Display panel, preparation method thereof and display device

Abstract

The embodiment of the invention provides a display panel, a preparation method thereof and a display device, the display panel comprises a display panel and a driving device, the display panel comprises a substrate and a bare chip, and the bare chip comprises a wiring area extending to the outer side of the substrate; the driving device comprises a driving chip, a rigid circuit board and a flexible circuit board, the driving chip is arranged on the rigid circuit board, the flexible circuit board is connected with the rigid circuit board, one end, far away from the rigid circuit board, of the flexible circuit board forms a binding end, and two opposite surfaces of the binding end respectively define a first binding area and a second binding area; the first binding area is connected with the wiring area through the first connecting part, and the second binding area is connected with the wiring area through the second connecting part, so that the area of the binding end in the flexible circuit board can be reduced, the area of the wiring area of a bare chip corresponding to the binding end is reduced, the area of a non-display area, occupied by the bare chip, of the substrate is reduced, and the display effect of the substrate is improved. Therefore, the area of the non-display area is reduced, and the proportion of the display area is increased.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] In a two-chip design of a display panel (ie, having a bare chip and a circuit board), the bare chip and the circuit board are separated, and after the bare chip and the circuit board are processed, they are electrically connected by binding.

[0003] With the improvement of display technology, higher requirements are placed on the performance of display products. While achieving a high frame rate of display products, the number of binding pins (gold fingers) connecting the circuit board and the bare chip will also increase, which leads to an increase in the area of ​​the binding area of ​​the circuit board and the binding area of ​​the bare chip, making it necessary to increase the area of ​​the non-display area to meet the demand for the increase in the binding area, which in turn leads to a decrease in the proportion of the display area (Active Area, AA), which is not conducive to the realization of a full screen. Summary of the invention

[0004] Embodiments of the present disclosure provide a display panel and a method for manufacturing the same, and a display device to solve or alleviate one or more technical problems in the prior art.

[0005] As one aspect of an embodiment of the present disclosure, an embodiment of the present disclosure provides a display module, which includes:

[0006] The display panel comprises a substrate and a bare chip disposed on the substrate, wherein the bare chip comprises a wiring area extending to the outside of the substrate;

[0007] The driving device comprises a driving chip, a rigid circuit board and a flexible circuit board, wherein the driving chip is arranged on the rigid circuit board, the flexible circuit board is connected to the rigid circuit board, an end of the flexible circuit board away from the rigid circuit board forms a binding end, and two opposite surfaces of the binding end respectively define a first binding area and a second binding area;

[0008] The binding end is overlapped with the bare chip, the first binding area is connected to the wiring area through a first connection part, and the second binding area is connected to the wiring area through a second connection part.

[0009] In some embodiments, the first connecting portion is an anisotropic conductive adhesive film.

[0010] In some embodiments, the second connecting portion is a silver paste layer.

[0011] In some embodiments, the first binding area is located on a side of the flexible circuit board facing the bare chip, and the second binding area is located on a side of the flexible circuit board facing away from the bare chip.

[0012] In some embodiments, it also includes: a connector; the connector is arranged on the flexible circuit board.

[0013] In some embodiments, the orthographic projection of the bare chip on the substrate is the first projection, the orthographic projection of the flexible circuit board on the substrate is the second projection, and the orthographic projection of the rigid circuit board on the substrate is the third projection;

[0014] The first projection and the third projection are spaced apart on the substrate, and the second projection and the first projection at least partially overlap on the substrate.

[0015] In some embodiments, the second binding area is flush with an edge of one side of the flexible circuit board adjacent to the bare chip, and the first binding area has a certain reserved area with an edge of one side of the flexible circuit board adjacent to the bare chip.

[0016] In some embodiments, the first binding region is provided with a plurality of first binding pins, and at least part of the plurality of first binding pins are electrically connected to the bare chip through the first connecting portion.

[0017] In some embodiments, the second binding area is provided with a plurality of second binding pins, and at least part of the plurality of second binding pins are electrically connected to the bare chip through the second connecting portion.

[0018] In some embodiments, the display module also includes a power module and a signal module, the second connecting part includes multiple silver paste connecting blocks, the current of the first binding pin is the same as the current of the second binding pin, the first binding pin is connected to the signal module, multiple second binding pins are connected to form a conductive block and the conductive block is connected to the power module, and the conductive block is connected to the wiring area through the silver paste connecting block.

