Base assembly and chemical vapor deposition device

Abstract

The invention provides a base assembly and a chemical vapor deposition device. The base assembly comprises a tray used for bearing a substrate; the heater is positioned below the tray and is used for heating the tray; the lining surrounds the heater, the outer diameter of a main body of the lining is larger than or equal to the outer diameter of the tray, and part of the upper surface of the main body extends upwards to form a supporting table used for supporting the tray; a taking and placing groove allowing a mechanical arm to enter is formed by the side wall of the supporting table and the upper surface of the main body, and at least part of the taking and placing groove is located below the tray and used for lifting the tray. The problem that the temperature difference between the center and the edge of the tray is large is solved, the uniformity of substrate film deposition is improved, and the service life of the tray is prolonged.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor equipment, and in particular to a base assembly and a chemical vapor deposition device. Background Art

[0002] In the semiconductor manufacturing industry, chemical vapor deposition (CVD) is a well-known process for forming thin film materials on the surface of a substrate. With the shrinking feature size of semiconductor devices and the increasing integration of devices, higher and higher requirements are placed on the uniformity of CVD thin films. During the thin film deposition process, various process conditions will affect the uniformity of thin film deposition on the substrate surface, especially the uniformity of the substrate surface temperature is an important factor in ensuring uniform deposition of thin films.

[0003] In the current technology, the substrate is placed on a tray, and the tray is rotated together with the support bushing below. During operation, in order to improve the uniformity of heating of the substrate, the heater first heats the tray, and after the heat is leveled by the tray, the substrate is heated by heat transfer. Therefore, the temperature uniformity of the tray will directly affect the temperature uniformity of the substrate.

[0004] However, in order to avoid direct contact with the heated substrate and causing debris, the substrate and the tray are usually moved together when the substrate is taken in and placed, and the tray diameter needs to be larger than the outer diameter of the bushing to facilitate the robot arm to lift the edge of the tray to take the tray in and place it. During the process, since the tray diameter is larger than the bushing, the edge of the tray will be in a suspended state and closer to the cold wall of the reaction chamber. The heat at the edge of the tray is more easily carried away by the airflow, resulting in a large temperature difference between the center and the outer edge of the tray, resulting in uneven temperature distribution between the center and edge of the substrate surface, affecting the uniformity of the substrate film deposition. In addition, the large temperature difference between the center and edge of the tray will also seriously shorten the life of the tray. Summary of the invention

[0005] The purpose of the present invention is to provide a base assembly and a chemical vapor deposition device to solve the problem of large temperature difference between the center and the edge of the tray, improve the uniformity of substrate film deposition, and extend the service life of the tray.

[0006] In order to achieve the above objectives, the present invention is implemented by the following technical solutions:

[0007] A base assembly comprising:

[0008] A tray for carrying a substrate;

[0009] a heater, located below the tray, for heating the tray;

[0010] A bushing surrounds the heater, the outer diameter of the bushing body is greater than or equal to the outer diameter of the pallet, and a portion of the upper surface of the body extends upward to form a support platform for supporting the pallet; the side walls of the support platform and the upper surface of the body form a pick-and-place groove that allows a robot arm to enter, and the pick-and-place groove is at least partially located under the pallet for lifting the pallet.

[0011] Optionally, the support platform is located at the inner edge of the upper surface of the main body, and the taking and placing groove is an annular groove surrounding the support platform.

[0012] Optionally, the pick-and-place groove is at least a pair of strip grooves, and each pair of the strip grooves is arranged on the upper surface of the main body.

[0013] Optionally, each pair of the strip grooves are symmetrically distributed about the central axis of the bushing.

[0014] Optionally, when the number of the strip grooves is two pairs or more, each pair of the strip grooves are rotationally symmetrically distributed about the central axis of the bushing.

[0015] Optionally, the strip-shaped groove is arranged at the edge of the upper surface of the main body, and the cross-section of the strip-shaped groove along the radial direction of the bushing is L-shaped.

[0016] Optionally, the outer diameter of the main body is 0-100 mm larger than the outer diameter of the tray.

