Coating method

Abstract

The invention relates to a coating method which comprises the following steps: a mask plate and a base material are assembled and fixed, the part, covered by the mask plate, of the base material corresponds to a non-coating area, and the part, not covered by the mask plate, of the base material corresponds to a coating area; a curable mixed-phase fluid is injected into the assembling gap between the mask plate and the base material until the assembling gap is filled with the curable mixed-phase fluid, the curable mixed-phase fluid forms a liquid level boundary coinciding with the boundary of the non-coating area under the action of liquid level tension, and the curable mixed-phase fluid comprises a curable liquid precursor and filling powder; the curable liquid precursor is cured to form gel, so that a solid filling layer is obtained, and the solid filling layer comprises the gel and filling powder filled in the gel; and executing a coating process at least by taking the solid filling layer as a mask so as to form a film layer on the coating area of the base material. Therefore, the winding plating phenomenon can be avoided, and the boundary between the coating area and the non-coating area is clear and sharp.

Description

Technical Field

[0001] The invention relates to the technical field of film coating, and in particular to a film coating method. Background Art

[0002] Before performing the coating process, the non-coated area of ​​the substrate is usually masked, that is, a mask plate is formed by physical or chemical methods to shield the non-coated area, prevent the coating target from adhering to the surface of the substrate, and grow a film layer in the non-coated area. At present, hard mask plates made of metal, ceramic or plastic are usually used in this field to shield the non-coated area. However, after the hard mask plate and the substrate are assembled, there is an assembly gap between the two. During the coating process, the target molecules are affected by the flight path and spontaneous diffusion, and will bypass the mask plate and grow to form a film layer in the non-coated area, so that the boundary between the coated area and the non-coated area appears blurred, and it is difficult to prepare products that require clear and sharp boundaries of the coated area. If the product requirements are to be achieved, the mask plate needs to be completely fitted to the substrate and the assembly gap needs to be controlled at the μm level. However, when the mask plate is large in size, the machining accuracy can often only reach 10μm, and it is difficult to achieve high-precision mask plate processing to control the assembly gap between the mask plate and the substrate, so that a clear boundary cannot be obtained. However, masks with higher precision have high manufacturing costs and are easily deformed and damaged during use, making them unsuitable for production use.

[0003] Therefore, how to avoid bypass plating and make the boundary between the coated area and the non-coated area clear and sharp has become a problem to be solved urgently in the field. Summary of the invention

[0004] In view of this, an embodiment of the present application provides a coating method to solve the problems existing in the background technology.

[0005] In a first aspect, an embodiment of the present invention provides a coating method, comprising the following steps: Assembling and fixing the mask plate and the substrate, the portion of the substrate covered by the mask plate corresponds to the non-coating area, and the portion of the substrate not covered by the mask plate corresponds to the coating area; Injecting a curable mixed-phase fluid into the assembly gap between the mask plate and the substrate until the curable mixed-phase fluid fills the assembly gap and the curable mixed-phase fluid forms a liquid surface boundary that coincides with the boundary of the non-coating area under the action of liquid surface tension, wherein the curable mixed-phase fluid includes a curable liquid precursor and a filling powder; The curable liquid precursor is cured to form a gel to obtain a solid filling layer, wherein the solid filling layer includes the gel and the filling powder filled in the gel; A coating process is performed using at least the solid filling layer as a mask to form a film layer on the coating area of ​​the substrate.

[0006] In the above technical solution, the fluidity of the curable liquid precursor is used to bring the filling powder into the assembly gap, and under the synergistic effect of the gel formed by the curing of the curable liquid precursor and the filling powder, a dense solid filling layer is formed, which has good filling and shielding effects; under the action of the liquid surface tension, the curable mixed fluid in the assembly gap forms a liquid surface boundary that coincides with the boundary of the non-coated area, thereby realizing the filling of the assembly gap and the precise profiling of the mask plate. Subsequently, when performing the coating process, at least the solid filling layer is used as a mask, so that the coating area can be precisely controlled, so that the boundary between the coating area and the non-coating area is clear and sharp, avoiding the occurrence of bypass plating.

[0007] In combination with the first aspect of the present invention, in an optional embodiment, before injecting the curable mixed-phase fluid into the assembly gap between the mask plate and the substrate, the method also includes: mixing the filling powder with the curable liquid precursor to obtain a mixed liquid; allowing the mixed liquid to stand to distinguish a supernatant and a precipitate in the mixed liquid; and using the supernatant as the curable mixed-phase fluid.

[0008] In the above technical solution, after the filling powder is mixed with the curable liquid precursor, the precipitate in the mixed liquid is discarded and the supernatant is extracted as the curable mixed-phase fluid, so that the filling powder in the curable mixed-phase fluid is dispersed more evenly, avoiding the filling powder from aggregating to form particle clusters, affecting the fluidity and liquid surface tension of the curable mixed-phase fluid, and then affecting the filling effect of the solid filling layer.

[0009] In combination with the first aspect of the present invention, in an optional embodiment, the material of the filling powder is a material with stable chemical properties under the coating process conditions.

[0010] In the above technical solution, a material with stable chemical properties under the coating process conditions is selected as the material of the filling powder, which is beneficial to avoid the reaction of the filling powder during the coating process, the introduction of impurity element pollution, and the abnormal color of the coating area boundary, which affects the filling effect and shielding effect of the solid filling layer, and causes the boundary line between the coating area and the non-coating area to be blurred, resulting in the phenomenon of bypass plating.

