Laser radar chip and laser radar

Abstract

The invention provides a laser radar chip and a laser radar. The laser radar chip comprises a substrate; the light emitting device array is positioned on the substrate; the light receiving device array is positioned on the substrate on one side of the light emitting device array; the light splitting unit is configured to transmit the detection light generated by the light emitting device array; the probe light is reflected by a target to form echo light; the light splitting unit is further configured to transmit the echo light to the light receiving device array; and the packaging body is located on the substrate and packages the light emitting device array, the light receiving device array and the light splitting unit. According to the invention, the alignment precision of the emission field of view and the receiving field of view of the laser radar can be effectively improved, the laser radar is convenient to assemble and produce, the cost of the laser radar is reduced, the reliability of the laser radar is improved, and the high-line-number laser radar is realized.

Description

Technical Field

[0001] The present invention relates to the field of laser radar, and in particular to a laser radar chip and a laser radar. Background Art

[0002] LiDAR is a commonly used distance measurement sensor with the characteristics of long detection distance, high resolution, and low environmental interference. It is widely used in intelligent robots, drones, unmanned driving and other fields. The working principle of LiDAR is to use the flight time of lasers traveling back and forth between the radar and the target to obtain information such as the distance and spatial position of the target. In LiDAR, the high-precision alignment between the transmitting field of view and the receiving field of view directly affects the important performance of LiDAR, such as its distance measurement capability and ranging accuracy.

[0003] At present, there is a problem with laser radar that it is difficult to ensure the alignment of the transmitting field of view and the receiving field of view. This is mainly because factors such as production process, temperature changes, and mechanical deformation can cause the transmitting field of view and the receiving field of view to offset and become unable to overlap.

[0004] In order to solve the above-mentioned problem of the field of view offset between transmission and reception, one of the methods currently used is the electronic aperture technology based on the receiving end array photosensitive device. Through this technology, the receiving field of view can be dynamically adjusted so that the receiving field of view always coincides with the transmitting field of view.

[0005] Moreover, in order to solve the problem of the misalignment between the transmitting and receiving fields of view in the prior art, it is often necessary to set a larger receiving field of view to ensure that even if an offset occurs between the transmitting field of view and the receiving field of view, the light spot is still within the receiving field of view, thereby avoiding a significant degradation of the laser radar's ranging performance.

[0006] Therefore, better alignment between the transmitting field of view and the receiving field of view can effectively improve the performance of the lidar. Summary of the invention

[0007] The problem solved by the present invention is how to improve the alignment accuracy between the transmitting field of view and the receiving field of view.

[0008] In order to solve the above problems, the present invention provides a laser radar chip, comprising:

[0009] A substrate; an array of light emitting devices, the array of light emitting devices being located on the substrate; an array of light receiving devices, the array of light receiving devices being located on the substrate on one side of the array of light emitting devices; a spectroscopic unit, the spectroscopic unit being configured to transmit detection light generated by the array of light emitting devices; the detection light being reflected by a target to form echo light; the spectroscopic unit being further configured to transmit the echo light to the array of light receiving devices; a packaging body, the packaging body being located on the substrate and packaging the array of light emitting devices, the array of light receiving devices and the spectroscopic unit.

[0010] Optionally, the light emitting device array includes a plurality of lasers, and the plurality of lasers are arranged in an array on the substrate; the light receiving device array includes a plurality of detectors, and the plurality of detectors are arranged in an array on the substrate.

[0011] Optionally, it also includes: a light emitting device driving module, which is located on the substrate and electrically connected to the light emitting device array and the substrate; and a light receiving device driving module, which is located on the substrate and electrically connected to the light receiving device array and the substrate.

[0012] Optionally, the light emitting device driving module and the light receiving device driving module are located between the light emitting device array and the light receiving device array; or, the light emitting device array and the light receiving device array are located between the light emitting device driving module and the light receiving device driving module.

[0013] Optionally, it further includes: a light-transmitting adhesive portion, which is located on a side of the light-splitting unit facing the substrate; the light-splitting unit is fixed to the light-receiving device array and the light-emitting device array via the light-transmitting adhesive portion.

[0014] Optionally, the spectroscopic unit includes: a spectroscopic element, and the spectroscopic element is configured to separate the optical path of the detection light from the optical path of the echo light.

[0015] Optionally, the beam splitter element is a polarization beam splitter.

[0016] Optionally, the detection light is emitted from the light emitting device array along a direction perpendicular to the substrate surface; the echo light is incident on the light receiving device array along a direction perpendicular to the substrate surface; the spectroscopic unit also includes: a light deflection element, which is located in the optical path of the detection light, and is configured to deflect the detection light to the spectroscopic element.

[0017] Optionally, the spectroscopic unit further includes: a focusing element, the focusing element is located in the optical path of the detection light, and the focusing element is configured so that the light emitting device array and the light receiving device array are both arranged on the substrate.

[0018] Optionally, the focusing element includes: a first lens, which is located upstream of the light deflection element in the optical path of the detection light to transmit the detection light to be incident on the light deflection element; and a second lens, which is located downstream of the light deflection element in the optical path of the detection light, and the detection light deflected by the light deflection element is transmitted through the second lens and then incident on the spectroscopic element.

[0019] Optionally, the first lens, the light deflection element and the second lens are integrally formed.

[0020] Optionally, the first lens is a convex lens or a gradient refractive index lens; the second lens is a convex lens or a gradient refractive index lens.

[0021] Optionally, the second lens is a gradient refractive index lens, and the first lens, the light deflection element, the second lens and the beam splitting element are integrally formed.

[0022] Correspondingly, the present invention also provides a laser radar, comprising: a laser radar chip, an optical component and a scanning device, wherein the laser radar chip comprises: a substrate; an array of light emitting devices, the array of light emitting devices being located on the substrate; an array of light receiving devices, the array of light receiving devices being located on the substrate on one side of the array of light emitting devices; a spectroscopic unit, the spectroscopic unit being configured to transmit the detection light generated by the array of light emitting devices; the detection light is reflected by a target to form an echo light; the spectroscopic unit is also configured to transmit the echo light to the array of light receiving devices; a package body, the package body being located on the substrate and encapsulating the array of light emitting devices, the array of light receiving devices and the spectroscopic unit; the optical component transmits the detection light emitted by the laser radar chip, the detection light transmitted by the optical component is reflected by the scanning device and then emitted; the echo light reflected by the scanning device is transmitted to the laser radar chip via the optical component.

[0023] Optionally, it also includes: a circuit board, which is electrically connected to the laser radar chip.