[0017] Optionally, the strip-shaped groove is arranged in the middle of the upper surface of the main body, and the cross-section of the strip-shaped groove along the radial direction of the bushing is U-shaped.

[0018] Optionally, the outer diameter of the main body is greater than the outer diameter of the tray, and the edge of the upper surface of the main body has an upward extending portion, and the extending portion covers the outer side wall of the tray.

[0019] Optionally, the height of the extension portion is greater than or equal to the height of the outer side wall of the tray.

[0020] Optionally, the bushing is connected to a driving mechanism, and the driving mechanism drives the bushing to rotate to a plurality of stop positions, and at each of the stop positions, the robot arm can enter a pair of the strip grooves.

[0021] Optionally, the main body is in a ring shape with a certain upward and downward extension, and the radial width of the upper surface of the main body is greater than the radial width of the lower surface.

[0022] Optionally, the heater is a ring-shaped heater, the outer diameter of which is larger than the inner diameter of the upper surface of the main body.

[0023] A chemical vapor deposition device, comprising:

[0024] A reaction chamber, wherein a film transfer port is provided on the side wall of the reaction chamber for the robot arm to enter and exit;

[0025] A base assembly as described in any one of the above items, arranged at the bottom of the reaction chamber;

[0026] An air inlet device, used for supplying reaction gas to the reaction chamber to perform thin film deposition on the substrate;

[0027] The vacuum device is used to vacuum the reaction chamber.

[0028] Compared with the prior art, the present invention has the following advantages:

[0029] The base assembly provided by the present invention, the bushing includes a main body and a support platform, the outer diameter of the main body is larger than the outer diameter of the tray, and the edge of the tray does not extend out of the bushing, so the heat of the heater can be transferred to the edge of the tray to heat the edge of the tray, and in addition, the side wall of the support platform and the upper surface of the main body form a pick-and-place groove that allows a robot arm to enter, so that the robot arm can enter the pick-and-place groove formed by the side wall of the support platform and the upper surface of the main body to pick and place the tray. Therefore, the present invention can solve the problem of large temperature difference between the edge and the center of the tray without affecting the pick-and-place of the tray, improve the uniformity of substrate film deposition, and extend the service life of the tray. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solution of the present invention, the following briefly introduces the drawings required for the description. Obviously, the drawings described below are an embodiment of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work:

[0031] Figure 1 It is a structural diagram of a chemical vapor deposition device;

[0032] Figure 2 for Figure 1 Structural diagram of the middle base assembly;

[0033] Figure 3 A structural diagram of a base assembly provided in one embodiment of the present invention;

[0034] Figure 4 A structural diagram of a bushing provided in one embodiment of the present invention;

[0035] Figure 5 Place the tray on Figure 4 Schematic diagram on the bushing shown;

[0036] Figure 6 A structural diagram of a bushing provided in another embodiment of the present invention;

[0037] Figure 7 For placing the tray Figure 6 a cutaway view on the bushing shown;

[0038] Figure 8 For placing the tray Figure 6 A perspective view on the bushing shown;

[0039] Fig. 9 A cross-sectional view of a base assembly provided in accordance with another embodiment of the present invention;

[0040] Fig.10 for Fig. 9 a perspective view of the base assembly shown;

[0041] Fig.11 A structural diagram of a bushing provided in another embodiment of the present invention. DETAILED DESCRIPTION

[0042] The scheme proposed by the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. According to the following description, the advantages and features of the present invention will be clearer. It should be noted that the accompanying drawings are in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the implementation method of the present invention. In order to make the purposes, features and advantages of the present invention more obvious and easy to understand, please refer to the accompanying drawings. It should be noted that the structures, proportions, sizes, etc. illustrated in the accompanying drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no technical substantive significance. Any structural modification, change in proportional relationship or adjustment of size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope of the technical content disclosed by the present invention.