[0011] In combination with the first aspect of the present invention, in an optional embodiment, the particle size of the filling powder is less than 1 μm.

[0012] In the above technical solution, the particle size of the filling powder is controlled to be less than 1 μm to prevent the filling powder with a larger particle size from affecting the fluidity and liquid surface tension of the curable mixed-phase fluid, thereby affecting the filling effect of the solid filling layer.

[0013] In combination with the first aspect of the present invention, in an optional embodiment, the coating method further comprises: mixing a solute with a solvent to configure a curable liquid precursor; The curable liquid precursor is cured to form a gel, which includes: the solute reacts with the solvent to form a gel.

[0014] In the above technical scheme, a curable liquid precursor is configured through a formula combination of solute and solvent, and the solute and solvent react to achieve the curing of the curable liquid precursor. In the actual process, the formula combination of solute and solvent can be adjusted according to various situations such as substrate, coating target material and coating process, which is beneficial to improve the versatility and universality of the coating method.

[0015] In conjunction with the first aspect of the present invention, in an optional embodiment, the solute includes a liquid organosilicon compound, a soluble inorganic metal salt, or a dissociable organic metal salt; The solvent includes at least one of the following: a polar organic solvent, a polar inorganic solvent, a non-polar organic solvent and a non-polar inorganic solvent.

[0016] In the above technical scheme, the solute includes a liquid organosilicon compound, a soluble inorganic metal salt or a dissociable organic metal salt, and a suitable solute can be selected according to a variety of situations; the solvent includes at least one of the following: a polar organic solvent, a polar inorganic solvent, a non-polar organic solvent and a non-polar inorganic solvent. When preparing the solution, a suitable solvent can be selected according to the solute, and a combination of multiple solvents can be selected, which is conducive to the configuration of a curable liquid precursor that meets the requirements.

[0017] In combination with the first aspect of the present invention, in an optional embodiment, the curable multiphase fluid includes a surfactant, and the surfactant is used to adjust the liquid surface tension of the curable multiphase fluid.

[0018] In the above technical solution, the liquid surface tension of the curable multiphase fluid is adjusted by a surfactant, which is beneficial to improving the filling effect of the curable multiphase fluid.

[0019] In combination with the first aspect of the present invention, in an optional embodiment, the proportion of the surfactant is less than or equal to 5%.

[0020] In the above technical solution, the proportion of the surfactant is controlled not to exceed 5% to avoid excessive concentration of the surfactant, which may reduce the fluidity of the curable mixed-phase fluid and further affect the filling effect of the curable mixed-phase fluid.

[0021] In combination with the first aspect of the present invention, in an optional embodiment, the curable mixed-phase fluid is injected into the assembly gap between the mask plate and the substrate until the curable mixed-phase fluid fills the assembly gap, and the curable mixed-phase fluid forms a liquid surface boundary that coincides with the boundary of the non-coating area under the action of liquid surface tension; the curable liquid precursor is cured to form a gel to obtain a solid filling layer, comprising: Injecting a curable mixed-phase fluid into the assembly gap between the mask plate and the substrate until the curable mixed-phase fluid fills the assembly gap and the curable mixed-phase fluid forms a liquid surface boundary that coincides with the boundary of the non-coating area under the action of liquid surface tension; The curable liquid precursor is cured to form a gel, and the liquid in the curable mixed-phase fluid is evaporated; Repeat the above steps at least twice to obtain the solid filling layer.

[0022] In the above technical solution, the steps of injection, solidification and evaporation are repeated multiple times, so that the solid filling layer finally prepared is more compact, which is beneficial to improving the filling effect and shielding effect of the solid filling layer.

[0023] In combination with the first aspect of the present invention, in an optional embodiment, when the curable mixed-phase fluid is injected for the first time, the volume V1 of the curable mixed-phase fluid injected for the first time is recorded; when the curable mixed-phase fluid is repeatedly injected, the volume V1 of the curable mixed-phase fluid currently injected is recorded. n , wherein n is the current injection number of the curable mixed-phase fluid, n≥2; Until V n <0.01V1, stop injecting the curable mixed-phase fluid to obtain the solid filling layer.

[0024] In the above technical solution, the volume V1 of the solidifiable mixed-phase fluid injected for the first time is recorded during the first injection, and the volume V of the solidifiable mixed-phase fluid currently injected is recorded during the repeated injection. n , and compare V1 with V n , so as to judge whether the standard is met, and set the standard to V n <0.01V1, which makes the finally prepared solid filling layer more compact, and is beneficial to improving the filling effect and shielding effect of the solid filling layer.

[0025] A coating method provided by an embodiment of the present invention has the following beneficial effects: The fluidity of the curable liquid precursor is used to bring the filling powder into the assembly gap. Under the synergistic effect of the gel formed by the curable liquid precursor and the filling powder, a dense solid filling layer is formed, which has good filling and shielding effects. Under the action of the liquid surface tension, the curable mixed phase fluid in the assembly gap forms a liquid surface boundary that coincides with the boundary of the non-coating area, thereby achieving the filling of the assembly gap and the precise profiling of the mask plate. Then, when performing the coating process, at least the solid filling layer is used as a mask, so that the coating area can be accurately controlled, so that the boundary between the coating area and the non-coating area is clear and sharp, and the phenomenon of bypass plating is avoided. After the filling powder is mixed with the curable liquid precursor, the precipitate in the mixed liquid, i.e., the filling powder with a larger particle size, is discarded, and the supernatant is extracted as the curable mixed phase fluid to prevent the filling powder with a larger particle size from affecting the fluidity and liquid surface tension of the curable mixed phase fluid, thereby affecting the filling effect of the curable mixed phase fluid; Selecting a material with stable chemical properties under the coating process conditions as the material of the filling powder is beneficial to avoiding reactions of the filling powder during the coating process, which may lead to contamination by impurity elements, abnormal color at the boundary of the coating area, affecting the filling and shielding effects of the solid filling layer, blurring the boundary line between the coating area and the non-coating area, and causing bypass plating.

