Cutting method for Mini LED backlight substrate

Abstract

The invention relates to the technical field of backlight substrate treatment, in particular to a Mini LED backlight substrate cutting method which comprises the following steps that S1, a backlight substrate is pretreated, the edge of the upward face of the backlight substrate is subjected to coating treatment, and the pretreated backlight substrate is placed on a cutting device; s2, the coating face of the backlight substrate is moved into the sealed cutting space, when the backlight substrate is moved to the position below a laser cutter, the position of the coating is detected through a detector, the shape of the backlight substrate is determined, and a numerical control system finds out a corresponding cutting mode; and S3, the backlight substrate is fixed to the cutting area, then the laser cutter is controlled to move through the numerical control system, cutting treatment is conducted on the backlight substrate, and meanwhile protective gas is sprayed out of the two sides of the laser cutter to conduct cutting protection. According to the cutting device, cutting modes of different specifications can be rapidly adjusted, and the cutting efficiency of the backlight substrate is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of backlight substrate processing, and in particular to a cutting method for a MiniLED backlight substrate. Background Art

[0002] MiniLED backlight substrate is one of the important components of MiniLED backlight display technology and products. The backlight substrate usually uses aluminum film as raw material. Aluminum film also has the characteristics of lightweight and corrosion resistance. It is very suitable for large-scale production of LCD displays. When processing the backlight substrate, the backlight substrate needs to be cut according to specifications.

[0003] The Chinese patent with publication number CN111308780B discloses a method for cutting a MiniLED backlight substrate, including: step S1, subjecting the MiniLED backlight substrate after film formation to a boxing process; step S2, cutting the MiniLED backlight substrate after boxing to prepare a small-plate MiniLED backlight substrate; step S3, removing the small-plate MiniLED backlight substrate from the box; step S4, packaging the small-plate MiniLED backlight substrate after boxing and performing subsequent processes. This method effectively solves the problem of film surface damage and metal plate corrosion during the cutting process of the MiniLED substrate.

[0004] In the process of processing the substrate, it is necessary to first perform boxing processing, and after cutting, it is also necessary to perform boxing processing, which reduces the cutting efficiency. In addition, when boxing backlight substrates of different specifications are manufactured, boxing modules of different specifications are required, which increases the cutting cost. Summary of the invention

[0005] The purpose of the present invention is to solve the problem in the prior art that different specifications of backlight substrates need to use box modules of different specifications when they are manufactured into boxes, which increases the cutting cost, and proposes a cutting method for MiniLED backlight substrates.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions: A method for cutting a MiniLED backlight substrate comprises the following steps: S1, pre-treating the backlight substrate, coating the edge of the upward side of the backlight substrate, and placing the pre-treated backlight substrate on a cutting device; S2, moving the coating surface of the backlight substrate into the sealed cutting space. When the backlight substrate moves under the laser cutter, the coating position is detected by the detector to determine the shape of the backlight substrate, and the CNC system finds the corresponding cutting method; S3, fixing the backlight substrate in the cutting area, and then controlling the mobile laser cutter to move by the numerical control system to cut the backlight substrate, and at the same time, spraying protective gas from both sides of the laser cutter to perform cutting protection; S4, through the exhaust components on both sides of the sealed space, the sprayed protective gas and the waste gas generated by cutting are sucked from the bottom of both sides; S5. Separate the shielding gas and the exhaust gas, and spray the shielding gas into the cutting space again.

[0007] Preferably, the protective gas is an inert gas with a pressure of 0.8-1 MPa.

[0008] Preferably, no lighting component is provided inside the cutting space, and the coating treatment is to use fluorescent material for coating, and the position of light emission is photosensitively detected by a detector, so as to determine the type of the backlight substrate to be cut and the cutting position.