[0043] The base assembly involved in the present invention includes a tray, a bushing and a heater located inside the bushing, wherein the outer diameter of the main body of the bushing is greater than or equal to the outer diameter of the tray, so that the edge of the tray can be radiantly heated by the main body of the bushing, thereby reducing the heat loss rate of the edge of the tray, and a portion of the upper surface of the main body extends upward to form a support platform for supporting the tray; the side walls of the support platform and the upper surface of the main body form a pick-and-place groove that allows a robotic arm to enter, and the pick-and-place groove is at least partially located below the tray for lifting the tray.

[0044] Figure 1The structure diagram of a chemical vapor deposition device is shown, the chemical vapor deposition device includes a reaction chamber 1, the bottom of the reaction chamber 1 is provided with a base assembly 5, the base assembly 5 is used to carry a substrate, and a film transfer port (not shown in the figure) is provided on the side wall of the reaction chamber for a robot to enter and exit. The robot places a tray carrying a substrate to be processed on a bushing of the base assembly 5 through the film transfer port, and takes out the tray and the substrate through the film transfer port after the process is completed. The chemical vapor deposition device also includes an air intake device 2 for supplying reaction gas to the reaction chamber 1 to perform thin film deposition on the substrate; Figure 1 As shown, the gas inlet device 2 is arranged on the side wall of the reaction chamber 1, and the reaction gas is supplied to the reaction chamber 1 in a horizontal direction. In other embodiments, the gas inlet device 2 can also be arranged on the top of the reaction chamber 1, and the reaction gas is supplied to the reaction chamber 1 in an upward direction. The chemical vapor deposition equipment also includes a gas extraction device 3, which is used to evacuate the reaction chamber 1, extract the reacted gas and maintain an extremely low pressure close to vacuum inside the reaction chamber 1. Figure 1 As shown, the exhaust device 3 is arranged on the side wall of the reaction chamber 1, opposite to the air intake device 3. In other embodiments, when the air intake device is arranged on the top of the reaction chamber 1, the exhaust device can be arranged at the bottom of the reaction chamber 1.

[0045] like Figure 2 As shown, the base assembly 5 includes a tray 51 for carrying the substrate 6. The upper surface of the tray 51 may include one or more recessed portions for carrying the substrate 6. The tray 51 is placed on a sleeve 52. Figure 1 As shown, the bushing 52 is connected to a driving mechanism 4, and the driving mechanism 4 is used to drive the bushing 52 to rotate during the process, so that the bushing 52 drives the tray 51 to rotate. A heater 53 is also provided under the tray 51, which is used to heat the tray 51 during the process and heat the substrate 6 through the heat transfer of the tray 51. In order to facilitate the robot to take and place the tray 51, the outer diameter of the tray 51 is larger than the outer diameter of the bushing 52, so that the edge A of the tray 51 extends out of the bushing 52, and the fork of the robot extends under the edge A of the tray 51 and lifts the tray 51 to take out the tray 51. Since the edge A of the tray 51 extends out of the bushing 52, and the heater 53 is located on the inner side of the bushing 52, its heat radiation is confined to the space surrounded by the lower surface of the tray 51 and the inner surface of the bushing 52, and the edge A is close to the cold wall of the reaction chamber 1 outside, and the heat is easily taken away by the airflow, and it cannot be effectively heated, resulting in a large temperature difference between the center and edge A of the tray 51, which affects the uniformity of the substrate film deposition and the life of the tray.

[0046] Based on this, the present invention provides a base assembly, such as Figure 3As shown, the base assembly includes a tray 10 for carrying a substrate W, a heater 20 located below the tray 10 for heating the tray 10, and a sleeve 30 surrounding the heater 20. The sleeve 30 includes a main body 31 and a support platform 32 extending upward from a portion of the upper surface of the main body 31 to form a support for supporting the tray 10. The outer diameter of the main body 31 is greater than the outer diameter of the tray 10. The side wall 321 of the support platform 32 and the upper surface 311 of the main body form a pick-and-place groove 33 for allowing a robot arm to enter. The pick-and-place groove 33 is at least partially located below the tray 10 and is used to lift the tray 10.