[0026] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings: Figure 1 A schematic diagram of forming a wrap-around plating area after performing a plating process; Figure 2 A schematic diagram of a coating method according to an embodiment of the present invention; Figure 3 A schematic diagram of a solid filling layer prepared by a coating method provided in an embodiment of the present application; Figure 4 This is a schematic diagram of the film layer after the coating process is performed in an embodiment of the present application.

[0028] Description of reference numerals: 10. substrate; 20. mask plate; 30. assembly gap; 40. film layer; 50. solid filling layer. DETAILED DESCRIPTION

[0029] The exemplary embodiments disclosed in the present invention will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the specific embodiments described herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present invention and to fully convey the scope of the present invention to those skilled in the art.

[0030] In the following description, a large number of specific details are given to provide a more thorough understanding of the present invention. However, it is obvious to those skilled in the art that the present invention can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present invention, some technical features known in the art are not described; that is, all features of actual embodiments are not described here, and well-known functions and structures are not described in detail.

[0031] In the drawings, the sizes of layers, regions, elements and their relative sizes may be exaggerated for clarity. Like reference numerals denote like elements throughout.

[0032] It should be understood that when an element or layer is referred to as "on ...", "adjacent to ...", "connected to" or "coupled to" other elements or layers, it can be directly on, adjacent to, connected to or coupled to other elements or layers, or there can be intervening elements or layers. On the contrary, when an element is referred to as "directly on ...", "directly adjacent to ...", "directly connected to" or "directly coupled to" other elements or layers, there is no intervening element or layer. It should be understood that although the terms first, second, third, etc. can be used to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of the present invention, the first element, component, region, layer or part discussed below can be represented as the second element, component, region, layer or part. And when the second element, component, region, layer or part is discussed, it does not indicate that the present invention necessarily has the first element, component, region, layer or part.

[0033] Spatial relationship terms such as "under", "below", "below", "under", "above", "above", etc., may be used here for convenience of description to describe the relationship between an element or feature shown in the figure and other elements or features. It should be understood that in addition to the orientation shown in the figure, the spatial relationship terms are intended to include different orientations of the device in use and operation. For example, if the device in the accompanying drawings is turned over, then the elements or features described as "under other elements" or "under it" or "under it" will be oriented as "on" other elements or features. Therefore, the exemplary terms "under" and "under" may include both upper and lower orientations. The device can be oriented otherwise (rotated 90 degrees or other orientations) and the spatial descriptors used herein are interpreted accordingly.

[0034] The purpose of the terms used herein is only to describe specific embodiments and is not intended to be limiting of the present invention. When used herein, the singular forms "one", "an" and "said / the" are also intended to include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "consisting of" and / or "comprising", when used in this specification, determine the presence of the features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0035] In order to fully understand the present invention, detailed steps and detailed structures will be proposed in the following description to illustrate the technical solution of the present invention. The preferred embodiments of the present invention are described in detail below, but in addition to these detailed descriptions, the present invention may also have other implementations.

[0036] Please refer to Figure 1 Before the coating process is performed, the non-coating area of ​​the substrate 10 needs to be shielded by the mask plate 20 to prevent the coating target from adhering to the surface of the substrate 10 and growing the film layer 40 in the non-coating area. However, after the mask plate 20 and the substrate 10 are assembled and fixed, there is an assembly gap 30 between the two. During the coating process, the target molecules are affected by the flight path and spontaneous diffusion, and will bypass the mask plate 20 and enter the assembly gap 30, and grow to form the film layer 40 in the non-coating area, making the boundary between the coating area and the non-coating area blurred, forming a bypass coating area, and it is difficult to prepare products that require clear and sharp boundaries of the coating area.

[0037] Based on this, the embodiment of the present application provides a coating method. Figure 2 A schematic diagram of a coating method according to an embodiment of the present invention. Figure 3 A schematic diagram of a solid filling layer prepared by a coating method provided in an embodiment of the present application, Figure 4 This is a schematic diagram of the film layer position after the coating process is performed in the embodiment of the present application. Figure 2 As shown, the coating method provided in the embodiment of the present application includes: Step S1: Assemble and fix the mask plate and the substrate, the portion of the substrate covered by the mask plate corresponds to the non-coating area, and the portion of the substrate not covered by the mask plate corresponds to the coating area; Step S2: injecting a curable mixed-phase fluid into the assembly gap between the mask plate and the substrate until the curable mixed-phase fluid fills the assembly gap and the curable mixed-phase fluid forms a liquid surface boundary that coincides with the boundary of the non-coating area under the action of liquid surface tension, wherein the curable mixed-phase fluid includes a curable liquid precursor and a filling powder; Step S3: curing the curable liquid precursor to form a gel to obtain a solid filling layer, wherein the solid filling layer includes the gel and a filling powder filled in the gel; Step S4: performing a coating process using at least the solid filling layer as a mask to form a film layer on the coating area of ​​the substrate.