[0024] Optionally, multiple laser radar chips are fixed and electrically connected to the same circuit board; multiple laser radar chips share optical components and scanning devices.

[0025] Optionally, the scanning device causes the detection light to scan along a first direction; and the plurality of laser radar chips are arranged in an array along a second direction, and the second direction is perpendicular to the first direction.

[0026] Optionally, it includes: multiple laser radar chipsets arranged along the first direction, the laser radar chipsets include multiple laser radar chips, and the multiple laser radar chips in the same laser radar chipset are arranged along the second direction; the multiple laser radar chips in one laser radar chipset are staggered with the multiple laser radar chips in an adjacent laser radar chipset along the second direction.

[0027] Optionally, it includes: a plurality of laser radar chipsets arranged along a first direction, the laser radar chipsets including a plurality of the laser radar chips, and the plurality of the laser radar chips in the same laser radar chipset are arranged along the second direction; at least a portion of the lasers in the light emitting device array / at least a portion of the detectors in the light receiving device array of the laser radar chip in one laser radar chipset and at least a portion of the lasers in the light emitting device array / at least a portion of the detectors in the light receiving device array of the laser radar chip in an adjacent laser radar chipset are staggered along the second direction.

[0028] Compared with the prior art, the technical solution of the present invention has the following advantages:

[0029] In the technical solution of the present invention, the light emitting device array, the light receiving device array and the spectroscopic unit are all located on the same substrate and are packaged in a package to form the laser radar chip. Since the light emitting device array and the light receiving device array are sealed in the same chip, based on the chip packaging process, the patch accuracy of the light emitting device array and the light receiving device array on the substrate can be controlled to the micron (μm) level, which can effectively ensure the high-precision alignment of the emission field of view of the laser in each channel and the receiving field of view of the detector; and the light emitting device array, the light receiving device array and the spectroscopic unit are all located on the same substrate, which can effectively reduce the assembly accuracy and the influence of temperature changes, mechanical deformation, etc. on the emission field of view and the receiving field of view during the use of the laser radar.

[0030] In the laser radar, the light emitting device array and the light receiving device array share the optical assembly and the scanning device, which can effectively overcome the influence of the optical axis offset of the lens group in the optical assembly, the position offset of the scanning device, etc. on the alignment accuracy between the emission field of view of the laser in each channel and the receiving field of view of the detector. Therefore, the scheme of the present invention can effectively improve the alignment accuracy of the emission field of view and the receiving field of view of the laser radar, facilitate the assembly and production of the laser radar, and help reduce the cost of the laser radar, improve the reliability of the laser radar, and realize the high-line-count laser radar. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the prior art descriptions. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without creative work. The drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation to the present invention. In the drawings:

[0032] Figure 1 1 is a schematic diagram of the cross-sectional structure of an embodiment of a laser radar chip of the present invention;

[0033] Figure 2 1 is a schematic diagram of a top view of a laser radar chip according to an embodiment of the present invention;

[0034] Figure 3 Schematic diagram of the optical path structure of the light splitting unit in one embodiment of the laser radar chip of the present invention;

[0035] Figure 4 1 is a schematic diagram of a top view of a light emitting device array and a light emitting device driving module in an embodiment of a laser radar chip of the present invention;

[0036] Figure 5 is a schematic diagram of a top view of a light emitting device array and a light emitting device driving module in another embodiment of a laser radar chip of the present invention;

[0037] Figure 6 is a schematic cross-sectional structure diagram of another embodiment of the laser radar chip of the present invention;

[0038] Figure 7 is a schematic cross-sectional structure diagram of another embodiment of the laser radar chip of the present invention;

[0039] Figure 8 is a schematic diagram of the optical path structure of a light splitting unit in another embodiment of the laser radar chip of the present invention;

[0040] Fig. 9 It is a schematic structural diagram of an embodiment of a laser radar of the present invention;

[0041] Fig.10 yes Fig. 9 An enlarged structural schematic diagram of a plurality of the laser radar chips in the laser radar embodiment shown;

[0042] Fig.11 yes Fig. 9 A schematic diagram of a top view structure of multiple laser radar chips on the circuit board in the laser radar embodiment shown;

[0043] Fig.12 It is a schematic diagram of the top view structure of multiple laser radar chips on a circuit board in another embodiment of the laser radar of the present invention. DETAILED DESCRIPTION

[0044] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present invention. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0045] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0046] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0047] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0048] The disclosure below provides many different embodiments or examples to realize different structures of the present invention. In order to simplify the disclosure of the present invention, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present invention. In addition, the present invention can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplicity and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides various specific examples of processes and materials, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0049] As can be seen from the background technology, the laser radar in the prior art has the problem of transmitting and receiving alignment.

[0050] To solve the technical problem, the present invention provides a laser radar chip, comprising: a substrate; an array of light emitting devices, the array of light emitting devices being located on the substrate; an array of light receiving devices, the array of light receiving devices being located on the substrate on one side of the array of light emitting devices; a spectroscopic unit, the spectroscopic unit being configured to transmit detection light generated by the array of light emitting devices; the detection light being reflected by a target to form echo light; the spectroscopic unit being further configured to transmit the echo light to the array of light receiving devices; a package body, the package body being located on the substrate and encapsulating the array of light emitting devices, the array of light receiving devices and the spectroscopic unit.

[0051] In the laser radar chip, the light emitting device array and the light receiving device array are sealed in the same chip. Based on the chip packaging process, the patch accuracy of the light emitting device array and the light receiving device array can be controlled to the micron (μm) level, which can effectively ensure the high-precision alignment between the emission field of view of the laser in each channel and the receiving field of view of the detector; and the light emitting device array, the light receiving device array and the light splitting unit are all located on the same substrate, which can effectively reduce the assembly accuracy and the influence of temperature change, mechanical deformation and other processes on the emission field of view and the receiving field of view during the use of the laser radar. In the laser radar, the light emitting device array and the light receiving device array share the optical component and the scanning device, which can effectively overcome the influence of the optical axis offset of the lens group in the optical component, the position offset of the scanning device and the like on the alignment accuracy between the emission field of view of the laser in each channel and the receiving field of view of the detector. Therefore, the scheme of the present invention can effectively improve the alignment accuracy of the emission field of view and the receiving field of view of the laser radar, facilitate the assembly and production of the laser radar, and is conducive to reducing the cost of the laser radar, improving the reliability of the laser radar and realizing the high-line laser radar.

[0052] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0053] refer to Figure 1 , shows a schematic diagram of the cross-sectional structure of an embodiment of a laser radar chip of the present invention.

