Circuit board manufacturing method and device, equipment and storage medium

Abstract

The invention provides a circuit board manufacturing method and device, equipment and a storage medium, and relates to the technical field of electronic equipment manufacturing. The method comprises the following steps: in response to a circuit board production request initiated by a user, obtaining a production work order corresponding to the circuit board production request at a first position; scanning the production work order to obtain a circuit board production report; obtaining a production material at the second position, and performing production processing on the production material based on production process information and production parameter information included in the circuit board production report to obtain a produced circuit board; wherein the produced circuit board comprises related information of production materials, production process information in the production processing process of the circuit board and real production parameters; and determining a circuit board distribution path corresponding to the circuit board production request, and completing the manufacturing of the circuit board after carrying out distribution processing on the produced circuit board based on the detected circuit board distribution instruction. According to the method, the manufacturing efficiency and quality of the circuit board are improved.

Description

Technical Field

[0001] The present application relates to the technical field of electronic device manufacturing, and in particular to a circuit board manufacturing method, device, equipment and storage medium. Background Art

[0002] In the field of modern electronic equipment manufacturing, circuit boards are one of the core components, and their quality and efficiency will directly affect the efficiency and performance of electronic equipment manufacturing. Therefore, how to ensure the quality and efficiency of circuit board manufacturing has become a technical problem that needs to be solved urgently.

[0003] In the related technology, a large amount of manual participation is required in the whole process traceability of circuit board manufacturing. For example, it may be necessary to manually record material information, manually start production instructions, and manually monitor production steps and production quality.

[0004] This implementation method not only leads to low efficiency in circuit board manufacturing, but also fails to achieve real-time monitoring and early warning of the entire circuit board manufacturing process. At this time, when quality problems occur in the circuit board, they cannot be discovered and handled in time, which in turn affects the quality of the circuit board. Summary of the invention

[0005] The present application provides a circuit board manufacturing method, device, equipment and storage medium to solve the technical problems in the prior art that the efficiency of circuit board manufacturing is low and the quality of circuit board manufacturing cannot be discovered and processed in time.

[0006] In a first aspect, the present application provides a circuit board manufacturing method, comprising:

[0007] In response to a circuit board production request initiated by a user, obtaining a production work order corresponding to the circuit board production request at a first location;

[0008] After scanning and processing the production work order, a circuit board production report is obtained; wherein the circuit board production report includes at least production process information and production parameter information;

[0009] Acquire the production material at the second position, and perform production processing on the production material based on the production process information and production parameter information included in the circuit board production report to obtain the produced circuit board; wherein the produced circuit board includes relevant information of the production material, production process information and real production parameters in the production process of the circuit board;

[0010] A circuit board delivery path corresponding to the circuit board production request is determined, and after the produced circuit board is delivered based on the detected circuit board delivery instruction, the manufacturing of the circuit board is completed.

[0011] In a possible implementation, the production process information includes a plurality of process nodes; based on the production process information and production parameter information included in the circuit board production report, the production material is subjected to production processing, including:

[0012] Determining target parameters matching each of the process nodes from the production parameter information;

[0013] The production material is processed according to the execution order of the multiple process nodes and the target parameters matched with each of the process nodes.

[0014] In a possible implementation, the multiple process nodes include a target node; wherein the target node indicates a node that needs to be quality tested; and the method further includes:

[0015] After executing the production process corresponding to the target node on the production material, a circuit board under production is obtained;

[0016] Determining quality detection content corresponding to the target node;

[0017] Based on the quality inspection content, quality inspection is performed on the circuit board being produced to obtain a quality inspection result.

[0018] In a possible implementation manner, after performing quality inspection on the circuit board being produced based on the quality inspection content and obtaining the quality inspection result, the method further includes:

[0019] If it is determined that the quality inspection result does not meet the preset quality requirement, the production process corresponding to the target node is re-executed.

[0020] In a possible implementation manner, before performing production processing on the production material according to the execution order of the multiple process nodes and the target parameters matching each of the process nodes, the method further includes:

[0021] Determine the equipment status information of the production equipment corresponding to the process node to be executed;

[0022] If it is determined based on the equipment status information that the production equipment does not meet the production process requirements, determining a spare node from the multiple process nodes;

[0023] The production material is processed based on the standby node.

[0024] In a possible implementation, the method further includes:

[0025] Based on the production process information and production parameter information included in the circuit board production report, after the production material is processed, processing information in the production process is obtained;

[0026] The circuit board identification information is generated based on the processing information, and after the circuit board identification information is printed on the circuit board, the produced circuit board is obtained.

[0027] In a possible implementation, the method further includes:

[0028] In response to the recognition instruction of the circuit board identification information, processing information of the produced circuit board during the production process is displayed.

[0029] In a second aspect, the present application provides a circuit board manufacturing device, comprising:

[0030] An acquisition unit, configured to, in response to a circuit board production request initiated by a user, acquire a production work order corresponding to the circuit board production request at a first location;

[0031] A scanning unit, configured to scan and process the production work order to obtain a circuit board production report; wherein the circuit board production report includes at least production process information and production parameter information;

[0032] A production unit, used to obtain production materials at the second location, and based on the production process information and production parameter information included in the circuit board production report, perform production processing on the production materials to obtain a produced circuit board; wherein the produced circuit board includes relevant information of the production materials, production process information during the circuit board production processing, and real production parameters;

[0033] The distribution unit is used to determine a circuit board distribution path corresponding to the circuit board production request, and complete the manufacture of the circuit board after performing distribution processing on the produced circuit board based on the detected circuit board distribution instruction.

[0034] In a possible implementation manner, the production process information includes multiple process nodes; a production unit is used to:

[0035] Determining target parameters matching each of the process nodes from the production parameter information;

[0036] The production material is processed according to the execution order of the multiple process nodes and the target parameters matched with each of the process nodes.