[0038] Therefore, the embodiment of the present application utilizes the fluidity of the curable liquid precursor to bring the filling powder into the assembly gap, and under the synergistic effect of the gel formed by the curing of the curable liquid precursor and the filling powder, a dense solid filling layer is formed, which has good filling and shielding effects; under the action of the liquid surface tension, the curable mixed fluid in the assembly gap forms a liquid surface boundary that coincides with the boundary of the non-coated area, thereby achieving the filling of the assembly gap and the precise profiling of the mask plate. Subsequently, when performing the coating process, at least the solid filling layer is used as a mask to avoid the occurrence of wrap-around plating, thereby achieving precise control of the coating area, so that the boundary between the coating area and the non-coating area is clear and sharp.

[0039] First, please refer to Figure 3 , execute step S1, assemble and fix the mask plate 20 and the substrate 10, the portion of the substrate 10 covered by the mask plate 20 corresponds to the non-coating area, and the portion of the substrate 10 not covered by the mask plate 20 corresponds to the coating area.

[0040] In this embodiment, the mask plate 20 is processed and manufactured according to the shape of the non-mask area and the substrate 10, and the material of the mask plate 20 can be selected from metal, plastic, ceramic and other materials according to the coating process. This embodiment does not limit this.

[0041] Next, a curable mixed-phase fluid for filling the assembly gap needs to be configured. In the present embodiment, the curable mixed-phase fluid is a curable liquid material containing solid particles, which is a solid-liquid mixed-phase fluid. Specifically, the curable mixed-phase fluid includes a curable liquid precursor and a filling powder. Thus, the filling powder, which is a solid particle, can be brought into the assembly gap by utilizing the fluidity of the curable liquid precursor. The curable liquid precursor can be cured to form a gel, and the filling powder can fill the mesh pores of the gel. Under the synergistic effect of the two, a dense solid filling layer is formed, which has a good filling effect and shielding effect.

[0042] Optionally, before injecting the curable mixed-phase fluid into the assembly gap between the mask plate and the substrate, the method also includes: mixing the filling powder with the curable liquid precursor to obtain a mixed liquid; allowing the mixed liquid to stand to distinguish a supernatant and a precipitate in the mixed liquid; and using the supernatant as the curable mixed-phase fluid.

[0043] It is understandable that the properties of the filling powder, such as particle size, shape, density and surface properties, and the properties of the curable liquid precursor, such as viscosity, liquid surface tension and chemical properties, will affect the dispersion of the filling powder in the curable liquid precursor. If the dispersion is poor, the filling powder will aggregate to form particle clusters, affecting the fluidity and liquid surface tension of the curable mixed phase fluid, and then affecting the filling effect of the solid filling layer. Therefore, after the curable liquid precursor and the filling powder are mixed, the mixed liquid is allowed to stand to form a precipitate and a supernatant (suspension). The precipitate is mostly the filling powder that forms the particle cluster, and the supernatant includes the filling powder that is relatively evenly dispersed in the curable liquid precursor. The supernatant is extracted as the curable mixed phase fluid, which ensures the fluidity and liquid surface tension of the curable mixed phase fluid.

[0044] Mixing the filling powder with the curable liquid precursor includes: adding the filling powder into the curable liquid precursor and mixing uniformly by ultrasonic stirring. The ultrasonic stirring is used to promote the dispersion of the filling powder in the curable liquid precursor.

[0045] In this embodiment, the material of the filling powder is a material with stable physical properties under the coating process conditions. The coating process conditions, such as temperature, may affect the physical properties of the filling powder, such as evaporation, melting, and sublimation. The change in the physical properties of the filling powder will directly affect the filling effect and shielding effect of the solid filling layer. Therefore, under the coating process conditions, the filling powder needs to have the characteristics of stable physical properties.

[0046] The material of the filling powder includes at least one of the following: metal, ceramic, plastic, non-metallic material and inorganic matter, which is not limited in this embodiment.

[0047] Optionally, the material of the filling powder is a material with stable chemical properties under the coating process conditions. Therefore, when the coating process is performed, the stable chemical properties of the filling powder enable it to maintain its original chemical properties and composition. Specifically, during the coating process, the filling powder will not decompose, react with the target material molecules, etc., introduce impurity element pollution, cause abnormal color at the boundary of the coating area, affect the filling effect and shielding effect of the solid filling layer, cause the phenomenon of bypass plating, and cause the boundary line between the coating area and the non-coating area to be blurred.

[0048] Furthermore, the physicochemical properties of the filling powder are the same as those of the coating target. During the coating process, the coating target is impacted by physical or chemical methods, such as magnetron sputtering, multi-arc ion plating, etc., and the target molecules are deposited on the surface of the substrate to form a film layer. The chemical properties of the coating target are stable throughout the process. Selecting a material with the same physicochemical properties as the coating target as the filling powder can ensure the chemical stability of the filling powder during the coating process, avoid the introduction of impurity contamination, and ensure the filling effect and shielding effect of the solid filling layer; and, if the coating target is a high-value product, other materials with the same physicochemical properties as the coating target can be selected as equivalent substitutes, which is conducive to reducing production costs.

[0049] Those skilled in the art can understand that the physicochemical properties of two different substances are basically not completely the same. The physicochemical properties of the filling powder are the same as those of the coating target material, which means that the filling powder and the coating target material are highly similar in one or several physicochemical properties, so that the filling powder has the characteristics of stable chemical properties under the coating process conditions. In other words, the physicochemical properties of the filling powder are similar to those of the coating target material. For example, if the coating target material is a metal, the filling powder can be a metal material with a melting and boiling point similar to that of the coating target material.