[0009] A MiniLED backlight substrate cutting device, comprising a processing table, a transmission assembly installed inside the processing table, a mobile frame slidably arranged on the processing table, a laser cutter arranged inside the mobile frame, and two air jet devices fixed on both sides of the laser cutter, characterized in that the transmission assembly comprises a conveyor belt, a plurality of air guide grooves are equidistantly opened on the conveyor belt, and the air guide grooves are arranged perpendicular to the moving direction; The two sides of the mobile frame are symmetrically fixedly connected with sealing curtains, which are made of elastic material to seal the inside of the mobile frame to form a cutting space; Two suction components are symmetrically fixedly installed on both sides of the movable frame. The suction ends of the suction components are in contact with the conveyor belt and air is sucked through the air guide groove.

[0010] Preferably, the exhaust assembly includes an exhaust fan, a telescopic tube, an exhaust end and an air blocking ring, the exhaust fan is fixedly installed on the inner side of the mobile frame, the telescopic tube is horizontally fixedly connected to the side of the exhaust fan away from the mobile frame, the exhaust end is fixedly connected to the outer end of the telescopic tube, the exhaust end is communicated with the telescopic tube, and an air inlet is opened on one side of the conveyor belt, and the air blocking ring is fixedly connected to the air inlet and in contact with the conveyor belt.

[0011] Preferably, a separation component is fixedly connected to the exhaust fan, and the separation component is used to separate the exhaust gas and the protective gas.

[0012] Preferably, the separation assembly includes a separator, an outlet pipe and a collection box, the separator is fixedly mounted on the upper surface of the exhaust fan, the collection box is fixedly mounted on the side of the separator for collecting condensed liquid, and the outlet pipe is fixedly connected to the upper end of the separator.

[0013] Preferably, a guide-out component is provided on the upper side of the exhaust fan, and the guide-out component is used to evaporate and guide out the condensate inside the separator.

[0014] Preferably, the export assembly includes a gasification module, a connecting pipe and a export strip, the gasification module is fixedly connected to the upper surface of the exhaust fan, the export strip is fixedly connected to the upper side of the exhaust end, and the connecting pipe is fixedly connected between the gasification module and the export strip.

[0015] Preferably, a push plate is fixedly connected to a side of the air extraction end away from the telescopic tube, and the push plate is made of an elastic material and is used to push the backlight substrate.

[0016] Compared with the prior art, the present invention has the following beneficial effects: 1. In order to ensure the cutting process of backlight substrates of different specifications, different backlight substrates are distinguished by coating them with fluorescent paint before cutting. The fluorescent coating process is quick and simple. While ensuring the cutting effect of the backlight substrate, the cutting methods of different specifications can be quickly adjusted, thereby improving the cutting efficiency of the backlight substrate.

[0017] 2. After the backlight substrate enters the cutting space, the shape of the fluorescent coating of the backlight substrate is distinguished by the fluorescent sensor, and different cutting methods are selected by processing the collected data information. Such pre-cutting processing does not require manual readjustment when cutting backlight substrates of different specifications, and is suitable for control and positioning in cutting spaces with poor light.

[0018] 3. The shielding gas can be extracted to the greatest extent through the exhaust component. At the same time, during the cutting process, the shielding gas will bring out the waste gas and hot melt generated in the cutting process. These waste gas and hot melt enter the air and cause air pollution. The shielding gas and such harmful waste gas can be collected by the exhaust fan, which not only plays a role in protecting the environment and making the processing of the backlight substrate more environmentally friendly, but also can recycle the shielding gas and reduce the processing cost.

[0019] 4. Usually, the collected gas is treated by pressurized condensation, so that the nitrogen in the exhaust gas is condensed and liquefied. When the exhaust gas and protective gas are separated in the separator, it is convenient to treat different gases differently.

[0020] 5. The re-gasified nitrogen is discharged through the connecting pipe, and the nitrogen is sprayed to the upper side of the backlight substrate through the discharge bar to ensure the amount of inert gas inside the sealed space and prevent dust and impurities in the air from falling onto the backlight substrate. At the same time, during the downward spraying and movement of the nitrogen, an airflow cycle will be formed to push and clean the impurities remaining on the backlight substrate.