[0054] The laser radar chip includes: a substrate 100; an array of light emitting devices 110, wherein the array of light emitting devices 110 is located on the substrate 100; an array of light receiving devices 120, wherein the array of light receiving devices 120 is located on the substrate 100 on one side of the array of light emitting devices 110; a spectroscopic unit 130, wherein the spectroscopic unit 130 is configured to transmit the detection light 101 generated by the array of light emitting devices 110; the detection light 101 is reflected by a target to form an echo light 102; the spectroscopic unit 130 is also configured to transmit the echo light 102 to the array of light receiving devices 120; and a package body 140, wherein the package body 140 is located on the substrate 100 and encapsulates the array of light emitting devices 110, the array of light receiving devices 120 and the spectroscopic unit 130.

[0055] It should be noted that Figure 1 The optical paths of the detection light 101 and the echo light 102 are only examples, and the present invention is not limited thereto.

[0056] The light emitting device array 110 and the light receiving device array 120 are sealed in the same chip. Based on the chip packaging process, the mounting accuracy of the light emitting device array 110 and the light receiving device array 120 on the substrate can be controlled to the micron (μm) level, which can effectively ensure the high-precision alignment of the emission field of view of each channel laser and the receiving field of view of the detector; and the light emitting device array 110, the light receiving device array 120 and the spectrometer unit 130 are all located on the same substrate 100, which can effectively reduce the assembly accuracy and the influence of temperature changes, mechanical deformation and other processes on the emission field of view and the receiving field of view during the use of the laser radar.

[0057] When applied to laser radar, the solution of the present invention can effectively improve the alignment accuracy of the laser radar's transmitting field of view and receiving field of view, facilitate the assembly and production of the laser radar, and is beneficial to reducing the cost of the laser radar, improving the reliability of the laser radar and realizing a high-line-count laser radar.

[0058] The technical solution of the laser radar chip embodiment of the present invention is described in detail below with reference to the accompanying drawings.

[0059] The substrate 100 is used to carry the devices disposed thereon, and is also used to realize electrical connection between the devices and external circuits and circuit boards.

[0060] It should be noted that, in some embodiments, the substrate 100 has a conductive structure, and the conductive structure is used to achieve electrical connection.

[0061] The light emitting device array 110 is located on one surface of the substrate 100 to generate detection light 101. The light receiving device array 120 is located on the substrate 100 at one side of the light emitting device array 110 to receive echo light 102.

[0062] Combined with reference Figure 2 In some embodiments of the present invention, the light emitting device array 110 includes a plurality of lasers 111, and the plurality of lasers 111 are arranged in an array on the substrate 100; the light receiving device array 120 includes a plurality of detectors 121, and the plurality of detectors 121 are arranged in an array on the substrate 100.

[0063] It should be noted that, in some embodiments of the present invention, the laser 111 is a vertical cavity surface emitting laser, that is, a Vertical Cavity Surface Emitting Laser, VCSEL. In some embodiments of the present invention, the detector is a single photon detector, such as a single photon avalanche diode (SPAD) or a silicon photomultiplier (SiPM).

[0064] like Figure 2 As shown, the plurality of lasers 111 are arranged in a one-dimensional array on the surface of the substrate 100, and the light emitting device array 110 is arranged in a linear array; the plurality of detectors 121 are arranged in a one-dimensional array on the surface of the substrate 100, and the light receiving device array 120 is arranged in a linear array.

[0065] Continue to refer Figure 1 and Figure 2 In some embodiments of the present invention, the laser radar chip also includes: a light emitting device driving module 112, which is located on the substrate 100 and is electrically connected to the light emitting device array 110 and the substrate 100; and a light receiving device driving module 122, which is located on the substrate 100 and is electrically connected to the light receiving device array 120 and the substrate 100.

[0066] Figure 1 and Figure 2 In some embodiments shown, the light emitting device array 110 and the light emitting device driving module 112 are arranged on the substrate 100 in a tiled structure. Specifically, the light emitting device array 110 and the light emitting device driving module 112 are arranged on the same surface of the substrate 100, and the light emitting device driving module 112 is located on one side of the light emitting device array 110.

[0067] Similarly, the light receiving device array 120 and the light receiving device driving module 122 are arranged on the substrate 100 in a tiled structure. Specifically, the light receiving device array 120 and the light receiving device driving module 122 are arranged on the same surface of the substrate 100, and the light receiving device driving module 122 is located on one side of the light receiving device array 120.

[0068] In some embodiments of the present invention, the light emitting device array 110 and the light receiving device array 120 are located between the light emitting device driving module 112 and the light receiving device driving module 122. Figure 1 and Figure 2 As shown, the light emitting device array 110 and the light receiving device array 120 are arranged in parallel on the surface of the substrate 100; the light emitting device driving module 112 is located on the side of the light emitting device array 110 away from the light receiving device array 120; the light receiving device driving module 122 is located on the side of the light receiving device array 120 away from the light emitting device array 110, that is, the light emitting device driving module 112, the light emitting device array 110, the light receiving device array 120 and the light receiving device driving module 122 are arranged in sequence on the surface of the substrate 100.

[0069] In some embodiments of the present invention, electrical connection between devices is achieved by bonding wires. Specifically, electrical connection is achieved between the light emitting device array 110 and the light emitting device driving module 112, between the light emitting device driving module 112 and the substrate 100, between the light receiving device array 120 and the light receiving device driving module 122, and between the light receiving device driving module 122 and the substrate 100 by bonding wires.

[0070] Specifically, the multiple lasers 111 of the light emitting device array 110, the multiple detectors 121 of the light receiving device array 120, and the light emitting device driving module 112 and the light receiving device driving module 122 are respectively mounted on the surface of the substrate 100; then, the pads of the multiple lasers 111 and the light emitting device driving module 112 and the bonding pads of the multiple detectors 121 and the light receiving device driving module 122 are respectively connected through bonding wires; similarly, the light emitting device driving module 112 and the substrate 100, and the light receiving device driving module 122 and the substrate 100 are respectively connected through bonding wires.

[0071] Continue to refer Figure 1 and Figure 2The optical splitting unit 130 of the laser radar chip is used to transmit the detection light 101 and the echo light 102 and separate the optical paths of the detection light 101 and the echo light 102.