[0050] Exemplarily, the coating target material is Pt, and the filling powder can be Ti powder; the coating target material is Au, and the filling powder can be Al powder; the coating target material is Ag, and the filling powder can be Fe powder; the coating target material is HfO2, and the filling powder can be SiO2; the coating target material is Ta2O5, and the filling powder can be Al2O3; the coating target material is Nb2O5, and the filling powder can be Fe2O3.

[0051] In this embodiment, the material of the filling powder is a coating target material.

[0052] Optionally, before mixing the filling powder with the curable liquid precursor, the method further includes: sieving and sorting the filling powder to select the filling powder that meets the requirements from the too wide particle size distribution.

[0053] Optionally, the particle size of the filling powder is less than 1 μm, thereby preventing the filling powder with a larger particle size from affecting the fluidity and liquid surface tension of the curable mixed-phase fluid, and further affecting the filling effect of the solid filling layer.

[0054] Furthermore, the particle size of the filling powder ranges from 200nm to 500nm. As the particle size increases, the gravity of the particles gradually increases. When the particle size is large to a certain extent, the gravity may exceed the aerodynamic force and electrostatic force, etc., causing the particles to settle or agglomerate due to gravity during flight or suspension. Therefore, if the particle size of the filling powder is too large, after it is mixed with the curable liquid precursor, the filling powder in the mixed liquid will gather in large quantities to form particle clusters, affecting the content of the filling powder in the curable mixed phase fluid, and then affecting the effect of the solid filling layer; as the particle size decreases, the filling powder can be better dispersed in the curable liquid precursor, and the precipitate gradually decreases, but the preparation of small particle size powder usually requires more sophisticated crushing, grading and screening processes, which usually require more advanced equipment and more complex technology to achieve, thereby increasing the difficulty and cost of production. Selecting filling powder within this particle size range takes into account both the effect of the solid filling layer and the production cost.

[0055] Optionally, the curable mixed phase fluid includes a surfactant, and the surfactant is used to adjust the liquid surface tension of the curable mixed phase fluid. It can be understood that the fluidity and liquid surface tension of the curable mixed phase fluid determine the filling rate of the assembly gap of the curable mixed phase fluid. Therefore, in order to obtain a good shielding effect of the solid filling layer, it is necessary to configure a curable mixed phase fluid with a suitable surface tension according to the hydrophilic and hydrophobic properties of the substrate surface. Therefore, during the configuration, the liquid surface tension of the curable mixed phase fluid can be adjusted by adding a surfactant. The addition of a surfactant changes the composition of the solvent liquid, affects the interaction force between the solvent molecules, and affects the formation of hydrogen bonds, thereby increasing or reducing the surface tension.

[0056] Furthermore, the proportion of the surfactant is less than or equal to 5%. If the concentration of the surfactant is too high, the fluidity of the curable mixed-phase fluid may be reduced, thereby affecting the filling effect of the curable mixed-phase fluid.

[0057] As an optional specific implementation, the coating method further includes: mixing the solute with the solvent to configure a curable liquid precursor; the curable liquid precursor is cured to form a gel, including: the solute reacts with the solvent to form a gel. Thus, the curable liquid precursor is configured through the formula combination of the solute and the solvent, and the solute and the solvent react to achieve the curing of the curable liquid precursor. In the actual process, the formula combination of the solute and the solvent can be adjusted according to various situations such as the substrate, the coating target material, and the coating process, which is conducive to improving the versatility and universality of the coating method.

[0058] Optionally, the concentration of the solute ranges from 0.001 mol / L to 1 mol / L. When the concentration of the solute is low, the curable liquid precursor takes a short time to cure, and the formed gel structure is loose; when the concentration of the solute is high, the curable liquid precursor takes a long time to cure, and the formed gel structure is dense. In actual configuration, the concentration of the solute can be adjusted as needed, and this embodiment does not limit this.

[0059] Optionally, the solute includes a liquid organosilicon compound, a soluble inorganic metal salt or a dissociable organic metal salt, and a suitable solute can be selected according to a variety of situations; the solvent includes at least one of the following: a polar organic solvent, a polar inorganic solvent, a non-polar organic solvent and a non-polar inorganic solvent. When preparing the solution, a suitable solvent can be selected according to the solute, and a combination of multiple solvents can be selected, which is conducive to the configuration of a curable liquid precursor that meets the requirements.

[0060] Specifically, the liquid organic silicon compound may include tetraethyl silicate, ethoxytrimethylsilane, or vinyl silane; the soluble inorganic metal salt may include titanium tetrachloride, yttrium trichloride, niobium pentachloride, aluminum trichloride, ferric chloride, magnesium dichloride or yttrium nitrate; the dissociable organic metal salt may include tetrabutyl titanate, tantalum ethoxide, yttrium oxalate or niobium ethoxide.

[0061] In some embodiments, the solute includes tetraethyl silicate and the solvent includes water and ethanol.

[0062] Tetraethyl silicate can combine with hydroxyl groups to undergo hydrolysis to form a SiO2 network gel. Water has a strong ability to provide hydroxyl groups and can achieve full hydrolysis, but the hydrolysis process is fast and will directly generate a precipitate rather than a gel. In addition, tetraethyl silicate is insoluble in water and cannot form a uniform solution. Ethanol has a weaker ability to provide hydroxyl groups and a slower hydrolysis process, which may not allow tetraethyl silicate to be fully hydrolyzed and condensed. When the solute is tetraethyl silicate, water and ethanol are selected as a mixed solvent. Tetraethyl silicate is soluble in ethanol and can allow tetraethyl silicate to be fully hydrolyzed, which is conducive to forming a colloid rather than directly generating a precipitate, thereby balancing solubility and reaction rate.