[0019] In some embodiments, the center distance between two adjacent first binding pins is a first distance, the center distance between two adjacent second binding pins is a second distance, and the ratio of the first distance to the second distance satisfies: (18-20):55.

[0020] In some embodiments, the rigid circuit board and the bare chip are spaced apart along a first direction, a plurality of first binding pins are spaced apart along a second direction, a plurality of second binding pins are spaced apart along the second direction, and the first direction and the second direction are perpendicular to each other.

[0021] As another aspect of the embodiments of the present disclosure, the present disclosure further provides a method for preparing a display module, which is used to prepare the above display module, and the method includes:

[0022] forming a bare chip on a substrate, wherein the bare chip includes a wiring area extending to the outside of the substrate;

[0023] A rigid circuit board and a flexible circuit board are provided, the flexible circuit board is connected to the rigid circuit board, one end of the flexible circuit board away from the rigid circuit board forms a binding end, and two opposite surfaces of the binding end respectively define a first binding area and a second binding area;

[0024] Providing a first connection portion, the first binding area is connected to the wiring area through the first connection portion;

[0025] Providing a second connection portion, the second binding area is connected to the wiring area through the second connection portion;

[0026] A driver chip is formed on a rigid circuit board.

[0027] In some embodiments, providing a first connection portion, and connecting the first binding area to the wiring area through the first connection portion specifically includes:

[0028] An ACF hot pressing process is performed between the first binding area and the wiring area to form an anisotropic conductive adhesive film connecting the first binding area and the wiring area.

[0029] In some embodiments, providing a second connection portion, and connecting the second binding area to the wiring area through the second connection portion, specifically includes:

[0030] The second binding area is located on the side of the flexible circuit board facing away from the bare chip, and a silver paste layer connecting the second binding area and the wiring area is formed through a silver paste curing process.

[0031] As another aspect of an embodiment of the present disclosure, the present disclosure further provides a display device, which includes: a display module as described above or a display module prepared by the method as described above.

[0032] The embodiments of the present disclosure have the following beneficial effects:

[0033] Based on the above-mentioned display panel and its preparation method, and display device, the present disclosure forms a first binding area and a second binding area on opposite sides of the binding end of the flexible circuit board, and sets gold fingers in the first binding area and the second binding area respectively, so as to evenly distribute the gold fingers to the first binding area and the second binding area, thereby reducing the area of ​​the binding end in the flexible circuit board. Secondly, the present disclosure also connects the first binding area and the wiring area respectively through the first connecting part and connects the second binding area and the wiring area respectively through the second connecting part, so as to realize the binding of the first binding area and the second binding area with the bare chip. In the process of signal transmission, the signal will be input into the flexible circuit board through the rigid circuit board, and the signal of the flexible circuit board will be input into the bare chip through the first connecting part and the second connecting part, so as to realize the signal transmission between the bare chip and the rigid circuit board. Such a setting can not only realize the signal transmission between the flexible circuit board and the driving chip, but also reduce the area of ​​the binding end in the flexible circuit board, thereby reducing the wiring area of ​​the bare chip corresponding to the binding end, and then reducing the non-display area of ​​the substrate occupied by the bare chip, thereby reducing the area of ​​the non-display area, thereby increasing the proportion of the display area. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments disclosed in accordance with the present disclosure and should not be regarded as limiting the scope of the present disclosure.

[0035] Figure 1 A schematic diagram showing the structure of a circuit board in the related art is shown;

[0036] Figure 2 A schematic structural diagram of a flexible circuit board according to an embodiment of the present disclosure is shown;

[0037] Figure 3 A schematic diagram showing the structure of a display panel according to an embodiment of the present disclosure is shown;

[0038] Figure 4 A schematic structural diagram of a driving device according to an embodiment of the present disclosure is shown;

[0039] Figure 5 A side view of a display module according to an embodiment of the present disclosure is shown;

[0040] Figure 6 A top view of a display module according to an embodiment of the present disclosure is shown;

[0041] Figure 7 A schematic diagram showing the connection relationship between the conductive block and the wiring area according to an embodiment of the present disclosure is shown.

[0042] Description of reference numerals:

[0043] Related technologies:

[0044] 10', flexible circuit board; 11', binding area;

[0045] 20', reinforcement layer;

[0046] 30', Rigid circuit board.