[0072] In some embodiments of the present invention, the light emitting surface of the light emitting device array 110 is arranged to face away from the substrate 100, and the photosensitive surface of the light receiving device array 120 is also arranged to face away from the substrate 100; the detection light 101 generated by the light emitting device array 110 is emitted from the light emitting surface along a direction A facing away from the substrate 100, and the echo light 102 formed by the reflection of the detection light 101 by the target outside the laser radar is incident on the photosensitive surface along a direction toward the substrate 100; the spectroscopic unit 130 is located on the side of the light emitting device array 110 and the light receiving device array 120 away from the substrate 100, for transmitting the detection light 101 and the echo light 102, and covering the light emitting surface of the light emitting device array 110 and the photosensitive surface of the light receiving device array 120, that is, on the surface of the substrate 100, the projection of the light emitting surface and the projection of the photosensitive surface are both within the projection range of the spectroscopic unit 130.

[0073] It should be noted that if Figure 1 In some specific embodiments shown, the laser radar chip also includes: a light-transmitting adhesive portion 150, which is located on the side of the spectroscopic unit 130 facing the substrate 100; the spectroscopic unit 130 is fixedly connected to the light receiving device array 120 and the light emitting device array 110 through the light-transmitting adhesive portion 150.

[0074] The light-transmitting adhesive portion 150 is located between the light receiving device array 120 and the light emitting device array 110 to achieve fixed connection between the light splitting unit 130, the light receiving device array 120 and the light emitting device array 110. Specifically, the material of the light-transmitting adhesive portion 150 may be a light-transmitting adhesive material.

[0075] Continue to refer Figure 1 , combined with reference Figure 3 The light splitting unit 130 includes a light splitting element 131, wherein the light splitting element 131 is configured to split the detection light 101 ( Figure 3 The optical path of the echo light 102 ( Figure 3 Specifically, the optical path of the detection light 101 between the light emitting device array 110 and the spectroscopic element 131 is separated from the optical path of the echo light 102 between the light receiving device array 120 and the spectroscopic element 131, and the spectroscopic element 131 is a polarization spectrometer.

[0076] like Figure 3In some of the embodiments shown, the detection light 101 is emitted from the light emitting device array 110 along a direction perpendicular to the surface of the substrate 100; the echo light 102 is incident on the light receiving device array 120 along a direction perpendicular to the surface of the substrate 100; the spectroscopic unit 130 also includes: a light deflection element 132, wherein the light deflection element 132 is located in the optical path of the detection light 101, and the light deflection element 132 is configured to deflect the detection light 101 to the spectroscopic element 131.

[0077] The light deflection element 132 is located on one side of the light splitting element 131, and the light deflection element 132 is used to deflect the detection light 101, so that the optical path of the detection light 101 and the optical path of the echo light 102 are partially parallel, specifically, the optical path of the detection light 101 between the light emitting device array 110 and the light deflection element 132 is parallel to the optical path of the echo light 102 between the light receiving device array 120 and the light splitting element 131, and the detection light 101 and the echo light 102 are both perpendicular to the surface of the substrate 100, so that the multiple lasers 111 in the light emitting device array 110 and the multiple detectors 121 in the light receiving device array 120 are arranged on the substrate 100 and are located on the same side of the light splitting element 130. Specifically, the light deflection element 132 is a prism.

[0078] like Figure 3 As shown, the detection light 101 incident on the light deflection element 132 is totally reflected on the surface 132a to be projected onto the spectroscopic element 131; the spectroscopic element 131 folds the detection light 101 again, thereby realizing the emission of the detection light 101; the echo light 102 formed by the reflection of the detection light 101 by the target outside the laser radar is incident on the spectroscopic element 131 along an optical path coaxial with the emitted detection light 101, and the echo light 102 directly transmits the spectroscopic element 131 and is projected onto the light receiving device array 120 to realize detection.

[0079] It should be noted that if Figure 3 In some of the embodiments shown, the light deflection element 132 is located in the optical path of the detection light 101 to deflect the detection light 101, so the position of the light deflection element 132 corresponds to the positions of the multiple lasers 111 in the light emitting device array 110. Specifically, as shown in the figure, the light deflection element 132 is located above the laser 111 in the light emitting device array 110; the echo light 102 directly transmits the spectroscopic element 131, that is, the optical path direction of the echo light 102 does not change, so the position of the spectroscopic element 131 corresponds to the position of the detector 121 of the light receiving device array 120. Specifically, as shown in the figure, the spectroscopic element 131 is located above the detector 121 of the light receiving device array 120.

[0080] It should also be noted that the spectroscopic element 131 deflects part of the detection light 101 to achieve the emission of the detection light 101; a light absorbing layer is provided on the surface of the spectroscopic element 131 facing away from the light deflection element 132 to absorb the detection light 101 transmitting the spectroscopic element 131.

[0081] Continue to refer Figure 3 In some embodiments of the present invention, the spectroscopic unit 130 further includes: a focusing element, which is located in the optical path of the detection light 101 and is suitable for adjusting the focal length. The focusing element is configured so that the light emitting device array 110 and the light receiving device array 120 are both arranged on the substrate 100.

[0082] By setting a focusing element in the optical path of the detection light 101, the focal length of the optical system in the optical path of the detection light 101 is changed (specifically extended), so that the focal length of the optical system in the optical path of the detection light 101 (specifically the focal length of the optical system including a common lens group and a focusing element) is different from the focal length of the optical system in the optical path of the echo light 102, and then the focal length is reasonably adjusted by the focusing element, so that the light emitting device array 110 and the light receiving device array 120 are both arranged on the substrate 100.

[0083] like Figure 3 In some specific embodiments shown, the focusing element includes: a first lens 133a, wherein the first lens 133a is located upstream of the light deflection element 132 in the optical path of the detection light 101, so as to transmit the detection light 101 to be incident on the light deflection element 132; and a second lens 133b, wherein the second lens 133b is located downstream of the light deflection element 132 in the optical path of the detection light 101, and the detection light 101 deflected by the light deflection element 132 is incident on the spectroscopic element 131 after being transmitted through the second lens 133b.

[0084] Specifically, the first lens 133a is a gradient refractive index lens; the second lens 133b is a gradient refractive index lens. A gradient refractive index lens, also known as a self-focusing lens, is a cylindrical optical lens whose internal material refractive index distribution gradually changes along the radial direction. Figure 3 In some of the embodiments shown, in the gradient index lens, the light beam incident and light beam exiting surfaces are both planes.

[0085] Therefore, in some specific embodiments, the spectroscopic element 130 is in a combined form, that is, the first lens 133a and the second lens 133b are both gradient refractive index lenses, and the first lens 133a, the light deflection element 132, the second lens 133b and the spectroscopic element 131 are integrally formed.