[0063] Specifically, the concentration of tetraethyl silicate is 0.01 mol / L; the ratio of water to ethanol is 10:1.

[0064] In this embodiment, the solvent further includes polyols. The polyols can act as surfactants, which are helpful for adjusting the liquid surface tension of the curable multiphase fluid to improve the filling effect of the curable multiphase fluid.

[0065] Specifically, the polyol may include ethylene glycol or glycerol. Ethylene glycol and glycerol have greater viscosity and can increase surface tension.

[0066] In this example, the polyol is ethylene glycol.

[0067] Optionally, the proportion of the polyol in the solvent is less than or equal to 5%, thereby preventing the polyol concentration from being too high and affecting the fluidity of the curable multiphase fluid, thereby causing an adverse effect on the filling effect of the curable multiphase fluid.

[0068] In this embodiment, the proportion of polyol in the solvent is 5%.

[0069] In some embodiments, the solute includes niobium pentachloride and the solvent includes methanol. Niobium pentachloride can be dissolved in methanol to form a homogeneous solution, and then the niobium pentachloride can combine with hydroxyl groups provided by methanol to form a gel.

[0070] Specifically, the concentration of niobium pentachloride is 0.03 mol / L.

[0071] In this embodiment, the solvent also includes acetylacetone. Acetylacetone molecules have specific functional groups, such as carbonyl and methylene, which can interact with methanol and solute molecules, help reduce the surface tension of the curable mixed phase fluid, and make it easier to spread and penetrate on the solid surface; and acetylacetone can spontaneously arrange on the gas-liquid interface or liquid-liquid interface to form a dense molecular film, reduce the free energy of the interface to further reduce the surface tension. Acetylacetone can act as a surfactant, which is beneficial to adjust the liquid surface tension of the curable mixed phase fluid to improve the filling effect of the curable mixed phase fluid.

[0072] Specifically, the proportion of acetylacetone in the solvent is 3%.

[0073] In some embodiments, the solute includes tetrabutyl titanate, and the solvent includes methanol. Tetrabutyl titanate can be dissolved in methanol to form a uniform solution, and then the tetrabutyl titanate is hydrolyzed in methanol to form a gel.

[0074] Specifically, the concentration of tetrabutyl titanate is 0.03 mol / L.

[0075] It can be understood that the above three embodiments are only exemplary of the formula combination of three solutes and solvents. In actual production, a suitable formula can be selected according to the material of the substrate, coating process conditions, etc., so that the solute and solvent can react to form a gel.

[0076] As another optional specific implementation, the curable liquid precursor is a liquid compound; the curable liquid precursor is cured to form a gel, including: under curing conditions, the liquid compound reacts to form a gel. Therefore, it is possible to directly select a liquid compound that can react to form a gel under certain conditions without adding other substances for configuration, which is more flexible.

[0077] In some embodiments, the curable liquid precursor is a sodium silicate aqueous solution; the curable liquid precursor is cured to form a gel, including: carbon dioxide in the air dissolves in water to form carbonic acid, sodium silicate and carbonic acid undergo double decomposition reaction to form orthosilicic acid, and orthosilicic acid dehydrates to form silicon oxide. Thus, SiO2 gel can be formed. The specific reaction process is shown in the following formula (1) and formula (2): Na2SiO3+H2CO3=H2SiO3+Na2CO3 (1) H2SiO3=H2O+SiO2 (2) In some embodiments, the curable liquid precursor is epoxy resin AB glue; the curable liquid precursor is cured to form a gel, including: the epoxy resin AB glue polymerizes itself to form a gel.

[0078] Epoxy resin AB glue includes component A and component B. Among them, epoxy resin is component A, which is a high-performance synthetic material with excellent physical properties and chemical stability. At room temperature or heating conditions, it can react with the curing agent to form a strong bond; the curing agent is component B, which chemically reacts with the epoxy resin to solidify it into a solid colloid.

[0079] In some embodiments, the curable liquid precursor is a single-component silicone or a two-component silicone; the curable liquid precursor is cured to form a gel, including: under heating conditions, the single-component silicone or the two-component silicone polymerizes to form a gel.

[0080] Single-component silicone usually contains one or more catalysts, which will be activated under heating conditions, thereby accelerating the polymerization reaction of silicone; the activated catalyst will promote the cross-linking reaction between silicone molecules, so that the molecular chain continues to grow and form a three-dimensional network structure; as the molecular chain grows and the degree of cross-linking increases, the silicone gradually loses its fluidity, becomes viscous and eventually forms a gel. Two-component silicone consists of two parts: a base material and a curing agent; under heating conditions, after the two parts are mixed, the active groups in the curing agent react rapidly with the functional groups in the base material to form a chemical bond connection. The chemical bond connection continues to increase, causing the silicone molecules to gradually cross-link into a three-dimensional network structure. As the polymerization reaction proceeds, the silicone gradually loses its fluidity and becomes viscous. Finally, the silicone is completely cured and forms a gel.

[0081] In some embodiments, the curable liquid precursor is a photocurable adhesive; the curable liquid precursor is cured to form a gel, including: under the irradiation of magnetic waves, the photocurable adhesive is polymerized to form a gel.