[0047] Since the outer diameter of the main body 31 is larger than the outer diameter of the tray 10, the edge a of the tray 10 does not extend beyond the upper edge of the bushing 30 to limit the vertical extension space, so the heat of the upper shoulder of the bushing 30 heated by the heater 20 can be directly radiated upward to the edge a of the tray 10 to heat the edge a of the tray 10. In addition, the side wall 321 of the support table 32 and the upper surface 311 of the main body 31 form a pick-up and placement groove 33 that allows a robot arm to enter, so that the robot arm can enter the pick-up and placement groove 33 formed by the side wall 321 of the support table 32 and the upper surface 311 of the main body 31 to pick up and place the tray 10, thereby moving the substrate. The present invention can solve the problem of large temperature difference between the edge a and the center of the tray 10 without affecting the pick-up and placement of the tray 10, improve the uniformity of substrate film deposition, and extend the service life of the tray.

[0048] like Figure 3 As shown, the main body 31 is a ring or a cylinder with a certain upward and downward extension. The radial width of the upper surface 311 of the main body 31 is greater than the radial width of the lower surface 312, thereby forming a shoulder above the main body 31. The heater 20 located in the main body 31 can directly heat the shoulder and transfer the heat to the support platform 32 above the main body 31. The support platform 32 and the shoulder heat the tray 10 through heat conduction and heat radiation. Specifically, the part of the tray 10 that contacts the support platform 32 is heated by heat conduction, and the part that does not contact the support platform 31 is heated by heat radiation. It can be understood that, for the annular edge a area of ​​the tray 10, a portion of it is in contact with the support platform 32, and this portion is heated by heat conduction, and the other portion is located above the loading and unloading groove 33 and therefore does not contact the support platform 32, and this portion is heated by heat radiation. Moreover, this portion is close to the shoulder of the main body 31, so the shoulder can also heat this portion by heat radiation. Compared with the outer edge of the edge a extending out of the sleeve, the temperature of the space around the edge a is higher. Therefore, the annular edge a of the tray 10 can be effectively heated, thereby reducing the temperature difference between the edge a and the center of the tray 10.

[0049] Furthermore, the heater 20 is an annular heater whose outer diameter is larger than the inner diameter of the upper surface 311 of the main body 31. Thus, the heater 20 can effectively heat the shoulder of the main body 31, thereby achieving effective heating of the annular edge a of the tray 10, further reducing the temperature difference between the edge a and the center of the tray 10.

[0050] In some embodiments, Figure 4 , Figure 6 As shown, the pick-up and placement groove 33 is at least one pair of strip grooves 33a. The side wall 321 of the support platform 32 corresponding to the strip groove 33a is a plane. Each pair of strip grooves 33a is symmetrically distributed about the central axis O of the bushing 30, that is, each pair of strip grooves 33a is symmetrically distributed about the central axis of the pallet 10, so that when the robot arm picks up and places the pallet 10, the center of gravity of the pallet 10 coincides with the center of the fork of the robot arm, thereby improving the stability of the robot arm in picking up and placing the pallet 10. When the number of the strip grooves 33a is two pairs or more, each pair of strip grooves 33a is rotationally symmetrically distributed about the central axis O of the bushing 30. The size of the strip grooves 33a is adapted to the size of the corresponding robot arm. In this embodiment, each pair of strip grooves 33a is basically kept parallel. In other embodiments, if the fork of the robot arm is not parallel, the corresponding strip grooves 33a can also be set non-parallel.

[0051] When the number of the strip grooves 33a is one pair, the driving mechanism 4 drives the bushing 30 to rotate and stop at a preset stop position. At the stop position, after the robot arm enters the reaction chamber from the film transfer port, it can enter the pair of strip grooves 33a to carry out the operation of picking up and placing the tray 10. When the number of the strip grooves 33a is multiple pairs, the driving mechanism 4 drives the bushing 30 to rotate and stop at multiple preset stop positions. At each stop position, the robot arm can enter a pair of strip grooves 33a to carry out the operation of picking up and placing the tray 10. Therefore, by setting multiple pairs of strip grooves 33a and multiple corresponding stop positions, the bushing 30 can be stopped at the nearest stop position, thereby improving the substrate processing efficiency.