[0086] Continue to refer Figure 1The package body 140 is suitable for packaging all components in the laser radar chip to achieve the encapsulation, placement, fixation and protection of each component.

[0087] The material of the package body 140 may be a light-proof adhesive. Figure 1 In some embodiments shown, the material of the package body 140 may be a polymer. The package body 140 may be formed by a T-Mold or C-Mold process to achieve overall packaging.

[0088] Specifically, the package body 140 is located on the substrate 100 and covers all components on the substrate 100. Figure 1 As shown, the packaging body 140 is filled between the light emitting device array 110 , the light receiving device array 120 , the light splitting unit 130 , the light emitting device driving module 112 and the light receiving device driving module 122 , and covers their respective surfaces.

[0089] It should be noted that the package 140 encapsulates the light emitting device array 110, the light receiving device array 120, the spectrometer unit 130, the light emitting device driving module 112 and the light receiving device driving module 122; in order to ensure the transmission of the detection light 101 and the echo light 102, the package 140 does not cover the surface of the spectrometer unit 130 used to transmit the detection light 101 and the echo light 102.

[0090] By encapsulating all components through the package body 140, the light emitting device array 110 and the light receiving device array 120 are set on the same substrate 100, and the patch accuracy of the light emitting device array 110 and the light receiving device array 120 is controlled to the micron (μm) level, which can effectively ensure the high-precision alignment of the emission field of view of the laser in each channel and the receiving field of view of the detector; the package body 140 fills the space between the components to fix the distance between the components, and the laser radar chip is used as a whole, which can effectively reduce the assembly accuracy and the influence of temperature changes, mechanical deformation and other processes on the emission field of view and the receiving field of view during the use of the laser radar.

[0091] It should be noted that if Figure 2 and 4 In some of the illustrated embodiments, the light emitting device array 110 and the light receiving device array 120 are both arranged in a linear array.

[0092] like Figure 4In some of the illustrated embodiments, the plurality of lasers (not shown in the figure) of the light emitting device array 210 are arranged in a single row on the surface of a substrate (not shown in the figure), and the light emitting device array 210 is arranged in a linear array; the light emitting device driving modules 212 are located on both sides of the light emitting device array 210, and the light emitting device driving modules 212 on both sides are electrically connected to the two sides of the light emitting device array 210, respectively.

[0093] It should be noted that in some embodiments, the arrangement of the multiple detectors of the light receiving device array can refer to Figure 4 The arrangement of the plurality of lasers in the light emitting device array 210 is shown in FIG. Only the arrangement and gating of the light receiving device driving module and the light emitting device driving module 212 are different.

[0094] In other embodiments of the present invention, the multiple lasers of the light emitting device array and the multiple detectors of the light receiving device array may also be arranged in a planar array.

[0095] like Figure 5 In some specific embodiments shown, the multiple lasers 311 of the light emitting device array 310 constitute a plurality of emitter groups arranged along a first direction X, and each emitter group includes a plurality of lasers 311 arranged along a second direction Y; in the second direction Y, each laser 311 of an emitter group is respectively located between two lasers 311 of adjacent emitter groups.

[0096] It should be noted that Figure 5 The arrangement of the two emitter groups in the array of light emitting devices arranged in a planar array along the first direction X is only an example. In other embodiments of the present invention, a larger number of emitter groups may be arranged along the first direction X, and the lasers of adjacent emitter groups along the first direction X are staggered along the second direction Y, that is, along the second direction Y, each laser of an emitter group is located between two lasers of adjacent emitter groups.

[0097] also, Figure 5 The two emitter groups in the light emitting device array shown in the figure and the arrangement of more emitter groups in other embodiments to form an irregular matrix are only examples. In other embodiments of the present invention, multiple emitter groups in the light emitting device array arranged in a planar array can also be regularly arranged to form a regular matrix.

[0098] In some embodiments, the arrangement of the multiple detectors of the light receiving device array can refer to Figure 5The arrangement of the plurality of lasers 311 of the light emitting device array 310 is shown in FIG. Only the arrangement and gating method of the light receiving device driving module and the light emitting device driving module 312 are different. Specifically, the plurality of detectors of the light receiving device array constitute a plurality of receiver groups arranged along the first direction X, and each receiver group includes a plurality of detectors arranged along the second direction Y; in the second direction Y, each detector of a receiver group is located between two detectors of adjacent receiver groups.

[0099] It should also be noted that Figure 1 and Figure 2 In some specific embodiments shown, a light emitting device array 110, a light receiving device array 120, a light emitting device driving module 112, and a light receiving device driving module 122 are arranged in a flat structure on a substrate 100. In other embodiments of the present invention, the light emitting device array and the light emitting device driving module and the light receiving device array and the light receiving device driving module may also be arranged in a stacked structure.

[0100] like Figure 6 In some of the embodiments shown, the light emitting device driving module 412 and the light emitting device array 410 are stacked sequentially on the surface of the substrate 400 ; the light receiving device driving module 422 and the light receiving device array 420 are stacked sequentially on the surface of the substrate 400 .

[0101] In some embodiments of the present invention, in a stacked structure, electrical connection between components is achieved through contacting bonding surfaces. Figure 6 As shown, electrical connection can be achieved between the light emitting device driving module 412 and the light emitting device array 410, between the light emitting device driving module 412 and the substrate 400, between the light receiving device driving module 422 and the light receiving device array 420, and between the light receiving device driving module 422 and the substrate 400 by means of insulating bonding or metal bonding.

[0102] refer to Figure 7 , shows a schematic diagram of the cross-sectional structure of another embodiment of the laser radar chip of the present invention.

[0103] The present invention will not repeat the same points as the above-mentioned embodiments. The difference from the above-mentioned embodiments is that in some embodiments, the light emitting device array and the light receiving device array are located on both sides of the light emitting device driving module and the light receiving device driving module to increase the distance between the laser of the light emitting device array and the detector of the light receiving device array, thereby reducing the difficulty of chip manufacturing process.

[0104] In some embodiments of the present invention, the light emitting device driving module 512 and the light receiving device driving module 522 are located between the light emitting device array 510 and the light receiving device array 520 .

[0105] Specific as Figure 7 As shown, the light emitting device array 510 and the light receiving device array 520 are arranged in parallel on the surface of the substrate 500; the light emitting device driving module 512 is located on the side of the light emitting device array 510 close to the light receiving device array 520; the light receiving device driving module 522 is located on the side of the light receiving device array 520 close to the light emitting device array 510, that is, the light emitting device array 510, the light emitting device driving module 512, the light receiving device driving module 522 and the light receiving device array 520 are arranged in sequence on the surface of the substrate 500.