[0037] In a possible implementation, the multiple process nodes include a target node; wherein the target node indicates a node that needs to be quality tested; and the device further includes a quality testing unit, which is used to:

[0038] After executing the production process corresponding to the target node on the production material, a circuit board under production is obtained;

[0039] Determining quality detection content corresponding to the target node;

[0040] Based on the quality inspection content, quality inspection is performed on the circuit board being produced to obtain a quality inspection result.

[0041] In a possible implementation manner, after performing quality inspection on the circuit board being produced based on the quality inspection content and obtaining the quality inspection result, the device is further used to:

[0042] If it is determined that the quality inspection result does not meet the preset quality requirement, the production process corresponding to the target node is re-executed.

[0043] In a possible implementation manner, before performing production processing on the production material according to the execution order of the multiple process nodes and the target parameters matching each of the process nodes, the device further includes a redundant processing unit for:

[0044] Determine the equipment status information of the production equipment corresponding to the process node to be executed;

[0045] If it is determined based on the equipment status information that the production equipment does not meet the production process requirements, determining a spare node from the multiple process nodes;

[0046] The production material is processed based on the standby node.

[0047] In a possible implementation manner, the production processing unit is further used for:

[0048] Based on the production process information and production parameter information included in the circuit board production report, after the production material is processed, processing information in the production process is obtained;

[0049] The circuit board identification information is generated based on the processing information, and after the circuit board identification information is printed on the circuit board, the produced circuit board is obtained.

[0050] In a possible implementation, the device further includes a display unit, which is used to:

[0051] In response to the recognition instruction of the circuit board identification information, processing information of the produced circuit board during the production process is displayed.

[0052] In a third aspect, the present application provides a computer device, comprising: a processor, and a memory communicatively connected to the processor;

[0053] The memory stores computer-executable instructions;

[0054] The processor executes the computer-executable instructions stored in the memory to implement the method according to any one of the first aspects.

[0055] In a fourth aspect, the present application provides a computer-readable storage medium, wherein the computer-readable storage medium stores computer-executable instructions, and when the computer-executable instructions are executed by a processor, they are used to implement any one of the methods in the first aspect.

[0056] In a fifth aspect, the present application provides a computer program product, comprising: computer execution instructions, the computer execution instructions are stored in a readable storage medium, at least one processor of a computer device can read the computer execution instructions from the readable storage medium, and the at least one processor executes the computer execution instructions, so that the computer device performs any method described in the first aspect.

[0057] The circuit board manufacturing method, device, equipment and storage medium provided by the present application can respond to the circuit board production request initiated by the user, obtain the production work order corresponding to the circuit board production request at the first position, and then obtain the circuit board production report after scanning the production work order; wherein the circuit board production report includes production process information and production parameter information. At this time, the production process information and production parameter information included in the circuit board production report can be used for the production and processing of the circuit board, which can not only ensure the accuracy of the circuit board production and processing, avoid manual operation errors, but also improve the production efficiency of the circuit board. After that, the production material at the second position can be obtained first, and then, based on the production process information and production parameter information included in the circuit board production report, the production material is processed to obtain the produced circuit board. At this time, the produced circuit board includes relevant information of the production material, production process information and real production parameters in the circuit board production process, so that the production process related information from raw materials to shipment in the circuit board production process can be recorded in real time, so that the production quality problems of the circuit board can be discovered and processed in time, and the quality of circuit board manufacturing is improved. After the production of the circuit board is completed, the circuit board distribution path corresponding to the circuit board production request can be determined, and after the produced circuit board is distributed and processed based on the detected circuit board distribution instruction, the manufacturing of the circuit board is completed. In this implementation, the logistics and distribution process of the circuit board is also monitored simultaneously to ensure the transparency of the entire circuit board manufacturing process, making the entire circuit board manufacturing process more traceable, thereby facilitating comprehensive monitoring and management of the circuit board manufacturing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0058] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0059] Figure 1 A schematic diagram of a process for manufacturing a circuit board provided in an embodiment of the present application;

[0060] Figure 2 A schematic diagram of a process flow of another circuit board manufacturing method provided in an embodiment of the present application;

[0061] Figure 3 A schematic diagram of production process information corresponding to a circuit board is provided for an embodiment of the present application;

[0062] Figure 4 A schematic diagram of an implementation process of a circuit board manufacturing method provided in an embodiment of the present application;

[0063] Figure 5 A schematic diagram of an application scenario of a circuit board manufacturing method provided in an embodiment of the present application;

[0064] Figure 6 A schematic diagram of the structure of a circuit board manufacturing device provided in an embodiment of the present application;

[0065] Figure 7 A schematic diagram of the structure of another circuit board manufacturing device provided in an embodiment of the present application;

[0066] Figure 8 A schematic diagram of the structure of a computer device provided in an embodiment of the present application.

[0067] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0068] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0069] The term "and / or" herein only describes an association relationship, indicating that three relationships may exist. For example, A and / or B may represent the following three situations: A exists alone, A and B exist at the same time, and B exists alone. In addition, the term "at least one" herein represents any combination of at least two of any one or more of a plurality of. For example, including at least one of A, B, and C may represent including any one or more elements selected from the set consisting of A, B, and C.

[0070] In order to ensure the quality of circuit board manufacturing, a circuit board manufacturing method with full-process traceability is generally adopted. In the existing circuit board manufacturing method based on full-process traceability, the equipment is mainly operated through human-computer interaction to realize the manufacture of circuit boards. For example, after receiving a circuit board manufacturing order and generating a corresponding work order, the manufacturing equipment corresponding to the work order can be manually allocated, and the material information can be manually scanned and registered for later traceability processing. In the manufacturing process of circuit boards, the quality problems of circuit boards are mainly recorded and checked manually, which is not only inefficient and unable to deal with the quality problems of circuit boards in a timely and effective manner, but also prone to mistakes, which in turn affects the quality and efficiency of circuit board manufacturing. Therefore, how to ensure the quality and efficiency of circuit board manufacturing has become a technical problem that needs to be solved urgently.

