions) in the composite plating solution, which is conducive to the coating prepared by using the composite plating solution having good electrical conductivity, stability and wear resistance.
[0062] The composite plating solution described in the present application, under the synergistic effect of the components and their concentrations, allows the graphene in the coating prepared by the composite plating solution to be evenly dispersed, so that the coating has good electrical conductivity, stability, wear resistance and other properties.
[0063] In a third aspect, the present invention also provides a method for preparing the composite plating solution, comprising the following steps:
[0064] Silver salt, cyanide, an anode activator, graphene, water and the composite dispersant described above are provided and mixed in proportion to obtain the composite plating solution.
[0065] The silver salt, cyanide and anode activator are as described above and will not be described in detail here.
[0066] In a fourth aspect, an embodiment of the present application further provides a plated component, wherein at least one surface of the plated component is bonded with a plating layer, and the plating layer is prepared by the composite plating solution described above through electroplating or other methods.
[0067] In at least some embodiments, the plated component is an electrical contact.
[0068] The present application is described in detail below through specific embodiments. The following embodiments are only partial embodiments of the present application and are not limitations of the present application.
[0069] Plating solution example 1
[0070] The composite plating solution of this embodiment includes KCN, silver cyanide, graphene, potassium sodium tartrate and a compound dispersant, wherein the compound dispersant includes a benzoquinone polymer, sodium toluenesulfonate and vinyl bis stearamide.
[0071] In the composite plating solution, the concentration of KCN is 65 g / L, the concentration of silver ions (the concentration of silver cyanide) is 25 g / L, the concentration of graphene is 5 g / L, the concentration of potassium sodium tartrate is 10 g / L, the concentration of benzoquinone polymer is 10 g / L, the concentration of sodium toluenesulfonate is 10 g / L, and the concentration of vinyl bis stearamide is 10 g / L.
[0072] Plating solution example 2
[0073] This embodiment is substantially the same as plating solution embodiment 1, except that the composite plating solution in this embodiment further includes sodium succinate, and the concentration of sodium succinate in the composite plating solution is 8 g / L.
[0074] Plating solution example 3
[0075] This embodiment is substantially the same as plating solution embodiment 2, except that, in this embodiment, sodium dimethylbenzenesulfonate is used to replace the sodium methylbenzenesulfonate in plating solution embodiment 2.
[0076] Plating solution example 4
[0077] This embodiment is basically the same as plating solution embodiment 3, except that polyacrylamide is used in this embodiment to replace the vinyl bisstearylamide in plating solution embodiment 3, and the concentration of polyacrylamide in the composite plating solution of this embodiment is 12 g / L.
[0078] Plating solution example 5
[0079] This embodiment is basically the same as plating solution embodiment 3, except that, in this embodiment, the composite plating solution also includes polyacrylamide, and in the composite plating solution of this embodiment, the concentration of vinyl bisstearylamide is 8 g / L and the concentration of polyacrylamide is 4 g / L.
[0080] Plating solution example 6
[0081] This embodiment is basically the same as plating solution embodiment 2, except that, in this embodiment, lauric acid diethanolamide and sodium pyrrolidone carboxylate are used to replace the vinyl bisstearylamide in plating solution embodiment 2, and the concentration of lauric acid diethanolamide is 5 g / L, and the concentration of sodium pyrrolidone carboxylate is 5 g / L.
[0082] Plating solution example 7
[0083] This embodiment is basically the same as plating solution embodiment 2, except that, in this embodiment, the concentration of benzoquinone polymer is 5 g / L, the concentration of sodium toluenesulfonate is 7 g / L, the concentration of vinyl bisstearylamide is 8 g / L, and the concentration of sodium succinate is 5 g / L.
[0084] Plating solution example 8
[0085] This embodiment is basically the same as plating solution embodiment 2, except that, in this embodiment, the concentration of benzoquinone polymer is 15 g / L, the concentration of sodium toluenesulfonate is 12 g / L, the concentration of vinyl bisstearylamide is 20 g / L, and the concentration of sodium succinate is 15 g / L.
[0086] Plating solution comparative example 1
[0087] This comparative example provides a composite plating solution. The components of the composite plating solution of this comparative example are basically the same as those of the composite plating solution of Plating Solution Example 1, except that the composite plating solution of this comparative example does not include the composite dispersant in the composite plating solution of Plating Solution Example 1.