[0047] This disclosure:

[0048] 1. Display module;

[0049] 10. display panel; 11. substrate; 12. bare chip; 121. wiring area;

[0050] 20. driving device; 21. rigid circuit board; 22. flexible circuit board; 221. binding end; 2211. first binding area; 2212. second binding area; 23. driving chip;

[0051] 30. a first connecting portion;

[0052] 40. second connecting portion; 41. silver paste connecting block;

[0053] 50. Connector;

[0054] 60. Conductive block;

[0055] X, first direction; Y, second direction. DETAILED DESCRIPTION

[0056] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present disclosure. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0057] Figure 1A schematic diagram of the structure of a circuit board in the related art is shown. In the related art, in a two-chip design of a display panel (i.e., having a bare chip and a circuit board), the bare chip and the circuit board are separated, and the circuit board includes a flexible circuit board 10' and a rigid circuit board 30'. The flexible circuit board 10' is clamped in the middle layer of the rigid circuit board 30'. After the bare chip and the flexible circuit board 10' are processed, they are electrically connected by binding. With the improvement of display technology, higher requirements are placed on the performance of display products. While achieving a high frame rate of display products, the number of binding pins (gold fingers) connected between the flexible circuit board 10' and the bare chip will also increase. However, one side of the flexible circuit board 10' is a binding area 11', and the other side is provided with a reinforcement layer 20', which results in that the increase in the number of gold fingers can only be met by increasing the area of ​​the binding area 11' of the flexible circuit board 10'. The increase in the area of ​​the binding area 11' of the flexible circuit board 10' results in a corresponding increase in the area of ​​the non-display area to meet the demand, which in turn results in a reduction in the proportion of the display area (Active Area, AA), which is not conducive to the realization of a full screen.

[0058] Figure 2 A schematic diagram showing the structure of a flexible circuit board 22 according to an embodiment of the present disclosure is shown; Figure 3 A schematic structural diagram of a display panel 10 according to an embodiment of the present disclosure is shown; Figure 4 A schematic structural diagram of a driving device 20 according to an embodiment of the present disclosure is shown; Figure 5 A side view of a display module 1 according to an embodiment of the present disclosure is shown; Figure 6 A top view of a display module 1 according to an embodiment of the present disclosure is shown. In some embodiments of the present disclosure, see Figure 2-Figure 6 A display module 1 is proposed, which includes: a display panel 10 and a driving device 20. Compared with the previous situation that only one side of the binding end 221 is provided with a binding area, the present disclosure respectively provides a first binding area 2211 and a second binding area 2212 on two opposite sides of the binding end 221 of the flexible circuit board 22, and respectively provides gold fingers in the first binding area 2211 and the second binding area 2212, and evenly distributes the gold fingers to the first binding area 2211 and the second binding area 2212, thereby reducing the area of ​​the binding end 221 in the flexible circuit board 22, and further reducing the area of ​​the wiring area 121 of the bare chip 12, so as to achieve the effect of reducing the area of ​​the non-display area of ​​the substrate 11 occupied by the bare chip 12, thereby increasing the proportion of the display area (Active Area, AA).

[0059] See also Figure 3 and Figure 5 In this embodiment, the display panel 10 includes a substrate 11 and a bare chip 12 disposed on the substrate 11 , and the bare chip 12 includes a wiring area 121 extending to the outside of the substrate 11 .

[0060] It can be understood that the display panel 10 includes a display area and a non-display area, the non-display area is arranged at the periphery of the display area, the bare chip 12 is arranged on the substrate 11, and the bare chip 12 is located in the non-display area.

[0061] See also Figure 4 and Figure 5 The driving device 20 includes a driving chip 23, a rigid circuit board 21 and a flexible circuit board 22. The driving chip 23 is arranged on the rigid circuit board 21. The flexible circuit board 22 is connected to the rigid circuit board 21. The end of the flexible circuit board 22 away from the rigid circuit board 21 forms a binding end 221. The two opposite surfaces of the binding end 221 respectively define a first binding area 2211 and a second binding area 2212. The first binding area 2211 and the second binding area 2212 are both used to set gold fingers.

[0062] Specifically, the flexible circuit board 22 is clamped at the middle layer position of the rigid circuit board 21 .

[0063] See also Figure 5 , wherein the binding end 221 overlaps the bare chip 12 , the first binding area 2211 is connected to the wiring area 121 through the first connection portion 30 , and the second binding area 2212 is connected to the wiring area 121 through the second connection portion 40 .