[0071] The circuit board manufacturing method provided in the present application aims to automatically record relevant information of the circuit board manufacturing process starting from the work order until the produced circuit boards are delivered, thereby realizing full-process and transparent information management and traceability of circuit board manufacturing, thereby timely discovering and correcting quality problems in the circuit board manufacturing process, improving the quality and efficiency of circuit board manufacturing, and thus solving the above technical problems of the prior art.

[0072] The technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems are described in detail below with specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0073] Figure 1 A schematic diagram of a circuit board manufacturing method provided in an embodiment of the present application is shown in FIG. Figure 1 As shown, the circuit board manufacturing method specifically includes the following steps:

[0074] S101. In response to a circuit board production request initiated by a user, obtain a production work order corresponding to the circuit board production request at a first location.

[0075] In one example, after receiving a circuit board manufacturing order, a corresponding production work order can be generated according to the circuit board manufacturing order, and the production work order is placed at the production starting point of the circuit board, that is, at the first position, so that after detecting the circuit board production request initiated by the user, the production of the circuit board begins. The production work order may include but is not limited to information such as production equipment information, production process information, and production parameter information.

[0076] In one example, the first position may indicate a starting point of a production device corresponding to a circuit board, or may indicate a computer device for controlling a circuit board production request process. The first position is not specifically limited here.

[0077] In one example, production work orders with different identification information can be generated for different types of circuit board production requests, where the different identification information can indicate different colors, different work order labels, etc. The specific content and quantity of the identification information of the production work order are not limited here, and are subject to what can be implemented.

[0078] In one example, when a production work order indicates the production of circuit boards of different models / types, the production work order may correspond to different work order labels, and / or, when a production work order indicates circuit boards at different production stages, the production work order may correspond to different colors.

[0079] In one example, a circuit board production request is used to request the start of circuit board production. At this time, after initiating the circuit board production request, the user can obtain a production work order and manufacture the circuit board according to the production work order.

[0080] S102: After scanning and processing the production work order, a circuit board production report is obtained.

[0081] The circuit board production report includes at least production process information and production parameter information.

[0082] In one example, a production work order can be scanned by a scanner to obtain a circuit board production report, and the circuit board production report is stored in a computer device for traceability.

[0083] In one example, the embodiment of the present application can also scan the production equipment corresponding to the circuit board to obtain the number information of the production equipment, and scan the work number of the operator who produces the circuit board to obtain the work number information of the operator. Afterwards, the number information of the production equipment and the work number information of the operator can also be stored in the computer device to ensure the integrity and diversity of the relevant information when the circuit board starts to be produced.

[0084] In one example, the production process information may include the production process of the circuit board. For example, the production process information may include but is not limited to the following production processes: cutting, inner layer, inner layer AOI (Automated Optical Inspection), lamination, drilling, electroplating, outer layer, outer layer AOI, solder mask text, molding, surface treatment, electrical testing, final inspection, shipment, etc. At this time, each production process may correspond to one or more process contents. For example, the inner layer AOI may correspond to at least one of the following process contents: punching, AOI-CVR (Automated Optical Inspection-Coverage Verification and Reporting), impedance, insertion loss, line width, etc.; for another example, drilling may correspond to at least one of the following process contents: drilling, back drilling, plasma treatment (plasma), laser drilling, deburring, baking, etc. There is no limitation on the process contents included in each production process here, and it shall be subject to meeting actual needs.

[0085] In one example, the production parameter information may indicate the parameters corresponding to the process content under the circuit board production process. For example, the production parameter information may indicate the impedance value, insertion loss value, line width value, etc. of the circuit board. The specific value of the production parameter information is not limited here, and shall be based on meeting actual needs.

[0086] S103: Acquire production materials at the second location, and perform production processing on the production materials based on the production process information and production parameter information included in the circuit board production report to obtain a produced circuit board.

[0087] Among them, the produced circuit boards include relevant information of production materials, production process information during the circuit board production process and actual production parameters.

[0088] In one example, after obtaining the production materials, the production materials can be scanned and processed to obtain the batch number information of the production materials and store it.

[0089] In one example, the relevant information of the production material may indicate the batch number information of the production material. In this case, printing the relevant information of the production material on the circuit board can realize LOT (Lot Number) traceability of the circuit board manufacturing process.

[0090] In one example, the second position may indicate the starting position of the production equipment corresponding to the circuit board. In this case, the circuit board can be produced directly according to the production materials at the second position. Alternatively, the second position may also indicate the storage location of the production materials. In this case, the production materials can be obtained by means of mechanical arms or robot transportation. The method of obtaining the production materials is not limited here, and it is subject to what can be realized.

[0091] In one example, the production process information included in the circuit board production report may also include a process sequence, so that the production materials can be processed according to the process sequence, the production process information and the production parameter information to obtain the produced circuit board.

[0092] In one example, when production materials are processed, a corresponding parameter range can be set for the process content under at least part of the production process included in the production process information, and when the actual production parameters of the produced circuit board exceed the parameter range, timely warning or timely adjustment can be made, thereby ensuring the quality of the produced circuit board.

[0093] In one example, when the production materials are processed based on the production process information included in the circuit board production report, the PNL code and PCB code corresponding to the circuit board can be generated in the pressing-molding process indicated by the production process information, so that the panel-level traceability of the circuit board can be achieved through the PNL code (Panel Code), and the circuit board-level traceability can be achieved through the PCB code (Printed Circuit Board Code). At this time, the PNL code contains information related to the panel of the circuit board, such as the panel number, panel type, panel parameters, etc.; the PCB code contains information related to the circuit board, such as the production process experienced by the circuit board, the process content included in each production process, and the actual production parameters under each process content.

[0094] S104: Determine a circuit board delivery path corresponding to the circuit board production request, and complete the manufacture of the circuit board after delivering the produced circuit board based on the detected circuit board delivery instruction.