[0088] Plating solution comparative example 2
[0089] This comparative example provides a composite plating solution. The components of the composite plating solution of this comparative example are basically the same as those of the composite plating solution of plating solution comparative example 1. The difference is that the composite plating solution of this comparative example includes a dispersant benzoquinone polymer, and the concentration of the benzoquinone polymer is 10 g / L.
[0090] Plating solution comparative example 3
[0091] This comparative example provides a composite plating solution. The components of the composite plating solution of this comparative example and the composite plating solution of plating solution comparative example 1 are basically the same, except that the composite plating solution of this comparative example includes a dispersant sodium toluenesulfonate, and the concentration of the sodium toluenesulfonate is 10 g / L.
[0092] Plating solution comparative example 4
[0093] This comparative example provides a composite plating solution. The components of the composite plating solution of this comparative example are basically the same as those of the composite plating solution of plating solution comparative example 1. The difference is that the composite plating solution of this comparative example includes a dispersant vinyl bisstearylamide, and the concentration of vinyl bisstearylamide is 10g / L.
[0094] Plating solution comparative example 5
[0095] This comparative example provides a composite plating solution. The components of the composite plating solution of this comparative example are substantially the same as those of the composite plating solution of plating solution embodiment 4, except that the composite plating solution of this comparative example does not include a benzoquinone polymer.
[0096] Plated Example 1
[0097] At least one surface of the plated component of this embodiment is provided with a plating layer, and the plating layer is obtained by electroplating the composite plating solution of Plating Solution Example 1 on the surface of the plated component.
[0098] Plated Parts Examples 2 to 8
[0099] The plated parts in Examples 2 to 8 are basically the same as the plated parts in Example 1, except that the plating layers in Examples 2 to 8 are respectively made of the composite plating solutions in Examples 2 to 8.
[0100] Plated Comparative Examples 1 to 5
[0101] The plated parts of comparative examples 1 to 5 are substantially the same as the plated parts of embodiment 1, except that the coating layers of the plated parts of comparative examples 1 to 5 are respectively coated with the composite plating solutions of the plating solution comparative examples 1 to 5.
[0102] The coatings of the plated parts of the plated parts of the plated parts examples 1 to 8 and the plated parts comparison examples 1 to 5 were subjected to Zeta potential test, abrasion resistance test and hardness test, respectively, to obtain the Zeta potential of the coating, the average sheet diameter of graphene in the coating, the average number of frictions that the coating can withstand per micron and the hardness. Among them, the Zeta potential test method is electrophoresis; the hardness test is carried out by a hardness tester; the wear resistance test is carried out by testing the coating with a steel wool abrasion resistance tester. The test results are shown in Table 1.
[0103] Table 1:
[0104]
[0105] From Table 1 we can see that:
[0106] Compared with the Zeta potential of the coating of the plated comparative examples 1 to 5, the absolute value of the Zeta potential of the coating of the plated embodiments 1 to 8 is higher. The reason is that the composite plating solution of the plating solution embodiments 1 to 8 includes the compound dispersant described in the present application, and the compound dispersant can effectively disperse the graphene, so that the graphene is uniformly dispersed in the plating solution system. When the metal-based-graphene composite plating solution including the compound dispersant is used for electroplating, the graphene in the composite plating solution can also cooperate with the metal ions in the plating solution to migrate in proportion (synchronous migration), and the compound dispersant has no poisoning effect on the silver ions in the metal-based-graphene composite plating solution.
[0107] Compared with the average number of frictions that can be borne per micron of the coatings of the plated comparative examples 1 to 5, the average number of frictions that can be borne per micron of the coatings of the plated examples 1 to 8 is higher. The reason is that the composite plating solution used in the preparation of the coatings of the plated examples 1 to 8 includes the compound dispersant described in the present application, and the compound dispersant can effectively disperse the graphene, so that the graphene is evenly dispersed in the plating solution system. When electroplating is performed using the metal-based-graphene composite plating solution including the compound dispersant, the graphene in the composite plating solution can also cooperate with the metal ions in the plating solution to migrate in proportion (synchronous migration), and the compound dispersant has no poisoning effect on the silver ions in the metal-based-graphene composite plating solution.