[0064] The gold finger is used to bind the bare chip 12 and the flexible circuit board 22, and is used to input a control signal to the bare chip 12. Here is a brief description of the concept of the gold finger. The nickel-gold plate is plated on the pads or copper foil of the first binding area 2211 and the second binding area 2212 to connect the pads or copper foil to the structure to be connected. Because the shape resembles a gold finger, it is called a "gold finger".

[0065] According to the display module 1 of the embodiment of the present disclosure, the present disclosure forms a first binding area 2211 and a second binding area 2212 on opposite sides of the binding end 221 of the flexible circuit board 22, and sets gold fingers in the first binding area 2211 and the second binding area 2212 respectively, so as to evenly distribute the gold fingers to the first binding area 2211 and the second binding area 2212, thereby reducing the area of ​​the binding end 221 in the flexible circuit board 22. Secondly, the present disclosure further connects the first binding area 2211 and the wiring area 121 respectively through the first connecting part 30 and connects the second binding area 2212 and the wiring area 121 respectively through the second connecting part 40, so as to realize the binding of the first binding area 2211 and the second binding area 2212 with the bare chip 12. During the signal transmission process, the signal will be input into the flexible circuit board 22 through the rigid circuit board 21, and the signal of the flexible circuit board 22 will be input into the bare chip 12 through the first connecting part 30 and the second connecting part 40, so as to realize the signal transmission between the bare chip 12 and the rigid circuit board 21. Such a configuration can not only realize the signal transmission between the flexible circuit board 22 and the driving chip 23, but also reduce the area of ​​the binding end 221 in the flexible circuit board 22, and then reduce the area of ​​the wiring area 121 of the bare chip 12 corresponding to the binding end 221, thereby reducing the area of ​​the non-display area of ​​the substrate 11 occupied by the bare chip 12, thereby reducing the area of ​​the non-display area in the display module 1, thereby increasing the proportion of the display area.

[0066] Exemplarily, when the frame rate of 90 Hz needs to be increased to 120 Hz, the number of gold fingers on the flexible circuit board 22 needs to be increased. For example, when the number of gold fingers is 1000, the area of ​​the binding end required in the related art is S. In the case of the display module 1 of the embodiment of the present disclosure, 500 gold fingers can be set in the first binding area 2211 and the second binding area 2212 respectively. Thus, the area of ​​the binding end 221 of the present disclosure is S / 2. Compared with the display module in the related art, the area of ​​the binding end 221 in the flexible circuit board 22 of the display module of the present disclosure is reduced by half. It should be noted that the number of gold fingers is not limited to this. In specific applications, those skilled in the art can determine it according to actual needs.

[0067] In some embodiments, the first connection part 30 is an anisotropic conductive film (ACF). The anisotropic conductive film has the advantages of relatively low process cost and relatively small space occupation, thereby enabling the area between the binding end 221 and the wiring area 121 for installing the first connection part 303 to be reduced. The anisotropic conductive film mainly includes conductive particles, insulating adhesive material, an upper protective film and a lower protective film. The conductive particles and the insulating adhesive material are located between the upper protective film and the lower protective film. During the assembly process, the upper protective film and the lower protective film can be torn off, and the anisotropic conductive film can be pasted on the first binding area 2211 and the wiring area 121 respectively, so as to connect the driver chip 23 and the flexible circuit board 22 through the anisotropic conductive film. In the process of fixing the anisotropic conductive film to the driver chip 23, the bare chip 12 can be pressed and heated to solidify the insulating adhesive material to form a stable connection structure.

[0068] During the signal transmission process, the signal is input into the flexible circuit board 22 through the rigid circuit board 21 , and the signal of the flexible circuit board 22 is input into the bare chip 12 through the conductive particles of the anisotropic conductive film, thereby realizing signal transmission between the bare chip 12 and the rigid circuit board 21 .

[0069] In the disclosed embodiment, the display module 1 may include a computer monitor, a television, a billboard, a laser printer with a display function, a telephone, a mobile phone, a personal digital assistant (PDA), a laptop computer, a digital camera, a camcorder, a viewfinder, a vehicle, a large-area wall, a theater screen or a stadium sign, etc.

[0070] See also Figure 4 and Figure 5 In some embodiments, the first binding area 2211 is located on a side of the flexible circuit board 22 facing the bare chip 12 , and the second binding area 2212 is located on a side of the flexible circuit board 22 facing away from the bare chip 12 .