[0095] In one example, the circuit board delivery instruction may indicate a pre-set scheduled delivery task, or may indicate a circuit board delivery instruction initiated by an operator through a computer device. The initiation method of the circuit board delivery instruction is not limited here.

[0096] In one example, when the produced circuit boards are delivered based on the detected circuit board delivery instructions, the delivery can be carried out on demand. For example, all the produced circuit boards can be delivered, or part of the produced circuit boards can be delivered, or the produced circuit boards can be delivered at different times, etc.

[0097] In a possible implementation, in the process of manufacturing the circuit board according to the above method, the relevant data in the circuit board manufacturing process can also be uploaded to the shared platform in real time, so that the circuit board manufacturer and the circuit board ordering party can obtain the real-time data in the circuit board manufacturing process, so as to facilitate the relevant personnel to view and analyze the relevant data in the circuit board manufacturing process. For example, if it is monitored that during the circuit board manufacturing process, the actual production parameters of the circuit board have not been able to meet the standards during the production process of the circuit board under the B process content of the A production process, then the production process information and / or production parameter information of the circuit board can be adjusted according to the actual production parameters of the circuit board, so as to ensure the quality of the circuit board and obtain a better quality circuit board.

[0098] It can be seen from the above description that the embodiment of the present application can respond to the circuit board production request initiated by the user, obtain the production work order corresponding to the circuit board production request at the first position, and then obtain the circuit board production report after scanning the production work order; wherein the circuit board production report includes production process information and production parameter information. At this time, the production process information and production parameter information included in the circuit board production report can be used for the production and processing of the circuit board, which can not only ensure the accuracy of the circuit board production and processing, avoid manual operation errors, but also improve the production efficiency of the circuit board. After that, the production material at the second position can be obtained first, and then, based on the production process information and production parameter information included in the circuit board production report, the production material is processed to obtain the produced circuit board. At this time, the produced circuit board includes relevant information of the production material, production process information and real production parameters in the circuit board production process, so that the production process related information from raw materials to shipment in the circuit board production process can be recorded in real time, so that the production quality problems of the circuit board can be discovered and processed in time, and the quality of circuit board manufacturing is improved. After the production of the circuit board is completed, the circuit board distribution path corresponding to the circuit board production request can be determined, and after the produced circuit board is distributed and processed based on the detected circuit board distribution instruction, the manufacturing of the circuit board is completed. In this implementation, the logistics and distribution process of the circuit board is also monitored simultaneously to ensure the transparency of the entire circuit board manufacturing process, making the entire circuit board manufacturing process more traceable, thereby facilitating comprehensive monitoring and management of the circuit board manufacturing process.

[0099] Figure 2 A schematic diagram of another circuit board manufacturing method provided in an embodiment of the present application is shown in FIG. Figure 2 As shown, the circuit board manufacturing method specifically includes the following steps:

[0100] S201. In response to a circuit board production request initiated by a user, obtain a production work order corresponding to the circuit board production request at a first location.

[0101] In an example, this step can refer to the content described in S101 above, and will not be described in detail here.

[0102] S202: After scanning and processing the production work order, a circuit board production report is obtained.

[0103] The circuit board production report includes at least production process information and production parameter information.

[0104] In an example, this step can refer to the content described in S102 above, and will not be described in detail here.

[0105] S203: Acquire production materials at the second location.

[0106] In an example, this step may refer to the content described in the above S103, and will not be described in detail here.

[0107] S204: Based on the production process information and production parameter information included in the circuit board production report, production processing is performed on the production materials.

[0108] In one example, the production process information includes multiple process nodes. At this time, the target parameters matching each process node can be determined from the production parameter information; then, the production materials are processed according to the execution order of the multiple process nodes and the target parameters matching each process node.

[0109] In one example, the process node included in the production process information may indicate the process content under the production process, for example, see Figure 3 , Figure 3 A schematic diagram of production process information corresponding to a circuit board is provided for an embodiment of the present application, such as Figure 3 As shown, the production process information corresponding to the circuit board may include the following production processes: cutting, inner layer, inner layer AOI, pressing, drilling, electroplating, outer layer, outer layer AOI, solder mask text, molding, surface treatment, electrical testing, final inspection, and shipment.

[0110] At this time, each production process can correspond to one or more process contents, that is, multiple process nodes. Figure 3As shown, the process nodes included in the cutting process are: cutting and filleting; the process nodes included in the inner layer process are: pre-treatment, exposure and etching; the process nodes included in the inner layer AOI process are: punching, AOI-CVR, impedance, insertion loss and line width; the process nodes included in the pressing process are: browning, assembly, riveting, lamination, pressing, X-Ray (X-ray), three-in-one line, edge removal, cleaning, Pp (Prepreg, prepreg material) cutting and Pp punching; the process nodes included in the drilling process are: drilling, back drilling, Plasma, laser drilling, deburring and baking; the process nodes included in the electroplating process are: horizontal electroplating, alkaline etching, pattern electricity, PTH (Plated Through Hole, plated through hole), board electricity, VCP (Vertical Continuous Plating, vertical continuous electroplating), fine grinding, and hole scanning; the process nodes included in the outer layer process are: pre-treatment, exposure, etching, impedance, and insertion loss; the process nodes included in the outer layer AOI process are: AOI-CVR, flying probe, and line filling; the process nodes included in the solder mask text process are: pre-treatment, silk screen, pre-bake, exposure, development, grinding, baking, plugging, text, and curing; the process nodes included in the molding process are: QR code, molding, controlled depth milling, beveling machine, V-CUT (V-shaped cutting, also known as V-shaped groove), three-dimensional, reflow soldering, and oven; the process nodes included in the surface treatment process are: gold wire, gold finger, OSP (Organic Solderability Preservative, organic solderability protective film), silver wire, and tin wire; the process nodes included in the electrical measurement process are: flying probe, hole inspection, general, and special; the process nodes included in the final inspection process are: AVI (Automated Visual Inspection, automatic visual inspection), full inspection table, cleaning line; the process nodes included in the shipment process are: slicing, OQC (Outgoing Quality Control, shipment quality control).