[0082] Light is electromagnetic radiation that is invisible to the naked eye and has a specific wavelength. Photocuring adhesives contain photoinitiators that can absorb the magnetic radiation energy of light. When the photoinitiator absorbs enough light energy, it will transition from the ground state to the excited state. In the excited state, it decomposes to produce free radicals (such as active free radicals) or cations and other highly reactive active species, which will attack the double bonds or active sites in the oligomers or monomer molecules in the photocuring adhesive, thereby initiating a chain growth reaction. The molecular chains continue to extend and gradually cross-link with each other to form a three-dimensional network structure, and then form a gel.

[0083] Next, please refer to Figure 3 , perform step S2 and step S3, inject the curable mixed phase fluid into the assembly gap 30 between the mask plate 20 and the substrate 10, until the curable mixed phase fluid fills the assembly gap 30, and the curable mixed phase fluid forms a liquid surface boundary that coincides with the boundary of the non-coating area under the action of liquid surface tension, and the curable mixed phase fluid includes a curable liquid precursor and a filling powder; the curable liquid precursor is cured to form a gel to obtain a solid filling layer 50, and the solid filling layer 50 includes a gel and a filling powder filled in the gel. Thus, the filling powder can be brought into the assembly gap 30 by utilizing the fluidity of the curable liquid precursor, and a liquid surface boundary that coincides with the boundary of the non-coating area is formed under the action of liquid surface tension, and a dense solid filling layer 50 is formed by the gel and filling powder formed by the curing of the curable liquid precursor, thereby achieving the filling of the assembly gap 30 and the precise profiling of the mask plate 20.

[0084] It can be understood that after the curable mixed phase fluid is injected, it contacts the mask plate 20 and the substrate 10, and the molecular distance on the surface of the curable mixed phase fluid is larger than the molecular distance inside. The interaction between the molecules is manifested as attraction, that is, liquid surface tension, and the curable mixed phase fluid is infiltrated with the surface of the mask plate 20 and the substrate 10. Then, under the traction of the liquid surface tension, the curable mixed phase fluid continues to extend in the assembly gap 30 until the assembly gap 30 is filled, that is, the curable mixed phase fluid has a capillary phenomenon in the assembly gap 30. In addition, when the curable mixed phase fluid extends to the boundary of the mask plate 20, because the liquid surface tension tends to keep the liquid surface smooth and continuous, and the boundary of the mask plate 20 provides a clear limit, under the interaction of the liquid surface tension and the boundary, the curable mixed phase fluid reaches equilibrium in the assembly gap 30, forming a liquid surface boundary that coincides with the boundary of the non-coating area.

[0085] In this embodiment, step S2 and step S3 may include: injecting a curable mixed-phase fluid into the assembly gap between the mask plate and the substrate until the curable mixed-phase fluid fills the assembly gap, and the curable mixed-phase fluid forms a liquid surface boundary that coincides with the boundary of the non-coated area under the action of liquid surface tension; the curable liquid precursor is cured to form a gel, and the liquid in the curable mixed-phase fluid evaporates; repeating the above steps at least twice to obtain a solid filling layer. It can be understood that after the curable liquid precursor is cured to form a gel and the liquid in the curable mixed-phase fluid evaporates, the solid matter in the assembly gap may not be able to fill the assembly gap, and there will be certain slits or pores, and the mesh structure of the gel is filled with air, and many micropores are formed. Therefore, by repeating the steps of injection, curing and evaporation for many times, the solid filling layer finally prepared is more compact, which is conducive to improving the filling effect and shielding effect of the solid filling layer.

[0086] Optionally, before repeating the above steps, the method further includes: placing the mask plate and the substrate in a vacuum container, and evacuating the assembly gap; taking the mask plate and the substrate out of the vacuum container. After performing the steps of injection, curing and evaporation, there may still be some gaps or micropores in the assembly gap that have not been filled, especially the pore size of the micropores in the gel is usually in the μm order, and it is difficult for the curable mixed phase fluid to penetrate. By evacuating the assembly gap to extract the air in these gaps or micropores, and then taking the mask plate and the substrate out of the vacuum container, continue to inject the curable mixed phase fluid, when the vacuum state is released, the atmospheric pressure will press the liquid into the micropores, and under the action of the surface tension of the liquid surface, the pores will be filled to prepare a dense and compact solid filling layer.

[0087] Optionally, when the curable multiphase fluid is injected for the first time, the volume V1 of the curable multiphase fluid injected for the first time is recorded; when the curable multiphase fluid is repeatedly injected, the volume V of the curable multiphase fluid currently injected is recorded. n , where n is the current injection times of the curable mixed phase fluid, n≥2; until V n <0.01V1, stop injecting the curable mixed phase fluid to obtain a solid filling layer. Thus, the volume of the curable mixed phase fluid injected each time is recorded, and the volume V1 of the curable mixed phase fluid injected for the first time is compared with the volume V1 of the curable mixed phase fluid injected currently. n , determine whether the standard is met, and set the standard to V n <0.01V1, which makes the finally prepared solid filling layer more compact, and is beneficial to improving the filling effect and shielding effect of the solid filling layer.

[0088] Optionally, when executing step S3, the method may include: controlling the curing time of the curable mixed-phase fluid. Thus, by controlling the curing time of the curable mixed-phase fluid, the bonding strength of the formed solid filling layer can be regulated so as to facilitate its removal after coating.