[0052] In one embodiment, Figure 4 As shown, the strip groove 33a is arranged at the edge of the upper surface 311 of the main body 31, and the cross section of the strip groove 33a along the radial direction of the bushing 30 is L-shaped, that is, the strip groove 33a is formed by a side wall 321 of the support platform 32 and the upper surface 311 of the main body. Figure 4 The structural diagram shows that the bushing 30 includes a pair of L-shaped strip grooves 33a, which are symmetrically distributed about the central axis of the bushing 30. In other embodiments, the bushing 30 may also include multiple pairs of such L-shaped strip grooves 33a, and each pair of strip grooves 33a are rotationally symmetrically distributed about the central axis of the bushing 30. Figure 5 The tray 10 is shown placed Figure 4 The structure diagram on the bushing 30 is shown, as Figure 5As shown, the outer diameter of the main body 31 is larger than the outer diameter of the tray 10 , for example, 0-100 mm larger, which can improve the heat radiation effect of the shoulder of the main body 31 on the edge area of ​​the tray 10 .

[0053] In another embodiment, Figure 6 As shown, the strip groove 33a is arranged in the middle of the upper surface 311 of the main body 31 , and the cross section of the strip groove 33a along the radial direction of the bushing 30 is U-shaped, that is, the strip groove 33a is formed by the two side walls 321 of the support platform 32 and the upper surface 311 of the main body 31 . Figure 6 The structural diagram shows that the bushing 30 includes a pair of U-shaped strip grooves 33a, which are symmetrically distributed about the central axis of the bushing 30. In other embodiments, the bushing 30 may also include multiple pairs of such U-shaped strip grooves 33a, and each pair of strip grooves 33a are rotationally symmetrically distributed about the central axis of the bushing 30. Figure 7 , Figure 8 The tray 10 is shown placed Figure 6 The structure diagram on the bushing 30 is shown, as Figure 7 , Figure 8 As shown, the outer diameter of the support table 32 is greater than or equal to the outer diameter of the tray 10. Therefore, in addition to receiving radiation heating, the edge a of the tray 10 also receives direct contact heat transfer from the support table, which can significantly improve the heating effect on the annular edge area of ​​the tray 10 and maintain the consistency of the temperature between the center and edge areas of the tray.

[0054] Furthermore, Fig. 9 , Fig.10 FIG. 1 shows a structural diagram of a tray 10 placed on a liner 30 of another embodiment. Figure 6 On the basis of the embodiment shown, in this embodiment, the outer diameter of the main body 31 is greater than the outer diameter of the tray 10, and the edge of the upper surface of the main body 31 has an upward extension portion 313, and the extension portion 313 covers the outer side wall of the tray 10. Therefore, the heat of the main body 31 is transferred to the extension portion 313, and the extension portion 313 heats the outer side wall of the tray 10, thereby enhancing the heating effect of the edge area and further reducing the temperature difference between the edge and the center of the tray 10. It should be noted that, optionally, the height of the extension portion 313 is greater than or equal to the height of the outer side wall of the tray 10, thereby heating and keeping the outer side wall of the tray 10 warm, further enhancing the heating effect of the edge area.

[0055] In other embodiments, Fig.11 As shown, the support platform 32 is located at the inner edge of the upper surface 311 of the main body 31, and the placement groove 33 is an annular groove 33b, which surrounds the support platform 32, that is, the annular groove 33b is formed by the annular outer side wall 321 of the support platform 32 and the upper surface 311 of the main body 31. The effect of placing the tray 10 on the bushing 30 of this embodiment can be referred to Figure 3In this embodiment, the pick-up and placement groove 33 is designed as an annular groove 33b. When the drive structure 4 drives the bushing 30 to rotate and stop at any position, the robot arm can enter the pick-up and placement groove 33 to perform the operation of picking up and placing the tray 10, thereby improving the substrate processing efficiency. Furthermore, the outer diameter of the main body 31 is 0-100 mm larger than the outer diameter of the tray 10, which can improve the heat radiation effect of the shoulder of the main body 31 on the edge area of ​​the tray 10.