[0111] In one example, Figure 3 The arrangement order of each process node displayed can also be used as the execution order of each process node. At this time, after determining the multiple process nodes included in the production process information, the production material can be processed according to the execution order of the multiple process nodes and the target parameters matched with each process node. At this time, the multiple process nodes included in the production process information can be Figure 3 Some of the process nodes are shown, and the specific contents of the multiple process nodes included in the production process information are not limited here.

[0112] In one example, if the process content indicates laser drilling, then the target parameters matching the process content may include laser power, pulse frequency, scanning speed, etc. There is no limitation on the type and quantity of target parameters matching each process content, which is subject to achievable performance.

[0113] In one example, in addition to Figure 3 In addition to the arrangement order of each process node displayed, different process node execution orders can be set according to different circuit board structure types. For example, if the circuit board is an N+N structure, then Figure 3 Each process node shown may be executed multiple times. For example, after lamination is completed, lamination needs to be performed again to meet the manufacturing requirements of the circuit board. The execution order of multiple process nodes is not specifically limited here, and is subject to meeting actual needs.

[0114] In one example, according to Figure 3 When manufacturing circuit boards at the various process nodes shown, you can also choose according to the type of circuit board Figure 3 Some of the process nodes shown perform production processing on production materials. For example, for electrical testing, if the number of circuit boards requested to be produced by the circuit board production request is large, the electrical testing processing can be performed through a dedicated process node; if the number of circuit boards requested to be produced by the circuit board production request is small, the electrical testing processing can be performed through a general process node, etc.

[0115] In one example, the multiple process nodes included in the production process information may include a target node; wherein the target node indicates a node that needs to be quality inspected. At this time, after executing the production process corresponding to the target node on the production material, the circuit board in production is obtained; then, the quality inspection content corresponding to the target node can be determined; then, the quality inspection of the circuit board in production is performed based on the quality inspection content to obtain the quality inspection result.

[0116] In one example, the quality inspection result can indicate whether the quality inspection content of the circuit board in production meets the quality requirements. For example, the quality inspection content can include but is not limited to: impedance inspection, insertion loss inspection, line width inspection, AOI-CVR inspection, flying probe inspection, general inspection, special inspection, slicing inspection, OQC inspection, etc.

[0117] In an example, if the target node is Figure 3The back drilling shown in the figure, then, after the back drilling process is performed on the production material, the circuit board in production is obtained. At this time, the quality inspection content corresponding to the target node can be determined, including but not limited to: impedance inspection, insertion loss inspection, line width inspection, AOI-CVR inspection, flying probe inspection, etc. At this time, after the quality inspection content is determined, the quality inspection of the circuit board in production can be carried out based on the quality inspection content to obtain the quality inspection result.

[0118] This implementation method can perform quality inspection and early warning on key processes in the circuit board manufacturing process, so that when quality problems occur in the circuit board, they can be discovered and handled in a timely manner. This not only helps prevent the further expansion of circuit board quality problems, but also helps to improve the quality of the produced circuit boards.

[0119] In a possible implementation, after quality inspection is performed on the circuit board in production based on the quality inspection content and the quality inspection result is obtained, if it is determined that the quality inspection result does not meet the preset quality requirements, the production process corresponding to the target node is re-executed.

[0120] In one example, if it is determined that the quality inspection result does not meet the preset quality requirements, the details of why the target node does not meet the quality requirements can be determined first. Then, based on the details of why the target node does not meet the quality requirements, the corresponding execution method can be determined, thereby re-executing the production process corresponding to the target node.

[0121] For example, if the target node does not meet the quality requirements, it is determined that the circuit board in production has a slight quality problem, then the corresponding execution method can be: make corrections on the circuit board in production. If the target node does not meet the quality requirements, it is determined that the circuit board in production has a serious quality problem, then the corresponding execution method can be: re-produce the circuit board based on a new panel.

[0122] For example, if the target node indicates the backdrilling process content, then, if it is determined that the line width of the circuit board in production after backdrilling does not meet the preset quality requirements, then, if it is determined that there is a small deviation in the line width of the circuit board in production, then the corresponding execution method can be determined as: a correction method is performed on the circuit board in production, and the line width of the circuit board in production is corrected so that the circuit board in production meets the preset quality requirements. If it is determined that there is a large deviation in the line width of the circuit board in production, and it is impossible to correct it in the circuit board in production to meet the preset quality requirements, then the corresponding execution method can be determined as: re-produce the circuit board based on the new panel, adjust the production parameter information of the circuit board, and re-produce the circuit board in production so that the re-produced circuit board meets the preset quality requirements.

[0123] This implementation method can automatically monitor and warn the quality of key production processes of circuit boards during the production and manufacturing of circuit boards, so that quality problems of circuit boards can be discovered and handled in a timely manner, which not only avoids the expansion of quality problems of circuit boards, but also reduces or avoids the losses caused by quality problems of circuit boards.

[0124] In a possible implementation, the embodiment of the present application can also record the relevant information of the production process corresponding to the above-mentioned re-execution of the target node on a computer terminal and print it on a circuit board, which can not only achieve a more fine-grained traceability of the circuit board manufacturing process, but also enable relevant personnel to timely adjust the production parameter information of subsequent circuit board production through the computer terminal, which not only optimizes the production parameter information of the circuit board, but also avoids losses caused by quality problems in subsequent circuit board manufacturing.

[0125] In one example, the embodiment of the present application performs production processing on production materials according to the execution order of multiple process nodes and the target parameters matching each process node to obtain the produced circuit board, and can first determine the equipment status information of the production equipment corresponding to the process node to be executed; if it is determined based on the equipment status information that the production equipment does not meet the production process requirements, then determine a spare node from the multiple process nodes; and perform production processing on the production materials based on the spare node.