[0071] In some embodiments, the second connection portion 40 is a silver paste layer. In the embodiment of the present disclosure, since the second binding area 2212 is on the side facing away from the bare chip 12, the second binding area 2212 and the wiring area 121 of the bare chip 12 are in the same direction, and the anisotropic conductive film (Anisotropic Conductive Adhesive Film) Film, ACF) can only be used for pressing between two opposite surfaces. Therefore, the second binding area 2212 and the bare chip 12 cannot be electrically connected by using anisotropic conductive adhesive film. The present invention realizes the electrical connection between the second binding area 2212 and the bare chip 12 by curing the conductive silver paste to form a silver paste layer. Secondly, since there is a height difference between the side of the bare chip 12 facing the substrate 11 and the second binding area 2212 in the direction perpendicular to the substrate, and since the cured silver paste layer has a certain mechanical strength and can withstand certain physical stress and environmental changes, the conductive silver paste is cured to form a silver paste layer to realize the electrical connection between the second binding area 2212 and the bare chip 12. This can avoid the situation where the connection fails due to the height difference between the side of the bare chip 12 facing the substrate 11 and the second binding area 2212 in the direction perpendicular to the substrate, thereby improving the connection stability of the bare chip 12 and the second binding area 2212. To achieve conduction between the driving chip 23 and the flexible circuit board 22, since the conductive silver paste has the advantages of low curing temperature, high bonding strength, stable electrical properties and simple corresponding binding process, using the conductive silver paste in the binding process can significantly improve the binding quality, thereby improving the signal transmission performance and display effect.

[0072] See also Figure 4 , Figure 5 as well as Figure 6 In some embodiments, the present disclosure further includes: a connector 50. The connector 50 is arranged on the flexible circuit board 22. Specifically, the rigid circuit board and the bare chip 12 are arranged at intervals along the first direction X, the connector 50 and the driver chip 23 on the rigid circuit board 21 are arranged at intervals along the first direction X, and the connector 50 and the driver chip 23 extend along the second direction Y. The first direction X and the second direction Y are perpendicular to each other. Such an arrangement can make the layout of the connector 50 and the driver chip 23 on the rigid circuit board 21 more reasonable, and reduce the area of ​​the rigid circuit board 21.

[0073] Specifically, the connector 50 is used to connect the display panel 10 and the host part together so that the host part can transmit signals and data to the display panel 10. Exemplarily, the connector 50 is an eDP connector or a USB-type C connector.

[0074] In some embodiments, the orthographic projection of the bare chip 12 on the substrate 11 is the first projection, the orthographic projection of the flexible circuit board 22 on the substrate 11 is the second projection, and the orthographic projection of the rigid circuit board 21 on the substrate 11 is the third projection. The first projection and the third projection are arranged at intervals on the substrate 11, the second projection and the first projection at least partially overlap on the substrate 11, and the overlapping area between the first projection and the second projection can be designed by the number of gold fingers, and the first connection portion 30 is made as close as possible to the side of the bare chip 12 facing the rigid circuit board 21, so as to reduce the overlapping area between the first projection and the second projection. The smaller the overlapping area between the first projection and the second projection, the smaller the area of ​​the flexible circuit board 22 located in the non-display area of ​​the display panel 10, which can effectively increase the proportion of the display area.

[0075] In some embodiments, the first binding area 2211 is provided with a plurality of first binding pins (also called FPC bumps), and the plurality of first binding pins are at least partially electrically connected to the bare chip 12 through the first connecting portion 30 .

[0076] In some embodiments, the second binding area 2212 is provided with a plurality of second binding pins (also called FPC bumps), and at least some of the plurality of second binding pins are electrically connected to the bare chip 12 through the second connecting portion 40 .

[0077] See also Figure 6 In some embodiments, the rigid circuit board 21 and the bare chip 12 are spaced apart along a first direction X, a plurality of first binding pins are spaced apart along a second direction Y, a plurality of second binding pins are spaced apart along the second direction Y, and the first direction X and the second direction Y are perpendicular to each other.