[0108] Compared with the hardness of the coating of the plated comparative examples 1 to 5, the hardness of the coating of the plated embodiments 1 to 8 is higher. The reason is that the composite plating solution used in the preparation of the coating of the plated embodiments 1 to 8 includes the compound dispersant described in the present application, and the compound dispersant can effectively disperse the graphene, so that the graphene is uniformly dispersed in the plating solution system. When the metal-based-graphene composite plating solution including the compound dispersant is used for electroplating, the graphene in the composite plating solution can also cooperate with the metal ions in the plating solution to migrate in proportion (synchronous migration), and the compound dispersant has no poisoning effect on the silver ions in the metal-based-graphene composite plating solution.
[0109] The compound dispersant and composite plating solution provided in the embodiments of the present application are introduced in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for technicians in this field, according to the ideas of the present application, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on the present application.
Claims
1. A composite dispersant, characterized in that: Including benzoquinone polymers, sodium benzenesulfonate compounds and amide compounds.
2. The composite dispersant according to claim 1, characterized in that: In the composite dispersant, the content of the benzoquinone polymer is 5 to 15 parts by weight, the content of the sodium benzenesulfonate compound is 7 to 12 parts by weight, and the content of the amide compound is 8 to 20 parts by weight.
3. The composite dispersant according to claim 1, characterized in that: The benzoquinone polymer includes a benzoquinone polymer; and / or The sodium benzene sulfonate compound includes sodium alkylbenzene sulfonate, and the sodium alkylbenzene sulfonate includes one or more of sodium methylbenzene sulfonate and sodium dimethylbenzene sulfonate; and / or The amide compound includes one or more of vinyl bis stearamide, lauric acid diethanolamide, sodium pyrrolidone carboxylate and polyacrylamide.
4. The composite dispersant according to claim 1, characterized in that: The compound dispersant also includes a succinate surfactant, and the succinate surfactant includes one or more of sodium succinate and potassium succinate.
5. The composite dispersant according to claim 4, characterized in that: In the composite dispersant, the content of the succinate surfactant is 5 to 15 parts by mass.
6. A composite plating solution, characterized in that: The composite plating solution comprises silver salt, cyanide, an anode activator, graphene, water and a compound dispersant, and the compound dispersant comprises a benzoquinone polymer, a sodium benzenesulfonate compound and an amide compound.
7. The composite plating solution according to claim 6, characterized in that: In the composite plating solution, the concentration of silver ions in the silver salt is 15 to 40 g / L; and / or In the composite plating solution, the concentration of the cyanide is 50 to 90 g / L; and / or In the composite plating solution, the concentration of the anode activator is 5 to 20 g / L; and / or In the composite plating solution, the concentration of the graphene is 5 to 15 g / L; and / or In the composite plating solution, the concentration of the benzoquinone polymer is 5 to 15 g / L; and / or In the composite plating solution, the concentration of the sodium benzenesulfonate compound is 7 to 12 g / L; and / or In the composite plating solution, the concentration of the amide compound is 8-20 g / L.
8. The composite plating solution according to claim 6, characterized in that: The silver salt comprises one or more of silver cyanide, silver nitrate, silver methane sulfonate, silver citrate, silver methane sulfonate, silver phenol-3-sulfonate and silver tartrate; and / or The cyanide comprises one or more of potassium cyanide and sodium cyanide; and / or The anode activator comprises sodium potassium tartrate; and / or The benzoquinone polymer includes a benzoquinone polymer; and / or The sodium benzene sulfonate compound includes sodium alkylbenzene sulfonate, and the sodium alkylbenzene sulfonate includes one or more of sodium methylbenzene sulfonate and sodium dimethylbenzene sulfonate; and / or The amide compound includes one or more of vinyl bis stearamide, lauric acid diethanolamide, sodium pyrrolidone carboxylate and polyacrylamide.
9. The composite plating solution according to claim 6, characterized in that: The compound dispersant also includes a succinate surfactant, and the succinate surfactant includes one or more of sodium succinate and potassium succinate.
10. The composite plating solution according to claim 9, characterized in that: In the composite plating solution, the concentration of the succinate surfactant is 5 to 15 g / L.