[0126] In one example, the equipment status information of a production device may indicate whether the production device can be used. For example, if it is determined that the production device is in a faulty state or under maintenance, then it can be determined that the equipment status information of the production device indicates that the production device cannot be used. If it is determined that the production device is in operation, then it can be determined that the equipment status information of the production device indicates that the production device can be used.

[0127] In one example, the spare node may indicate a node that can replace the process node to be executed. Figure 3 If the production equipment corresponding to the drilling process node shown fails, then the three-in-one process node can be executed in the pressing step, thereby skipping the drilling process node. This ensures that the circuit board can still be produced when some production equipment fails, thereby providing a variety of selectable production routes for the production of circuit boards and improving production efficiency.

[0128] S205: Obtain processing information during the production process.

[0129] In one example, the processing information may indicate the process nodes executed by the circuit board during the production process and the target parameters corresponding to the execution of each process node.

[0130] S206: Generate circuit board identification information based on the processed information, and print the circuit board identification information on the circuit board to obtain a produced circuit board.

[0131] In one example, the processing information of the circuit board during the production process includes, but is not limited to: relevant information of the production materials, production process information of the circuit board during the production process, and actual production parameters.

[0132] In one example, the generated circuit board identification information may be QR code information.

[0133] In one example, after obtaining the produced circuit board, the embodiment of the present application can also respond to the recognition instruction of the circuit board identification information and display the processing information of the produced circuit board during the production process, so that the user can trace the detailed information of the circuit board production process through the circuit board identification information, so that when there is a problem with the circuit board, it can be traced clearly and quickly to the source and solve the problem in time.

[0134] In one example, after the produced circuit board is obtained, the circuit board delivery path can be automatically obtained, so as to perform the circuit board delivery process, as described in S207 below for details.

[0135] S207: Determine a circuit board delivery path corresponding to the circuit board production request, and complete the manufacture of the circuit board after performing delivery processing on the produced circuit board based on the detected circuit board delivery instruction.

[0136] For an example, see Figure 4 , Figure 4 A schematic diagram of an implementation process of a circuit board manufacturing method provided in an embodiment of the present application is shown in FIG. Figure 4 As shown, production materials can be managed through ERP (Enterprise Resource Planning). Before production materials are stored and put into the warehouse, material labels can be issued through MES (Manufacturing Execution System) and then the production materials can be put into the warehouse. In this way, the material LOT can be determined according to the production material batch, and then the production work order can be determined based on the material LOT, thereby realizing LOT-level management and traceability of production materials.

[0137] At this time, after receiving the circuit board production request initiated by the user, the corresponding production work order can be generated, and the entry and exit time of the work order, the machine and operator information corresponding to the work order can be collected through scanning guns, computer equipment, networks and plug-in systems to generate a circuit board production report.

[0138] Afterwards, the production process corresponding to the circuit board production process can be determined based on the production process information and production parameter information included in the work order / circuit board production report, so that after the production materials are put into production, the corresponding production process (for example, Figure 4 The production process 1, ..., production process n) shown in the figure processes the circuit board to obtain the produced circuit board. At this time, the production process of the circuit board can be managed and traced by printing the processing information of the circuit board in the production process on the produced circuit board.

[0139] After obtaining the produced circuit boards, the produced circuit boards can be stored in the warehouse first, that is, the circuit boards are put into storage, and then they can be distributed according to the pre-set delivery time, or they can be directly distributed. When the circuit boards arrive at the client and the customer signs for them, the order corresponding to the produced circuit boards is completed. At this time, the whole process of circuit board manufacturing is completed. At this time, the distribution process of the circuit boards can be recorded to achieve traceability of the finished products and outbound shipment of the circuit boards.

[0140] For an example, see Figure 5 , Figure 5 A schematic diagram of an application scenario of a circuit board manufacturing method provided in an embodiment of the present application, such as Figure 5 As shown, in the actual application scenario, it can include a scheduling and production module, a material on-time delivery module, an information sending module (including but not limited to the sending of equipment status information and production parameter information), a production execution module, a quality control module, a production error prevention module, an on-site abnormal call module, an operation guidance module, a production statistics module, a product timely shipment module and a global production control module, etc.

[0141] In one example, the scheduling and production module can receive a circuit board production request initiated by a user, and obtain a production work order corresponding to the circuit board production request at the first position. After that, the material on-time delivery module can deliver production materials according to the production work order, thereby obtaining production materials corresponding to the production order. Next, the information delivery module can deliver production parameter information according to the production work order, and deliver the acquired equipment status information, so that the production execution module can perform production processing on the production materials.

[0142] When the production execution module processes the production materials, the quality control module and the production error prevention module can monitor the quality of the produced circuit boards to ensure the quality of the produced circuit boards. At this time, when the on-site abnormal call module finds an error that cannot be corrected during the production process, it can call the relevant personnel for abnormal processing, so as to promptly discover and solve the quality problems of the circuit boards during the production process. At the same time, if quality problems with many errors are found during the production process of the circuit boards, the relevant personnel can correct the production parameter information through the operation guidance module to reduce the quality problems in the production process of the circuit boards and ensure the production quality of the circuit boards.

[0143] After the circuit board production is completed, the production statistics module can be used to count the produced circuit boards and deliver them on time as needed. At this time, the circuit board delivery instructions can be initiated through the product timely shipment module to deliver the produced circuit boards, thus completing the entire process of circuit board manufacturing.

[0144] like Figure 5 As shown, the application scenario of the circuit board manufacturing method provided in the embodiment of the present application also includes a global production control module. At this time, the relevant data of the entire process of circuit board manufacturing can be shared through the global production control module, so that the authenticity, timeliness, sharing, early warning and traceability of the circuit board manufacturing related data can be guaranteed through the global production control module, so as to quickly respond to quality problems in the circuit board manufacturing process and reduce losses.