[0021] 6. During the laser cutting process, the temperature of the cut surface just completed is high and it is easy to produce slight deformation. The nitrogen with lower temperature will be sucked in through the vacuum below. The nitrogen will move down along the cutting gap to cool the cut surface and prevent oxidation of the cut surface.

[0022] 7. During the cutting process, in order to ensure the cutting effect of the backlight substrate, the backlight substrate needs to be fixed in position during the processing. The exhaust end is moved by the extension and retraction of the telescopic tube. While the exhaust gas is sucked at a close distance, the backlight substrate is clamped and fixed in position by the push plates on both sides. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a flow chart of a cutting method for a MiniLED backlight substrate proposed in the present invention; Figure 2 This is a front structural schematic diagram of a MiniLED backlight substrate cutting device proposed by the present invention; Figure 3 This is a schematic diagram of the side structure of a MiniLED backlight substrate cutting device proposed by the present invention; Figure 4 A schematic diagram of a conveyor belt structure of a MiniLED backlight substrate cutting device proposed in the present invention; Figure 5 This is a schematic diagram of the position structure of a laser cutter of a MiniLED backlight substrate cutting device proposed by the present invention; Figure 6 This is a schematic diagram of the side structure of an exhaust component of a MiniLED backlight substrate cutting device proposed by the present invention; Figure 7 This is a schematic diagram of the bottom structure of a MiniLED backlight substrate cutting device proposed in the present invention.

[0024] In the figure: 1. processing table; 2. conveyor belt; 3. mobile frame; 4. laser cutter; 5. jet device; 6. sealing curtain; 7. exhaust assembly; 71. exhaust fan; 72. telescopic tube; 73. exhaust terminal; 74. air baffle ring; 8. separation assembly; 81. separator; 82. outlet pipe; 83. collection box; 9. outlet assembly; 91. gasification module; 92. connecting pipe; 93. outlet strip; 10. air guide groove; 11. push plate. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0026] The terms such as "upper", "lower", "left", "right", "middle" and "one" used in the present invention are only for the convenience of description and are not used to limit the scope of the present invention. Changes or adjustments to their relative relationships should be regarded as the scope of the present invention without substantially changing the technical content.

[0027] A method for cutting a MiniLED backlight substrate comprises the following steps: S1, pre-treating the backlight substrate, coating the edge of the upward side of the backlight substrate, and placing the pre-treated backlight substrate on a cutting device; S2, moving the coating surface of the backlight substrate into the sealed cutting space. When the backlight substrate moves under the laser cutter, the coating position is detected by the detector to determine the shape of the backlight substrate, and the CNC system finds the corresponding cutting method; S3, fixing the backlight substrate in the cutting area, and then controlling the mobile laser cutter to move by the numerical control system to cut the backlight substrate, and at the same time, spraying protective gas from both sides of the laser cutter to perform cutting protection; S4, through the exhaust components on both sides of the sealed space, the sprayed protective gas and the waste gas generated by cutting are sucked from the bottom of both sides; S5. Separate the shielding gas and the exhaust gas, and spray the shielding gas into the cutting space again.

[0028] Preferably, the shielding gas is an inert gas with a pressure of 0.8-1Mpa. Nitrogen is usually used as the shielding gas. Nitrogen has stable chemical properties and low audio conductivity. In laser cutting, nitrogen is mainly used as a shielding gas to prevent oxidation and nitridation of the cutting surface and maintain the smoothness of the cutting surface. During the cutting process, the laser beam melts or vaporizes the material, generating molten material or smoke. The protective gas can blow away the molten material or smoke through coaxial high pressure to ensure the continuation of the cutting process and the clarity of the cutting surface.

[0029] Preferably, no lighting component is provided inside the cutting space, and the coating treatment is to use fluorescent material for coating, and the position of light emission is detected by a detector to determine the type of the backlight substrate to be cut and the cutting position.