[0078] In the related art, the silicon-based OLED (Organic Light Emitting Diode) display module needs to be connected to the power module through the binding pins to supply power to the display panel. Secondly, the display panel also needs to be connected to the signal module through the binding pins to input the driving signal to the display panel, and the current of the binding pins connected to the power module is greater than the current of the binding pins connected to the signal module. Exemplarily, the power module is at least one of AVDD, IOVCC, ELVDD, VCOM, VSS1, and VSS2, AVDD is an analog voltage for the driver chip 23 to output the corresponding signal, IOVCC is the voltage of the input / output (I / O) interface chip in the driver chip 23 for driving the display panel, ELVDD is used to control the high voltage and low voltage of the pixel light emission in the display area, and VCOM is used to balance the driving circuit. In order for the above-mentioned power module to function normally, the circuit module requires a larger current. For example, IOVCC=600mA, ELVDD=600mA, VCOM=300mA, AVDD=200mA. Since the current passing through the power module is large, the power module needs to connect multiple binding pins to meet the current requirement of the power module.

[0079] Figure 7 A schematic diagram showing the connection relationship between the conductive block 60 and the wiring area 121 according to an embodiment of the present disclosure is shown in FIG. Figure 7 In order to solve the technical problems of the above-mentioned related technologies, the embodiment of the present disclosure also includes a power module and a signal module, the second connecting part includes multiple silver paste connecting blocks 41, the current of the first binding pin is the same as the current of the second binding pin, the first binding pin is connected to the signal module, and multiple second binding pins are connected to form a conductive block 60, and the conductive block is connected to the power module, and the conductive block is connected to the wiring area 121 through the silver paste connecting block 41, thereby, the current passing through the conductive block 60 is greater than the current passing through the single first binding pin.

[0080] The current passing through the first binding pin and the second binding pin is related to the area. The larger the area, the greater the current that can pass through.

[0081] It should be noted that each silver paste connection block 41 of the silver paste layer needs to be processed separately to connect the silver paste connection block 41 to the corresponding conductive block 60 and the wiring area 121. Since the silver paste layer includes multiple silver paste connection blocks 41, the number of silver paste connection blocks 41 will affect the processing efficiency of the silver paste layer.

[0082] Through the above-mentioned implementation, the present disclosure combines multiple second binding pins connected to the power module to form a conductive block 60. The current passing through the conductive block 60 is the sum of the current passing through the multiple second binding pins. Therefore, only one conductive block 60 is needed to meet the current demand of the power module. Secondly, the present disclosure sets the conductive block 60 in the second binding area, that is, sets the conductive block 60 on the surface of the flexible circuit board 22 facing away from the substrate 11, and then connects the conductive block 60 with the wiring area 121 through the silver paste connection block 41. Since the present disclosure combines multiple second binding pins connected to the power module to form a conductive block 60, and each conductive block 60 only needs to be configured with one silver paste connection block 41, the number of silver paste connection blocks 41 in the flexible circuit board and the wiring area 121 is effectively reduced, which is beneficial to improving the processing efficiency of the silver paste layer.

[0083] See also Figure 2 In some embodiments, the second binding area 2212 is flush with the edge of one side of the flexible circuit board adjacent to the bare chip 12, and the first binding area 2211 has a certain reserved area with the edge of one side of the flexible circuit board adjacent to the bare chip 12. Exemplarily, the size of the reserved area is 0.2 mm, 0.3 mm or 0.4 mm, etc. During the manufacturing process of the display module 1, the first binding area 2211 is first bound to the wiring area 121 of the bare chip 12, and then the second binding area 2212 is bound to the wiring area 121 of the bare chip 12. Since the silver paste has a certain flowability before being fixed, the present disclosure reserves a certain space to prevent the silver paste from flowing to the first binding area 2211 before curing through the setting of the reserved area, so as to avoid the silver paste layer of the second binding area 2212 from contacting with the second binding area 2212 during the curing process to cause a short circuit, thereby causing damage to the display module 1.

[0084] In some embodiments, the center distance between two adjacent first binding pins is the first distance, and the center distance between two adjacent second binding pins is the second distance. When the first binding pins of the flexible circuit board have enough area to meet the requirements of the anisotropic conductive film on the number of conductive particles, the center distance between two adjacent first binding pins is 36um to 40um. However, since the silver paste has a certain fluidity, when the silver paste falls into the two adjacent second binding pins, it is easy to cause the two adjacent second binding pins to be connected through the silver paste, which can easily lead to reliability problems such as short circuits. Therefore, the center distance between two adjacent second binding pins is 110um, so the ratio of the first distance to the second distance needs to meet the following requirements: (18-20): 55

[0085] The embodiments of the present disclosure further provide a method for manufacturing the display module 1 according to the above embodiments, comprising:

[0086] A bare chip 12 is formed on a substrate 11 , wherein the bare chip 12 includes a wiring area 121 extending to the outside of the substrate 11 ;

[0087] A rigid circuit board 21 and a flexible circuit board 22 are provided. The flexible circuit board 22 is connected to the rigid circuit board 21. One end of the flexible circuit board 22 away from the rigid circuit board 21 forms a binding end 221. Two opposite surfaces of the binding end 221 respectively define a first binding area 2211 and a second binding area 2212.