[0145] Those skilled in the art will appreciate that, in the above method of specific implementation, the order in which the steps are written does not imply a strict execution order and does not constitute any limitation on the implementation process. The specific execution order of the steps should be determined by their functions and possible internal logic.

[0146] Figure 6 A schematic diagram of a circuit board manufacturing device provided in an embodiment of the present application is shown in FIG. Figure 6 As shown, the circuit board manufacturing device 600 includes:

[0147] The acquisition unit 601 is used to respond to a circuit board production request initiated by a user and acquire a production work order corresponding to the circuit board production request at a first location.

[0148] The scanning unit 602 is used to scan and process the production work order to obtain a circuit board production report; wherein the circuit board production report at least includes production process information and production parameter information.

[0149] The production unit 603 is used to obtain the production materials at the second position, and based on the production process information and production parameter information included in the circuit board production report, perform production processing on the production materials to obtain the produced circuit boards; wherein the produced circuit boards include relevant information of the production materials, production process information during the circuit board production processing, and actual production parameters.

[0150] The distribution unit 604 is used to determine a circuit board distribution path corresponding to the circuit board production request, and complete the circuit board manufacturing after performing distribution processing on the produced circuit board based on the detected circuit board distribution instruction.

[0151] Figure 7 A schematic diagram of the structure of another circuit board manufacturing device provided in an embodiment of the present application is shown in FIG. Figure 7 As shown, the circuit board manufacturing device 700 includes:

[0152] The acquisition unit 701 is configured to acquire, in response to a circuit board production request initiated by a user, a production work order corresponding to the circuit board production request at a first location.

[0153] The scanning unit 702 is used to scan and process the production work order to obtain a circuit board production report; wherein the circuit board production report at least includes production process information and production parameter information.

[0154] The production unit 703 is used to obtain the production materials at the second position, and based on the production process information and production parameter information included in the circuit board production report, perform production processing on the production materials to obtain the produced circuit boards; wherein the produced circuit boards include relevant information of the production materials, production process information during the circuit board production processing, and actual production parameters.

[0155] The distribution unit 704 is used to determine a circuit board distribution path corresponding to the circuit board production request, and complete the manufacture of the circuit board after performing distribution processing on the produced circuit board based on the detected circuit board distribution instruction.

[0156] In a possible implementation manner, the production process information includes multiple process nodes; the production unit 703 is used to:

[0157] From the production parameter information, determine the target parameters that match each process node;

[0158] The production materials are processed according to the execution order of multiple process nodes and the target parameters matching each process node.

[0159] In a possible implementation, the plurality of process nodes include a target node; wherein the target node indicates a node that needs to be quality tested; and the apparatus further includes a quality testing unit 705, which is used to:

[0160] After executing the production process corresponding to the target node on the production material, the circuit board in production is obtained;

[0161] Determine the quality detection content corresponding to the target node;

[0162] Based on the quality inspection content, quality inspection is performed on the circuit boards in production to obtain quality inspection results.

[0163] In a possible implementation manner, after performing quality inspection on the circuit board in production based on the quality inspection content and obtaining the quality inspection result, the device is further used to:

[0164] If it is determined that the quality inspection result does not meet the preset quality requirements, the production process corresponding to the target node is re-executed.

[0165] In a possible implementation, before the production material is processed according to the execution order of the multiple process nodes and the target parameters matching each process node, the device further includes a redundant processing unit 706, which is used to:

[0166] Determine the equipment status information of the production equipment corresponding to the process node to be executed;

[0167] If it is determined based on the equipment status information that the production equipment does not meet the production process requirements, a spare node is determined from multiple process nodes;

[0168] Production materials are processed based on spare nodes.

[0169] In a possible implementation manner, the production unit 703 is further configured to:

[0170] Based on the production process information and production parameter information included in the circuit board production report, after the production materials are processed, the processing information in the production process is obtained;

[0171] The circuit board identification information is generated based on the processing information, and after the circuit board identification information is printed on the circuit board, a produced circuit board is obtained.

[0172] In a possible implementation, the device further includes a display unit 707, which is used to:

[0173] In response to the recognition instruction of the circuit board identification information, processing information of the produced circuit board during the production process is displayed.

[0174] Figure 8A schematic diagram of the structure of a computer device provided in an embodiment of the present application is shown in FIG. Figure 8 As shown, the computer device 800 includes: a memory 801 and a processor 802 .

[0175] Memory 801 is a memory used to store computer-executable instructions in processor 802 .

[0176] The processor 802 is configured to execute the method provided in the above embodiment.

[0177] The computer device further includes a receiver 803 and a transmitter 804. The receiver 803 is used to receive instructions and data sent by an external device, and the transmitter 804 is used to send instructions and data to the external device.

[0178] The embodiment of the present application also provides a computer-readable storage medium, on which computer-executable instructions are stored, and when the computer-executable instructions are executed by a processor, the steps of the circuit board manufacturing method in the above method embodiment are executed. The storage medium can be a volatile or non-volatile computer-readable storage medium.

[0179] An embodiment of the present application also provides a computer program product, which carries computer execution instructions. The instructions included in the computer execution instructions can be used to execute the steps of the circuit board manufacturing method in the above method embodiment. For details, please refer to the above method embodiment, which will not be repeated here.

[0180] It should be noted that, for the aforementioned method embodiments, for the sake of simplicity, they are all expressed as a series of action combinations, but those skilled in the art should be aware that the present application is not limited by the described order of actions, because according to the present application, certain steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily required by the present application.

[0181] It should be further noted that, although the various steps in the flowchart are displayed in sequence according to the indication of the arrows, these steps are not necessarily executed in sequence in the order indicated by the arrows. Unless there is a clear description in this article, the execution of these steps is not strictly limited in order, and these steps can be executed in other orders. Moreover, at least a portion of the steps in the flowchart may include multiple sub-steps or multiple stages, and these sub-steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these sub-steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a portion of the sub-steps or stages of other steps.