[0056] Based on the same inventive concept, the present invention also provides a chemical vapor deposition device, comprising:

[0057] A reaction chamber, wherein a film transfer port is provided on the side wall of the reaction chamber for the robot arm to enter and exit;

[0058] The base assembly as described above is arranged at the bottom of the reaction chamber;

[0059] An air inlet device, used for supplying reaction gas to the reaction chamber to perform thin film deposition on the substrate;

[0060] The vacuum device is used to vacuum the reaction chamber.

[0061] In this embodiment, the chemical vapor deposition device may be a metal organic compound chemical vapor deposition device. In other embodiments, it may also be other types of chemical vapor deposition devices.

[0062] Although the content of the present invention has been described in detail through the above preferred embodiments, it should be appreciated that the above description should not be considered as a limitation of the present invention. After reading the above content, it will be apparent to those skilled in the art that various modifications and substitutions of the present invention will occur. Therefore, the protection scope of the present invention should be limited by the appended claims.

Claims

1. A base assembly, characterized in that: include: A tray for carrying a substrate; a heater, located below the tray, for heating the tray; A bushing surrounds the heater, the outer diameter of the bushing body is greater than or equal to the outer diameter of the pallet, and a portion of the upper surface of the body extends upward to form a support platform for supporting the pallet; the side walls of the support platform and the upper surface of the body form a pick-and-place groove that allows a robot arm to enter, and the pick-and-place groove is at least partially located under the pallet for lifting the pallet.

2. The base assembly according to claim 1, characterized in that The support platform is located at the inner edge of the upper surface of the main body, and the taking and placing groove is an annular groove surrounding the support platform.

3. The base assembly according to claim 1, wherein: The taking and placing grooves are at least one pair of strip grooves, and each pair of the strip grooves is arranged on the upper surface of the main body.

4. The base assembly according to claim 3, characterized in that Each pair of the strip grooves is symmetrically distributed about the central axis of the bushing.

5. The base assembly according to claim 3, characterized in that When the number of the strip grooves is two pairs or more, each pair of the strip grooves is rotationally symmetrically distributed about the central axis of the bushing.

6. The base assembly according to claim 3, characterized in that The strip groove is arranged at the edge of the upper surface of the main body, and the cross section of the strip groove along the radial direction of the bushing is L-shaped.

7. The base assembly according to claim 2 or 6, characterized in that: The outer diameter of the main body is 0-100 mm larger than the outer diameter of the tray.

8. The base assembly according to claim 3, wherein: The strip groove is arranged in the middle of the upper surface of the main body, and the cross section of the strip groove along the radial direction of the bushing is U-shaped.

9. The base assembly according to claim 8, wherein: The outer diameter of the main body is greater than the outer diameter of the tray. The edge of the upper surface of the main body has an upward extending portion, and the extending portion covers the outer side wall of the tray.

10. The base assembly according to claim 9, wherein: The height of the extension portion is greater than or equal to the height of the outer side wall of the tray.

11. The base assembly according to claim 3, characterized in that The bushing is connected to a driving mechanism, and the driving mechanism drives the bushing to rotate to a plurality of stop positions. At each of the stop positions, the robot arm can enter a pair of the strip grooves.

12. The base assembly of claim 1, wherein: The main body is in a ring shape with a certain upward and downward extension, and the radial width of the upper surface of the main body is greater than the radial width of the lower surface.

13. The base assembly of claim 12, wherein: The heater is a ring-shaped heater, and its outer diameter is larger than the inner diameter of the upper surface of the main body.

14. A chemical vapor deposition device, characterized in that: include: A reaction chamber, wherein a film transfer port is provided on the side wall of the reaction chamber for the robot arm to enter and exit; The base assembly according to any one of claims 1 to 13, arranged at the bottom of the reaction chamber; An air inlet device, used for supplying reaction gas to the reaction chamber to perform thin film deposition on the substrate; The vacuum device is used to vacuum the reaction chamber.

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