[0088] A first connection portion 30 is provided, and the first binding area 2211 is connected to the wiring area 121 through the first connection portion 30;

[0089] A second connection portion 40 is provided, and the second binding area 2212 is connected to the wiring area 121 through the second connection portion 40;

[0090] A driving chip 23 is formed on the rigid wiring board 21 .

[0091] In the embodiment of the present disclosure, the present disclosure forms a first binding area 2211 and a second binding area 2212 on opposite sides of the binding end 221 of the flexible circuit board 22, and sets gold fingers in the first binding area 2211 and the second binding area 2212 respectively to evenly distribute the gold fingers to the first binding area 2211 and the second binding area 2212. Since the number of gold fingers in one of the first binding area 2211 and the second binding area 2212 is reduced, the area of ​​the binding end 221 in the flexible circuit board 22 can be reduced. Secondly, the present disclosure further connects the first binding area 2211 and the wiring area 121 respectively through the first connecting portion 30 and connects the second binding area 2212 and the wiring area 121 respectively through the second connecting portion 40, so as to realize the binding of the first binding area 2211 and the second binding area 2212 with the bare chip 12. During the signal transmission process, the signal will be input into the flexible circuit board through the rigid circuit board 21, and the signal of the flexible circuit board will be input into the bare chip 12 through the first connecting portion 30 and the second connecting portion 40, so as to realize the signal transmission between the bare chip 12 and the rigid circuit board 21. Such a configuration can not only realize the signal transmission between the flexible circuit board 22 and the driving chip 23, but also reduce the area of ​​the binding end 221 in the flexible circuit board 22, thereby reducing the area of ​​the wiring area 121 of the bare chip 12 corresponding to the binding end 221, and further reduce the area of ​​the non-display area of ​​the substrate 11 occupied by the bare chip 12, thereby reducing the area of ​​the non-display area, thereby increasing the proportion of the display area.

[0092] In some embodiments, a first connection portion 30 is provided, and the first binding area 2211 is connected to the wiring area 121 through the first connection portion 30, specifically including:

[0093] An anisotropic conductive adhesive film connecting the first binding area 2211 and the wiring area 121 is formed by an ACF hot pressing process between the first binding area 2211 and the wiring area 121. The anisotropic conductive adhesive film has the advantages of relatively low process cost and relatively small occupied space, thereby enabling the first connecting portion 30 to occupy a smaller area of ​​the driving chip 23.

[0094] In some embodiments, a second connection portion 40 is provided, and the second binding area 2212 is connected to the wiring area 121 through the second connection portion 40, specifically including:

[0095] The second binding area 2212 is located on the side of the flexible circuit board 22 facing away from the bare chip 12, and a silver paste layer is formed by a silver paste curing process to connect the second binding area 2212 and the wiring area 121. Specifically, the silver paste layer in the present disclosure includes a plurality of silver paste connection blocks, and each second binding pin needs to be connected to the wiring area 121 by a silver paste connection block through a curing process, so as to achieve the connection between the second binding pin and the wiring area 121.

[0096] The embodiment of the present disclosure further provides a display device, which includes: the display panel 10 of the above embodiment of the present disclosure, or the display panel 10 prepared by the preparation method of the above embodiment of the present disclosure. Therefore, the display device can have all the features and advantages of the display panel 10 or the preparation method described above, which will not be repeated here.

[0097] In the description of this specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present disclosure.

[0098] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present disclosure, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0099] In the present disclosure, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances.

[0100] In the present disclosure, unless otherwise expressly specified and limited, a first feature being “above” or “below” a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being “above”, “above”, and “above” a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0101] The disclosure above provides many different embodiments or examples to implement different structures of the present disclosure. In order to simplify the disclosure of the present disclosure, the components and settings of specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present disclosure. In addition, the present disclosure can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed.