[0106] also, Figure 7 In some specific embodiments shown, electrical connection between devices is achieved by bonding wires. The light emitting device array 510 and the light emitting device driving module 512 are both provided with bonding wires to achieve electrical connection with the substrate 500; the light receiving device array 520 and the light receiving device driving module 522 are both provided with bonding wires to achieve electrical connection with the substrate 500.

[0107] Specifically, the light emitting device array 510, the light receiving device array 520, the light emitting device driving module 512, and the light receiving device driving module 522 are respectively mounted on the surface of the substrate 500; then, the bonding pads of the laser, the detector, the light emitting device driving module 512, and the light receiving device driving module 522 are connected to the substrate 500 using bonding wires formed by an ultra-low wire arc bonding (bonding wire low arc bonding) process.

[0108] It should be noted that Figure 1 In some embodiments shown in the figure, the laser of the light emitting device array 510 is electrically connected to the light emitting device driving module 512, and then electrically connected to the substrate 500 through the light emitting device driving module 512. Figure 1 Some of the embodiments shown are different. Figure 7 In some of the illustrated embodiments, the lasers of the light emitting device array 110 are directly electrically connected to the substrate 100 via bonding wires.

[0109] In addition, another difference from the above-mentioned embodiment is that the light splitting unit is in a split form. Figure 8As shown, in the light splitting unit 530 , the first lens 533 a and the second lens 533 b are convex lenses; the first lens 533 a , the light deflection element 532 and the second lens 533 b are integrally formed and separated from the light splitting element 531 .

[0110] Accordingly, the present invention also provides a laser radar. Fig. 9 , the laser radar includes: a laser radar chip 610, an optical component 620 and a scanning device 630, wherein the laser radar chip 610 includes: a substrate; an array of light emitting devices, the array of light emitting devices is located on the substrate; an array of light receiving devices, the array of light receiving devices is located on the substrate on one side of the array of light emitting devices; a spectroscopic unit, the spectroscopic unit is configured to transmit the detection light generated by the array of light emitting devices; the detection light is reflected by the target to form an echo light 102; the spectroscopic unit is also configured to transmit the echo light 102 to The light receiving device array; a package body, which is located on the substrate and encapsulates the light emitting device array, the light receiving device array and the spectroscopic unit; the optical component 620 transmits the detection light emitted by the laser radar chip 610, and the detection light transmitted by the optical component 620 is reflected by the scanning device 630 and then emitted from the laser radar; the target 640 reflects the detection light to form an echo light 102, and the echo light 102 reflected by the scanning device 630 is transmitted to the laser radar chip 610 via the optical component 620.

[0111] Combined with reference Figures 1 to 3 , showing Fig. 9 A schematic diagram of the structure of the laser radar chip described in the laser radar embodiment is shown.

[0112] like Figures 1 to 3 As shown, the laser radar chip includes: a substrate 100; a light emitting device array 110, the light emitting device array 110 is located on the substrate 100; a light receiving device array 120, the light receiving device array 120 is located on the substrate 100 on one side of the light emitting device array 110; a spectroscopic unit 130, the spectroscopic unit 130 is configured to transmit the detection light generated by the light emitting device array 110; the detection light is reflected by the target to form an echo light 102; the spectroscopic unit 130 is also configured to transmit the echo light 102 to the light receiving device array 120; a package body 140, the package body 140 is located on the substrate 100 and encapsulates the light emitting device array 110, the light receiving device array 120 and the spectroscopic unit 130.

[0113] In some specific embodiments, the laser radar chip 610 is the laser radar chip of the present invention. Therefore, the specific technical solution of the laser radar chip 610 refers to the specific embodiment of the aforementioned laser radar chip, and the present invention will not be repeated here.

[0114] The light emitting device array 110, the light receiving device array 120 and the spectroscopic unit 130 are all located on the same substrate 100 and are packaged in a package body 140 to form the laser radar chip 610. The laser radar chip 610 is used as a whole, which can effectively reduce the impact of the assembly process on the optical path between the light emitting device array 110, the light receiving device array 120 and the spectroscopic unit 130, effectively improve the alignment accuracy of the laser radar's transmitting field of view and receiving field of view, facilitate the assembly and production of the laser radar, and is conducive to reducing the cost of the laser radar, improving the reliability of the laser radar, and realizing a high-line-count laser radar.

[0115] The laser radar further includes a circuit board 611, and the circuit board 611 is electrically connected to the laser radar chip 610. The laser radar chip 610 is fixed to the surface of the circuit board 611 and is electrically connected to the circuit board 611. Specifically, the laser radar chip 610 is electrically connected to the circuit board 611 through solder balls 612 (such as Figure 1 As shown) is electrically connected to the circuit board 611.

[0116] like Fig.10 In some specific embodiments shown, the laser radar includes a plurality of the laser radar chips 610 ; the plurality of the laser radar chips 610 are fixed and electrically connected to the same circuit board 611 .

[0117] Combined with reference Fig.11 , showing Fig. 9 A schematic diagram of the top view structure of multiple laser radar chips 610 on the circuit board 611 in the laser radar embodiment shown.

[0118] In some specific embodiments, the laser radar includes: a plurality of laser radar chipsets 613, the plurality of laser radar chipsets 613 are arranged along a first direction X, the laser radar chipset 613 includes a plurality of laser radar chips 610, and the plurality of laser radar chips 610 in the same laser radar chipset 613 are arranged along the second direction Y. The plurality of laser radar chips 610 in one laser radar chipset are staggered with the plurality of laser radar chips 610 in an adjacent laser radar chipset along the second direction Y. Fig.11As shown, the laser radar includes: a laser radar chipset 613a and a laser radar chipset 613b, and the laser radar chipset 613a and the laser radar chipset 613b are adjacently arranged along the first direction X, that is, no other laser radar chip is arranged between the laser radar chipset 613a and the laser radar chipset 613b.

[0119] It should be noted that in other embodiments of the present invention, the multiple laser radar chips of the laser radar chips group can also be arranged flush with the multiple laser radar chips of the adjacent laser radar chips group along the second direction, that is, the multiple laser radar chips of one laser radar chips group are arranged flush with the multiple laser radar chips of the adjacent laser radar chips group along the second direction Y.

[0120] The multiple laser radar chips 610 of the laser radar chips group 613a and the multiple laser radar chips 610 of the laser radar chips group 613b are staggered along the second direction Y, that is, along the second direction Y, the laser radar chips 610 of the laser radar chips group 613a are located between two adjacent laser radar chips 610 of the laser radar chips group 613b, and each laser radar chip 610 of the laser radar chips group 613b is located between two adjacent laser radar chips 610 of the laser radar chips group 613a.