[0182] It should be understood that the above-mentioned device embodiments are only illustrative, and the device of the present application can also be implemented in other ways. For example, the division of units / modules in the above-mentioned embodiments is only a logical function division, and there may be other division methods in actual implementation. For example, multiple units, modules or components can be combined, or can be integrated into another system, or some features can be ignored or not executed.

[0183] In addition, unless otherwise specified, each functional unit / module in each embodiment of the present application may be integrated into one unit / module, each unit / module may exist physically separately, or two or more units / modules may be integrated together. The above-mentioned integrated unit / module may be implemented in the form of hardware or in the form of a software program module.

[0184] If the integrated unit / module is implemented in the form of hardware, the hardware may be a digital circuit, an analog circuit, etc. The physical implementation of the hardware structure includes but is not limited to transistors, memristors, etc. If not otherwise specified, the processor may be any appropriate hardware processor, such as a CPU, a GPU, an FPGA, a DSP, an ASIC, etc. If not otherwise specified, the storage unit may be any appropriate magnetic storage medium or magneto-optical storage medium, such as a resistive random access memory RRAM (Resistive Random Access Memory), a dynamic random access memory DRAM (Dynamic Random Access Memory), a static random access memory SRAM (Static Random-Access Memory), an enhanced dynamic random access memory EDRAM (Enhanced Dynamic Random Access Memory), a high-bandwidth memory HBM (High-Bandwidth Memory), a hybrid memory cube HMC (Hybrid Memory Cube), etc.

[0185] If the integrated unit / module is implemented in the form of a software program module and sold or used as an independent product, it can be stored in a computer-readable memory. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product, which is stored in a memory and includes several instructions for a computer device (which can be a personal computer, server or network device, etc.) to perform all or part of the steps of the various embodiments of the present application. The aforementioned memory includes: U disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), mobile hard disk, disk or optical disk and other media that can store program codes.

[0186] In the above embodiments, the description of each embodiment has its own emphasis. For the part not described in detail in a certain embodiment, please refer to the relevant description of other embodiments. The technical features of the above embodiments can be combined arbitrarily. In order to make the description concise, all possible combinations of the technical features in the above embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0187] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the invention disclosed herein. The present application is intended to cover any modification, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary techniques in the art that are not disclosed in the present application. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present application are indicated by the following claims.

[0188] It should be understood that the present application is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A method for manufacturing a circuit board, characterized in that: The method comprises: In response to a circuit board production request initiated by a user, obtaining a production work order corresponding to the circuit board production request at a first location; After scanning and processing the production work order, a circuit board production report is obtained; wherein the circuit board production report includes at least production process information and production parameter information; Acquire the production material at the second position, and perform production processing on the production material based on the production process information and production parameter information included in the circuit board production report to obtain the produced circuit board; wherein the produced circuit board includes relevant information of the production material, production process information and real production parameters in the production process of the circuit board; A circuit board delivery path corresponding to the circuit board production request is determined, and after the produced circuit board is delivered based on the detected circuit board delivery instruction, the manufacturing of the circuit board is completed.

2. The method according to claim 1, characterized in that The production process information includes a plurality of process nodes; based on the production process information and production parameter information included in the circuit board production report, the production material is subjected to production processing, including: Determining target parameters matching each of the process nodes from the production parameter information; The production material is processed according to the execution order of the multiple process nodes and the target parameters matched with each of the process nodes.

3. The method according to claim 2, characterized in that The multiple process nodes include a target node; wherein the target node indicates a node that needs to be quality tested; and the method further includes: After executing the production process corresponding to the target node on the production material, a circuit board under production is obtained; Determining quality detection content corresponding to the target node; Based on the quality inspection content, quality inspection is performed on the circuit board being produced to obtain a quality inspection result.

4. The method according to claim 3, characterized in that After performing quality inspection on the circuit board being produced based on the quality inspection content and obtaining the quality inspection result, the method further includes: If it is determined that the quality inspection result does not meet the preset quality requirement, the production process corresponding to the target node is re-executed.

5. The method according to claim 2, characterized in that: Before performing production processing on the production material according to the execution order of the multiple process nodes and the target parameters matched with each of the process nodes, the method further includes: Determine the equipment status information of the production equipment corresponding to the process node to be executed; If it is determined based on the equipment status information that the production equipment does not meet the production process requirements, determining a spare node from the multiple process nodes; The production material is processed based on the standby node.

6. The method according to any one of claims 1 to 5, characterized in that The method further comprises: Based on the production process information and production parameter information included in the circuit board production report, after the production material is processed, processing information in the production process is obtained; The circuit board identification information is generated based on the processing information, and after the circuit board identification information is printed on the circuit board, the produced circuit board is obtained.

7. The method according to claim 6, characterized in that The method further comprises: In response to the recognition instruction of the circuit board identification information, processing information of the produced circuit board during the production process is displayed.

8. A circuit board manufacturing device, characterized in that: The device comprises: An acquisition unit, configured to, in response to a circuit board production request initiated by a user, acquire a production work order corresponding to the circuit board production request at a first location; A scanning unit, configured to scan and process the production work order to obtain a circuit board production report; wherein the circuit board production report includes at least production process information and production parameter information; A production unit, used to obtain production materials at the second location, and based on the production process information and production parameter information included in the circuit board production report, perform production processing on the production materials to obtain a produced circuit board; wherein the produced circuit board includes relevant information of the production materials, production process information during the circuit board production processing, and real production parameters; The distribution unit is used to determine a circuit board distribution path corresponding to the circuit board production request, and complete the manufacture of the circuit board after performing distribution processing on the produced circuit board based on the detected circuit board distribution instruction.

9. A computer device, characterized in that: include: A processor, and a memory communicatively connected to the processor; The memory stores computer-executable instructions; The processor executes the computer-executable instructions stored in the memory to implement the circuit board manufacturing method according to any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer-executable instructions, which are used to implement the circuit board manufacturing method according to any one of claims 1 to 7 when executed by a processor.

Images