[0030] During the laser cutting process of the laser cutter 4, particles and dust in the air may affect the normal use of the laser. By performing the cutting process inside a sealed cutting space, the influence of air and external light on the laser cutting is avoided, thereby ensuring the heat conduction of the laser cutting.

[0031] In order to ensure the cutting processing of backlight substrates of different specifications, different backlight substrates are distinguished by coating them with fluorescent paint before cutting, and the fluorescent coating step is quick and simple. While ensuring the cutting effect of the backlight substrate, the cutting method of different specifications can be quickly adjusted, thereby improving the cutting efficiency of the backlight substrate. After the backlight substrate enters the cutting space, the shape of the fluorescent coating of the backlight substrate is distinguished by the fluorescent sensor, and different cutting methods are selected by processing the collected data information. Such pre-cutting treatment does not require manual readjustment when cutting backlight substrates of different specifications, and is suitable for control and positioning inside the cutting space with poor light.

[0032] Reference Figure 1-Figure 6 A MiniLED backlight substrate cutting device comprises a processing table 1, a conveyor belt 2 installed inside the processing table 1, a mobile frame 3 slidably arranged on the processing table 1, a laser cutter 4 arranged inside the mobile frame 3, and two jet devices 5 fixed on both sides of the laser cutter 4, wherein a plurality of air guide grooves 10 are equidistantly opened on the conveyor belt 2, and the air guide grooves 10 are arranged perpendicular to the moving direction; Two sealing curtains 6 are symmetrically fixedly connected to both sides of the mobile frame 3 for feeding and discharging materials. The sealing curtains 6 are made of elastic material and seal the inside of the mobile frame 3 to form a cutting space. Two suction components 7 are symmetrically fixedly installed on both sides of the movable frame 3. The suction ends of the suction components 7 are in contact with the conveyor belt 2, and air is sucked through the air guide groove 10.

[0033] In the embodiment of the above technical solution, during the processing, the pre-processed backlight substrate is placed on the conveyor belt 2, and after the backlight substrate is moved to the inner side of the mobile frame 3, the laser cutting position is turned into a sealed space through two sealing curtains 6, and the laser cutter 4 is controlled by numerical control to perform laser cutting on the backlight substrate, while the jet devices 5 on both sides eject the inert gas, and during the cutting process, the inert gas and waste gas inside the sealed space are extracted along the multiple air guide grooves 10 through the exhaust components 7 on both sides. The present invention adopts the laser cutting method, which reduces the oxidation of the cut surface while ensuring the cutting efficiency.

[0034] The preferred technical solution in this embodiment is: Reference Figure 5-6The exhaust assembly 7 includes an exhaust fan 71, a telescopic tube 72, an exhaust terminal 73 and an air blocking ring 74. The exhaust fan 71 is fixedly installed on the inner side of the mobile frame 3. The telescopic tube 72 is horizontally fixedly connected to the side of the exhaust fan 71 away from the mobile frame 3. The exhaust terminal 73 is fixedly connected to the outer end of the telescopic tube 72. The exhaust terminal 73 is connected to the telescopic tube 72, and an air inlet is opened on the side close to the conveyor belt 2. The air inlet is connected to the telescopic tube 72. The air blocking ring 74 is fixedly connected to the bottom surface of the exhaust terminal 73 and contacts the conveyor belt 2. Air is extracted through the fan inside the exhaust fan 71. Since the exhaust end 73 is in close contact with the conveyor belt 2, the gas inside the air guide groove 10 will be extracted first when exhausting. When the protective gas is ejected, it will impact the surface of the backlight substrate. Therefore, the protective gas is mostly present below the cutting space. The protective gas can be extracted to the greatest extent through the exhaust component 7. At the same time, during the cutting process, the protective gas will bring out the waste gas and hot melt generated during the cutting process. These waste gas and hot melt enter the air and cause air pollution. The protective gas and such harmful waste gas are collected by the exhaust fan 71, which not only plays a role in protecting the environment, making the processing of the backlight substrate more environmentally friendly, but also can be recycled to reduce the processing cost.