[0121] It should be noted that Fig.11 The arrangement of the two laser radar chipsets in the first direction X is only an example. In other embodiments of the present invention, a larger number of laser radar chipsets may be arranged along the first direction X. And the laser radar chips of adjacent laser radar chipsets along the first direction X are staggered along the second direction Y, that is, along the second direction Y, each laser radar chip of a laser radar chipset is located between two laser radar chips of adjacent laser radar chipsets.

[0122] like Fig. 9 and Fig.11 In some embodiments shown, the light emitting device array of each laser radar chip 610 has 32 lasers, and the light receiving device array has 32 detectors, that is, each laser radar chip 610 has 32 channels. Eight laser radar chips 610 constitute 256 channels. Under the premise of ensuring that 256 channels are set on the circuit board, Fig.11 The arrangement shown can effectively reduce the size of the circuit board.

[0123] In some specific embodiments, the laser radar is a vehicle-mounted laser radar. The detection range of the vehicle-mounted laser radar is mainly concentrated on the ground and its vicinity, and the circuit board is arranged vertically to the horizontal plane; Fig.11The arrangement shown can effectively reduce the height of the laser radar.

[0124] Continue to refer Fig. 9 The laser radar also includes: an optical component 620 and a scanning device 630, which are used to transmit and receive the detection light and the echo light.

[0125] Specifically, the detection light emitted by the laser radar chip 610 is transmitted to the scanning device 630 by the optical component 620, and the scanning device 630 reflects the detection light to realize the emission of the detection light; the echo light formed by the reflection of the detection light by the target 640 is received by the scanning device 630, and the scanning device 630 reflects the echo light to the optical component 620, and the echo light is transmitted to the laser radar chip 610 via the optical component 620.

[0126] In some embodiments of the present invention, multiple laser radar chips 610 share an optical component 620 and a scanning device 630. The light emitting device array 110 and the light receiving device array 120 share an optical component 620 and a scanning device 630, which can effectively overcome the influence of the optical axis offset of the lens group in the optical component, the position offset of the scanning device, etc. on the alignment accuracy between the transmitting field of view of the laser in each channel and the receiving field of view of the detector. Therefore, the scheme of the present invention can effectively improve the alignment accuracy of the transmitting field of view and the receiving field of view of the laser radar, facilitate the assembly and production of the laser radar, and help reduce the cost of the laser radar, improve the reliability of the laser radar, and realize the high-line-count laser radar.

[0127] In some specific embodiments, a plurality of the laser radar chips 610 share one optical component 620 and one scanning device 630. However, the present invention does not limit the number of optical components 620 and scanning devices 630 included in the laser radar.

[0128] In some embodiments of the present invention, the scanning device 630 scans the detection light along the first direction X; the plurality of laser radar chips 610 are arranged in an array along the second direction Y, and the second direction Y is perpendicular to the first direction X. In some specific embodiments, the laser radar is a vehicle-mounted laser radar, and the detection range of the vehicle-mounted laser radar is mainly concentrated on the ground and its vicinity, the first direction X is parallel to the horizontal plane, and the second direction Y is perpendicular to the horizontal plane.

[0129] It should be noted that the first direction X is the scanning direction of the scanning device 630, and the second direction is the arrangement direction of the multiple laser radar chips 610. The selection of the first direction X and the second direction Y is related to the field of view of the laser radar, that is, when the field of view of the laser radar changes, the scanning direction of the scanning device 630 and the arrangement direction of the multiple laser radar chips 610 will also change accordingly. The present invention does not limit the scanning direction of the scanning device and the arrangement direction of the multiple laser radar chips. It should also be noted that, Fig. 9 and Fig.11 In some of the embodiments shown, the multiple laser radar chips of a laser radar chipset are staggered with the multiple laser radar chips of an adjacent laser radar chipset along the second direction Y. In other embodiments of the present invention, the multiple laser radar chipsets may also be arranged in other ways, such as arranging more laser radar chipsets along the first direction X, or arranging the multiple laser radar chips 610 in a row along the second direction, or arranging the multiple laser radar chips 610 in the same way as the arrangement of the multiple lasers.

[0130] like Fig.12 In some specific embodiments shown, at least a portion of the lasers in the light emitting device array / at least a portion of the detectors in the light receiving device array of the lidar chip of one lidar chipset are alternately arranged along the second direction Y with at least a portion of the lasers in the light emitting device array / at least a portion of the detectors in the light receiving device array of the lidar chip of an adjacent lidar chipset.

[0131] Specifically, the laser radar includes: a first laser radar chipset and a second laser radar chipset, the first laser radar chipset and the second laser radar chipset are adjacently arranged along a first direction, that is, no other laser radar chip is arranged between the first laser radar chipset and the second laser radar chipset.

[0132] At least a portion of the lasers in the multiple laser radar chips 710a of the first laser radar chips group and at least a portion of the lasers in the multiple laser radar chips 710b of the second laser radar chips group are staggered along the second direction Y, that is, along the second direction Y, each laser of the laser radar chip 710a in the first laser radar chips group is located between two adjacent lasers of the adjacent laser radar chips 710b in the second laser radar chips group.

[0133] Specifically, Fig.12In some of the illustrated embodiments, a center line 711b of the laser of the laser radar chip 710b in the second laser radar chipset along the second direction Y is located between a center line 711a of the laser of the laser radar chip 710a in the first laser radar chipset along the second direction Y and a center line 712a of the laser of the laser radar chip 710a in the first laser radar chipset along the second direction Y.

[0134] It should be noted that in some embodiments, the arrangement of multiple detectors in the light receiving device array of the laser radar can refer to Fig.12 The arrangement of the multiple lasers in the light emitting device array shown in . Only the arrangement and gating method of the light receiving device driver module are different from those of the light emitting device driver module. Specifically, at least part of the detectors in the multiple laser radar chips of the first laser radar chips group and at least part of the detectors in the multiple laser radar chips of the second laser radar chips group are staggered along the second direction Y, that is, along the second direction, the detector of the laser radar chip in the first laser radar chips group is located between the adjacent two detectors of the laser radar chips in the adjacent second laser radar chips group.