[0089] Next, please refer to Figure 4 , step S4 is performed, at least the solid filling layer 50 is used as a mask, and a coating process is performed to form a film layer 40 on the coating area of ​​the substrate. Thus, at least the solid filling layer 50 is used as a mask to avoid the occurrence of a plating-around phenomenon, and to achieve precise control of the coating area, so that the boundary between the coating area and the non-coating area is clear and sharp.

[0090] Before step S4, the method may further include: removing the mask plate 20. Therefore, when the coating process is subsequently performed, the solid filling layer 50 may be directly used as a mask.

[0091] In this embodiment, the mask used when performing the coating process is a mask plate and a solid filling layer.

[0092] After step S4 , the method further includes: removing the solid filling layer 50 .

[0093] Specifically, the solid filling layer can be removed by wiping.

[0094] Optionally, after wiping, part of the solid filling layer remains on the substrate; the method further comprises: soaking the substrate in a NaOH solution or a HF solution for a certain period of time; wiping away the remaining part of the solid filling layer; or, ultrasonic cleaning to remove the remaining part of the solid filling layer. NaOH is a strong base and HF is a strong acid, both of which can react chemically with most gels, especially gels containing silicate components, and during the soaking process, the liquid penetrates into the gel, causing it to swell, and the adhesion between the gel and the substrate decreases, and then it can be removed by wiping after soaking, or by ultrasonic cleaning. In this way, the solid filling layer on the substrate is cleaned.

[0095] It should be understood that the above embodiments are exemplary and are not intended to include all possible implementations included in the claims. Various modifications and changes may be made on the basis of the above embodiments without departing from the scope of the present disclosure. Similarly, the various technical features of the above embodiments may be arbitrarily combined to form other embodiments of the present invention that may not be explicitly described. Therefore, the above embodiments only express several implementations of the present invention and do not limit the scope of protection of the patent of the present invention.

Claims

1. A coating method, It is characterized in that The steps include: Assembling and fixing the mask plate and the substrate, the portion of the substrate covered by the mask plate corresponds to the non-coating area, and the portion of the substrate not covered by the mask plate corresponds to the coating area; Injecting a curable mixed-phase fluid into the assembly gap between the mask plate and the substrate until the curable mixed-phase fluid fills the assembly gap and the curable mixed-phase fluid forms a liquid surface boundary that coincides with the boundary of the non-coating area under the action of liquid surface tension, wherein the curable mixed-phase fluid includes a curable liquid precursor and a filling powder; The curable liquid precursor is cured to form a gel to obtain a solid filling layer, wherein the solid filling layer includes the gel and the filling powder filled in the gel; A coating process is performed using at least the solid filling layer as a mask to form a film layer on the coating area of ​​the substrate.

2. The coating method according to claim 1, It is characterized in that Before injecting the curable mixed-phase fluid into the assembly gap between the mask plate and the substrate, the method further comprises: The filling powder is mixed with the curable liquid precursor to obtain a mixed liquid; the mixed liquid is allowed to stand to separate a supernatant liquid and a precipitate from the mixed liquid; and the supernatant liquid is used as the curable mixed-phase fluid.

3. The coating method according to claim 1, It is characterized in that The material of the filling powder is a material with stable chemical properties under the coating process conditions.

4. The coating method according to claim 1, It is characterized in that The particle size of the filling powder is less than 1 μm.

5. The coating method according to claim 1, It is characterized in that The coating method further comprises: mixing a solute with a solvent to obtain a curable liquid precursor; The curable liquid precursor is cured to form a gel, which includes: the solute reacts with the solvent to form a gel.

6. The coating method according to claim 5, It is characterized in that The solute includes a liquid organosilicon compound, a soluble inorganic metal salt or a dissociable organic metal salt; The solvent includes at least one of the following: a polar organic solvent, a polar inorganic solvent, a non-polar organic solvent and a non-polar inorganic solvent.

7. The coating method according to claim 1, It is characterized in that The curable multiphase fluid includes a surfactant, and the surfactant is used to adjust the liquid surface tension of the curable multiphase fluid.

8. The coating method according to claim 7, It is characterized in that The surfactant accounts for less than or equal to 5%.

9. The coating method according to claim 1, It is characterized in that The curable mixed-phase fluid is injected into the assembly gap between the mask plate and the substrate until the curable mixed-phase fluid fills the assembly gap and the curable mixed-phase fluid forms a liquid surface boundary that coincides with the boundary of the non-coating area under the action of liquid surface tension; The curable liquid precursor is cured to form a gel to obtain a solid filling layer, comprising: Injecting a curable mixed-phase fluid into the assembly gap between the mask plate and the substrate until the curable mixed-phase fluid fills the assembly gap and the curable mixed-phase fluid forms a liquid surface boundary that coincides with the boundary of the non-coating area under the action of liquid surface tension; The curable liquid precursor is cured to form a gel, and the liquid in the curable mixed-phase fluid is evaporated; Repeat the above steps at least twice to obtain the solid filling layer.

10. The coating method according to claim 9, It is characterized in that When the curable multiphase fluid is injected for the first time, the volume V of the curable multiphase fluid injected for the first time is recorded. 1 When the curable mixed phase fluid is repeatedly injected, the volume V of the curable mixed phase fluid currently injected is recorded; n , wherein n is the current injection number of the curable mixed-phase fluid, n≥2; Until V n <0.01V 1 , stop injecting the curable mixed-phase fluid to obtain the solid filling layer.

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