[0035] Reference Figure 5-6 The exhaust fan 71 is fixedly connected with a separation component 8, and the separation component 8 is used to separate the exhaust gas and the protective gas; The separation assembly 8 includes a separator 81, an outlet pipe 82 and a collection box 83. The separator 81 is fixedly mounted on the upper surface of the exhaust fan 71. The collection box 83 is fixedly mounted on the side of the separator 81 for collecting condensed liquid. The outlet pipe 82 is fixedly connected to the upper end of the separator 81.

[0036] In order to separate the exhaust gas and the protective gas, the collected gas is usually treated by pressurized condensation, so as to condense and liquefy the nitrogen in the exhaust gas. After the exhaust gas and the protective gas are separated in the separator 81, the exhaust gas is introduced into the external exhaust gas treatment device through the outlet pipe 82. The exhaust gas treatment device belongs to the prior art.

[0037] Reference Figure 5-6 The exhaust fan 71 is provided with an outlet assembly 9 on its upper side, and the outlet assembly 9 is used to evaporate and outlet the condensate inside the separator 81; The outlet assembly 9 includes a gasification module 91, a connecting pipe 92 and an outlet strip 93. The gasification module 91 is fixedly connected to the upper surface of the exhaust fan 71, the outlet strip 93 is fixedly connected to the upper side of the exhaust terminal 73, and the connecting pipe 92 is fixedly connected between the gasification module 91 and the outlet strip 93.

[0038] When the liquid nitrogen after the condensation process is transferred to the inside of the gasification module 91, the inside of the gasification module 91 is used to restore the air pressure to the level of liquid nitrogen gasification. The gasification module 91 exists in the existing refrigeration device and belongs to the existing technology. The re-gasified nitrogen is discharged through the connecting pipe 92, and the nitrogen is sprayed to the upper side of the backlight substrate again through the outlet strip 93 to ensure the amount of inert gas inside the sealed space and prevent dust and impurities in the air from falling onto the backlight substrate. At the same time, in the process of the jet device spraying nitrogen downward and the nitrogen on both sides moving toward the middle, an air flow cycle will be formed to push and clean the impurities remaining on the backlight substrate.

[0039] When the re-gasified nitrogen is sprayed out, the temperature of the newly re-gasified nitrogen is relatively low. During the laser cutting process, the temperature of the cutting surface that has just been cut is relatively high and it is easy to produce slight deformation. The nitrogen with lower temperature will be sucked in through the vacuum below. The nitrogen will move down along the cutting gap to cool the cutting surface and prevent oxidation of the cutting surface at the same time.

[0040] Reference Figure 5-6 The side of the exhaust end 73 away from the telescopic tube 72 is fixedly connected with a push plate 11, and the push plate 11 is made of elastic material and is used to push the backlight substrate. When the exhaust end 73 moves, it will drive the push plate 11 to translate, thereby the two push plates 11.

[0041] During the cutting process, in order to ensure the cutting effect of the backlight substrate, the backlight substrate needs to be fixed in position during the processing. The exhaust end 73 is driven to move in position by extending and retracting the telescopic tube 72. While the exhaust gas is sucked at a close distance, the backlight substrate is clamped and fixed in position by the push plates 11 on both sides.

[0042] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A method for cutting a MiniLED backlight substrate, characterized in that: The following steps are involved: S1, pre-treating the backlight substrate, coating the edge of the upward side of the backlight substrate, and placing the pre-treated backlight substrate on a cutting device; S2, moving the coating surface of the backlight substrate into the sealed cutting space. When the backlight substrate moves under the laser cutter, the coating position is detected by the detector to determine the shape of the backlight substrate, and the CNC system finds the corresponding cutting method; S3, fixing the backlight substrate in the cutting area, and then controlling the mobile laser cutter to move by the numerical control system to cut the backlight substrate, and at the same time, spraying protective gas from both sides of the laser cutter to perform cutting protection; S4, through the exhaust components on both sides of the sealed space, the sprayed protective gas and the waste gas generated by cutting are sucked from the bottom of both sides; S5. Separate the shielding gas and the exhaust gas, and spray the shielding gas into the cutting space again.