[0135] In summary, the light emitting device array and the light receiving device array are sealed in the same chip. Based on the chip packaging process, the patch accuracy of the light emitting device array and the light receiving device array can be controlled to the micron (μm) level, which can effectively ensure the high-precision alignment between the emission field of view of the laser in each channel and the receiving field of view of the detector; and the light emitting device array, the light receiving device array and the light splitting unit are all located on the same substrate, which can effectively reduce the assembly accuracy and the influence of temperature change, mechanical deformation and other processes on the emission field of view and the receiving field of view during the use of the laser radar. In the laser radar, the light emitting device array and the light receiving device array share optical components and scanning devices, which can effectively overcome the influence of the optical axis offset of the lens group in the optical component, the position offset of the scanning device, etc. on the alignment accuracy between the emission field of view of the laser in each channel and the receiving field of view of the detector. Therefore, the scheme of the present invention can effectively improve the alignment accuracy of the emission field of view and the receiving field of view of the laser radar, facilitate the assembly and production of the laser radar, and is conducive to reducing the cost of the laser radar, improving the reliability of the laser radar and realizing the high-line laser radar.

[0136] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the claims.

Claims

1. A laser radar chip, characterized in that: include: substrate; a light emitting device array, the light emitting device array being located on the substrate; A light receiving device array, the light receiving device array being located on a substrate on one side of the light emitting device array; a spectroscopic unit, the spectroscopic unit being configured to transmit the detection light generated by the light emitting device array; the detection light is reflected by a target to form an echo light; the spectroscopic unit is also configured to transmit the echo light to the light receiving device array; A packaging body is located on the substrate and packages the light emitting device array, the light receiving device array and the light splitting unit.

2. The laser radar chip according to claim 1, characterized in that: The light emitting device array includes a plurality of lasers, and the plurality of lasers are arranged in an array on the substrate; The light receiving device array includes a plurality of detectors, and the plurality of detectors are arranged in an array on the substrate.

3. The laser radar chip according to claim 1, characterized in that: Also includes: A light emitting device driving module, the light emitting device driving module is located on the substrate and is electrically connected to the light emitting device array and the substrate; The light receiving device driving module is located on the substrate and is electrically connected to the light receiving device array and the substrate.

4. The laser radar chip according to claim 3, characterized in that: The light emitting device driving module and the light receiving device driving module are located between the light emitting device array and the light receiving device array; Alternatively, the light emitting device array and the light receiving device array are located between the light emitting device driving module and the light receiving device driving module.

5. The laser radar chip according to claim 1, characterized in that: Also includes: a light-transmitting adhesive portion, the light-transmitting adhesive portion being located on a side of the light-splitting unit facing the substrate; The light splitting unit is fixed to the light receiving device array and the light emitting device array through the light-transmitting adhesive portion.

6. The laser radar chip according to claim 1, characterized in that: The light splitting unit comprises: A spectroscopic element is configured to separate an optical path of the probe light from an optical path of the echo light.

7. The laser radar chip according to claim 6, characterized in that: The beam splitting element is a polarization beam splitter.

8. The laser radar chip according to claim 6, characterized in that: The detection light is emitted from the light emitting device array in a direction perpendicular to the substrate surface; The echo light is incident on the light receiving device array along a direction perpendicular to the substrate surface; The spectroscopic unit further includes: a light deflection element, which is located in the optical path of the detection light and is configured to deflect the detection light to the spectroscopic element.

9. The laser radar chip according to claim 8, characterized in that: The spectroscopic unit further includes a focusing element, which is located in the optical path of the detection light and is configured so that both the light emitting device array and the light receiving device array are disposed on the substrate.

10. The laser radar chip according to claim 9, characterized in that: The focusing element comprises: a first lens, the first lens being located upstream of the light deflection element in the optical path of the detection light so as to transmit the detection light to be incident on the light deflection element; The second lens is located downstream of the light deflection element in the optical path of the detection light. The detection light deflected by the light deflection element is transmitted through the second lens and then incident on the beam splitter element.

11. The laser radar chip according to claim 10, characterized in that: The first lens, the light deflection element and the second lens are integrally formed.

12. The laser radar chip according to claim 11, characterized in that: The first lens is a convex lens or a gradient refractive index lens; the second lens is a convex lens or a gradient refractive index lens.

13. The laser radar chip according to claim 12, characterized in that: The second lens is a gradient refractive index lens, and the first lens, the light deflection element, the second lens and the light splitting element are integrally formed.

14. A laser radar, characterized in that: include: A laser radar chip, an optical component and a scanning device, wherein the laser radar chip comprises: substrate; a light emitting device array, the light emitting device array being located on the substrate; A light receiving device array, the light receiving device array being located on a substrate on one side of the light emitting device array; a spectroscopic unit, the spectroscopic unit being configured to transmit the detection light generated by the light emitting device array; the detection light is reflected by a target to form an echo light; the spectroscopic unit is also configured to transmit the echo light to the light receiving device array; A packaging body, the packaging body is located on the substrate and packages the light emitting device array, the light receiving device array and the light splitting unit; The optical component transmits the detection light emitted by the laser radar chip, and the detection light transmitted by the optical component is reflected by the scanning device and then emitted; the echo light reflected by the scanning device is transmitted to the laser radar chip through the optical component.

15. The laser radar according to claim 14, characterized in that: Also includes: A circuit board is electrically connected to the laser radar chip.

16. The laser radar according to claim 14, characterized in that: A plurality of the laser radar chips are fixed and electrically connected to the same circuit board; Multiple laser radar chips share optical components and scanning devices.

17. The laser radar according to claim 15, characterized in that: The scanning device causes the detection light to scan along a first direction; The plurality of laser radar chips are arranged in an array along a second direction, and the second direction is perpendicular to the first direction.

18. The laser radar according to claim 17, characterized in that: include: A plurality of laser radar chipsets arranged along the first direction, the laser radar chipsets comprising a plurality of the laser radar chips, and the plurality of the laser radar chips in the same laser radar chipset are arranged along the second direction; The multiple laser radar chips of one laser radar chips group are arranged alternately with the multiple laser radar chips of an adjacent laser radar chips group along the second direction.

19. The laser radar according to claim 17, characterized in that: include: A plurality of laser radar chipsets arranged along a first direction, wherein the laser radar chipsets include a plurality of the laser radar chips, and the plurality of the laser radar chips in the same laser radar chipset are arranged along the second direction; At least a portion of the lasers in the light emitting device array / at least a portion of the detectors in the light receiving device array in the laser radar chip of one laser radar chip group are alternately arranged along the second direction with at least a portion of the lasers in the light emitting device array / at least a portion of the detectors in the light receiving device array in the laser radar chip of an adjacent laser radar chip group.

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