[0102] The above is only a specific implementation of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any technician familiar with the technical field can easily think of various changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A display module, It is characterized in that include: The display panel comprises a substrate and a bare chip disposed on the substrate, wherein the bare chip comprises a wiring area extending to the outside of the substrate; A driving device, comprising a driving chip, a rigid circuit board and a flexible circuit board, wherein the driving chip is arranged on the rigid circuit board, the flexible circuit board is connected to the rigid circuit board, an end of the flexible circuit board away from the rigid circuit board forms a binding end, and two opposite surfaces of the binding end respectively define a first binding area and a second binding area; The binding end is overlapped with the bare chip, the first binding area is connected to the wiring area through a first connection part, and the second binding area is connected to the wiring area through a second connection part.

2. The display module according to claim 1, It is characterized in that The first connecting portion is an anisotropic conductive adhesive film.

3. The display module according to claim 1, It is characterized in that The second connecting portion is a silver paste layer.

4. The display module according to claim 1, It is characterized in that The first binding area is located on a side of the flexible circuit board facing the bare chip, and the second binding area is located on a side of the flexible circuit board facing away from the bare chip.

5. The display module according to claim 1, It is characterized in that Also includes: Connector; the connector is arranged on the flexible circuit board.

6. The display module according to claim 1, It is characterized in that The orthographic projection of the bare chip on the substrate is a first projection, the orthographic projection of the flexible circuit board on the substrate is a second projection, and the orthographic projection of the rigid circuit board on the substrate is a third projection; The first projection and the third projection are spaced apart on the substrate, and the second projection and the first projection at least partially overlap on the substrate.

7. The display module according to claim 1, It is characterized in that The second binding area is flush with an edge of one side of the flexible circuit board adjacent to the bare chip, and the first binding area has a certain reserved area with an edge of one side of the flexible circuit board adjacent to the bare chip.

8. The display module according to any one of claims 1 to 7, It is characterized in that The first binding area is provided with a plurality of first binding pins, and at least part of the plurality of first binding pins is electrically connected to the bare chip through the first connecting portion.

9. The display module according to claim 8, It is characterized in that The second binding area is provided with a plurality of second binding pins, and at least part of the plurality of second binding pins is electrically connected to the bare chip through the second connecting portion.

10. The display module according to claim 9, It is characterized in that The display module also includes a power module and a signal module, the second connecting part includes a plurality of silver paste connecting blocks, the current of the first binding pin is the same as the current of the second binding pin, the first binding pin is connected to the signal module, a plurality of the second binding pins are connected to form a conductive block and the conductive block is connected to the power module, and the conductive block is connected to the wiring area through the silver paste connecting block.

11. The display module according to claim 9, It is characterized in that The center distance between two adjacent first binding pins is a first distance, the center distance between two adjacent second binding pins is a second distance, and the ratio of the first distance to the second distance satisfies: (18-20):

55.

12. The display module according to claim 9, It is characterized in that The rigid circuit board and the bare chip are spaced apart along a first direction, a plurality of the first binding pins are spaced apart along a second direction, a plurality of the second binding pins are spaced apart along the second direction, and the first direction and the second direction are perpendicular to each other.

13. A method for preparing a display module, It is characterized in that For preparing the display module according to any one of claims 1 to 12, the method comprises: forming a bare chip on a substrate, the bare chip comprising a wiring region extending to the outside of the substrate; A rigid circuit board and a flexible circuit board are provided, wherein the flexible circuit board is connected to the rigid circuit board, an end of the flexible circuit board away from the rigid circuit board forms a binding end, and two opposite surfaces of the binding end respectively define a first binding area and a second binding area; Providing a first connection portion, wherein the first binding area is connected to the wiring area through the first connection portion; providing a second connection portion, wherein the second binding area is connected to the wiring area through the second connection portion; A driver chip is formed on a rigid circuit board.

14. The preparation method according to claim 13, It is characterized in that The providing of the first connecting portion, wherein the first binding area is connected to the wiring area through the first connecting portion, specifically includes: An ACF hot pressing process is performed between the first binding area and the wiring area to form an anisotropic conductive adhesive film connecting the first binding area and the wiring area.

15. The preparation method according to claim 13, It is characterized in that The providing of the second connection portion, wherein the second binding area is connected to the wiring area through the second connection portion, specifically includes: The second binding area is located on a side of the flexible circuit board facing away from the bare chip, and a silver paste layer connecting the second binding area and the wiring area is formed through a silver paste curing process.

16. A display device, It is characterized in that include: A display module as described in any one of claims 1 to 12 or a display module prepared by the method according to claims 13 to 15.

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