2. A method for cutting a MiniLED backlight substrate according to claim 1, characterized in that: The protective gas is an inert gas with a pressure of 0.8-1Mpa.

3. The method for cutting a MiniLED backlight substrate according to claim 1, characterized in that: The coating process is to use fluorescent materials for coating, and the position of light emission is detected by a detector to determine the type of cutting the backlight substrate and the cutting position.

4. A MiniLED backlight substrate cutting device, comprising a processing table (1), a conveyor belt (2) installed inside the processing table (1), a movable frame (3) slidably arranged on the processing table (1), a laser cutter (4) arranged inside the movable frame (3), and two jet devices (5) fixed on both sides of the laser cutter (4), characterized in that: The backlight substrate is cut by the cutting method according to claim 1, a plurality of air guide grooves (10) are equidistantly provided on the conveyor belt (2), and the air guide grooves (10) are arranged perpendicular to the moving direction; Two sealing curtains (6) are symmetrically fixedly connected on both sides of the mobile frame (3) for feeding and discharging materials, and the sealing curtains (6) are made of elastic material and seal the interior of the mobile frame (3) to form a cutting space; Two air extraction components (7) are symmetrically fixedly mounted on both sides of the movable frame (3); the air extraction ends of the air extraction components (7) are in contact with the conveyor belt (2) and air is sucked through the air guide grooves (10).

5. The MiniLED backlight substrate cutting device according to claim 4, characterized in that: The exhaust assembly (7) comprises an exhaust fan (71), a telescopic tube (72), an exhaust terminal (73) and an air blocking ring (74); the exhaust fan (71) is fixedly mounted on the inner side of the movable frame (3); the telescopic tube (72) is horizontally fixedly connected to a side of the exhaust fan (71) away from the movable frame (3); the exhaust terminal (73) is fixedly connected to an outer end of the telescopic tube (72); the exhaust terminal (73) is connected to the telescopic tube (72) and an air inlet is provided on a side close to the conveyor belt (2); the air inlet is connected to the telescopic tube (72); and the air blocking ring (74) is fixedly connected to the bottom surface of the exhaust terminal (73) and is in contact with the conveyor belt (2).

6. The MiniLED backlight substrate cutting device according to claim 5, characterized in that: A separation component (8) is fixedly connected to the exhaust fan (71), and the separation component (8) is used to separate exhaust gas and protective gas.

7. The MiniLED backlight substrate cutting device according to claim 6, characterized in that: The separation assembly (8) comprises a separator (81), a guide pipe (82) and a collection box (83); the separator (81) is fixedly mounted on the upper surface of the exhaust fan (71); the collection box (83) is fixedly mounted on the side of the separator (81) and is used to collect condensed liquid; the guide pipe (82) is fixedly connected to the upper end of the separator (81).

8. The MiniLED backlight substrate cutting device according to claim 5, characterized in that: A discharge assembly (9) is provided on the upper side of the exhaust fan (71), and the discharge assembly (9) is used to evaporate and discharge the condensate inside the separator (81).

9. The MiniLED backlight substrate cutting device according to claim 8, characterized in that: The outlet assembly (9) comprises a gasification module (91), a connecting pipe (92) and an outlet strip (93); the gasification module (91) is fixedly connected to the upper surface of the exhaust fan (71); the outlet strip (93) is fixedly connected to the upper side of the exhaust end (73); and the connecting pipe (92) is fixedly connected between the gasification module (91) and the outlet strip (93).

10. The MiniLED backlight substrate cutting device according to claim 5, characterized in that: A push plate (11) is fixedly connected to a side of the air extraction end (73) away from the telescopic tube (72); the push plate (11) is made of an elastic material and is used to push the backlight substrate.

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